JP7799504B2 - Quartz crystal oscillator, its manufacturing method, and intermediate wafer for quartz crystal oscillator - Google Patents
Quartz crystal oscillator, its manufacturing method, and intermediate wafer for quartz crystal oscillatorInfo
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Description
本発明は、水晶片を容器に導電性接着剤によって接着固定する構造に特徴を有した水晶振動子及びその製造方法並びに水晶振動子用の中間体ウエハに関する。 The present invention relates to a quartz crystal unit characterized by a structure in which a quartz crystal blank is adhesively fixed to a container using a conductive adhesive, a method for manufacturing the same, and an intermediate wafer for the quartz crystal unit.
近年のほとんどの水晶振動子は、ＳＭＤ型のものである。従って、水晶片を容器に固定する際は、水晶片の２つの主面の一方を容器の接着パッド側に対向させ、当該主面の所定部分を接着パッドに導電性接着剤によって電気的かつ機械的に接続固定する。 Most quartz crystal units available today are SMD type. Therefore, when fixing a quartz crystal blank to a container, one of the two main surfaces of the quartz crystal blank faces the adhesive pad on the container, and a specific portion of that main surface is electrically and mechanically connected to the adhesive pad using a conductive adhesive.
一方、水晶片は、その表裏に励振用電極を有しているため、接着パッドとは反対面側にある励振用電極は、接着パッド側に引き回す必要がある。一般には、この引き回しは、水晶片の側面を経由して行われる。
水晶片の一方の面から他方の面に励振用電極を、水晶片の側面を経由して引き回す場合、水晶片の主面と側面との境界である水晶片のエッジで電極の断線が起き易い。
この断線を軽減する１つの策として、例えば特許文献１に示されているように、水晶片の一方の面から他方の面に貫通孔を設け、この貫通孔を利用して表裏の導通を図る構造がある（特許文献１，３，５、段落８３等）。
On the other hand, since the crystal blank has excitation electrodes on both sides, the excitation electrodes on the side opposite the bonding pads must be routed to the bonding pads, which is generally done via the side of the crystal blank.
When an excitation electrode is routed from one surface of a crystal blank to the other via the side surface of the crystal blank, the electrode is prone to breakage at the edge of the crystal blank, which is the boundary between the main surface and the side surface of the crystal blank.
One way to reduce this disconnection is to provide a through hole from one side of the crystal piece to the other, as shown in Patent Document 1, and use this through hole to ensure electrical continuity between the front and back sides (Patent Documents 1, 3, 5, paragraph 83, etc.).
しかしながら、特許文献１には、貫通孔の具体的な構造、特に深さ方向の内部形状等の具体的な記載はない。また、貫通孔の製法に関する記載もない。貫通孔の製法としてフォトリソグラフィ技術及びウエットエッチング技術を用いる方法が考えられるが、この方法を水晶片の貫通孔の形成に使用した場合、貫通孔の開口部や内部が水晶の結晶性に起因した結晶面の影響を受け、貫通孔内部は複数の結晶面からから成る複雑な構造となる。そのため、貫通孔内部を、電極膜等の導通部材が形成し易い状態となった貫通孔を形成することが難しい。
すなわち、貫通孔の構造によっては、水晶片の表裏の導通を図るという目的を満足できない場合があり、貫通孔の構造やその製造方法に関して、改善の余地がある。
本出願に係る発明者も、水晶片の表裏の導通を図るための貫通孔の構造およびその製法について鋭意検討を行ってきた。
この出願は上記の点に鑑みなされたものであり、従って、この出願の目的は、水晶片の表裏を導通するための好ましい貫通孔を有した新規な構造の水晶振動子と、この構造を簡易に形成できる製造方法と、前記水晶振動子を形成するための中間体ウエハと、を提供することにある。
However, Patent Document 1 does not specifically describe the structure of the through-hole, particularly the internal shape in the depth direction. It also does not describe a method for manufacturing the through-hole. While photolithography and wet etching techniques are conceivable as methods for manufacturing through-holes in quartz crystal pieces, when these methods are used to form through-holes in quartz crystal pieces, the opening and interior of the through-hole are affected by the crystal planes due to the crystallinity of the quartz crystal, resulting in a complex structure inside the through-hole consisting of multiple crystal planes. Therefore, it is difficult to form through-holes in a state where a conductive material such as an electrode film can be easily formed inside the through-hole.
That is, depending on the structure of the through-hole, the objective of achieving electrical continuity between the front and back of the crystal blank may not be achieved, and there is room for improvement in the structure of the through-hole and its manufacturing method.
The inventors of the present application have also conducted extensive research into the structure of the through holes for achieving electrical continuity between the front and back of the crystal blank, and the manufacturing method thereof.
This application has been made in consideration of the above points, and therefore, the object of this application is to provide a quartz crystal resonator with a novel structure having a preferable through hole for providing electrical conductivity between the front and back of the quartz crystal blank, a manufacturing method that can easily form this structure, and an intermediate wafer for forming the quartz crystal resonator.
この目的の達成を図るため、この出願の水晶振動子によれば、水晶片と、前記水晶片を収容する容器と、前記水晶片を容器に接続固定している導電性接着剤と、前記水晶片の前記接続固定領域の一部に設けられ前記水晶片の表裏を貫通している貫通孔と、を備える水晶振動子において、
前記貫通孔としての、水晶の結晶性を消失させた面を内壁に有する貫通孔と、
前記水晶片の一方の面、前記貫通孔の内壁上及び前記水晶片の他方の面に渡って設けられた電極と、を備えることを特徴とする。
In order to achieve this object, the quartz crystal resonator of this application comprises a quartz crystal piece, a container for accommodating the quartz crystal piece, a conductive adhesive for connecting and fixing the quartz crystal piece to the container, and a through-hole that is provided in a portion of the connection and fixing area of the quartz crystal piece and penetrates the front and back of the quartz crystal piece,
The through hole has an inner wall formed of a surface of quartz crystal that has lost its crystallinity;
and electrodes provided on one surface of the crystal blank, on the inner wall of the through-hole, and across the other surface of the crystal blank.
ここで、水晶の結晶性を消失させた面とは、フォトリソグラフィ技術及びフッ酸系エッチャントを用いたウエットエッチング技術によって形成され、水晶の結晶面が凹部の内壁や底面の一部又は全部に残った面とは違う面、のことである。
具体的には、水晶の結晶性を消失させた面とは、当該貫通孔の内壁に水晶片表面から深さ方向に進行した線状痕跡が、内壁の周方向に並んでいて、これら並んだ線状痕跡による微小凹凸が生じている面である（図２（Ａ）のＳＥＭ写真参照）。このような面は、本願の別発明である短パルスレーザ、例えばピコ秒レーザ又はフェムト秒レーザ等を用いる製法によって形成できる。
Here, the surface from which the crystallinity of the quartz crystal has been eliminated refers to a surface that is different from the surface formed by photolithography and wet etching using a hydrofluoric acid-based etchant, in which the quartz crystal surface remains on part or all of the inner wall and bottom surface of the recess.
Specifically, a surface in which the crystallinity of the quartz crystal has been eliminated is a surface in which linear traces extending in the depth direction from the surface of the quartz crystal blank are aligned in the circumferential direction of the inner wall of the through-hole, resulting in minute irregularities caused by these aligned linear traces (see the SEM photograph in Figure 2(A)). Such a surface can be formed by a manufacturing method using a short-pulse laser, such as a picosecond laser or femtosecond laser, which is another invention of the present application.
なお、この水晶振動子の発明を実施するに当たり、前記貫通孔は、水晶片の厚さ方向に沿って切った断面形状が、水晶片の第１表面側からその反対面である第２表面側に向かって先細りのロート状であることが好ましい（図１（Ｃ）参照）。
また、この水晶振動子の発明を実施するに当たり、前記貫通孔は、水晶片の厚さ方向に沿って切った断面形状が、水晶片の厚さ方向の途中で開口具合が低減し、その後拡大する、いわゆる砂時計状であっても良い（図２（Ｂ）参照）。
このようにロート状や砂時計形状であると、貫通孔内に電極形成用の膜を被覆し易い。
In carrying out the invention of this quartz crystal resonator, it is preferable that the cross section of the through hole taken along the thickness direction of the quartz crystal blank has a funnel-like shape that tapers from the first surface side to the second surface side of the quartz crystal blank (see FIG. 1(C)).
Furthermore, in carrying out the invention of this quartz crystal resonator, the through hole may have a cross-sectional shape cut along the thickness direction of the quartz crystal element, in which the opening decreases midway through the thickness direction of the quartz crystal element and then expands, forming a so-called hourglass shape (see FIG. 2(B)).
Such a funnel-like or hourglass-like shape makes it easy to coat the inside of the through-hole with a film for forming an electrode.
この出願の他の発明である水晶振動子の製造方法の発明によれば、水晶片を容器に導電性接着剤によって固定している構造を有した水晶振動子を製造するに当たり、
前記水晶片の導電性接着剤によって固定される予定領域の一部に、短パルスレーザによって、水晶片を貫通する貫通孔を形成する工程と、
前記貫通孔を形成した水晶片に水晶振動子の電極形成用の金属膜を、前記貫通孔内も被覆するよう形成する工程と、
前記金属膜を形成した水晶片に前記貫通孔内も被覆するようフォトレジストを形成する工程と、
前記フォトレジストを露光・現像して電極形成用のレジストパタンを形成する工程と、前記レジストパタンから露出する前記金属膜を選択的に除去して当該電極としての、前記貫通孔内も被覆している電極を形成する工程と
を含むことを特徴とする。
According to another invention of this application, a method for manufacturing a quartz crystal resonator, when manufacturing a quartz crystal resonator having a structure in which a quartz crystal blank is fixed to a container with a conductive adhesive,
forming a through-hole penetrating the quartz crystal blank by using a short-pulse laser in a portion of the area of the quartz crystal blank that is to be fixed with a conductive adhesive;
forming a metal film for forming electrodes of a quartz crystal unit on the quartz crystal element having the through-holes formed therein so as to cover the inside of the through-holes;
forming a photoresist on the crystal piece on which the metal film is formed so as to cover the inside of the through-hole;
The method is characterized by including a step of exposing and developing the photoresist to form a resist pattern for forming an electrode, and a step of selectively removing the metal film exposed from the resist pattern to form an electrode that also covers the inside of the through hole.
この出願の水晶振動子によれば、水晶片の容器と接続される領域の一部に、水晶片を貫通していて、水晶の結晶性を消失させた面を内壁に有する貫通孔と、前記水晶片の一方の面、前記貫通孔の内壁上及び前記水晶片の他方の面に渡って設けた電極と、を備えている。従って、貫通孔内に水晶片の結晶面が無い構造を持つ水晶片を有した水晶振動子が得られる。しかも、容器の側とは反対側の励振用電極はこの貫通孔を介して容器側に引き回されて接着パッドと接続された水晶振動子が得られる。ここで、貫通孔内に水晶の結晶面があると、結晶面は結晶の異方性に起因した面であるため、貫通孔の開口度を低下し易いことが多いため、貫通孔を利用して電極を引き回すという目的の弊害になる。一方、本発明では、貫通孔は結晶性を消失させた側面を持つものであるため、結晶面を有する場合に比べ、貫通孔の開口率を高くできる。従って、水晶片の一方の面、貫通孔の内壁上および水晶片の他方の面に渡って設けた電極も、貫通孔内に有効に形成されたものとなるため、水晶片の表裏の導通を確実に行える。
また、この出願の水晶振動子の製造方法によれば、水晶片の表裏を貫通する貫通孔を短パルスレーザによって形成するため、水晶の結晶性を消失させた面を有する貫通孔を簡易に形成できる。また、水晶の結晶性を消失させた面を持つ貫通孔は、水晶の結晶性を有する面を持つ貫通孔に比べて、貫通孔の開口率は高くなり易く、かつ、内壁は金属膜やフォトレジトの被膜性が高い貫通孔になる。そのため、水晶振動子の電極形成用の金属膜やフォトレジストを貫通孔内に被覆し易いので、貫通孔内に所望の電極を形成できる。
According to the quartz crystal resonator of this application, a portion of the region of the quartz crystal blank connected to the container includes a through-hole penetrating the quartz crystal blank and having a surface on its inner wall that has been decrystallized, and electrodes provided on one side of the quartz crystal blank, on the inner wall of the through-hole, and across the other side of the quartz crystal blank. This results in a quartz crystal resonator with a quartz crystal blank with a structure in which the quartz crystal blank has no crystal surface within the through-hole. Furthermore, the excitation electrode on the side opposite the container is routed to the container side through the through-hole and connected to the bonding pad, resulting in a quartz crystal resonator. However, if a quartz crystal surface is present within the through-hole, the crystal surface is due to the anisotropy of the crystal, which often reduces the aperture ratio of the through-hole, thereby adversely affecting the purpose of routing the electrode through the through-hole. In contrast, in the present invention, the through-hole has a side surface that has been decrystallized, allowing for a higher aperture ratio of the through-hole compared to a case in which a crystalline surface is present. Therefore, the electrodes provided on one side of the crystal blank, on the inner wall of the through hole, and across the other side of the crystal blank are effectively formed within the through hole, ensuring reliable conductivity between the front and back of the crystal blank.
Furthermore, according to the method for manufacturing a quartz crystal unit of this application, through-holes that penetrate the front and back of a quartz crystal blank are formed using a short-pulse laser, making it possible to easily form through-holes with surfaces that eliminate the crystallinity of the quartz crystal. Furthermore, through-holes with surfaces that eliminate the crystallinity of the quartz crystal tend to have a higher aperture ratio and have inner walls that are highly coatable with metal films or photoresists compared to through-holes with surfaces that retain the crystallinity of the quartz crystal. Therefore, it is easy to coat the inside of the through-holes with metal films or photoresists for forming electrodes on the quartz crystal unit, making it possible to form desired electrodes within the through-holes.
以下、図面を参照してこの出願の各発明の実施形態について説明する。なお、説明に用いる各図はこれら発明を理解できる程度に概略的に示してあるにすぎない。また、説明に用いる各図において、同様な構成成分については同一の番号を付して示し、その説明を省略する場合もある。また、以下の実施形態中で述べる形状、材質、製法例等はこの発明の範囲内の好適例に過ぎない。従って、本発明が以下の実施形態のみに限定されるものではない。 Embodiments of the inventions of this application will be described below with reference to the drawings. Note that the drawings used for the description are merely schematic illustrations to enable understanding of the inventions. Furthermore, in the drawings used for the description, similar components are designated by the same numbers, and their description may be omitted. Furthermore, the shapes, materials, manufacturing methods, etc. described in the following embodiments are merely preferred examples within the scope of this invention. Therefore, the present invention is not limited to the following embodiments.
１． 水晶振動子の実施形態
図１を参照して実施形態の水晶振動子１０について、説明する。図１（Ａ）～（Ｄ）は実施形態の水晶振動子１０の説明図である。特に、（Ａ）図はその上面図、（Ｂ）図は水晶片１１に着目した上面図、（Ｃ）図は（Ｂ）図中のＰ－Ｐ線での断面図、（Ｄ）図は（Ｃ）図中のＱ部分を水晶片１１の上方（図中Ｒで示す方向）から見た上面図である。
実施形態の水晶振動子１０は、水晶片１１と、水晶片１１を収容する容器１３と、水晶片１１を容器１３に接続固定している導電性接着剤１５と、水晶片１１の導電性接着剤１５との接続固定領域１１ｃ（図１（Ｂ）参照）の一部に設けられ、水晶の結晶性を消失させた面を内壁に有する貫通孔１７と、を備えている。以下、各構成成分について具体的に説明する。
1. Embodiments of a Quartz Crystal Resonator A quartz crystal resonator 10 according to an embodiment will be described with reference to Figure 1. Figures 1A to 1D are explanatory diagrams of a quartz crystal resonator 10 according to an embodiment. In particular, Figure 1A is a top view thereof, Figure 1B is a top view focusing on the quartz crystal blank 11, Figure 1C is a cross-sectional view taken along line P-P in Figure 1B, and Figure 1D is a top view of part Q in Figure 1C as viewed from above the quartz crystal blank 11 (in the direction indicated by R in the figure).
The quartz crystal unit 10 of this embodiment includes a quartz crystal blank 11, a container 13 that houses the quartz crystal blank 11, a conductive adhesive 15 that connects and fixes the quartz crystal blank 11 to the container 13, and a through-hole 17 that is provided in a portion of the connection and fixation area 11c (see FIG. 1B ) of the quartz crystal blank 11 with the conductive adhesive 15, and has an inner wall that is a surface where the crystallinity of the quartz crystal has been eliminated. Each of the components will be described in detail below.
水晶片１１は、この場合、ＡＴカットの水晶片である。水晶片１１は、励振用電極１１ａと、引出電極１１ｂと、本発明の特徴である貫通孔１７（詳細は後述する）と、を備えている。励振用電極１１ａは、水晶片１１の表裏の主面の所定領域に設けてあり、任意好適な金属膜で構成してある。引出電極１１ｂは、水晶片１１の両主面の励振用電極１１ａ各々から、貫通孔１７内を経由して、水晶片１１の他方の面のこの例の場合は水晶片の一端側に引きまわしてある。すなわち、容器側とは反対面にある励振用電極はこの貫通孔１７内の電極を介して容器側の面に引き回された構造が実現される。なお、励振用電極の水晶片の表裏の引き回しのために、水晶片の側壁を介した引き回し構造を併用しても良い。 In this case, the crystal blank 11 is an AT-cut crystal blank. The crystal blank 11 includes an excitation electrode 11a, an extraction electrode 11b, and a through-hole 17 (described in detail below), a feature of the present invention. The excitation electrode 11a is provided in a predetermined area on each of the front and back principal surfaces of the crystal blank 11 and is made of any suitable metal film. The extraction electrode 11b is routed from each of the excitation electrodes 11a on both principal surfaces of the crystal blank 11 through the through-hole 17 to the other side of the crystal blank 11, in this example, one end of the crystal blank. In other words, the excitation electrode on the side opposite the container is routed to the container side via the electrode in the through-hole 17. Note that a routing structure via the sidewall of the crystal blank may also be used to route the excitation electrodes between the front and back of the crystal blank.
容器１３は、この例の場合、水晶片１１を収容する凹部１３ａと、凹部１３ａを生じさせている土手部１３ｂと、接着パッド１３ｃとを備えるものである。接着パッド１３ｃは、この例の場合、凹部１３ａの底面であって、水晶片１１の引出電極１１ｂと対応する領域に設けてある。接着パッド１３ｃは、容器１３の裏面に設けた外部接続端子（図示を省略）に、ビア配線又はキャスタレーション配線（いずれも図示せず）を介して接続してある。 そして、水晶片１１は、接着パッド１３ｃに、引出電極１１ｂの位置で、導電性接着剤１５によって電気的及び機械的に接続固定してある。すなわち、水晶片１１は容器１３に片持ち支持されている。
容器１３の土手部１３ｂの天面に、蓋部材（図示を省略）が接合されて、水晶片１１は、容器１３に封止してある。なお、容器１３と蓋部材との接合は、封止方式に応じた任意好適な方法で行われる。容器１３は、例えばセラミック製パッケージで構成できる。
導電性接着剤１５は、任意好適なもので構成できるが、この例の場合はシリコーン系の導電性接着剤としてある。
In this example, the container 13 includes a recess 13a for accommodating the crystal blank 11, a bank portion 13b that defines the recess 13a, and an adhesive pad 13c. In this example, the adhesive pad 13c is located on the bottom surface of the recess 13a, in an area corresponding to the extraction electrode 11b of the crystal blank 11. The adhesive pad 13c is connected to an external connection terminal (not shown) on the back surface of the container 13 via via wiring or castellation wiring (neither is shown). The crystal blank 11 is electrically and mechanically connected and fixed to the adhesive pad 13c at the position of the extraction electrode 11b using a conductive adhesive 15. In other words, the crystal blank 11 is cantilevered by the container 13.
A lid (not shown) is bonded to the top surface of the bank portion 13b of the container 13, sealing the crystal blank 11 in the container 13. The container 13 and the lid are bonded together using any suitable method depending on the sealing method. The container 13 can be made of, for example, a ceramic package.
The conductive adhesive 15 can be made of any suitable material, but in this example, it is a silicone-based conductive adhesive.
次に、本発明の特徴である貫通孔１７の、具体的構造例について説明する。この説明を図１に加えて図２を参照して行う。図２（Ａ）は、水晶片１１の接続固定領域１１Ｃ付近を水晶片１１の厚さ方向に切った断面の、ＳＥＭ（電子顕微鏡）写真である。また、図２（Ｂ）、図２（Ｃ）は貫通孔の他の例を示した図であり、図２（Ａ）同様の位置での断面図である。なお、図２（Ａ）のＳＥＭ写真中に記した寸法は、短パルスレーザによる試作加工時の寸法例である。
貫通孔１７は、水晶片１１の表裏を導通する電極を設けるための貫通孔であり、然も、内壁が水晶の結晶性を消失させた面１７ａとなっている貫通孔である。
この例の場合は、面１７ａは、貫通孔１７の内壁に水晶片１１の表面から深さ方向に進行した線状痕跡が、内壁の周方向に並んでいて、これら並んだ線状痕跡による微小凹凸が生じている面１７ａである。このような面は、本願の別発明である短パルスレーザを用いる製法によって容易に形成できる（詳細は後述する）。
Next, a specific structural example of the through hole 17, which is a feature of the present invention, will be described. This description will be made with reference to FIG. 2 in addition to FIG. 1. FIG. 2(A) is an SEM (electron microscope) photograph of a cross section of the crystal blank 11 taken in the thickness direction of the crystal blank 11 near the connection and fixing region 11C. Also, FIGS. 2(B) and 2(C) are diagrams showing other examples of through holes, and are cross-sectional views at the same position as FIG. 2(A). Note that the dimensions shown in the SEM photograph in FIG. 2(A) are example dimensions during prototype processing using a short-pulse laser.
The through-hole 17 is a through-hole for providing an electrode that connects the front and back of the crystal blank 11, and the inner wall of the through-hole is a surface 17a where the crystallinity of the crystal has been eliminated.
In this example, surface 17a is formed by linear traces that extend in the depth direction from the surface of crystal blank 11 and are aligned in the circumferential direction of the inner wall of through-hole 17, creating minute irregularities due to these linear traces. Such a surface can be easily formed by a manufacturing method using a short-pulse laser, which is another invention of the present application (details will be described later).
また、この実施形態の貫通孔１７は、図１（Ｃ）、図２（Ａ）に示したように、水晶片の厚さ方向に沿った断面で見た際の形状が、水晶片の第１表面側からその反対面である第２表面側に向かって先細りのロート状となっている。このような形状であると、貫通孔の内壁に電極形成用の金属膜を例えばスパッタ法等で成膜する際に金属膜を被覆させ易く、さらに、貫通孔の内壁にフォトレジストを被覆させ易いので、好ましい。貫通孔１７の大きさは、金属膜やレジスト膜の被覆のし易さ等を考慮して決める。これに限られないが、貫通孔１７の大きな開口側（図２（Ａ）の上方の開口）の直径が例えば２０～５０μｍ、貫通孔１７の小さな開口側（図２（Ａ）の下方側の開口）の直径が例えば１０～３０μｍが良い。 In addition, as shown in Figures 1(C) and 2(A), the through-hole 17 in this embodiment has a funnel-like shape when viewed in a cross section along the thickness direction of the quartz element, tapering from the first surface side of the quartz element to the opposite second surface side. This shape is preferable because it makes it easier to coat the inner wall of the through-hole with a metal film for forming an electrode when forming the metal film on the inner wall of the through-hole using, for example, a sputtering method, and also makes it easier to coat the inner wall of the through-hole with a photoresist. The size of the through-hole 17 is determined taking into account factors such as the ease of coating with a metal film or resist film. While not limited to this, it is preferable that the diameter of the larger opening side of the through-hole 17 (the upper opening in Figure 2(A)) be, for example, 20 to 50 μm, and the diameter of the smaller opening side of the through-hole 17 (the lower opening in Figure 2(A)) be, for example, 10 to 30 μm.
なお、貫通孔は、水晶片の厚さ方向に沿った断面で見た際の形状が、水晶片の厚さ方向の途中で開口具合が低減し、その後拡大する、いわゆる砂時計状の貫通孔１７ｘ（図２（Ｂ）参照）であっても良い。この例の場合も、貫通孔の内壁に電極形成用の金属膜を例えばスパッタ法等で成膜する際に、金属粒子は水晶片の両面から貫通孔内に親友し易くなるので、金属膜を被覆させ易く、さらに、貫通孔の内壁にフォトレジストを被覆させ易いので、好ましい。断面形状が砂時計状の貫通孔１７ｘを構成する場合、水晶片の表裏から見て貫通孔１７ｘの細くなる部分までの深さｄ１、ｄ２（図２（Ｂ）参照）は、同じ程度が好ましい、すなわち、水晶片１１の厚さの中央付近で細くなる構造が好ましい。しかし、ｄ１＞ｄ２の場合や、ｄ１＜ｄ２の場合があっても良い。
また、図２（Ｃ）に示すように、貫通孔は水晶片１１の表裏に渡ってほぼ同じ太さの貫通孔１７ｙあっても良い。ただし、この貫通孔１７ｙの場合は、図２（Ａ）、（Ｂ）の場合に暮部、貫通孔の内壁に金属膜やレジストを被覆させにくい。
なお、図２の各例では貫通孔は、反対電位とされる２つの励振用電極に対し１個ずつの例であったが、貫通孔は２つずつ以上設ける場合があっても良い。
The through-holes may have a so-called hourglass-shaped cross-section 17x (see FIG. 2B ), in which the opening narrows midway through the thickness of the crystal blank and then widens. This is also preferable because, when forming a metal film for forming an electrode on the inner wall of the through-hole using a sputtering method or the like, metal particles can easily penetrate into the through-hole from both sides of the crystal blank, facilitating coating with the metal film and also facilitating coating with photoresist on the inner wall of the through-hole. When the through-holes 17x have an hourglass-shaped cross-section, it is preferable that the depths d1 and d2 (see FIG. 2B ) of the through-holes 17x to their tapered portions when viewed from the front and back of the crystal blank are approximately the same. In other words, a structure in which the depth narrows near the center of the thickness of the crystal blank 11 is preferred. However, cases in which d1 > d2 or d1 < d2 are also acceptable.
2C, the through-holes may be through-holes 17y of approximately the same width on both sides of the crystal blank 11. However, in the case of through-holes 17y, it is difficult to coat the inner walls of the through-holes with a metal film or resist, as in the cases of FIGS.
In each example shown in FIG. 2, one through-hole is provided for each of the two excitation electrodes having opposite potentials, but two or more through-holes may be provided for each of the two excitation electrodes.
貫通孔１７の平面的形状は任意のものとできるが、貫通孔の開口際での電極膜のカバレージ等を考慮すれば、貫通孔の開口部は、円形状や楕円形状であることが好ましい。
この発明の水晶振動子１０では、所定の貫通孔と貫通孔内の電極とによって、水晶片の表裏の導通をとることができるので、貫通孔１７を用いず水晶片の側壁を介して電極を引き回す場合に比べて、電極引き回しの信頼性が高まる。
The through-hole 17 may have any planar shape, but considering the coverage of the electrode film around the opening of the through-hole, it is preferable that the opening of the through-hole is circular or elliptical.
In the crystal resonator 10 of this invention, electrical continuity can be established between the front and back of the crystal blank through the specified through-holes and the electrodes within the through-holes, which improves the reliability of electrode routing compared to when electrodes are routed via the side walls of the crystal blank without using through-holes 17.
１． 製造方法の実施形態
次に、本願の製造方法の発明の実施形態について、図３を及び図４を参照して説明する。図３、図４は、いずれも、実施形態の製造方法の要部を示した製造工程図である。なお、本発明の水晶振動子１０は、大型の水晶ウエハからフォトリソグラフィ技術及び成膜技術を用いた工法によって製造することが好ましいので、本実施形態ではそのような例を説明する。
先ず、水晶振動子１０を製造するための、ＡＴカット水晶ウエハであって所定厚み及び大きさのＡＴカットの水晶ウエハ１１０を、用意する（図３（Ａ））。そして、水晶ウエハ１１０に、周知の方法で、水晶振動子１０の中間体１１ｘとして、水晶片１１の外形加工が済んでいて励振用電極が形成される前の中間体１１ｘを、マトリクス状に多数形成する（図３（Ａ））。
次に、このような水晶ウエハ１１０の個々の振動子の中間体１１ｘの、導電性接着剤によって接着される接続固定領域１１ｃの一部に対し、レーザ装置例えば短パルスレーザ装置２１から、短パルスレーザ光２１ａを照射して貫通孔１７を形成する。レーザ装置２１は、ガルバノミラー（図示を省略）を備えていて、レーザ光２１ａを接続固定領域１１ｃに任意の形状で走査できるので、任意の平面形状の貫通孔１７を形成できる。また、レーザ光２１ａのパワー及び又は走査回数を所定の条件にすることによって、貫通孔１７の大きさを調整できる（図３（Ａ）参照）。このようにレーザによって形成された貫通孔１７は、内壁や底面が水晶の結晶性を消失させた面、すなわち線状痕跡が多数並んで生じた微小凹凸面になる。
なお、貫通孔として図２（Ｂ）に示した断面が砂時計状の貫通孔１７ｘを水晶ウエハ１１０に形成する場合は、水晶ウエハ１１０の両面からレーザ光をそれぞれ照射すれば良い。
1. Embodiment of Manufacturing Method Next, an embodiment of the manufacturing method of the present invention will be described with reference to Figures 3 and 4. Figures 3 and 4 are both manufacturing process diagrams showing the main parts of the manufacturing method of the embodiment. Note that since it is preferable to manufacture the quartz crystal resonator 10 of the present invention from a large quartz crystal wafer using a process that employs photolithography and film formation techniques, this embodiment will describe such an example.
First, an AT-cut quartz crystal wafer 110 of a predetermined thickness and size is prepared for manufacturing the quartz crystal unit 10 (FIG. 3A). Then, using a well-known method, a large number of intermediates 11x for the quartz crystal unit 10 are formed in a matrix on the quartz crystal wafer 110, each intermediate having the outer shape of the quartz crystal blank 11 and before the formation of the excitation electrodes (FIG. 3A).
Next, a laser device, such as a short-pulse laser device 21, irradiates a portion of the connection and fixing region 11c of the intermediate body 11x of each vibrator on the quartz crystal wafer 110, which is bonded with a conductive adhesive, with short-pulse laser light 21a to form a through-hole 17. The laser device 21 is equipped with a galvanometer mirror (not shown), which allows the laser light 21a to scan the connection and fixing region 11c in any desired shape, thereby forming a through-hole 17 with any desired planar shape. Furthermore, the size of the through-hole 17 can be adjusted by setting the power of the laser light 21a and/or the number of scans to predetermined conditions (see FIG. 3A). The through-hole 17 thus formed by the laser has an inner wall and bottom surface that has lost the crystallinity of the quartz crystal, i.e., a micro-irregular surface with numerous linear traces lined up.
When forming through-holes 17x having an hourglass-shaped cross section as shown in FIG. 2B in the quartz-crystal wafer 110, laser light can be irradiated from both sides of the quartz-crystal wafer 110.
貫通孔１７の形成が済んだ水晶ウエハ１１０に対し、周知の成膜技術、例えばスパッタ法によって、励振用電極１１ａ及び引出電極１１ｂを形成するための金属膜１１ｍを、水晶ウエハの全面に形成して、金属膜形成済みの水晶ウエハ１１２を得る（図３（Ｂ））。この際、図４（Ａ）に示したように、金属膜１１ｍを水晶ウエハ１１２の両面はもちろん、貫通孔１７の内壁にも被覆する。本発実施形態の貫通孔１７であると、水晶の結晶性が消失された微小凹凸状態及びロート状の断面の効果によって、金属膜１１ｍは所望の通りに貫通孔１７に被覆できる。
次に、この水晶ウエハ１１２全面及び貫通孔１７内に、フォトレジスト２３を被覆する（図４（Ａ））。本発実施形態の貫通孔１７であると、上記した側面状態及び断面のロート形状の効果によって、フォトレジスト２３は所望の通りに貫通孔１７に被覆できる。
次に、フォトレジスト２３を露光・現像して電極形成用のレジストパタン(図示を省略)を形成し、次いで、レジストパタンから露出する金属膜１１ｍを選択的に除去して当該電極としての、前記貫通孔内も被覆している電極、すなわち励振用電極１１ａ及び引出電極１１ｂを形成する。この図４（Ｂ）に示した水晶ウエハ１１２は、水晶振動子用の中間体ウエハに相当する。
その後、周知の方法で水晶ウエハ１１２から水晶振動子の中間体１１ｙを個片化し、それを容器１３（図１参照）に導電性接着剤によって接着固定する。
導電性接着剤の硬化が済んだ水晶片１１に対し周波数調整をし、容器１３を蓋部材（図示を省略）によって封止することによって、図１（Ａ）に示した水晶振動子１０を形成できる。
この製造方法によれば、貫通孔１７を短パルスレーザによって形成するので、内壁や底面が水晶の結晶性を除去した面となっている貫通孔であって、電極形成用の金属膜やフォトレジストを貫通孔内に被覆させ易い形状の貫通孔を容易に形成できる。
After the through-holes 17 have been formed, a metal film 11m for forming the excitation electrodes 11a and extraction electrodes 11b is formed over the entire surface of the quartz-crystal wafer 110 using a well-known film-forming technique, such as sputtering, to obtain a metal-film-formed quartz-crystal wafer 112 (FIG. 3B). As shown in FIG. 4A, the metal film 11m coats both sides of the quartz-crystal wafer 112 as well as the inner walls of the through-holes 17. In the case of the through-holes 17 of this embodiment, the metal film 11m can coat the through-holes 17 as desired due to the micro-irregularities resulting from the loss of crystal crystallinity and the funnel-shaped cross section.
Next, the entire surface of the quartz-crystal wafer 112 and the inside of the through-hole 17 are coated with photoresist 23 (FIG. 4A). In the case of the through-hole 17 of this embodiment, the above-described side surface condition and funnel-shaped cross section allow the photoresist 23 to coat the through-hole 17 as desired.
Next, the photoresist 23 is exposed and developed to form a resist pattern (not shown) for forming electrodes, and then the metal film 11m exposed from the resist pattern is selectively removed to form the electrodes that also cover the inside of the through holes, i.e., the excitation electrodes 11a and extraction electrodes 11b. The quartz crystal wafer 112 shown in Figure 4(B) corresponds to an intermediate wafer for quartz crystal resonators.
Thereafter, the crystal wafer 112 is diced into individual crystal resonator intermediates 11y by a known method, and each is bonded and fixed to the container 13 (see FIG. 1) with a conductive adhesive.
After the conductive adhesive has hardened, the frequency of the crystal blank 11 is adjusted, and the container 13 is sealed with a lid (not shown), thereby completing the crystal resonator 10 shown in FIG. 1A.
According to this manufacturing method, the through hole 17 is formed using a short pulse laser, so that the inner wall and bottom surface of the through hole are surfaces where the crystallinity of the quartz has been removed, and it is possible to easily form a through hole having a shape that makes it easy to coat the inside of the through hole with a metal film or photoresist for forming an electrode.
なお、上記した実施形態では、水晶片としてＡＴカットの水晶片を用いた例を示したが、水晶片は、ＡＴカットの水晶片以外の水晶片、例えば音叉型水晶片や、ＳＣカットの水晶片などのいわゆる２回回転の水晶片であって良い。また、引出電極１１ｂは、水晶片１１の両主面の励振用電極１１ａ各々から、水晶片１１の１つの辺の側であって当該１つの辺の両端領域に引き出した例、すなわち片持ち保持に対応する形状の例を示したが、両持ち支持の２点固定や両持ち支持の４点固定の接着構造に対しても本発明は適用できる。また、容器１３として凹部１３ａを有した構造の例を示したが、容器が平板状で、蓋部材が水晶片を収容する凹部を有したキャップ状のものとした水晶振動子に対しても、本発明は適用できる。 While the above embodiment illustrates an example in which an AT-cut crystal blank is used as the crystal blank, the crystal blank may be a crystal blank other than an AT-cut crystal blank, such as a tuning fork-shaped crystal blank or an SC-cut crystal blank, which is a so-called two-rotation crystal blank. Furthermore, while the example illustrates an example in which the extraction electrodes 11b are extended from the excitation electrodes 11a on both main surfaces of the crystal blank 11 to the end regions of one edge of the crystal blank 11, i.e., a shape corresponding to cantilever support, the present invention can also be applied to adhesive structures with two-point fixation and four-point fixation for both-side support. Furthermore, while the example illustrates a structure in which the container 13 has a recess 13a, the present invention can also be applied to crystal resonators in which the container is flat and the lid member is cap-shaped with a recess that accommodates the crystal blank.
１０：実施形態の水晶振動子、 １１：水晶片、
１１ａ：励振用電極、 １１ｂ：引出電極、
１１ｃ：接続固定領域、 １３：容器、
１３ａ：凹部、 １３ｂ：土手部、
１３ｃ：接着パッド、 １５：導電性接着剤、
１７：貫通孔、 １７ａ：水晶の結晶性を消失させた面
２１：レーザ装置、 ２１ａ：レーザ光、
２３：フォトレジスト
１１０：水晶ウエハ
１１２：水晶ウエハ（水晶振動子用の中間体ウエハ）、
１１ｘ、１１ｙ：水晶振動子の中間体
１１ｍ：電極形成用の金属膜
10: Crystal resonator of the embodiment; 11: Crystal blank;
11a: Excitation electrode, 11b: Extraction electrode,
11c: connection and fixing region; 13: container;
13a: recessed portion, 13b: bank portion,
13c: adhesive pad; 15: conductive adhesive;
17: through-hole, 17a: crystallinity-eliminating surface of quartz crystal, 21: laser device, 21a: laser light,
23: Photoresist 110: Quartz crystal wafer 112: Quartz crystal wafer (intermediate wafer for quartz crystal oscillator)
11x, 11y: Intermediate body of quartz crystal oscillator 11m: Metal film for forming electrodes
Claims (7)
前記貫通孔として、内壁に水晶の結晶性を消失させた面であって、前記水晶片の表面から深さ方向に進行した線状痕跡が、内壁の周方向に並んでいて、これら並んだ線状痕跡による微小凹凸が生じている面を有した貫通孔と、
前記水晶片の一方の面、前記貫通孔の内壁上及び前記水晶片の他方の面に渡って設けられた電極と、を備えることを特徴とする水晶振動子。 A quartz crystal resonator comprising: a quartz crystal blank; a container for accommodating the quartz crystal blank; a conductive adhesive for connecting and fixing a connection and fixing region of the quartz crystal blank to the container; and a through hole provided in a portion of the connection and fixing region of the quartz crystal blank, penetrating the front and back of the quartz crystal blank,
The through hole has an inner wall on which the crystallinity of the quartz crystal has been eliminated , and linear traces extending in the depth direction from the surface of the quartz crystal piece are aligned in the circumferential direction of the inner wall, and a surface on which minute irregularities are generated by these aligned linear traces ;
and electrodes provided on one surface of the quartz crystal blank, on the inner wall of the through hole, and across the other surface of the quartz crystal blank.
前記水晶片の導電性接着剤によって固定される予定領域の一部に、短パルスレーザによって、水晶片を貫通する貫通孔として、内壁に水晶の結晶性を消失させた面であって、前記水晶片の表面から深さ方向に進行した線状痕跡が、内壁の周方向に並んでいて、これら並んだ線状痕跡による微小凹凸が生じている面を有した貫通孔を形成する工程と、
前記貫通孔を形成した水晶片に水晶振動子の電極形成用の金属膜を、前記貫通孔内も被覆するよう形成する工程と、
前記金属膜を形成した水晶片に前記貫通孔内も被覆するようフォトレジストを形成する工程と、
前記フォトレジストを露光・現像して電極形成用のレジストパタンを形成する工程と、前記レジストパタンから露出する前記金属膜を選択的に除去して当該電極としての、前記貫通孔内も被覆している電極を形成する工程と
を含むことを特徴とする水晶振動子の製造方法。 When manufacturing a quartz crystal unit having a structure in which a quartz crystal blank is fixed to a container with a conductive adhesive,
a step of forming a through hole penetrating the quartz element in a portion of the area of the quartz element to be fixed with a conductive adhesive by using a short pulse laser , the through hole having an inner wall surface where the crystallinity of the quartz has been eliminated, linear traces progressing in the depth direction from the surface of the quartz element are aligned in the circumferential direction of the inner wall, and the aligned linear traces create a surface where minute irregularities are generated ;
forming a metal film for forming electrodes of a quartz crystal unit on the quartz crystal element having the through-holes formed therein so as to cover the inside of the through-holes;
forming a photoresist on the crystal piece on which the metal film is formed so as to cover the inside of the through-hole;
a step of exposing and developing the photoresist to form a resist pattern for forming an electrode; and a step of selectively removing the metal film exposed from the resist pattern to form an electrode that also covers the inside of the through hole.
前記中間体である水晶片の、導電性接着剤によって容器に接続固定される領域の一部に、前記水晶片の表裏を貫通している貫通孔として、内壁に水晶の結晶性を消失させた面であって、前記水晶片の表面から深さ方向に進行した線状痕跡が、内壁の周方向に並んでいて、これら並んだ線状痕跡による微小凹凸が生じている面を有した貫通孔と、
前記水晶片の一方の面、前記貫通孔の内壁上及び前記水晶片の他方の面に渡って設けられた電極と、を備えることを特徴とする水晶振動子用の中間体ウエハ。 In an intermediate wafer for crystal resonators, which has a large number of crystal pieces arranged in a matrix, the intermediate wafer is used to form crystal resonators.
A through hole penetrating the front and back of the quartz crystal blank in a portion of the area connected and fixed to the container by a conductive adhesive , the through hole having an inner wall where the crystallinity of the quartz crystal has been eliminated, linear traces extending in the depth direction from the surface of the quartz crystal blank are aligned in the circumferential direction of the inner wall, and the aligned linear traces create minute irregularities on the surface ;
an electrode provided on one surface of the quartz crystal blank, on the inner wall of the through hole, and across the other surface of the quartz crystal blank;
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004173050A (en) | 2002-11-21 | 2004-06-17 | Nippon Dempa Kogyo Co Ltd | Quartz crystal resonator and manufacturing method thereof |
| JP2007267288A (en) | 2006-03-30 | 2007-10-11 | Nippon Dempa Kogyo Co Ltd | Manufacturing method of tuning fork type crystal resonator and crystal resonator device |
| JP2007288644A (en) | 2006-04-19 | 2007-11-01 | Epson Toyocom Corp | Piezoelectric substrate, piezoelectric vibration element, surface mount piezoelectric vibrator, method for manufacturing piezoelectric substrate, and surface mount piezoelectric oscillator |
| WO2012108335A1 (en) | 2011-02-07 | 2012-08-16 | 株式会社大真空 | Tuning-fork type piezoelectric vibrating reed and tuning-fork type piezoelectric vibrator |
| JP2021150759A (en) | 2020-03-18 | 2021-09-27 | 日本電波工業株式会社 | Crystal device and manufacturing method of the same |
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| JP4360131B2 (en) * | 2003-06-11 | 2009-11-11 | エプソントヨコム株式会社 | Piezoelectric device and manufacturing method thereof |
| JP4075893B2 (en) * | 2004-05-21 | 2008-04-16 | セイコーエプソン株式会社 | Quartz crystal manufacturing method, apparatus and crystal resonator |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004173050A (en) | 2002-11-21 | 2004-06-17 | Nippon Dempa Kogyo Co Ltd | Quartz crystal resonator and manufacturing method thereof |
| JP2007267288A (en) | 2006-03-30 | 2007-10-11 | Nippon Dempa Kogyo Co Ltd | Manufacturing method of tuning fork type crystal resonator and crystal resonator device |
| JP2007288644A (en) | 2006-04-19 | 2007-11-01 | Epson Toyocom Corp | Piezoelectric substrate, piezoelectric vibration element, surface mount piezoelectric vibrator, method for manufacturing piezoelectric substrate, and surface mount piezoelectric oscillator |
| WO2012108335A1 (en) | 2011-02-07 | 2012-08-16 | 株式会社大真空 | Tuning-fork type piezoelectric vibrating reed and tuning-fork type piezoelectric vibrator |
| JP2021150759A (en) | 2020-03-18 | 2021-09-27 | 日本電波工業株式会社 | Crystal device and manufacturing method of the same |
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