JP7799481B2 - Power conversion equipment for railway vehicles - Google Patents

Description

An embodiment of the present invention relates to a power conversion device for a railway vehicle.

A three-level circuit power conversion device includes a converter unit that converts AC to DC, an inverter unit that converts DC to AC, and a cooling unit. The converter unit and inverter unit are equipped with semiconductor modules that generate heat during power conversion. In a power conversion device for a railway vehicle, the cooling unit absorbs the heat generated by the semiconductor modules of the converter unit and inverter unit, and cools the cooling unit using the wind generated by the vehicle's running.

Patent No. 6858244 Patent No. 6735721

The problem that this invention aims to solve is to provide a power conversion device that can efficiently cool the semiconductor modules of each phase of the converter and inverter sections.

According to an embodiment, a railway vehicle power conversion device includes a cooling unit, a converter unit, an inverter unit, and a plurality of heat pipes. The cooling unit has cooling fins that are cooled by movement of one and the other of the railway vehicles in the traveling directions. The converter unit is adjacent to the cooling unit in a direction intersecting the traveling direction with a U phase and a V phase, and is fixed to the cooling unit. The converter unit generates heat when converting AC to DC. The inverter unit is adjacent to the converter unit in a direction intersecting the traveling direction, and the U phase, V phase, and W phase are adjacent to the converter unit in a direction intersecting the traveling direction, and is fixed to the cooling unit. The inverter unit generates heat when converting DC to AC. A plurality of heat pipes are provided between the cooling fins and the converter unit, and between the cooling fins and the inverter unit. The cooling unit has a first end along the traveling direction and a second end opposite the first end. Each phase of the converter unit and each phase of the inverter unit are respectively arranged adjacent to the first end of the cooling unit and include a first semiconductor module that generates heat during power conversion, a second semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module, and a third semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module. The first semiconductor module is arranged on the air intake side or the air exhaust side of the second semiconductor module and the third semiconductor module when traveling in the traveling direction. The heat pipes are provided for each phase of the converter unit and each phase of the inverter unit. An evaporator of the working fluid at one end of the heat pipe is arranged between the cooling fin and the first semiconductor module. A condenser of the working fluid at the other end of the heat pipe is arranged between the cooling fin and the second semiconductor module or the third semiconductor module.

1 is a schematic side view of a portion of a railway vehicle according to an embodiment mounted on a rail; 1 is a schematic diagram of a power conversion device according to a first embodiment; 1 is a circuit diagram of a three-level power conversion device according to a first embodiment. 3 is a three-level circuit diagram of each phase of a converter unit and an inverter unit of the power conversion device according to the first embodiment. FIG. FIG. 10 is a schematic diagram of a power conversion device according to a second embodiment. FIG. 10 is a schematic diagram of a power conversion device according to a third embodiment. FIG. 13 is a schematic diagram of a power conversion device according to a first modified example of the third embodiment. FIG. 13 is a schematic diagram of a power conversion device according to a second modification of the third embodiment. FIG. 10 is a circuit diagram of a three-level power conversion device according to a fourth embodiment.

A preferred embodiment of the railway vehicle 10 will now be described with reference to the drawings.

[First embodiment]
A railway vehicle 10 according to a first embodiment will be described with reference to Figures 1 to 4. Note that in each figure, for the sake of convenience, the scale of each component will be changed as appropriate, and some components will be omitted or simplified.

Figure 1 is a side view that schematically illustrates a portion of a railway vehicle 10 according to an embodiment. The railway vehicle 10 shown in Figure 1 runs on a dedicated path (track) on which rails 100 or the like are laid. The railway vehicle 10 includes a bogie 12, a car body 14, and a power conversion device (rail vehicle power conversion device) 16.

An XYZ Cartesian coordinate system is set in Figure 1. In this embodiment, the X direction in Figure 1 indicates the fore-and-aft direction of the railway vehicle 10, the Y direction indicates the width direction of the railway vehicle 10, and the Z direction indicates the direction of gravity. The left side of the page in Figure 1 is the +X direction, the back side of the page is the +Y direction, and the top of the page is the +Z direction. Furthermore, the fore-and-aft direction of the railway vehicle 10 is the expected traveling direction of the railway vehicle 10 (the first direction (+X direction) and the second direction (-X direction) opposite the first direction).

The bogie 12 includes, for example, a bogie frame 22, multiple axles 24, multiple wheels 26, an electric motor 28, and a bogie spring 30. Multiple bogies 12 are provided, for example, under the floor of the car body 14, spaced apart in the expected direction of travel.

The bogie springs 30 are, for example, air springs. The bogie frame 22 is connected to the underfloor of the car body 14 via the bogie springs 30.

The axles 24 extend in the width direction of the railway vehicle 10. The multiple axles 24 are rotatably supported on the bogie frame 22. For example, a pair of axles 24 are provided at both ends of the bogie frame 22 along the expected direction of travel.

The wheels 26 are attached to both widthwise ends of the axle 24 and are placed on the rails 100. In this embodiment, for example, four wheels 26 are provided on one bogie 12.

The electric motor 28 is supported, for example, by the bogie frame 22. The electric motor 28 rotates the axles 24. For example, a pair of electric motors 28 are provided to rotate each of the pair of axles 24. As a specific example, the electric motor 28 has a rotating shaft that rotates using three-phase AC power and a transmission mechanism that transmits the rotation of the rotating shaft to the axles 24.

The vehicle body 14 is long in the expected traveling direction (front-to-rear direction). The vehicle body 14 is formed in a roughly rectangular parallelepiped shape that is long in the front-to-rear direction. However, the shape of the vehicle body 14 is not limited to this shape and can be set as appropriate.

A pantograph 14a is installed on the ceiling of the car body 14, facing upward in the direction of gravity. The pantograph 14a is configured to be able to come into contact with an overhead wire 101 set a certain distance above the rail 100.

As shown in FIG. 1, the power conversion device 16 is arranged, for example, between the bogies 12 along the expected direction of travel. The power conversion device 16 has a housing 52 that is attached under the floor of the car body 14 of the railway vehicle 10. Various devices of the power conversion device 16, which will be described later, are provided in the housing 52.

The upper left diagram in Figure 2 is a schematic diagram of the power conversion device 16 used in the railway vehicle 10, viewed from the carbody 14 side. The right diagram in Figure 2 is a diagram viewed from the second direction (-X direction) of the expected running direction to the first direction (+X direction). The lower left diagram in Figure 2 is a diagram viewed from one side (-Y direction) in the width direction to the other side (+Y direction). Figure 3 is a circuit diagram of each phase of the converter unit 56 and inverter unit 58 of the power conversion device 16. Figure 4 is a circuit diagram of the converter unit 56, filter capacitor 57, and inverter unit 58 of the power conversion device 16.

As shown in FIG. 2, the power conversion device 16 has a cooling unit 54, a converter unit 56, an inverter unit 58, and multiple heat pipes 60.

The housing 52 houses various components, including a cooling unit 54, a converter unit 56, an inverter unit 58, and multiple heat pipes 60.

The housing 52 is open at least in the expected direction of travel (X direction), and air flows along the cooling section 54. The housing 52 may also be open in the width direction (Y direction). The underside of the housing 52 may also be open to expose the cooling fins 74.

The cooling unit 54 is formed from a material with high thermal conductivity, such as aluminum. Specifically, the cooling unit 54 includes a heat receiving block 72 and a plurality of cooling fins 74 that are, for example, integrated into the heat receiving block 72.

The heat receiving block 72 is disposed, for example, inside the housing 52. A portion of the heat receiving block 72 may be disposed, for example, outside the housing 52.

The heat receiving block 72 may have a variety of shapes, for example, a rectangular parallelepiped shape. The converter unit 56 and inverter unit 58 are provided on the upper surface of the heat receiving block 72. The converter unit 56 and inverter unit 58 are aligned in the width direction of the railway vehicle 10. For convenience, in this embodiment, the end of the heat receiving block 72 on the first direction (+X direction) side is referred to as the first end 72a, the end on the second direction (-X direction) side is referred to as the second end 72b, the end on one side in the width direction (+Y direction side) is referred to as the third end 72c, and the end on the other side in the width direction (-Y direction side) is referred to as the fourth end 72d.

When the power conversion device 16 is installed under the floor of the vehicle body 14, the multiple cooling fins 74 extend downward in the direction of gravity (+Z direction) from the heat receiving block 72. The multiple cooling fins 74 form an air receiving section. The multiple cooling fins 74 may be arranged inside or outside the housing 52.

The cooling fins 74 are formed as thin rectangular plates that are long in one direction (X direction). When the power conversion device 16 is installed under the floor of the carbody 14, the cooling fins 74 are arranged on the heat receiving block 72 with their thickness direction aligned with the width direction (Y direction) of the railway vehicle 10 and their longitudinal direction aligned with the expected running direction (X direction). Furthermore, the multiple cooling fins 74 are arranged at predetermined intervals in the thickness direction of the cooling fins 74. Here, the predetermined intervals are, for example, equal intervals.

It is preferable that the one end 74a of the cooling fin 74, which is furthest in the +X direction, be positioned on the +X side of the position furthest in the +X direction of the first semiconductor module 82. The one end 74a may be positioned on the +X side or the -X side of the first end 72a of the heat receiving block 72. It is also preferable that the other end 74b of the cooling fin 74, which is furthest in the -X direction, be positioned on the -X side of the position furthest in the -X direction of the second semiconductor module 84. The other end 74b may be positioned on the +X side or the -X side of the second end 72b of the heat receiving block 72.

The multiple cooling fins 74 form multiple flow passages through which the traveling wind F1 or F2 flows along the traveling direction in the gaps between adjacent cooling fins 74 in the width direction. As the railway vehicle 10 travels, the multiple cooling fins 74 receive the traveling wind F1 or F2 that flows mainly along the expected traveling direction, and exchange heat with the traveling wind F1 or F2.

The power conversion device 16 converts AC power supplied from the overhead line 101 via, for example, a pantograph 14a attached to the upper side of the car body 14, into DC power using a converter unit 56, and then converts the DC power into three-phase AC power using an inverter unit 58, and transmits the power to each electric motor 28.

The converter unit 56 is composed of a U phase and a V phase, and the inverter unit 58 is composed of a U phase, a V phase, and a W phase. The U phase and the V phase of the converter unit 56 are aligned in the width direction and are adjacent to each other. The U phase, the V phase, and the W phase of the inverter unit 58 are aligned in the width direction and are adjacent to each other.

In this embodiment, the converter unit 56 and the inverter unit 58 each have a three-level circuit configuration, for example. Figure 3 shows a three-level circuit diagram for each phase of the converter unit 56 and the inverter unit 58. Each phase of the converter unit 56 and the inverter unit 58 is composed of three semiconductor modules 82, 84, and 86 that house semiconductors such as switching elements and diodes.

In this embodiment, the phases of the converter unit 56 refer to the U phase and V phase of the converter unit 56. The phases of the inverter unit 58 refer to the U phase, V phase, and W phase of the inverter unit 58.

The first semiconductor module 82 is a so-called 2-in-1 module in which the upper and lower arms contain a pair of switching elements, typically insulated gate bipolar transistors (IGBTs), and anti-parallel diodes in a single package. The first semiconductor module 82 houses two switching elements (second switching element Q2 and third switching element Q3) connected in series. The first semiconductor module 82 may also be a so-called 4-in-1 module.

The second semiconductor module 84 and the third semiconductor module 86 are chopper modules equipped with a switching element and an anti-parallel diode pair in the upper or lower arm, and a clamp diode in the lower or upper arm. The second semiconductor module 84 houses the first switching element Q1 and the first clamp diode D5 in a single package. The third semiconductor module 86 houses the fourth switching element Q4 and the second clamp diode D6 in a single package.

As shown in Figure 2, the semiconductor modules 82, 84, and 86 that make up each phase of the converter section 56 and the inverter section 58 are mounted on the heat receiving block 72 of the cooling section 54, on the side opposite the cooling fins 74.

In this embodiment, each phase of the converter unit 56 and inverter unit 58 is arranged in the longitudinal direction of the cooling fins 74, i.e., in the same direction as the direction in which the cooling air F1 or F2 passes between the cooling fins 74 (the expected direction in which the railway vehicle 10 is traveling). Semiconductor modules 82, 84, and 86 are installed in each phase of the converter unit 56 and inverter unit 58.

In this embodiment, a first semiconductor module 82 housing a second switching element Q2 and a third switching element Q3 is disposed along the expected traveling direction of the railcar 10 on the inlet side of the cooling air F1 or the exhaust side of the cooling air F2, i.e., on the first end 72a side of the heat receiving block 72. The first semiconductor module 82 is disposed on the inlet side of the cooling air F1 or the exhaust side of the cooling air F2 relative to the second semiconductor module 84 and the third semiconductor module 86 when traveling in the expected traveling direction (travel direction). In this embodiment, when the first semiconductor module 82 is located on the inlet side of the cooling air F1 (the first end 72a side of the heat receiving block 72) along the first direction of the railcar 10, the third semiconductor module 86 and the second semiconductor module 84 are disposed in this order from the inlet side of the cooling air F1 toward the exhaust side (the second end 72b side of the heat receiving block 72). For this reason, in this embodiment, the second semiconductor module 84, third semiconductor module 86, and first semiconductor module 82 are arranged in this order along the railway vehicle 10 in a second direction opposite to the first direction, from the intake side of the cooling air F2 (the second end 72b side of the heat receiving block 72) to the exhaust side (the first end 72a side of the heat receiving block 72).

In FIG. 2, the first semiconductor module of the U phase of the converter unit 56 is designated by the reference numeral 82CU, and the first semiconductor module of the V phase of the converter unit 56 is designated by the reference numeral 82CV. Similarly, the second semiconductor module of the U phase of the converter unit 56 is designated by the reference numeral 84CU, and the second semiconductor module of the V phase of the converter unit 56 is designated by the reference numeral 84CV. The third semiconductor module of the U phase of the converter unit 56 is designated by the reference numeral 86CU, and the third semiconductor module of the V phase of the converter unit 56 is designated by the reference numeral 86CV. Note that in the following description of the converter unit 56, the first semiconductor module will be primarily described using the reference numeral 82, the second semiconductor module will be primarily described using the reference numeral 84, and the third semiconductor module will be primarily described using the reference numeral 86.

2, the first semiconductor module for the U phase of the inverter unit 58 is designated by the symbol 82IU, the first semiconductor module for the V phase of the inverter unit 58 is designated by the symbol 82IV, and the first semiconductor module for the W phase of the inverter unit 58 is designated by the symbol 82IW. Similarly, the second semiconductor module for the U phase of the inverter unit 58 is designated by the symbol 84IU, the second semiconductor module for the V phase of the inverter unit 58 is designated by the symbol 84IV, and the second semiconductor module for the W phase of the inverter unit 58 is designated by the symbol 84IW. The third semiconductor module for the U phase of the inverter unit 58 is designated by the symbol 86IU, the third semiconductor module for the V phase of the inverter unit 58 is designated by the symbol 86IV, and the third semiconductor module for the W phase of the inverter unit 58 is designated by the symbol 86IW. In the following description of the inverter unit 58, the first semiconductor module will be primarily referred to as 82, the second semiconductor module will be primarily referred to as 84, and the third semiconductor module will be primarily referred to as 86.

The converter section 56 and inverter section 58 of the three-level circuit system according to this embodiment are configured as shown in Figure 4.

As shown in Figure 4, a smoothing filter capacitor 57 is installed between the converter unit 56 and the inverter unit 58 to stabilize and smooth the DC power output from the converter unit 56 and supplied to the inverter unit 58. Note that the filter capacitor 57 is not shown in Figure 2.

This power conversion device 16, together with a control unit (not shown), constitutes a power conversion unit. The control unit transmits and receives switching signals between the converter unit 56 of the power conversion device 16 and the inverter unit 58.

The switching element and the anti-parallel diode are formed of, for example, a silicon semiconductor, but the switching element and the anti-parallel diode are not limited to being formed of a silicon semiconductor and may be formed of any appropriate semiconductor.
For example, the switching elements Q1, Q2, Q3, and Q4 shown in FIG. 3 may be configured by, for example, metal oxide semiconductor field effect transistors (MOSFETs).
At least one of the switching element, the anti-parallel diode, and the clamp diode may be made of a wide bandgap semiconductor.

In this embodiment, as shown in FIG. 2, a heat pipe 60 is disposed in the heat receiving block 72 in the same direction as the cooling air F1 or F2 flows and directly below the semiconductor modules 82, 84, and 86 of each phase. The heat pipe 60 may have a flat appearance, for example, and be disposed on the upper surface of the heat receiving block 72 opposite the cooling fins 74, or may have a flat or cylindrical appearance, for example, and be embedded, for example, pressed into the heat receiving block 72.

In FIG. 2, the heat pipes directly below the first semiconductor module 82CU, third semiconductor module 86CU, and second semiconductor module 84CU of the U phase of the converter unit 56 are designated by the reference symbol 60CU. The heat pipes directly below the first semiconductor module 82CV, third semiconductor module 86CV, and second semiconductor module 84CV of the V phase of the converter unit 56 are designated by the reference symbol 60CV. In the following explanation of the converter unit 56, the heat pipes will mainly be designated by the reference symbol 60.

Similarly, the heat pipes directly below the first semiconductor module 82IU, third semiconductor module 86IU, and second semiconductor module 84IU of the U phase of the inverter unit 58 are designated by the symbol 60IU. The heat pipes directly below the first semiconductor module 82IV, third semiconductor module 86IV, and second semiconductor module 84IV of the V phase of the inverter unit 58 are designated by the symbol 60IV. The heat pipes directly below the first semiconductor module 82IW, third semiconductor module 86IW, and second semiconductor module 84IW of the W phase of the inverter unit 58 are designated by the symbol 60IW. Note that in the following description of the inverter unit 58, the heat pipes will mainly be designated by the symbol 60.

The heat pipes 60 are preferably arranged directly below and spanning the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 sets of each phase of the converter section 56 and inverter section 58. One end 62 of each heat pipe 60 is located between the first end 72a and the second end 72b, on the first end 72a side, and the other end 64 is located between the first end 72a and the second end 72b, on the second end 72b side.

Heat pipes 60 are used for heat transfer. The outer shell of the heat pipe 60 is formed, for example, from a copper alloy. An example of the working fluid for the heat pipes 60 is water. One end 62 of each heat pipe 60 is the evaporation section of the working fluid (refrigerant) sealed inside, and the other end 64 is the condensation section of the working fluid. One end 62 of the heat pipe 60 is positioned on the heat receiving block 72 between the first semiconductor module 82 of each phase and the cooling fin 74. The other end 64 of the heat pipe 60 is positioned on the heat receiving block 72 between the second semiconductor module 84 of each phase and the cooling fin 74.

In this embodiment, each heat pipe 60 is used under conditions such as within an appropriate temperature range, where the working fluid (refrigerant) in the evaporator at one end 62 of the heat pipe 60 does not dry out.

Next, we will explain the effects of the power conversion device 16 of the railway vehicle 10 configured in this manner. Here, we will explain an example in which the railway vehicle 10 travels in a first direction (+X direction) in the expected traveling direction, and an example in which the railway vehicle 10 travels in a second direction (-X direction) opposite the first direction.

When the railway vehicle 10 runs on the rails 100 in a first direction or a second direction, the converter unit 56 of the power conversion device 16 converts AC power input from the overhead line 101 via the pantograph 14a into DC power and outputs it to the inverter unit 58 via a filter capacitor 57. The inverter unit 58 converts the DC power output by the converter unit 56 into AC power.

At this time, in each phase of the converter unit 56 and the inverter unit 58, power is transmitted, for example, from the second semiconductor module 84, the third semiconductor module 86, and the first semiconductor module 82 in that order. That is, power is input to the second semiconductor module 84, passed through the third semiconductor module 86, and output by the first semiconductor module 82.

The power conversion device 16 then supplies the AC power converted by the inverter unit 58 to each electric motor 28. Each electric motor 28 rotates using the supplied AC power. When the rotational force of the electric motor 28 is transmitted to the axle 24, the axle 24 and the wheel 26 rotate. This causes the railway vehicle 10 to travel along the rail 100 in either the first or second expected traveling direction. In other words, the power conversion device 16 drives the electric motor 28 of the railway vehicle 10 and can output to the electric motor 28 electric power that moves the railway vehicle 10 in the specified traveling direction.

When the converter unit 56 converts AC current to DC current, and when the inverter unit 58 converts DC power to AC power, the power conversion device 16 generates heat due to power loss during power conversion. Heat is generated in the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and the inverter unit 58. The heat generated in the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and the inverter unit 58 is transferred to each cooling fin 74 via the heat receiving block 72 of the cooling unit 54.

In each phase of the converter unit 56, the heat generation amount of the first semiconductor module 82 is greater than the heat generation amount of the second semiconductor module 84 and the third semiconductor module 86. In other words, the heat generation amount of each of the second semiconductor module 82 and the third semiconductor module 86 of the converter unit 56 during power conversion is less than that of the first semiconductor module.

Furthermore, in each phase of the inverter unit 58, the amount of heat generated by the first semiconductor module 82 may be greater than the amount of heat generated by the second semiconductor module 84 and the third semiconductor module 86. In other words, the amount of heat generated by each of the second semiconductor module 82 and the third semiconductor module 86 of the inverter unit 58 during power conversion may be less than that of the first semiconductor module. The reason why the amount of heat generated by the first semiconductor module 82 in each phase of the inverter unit 58 may be greater than that of the second semiconductor module 84 and the third semiconductor module 86 is thought to be because the first semiconductor module 82 has two switching elements Q2 and Q3.

In general, the heat generation amount of each phase of the converter section 56 of the power conversion device 16 is greater than the heat generation amount of each phase of the inverter section 58.

When one end 62 of the heat pipe 60 is heated, the working fluid inside the heat pipe 60 absorbs heat and evaporates. At this time, the vapor pressure at one end 62 of the heat pipe 60 becomes higher than the vapor pressure at the other end 64. As a result, the working fluid that evaporates at one end 62 of the heat pipe 60 moves to the other end 64 of the heat pipe 60. The vaporized working fluid condenses into a liquid at the other end 64. The working fluid dissipates heat when it returns from a gas state to a liquid state. Therefore, heat input to one end 62 of the heat pipe 60 is output from the other end 64. Then, the working fluid that has returned to a liquid state at the other end 64 of the heat pipe 60 returns to the one end 62 of the heat pipe 60 via the wick within the heat pipe 60. In this way, the working fluid circulates between one end 62 and the other end 64 of the heat pipe 60 while undergoing a phase change between gas and liquid. Therefore, the heat pipe 60 continues to transfer heat from high-temperature areas to low-temperature areas as long as the working fluid does not dry out. Furthermore, even if the working fluid in the evaporation section dries out, heat can still be transferred from one end 62 of the heat pipe 60 to the other end 64 via the copper alloy material.

In this embodiment, one end 62 of the heat pipe 60 is disposed directly below the first semiconductor module 82 of each phase of the converter unit 56 and the inverter unit 58, and the other end 64 of the heat pipe 60 is disposed directly below the second semiconductor module 84. Therefore, heat from the first semiconductor module 82 is input to one end 62 of the heat pipe 60 by the heat pipe 60, transferred to the other end 64, and output (radiated) at the other end 64.

As a result, heat generated by the first semiconductor module 82 is transferred to the heat receiving block 72 of the cooling unit 54 and moves through one end 62 of the heat pipe 60 to the other end 64. Heat generated at the other end 64 of the heat pipe 60 is then transferred to the heat receiving block 72 of the cooling unit 54. As a result, heat generated by the first semiconductor module 82 is transferred to the heat receiving block 72 of the cooling unit 54 near the first semiconductor module 82 and through the other end 64 of the heat pipe 60 to the heat receiving block 72 of the cooling unit 54 near the other end 64 of the heat pipe 60.

Furthermore, heat generated by the second semiconductor module 84 is transferred to the heat receiving block 72 of the cooling unit 54 near the second semiconductor module 84. Similarly, heat generated by the third semiconductor module 86 is transferred to the heat receiving block 72 of the cooling unit 54 near the third semiconductor module 86.

As a result, of the semiconductor modules 82, 84, and 86 of each phase, the heat from the first semiconductor module 82, which generates the greatest amount of heat, is transferred directly to the heat receiving block 72 of the cooling unit 54 near one end 62 of the heat pipe 60, and is also transferred to the heat receiving block 72 of the cooling unit 54 near the other end 64 of the heat pipe 60. Therefore, the heat from the first semiconductor module 82, which generates the greatest amount of heat, is transferred (thermally conducted) to a wider area of the heat receiving block 72. At the same time, the heat from the second semiconductor module 84 is transferred to the heat receiving block 72 of the cooling unit 54 near the other end 64 of the heat pipe 60. Furthermore, the heat from the third semiconductor module 86 is transferred to the heat receiving block 72 of the cooling unit 54 at a position between the one end 62 and the other end 64 of the heat pipe 60.

Therefore, in the railway vehicle 10 according to this embodiment, when heat is transferred to the heat receiving block 72, a locally large amount of heat transfer is prevented in the heat receiving block 72. In this embodiment, a portion of the heat from the first semiconductor module 82 is transferred to the other end 64 of the heat pipe 60 at one end 62, and a portion of the heat from the first semiconductor module 82 is transferred to the heat receiving block 72 at one end 62 of the heat pipe 60. Furthermore, a portion of the heat from the first semiconductor module 82 is transferred to the heat receiving block 72 at the other end 64 of the heat pipe 60, and a portion of the heat from the second semiconductor module 84 is transferred to the heat receiving block 72 near the other end 64 of the heat pipe 60. Therefore, in the power conversion device 16 according to this embodiment, heat from the first semiconductor module 82, which generates the greatest amount of heat among the semiconductor modules 82, 84, and 86 of each phase, is dispersed and transferred to the heat receiving block 72. Furthermore, a portion of the heat from the third first semiconductor module 82 is transferred to the heat receiving block 72. As a result, the power conversion device 16 of this embodiment reduces the area requiring locally high heat transfer when transferring heat to the heat receiving block 72 of the cooling unit 54. Therefore, in the power conversion device 16 of this embodiment, heat from the semiconductor modules 82, 84, 86 of each phase is dispersed and transferred over a wide area, such as the contact surface between the heat pipe 60 and the heat receiving block 72 and the surrounding area. In other words, the power conversion device 16 of the railway vehicle 10 of this embodiment achieves uniform heat transfer to the cooling unit 54 caused by heat generated by the converter unit 56 and inverter unit 58.

The housing 52 is open in at least the expected traveling direction (first direction and second direction), allowing air to flow along the cooling section 54. As a result, when the railcar 10 travels in the first direction, traveling wind (cooling wind) F1 hits one end 74a of the cooling fin 74 and exits from the other end 74b of the cooling fin 74. At this time, the multiple cooling fins 74 receive the traveling wind F1 flowing in the first direction as the railcar 10 travels. Heat exchange occurs between the multiple cooling fins 74 and the traveling wind (atmosphere) F1, allowing heat generated in the semiconductor modules 82, 84, 86 of each phase of the inverter section 58 and converter section 56 to be dissipated to the atmosphere via the multiple cooling fins 74.

For this reason, the cooling unit 54 cools the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and inverter unit 58, which generate heat during power conversion. Therefore, the cooling unit 54 suppresses temperature increases in the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and inverter unit 58, and attempts to maintain a uniform temperature among the semiconductor modules 82, 84, and 86 in each phase.

When the railway vehicle 10 travels in a second direction opposite the first direction, traveling wind (cooling wind) F2 hits the other end 74b of the cooling fin 74 and exits from one end 74a of the cooling fin 74. At this time, the multiple cooling fins 74 receive the traveling wind F2 flowing in the second direction as the railway vehicle 10 travels. As a result, the cooling unit 54 cools the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and inverter unit 58. As a result, the cooling unit 54 suppresses temperature increases in the semiconductor modules 82, 84, and 86 of each phase and attempts to maintain a uniform temperature among the semiconductor modules 82, 84, and 86 in each phase.

In this way, the power conversion device 16 according to this embodiment arranges the three semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and inverter unit 58 on the heat receiving block 72 of the cooling unit 54, and arranges the first semiconductor module 82, which generates the greatest amount of heat, on the one end 62 side of the heat pipe 60. Therefore, the power conversion device 16 according to this embodiment transfers heat from the first semiconductor module 82, which is expected to generate the greatest amount of heat in each phase, to the cooling unit 54, and also transfers heat from one end 62 to the other end 64 of the heat pipe 60 before transferring it to the cooling unit 54, thereby cooling the three semiconductor modules 82, 84, and 86 of each phase. Therefore, the power conversion device 16 according to this embodiment can suppress temperature increases in the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and inverter unit 58 during power conversion, and can maintain uniform temperatures in the semiconductor modules 82, 84, and 86 in each phase.

Therefore, this embodiment provides a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and inverter section 58.

In this embodiment, an example has been described in which the U and V phases of the converter unit 56 are arranged in a direction (Y direction) perpendicular to the direction of travel (X direction). The U and V phases of the converter unit 56 only need to be adjacent in a direction intersecting the direction of travel.

Similarly, in this embodiment, an example has been described in which the U, V, and W phases of the inverter unit 58 are arranged in a direction (Y direction) perpendicular to the direction of travel (X direction). The U, V, and W phases of the inverter unit 58 may be arranged adjacent to each other in a direction intersecting the direction of travel.

In this embodiment, an example has been described in which the first semiconductor module 82, the third semiconductor module 86, and the second semiconductor module 84 are arranged in this order along the expected driving direction in each phase of the converter unit 56 and each phase of the inverter unit 58. The order of the second semiconductor module 84 and the third semiconductor module 86 may be reversed. That is, in either the phase of the converter unit 56 or the phase of the inverter unit 58, the second semiconductor module 84 may be arranged between the first semiconductor module 82 and the third semiconductor module 86. Therefore, the condensation portion of the working fluid at the other end 64 of the heat pipe 60 only needs to be arranged between the cooling fin 74 and the second semiconductor module 84 or the third semiconductor module 86.

Furthermore, in this embodiment, an example has been described in which the heat pipe 60 is arranged so as to straddle three semiconductor modules 82, 84, and 86 in each phase of the converter section 56 and each phase of the inverter section 58. It is also preferable that the evaporator section at one end 62 of the heat pipe 60 is arranged between the cooling fin 74 and the first semiconductor module 82, and the condenser section at the other end 64 is arranged between the cooling fin 74 and the third semiconductor module 86 in Figure 2. In this case, the heat pipe 60 does not have to be arranged between the cooling fin 74 and the second semiconductor module 84.

In the power conversion device 16 shown in Figure 2, an example has been described in which one heat pipe 60 is arranged for a set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for each phase of the converter unit 56 and inverter unit 58. Multiple heat pipes 60, such as two, may be arranged side by side in the width direction (Y direction) for a set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for each phase of the converter unit 56 and inverter unit 58.

Also, one of the multiple heat pipes 60 may be disposed directly below the set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for each phase of the converter unit 56 and the inverter unit 58, and the remaining heat pipes 60 may be disposed between the set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for the adjacent phase. That is, for example, one heat pipe 60 may be disposed directly below the set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for the U and V phases of the converter unit 56. Then, one heat pipe 60 may be disposed between the set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for the U phase of the converter unit 56 and the set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for the V phase. In this case, the heat pipes 60 are positioned so as not to interfere with the attachment of each semiconductor module 82, 84, 86 to the heat receiving block 72. The heat generated by the first semiconductor module 82 of each phase can be transferred from one end 62 to the other end 64 of the heat pipes 60 and then transferred to the cooling unit 54. That is, when the heat pipes 60 are not in direct contact with the semiconductor modules 82, 84, 86, heat from the first semiconductor module 82, for example, is transferred to the one end 62 of the heat pipe 60 via the heat receiving block 72 of the cooling unit 54. In this manner, heat from the first semiconductor module 82 may be transferred directly to the one end 62 of the heat pipe 60, or may be transferred to the one end 62 of the heat pipe 60 via the heat receiving block 72 of the cooling unit 54. In either case, heat input to the one end 62 of the heat pipe 60 is radiated from the other end 64, which is at a lower temperature than the one end 62, and transferred to the heat receiving block 72 of the cooling unit 54.

In this embodiment, an example has been described in which, for both the converter unit 56 and the inverter unit 58, the three semiconductor modules 82, 84, 86 for each phase are arranged on the heat receiving block 72 of the cooling unit 54, and the first semiconductor module 82, which generates the greatest amount of heat, is arranged on one end 62 of the heat pipe 60. For example, for the converter unit 56, the three semiconductor modules 82, 84, 86 for the U and V phases may be arranged on the heat receiving block 72 of the cooling unit 54, and the first semiconductor module 82, which generates the greatest amount of heat, may be arranged on one end 62 of the heat pipe 60, and a different cooling structure may be adopted for the inverter unit 58.

Note that the power conversion device 16 according to this embodiment may have, for example, multiple inverter units 58 connected to one converter unit 56. Furthermore, one inverter unit 58 may drive, for example, multiple electric motors 28 of the bogie 12 of the railway vehicle 10.

Second Embodiment
A second embodiment of the power conversion device 16 will be described with reference to Fig. 5. The power conversion device 16 according to this embodiment is a modified example of the power conversion device 16 according to the first embodiment, and the contents described in the first embodiment will not be described as appropriate.

Figure 5 shows a power conversion device 16 according to the second embodiment. As shown in Figure 5, in the power conversion device 16 according to this embodiment, each phase (U-phase and V-phase) of the converter unit 56 and each phase (U-phase, V-phase, and W-phase) of the inverter unit 58 has a plurality of first semiconductor modules 82 connected in parallel, a plurality of second semiconductor modules 84 connected in parallel, and a plurality of third semiconductor modules 86 connected in parallel. For simplicity of explanation, it is assumed here that each phase of the converter unit 56 and the inverter unit 58 has n (n is a natural number greater than or equal to 2) first semiconductor modules 82, second semiconductor modules 84, and third semiconductor modules 86 connected in parallel.

The first semiconductor modules 82 for each phase of the converter unit 56 and inverter unit 58 are arranged on the heat receiving block 72 of the cooling unit 54 in a direction (Y direction) perpendicular to the expected traveling direction (X direction). In FIG. 5, two first semiconductor modules 82CU1, 82CU2, etc. are arranged in the U phase of the converter unit 56, and two first semiconductor modules 82CV1, 82CV2, etc. are arranged in the V phase. Furthermore, two semiconductor modules are arranged in each of the U and V phases of the inverter unit 58, but these are not shown in FIG. 5. In FIG. 5, two first semiconductor modules 82IW1, 82IW2, etc. are arranged in the W phase of the inverter unit 58.

The second semiconductor modules 84 for each phase of the converter unit 56 and the inverter unit 58 are arranged on the heat receiving block 72 of the cooling unit 54 in a direction (Y direction) perpendicular to the expected traveling direction (X direction). In FIG. 5, two second semiconductor modules 84CU1, 84CU2, etc. are arranged in the U phase of the converter unit 56, and two second semiconductor modules 84CV1, 84CV2, etc. are arranged in the V phase. Furthermore, two semiconductor modules are arranged in each of the U and V phases of the inverter unit 58, but these are not shown in FIG. 5. In FIG. 5, two second semiconductor modules 84IW1, 84IW2, etc. are arranged in the W phase of the inverter unit 58.

The third semiconductor modules 86 for each phase of the converter unit 56 and the inverter unit 58 are arranged on the heat receiving block 72 of the cooling unit 54 in a direction (Y direction) perpendicular to the expected traveling direction (X direction). In FIG. 5, two third semiconductor modules 86CU1, 86CU2, etc. are arranged in the U phase of the converter unit 56, and two third semiconductor modules 86CV1, 86CV2, etc. are arranged in the V phase. Furthermore, two semiconductor modules are arranged in each of the U and V phases of the inverter unit 58, but these are not shown in FIG. 5. In FIG. 5, two third semiconductor modules 86IW1, 86IW2, etc. are arranged in the W phase of the inverter unit 58.

Then, for example, a third semiconductor module 86 is arranged adjacent to each first semiconductor module 82 in the -X direction (the second end 72b side of the heat receiving block 72 relative to the first end 72a), and a second semiconductor module 84 is arranged adjacent to the third semiconductor module 86 in the -X direction (the second end 72b side of the heat receiving block 72 relative to the first end 72a).

The same number of heat pipes 60 are prepared as the number of first semiconductor modules 82 for each phase of the converter unit 56 and inverter unit 58. A heat pipe 60 is disposed between each set of the first semiconductor module 82, third semiconductor module 86, and second semiconductor module 84 arranged in the X direction for each phase of the converter unit 56 and inverter unit 58 and the cooling fin 74.

Explaining the example in FIG. 5, a heat pipe 60CU1 is arranged between the cooling fins 74 and the first semiconductor module 82CU1, third semiconductor module 86CU1, and second semiconductor module 84CU1 of the U phase of the converter unit 56. A heat pipe 60CU2 is arranged between the cooling fins 74 and the first semiconductor module 82CU2, third semiconductor module 86CU2, and second semiconductor module 84CU2 of the U phase of the converter unit 56. A heat pipe 60CV1 is arranged between the cooling fins 74 and the first semiconductor module 82CV1, third semiconductor module 86CV1, and second semiconductor module 84CV1 of the V phase of the converter unit 56. A heat pipe 60CV2 is arranged between the cooling fins 74 and the first semiconductor module 82CV2, third semiconductor module 86CV2, and second semiconductor module 84CV2 of the V phase of the converter unit 56.

In Figure 5, the two semiconductor modules and heat pipes for each of the U and V phases of the inverter unit 58 are not shown. A heat pipe 60IW1 is arranged between the cooling fins 74 and the first semiconductor module 82IW1, third semiconductor module 86IW1, and second semiconductor module 84IW1 of the W phase of the inverter unit 58. A heat pipe 60IW2 is arranged between the cooling fins 74 and the first semiconductor module 82IW2, third semiconductor module 86IW2, and second semiconductor module 84IW2 of the W phase of the inverter unit 58.

One end 62 of each heat pipe 60 is positioned between the first semiconductor module 82 and the cooling fin 74. The other end 64 of the heat pipe 60 is positioned between the second semiconductor module 84 and the cooling fin 74.

By connecting multiple semiconductor modules in parallel in each phase of the converter section 56 and the inverter section 58, as in the power conversion device 16 of this embodiment, the current density of the current flowing through the power conversion device 16 can be increased compared to the power conversion device 16 described in the first embodiment.

The power conversion device 16 according to this embodiment achieves the same effects as the power conversion device 16 described in the first embodiment. Therefore, when performing power conversion, the power conversion device 16 according to this embodiment can suppress temperature increases in the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and inverter unit 58, and can maintain a uniform temperature in the semiconductor modules 82, 84, and 86 in each phase.

Therefore, this embodiment provides a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and inverter section 58.

[Third embodiment]
A third embodiment of the power conversion device 16 will be described with reference to Fig. 6. The power conversion device 16 according to this embodiment is a further modified example of the power conversion device 16 according to the first and second embodiments, and the contents described in the first and second embodiments will not be described as appropriate.

Figure 6 shows a power conversion device 16 according to a third embodiment. The power conversion device 16 shown in Figure 6 is a diagram in which terminal blocks 92a, 92b and AC terminals 94C, 94I have been added to the upper left diagram of Figure 2.

As shown in FIG. 6, the power conversion device 16 has a terminal block 92a on the converter unit 56 side and a terminal block 92b on the inverter unit 58 side. The terminal blocks 92a and 92b are provided, for example, on the housing 52 shown in FIG. 1. The terminal blocks 92a and 92b are provided, for example, on the first direction (+X direction) side of the cooling unit 54. Note that the terminal block 92a of the converter unit 56 and the terminal block 92b of the inverter unit 58 may be integrated as long as they are electrically insulated.

In the power conversion device 16 shown in the upper left diagram of Figure 2 of the first embodiment, when power input is on the right side (-X direction) and output is on the left side (+X direction), the first semiconductor module 82 of the converter unit 56 is provided with an AC terminal (input terminal) 94CU on the converter unit 56 side that is electrically connected to the terminal block 92a. Note that Figure 6 shows, as representatives, the AC terminal 94CU1 connected to the first semiconductor module 82CU and the AC terminal 94CU3 connected to the third semiconductor module 86CU. The first semiconductor module 82 of the inverter unit 58 is provided with an AC terminal (output terminal) 94IW on the inverter unit 58 side that is electrically connected to the terminal block 92b. Note that Figure 6 shows, as representatives, the AC terminal 94IW1 connected to the first semiconductor module 82IW and the AC terminal 94IW3 connected to the third semiconductor module 86IW. In other words, the V-phase AC terminal of the converter unit 56 is not shown in Figure 6. Also, in Figure 6, the U-phase output terminal and V-phase output terminal of the inverter unit 58 are not shown. In the following explanation, the terminal of the converter unit 56 will mainly be referred to as 94C, and the terminal of the inverter unit 58 will mainly be referred to as 94I.

In this way, one end of the AC terminal 94C for each phase on the converter unit 56 side protrudes toward the side where the terminal block 92a is provided, and one end of the AC terminal 94I for each phase on the inverter unit 58 side protrudes toward the side where the terminal block 92b is provided.

The AC terminal 94C of the converter unit 56 and the AC terminal 94I of the inverter unit 58 are each formed from a conductor called a bus bar.

According to this embodiment, the power conversion device 16 has the AC terminal 94C of the converter unit 56 and the AC terminal 94I of the inverter unit 58 arranged in the same direction, i.e., the first direction side, relative to the converter unit 56 and the inverter unit 58. Furthermore, the power conversion device 16 has the terminal blocks 92a and 92b arranged on the first direction side. This allows workers performing maintenance, etc., to easily connect/disconnect the AC terminal 94C of each phase of the converter unit 56 to the terminal block 92a, and easily connect/disconnect the AC terminal 94I of each phase of the inverter unit 58 to the terminal block 92b. Therefore, the power conversion device 16 according to this embodiment improves the ease of connecting/disconnecting the AC terminal 94C of each phase of the converter unit 56 to the terminal block 92a, and connecting/disconnecting the AC terminal 94I of each phase of the inverter unit 58 to the terminal block 92b.

Furthermore, the AC terminal 94C of the converter unit 56 of the power conversion device 16, the AC terminal 94I of the inverter unit 58, and the terminal blocks 92a and 92b are provided on the first direction side. This reduces the number of electrical connection positions between the converter unit 56 and the inverter unit 58 to one or two, for example. This allows the power conversion device 16 to be manufactured in a relatively compact size. Furthermore, by determining that the AC terminal 94C of the converter unit 56 of the power conversion device 16, the AC terminal 94I of the inverter unit 58, and the terminal blocks 92a and 92b are provided on the first direction side and clarifying the design concept, the design of the converter unit 56 and the inverter unit 58 can be relatively easily performed.

Furthermore, the power conversion device 16 according to this embodiment achieves the same effects as the power conversion device 16 described in the first embodiment. Therefore, according to the power conversion device 16 according to this embodiment, when power conversion is performed, it is possible to suppress temperature increases in the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and the inverter unit 58, and to maintain a uniform temperature in the semiconductor modules 82, 84, and 86 in each phase.

Therefore, this embodiment provides a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and inverter section 58.

[First Modification]
A power conversion device 16 according to a first modification of the third embodiment will be described with reference to FIG.

The arrangement of the converter unit 56 and inverter unit 58 of the power conversion device 16 in Figure 7 according to the first variant of the third embodiment is reversed in the width direction (Y direction) compared to the converter unit 56 and inverter unit 58 of the power conversion device 16 according to the first embodiment shown in the upper left diagram of Figure 2. In other words, the arrangement of the inverter unit 58 and converter unit 56 in the width direction can be selected as appropriate. Note that the heat pipes 60 are not shown in Figure 7.

The power conversion device 16 according to this modification achieves the same effects as the power conversion device 16 described in the first to third embodiments. Therefore, the power conversion device 16 according to this modification can suppress temperature increases in the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and inverter unit 58 during power conversion, and can maintain a uniform temperature for the semiconductor modules 82, 84, and 86 in each phase. Therefore, this modification can provide a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and inverter unit 58.

[Second Modification]
A power conversion device 16 according to a second modification of the third embodiment will be described with reference to FIG.

The arrangement of the converter unit 56 and inverter unit 58 of the power conversion device 16 in Figure 8 relating to the second modified example of the third embodiment is reversed in the expected driving direction (X direction) compared to the converter unit 56 and inverter unit 58 of the power conversion device 16 in Figure 7 relating to the first modified example of the third embodiment. In other words, the arrangement of the inverter unit 58 and converter unit 56 in the expected driving direction can be selected as appropriate. Note that the heat pipe 60 is not shown in Figure 8.

The power conversion device 16 according to this modification achieves the same effects as the power conversion device 16 described in the first to third embodiments. Therefore, the power conversion device 16 according to this modification can suppress temperature increases in the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and inverter unit 58 during power conversion, and can maintain a uniform temperature for the semiconductor modules 82, 84, and 86 in each phase. Therefore, this modification can provide a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and inverter unit 58.

[Fourth embodiment]
A fourth embodiment of the power conversion device 16 will be described with reference to Fig. 9. The power conversion device 16 according to this embodiment is a further modified example of the power conversion device 16 according to the first to third embodiments, including the modified examples, and the contents described in the first to third embodiments will not be described as appropriate.

In the first embodiment, as shown in FIG. 3, an example was described in which the three-level power conversion device 16 is configured with a first semiconductor module 82, which is a 2-in-1 module, and second and third semiconductor modules 84, 86, which are two chopper modules.

Figure 9 shows a three-level circuit diagram of each phase of the converter unit 56 and inverter unit 58 according to this embodiment. Each phase of the converter unit 56 and inverter unit 58 is composed of three semiconductor modules 82, 84, and 86, which house semiconductors such as switching elements and diodes.

For example, as shown in FIG. 9, the clamp diode D5 (see FIG. 3) of the second semiconductor module 84 may be replaced with a switching element such as an IGBT, resulting in a 2-in-1 module configured as a single package. Also, the clamp diode D6 (see FIG. 3) of the third semiconductor module 86 may be replaced with a switching element such as an IGBT, resulting in a 2-in-1 module configured as a single package.

The power conversion device 16 according to this embodiment achieves the same effects as the power conversion device 16 described in the first to third embodiments. Therefore, when performing power conversion, the power conversion device 16 according to this embodiment can suppress temperature increases in the semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and inverter unit 58, and can maintain a uniform temperature in the semiconductor modules 82, 84, and 86 in each phase.

Therefore, this embodiment provides a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and inverter section 58.

In addition, in the power conversion device 16 according to this embodiment, the three-level circuit shown in FIG. 9 may be used for each phase of the converter unit 56, and the three-level circuit shown in FIG. 3 may be used for the inverter unit 58. In addition, in the power conversion device 16 according to this embodiment, the three-level circuit shown in FIG. 3 may be used for each phase of the converter unit 56, and the three-level circuit shown in FIG. 9 may be used for the inverter unit 58.

As described above, according to the embodiments including the various modifications, it is possible to provide a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and the inverter section 58.

Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims.
The following is a summary of the claims of this application at the time of filing.
[Appendix 1]
a cooling unit having cooling fins that are cooled by movement of the railway vehicle in one and the other traveling directions;
a converter unit, the U-phase and V-phase being adjacent to each other in a direction intersecting the direction of travel, fixed to the cooling unit, and generating heat when converting AC to DC;
an inverter unit that is adjacent to the converter unit in a direction intersecting the traveling direction, and that is adjacent to a U-phase, a V-phase, and a W-phase in a direction intersecting the traveling direction, and that is fixed to the cooling unit and generates heat when converting DC to AC;
a plurality of heat pipes provided between the cooling fin and the converter unit, and between the cooling fin and the inverter unit;
and
Each phase of the converter unit and each phase of the inverter unit are
a first semiconductor module that generates heat during power conversion;
a second semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module;
a third semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module;
Equipped with
the first semiconductor module is provided on an air intake side or an air exhaust side relative to the second semiconductor module and the third semiconductor module when traveling in the traveling direction;
the heat pipes are provided for each phase of the converter unit and each phase of the inverter unit,
an evaporating portion of the working fluid at one end of the heat pipe is disposed between the cooling fin and the first semiconductor module;
a condensation portion of the working fluid at the other end of the heat pipe is disposed between the cooling fin and the second semiconductor module or the third semiconductor module.
Power conversion equipment for railway vehicles.
[Appendix 2]
the heat pipe is disposed directly below and straddling a set of the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit,
2. The power conversion device for a railway vehicle according to claim 1.
[Appendix 3]
a housing in which the converter unit, the inverter unit, and the cooling unit are disposed;
The housing is provided with a terminal block,
the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit are each provided with an AC terminal;
the terminal block, the AC terminal of the converter unit, and the AC terminal of the inverter unit are provided on the same side of the first semiconductor module, that is, on the air intake side or the air exhaust side.
3. The power conversion device for a railway vehicle according to claim 1 or 2.
[Appendix 4]
the first semiconductor module is a module accommodating a plurality of switching elements that generate heat due to power conversion;
4. The power conversion device for a railway vehicle according to claim 1.

10...railroad vehicle, 12...bogie, 14...car body, 14a...pantograph, 16...power conversion device, 22...bogie frame, 24...axle, 26...wheel, 28...electric motor, 30...bogie spring, 52...casing, 54...cooling section, 56...converter section, 57...filter capacitor, 58...inverter section, 60...heat pipe, 62...one end (evaporation section), 64...other end (condensation section), 72...heat receiving block, 7 4...cooling fin, 74a...one end, 74b...other end, 82, 82C, 82I...first semiconductor module, 84, 84C, 84I...second semiconductor module, 86, 86C, 86W...third semiconductor module, 92a, 92b...terminal block, 94C, 94I...AC terminal, 100...rail, 101...overhead line, Q1-Q4...switching elements, D5, D6...clamp diodes.

Claims (4)

a cooling unit having cooling fins that are cooled by movement of the railway vehicle in one and the other traveling directions;
a converter unit, the U-phase and V-phase being adjacent to each other in a direction intersecting the direction of travel, fixed to the cooling unit, and generating heat when converting AC to DC;
an inverter unit that is adjacent to the converter unit in a direction intersecting the traveling direction, and that is adjacent to a U phase, a V phase, and a W phase in a direction intersecting the traveling direction, and that is fixed to the cooling unit and generates heat when converting DC to AC;
a plurality of heat pipes respectively provided between the cooling fin and the converter unit, and between the cooling fin and the inverter unit;
the cooling portion has a first end along the traveling direction and a second end opposite to the first end,
Each phase of the converter unit and each phase of the inverter unit are
a first semiconductor module disposed adjacent to the first end of the cooling unit and generating heat during power conversion;
a second semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module;
a third semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module;
the first semiconductor module is provided on an air intake side or an air exhaust side relative to the second semiconductor module and the third semiconductor module when traveling in the traveling direction;
the heat pipes are provided for each phase of the converter unit and each phase of the inverter unit,
an evaporating portion of the working fluid at one end of the heat pipe is disposed between the cooling fin and the first semiconductor module;
a condensation portion of the working fluid at the other end of the heat pipe is disposed between the cooling fin and the second semiconductor module or the third semiconductor module;
Power conversion equipment for railway vehicles. The power conversion device for railway vehicles according to claim 1, wherein the heat pipes are arranged directly below and straddling the first semiconductor module, the second semiconductor module, and the third semiconductor module set for each phase of the converter unit and the inverter unit. a housing in which the converter unit, the inverter unit, and the cooling unit are disposed;
The housing is provided with a terminal block,
the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit are each provided with an AC terminal;
3. The power conversion device for a railway vehicle according to claim 1, wherein the terminal block, the AC terminal of the converter unit, and the AC terminal of the inverter unit are arranged in the same direction, either on the air intake side or the air exhaust side, relative to the first semiconductor module. 4. The power conversion device for a railway vehicle according to claim 1, wherein the first semiconductor module is a module accommodating a plurality of switching elements that generate heat due to power conversion.