JP7802342B2 - pressure sensor - Google Patents
pressure sensorInfo
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- JP7802342B2 JP7802342B2 JP2021215097A JP2021215097A JP7802342B2 JP 7802342 B2 JP7802342 B2 JP 7802342B2 JP 2021215097 A JP2021215097 A JP 2021215097A JP 2021215097 A JP2021215097 A JP 2021215097A JP 7802342 B2 JP7802342 B2 JP 7802342B2
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Description
本発明は、押圧力に応じて抵抗値が変化する感圧センサに関するものである。 The present invention relates to a pressure sensor whose resistance value changes in response to pressure.
従来、押圧力に応じて抵抗値が変化する感圧センサは、例えば特許文献１に示すように、下側電極を設けた下側回路基板と、上側電極を設けた上側回路基板とを、スペーサを介して積層し、その際スペーサに設けた開口部内において前記上側電極と下側電極とを対向させ、上側電極の背面側の上側回路基板を押圧してこれを下降させることで上側電極を下側電極に当接させ、当該当接力（荷重）の大きさ（当接面積）に応じて上側電極と下側電極間の抵抗値を変化させるように構成されていた。 Conventionally, pressure-sensitive sensors whose resistance value changes in response to pressure, as shown in Patent Document 1, for example, are configured by stacking a lower circuit board with a lower electrode and an upper circuit board with an upper electrode via a spacer, with the upper and lower electrodes facing each other within an opening in the spacer, and by pressing the upper circuit board on the back side of the upper electrode and lowering it, the upper electrode comes into contact with the lower electrode, and the resistance value between the upper and lower electrodes changes depending on the magnitude (contact area) of the contact force (load).
しかし従来の感圧センサは、上述のように、２枚の回路基板とスペーサとを用いて構成されるので部品点数が多くなり、また製品の厚み寸法が厚くなり、さらに２枚の回路基板とスペーサの組み立て時のずれによって下側電極に対してスペーサの開口部や上側電極の位置がずれてしまう虞があった。 However, as mentioned above, conventional pressure sensors are constructed using two circuit boards and a spacer, which increases the number of parts and increases the thickness of the product. Furthermore, there is a risk that misalignment during assembly of the two circuit boards and spacer could cause the opening in the spacer or the position of the upper electrode to be misaligned relative to the lower electrode.
本発明は上述の点に鑑みてなされたものでありその目的は、部品点数の削減と厚みの薄型化が図れ、また上下の接点間に組み立てによるずれが生じる虞もない感圧センサを提供することにある。 The present invention was made in consideration of the above points, and its purpose is to provide a pressure sensor that reduces the number of parts, is thinner, and has no risk of misalignment between the upper and lower contacts due to assembly.
本発明は、押圧力に応じて抵抗値が変化する感圧センサにおいて、１枚の合成樹脂製の基板の上面に、第１の接点パターン及び当該第１の接点パターンに接続する第１の配線パターンを直接形成し、前記第１の接点パターンの上面に、圧力に応じて抵抗値が変化する感圧抵抗体を直接積層して形成し、前記感圧抵抗体の上面の前記第１の接点パターンと対向する位置に、第２の接点パターンを直接積層して形成し、さらに前記第２の接点パターンに接続する第２の配線パターンを、前記感圧抵抗体の上面及び側面、もしくは前記感圧抵抗体の側面に直接接触するように積層して形成して前記基板の上面に引き出し、前記感圧抵抗体を、前記第１の接点パターン及び前記第２の接点パターンの大きさよりも大きく形成し、且つ前記基板よりも粗い表面の前記感圧抵抗体上に形成される第２の接点パターンの大きさを、前記第１の接点パターンの大きさよりも大きい面積に形成して、前記第２の接点パターンが前記第１の接点パターンの上面全体を覆う構造としたことを特徴とする。
本発明によれば、１枚の基板上に各種パターンを形成することで感圧センサを構成できるので、部品点数の削減と厚みの薄型化が図れ、また第１，第２の接点パターン間に組み立てによるずれが生じる虞もなくなる。
また従来のように第１の接点パターンと第２の接点パターン間にスペーサによる空間を設けないので、軽い力を印加するだけで抵抗値の変化が始まる。従って、軽い力で抵抗値の変化が始まって押圧力が大きくなるに伴ってさらに抵抗値が変化していく特性が要求される感圧センサとして用いて好適となる。
また感圧抵抗体の厚みは薄いために、感圧抵抗体を介してその上下に位置する第１，第２の接点パターンが真上真下で対向している部分のみで導通するので（抵抗値の変化が生じるので）、第１，第２の接点パターンの面積を調整することで、容易に抵抗値の調整（対向面積を小さくすると抵抗値が大きくなる）を行うことができる。
The present invention is characterized by a pressure-sensitive sensor whose resistance value changes in response to pressure, in which a first contact pattern and a first wiring pattern connected to the first contact pattern are formed directly on the upper surface of a synthetic resin substrate, a pressure-sensitive resistor whose resistance value changes in response to pressure is formed by directly stacking the first contact pattern on the upper surface of the first contact pattern, a second contact pattern is formed by directly stacking the first contact pattern on the upper surface of the pressure-sensitive resistor in a position facing the first contact pattern, and a second wiring pattern connected to the second contact pattern is formed by stacking so as to directly contact the upper surface and side surfaces of the pressure- sensitive resistor or the side surfaces of the pressure-sensitive resistor and is extended to the upper surface of the substrate, the pressure-sensitive resistor is formed to be larger in size than the first contact pattern and the second contact pattern, and the size of the second contact pattern formed on the pressure-sensitive resistor, which has a surface rougher than the substrate, is formed to be larger in area than the first contact pattern, and the second contact pattern covers the entire upper surface of the first contact pattern .
According to the present invention, a pressure sensor can be constructed by forming various patterns on a single substrate, which reduces the number of parts and the thickness, and also eliminates the risk of misalignment between the first and second contact patterns due to assembly.
Furthermore, since there is no space between the first and second contact patterns using a spacer as in the past, the resistance value begins to change with the application of only a light force, making it suitable for use as a pressure-sensitive sensor that requires a characteristic in which the resistance value begins to change with a light force and then changes further as the pressing force increases.
Furthermore, since the thickness of the pressure-sensitive resistor is thin, the first and second contact patterns located above and below it are conductive only at the points where they face each other directly above and below the resistor (resistance changes occur), so the resistance value can be easily adjusted by adjusting the area of the first and second contact patterns (reducing the opposing area increases the resistance value).
また本発明は、上記特徴に加え、前記第１の接点パターンと前記第１の配線パターン、及び前記感圧抵抗体、及び前記第２の接点パターンと前記第２の配線パターンは、何れも、前記基板上に印刷によって直接積層して形成される印刷層であることを特徴とする。
これによって、１枚の基板上に各種パターンを容易且つ正確な位置に形成することができ、部品点数の削減と製造コストの低減化と厚みの薄型化とが図れる。また第１，第２の接点パターン間に組み立てによるずれが生じる虞もなくなる。
In addition to the above characteristics, the present invention is also characterized in that the first contact pattern and the first wiring pattern, the pressure-sensitive resistor, and the second contact pattern and the second wiring pattern are all printed layers formed by directly stacking them on the substrate by printing.
This allows various patterns to be formed easily and accurately on a single substrate, reducing the number of parts, manufacturing costs, and thickness, and also eliminating the risk of misalignment between the first and second contact patterns due to assembly.
本発明によれば、部品点数の削減と厚みの薄型化が図れる。また上下の接点間に組み立てによるずれが生じる虞もなくなり、製品特性の安定した感圧センサを得ることができる。 This invention allows for a reduction in the number of parts and a thinner design. It also eliminates the risk of misalignment between the upper and lower contacts during assembly, resulting in a pressure sensor with stable product characteristics.
以下、本発明の実施形態を、図面を参照して詳細に説明する。図１は本発明の第１実施形態にかかる感圧センサ１－１の概略断面図（図２のＡ－Ａ概略断面図）、図２は感圧センサ１－１の概略平面図である。これらの図に示すように、感圧センサ１－１は、基板１０上に、第１の接点パターン２１及び第１の接点パターン２１に接続する第１の配線パターン３１を形成し、第１の接点パターン２１上に圧力によって抵抗値が変化する感圧抵抗体（感圧抵抗層、感圧抵抗パターン）４１を形成し、感圧抵抗体４１上の前記第１の接点パターン２１と対向する位置に第２の接点パターン５１を形成し、さらに第２の接点パターン５１に接続する第２の配線パターン６１を前記感圧抵抗体４１の上面及び側面に接触させた後に基板１０上に引き出して構成されている。なお以下の説明において、「上」とは基板１０から第１の接点パターン２１などを形成した面側を見る方向をいい、「下」とはその反対方向をいうものとするが、これは、感圧センサ１－１を使用する際の方向を限定する趣旨ではない。 Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic cross-sectional view (A-A schematic cross-sectional view in FIG. 2) of a pressure-sensitive sensor 1-1 according to a first embodiment of the present invention, and FIG. 2 is a schematic plan view of the pressure-sensitive sensor 1-1. As shown in these figures, the pressure-sensitive sensor 1-1 is configured by forming a first contact pattern 21 and a first wiring pattern 31 connected to the first contact pattern 21 on a substrate 10, forming a pressure-sensitive resistor (pressure-sensitive resistive layer, pressure-sensitive resistive pattern) 41 on the first contact pattern 21, the resistance value of which changes with pressure, forming a second contact pattern 51 on the pressure-sensitive resistor 41 in a position opposite the first contact pattern 21, and further forming a second wiring pattern 61 connected to the second contact pattern 51 in contact with the top and side surfaces of the pressure-sensitive resistor 41 and then extending it onto the substrate 10. In the following description, "up" refers to the direction when looking from the substrate 10 toward the surface on which the first contact pattern 21 and other components are formed, and "down" refers to the opposite direction, but this is not intended to limit the direction in which the pressure sensor 1-1 can be used.
次に、上記感圧センサ１－１の構成を、その製造方法と共に説明する。
まず基板１０を用意する。基板１０は可撓性を有する合成樹脂フィルムによって構成されており、この例ではポリエチレンテレフタレート（ＰＥＴ）フィルムを用いている。
Next, the configuration of the pressure-sensitive sensor 1-1 will be described together with its manufacturing method.
First, prepare the substrate 10. The substrate 10 is made of a flexible synthetic resin film, and in this example, a polyethylene terephthalate (PET) film is used.
次に、上記基板１０上に第１の接点パターン２１と第１の配線パターン３１とを、導電ペースト（この例では銀ペースト）をスクリーン印刷することによって同時に形成する。第１の接点パターン２１は、この例では円形（他の各種形状であっても良い）であり、その外周辺の一部に接続するように線状の第１の配線パターン３１が形成されている。 Next, the first contact pattern 21 and the first wiring pattern 31 are simultaneously formed on the substrate 10 by screen printing a conductive paste (silver paste in this example). In this example, the first contact pattern 21 is circular (although it may have various other shapes), and the linear first wiring pattern 31 is formed so as to connect to part of its outer periphery.
次に、上記第１の接点パターン２１の上面全体と、これに接続する第１の配線パターン３１の一部を覆うように、上記基板１０上に感圧抵抗体４１を、カーボンペーストをスクリーン印刷することによって形成する。感圧抵抗体４１は、この例では円形（他の各種形状であっても良い）であり、上記第１の接点パターン２１及び下記する第２の接点パターン５１の大きさよりも大きく形成されている。カーボンペーストは、硬化しても柔軟性を有する合成樹脂とカーボン粉と溶剤を混合した導電性塗料を用いて構成されている。 Next, a pressure-sensitive resistor 41 is formed on the substrate 10 by screen-printing carbon paste so as to cover the entire top surface of the first contact pattern 21 and a portion of the first wiring pattern 31 connected thereto. In this example, the pressure-sensitive resistor 41 is circular (although it may have various other shapes) and is formed larger than the first contact pattern 21 and the second contact pattern 51 described below. The carbon paste is made from a conductive paint made by mixing a synthetic resin that remains flexible even when hardened with carbon powder and a solvent.
次に、上記感圧抵抗体４１の上面を含む上記基板１０上に、第２の接点パターン５１と第２の配線パターン６１とを、銀ペーストをスクリーン印刷することによって同時に形成する。第２の接点パターン５１は、この例では円形（他の各種形状であっても良い）であり、その外周辺の一部に接続するように線状の第２の配線パターン６１が形成されている。第２の接点パターン５１は前記第１の接点パターン２１の上面全体を覆うように、第１の接点パターン２１よりも大きい面積で形成されている。第２の配線パターン６１は、感圧抵抗体４１の上面から前記感圧抵抗体４１の側面に接触して前記基板１０上に引き出されるように形成されている。 Next, a second contact pattern 51 and a second wiring pattern 61 are simultaneously formed on the substrate 10, including the top surface of the pressure-sensitive resistor 41, by screen printing silver paste. In this example, the second contact pattern 51 is circular (it may be any other shape), and a linear second wiring pattern 61 is formed so as to connect to part of its outer periphery. The second contact pattern 51 is formed with a larger area than the first contact pattern 21, so as to cover the entire top surface of the first contact pattern 21. The second wiring pattern 61 is formed so that it contacts the side of the pressure-sensitive resistor 41 from the top surface of the pressure-sensitive resistor 41 and is drawn out onto the substrate 10.
以上の製造方法によって感圧センサ１－１が完成する。なお上記製造手順はその一例であり、他の各種異なる製造手順を用いて製造しても良いことはいうまでもない。 The pressure sensor 1-1 is completed using the above manufacturing method. Note that the above manufacturing procedure is only one example, and it goes without saying that various other manufacturing procedures may also be used.
以上のように構成された感圧センサ１－１は、感圧抵抗体４１が、第１，第２の接点パターン２１，５１の間に介在することで、第１，第２の接点パターン２１，５１間に所定の抵抗値を生じさせている。なお、第２の接点パターン５１の少なくとも一部は、第１の接点パターン２１の真上に位置していなければ、互いに導通しない。そのため第２の接点パターン５１の少なくとも一部は、第１の接点パターン２１の真上に位置する必要があり、そのような実施形態となっている。 In the pressure-sensitive sensor 1-1 configured as described above, the pressure-sensitive resistor 41 is interposed between the first and second contact patterns 21, 51, thereby generating a predetermined resistance value between the first and second contact patterns 21, 51. Note that unless at least a portion of the second contact pattern 51 is located directly above the first contact pattern 21, they will not be electrically connected to each other. Therefore, at least a portion of the second contact pattern 51 must be located directly above the first contact pattern 21, and this is the embodiment in which this is the case.
そして基板１０を図示しない基台上に載置し、第２の接点パターン５１をその上側から指またはキートップなどの押圧体によって押圧すると、柔軟性を有する感圧抵抗体４１が圧縮され、その厚みが薄くなって、感圧抵抗体４１中のカーボン粉同士が強く接触することでカーボン粒子間の接触面積が増大し、これによって第１，第２の接点パターン２１，５１間の抵抗値が小さくなる。一方前記押圧を解除していけば、感圧抵抗体４１の厚みがその弾性復帰力によって元の厚みに戻ってゆき、抵抗値は大きくなっていく。つまり、前記押圧する力（押圧力）の大きさに応じて、第１，第２の接点パターン２１，５１間の抵抗値が異なり、これによって前記押圧力に応じた異なる出力が得られ、当該押圧力の大きさを検知することができる。 When the substrate 10 is placed on a base (not shown) and the second contact pattern 51 is pressed from above with a finger or a pressing object such as a key top, the flexible pressure-sensitive resistor 41 is compressed, reducing its thickness. The carbon powder particles in the pressure-sensitive resistor 41 come into strong contact with each other, increasing the contact area between the carbon particles, thereby reducing the resistance between the first and second contact patterns 21, 51. Meanwhile, as the pressure is gradually released, the pressure-sensitive resistor 41 returns to its original thickness due to its elastic restoring force, increasing the resistance. In other words, the resistance between the first and second contact patterns 21, 51 varies depending on the magnitude of the pressing force (pressure), resulting in a different output corresponding to the pressing force and making it possible to detect the magnitude of the pressing force.
なお上述のように、感圧抵抗体４１の厚みはより厚い方が、この感圧センサ１－１を押圧しないときの第１，第２接点パターン２１，５１間の抵抗値が大きくなると共に、これを押下したときの抵抗値の変化幅が大きくなるので、より好ましい。従って上記感圧センサ１－１においては、感圧抵抗体４１の厚みを第１，第２の接点パターン２１，５１の厚みよりも厚く形成しているが、本発明はこれに限られず、第１，第２の接点パターン２１，５１の厚みと同一又は薄い厚みとしても良い。 As mentioned above, it is preferable that the thickness of the pressure-sensitive resistor 41 is thicker, as this increases the resistance between the first and second contact patterns 21, 51 when the pressure-sensitive sensor 1-1 is not pressed, and also increases the range of change in resistance when pressed. Therefore, in the pressure-sensitive sensor 1-1, the thickness of the pressure-sensitive resistor 41 is made thicker than the thickness of the first and second contact patterns 21, 51, but the present invention is not limited to this, and the thickness may be the same as or thinner than the thickness of the first and second contact patterns 21, 51.
また感圧抵抗体１の厚みは薄いので、第１，第２の接点パターン２１，５１間に電圧を印加した際に電気が流れるのは、即ち抵抗体として作用するのは、感圧抵抗体４１全体中の第１，第２の接点パターン２１，５１が上下に対向（重複）している面の部分だけである。この実施形態で言えば、第２の接点パターン５１よりも第１の接点パターン２１の方が小さいので、第１の接点パターン２１の面の真上に対向する感圧抵抗体４１の部分のみが抵抗体として作用する。従って、高い抵抗値を得たい場合は第１，第２の接点パターン２１，５１の内の少なくとも何れか一方の接点パターン（この例の場合は第１の接点パターン２１）の面積を小さくすればよい。このときもう一方の接点パターン（この例の場合は第２の接点パターン５１）は、上記一方の接点パターン（第１の接点パターン２１）よりもその面積を大きくし、両者の印刷誤差によって上記一方の接点パターン（第１の接点パターン２１）に対してもう一方の接点パターン（第２の接点パターン５１）が対向しない部分が生じることを確実に防止することが好ましい。 Furthermore, because the thickness of the pressure-sensitive resistor 1 is thin, when a voltage is applied between the first and second contact patterns 21, 51, electricity flows only in the surface portion of the entire pressure-sensitive resistor 41 where the first and second contact patterns 21, 51 face each other (overlap) vertically, i.e., the portion that acts as a resistor. In this embodiment, since the first contact pattern 21 is smaller than the second contact pattern 51, only the portion of the pressure-sensitive resistor 41 that faces directly above the surface of the first contact pattern 21 acts as a resistor. Therefore, to obtain a high resistance value, it is sufficient to reduce the area of at least one of the first and second contact patterns 21, 51 (in this example, the first contact pattern 21). In this case, it is preferable to make the area of the other contact pattern (in this example, the second contact pattern 51) larger than that of the first contact pattern (the first contact pattern 21), to reliably prevent the occurrence of a portion where the other contact pattern (the second contact pattern 51) does not face the first contact pattern (the first contact pattern 21) due to printing errors between the two.
上述のように、感圧センサ１－１の抵抗値は、小さい方の接点パターン（第１の接点パターン２１）の面積で決まるが、この実施形態のように、基板１０に直接印刷する接点パターン（第１の接点パターン２１）の方を、感圧抵抗体４１上に印刷する接点パターン（第２の接点パターン５１）よりも小さく形成したのは、面の滑らかな基板１０上に形成する接点パターン（第１の接点パターン２１）の方が、面の粗い感圧抵抗体４１上に形成する接点パターン（第２の接点パターン５１）よりも印刷精度を高くでき、小さい方の接点パターン（第１の接点パターン２１）の面積で決まる抵抗値の精度を、より高めることが期待できるからである。 As mentioned above, the resistance value of the pressure-sensitive sensor 1-1 is determined by the area of the smaller contact pattern (first contact pattern 21). However, as in this embodiment, the contact pattern (first contact pattern 21) printed directly on the substrate 10 is made smaller than the contact pattern (second contact pattern 51) printed on the pressure-sensitive resistor 41. This is because the contact pattern (first contact pattern 21) formed on the substrate 10, which has a smooth surface, can be printed with higher accuracy than the contact pattern (second contact pattern 51) formed on the pressure-sensitive resistor 41, which has a rough surface, and this is expected to further improve the accuracy of the resistance value, which is determined by the area of the smaller contact pattern (first contact pattern 21).
また感圧抵抗体４１は、この感圧センサ１－１のように、前記第１，第２の接点パターン２１，５１よりもその外形形状を大きく形成し、確実に第１，第２の接点パターン２１，５１の対向面間に存在するように形成することが好ましい。 Furthermore, as in this pressure-sensitive sensor 1-1, it is preferable to form the pressure-sensitive resistor 41 so that its outer shape is larger than the first and second contact patterns 21, 51, and to ensure that it is located between the opposing surfaces of the first and second contact patterns 21, 51.
図３は、感圧センサ１－１の一具体例を示す平面図である。同図に示すように、基板１０は、センサ本体形成部１１と、センサ本体形成部１１の外周に接続されて帯状に延びる出力引出部１３とを具備して構成されている。そしてセンサ本体形成部１１には前記第１，第２の接点パターン２１，５１と感圧抵抗体４１と前記第１，第２の接点パターン２１，５１にそれぞれ接続した第１，第２の配線パターン３１，６１の一部とが印刷形成され、出力引出部１３には第１，第２の配線パターン３１，６１の残りの部分が印刷形成されてそれらの先端に出力端子パターン３３，６３が印刷形成されている。これによって、容易に第１，第２の接点パターン２１，５１間に電圧を印可し、出力を得ることができる。 Figure 3 is a plan view showing one specific example of a pressure-sensitive sensor 1-1. As shown in the figure, the substrate 10 is configured to include a sensor body forming portion 11 and an output lead portion 13 that is connected to the outer periphery of the sensor body forming portion 11 and extends in a strip-like shape. The first and second contact patterns 21, 51, the pressure-sensitive resistor 41, and portions of the first and second wiring patterns 31, 61 connected to the first and second contact patterns 21, 51, respectively, are printed on the sensor body forming portion 11, while the remaining portions of the first and second wiring patterns 31, 61 are printed on the output lead portion 13, with output terminal patterns 33, 63 printed on their tips. This makes it easy to apply a voltage between the first and second contact patterns 21, 51 and obtain an output.
図４は本発明の第２実施形態にかかる感圧センサ１－２の概略断面図（図５のＢ－Ｂ概略断面図）、図５は感圧センサ１－２の概略平面図である。これらの図に示す感圧センサ１－２において、前記図１～図３に示す感圧センサ１－１と同一又は相当部分には同一符号を付す（但し、各符号には添え字「－２」を付す）。なお以下で説明する事項以外の事項については、前記図１～図３に示す実施形態と同じである。 Figure 4 is a schematic cross-sectional view of a pressure-sensitive sensor 1-2 according to a second embodiment of the present invention (a schematic cross-sectional view taken along line B-B in Figure 5), and Figure 5 is a schematic plan view of the pressure-sensitive sensor 1-2. In the pressure-sensitive sensor 1-2 shown in these figures, parts that are the same as or equivalent to those in the pressure-sensitive sensor 1-1 shown in Figures 1 to 3 are given the same reference numerals (however, each reference numeral has the suffix "-2" added). Note that matters other than those described below are the same as those in the embodiment shown in Figures 1 to 3.
この感圧センサ１－２において上記感圧センサ１－１と相違する点は、第１の接点パターン２１－２を第２の接点パターン５１－２や感圧抵抗体４１－２よりも大きく構成し、また感圧抵抗体４１－２を第１の接点パターン２１－２の周囲（外周）の少なくとも一部を覆うように形成している点である。第１の接点パターン２１－２と第２の接点パターン５１－２が真上真下に対向している部分の間全体に感圧抵抗体４１―２が位置していることは上記第１実施形態の場合と同様である。 This pressure-sensitive sensor 1-2 differs from the pressure-sensitive sensor 1-1 in that the first contact pattern 21-2 is larger than the second contact pattern 51-2 and the pressure-sensitive resistor 41-2, and the pressure-sensitive resistor 41-2 is formed to cover at least a portion of the periphery (outer periphery) of the first contact pattern 21-2. As in the first embodiment, the pressure-sensitive resistor 41-2 is positioned across the entire area where the first contact pattern 21-2 and the second contact pattern 51-2 face each other directly above and below.
即ち、感圧抵抗体４１－２は、第１の接点パターン２１－２の上面全体を覆う必要はなく、第１の接点パターン２１－２の周囲の少なくとも一部を覆うことで構成しても良い。このように第１の接点パターン２１－２と第２の接点パターン５１－２と感圧抵抗体４１－２の大きさや配置位置は種々の変更が可能である。このように感圧センサ１－２を構成しても、本発明の作用・効果を発揮する。 In other words, the pressure-sensitive resistor 41-2 does not need to cover the entire top surface of the first contact pattern 21-2, but may be configured to cover at least a portion of the periphery of the first contact pattern 21-2. In this way, the size and placement of the first contact pattern 21-2, second contact pattern 51-2, and pressure-sensitive resistor 41-2 can be modified in various ways. Even when the pressure-sensitive sensor 1-2 is configured in this way, the functions and effects of the present invention can be achieved.
なお上記感圧センサ１－１，１－２では、第２の配線パターン６１，６１－２を、感圧抵抗体４１，４１－２の上面及び側面（外周側面）に接触させた後に基板１０上に引き出しているが、例えば第２の接点パターン５１，５１－２の外周辺の一部と感圧抵抗体４１，４１－２の外周辺の一部とを一致させ、一致させた部分に第２の配線パターン６１，６１－２を接続することで、第２の配線パターン６１，６１－２を感圧抵抗体４１，４１－２の側面のみに接触して（感圧抵抗体４１，４１－２の上面に接触させないで）基板１０上に引き出す構成とすることもできる。 In the above-mentioned pressure-sensitive sensors 1-1 and 1-2, the second wiring patterns 61 and 61-2 are brought into contact with the top and side surfaces (outer peripheral surfaces) of the pressure-sensitive resistors 41 and 41-2 before being drawn out onto the substrate 10. However, it is also possible to draw out the second wiring patterns 61 and 61-2 onto the substrate 10 in contact only with the side surfaces of the pressure-sensitive resistors 41 and 41-2 (without coming into contact with the top surfaces of the pressure-sensitive resistors 41 and 41-2) by, for example, aligning part of the outer periphery of the second contact patterns 51 and 51-2 with part of the outer periphery of the pressure-sensitive resistors 41 and 41-2 and connecting the second wiring patterns 61 and 61-2 to the aligned portions.
以上説明したように、上記感圧センサ１－１，１－２は、基板１０，１０－２上に、第１の接点パターン２１，２１－２及び第１の接点パターン２１，２１－２に接続する第１の配線パターン３１，３１－２を形成し、前記第１の接点パターン２１，２１－２上に、圧力に応じて抵抗値が変化する感圧抵抗体４１，４１－２を形成し、感圧抵抗体４１，４１－２上の前記第１の接点パターン２１，２１－２と対向する位置に、第２の接点パターン５１，５１－２を形成し、さらに前記第２の接点パターン５１，５１－２に接続する第２の配線パターン６１，６１－２を前記基板１０，１０－２上に引き出して構成されているので、１枚の基板１０，１０－２上に各種パターンを形成するだけで感圧センサ１－１，１－２を構成することができ、部品点数の削減と厚みの薄型化が図れ、また第１，第２の接点パターン２１，５１，２１－２，５１－２間に組み立てによるずれが生じる虞もなくなる。 As explained above, the pressure-sensitive sensors 1-1 and 1-2 have first contact patterns 21 and 21-2 and first wiring patterns 31 and 31-2 connected to the first contact patterns 21 and 21-2 formed on the substrates 10 and 10-2, pressure-sensitive resistors 41 and 41-2 whose resistance value changes depending on pressure formed on the first contact patterns 21 and 21-2, and second contact patterns 5 and 6 formed on the pressure-sensitive resistors 41 and 41-2 at positions facing the first contact patterns 21 and 21-2. Since the pressure-sensitive sensors 1-1 and 1-2 are constructed by forming first and second wiring patterns 21, 51-2 and then extending second wiring patterns 61, 61-2 connected to the second contact patterns 51, 51-2 onto the substrates 10, 10-2, the pressure-sensitive sensors 1-1 and 1-2 can be constructed simply by forming various patterns on a single substrate 10, 10-2, reducing the number of parts and the thickness, and eliminating the risk of misalignment between the first and second contact patterns 21, 51, 21-2, and 51-2 during assembly.
また上記感圧センサ１－１，１－２は、第１の接点パターン２１，２１－２と第１の配線パターン３１，３１－２、及び感圧抵抗体４１，４１－２、及び第２の接点パターン５１，５１－２と第２の配線パターン６１，６１－２を印刷によって積層して形成したので、１枚の基板１０，１０－２上に各種パターンを容易且つ正確な位置に形成することができ、この点からも部品点数の削減と製造コストの低減化と厚みの薄型化とが図れる。また第１，第２の接点パターン２１，２１－２，５１，５１－２間に組み立てによるずれが生じる虞もなくなる。 Furthermore, the pressure-sensitive sensors 1-1, 1-2 are formed by layering the first contact patterns 21, 21-2, first wiring patterns 31, 31-2, pressure-sensitive resistors 41, 41-2, and second contact patterns 51, 51-2, and second wiring patterns 61, 61-2 by printing. This allows various patterns to be easily and accurately formed in positions on a single substrate 10, 10-2, thereby reducing the number of parts, manufacturing costs, and thickness. There is also no risk of misalignment between the first and second contact patterns 21, 21-2, 51, 51-2 during assembly.
以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載がない何れの形状や構造や材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば、上記基板１０，１０－２、第１の接点パターン２１，２１－２、第１の配線パターン３１，３１－２、感圧抵抗体４１，４１－２、第２の接点パターン５１，５１－２、第２の配線パターン６１，６１－２の形状や配置位置に種々の変更が可能であることは言うまでもない。また上記例では、各種パターンの形成にスクリーン印刷を用いたが、他の各種印刷方法（例えばオフセット印刷、インクジェット印刷）、さらには印刷以外の各種パターン形成方法（例えばエッチング方法）を用いて形成しても良い。また上記実施形態では、基板１０，１０－２としてフレキシブル基板を用いたが、硬質の基板を用いても良い。 While the above describes an embodiment of the present invention, the present invention is not limited to the above embodiment and various modifications are possible within the scope of the claims and the technical concept described in the specification and drawings. Furthermore, any shape, structure, or material not directly described in the specification or drawings is within the scope of the technical concept of the present invention as long as it achieves the functions and effects of the present invention. For example, it goes without saying that various modifications are possible to the shapes and positions of the substrates 10, 10-2, first contact patterns 21, 21-2, first wiring patterns 31, 31-2, pressure-sensitive resistors 41, 41-2, second contact patterns 51, 51-2, and second wiring patterns 61, 61-2. Furthermore, while screen printing was used to form the various patterns in the above example, other printing methods (e.g., offset printing, inkjet printing), and even pattern formation methods other than printing (e.g., etching) may also be used. Furthermore, although flexible substrates were used as substrates 10, 10-2 in the above embodiment, rigid substrates may also be used.
また、上記記載及び各図で示した実施形態は、その目的及び構成等に矛盾がない限り、互いの記載内容を組み合わせることが可能である。また、上記記載及び各図の記載内容は、その一部であっても、それぞれ独立した実施形態になり得るものであり、本発明の実施形態は上記記載及び各図を組み合わせた一つの実施形態に限定されるものではない。 Furthermore, the embodiments described above and shown in each figure can be combined as long as there is no contradiction in their purpose, configuration, etc. Furthermore, even a portion of the description described above and the figures can be used as independent embodiments, and the embodiments of the present invention are not limited to a single embodiment combining the description described above and the figures.
１－１、１－２ 感圧センサ
１０，１０－２ 基板
２１，２１－２ 第１の接点パターン
３１，３１－２ 第１の配線パターン
４１，４１－２ 感圧抵抗体
５１，５１－２ 第２の接点パターン
６１，６１－２ 第２の配線パターン
1-1, 1-2 Pressure-sensitive sensor 10, 10-2 Substrate 21, 21-2 First contact pattern 31, 31-2 First wiring pattern 41, 41-2 Pressure-sensitive resistor 51, 51-2 Second contact pattern 61, 61-2 Second wiring pattern
Claims (2)
１枚の合成樹脂製の基板の上面に、第１の接点パターン及び当該第１の接点パターンに接続する第１の配線パターンを直接形成し、
前記第１の接点パターンの上面に、圧力に応じて抵抗値が変化する感圧抵抗体を直接積層して形成し、
前記感圧抵抗体の上面の前記第１の接点パターンと対向する位置に、第２の接点パターンを直接積層して形成し、
さらに前記第２の接点パターンに接続する第２の配線パターンを、前記感圧抵抗体の上面及び側面、もしくは前記感圧抵抗体の側面に直接接触するように積層して形成して前記基板の上面に引き出し、
前記感圧抵抗体を、前記第１の接点パターン及び前記第２の接点パターンの大きさよりも大きく形成し、
且つ前記基板よりも粗い表面の前記感圧抵抗体上に形成される第２の接点パターンの大きさを、前記第１の接点パターンの大きさよりも大きい面積に形成して、前記第２の接点パターンが前記第１の接点パターンの上面全体を覆う構造としたことを特徴とする感圧センサ。 In a pressure sensor whose resistance value changes depending on the pressing force,
a first contact pattern and a first wiring pattern connected to the first contact pattern are directly formed on an upper surface of a single synthetic resin substrate;
a pressure-sensitive resistor whose resistance value changes in response to pressure is formed by directly laminating it on the upper surface of the first contact pattern;
a second contact pattern is formed by directly stacking it on the upper surface of the pressure-sensitive resistor at a position facing the first contact pattern;
Furthermore, a second wiring pattern connected to the second contact pattern is formed by laminating it so as to be in direct contact with the upper surface and side surface of the pressure-sensitive resistor or the side surface of the pressure-sensitive resistor, and is drawn out to the upper surface of the substrate ;
The pressure-sensitive resistor is formed to be larger than the first contact pattern and the second contact pattern;
A pressure-sensitive sensor characterized in that the size of a second contact pattern formed on the pressure-sensitive resistor, which has a surface rougher than that of the substrate, is formed to be larger than the size of the first contact pattern, and the second contact pattern covers the entire upper surface of the first contact pattern .
前記第１の接点パターンと前記第１の配線パターン、及び前記感圧抵抗体、及び前記第２の接点パターンと前記第２の配線パターンは、何れも、前記基板上に印刷によって直接積層して形成される印刷層であることを特徴とする感圧センサ。 The pressure-sensitive sensor according to claim 1 ,
A pressure-sensitive sensor characterized in that the first contact pattern, the first wiring pattern, the pressure-sensitive resistor, and the second contact pattern and the second wiring pattern are all printed layers formed by directly stacking them on the substrate by printing.
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