JP7803071B2 - Wiring board and method for manufacturing the same - Google Patents

Description

Embodiments of the present disclosure relate to wiring boards and methods for manufacturing wiring boards.

Currently, mobile terminal devices such as smartphones and tablets are becoming more sophisticated, smaller, thinner, and lighter. Because these mobile terminal devices use multiple communication bands, they require multiple antennas corresponding to the communication bands. For example, mobile terminal devices are equipped with multiple antennas, including a telephone antenna, a Wi-Fi (Wireless Fidelity) antenna, a 3G (Generation) antenna, a 4G (Generation) antenna, an LTE (Long Term Evolution) antenna, a Bluetooth (registered trademark) antenna, and an NFC (Near Field Communication) antenna. However, as mobile terminal devices become smaller, the space available for antenna installation is limited, limiting the freedom in antenna design. Furthermore, because antennas are built into a limited space, radio wave sensitivity is not always satisfactory.

For this reason, film antennas that can be mounted in the display area of mobile terminal devices have been developed. These film antennas are transparent antennas in which an antenna pattern is formed on a transparent substrate, and the antenna pattern is formed from a mesh-like conductive mesh layer consisting of conductor portions as formed portions of an opaque conductive layer and numerous openings as non-formed portions.

JP 2011-66610 A Patent No. 5636735 specification Patent No. 5695947 specification

For example, in conventional film antennas, one or more mesh antennas are mounted on a transparent substrate, and there are both areas on the transparent substrate where an antenna pattern is formed and areas where no antenna pattern is formed. In this case, the presence of areas where no antenna pattern is formed makes the areas where the antenna pattern is formed easily visible. For this reason, there is a demand for making wiring patterns such as antenna patterns less visible.

One of the objectives of this embodiment is to provide a wiring board and a method for manufacturing a wiring board that can make the wiring pattern area less visible.

A wiring board according to one embodiment of the present disclosure is a wiring board comprising: a substrate; a wiring pattern region disposed on the substrate and including a plurality of wirings; and a plurality of dummy pattern regions disposed around the wiring pattern region and electrically independent from the wirings, wherein the substrate is transparent; and wherein, of the plurality of dummy pattern regions, a first dummy pattern region adjacent to the wiring pattern region has an aperture ratio equal to or greater than the aperture ratio of the wiring pattern region; and, of the plurality of dummy pattern regions, a second dummy pattern region adjacent to the first dummy pattern region and farther from the wiring pattern region than the first dummy pattern region has an aperture ratio greater than the aperture ratio of the first dummy pattern region.

In a wiring board according to one embodiment of the present disclosure, there may be multiple wiring pattern regions, and at least one dummy pattern region may be provided so as to surround multiple wiring pattern regions.

In a wiring board according to one embodiment of the present disclosure, the aperture ratios of the wiring pattern region and the plurality of dummy pattern regions may increase stepwise from the wiring pattern region toward the dummy pattern region farthest from the wiring pattern region, the difference between the aperture ratio of the first dummy pattern region and the aperture ratio of the wiring pattern region may be 0% or more and 2% or less, and the difference between the aperture ratios of adjacent dummy pattern regions may be 0.02% or more and 2% or less.

A wiring board according to one embodiment of the present disclosure may further include a peripheral region arranged around the dummy pattern region farthest from the wiring pattern region, and the aperture ratio of the peripheral region may be 100%.

In a wiring board according to one embodiment of the present disclosure, the aperture ratios of the wiring pattern region and the multiple dummy pattern regions may increase stepwise from the wiring pattern region toward the dummy pattern region farthest from the wiring pattern region, and the difference between the aperture ratio of the first dummy pattern region and the aperture ratio of the wiring pattern region and the difference between the aperture ratios of adjacent dummy pattern regions may be 0% or more and 2% or less, and the difference between the aperture ratios of the surrounding region and the dummy pattern region adjacent to the surrounding region may be 0.02% or more and 2% or less.

In a wiring board according to one embodiment of the present disclosure, the outer edge of the wiring pattern region may include a first side and a second side that intersect with each other in a planar view. When the vertex where the first side and the second side intersect is defined as a first vertex, an extension line of the first side extending from the first vertex is defined as a first virtual line, and an extension line of the second side extending from the first vertex is defined as a second virtual line, the outer edge of the first dummy pattern region in the region sandwiched between the first virtual line and the second virtual line may have an arc shape centered at the first vertex.

In a wiring board according to one embodiment of the present disclosure, in the region between the first virtual line and the second virtual line, the outer edge of the second dummy pattern region may have an arc shape centered on the first vertex.

A wiring board according to one embodiment of the present disclosure is a wiring board comprising: a substrate; a wiring pattern region disposed on the substrate and including a plurality of wirings; and a plurality of dummy pattern regions disposed around the wiring pattern region and electrically independent from the wirings, wherein the substrate is transparent, and a first dummy pattern region adjacent to the wiring pattern region among the plurality of dummy pattern regions has an aperture ratio of 1/2 or less than that of a first dummy pattern region adjacent to the first dummy pattern region among the plurality of dummy pattern regions and having a larger aperture ratio than that of the first dummy pattern region. The opening ratio of the first dummy pattern region is smaller than that of the second dummy pattern region farther from the line region, and the outer edge of the first dummy pattern region includes a third side and a fourth side that intersect with each other in a plan view. When the vertex where the third side and the fourth side intersect is defined as a second vertex, an extension of the third side extending from the second vertex is defined as a third virtual line, and an extension of the fourth side extending from the second vertex is defined as a fourth virtual line, the outer edge of the second dummy pattern region in the region sandwiched between the third virtual line and the fourth virtual line has an arc shape centered at the second vertex.

In a wiring board according to one embodiment of the present disclosure, the multiple dummy pattern regions may each include multiple dummy wirings that are electrically independent from the wiring, and the multiple dummy wirings may each have a first dummy wiring portion and a second dummy wiring portion, and the first dummy wiring portions of adjacent dummy pattern regions may be arranged parallel to each other, and the second dummy wiring portions of adjacent dummy pattern regions may be arranged parallel to each other.

In a wiring board according to one embodiment of the present disclosure, the wiring pattern region may further include a plurality of connecting wires connecting the plurality of wirings, and the plurality of dummy pattern regions may each include a plurality of dummy wires electrically independent from the wirings and the connecting wires, and the plurality of dummy wires may each have a first dummy wire portion and a second dummy wire portion, and the wirings and the first dummy wire portion of each dummy pattern region may be arranged parallel to each other, and the connecting wires and the second dummy wire portion of each dummy pattern region may be arranged parallel to each other.

A wiring board according to one embodiment of the present disclosure is a wiring board comprising: a substrate; a wiring pattern region disposed on the substrate and including a plurality of wirings; and a dummy pattern region disposed around the wiring pattern region and electrically independent from the wirings, wherein the substrate is transparent, and the outer edge of the wiring pattern region includes a first side and a second side that intersect with each other in a planar view, and where the vertex where the first side and the second side intersect is defined as a first vertex, an extension line of the first side extending from the first vertex is defined as a first virtual line, and an extension line of the second side extending from the first vertex is defined as a second virtual line, the outer edge of the dummy pattern region in the region sandwiched between the first virtual line and the second virtual line has an arc shape centered at the first vertex.

A wiring board according to one embodiment of the present disclosure may have radio wave transmission and reception capabilities.

An image display device according to one embodiment of the present disclosure includes a wiring substrate according to one embodiment and a display device laminated on the wiring substrate, and the wiring pattern area is provided in a corner of the display device.

A method for manufacturing a wiring board according to one embodiment of the present disclosure includes the steps of preparing a substrate and forming, on the substrate, a wiring pattern region including a plurality of wirings, and a plurality of dummy pattern regions arranged around the wiring pattern region and electrically independent from the wirings, wherein the substrate is transparent, and a first dummy pattern region of the plurality of dummy pattern regions adjacent to the wiring pattern region has an aperture ratio equal to or greater than the aperture ratio of the wiring pattern region, and a second dummy pattern region of the plurality of dummy pattern regions adjacent to the first dummy pattern region and farther from the wiring pattern region than the first dummy pattern region has an aperture ratio greater than the aperture ratio of the first dummy pattern region.

A method for manufacturing a wiring board according to one embodiment of the present disclosure includes the steps of: preparing a substrate; and forming, on the substrate, a wiring pattern region including a plurality of wirings; and a dummy pattern region disposed around the wiring pattern region and electrically independent from the wirings; wherein the substrate is transparent; and the outer edge of the wiring pattern region includes a first side and a second side that intersect with each other in a planar view; where the vertex where the first side and the second side intersect is defined as a first vertex, an extension of the first side extending from the first vertex is defined as a first virtual line, and an extension of the second side extending from the first vertex is defined as a second virtual line, the outer edge of the dummy pattern region in the region sandwiched between the first virtual line and the second virtual line has an arc shape centered at the first vertex.

A method for manufacturing a wiring board according to one embodiment of the present disclosure is a method for manufacturing a wiring board, comprising the steps of: preparing a substrate; and forming, on the substrate, a wiring pattern region including a plurality of wirings; and a plurality of dummy pattern regions arranged around the wiring pattern region and electrically independent from the wirings; wherein the substrate is transparent; and a first dummy pattern region adjacent to the wiring pattern region among the plurality of dummy pattern regions has an aperture ratio of 1/2 or less than that of the first dummy pattern region among the plurality of dummy pattern regions, the aperture ratio of the first dummy pattern region being adjacent to the first dummy pattern region among the plurality of dummy pattern regions. This is a method for manufacturing a wiring substrate, wherein the opening ratio of the first dummy pattern region is smaller than that of a second dummy pattern region that is farther from the wiring pattern region, and the outer edge of the first dummy pattern region includes a third side and a fourth side that intersect with each other in a plan view, and when the vertex where the third side and the fourth side intersect is defined as a second vertex, an extension of the third side extending from the second vertex is defined as a third virtual line, and an extension of the fourth side extending from the second vertex is defined as a fourth virtual line, the outer edge of the second dummy pattern region in the region sandwiched between the third virtual line and the fourth virtual line has an arc shape centered at the second vertex.

According to embodiments of the present disclosure, wiring pattern areas can be made less visible.

FIG. 1 is a plan view showing a wiring board according to an embodiment. FIG. 2A is an enlarged plan view (enlarged view of part IIA in FIG. 1) showing a wiring board according to an embodiment. FIG. 2B is an enlarged plan view (enlarged view of part IIB in FIG. 1) showing the wiring board according to one embodiment. FIG. 3 is a cross-sectional view (cross-sectional view taken along line III-III in FIG. 2A) showing the wiring board according to one embodiment. FIG. 4 is a cross-sectional view (cross-sectional view taken along line IV-IV in FIG. 2A) showing the wiring board according to one embodiment. FIG. 5 is a cross-sectional view (cross-sectional view taken along line VV in FIG. 2A) showing a wiring board according to an embodiment. FIG. 6A is a cross-sectional view showing a method for manufacturing a wiring substrate according to an embodiment. FIG. 6B is a cross-sectional view showing a method for manufacturing a wiring substrate according to an embodiment. FIG. 6C is a cross-sectional view showing a method for manufacturing a wiring substrate according to an embodiment. FIG. 6D is a cross-sectional view showing a method for manufacturing a wiring substrate according to an embodiment. FIG. 6E is a cross-sectional view showing a method for manufacturing a wiring substrate according to an embodiment. FIG. 6F is a cross-sectional view showing a method for manufacturing a wiring substrate according to an embodiment. FIG. 7 is a plan view showing an image display device according to an embodiment. FIG. 8 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 9 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 10 is an enlarged plan view (corresponding to FIG. 2A) showing a modified example of the wiring substrate according to the embodiment. FIG. 11 is an enlarged plan view (corresponding to FIG. 2A) showing a modified example of the wiring board according to the embodiment. FIG. 12 is an enlarged plan view (corresponding to FIG. 2A) showing a modified example of the wiring substrate according to the embodiment. FIG. 13 is an enlarged plan view (corresponding to FIG. 2A) showing a modified example of the wiring board according to the embodiment. FIG. 14 is an enlarged plan view showing a modified example of the wiring board according to the embodiment. FIG. 15 is an enlarged plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 16 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 17 is an enlarged plan view (enlarged view of portion XVII in FIG. 16) showing a wiring board according to an embodiment. FIG. 18 is a plan view showing a modified example of the image display device according to the embodiment. FIG. 19 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 20 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 21 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 22 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 23 is a plan view showing a modified example of the wiring substrate according to the embodiment. FIG. 24 is a plan view showing a modified example of the wiring substrate according to the embodiment.

First, one embodiment will be described with reference to Figures 1 to 7. Figures 1 to 7 show this embodiment.

The figures shown below are schematic diagrams. Therefore, the size and shape of each part have been appropriately exaggerated to facilitate understanding. Furthermore, appropriate modifications can be made without departing from the technical concept. In the figures shown below, identical parts are given the same reference numerals, and some detailed explanations may be omitted. Furthermore, the numerical values, such as dimensions, and material names of each component described in this specification are examples of an embodiment, and are not limited to these and can be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are interpreted to include substantially the same state in addition to their strict meaning.

In this embodiment, the "X direction" refers to a direction perpendicular to the longitudinal direction of the wiring pattern area and a direction perpendicular to the length direction corresponding to the frequency band of the antenna wiring. The "Y direction" refers to a direction perpendicular to the X direction and parallel to the longitudinal direction of the wiring pattern area and a direction parallel to the length direction corresponding to the frequency band of the antenna wiring. The "Z direction" refers to a direction perpendicular to both the X direction and the Y direction and parallel to the thickness direction of the wiring board. Furthermore, the "front surface" refers to the surface on the positive side of the Z direction, which is the surface on the board on which the antenna wiring is provided. The "back surface" refers to the surface on the negative side of the Z direction, which is the surface opposite to the surface on the board on which the antenna wiring is provided. Note that this embodiment will be described taking as an example a case where the wiring pattern area 20 is an antenna pattern area 20 with radio wave transmission and reception functionality (antenna functionality), but the wiring pattern area 20 does not necessarily have radio wave transmission and reception functionality (antenna functionality).

[Configuration of wiring board]
The configuration of the wiring board according to this embodiment will be described with reference to Figures 1 to 5. Figures 1 to 5 are diagrams showing the wiring board according to this embodiment.

As shown in FIG. 1, a wiring board 10 according to this embodiment is placed on, for example, the display of an image display device. Such wiring board 10 comprises a transparent substrate 11, an antenna pattern area (wiring pattern area) 20 arranged on the substrate 11, and a plurality of dummy pattern areas 30 arranged around the antenna pattern area 20 on the substrate 11. In addition, a power supply section 40 is electrically connected to the antenna pattern area 20.

The substrate 11 has a substantially rectangular shape in a plan view, with its longitudinal direction parallel to the Y direction and its lateral direction parallel to the X direction. The substrate 11 is transparent and substantially flat, with a substantially uniform thickness overall. The length _L1 of the substrate 11 in the longitudinal direction (Y direction) can be selected, for example, from 100 mm to 200 mm, and the length L2 of the substrate ₁₁ in the lateral direction (X direction) can be selected, for example, from 50 mm to 100 mm.

The material of the substrate 11 may be any material that is transparent in the visible light range and electrically insulating. In this embodiment, the material of the substrate 11 is polyethylene terephthalate, but is not limited thereto. The substrate 11 is preferably made of an organic insulating material, such as a polyester resin such as polyethylene terephthalate, an acrylic resin such as polymethyl methacrylate, a polycarbonate resin, a polyimide resin, a polyolefin resin such as a cycloolefin polymer, or a cellulose resin such as triacetyl cellulose. Alternatively, the substrate 11 may be made of an organic insulating material such as a cycloolefin polymer (e.g., ZF-16 manufactured by Nippon Zeon Co., Ltd.) or a polynorbornene polymer (manufactured by Sumitomo Bakelite Co., Ltd.). The substrate 11 may also be made of glass, ceramics, or other suitable materials depending on the application. While the substrate 11 is illustrated as being composed of a single layer, the present invention is not limited thereto and may have a structure in which multiple substrates or layers are stacked. The substrate 11 may also be in the form of a film or a plate. Therefore, the thickness of the substrate 11 is not particularly limited and can be selected appropriately depending on the application. As an example, the thickness T ₁ of the substrate 11 (length in the Z direction, see FIG. 3) can be set in the range of 10 μm or more and 200 μm or less.

The dielectric dissipation factor of the substrate 11 may be 0.002 or less, and preferably 0.001 or less. There is no particular lower limit to the dielectric dissipation factor of the substrate 11, but it may be greater than 0. By having the dielectric dissipation factor of the substrate 11 within the above range, it is possible to reduce the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves, particularly when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the antenna pattern region 20 are high frequency. There is no particular limit to the lower limit of the dielectric dissipation factor of the substrate 11. There is no particular limit to the relative permittivity of the substrate 11, but it may be 2.0 or more and 10.0 or less.

The dielectric loss tangent of the substrate 11 can be measured in accordance with IEC 62562. Specifically, first, a test piece is prepared by cutting out a portion of the substrate 11 where the antenna pattern region 20 is not formed. Alternatively, the substrate 11 with the antenna pattern region 20 formed can be cut out, and the antenna pattern region 20 can be removed by etching or the like. The dimensions of the test piece should be 10 mm to 20 mm wide and 50 mm to 100 mm long. Next, the dielectric loss tangent is measured in accordance with IEC 62562. The relative permittivity and dielectric loss tangent of the substrate 11 can also be measured in accordance with ASTM D150.

The substrate 11 is also transparent. In this specification, "transparent" means that the transmittance of visible light (light with a wavelength of 400 nm or more and 700 nm or less) is 85% or more. The substrate 11 may have a transmittance of visible light (light with a wavelength of 400 nm or more and 700 nm or less) of 85% or more, preferably 90% or more. There is no particular upper limit to the visible light transmittance of the substrate 11, but it may be, for example, 100% or less. By setting the visible light transmittance of the substrate 11 within the above range, the transparency of the wiring substrate 10 can be increased, making it easier to view the display 91 (described below) of the image display device 90. Visible light refers to light with a wavelength of 400 nm or more and 700 nm or less. Furthermore, a visible light transmittance of 85% or more means that when the absorbance of the substrate 11 is measured using a known spectrophotometer (for example, the V-670 spectrometer manufactured by JASCO Corporation), the transmittance is 85% or more over the entire wavelength range from 400 nm to 700 nm.

In FIG. 1 , there are multiple (three) antenna pattern areas 20 on the substrate 11, each corresponding to a different frequency band. That is, the multiple antenna pattern areas 20 have different lengths (length in the Y direction) _La , each corresponding to a specific frequency band. Note that the lower the corresponding frequency band, the longer the length _La of the antenna pattern area 20. When the wiring substrate 10 is disposed on, for example, a display 91 of an image display device 90 (see FIG. 7 described later), if the wiring substrate 10 has a radio wave transmission/reception function, each antenna pattern area 20 may correspond to any of a telephone antenna, a Wi-Fi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, etc. Alternatively, if the wiring substrate 10 does not have a radio wave transmission/reception function, each antenna pattern area 20 may perform functions such as hovering (a function that allows the user to operate the display without directly touching it), fingerprint authentication, a heater, noise reduction (shielding), etc. Furthermore, the antenna pattern region 20 does not have to be present over the entire surface of the substrate 11, but may be present in only a partial region on the substrate 11.

Each antenna pattern region 20 has a quadrangular shape in a plan view. In this embodiment, each antenna pattern region 20 has a substantially rectangular shape in a plan view. The longitudinal direction of each antenna pattern region 20 is parallel to the Y direction, and the lateral direction of each antenna pattern region 20 is parallel to the X direction. The length _La of each antenna pattern region 20 in the longitudinal direction (Y direction) can be selected, for example, from 3 mm to 100 mm, and the width _Wa of each antenna pattern region 20 in the lateral direction (X direction) can be selected, for example, from 1 mm to 10 mm. In particular, the antenna pattern region 20 may function as a millimeter wave antenna. When the antenna pattern region 20 is a millimeter wave antenna, the length _La of the antenna pattern region 20 can be selected, for example, from 1 mm to 10 mm, and more preferably, from 1.5 mm to 5 mm.

In the antenna pattern region 20, metal wires are formed in a lattice or mesh pattern, with a uniform repeat pattern in the X and Y directions. That is, as shown in Figures 2A and 2B, the antenna pattern region 20 is composed of repeated L-shaped unit pattern shapes 20a (shaded areas in Figures 2A and 2B) consisting of a portion extending in the X direction (part of the antenna connecting wiring 22, described below) and a portion extending in the Y direction (part of the antenna wiring 21, described below).

As shown in Figures 2A and 2B, each antenna pattern area 20 includes a plurality of antenna wirings (wirings) 21 that function as antennas and a plurality of antenna connecting wirings (connecting wirings) 22 that connect the plurality of antenna wirings 21. Specifically, the plurality of antenna wirings 21 and the plurality of antenna connecting wirings 22 are integrated as a whole to form a regular lattice or mesh shape. Each antenna wiring 21 extends in a direction corresponding to the antenna's frequency band (Y direction), and each antenna connecting wiring 22 extends in a direction perpendicular to the antenna wiring 21 (X direction). The antenna wiring 21 primarily functions as an antenna by having a length L _a (the length of the antenna pattern area 20 described above) that corresponds to a predetermined frequency band. Meanwhile, the antenna connecting wirings 22 connect these antenna wirings 21 together, thereby preventing problems such as breakage of the antenna wirings 21 or loss of electrical connection between the antenna wirings 21 and the power supply section 40.

In each antenna pattern region 20, a plurality of openings 23 are formed by being surrounded by adjacent antenna wirings 21 and adjacent antenna connecting wirings 22. The antenna wirings 21 and the antenna connecting wirings 22 are arranged at equal intervals. That is, the plurality of antenna wirings 21 are arranged at equal intervals, and the pitch _P1 (see FIG. 2A ) therebetween can be, for example, in the range of 0.01 mm to 1 mm. The plurality of antenna connecting wirings 22 are arranged at equal intervals, and the pitch _P2 (see FIG. 2A ) therebetween can be, for example, in the range of 0.01 mm to 1 mm. Since the plurality of antenna wirings 21 and the plurality of antenna connecting wirings 22 are arranged at equal intervals, the size of the openings 23 within each antenna pattern region 20 is uniform, making the antenna pattern region 20 less visible to the naked eye. The pitch _P1 of the antenna wirings 21 is equal to the pitch _P2 of the antenna connecting wirings 22. Therefore, each opening 23 has a substantially square shape in a plan view, and the transparent substrate 11 is exposed through each opening 23. Therefore, by increasing the area of each opening 23, the transparency of the wiring substrate 10 as a whole can be increased. The length L ₃ of one side of each opening 23 (see FIG. 2A ) can be, for example, in the range of 0.01 mm or more and 1 mm or less. While the antenna wiring 21 and the antenna connecting wiring 22 are orthogonal to each other, this is not a limitation and they may intersect at an acute or obtuse angle. The shape of the opening 23 is preferably the same across the entire surface, but it does not have to be uniform across the entire surface; for example, it may vary depending on the location.

As shown in FIG. 3, each antenna wiring 21 has a substantially rectangular or square cross section (X-direction cross section) perpendicular to its longitudinal direction. In this case, the cross-sectional shape of the antenna wiring 21 is substantially uniform along the longitudinal direction (Y-direction) of the antenna wiring 21. Also, as shown in FIG. 4, the cross-sectional shape of each antenna connecting wiring 22 perpendicular to the longitudinal direction (Y-direction cross section) is substantially rectangular or square, and is substantially the same as the cross-sectional shape (X-direction cross section) of the antenna wiring 21 described above. In this case, the cross-sectional shape of the antenna connecting wiring 22 is substantially uniform along the longitudinal direction (X-direction) of the antenna connecting wiring 22. The cross-sectional shapes of the antenna wiring 21 and the antenna connecting wiring 22 do not necessarily have to be substantially rectangular or square; for example, they may be substantially trapezoidal, with the front side (positive Z-direction side) narrower than the back side (negative Z-direction side), or may have curved sides on both widthwise sides.

In this embodiment, the line width W ₁ of the antenna wiring 21 (length in the X direction, see FIG. 3 ) and the line width W ₂ of the antenna connecting wiring 22 (length in the Y direction, see FIG. 4 ) are not particularly limited and can be selected appropriately depending on the application. For example, the line width W ₁ of the antenna wiring 21 can be selected in the range of 0.1 μm to 5.0 μm, and the line width W ₂ of the antenna connecting wiring 22 can be selected in the range of 0.1 μm to 5.0 μm. Furthermore, the height H ₁ of the antenna wiring 21 (length in the Z direction, see FIG. 3 ) and the height H ₂ of the antenna connecting wiring 22 (length in the Z direction, see FIG. 4 ) are not particularly limited and can be selected appropriately depending on the application, for example, in the range of 0.1 μm to 5.0 μm.

The material of the antenna wiring 21 and the antenna connecting wiring 22 may be any conductive metal material. In this embodiment, the material of the antenna wiring 21 and the antenna connecting wiring 22 is copper, but this is not limited to this. The material of the antenna wiring 21 and the antenna connecting wiring 22 can be, for example, a metal material (including an alloy) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel.

As mentioned above, the wiring board 10 has multiple dummy pattern areas 30. Referring again to FIG. 1, each dummy pattern area 30 is provided to surround the periphery of each antenna pattern area 20, and is formed to surround the entire circumferential area (positive X side, negative X side, positive Y side) of each antenna pattern area 20 except for the power supply unit 40 side (negative Y side). In this case, the dummy pattern area 30 is arranged on the board 11 over almost the entire area except for the antenna pattern area 20 and the power supply unit 40. Unlike the antenna pattern area 20, this dummy pattern area 30 does not actually function as an antenna.

In the illustrated example, the wiring board 10 has three dummy pattern regions 30. That is, the wiring board 10 has a first dummy pattern region 301 adjacent to the antenna pattern region 20, a second dummy pattern region 302 adjacent to the first dummy pattern region 301, and a third dummy pattern region 303 adjacent to the second dummy pattern region 302. Of these, the second dummy pattern region 302 is located farther from the antenna pattern region 20 than the first dummy pattern region 301 and surrounds the first dummy pattern region 301. Furthermore, the third dummy pattern region 303 is located farther from the antenna pattern region 20 than the second dummy pattern region 302 and surrounds the second dummy pattern region 302. The number of dummy pattern regions 30 included in the wiring board 10 is arbitrary and may be, for example, between 2 and 50, or between 2 and 10.

The first dummy pattern region 301 has a pair of first portions 301A extending along the Y direction and a second portion 301B extending along the X direction between the first portions 301A. The width W _a1 of the first portions 301A in the short side direction (X direction) can be selected, for example, in the range of 0.1 mm to 50 mm, and preferably in the range of 0.2 mm to 10 mm, and the width W _a2 of the second portions 301B in the short side direction (Y direction) can be selected, for example, in the range of 0.1 mm to 50 mm, and preferably in the range of 0.2 mm to 10 mm.

The second dummy pattern region 302 has a pair of first portions 302A extending along the Y direction and a second portion 302B extending along the X direction between the first portions 302A. The width W _a3 of the first portions 302A in the short side direction (X direction) can be selected, for example, from a range of 0.1 mm to 50 mm, and preferably from a range of 0.2 mm to 10 mm, and the width W _a4 of the second portions 302B in the short side direction (Y direction) can be selected, for example, from a range of 0.1 mm to 50 mm, and preferably from a range of 0.2 mm to 10 mm.

Here, the width W _a3 of the first portion 302A of the second dummy pattern region 302 may be larger than the width W _a1 of the first portion 301A of the first dummy pattern region 301. As will be described later, in this embodiment, the aperture ratio A22 of the second dummy pattern region 302 is larger than the aperture ratio A21 of the first dummy pattern region 301. Therefore, by making the width W _a3 of the first portion 302A of the second dummy pattern region 302 larger than the width W _a1 of the first portion 301A of the first dummy pattern region 301, the overall aperture ratio of the wiring substrate 10 can be increased, and the transparency of the wiring substrate 10 can be improved. Similarly, the width W _a4 of the second portion 302B may be larger than the width W _a2 of the second portion 301B of the first dummy pattern region 301. This allows the overall aperture ratio of the wiring substrate 10 to be increased, and the transparency of the wiring substrate 10 can be improved.

The third dummy pattern region 303 is arranged to surround multiple antenna pattern regions 20. In the illustrated example, the third dummy pattern region 303 is arranged to surround all of the antenna pattern regions 20. This effectively makes the multiple antenna pattern regions 20 less visible. This third dummy pattern region 303 is arranged over almost the entire area of the substrate 11, excluding the antenna pattern regions 20, the first dummy pattern region 301, the second dummy pattern region 302, and the power supply section 40.

As shown in Figures 2A and 2B, the multiple dummy pattern regions 301, 302, and 303 each include multiple dummy wirings 301a, 302a, and 303a that are electrically independent of the antenna wiring 21 (antenna wiring 21 and antenna connecting wiring 22). Specifically, the first dummy pattern region 301 is composed of repeated dummy wirings 301a having a predetermined unit pattern shape, the second dummy pattern region 302 is composed of repeated dummy wirings 302a having a predetermined unit pattern shape, and the third dummy pattern region 303 is composed of repeated dummy wirings 303a having a predetermined unit pattern shape. In other words, each dummy pattern region 301, 302, and 303 includes multiple dummy wirings 301a, 302a, and 303a of the same shape, and each dummy wiring 301a, 302a, and 303a is electrically independent from the antenna pattern region 20.

The multiple dummy wirings 301a are arranged regularly throughout the first dummy pattern region 301, the multiple dummy wirings 302a are arranged regularly throughout the second dummy pattern region 302, and the multiple dummy wirings 303a are arranged regularly throughout the third dummy pattern region 303. The multiple dummy wirings 301a, 302a, and 303a are spaced apart from one another in the planar direction and are arranged in island shapes protruding above the substrate 11. In other words, each dummy wiring 301a, 302a, and 303a is electrically independent from the antenna pattern region 20, the power supply section 40, and other dummy wirings.

Furthermore, the multiple dummy wirings 301a, 302a, and 303a each have first dummy wiring portions 311, 312, and 313 and second dummy wiring portions 321, 322, and 323. As shown in FIG. 2A, the first dummy wiring portions 311, 312, and 313 of adjacent dummy pattern regions 301, 302, and 303 are arranged parallel to each other. For example, the first dummy wiring portion 311 of the first dummy pattern region 301 and the first dummy wiring portion 312 of the second dummy pattern region 302 are arranged parallel to each other. This makes it difficult to visually recognize the difference between the first dummy pattern region 301 and the second dummy pattern region 302 in the Y direction. Furthermore, the first dummy wiring portion 312 of the second dummy pattern region 302 and the first dummy wiring portion 313 of the third dummy pattern region 303 are arranged parallel to each other. This makes it difficult to visually recognize the difference between the second dummy pattern region 302 and the third dummy pattern region 303 in the Y direction.

Furthermore, as shown in FIG. 2A, the antenna wiring 21 in the antenna pattern region 20 and the first dummy wiring portions 311, 312, and 313 in each of the dummy pattern regions 301, 302, and 303 are arranged parallel to one another. This makes it difficult to visually recognize the difference between the antenna pattern region 20 and each of the dummy pattern regions 301, 302, and 303 in the Y direction.

Also, as shown in FIG. 2B, the second dummy wiring portions 321, 322, and 323 of adjacent dummy pattern regions 301, 302, and 303 are arranged parallel to each other. For example, the second dummy wiring portion 321 of the first dummy pattern region 301 and the second dummy wiring portion 322 of the second dummy pattern region 302 are arranged parallel to each other. This makes it difficult to visually recognize the difference between the first dummy pattern region 301 and the second dummy pattern region 302 in the X direction. Furthermore, the second dummy wiring portion 322 of the second dummy pattern region 302 and the second dummy wiring portion 323 of the third dummy pattern region 303 are arranged parallel to each other. This makes it difficult to visually recognize the difference between the second dummy pattern region 302 and the third dummy pattern region 303 in the X direction.

Furthermore, as shown in FIG. 2B, the antenna connecting wiring 22 in the antenna pattern region 20 and the second dummy wiring portions 321, 322, and 323 in each of the dummy pattern regions 301, 302, and 303 are arranged parallel to one another. This makes it difficult to visually recognize the difference between the antenna pattern region 20 and each of the dummy pattern regions 301, 302, and 303 in the X direction.

Next, we will explain the dummy wirings 301a, 302a, and 303a in more detail. Here, we will first explain the dummy wiring 301a in the first dummy pattern region 301.

(Dummy wiring in the first dummy pattern region)
2A and 2B, the dummy wirings 301a are each approximately L-shaped in a plan view, and have a first dummy wiring portion 311 extending in the Y direction and a second dummy wiring portion 321 extending in the X direction. Of these, the first dummy wiring portion 311 has a predetermined length _L4 (length in the Y direction, see FIG. 2A), and the second dummy wiring portion 321 has a predetermined length _L5 (length in the X direction, see FIG. 2A), which are equal to each other ( _L4 = _L5 ).

Furthermore, in the first dummy pattern region 301, gaps 331a (shaded portions in FIGS. 2A and 2B) are formed between dummy wirings 301a adjacent to each other in the X direction, and gaps 331b (shaded portions in FIGS. 2A and 2B) are formed between dummy wirings 301a adjacent to each other in the Y direction. In this case, the dummy wirings 301a are arranged at equal intervals. That is, the dummy wirings 301a adjacent to each other in the X direction are arranged at equal intervals, and the gap _G1 therebetween can be, for example, in the range of 1 μm to 20 μm. Similarly, the dummy wirings 301a adjacent to each other in the Y direction are arranged at equal intervals, and the gap _G2 therebetween can be, for example, in the range of 1 μm to 20 μm. The maximum values of the gaps _G1 and _G2 may be 0.8 times or less the pitches _P1 and _P2 described above, respectively. In this case, the gap _G1 of the dummy wiring 301a in the X direction is equal to the gap _G2 of the dummy wiring 301a in the Y direction ( _G1 = _G2 ).

In this embodiment, the dummy wiring 301a has a shape in which a portion of the unit pattern shape 20a of the antenna pattern region 20 described above is missing. That is, the shape of the dummy wiring 301a is the L-shaped unit pattern shape 20a of the antenna pattern region 20 minus the above-mentioned voids 331a and 331b. In other words, the shape of the multiple dummy wirings 301a and multiple voids 331a and 331b of the first dummy pattern region 301 combined corresponds to the lattice or mesh shape that forms the antenna pattern region 20. In this way, because the dummy wiring 301a of the first dummy pattern region 301 has a shape in which a portion of the unit pattern shape 20a of the antenna pattern region 20 is missing, the difference between the antenna pattern region 20 and the first dummy pattern region 301 is difficult to visually recognize, and the antenna pattern region 20 arranged on the substrate 11 is less visible.

In FIG. 2A, the antenna pattern region 20 and the first dummy pattern region 301 are adjacent to each other in the Y direction. Near the boundary between the antenna pattern region 20 and the first dummy pattern region 301, the first dummy wiring portion 311 is formed on an extension of the antenna wiring 21. For this reason, the difference between the antenna pattern region 20 and the first dummy pattern region 301 is difficult to visually recognize in the Y direction.

In addition, in FIG. 2B, the antenna pattern region 20 and the first dummy pattern region 301 are adjacent to each other in the X direction. Near the boundary between the antenna pattern region 20 and the first dummy pattern region 301, the second dummy wiring portion 321 is formed on an extension of the antenna connecting wiring 22. For this reason, the difference between the antenna pattern region 20 and the first dummy pattern region 301 is difficult to visually recognize in the X direction.

As shown in FIG. 5, the first dummy wiring portion 311 of each dummy wiring 301a has a cross section (X-direction cross section) perpendicular to its longitudinal direction (Y-direction) that is approximately rectangular or square. Also, as shown in FIG. 4, the second dummy wiring portion 321 of each dummy wiring 301a has a cross section (Y-direction cross section) perpendicular to its longitudinal direction (X-direction) that is approximately rectangular or square. In this case, the cross-sectional shape of the first dummy wiring portion 311 is approximately the same as the cross-sectional shape of the antenna wiring 21, and the cross-sectional shape of the second dummy wiring portion 321 is approximately the same as the cross-sectional shape of the antenna connecting wiring 22.

In this embodiment, the line width _W3 (length in the X direction, see FIG. 5) of the first dummy wiring portion 311 is approximately the same as the line width _W1 of the antenna wiring 21, and the line width _W4 (length in the Y direction, see FIG. 4) of the second dummy wiring portion 321 is approximately the same as the line width _W2 of the antenna connecting wiring 22. In addition, the height _H3 (length in the Z direction, see FIG. 5) of the first dummy wiring portion 311 and the height _H4 (length in the Z direction, see FIG. 4) of the second dummy wiring portion 321 are also approximately the same as the height _H1 of the antenna wiring 21 and the height _H2 of the antenna connecting wiring 22, respectively.

Next, we will explain the dummy wiring 302a in the second dummy pattern region 302.

(Dummy wiring in the second dummy pattern region)
2A and 2B, the dummy wirings 302a are each approximately L-shaped in a plan view, and have a first dummy wiring portion 312 extending in the Y direction and a second dummy wiring portion 322 extending in the X direction. Of these, the first dummy wiring portion 312 has a predetermined length _L6 (length in the Y direction, see FIG. 2A), and the second dummy wiring portion 322 has a predetermined length _L7 (length in the X direction, see FIG. 2A), which are equal to each other ( _L6 = _L7 ).

Furthermore, in the second dummy pattern region 302, gaps 332a (shaded portions in FIGS. 2A and 2B) are formed between dummy wirings 302a adjacent to each other in the X direction, and gaps 332b (shaded portions in FIGS. 2A and 2B) are formed between dummy wirings 302a adjacent to each other in the Y direction. In this case, the dummy wirings 302a are arranged at equal intervals. That is, the dummy wirings 302a adjacent to each other in the X direction are arranged at equal intervals, and the gap _G3 therebetween can be, for example, in the range of 2 μm to 40 μm. Similarly, the dummy wirings 302a adjacent to each other in the Y direction are arranged at equal intervals, and the gap _G4 therebetween can be, for example, in the range of 2 μm to 40 μm. The maximum values of the gaps _G3 and _G4 may be 0.64 times or less the pitches _P1 and _P2 described above, respectively. In this case, the gap _G3 of the dummy wiring 302a in the X direction is equal to the gap _G4 of the dummy wiring 302a in the Y direction ( _G3 = _G4 ).

In this embodiment, the dummy wiring 302a has a shape in which a portion of the above-mentioned dummy wiring 301a is missing. In other words, the dummy wiring 302a has a shape in which a portion of the unit pattern shape 20a in the antenna pattern region 20 is missing. In this case, the shape of the dummy wiring 302a is the L-shaped unit pattern shape 20a in the antenna pattern region 20 minus the above-mentioned voids 332a and 332b. In other words, the shape formed by combining the multiple dummy wirings 302a and the multiple voids 332a and 332b in the second dummy pattern region 302 corresponds to the lattice or mesh shape that forms the antenna pattern region 20. In this way, the dummy wiring 302a in the second dummy pattern region 302 has a shape in which a portion of the dummy wiring 301a in the first dummy pattern region 301 is missing, making it difficult to visually recognize the difference between the first dummy pattern region 301 and the second dummy pattern region 302, and making it difficult to see the first dummy pattern region 301 and the second dummy pattern region 302 arranged on the substrate 11.

In Figure 2A, the first dummy pattern region 301 and the second dummy pattern region 302 are adjacent to each other in the Y direction. Near the boundary between the first dummy pattern region 301 and the second dummy pattern region 302, the first dummy wiring portion 312 of the second dummy pattern region 302 is formed on an extension of the first dummy wiring portion 311 of the first dummy pattern region 301. As a result, the difference between the first dummy pattern region 301 and the second dummy pattern region 302 is difficult to visually recognize in the Y direction. Note that in the illustrated example, the first dummy wiring portion 311 adjacent to the boundary line B1 between the first dummy pattern region 301 and the second dummy pattern region 302 and the first dummy wiring portion 312 adjacent to the boundary line B1 are spaced apart from each other, but this is not limited to this. For example, although not shown, the first dummy wiring portion 311 adjacent to the boundary line B1 and the first dummy wiring portion 312 adjacent to the boundary line B1 may be connected.

In addition, in Figure 2B, the first dummy pattern region 301 and the second dummy pattern region 302 are adjacent to each other in the X direction. Near the boundary between the first dummy pattern region 301 and the second dummy pattern region 302, the second dummy wiring portion 322 of the second dummy pattern region 302 is formed on an extension of the second dummy wiring portion 321 of the first dummy pattern region 301. As a result, the difference between the first dummy pattern region 301 and the second dummy pattern region 302 is difficult to visually recognize in the X direction. Note that in the illustrated example, the second dummy wiring portion 321 adjacent to the boundary line B1 between the first dummy pattern region 301 and the second dummy pattern region 302 and the second dummy wiring portion 322 adjacent to the boundary line B1 are spaced apart from each other, but this is not limited to this. For example, although not shown, the second dummy wiring portion 321 adjacent to the boundary line B1 and the second dummy wiring portion 322 adjacent to the boundary line B1 may be connected.

In this embodiment, the other shapes (cross-sectional shape in the X-direction cross section, line width, and height) of the first dummy wiring portion 312 of the second dummy pattern region 302 are substantially the same as the shape of the first dummy wiring portion 311 of the first dummy pattern region 301, so a detailed description will be omitted here. Furthermore, the other shapes (cross-sectional shape in the Y-direction cross section, line width, and height) of the second dummy wiring portion 322 of the second dummy pattern region 302 are substantially the same as the shape of the second dummy wiring portion 321 of the first dummy pattern region 301, so a detailed description will be omitted here.

Next, we will explain the dummy wiring 303a in the third dummy pattern region 303.

(Dummy wiring in the third dummy pattern area)
2A and 2B, the dummy wirings 303a are each approximately L-shaped in plan view, and have a first dummy wiring portion 313 extending in the Y direction and a second dummy wiring portion 323 extending in the X direction. Of these, the first dummy wiring portion 313 has a predetermined length _L8 (length in the Y direction, see FIG. 2A), and the second dummy wiring portion 323 has a predetermined length _L9 (length in the X direction, see FIG. 2A), which are equal to each other ( _L8 = _L9 ).

Furthermore, in the third dummy pattern region 303, gaps 333a (shaded portions in FIGS. 2A and 2B) are formed between dummy wirings 303a adjacent to each other in the X direction, and gaps 333b (shaded portions in FIGS. 2A and 2B) are formed between dummy wirings 303a adjacent to each other in the Y direction. In this case, the dummy wirings 303a are arranged at equal intervals. That is, the dummy wirings 303a adjacent to each other in the X direction are arranged at equal intervals, and the gap _G5 between them can be, for example, in the range of 6 μm to 60 μm. Similarly, the dummy wirings 303a adjacent to each other in the Y direction are arranged at equal intervals, and the gap _G6 between them can be, for example, in the range of 6 μm to 60 μm. The maximum values of the gaps _G5 and _G6 may be 0.51 times or less the pitches _P1 and _P2 described above, respectively. In this case, the gap _G5 of the dummy wiring 303a in the X direction is equal to the gap _G6 of the dummy wiring 303a in the Y direction ( _G5 = _G6 ).

In this embodiment, the dummy wiring 303a has a shape in which a portion of the above-mentioned dummy wiring 302a is missing. In other words, the dummy wiring 303a has a shape in which a portion of the unit pattern shape 20a in the antenna pattern region 20 is missing. In this case, the shape of the dummy wiring 303a is the L-shaped unit pattern shape 20a in the antenna pattern region 20 minus the above-mentioned voids 333a and 333b. In other words, the shape formed by combining the multiple dummy wirings 303a and the multiple voids 333a and 333b in the third dummy pattern region 303 corresponds to the lattice or mesh shape that forms the antenna pattern region 20. In this way, the dummy wiring 303a in the third dummy pattern region 303 has a shape in which a portion of the dummy wiring 302a in the second dummy pattern region 302 is missing, making it difficult to visually recognize the difference between the second dummy pattern region 302 and the third dummy pattern region 303, and making it difficult to see the second dummy pattern region 302 and the third dummy pattern region 303 arranged on the substrate 11.

In Figure 2A, the second dummy pattern region 302 and the third dummy pattern region 303 are adjacent to each other in the Y direction. Near the boundary between the second dummy pattern region 302 and the third dummy pattern region 303, the first dummy wiring portion 313 of the third dummy pattern region 303 is formed on an extension of the first dummy wiring portion 312 of the second dummy pattern region 302. As a result, the difference between the second dummy pattern region 302 and the third dummy pattern region 303 is difficult to visually recognize in the Y direction. Note that in the illustrated example, the first dummy wiring portion 312 adjacent to the boundary line B2 between the second dummy pattern region 302 and the third dummy pattern region 303 and the first dummy wiring portion 313 adjacent to the boundary line B2 are spaced apart from each other, but this is not limited to this. For example, although not shown, the first dummy wiring portion 312 adjacent to the boundary line B2 and the first dummy wiring portion 313 adjacent to the boundary line B2 may be connected.

In addition, in Figure 2B, the second dummy pattern region 302 and the third dummy pattern region 303 are adjacent to each other in the X direction. Near the boundary between the second dummy pattern region 302 and the third dummy pattern region 303, the second dummy wiring portion 323 of the third dummy pattern region 303 is formed on an extension of the second dummy wiring portion 322 of the second dummy pattern region 302. As a result, the difference between the second dummy pattern region 302 and the third dummy pattern region 303 is difficult to visually recognize in the X direction. Note that in the illustrated example, the second dummy wiring portion 322 adjacent to the boundary line B2 between the second dummy pattern region 302 and the third dummy pattern region 303 and the second dummy wiring portion 323 adjacent to the boundary line B2 are spaced apart from each other, but this is not limited to this. For example, although not shown, the second dummy wiring portion 322 adjacent to the boundary line B2 and the second dummy wiring portion 323 adjacent to the boundary line B1 may be connected.

In this embodiment, the other shapes (cross-sectional shape in the X-direction cross section, line width, and height) of the first dummy wiring portion 313 of the third dummy pattern region 303 are substantially the same as the shape of the first dummy wiring portion 311 of the first dummy pattern region 301, so a detailed description will be omitted here. Furthermore, the other shapes (cross-sectional shape in the Y-direction cross section, line width, and height) of the second dummy wiring portion 323 of the third dummy pattern region 303 are substantially the same as the shape of the second dummy wiring portion 321 of the first dummy pattern region 301, so a detailed description will be omitted here.

The material for the above-mentioned dummy wiring 301a, 302a, and 303a can be the same metal material as the material for the antenna wiring 21 and the antenna connecting wiring 22.

In this embodiment, the antenna pattern region 20, the first dummy pattern region 301, the second dummy pattern region 302, and the third dummy pattern region 303 each have a predetermined aperture ratio A1, A21, A22, and A23. In this case, the aperture ratio A21 of the first dummy pattern region 301 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20, and the aperture ratio A22 of the second dummy pattern region 302 is greater than the aperture ratio A21 of the first dummy pattern region 301. Thus, in this embodiment, the aperture ratios A1, A21, A22, and A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 increase stepwise from the antenna pattern region 20 toward the dummy pattern region 30 farthest from the antenna pattern region 20. That is, the aperture ratio A21 of the first dummy pattern region 301 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20, the aperture ratio A22 of the second dummy pattern region 302 is greater than the aperture ratio A21 of the first dummy pattern region 301, and the aperture ratio A23 of the third dummy pattern region 303 is greater than the aperture ratio A22 of the second dummy pattern region 302 (A23 > A22 > A21 ≧ A1). This ensures the transparency of the wiring substrate 10.

Furthermore, the difference between the aperture ratio A21 of the first dummy pattern region 301 adjacent to the antenna pattern region 20 and the aperture ratio A1 of the antenna pattern region 20 is preferably 0% to 2%, more preferably 0.02% to 1%, and even more preferably 0.08% to 0.5%. Having a difference between the aperture ratio A21 and the aperture ratio A1 of 0% or more increases the transparency of the wiring substrate 10. Furthermore, having a difference between the aperture ratio A21 and the aperture ratio A1 of 2% or less reduces the difference between the aperture ratios A21 and A1, making the boundary between the antenna pattern region 20 and the first dummy pattern region 301 less visible. This makes it difficult to recognize the presence of the antenna pattern region 20 with the naked eye. The difference from the aperture ratio A1 of the antenna pattern region 20 may be 0.1% to 3%.

Furthermore, the difference between the aperture ratios A21, A22, and A23 of adjacent dummy pattern regions 30 (e.g., the difference between aperture ratio A21 and aperture ratio A22) is preferably 0.02% or more and 2% or less, more preferably 0.04% or more and 1% or less, and even more preferably 0.08% or more and 0.5% or less. Having the difference between aperture ratios A21, A22, and A23 be 0.02% or more increases the transparency of the wiring substrate 10. Furthermore, having the difference between aperture ratios A21, A22, and A23 be 2% or less reduces the difference between aperture ratios A21 and A22, for example, making the boundary between the first dummy pattern region 301 and the second dummy pattern region 302 less visible. In this way, the boundary between each dummy pattern region 30 can be made less visible, making the presence of each dummy pattern region 30 less noticeable to the naked eye. The difference in aperture ratios A21, A22, and A23 between adjacent dummy pattern regions 30 may be 0.1% or more and 3% or less.

The aperture ratio A1 of the antenna pattern region 20 described above can be, for example, in the range of 85% to 99.9%. The aperture ratio A21 of the first dummy pattern region 301 can be, for example, in the range of 85% to less than 100%. The aperture ratio A22 of the second dummy pattern region 302 can be, for example, in the range of 86% to less than 100%. The aperture ratio A23 of the third dummy pattern region 303 can be, for example, in the range of 86.5% to less than 100%.

Furthermore, the aperture ratio A3 of the combined antenna pattern region 20 and each dummy pattern region 30 (i.e., the overall aperture ratio of the wiring substrate 10) can be set, for example, in the range of 87% or more and less than 100%. By setting the aperture ratio A3 in this range, the conductivity and transparency of the wiring substrate 10 can be ensured.

The aperture ratio refers to the percentage of the area of the opening area (the area where no metal parts such as the antenna wiring 21, antenna connecting wiring 22, dummy wiring 301a, 302a, 303a, etc. are present and where the substrate 11 is exposed) in a unit area of a specified area (the antenna pattern area 20, the dummy pattern area 30, or the antenna pattern area 20 and the dummy pattern area 30).

Referring again to FIG. 1 , the power supply unit 40 is electrically connected to the antenna pattern area 20. This power supply unit 40 is made of a conductive, thin, rectangular member. The longitudinal direction of the power supply unit 40 is parallel to the X direction, and the lateral direction of the power supply unit 40 is parallel to the Y direction. The power supply unit 40 is located at the longitudinal end (the negative end in the Y direction) of the substrate 11. The power supply unit 40 can be made of, for example, a metal material (including an alloy) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel. When the wiring board 10 is incorporated into the image display device 90 (see FIG. 7 ), this power supply unit 40 is electrically connected to the wireless communication circuit 92 of the image display device 90. While the power supply unit 40 is provided on the surface of the substrate 11, this is not a limitation, and part or all of the power supply unit 40 may be located outside the periphery of the substrate 11.

[Method of manufacturing a wiring board]
Next, a method for manufacturing a wiring board according to this embodiment will be described with reference to Figures 6A to 6F, which are cross-sectional views illustrating the method for manufacturing a wiring board according to this embodiment.

First, as shown in Figure 6A, a transparent substrate 11 is prepared.

Next, an antenna pattern region 20 including multiple antenna wirings 21 and multiple dummy pattern regions 30 arranged around the antenna pattern region 20 and electrically independent from the antenna wirings 21 are formed on the substrate 11. At this time, a conductive layer 51 is first formed over substantially the entire surface of the substrate 11. In this embodiment, the thickness of the conductive layer 51 is 200 nm. However, this is not limited to this, and the thickness of the conductive layer 51 can be appropriately selected within the range of 10 nm to 1000 nm. In this embodiment, the conductive layer 51 is formed by sputtering using copper. Plasma CVD may also be used to form the conductive layer 51.

Next, as shown in FIG. 6B, a photo-curable insulating resist 52 is applied to substantially the entire surface of the substrate 11. Examples of the photo-curable insulating resist 52 include organic resins such as acrylic resins and epoxy resins.

Next, as shown in FIG. 6C, an insulating layer 54 is formed by photolithography. In this case, the photo-curable insulating resist 52 is patterned by photolithography to form an insulating layer 54 (resist pattern) in which trenches 54a are formed. The trenches 54a have a planar shape pattern corresponding to the antenna wiring 21, antenna connecting wiring 22, and dummy wiring 301a, 302a, and 303a. Furthermore, at this time, the insulating layer 54 is formed so that the conductive layer 51 corresponding to the antenna wiring 21, antenna connecting wiring 22, and dummy wiring 301a, 302a, and 303a is exposed.

However, the trenches 54a can also be formed in the surface of the insulating layer 54 by imprinting. In this case, a transparent imprinting mold with protrusions corresponding to the trenches 54a is prepared, the mold is brought close to the substrate 11, and a photo-curable insulating resist 52 is spread between the mold and the substrate 11. Next, light is irradiated from the mold side to harden the photo-curable insulating resist 52, thereby forming the insulating layer 54. As a result, trenches 54a with the shape of the transferred protrusions are formed in the surface of the insulating layer 54. The mold is then peeled off from the insulating layer 54, resulting in the insulating layer 54 having the cross-sectional structure shown in Figure 6C. While not shown, residual insulating material may remain at the bottom of the trenches 54a in the insulating layer 54. Therefore, the residual insulating material is removed by wet processing using a permanganate solution or N-methyl-2-pyrrolidone, or dry processing using oxygen plasma. By removing the residual insulating material in this way, trenches 54a that expose the conductive layer 51 can be formed, as shown in Figure 6C.

Next, as shown in FIG. 6D, the trenches 54a in the insulating layer 54 are filled with a conductor 55. In this embodiment, the trenches 54a in the insulating layer 54 are filled with copper using electroplating, using the conductive layer 51 as a seed layer.

Next, as shown in Figure 6E, the insulating layer 54 is removed. In this case, the insulating layer 54 on the substrate 11 is removed by wet processing using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or by dry processing using oxygen plasma.

Then, as shown in FIG. 6F, the conductive layer 51 on the surface of the substrate 11 is removed. At this time, a wet process using hydrogen peroxide is performed to etch the conductive layer 51 so that the surface of the substrate 11 is exposed. In this manner, a wiring substrate 10 is obtained, which includes the substrate 11 and the antenna pattern region 20 and dummy pattern region 30 arranged on the substrate 11. In this case, the aperture ratio A21 of the first dummy pattern region 301 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20, and the aperture ratio A22 of the second dummy pattern region 302 is greater than the aperture ratio A21 of the first dummy pattern region 301. Furthermore, the aperture ratio A23 of the third dummy pattern region 303 is greater than the aperture ratio A22 of the second dummy pattern region 302. Furthermore, the antenna pattern region 20 includes the antenna wiring 21 and the antenna connecting wiring 22, and the dummy pattern region 30 includes dummy wirings 301a, 302a, and 303a. The above-mentioned conductor 55 includes the antenna wiring 21, the antenna connecting wiring 22, and dummy wiring 301a, 302a, and 303a.

[Operation of this embodiment]
Next, the operation of the wiring board having such a configuration will be described.

As shown in FIG. 7 , the wiring board 10 is incorporated into an image display device 90 having a display (display device) 91. The image display device 90 includes the wiring board 10 and a display 91 laminated on the wiring board 10. The wiring board 10 is disposed on the display 91. Examples of such image display devices 90 include mobile terminal devices such as smartphones and tablets. The antenna pattern region 20 of the wiring board 10 is electrically connected to the wireless communication circuit 92 of the image display device 90 via the power supply section 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the antenna pattern region 20, enabling communication using the image display device 90. Note that each dummy pattern region 30 is separated from the antenna pattern region 20 and is electrically independent, so there is no risk that the presence of each dummy pattern region 30 will affect the transmission and reception of radio waves.

In this embodiment, the wiring board 10 has a transparent substrate 11 and an antenna pattern area 20 disposed on the substrate 11 and including multiple antenna wirings 21, ensuring the transparency of the wiring board 10. As a result, when the wiring board 10 is placed on a display 91, the display 91 can be seen through the openings 23 in the antenna pattern area 20, and the visibility of the display 91 is not obstructed.

A plurality of dummy pattern regions 30 electrically independent from the antenna wiring 21 are arranged around the antenna pattern region 20. The aperture ratio A21 of the first dummy pattern region 301 adjacent to the antenna pattern region 20 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20. The aperture ratio A22 of the second dummy pattern region 302 adjacent to the first dummy pattern region 301 and farther from the wiring pattern region 20 than the first dummy pattern region 301 is greater than the aperture ratio A21 of the first dummy pattern region 301. This makes it possible to make the boundaries between the antenna pattern region 20, the first dummy pattern region 301, and the second dummy pattern region 302 unclear. This makes it possible to make the antenna pattern region 20, the first dummy pattern region 301, and the second dummy pattern region 302 less visible on the surface of the display 91, making it more difficult for a user of the image display device 90 to recognize the antenna pattern region 20, the first dummy pattern region 301, and the second dummy pattern region 302 with the naked eye. Furthermore, because the aperture ratio A21 of the first dummy pattern region 301 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20, and the aperture ratio A22 of the second dummy pattern region 302 is greater than the aperture ratio A21 of the first dummy pattern region 301, the overall aperture ratio A3 of the wiring substrate 10 can be increased even when the boundaries between the antenna pattern region 20, the first dummy pattern region 301, and the second dummy pattern region 302 are made unclear. This ensures the conductivity and transparency of the wiring substrate 10.

Here, in order to improve antenna performance, it is necessary to increase the conductivity of the antenna wiring 21. However, if the line width _W1 of the antenna wiring 21 is increased to increase the conductivity of the antenna wiring 21, for example, the aperture ratio A1 of the antenna pattern region 20 will decrease. In this case, it is possible to provide a dummy pattern region around the antenna pattern region 20 to make the antenna pattern region 20 less visible. On the other hand, if a single dummy pattern region is provided around the antenna pattern region 20 (for example, if a single dummy pattern region is provided over substantially the entire area of the substrate 11 except for the antenna pattern region 20), the aperture ratio A1 of the antenna pattern region 20 will decrease. In order to obscure the boundary between the antenna pattern region 20 and the dummy pattern region, the aperture ratio of the dummy pattern region will also need to be reduced. On the other hand, if the aperture ratio of the dummy pattern region is reduced, the overall aperture ratio A3 of the wiring board 10 will decrease, which may result in the wiring board 10 appearing dark overall. In contrast, according to the present embodiment, the wiring board 10 includes a plurality of dummy pattern regions 30, the aperture ratio A21 of the first dummy pattern region 301 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20, and the aperture ratio A22 of the second dummy pattern region 302 is greater than the aperture ratio A21 of the first dummy pattern region 301. As a result, even if the aperture ratio A1 of the antenna pattern region 20 is reduced, the boundaries between the antenna pattern region 20, the first dummy pattern region 301, and the second dummy pattern region 302 are obscured, while the overall aperture ratio A3 of the wiring board 10 can be increased. This ensures the conductivity and transparency of the wiring board 10.

Furthermore, according to this embodiment, the third dummy pattern region 303 is provided so as to surround the multiple antenna pattern regions 20. This effectively makes the multiple antenna pattern regions 20 less visible.

Furthermore, according to this embodiment, the multiple dummy pattern areas 301, 302, and 303 each include multiple dummy wirings 301a, 302a, and 303a that are electrically independent from the antenna wiring 21. Furthermore, the multiple dummy wirings 301a, 302a, and 303a each have first dummy wiring portions 311, 312, and 313 and second dummy wiring portions 321, 322, and 323. The first dummy wiring portions 311, 312, and 313 of adjacent dummy pattern areas 301, 302, and 303 are arranged parallel to each other. This makes it possible to obscure the boundaries between adjacent dummy pattern areas 301, 302, and 303 in the Y direction, making the dummy pattern areas 301, 302, and 303 difficult to recognize with the naked eye on the surface of the display 91.

In addition, the second dummy wiring portions 321, 322, and 323 of adjacent dummy pattern areas 301, 302, and 303 are arranged parallel to each other. This makes the boundaries between adjacent dummy pattern areas 301, 302, and 303 unclear in the X direction, making the dummy pattern areas 301, 302, and 303 difficult to see with the naked eye on the surface of the display 91.

Furthermore, according to this embodiment, the antenna pattern region 20 further includes a plurality of antenna connecting wirings 22 that connect the plurality of antenna wirings 21. Furthermore, the plurality of dummy pattern regions 301, 302, and 303 include a plurality of dummy wirings 301a, 302a, and 303a that are electrically independent from the antenna wirings 21 and the antenna connecting wirings 22, respectively. Furthermore, the plurality of dummy wirings 301a, 302a, and 303a each have a first dummy wiring portion 311, 312, and 313 and a second dummy wiring portion 321, 322, and 323. The antenna wirings 21 in the antenna pattern region 20 and the first dummy wiring portions 311, 312, and 313 in each of the dummy pattern regions 301, 302, and 303 are arranged parallel to each other. This makes the boundaries between the antenna pattern area 20 and each of the dummy pattern areas 301, 302, and 303 unclear in the Y direction, making the antenna pattern area 20 and each of the dummy pattern areas 301, 302, and 303 difficult to see with the naked eye on the surface of the display 91.

Furthermore, as shown in FIG. 2B, the antenna connecting wiring 22 of the antenna pattern area 20 and the second dummy wiring portions 321, 322, and 323 of each dummy pattern area 301, 302, and 303 are arranged parallel to one another. This makes the boundary between the antenna pattern area 20 and each dummy pattern area 301, 302, and 303 unclear in the X direction, making the antenna pattern area 20 and each dummy pattern area 301, 302, and 303 difficult to recognize with the naked eye on the surface of the display 91.

(Modification)
Next, various modified examples of the wiring board will be described with reference to Figures 8 to 24. Figures 8 to 24 are diagrams showing various modified examples of the wiring board. Each of the modified examples shown in Figures 8 to 24 differs in the configuration of the antenna pattern region 20 and/or the dummy pattern region 30, but the other configurations are substantially the same as those of the above-mentioned embodiment. In Figures 8 to 24, the same parts as those shown in Figures 1 to 7 are given the same reference numerals, and detailed description thereof will be omitted.

(Variation 1)
8 shows a wiring board 10A according to Modification 1. In Fig. 8, a second dummy pattern region 302 is provided so as to surround a plurality of antenna pattern regions 20. In the illustrated example, the second dummy pattern region 302 is provided so as to surround all of the antenna pattern regions 20. In this case as well, the plurality of antenna pattern regions 20 can be effectively made less visible.

Although not shown, the first dummy pattern region 301 may be provided so as to surround multiple antenna pattern regions 20. In this case, the first dummy pattern region 301 may be provided so as to surround all of the antenna pattern regions 20.

(Variation 2)
9 shows a wiring board 10B according to Modification 2. In Fig. 9, the wiring board 10B further includes a surrounding region 50 arranged around the dummy pattern region 30 (in this modification, the second dummy pattern region 302) that is farthest from the antenna pattern region 20. The aperture ratio of the surrounding region 50 is 100%. In other words, the surrounding region 50 does not include dummy wiring.

In this case, the difference in aperture ratio between adjacent dummy pattern regions 30, and the difference in aperture ratio between the peripheral region 50 and the dummy pattern region 30 adjacent to the peripheral region 50, may each be 0.02% or more and 2% or less. Having the above-mentioned difference of 0.02% or more increases the transparency of the wiring substrate 10. Furthermore, having the above-mentioned difference of 2% or less makes it difficult to see the boundary between the dummy pattern region 30 and the peripheral region 50. This makes it difficult to recognize the presence of the antenna pattern region 20 with the naked eye.

In this way, the wiring board 10B further includes a peripheral region 50 arranged around the dummy pattern region 30, which is farthest from the antenna pattern region 20, and the aperture ratio of the peripheral region 50 is 100%, thereby increasing the overall aperture ratio A3 of the wiring board 10B. This increases the transparency of the wiring board 10B.

(Variation 3)
10 shows a wiring board 10C according to Modification 3. In Fig. 10, the antenna wiring 21 and the antenna connecting wiring 22 intersect at an angle, and each opening 23 is formed in a diamond shape in a plan view. The antenna wiring 21 and the antenna connecting wiring 22 are non-parallel to both the X direction and the Y direction.

Furthermore, the first dummy wiring portion 311 of the first dummy pattern region 301, the first dummy wiring portion 312 of the second dummy pattern region 302, and the first dummy wiring portion 313 of the third dummy pattern region 303 each extend parallel to the antenna wiring 21. Similarly, the second dummy wiring portion 321 of the first dummy pattern region 301, the second dummy wiring portion 322 of the second dummy pattern region 302, and the second dummy wiring portion 323 of the third dummy pattern region 303 each extend parallel to the antenna connecting wiring 22.

In this modified example, the boundaries between the antenna pattern area 20 and each dummy pattern area 30 can also be made unclear. This makes it possible to make the antenna pattern area 20 and each dummy pattern area 30 less visible on the surface of the display 91, making it difficult for a user of the image display device 90 to recognize the antenna pattern area 20 and each dummy pattern area 30 with the naked eye. Furthermore, the conductivity and transparency of the wiring board 10C can be ensured.

(Variation 4)
11 shows a wiring board 10D according to Modification 4. In FIG. 11, the line widths of the antenna wiring 21 and the first dummy wiring portions 311, 312, and 313 gradually narrow from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20. That is, the line width of the first dummy wiring portion 311 in the first dummy pattern region 301 is narrower than the line width of the antenna wiring 21 in the antenna pattern region 20. Furthermore, the line width of the first dummy wiring portion 312 in the second dummy pattern region 302 is narrower than the line width of the first dummy wiring portion 311 in the first dummy pattern region 301. Furthermore, the line width of the first dummy wiring portion 313 in the third dummy pattern region 303 is narrower than the line width of the first dummy wiring portion 312 in the second dummy pattern region 302.

In this way, by gradually narrowing the line width of the antenna wiring 21 and the first dummy wiring portions 311, 312, 313 from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20, the aperture ratios A1, A21, A22, A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 can be gradually increased from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20.

In addition, in FIG. 11, the line widths of the antenna connecting wiring 22 and the second dummy wiring portions 321, 322, and 323 gradually narrow from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20. That is, the line width of the second dummy wiring portion 321 in the first dummy pattern region 301 is narrower than the line width of the antenna connecting wiring 22 in the antenna pattern region 20. Furthermore, the line width of the second dummy wiring portion 322 in the second dummy pattern region 302 is narrower than the line width of the second dummy wiring portion 321 in the first dummy pattern region 301. Furthermore, the line width of the second dummy wiring portion 323 in the third dummy pattern region 303 is narrower than the line width of the second dummy wiring portion 322 in the second dummy pattern region 302.

In this way, by gradually narrowing the line width of the antenna connecting wiring 22 and the second dummy wiring portions 321, 322, 323 from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20, the aperture ratios A1, A21, A22, A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 can be gradually increased from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20.

(Variation 5)
12 shows a wiring board 10E according to Modification 5. In FIG. 12, the pitch of the antenna wiring 21 and the first dummy wiring portions 311, 312, and 313 gradually increases from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20. That is, the pitch of the first dummy wiring portions 311 in the first dummy pattern region 301 is larger than the pitch of the antenna wiring 21 in the antenna pattern region 20. Furthermore, the pitch of the first dummy wiring portions 312 in the second dummy pattern region 302 is larger than the pitch of the first dummy wiring portions 311 in the first dummy pattern region 301. Furthermore, the pitch of the first dummy wiring portions 313 in the third dummy pattern region 303 is larger than the pitch of the first dummy wiring portions 312 in the second dummy pattern region 302.

In the illustrated example, the pitch of the first dummy wiring portions 311, 312, and 313 is an integer multiple of the pitch of the antenna wiring 21. Specifically, the pitch of the first dummy wiring portion 311 is twice the pitch of the antenna wiring 21, the pitch of the first dummy wiring portion 312 is three times the pitch of the antenna wiring 21, and the pitch of the first dummy wiring portion 313 is four times the pitch of the antenna wiring 21. Note that the pitch of the first dummy wiring portions 311, 312, and 313 do not have to be an integer multiple of the pitch of the antenna wiring 21.

In this way, by gradually increasing the pitch of the antenna wiring 21 and the first dummy wiring portions 311, 312, 313 from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20, the aperture ratios A1, A21, A22, A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 can be gradually increased from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20.

In addition, in FIG. 12, the pitch of the antenna connecting wiring 22 and the second dummy wiring portions 321, 322, and 323 gradually increases from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20. That is, the pitch of the second dummy wiring portions 321 in the first dummy pattern region 301 is larger than the pitch of the antenna connecting wiring 22 in the antenna pattern region 20. Furthermore, the pitch of the second dummy wiring portions 322 in the second dummy pattern region 302 is larger than the pitch of the second dummy wiring portions 321 in the first dummy pattern region 301. Furthermore, the pitch of the second dummy wiring portions 323 in the third dummy pattern region 303 is larger than the pitch of the second dummy wiring portions 322 in the second dummy pattern region 302.

In the illustrated example, the pitch of the second dummy wiring portions 321, 322, and 323 is an integer multiple of the pitch of the antenna connecting wiring 22. Specifically, the pitch of the second dummy wiring portion 321 is twice the pitch of the antenna connecting wiring 22, the pitch of the second dummy wiring portion 322 is three times the pitch of the antenna connecting wiring 22, and the pitch of the second dummy wiring portion 323 is four times the pitch of the antenna connecting wiring 22. Note that the pitch of the second dummy wiring portions 321, 322, and 323 does not have to be an integer multiple of the pitch of the antenna connecting wiring 22.

In this way, by gradually increasing the pitch of the antenna connecting wiring 22 and the second dummy wiring portions 321, 322, 323 from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20, the aperture ratios A1, A21, A22, A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 can be gradually increased from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20.

(Variation 6)
13 shows a wiring board 10F according to Modification 6. In FIG. 13, first dummy wiring portions 311, 312, and 313 are formed in the shape of dashed lines. Furthermore, the gaps between the dashed first dummy wiring portions 311, 312, and 313 gradually increase in length from the dummy pattern region 30 adjacent to the antenna pattern region 20 toward the dummy pattern region 30 farthest from the antenna pattern region 20. That is, the gaps between the first dummy wiring portions 312 in the second dummy pattern region 302 are longer than the gaps between the first dummy wiring portions 311 in the first dummy pattern region 301. Furthermore, the gaps between the first dummy wiring portions 313 in the third dummy pattern region 303 are longer than the gaps between the first dummy wiring portions 312 in the second dummy pattern region 302.

In this way, by forming the first dummy wiring portions 311, 312, 313 in a dashed line shape and gradually increasing the length of the gaps between the dashed first dummy wiring portions 311, 312, 313 from the dummy pattern region 30 adjacent to the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20, the aperture ratios A1, A21, A22, A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 can be gradually increased from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20.

In addition, in FIG. 13, the second dummy wiring portions 321, 322, and 323 are formed in the shape of dashed lines. Furthermore, the gaps between the dashed-line-formed second dummy wiring portions 321, 322, and 323 gradually become longer from the dummy pattern region 30 adjacent to the antenna pattern region 20 toward the dummy pattern region 30 farthest from the antenna pattern region 20. That is, the gap between the second dummy wiring portion 322 in the second dummy pattern region 302 is longer than the gap between the second dummy wiring portion 321 in the first dummy pattern region 301. Furthermore, the gap between the second dummy wiring portion 323 in the third dummy pattern region 303 is longer than the gap between the second dummy wiring portion 322 in the second dummy pattern region 302.

In this way, by forming the second dummy wiring portions 321, 322, 323 in a dashed line shape and gradually increasing the length of the gaps between the dashed second dummy wiring portions 321, 322, 323 from the dummy pattern region 30 adjacent to the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20, the aperture ratios A1, A21, A22, A23 of the antenna pattern region 20 and the multiple dummy pattern regions 30 can be gradually increased from the antenna pattern region 20 toward the dummy pattern region 30 farther from the antenna pattern region 20.

(Variation 7)
Fig. 14 shows a wiring board 10G according to Modification 7. In Fig. 14, the boundary line B between the antenna pattern region 20 and the first dummy pattern region 301, the boundary line B1 between the first dummy pattern region 301 and the second dummy pattern region 302, and the boundary line B2 between the second dummy pattern region 302 and the third dummy pattern region 303 are each formed in a zigzag pattern.

In this modified example, the boundaries between the antenna pattern area 20 and each dummy pattern area 30 can be made less clear. This makes it difficult to see the antenna pattern area 20 and each dummy pattern area 30 on the surface of the display 91, making it difficult for a user of the image display device 90 to recognize the antenna pattern area 20 and each dummy pattern area 30 with the naked eye.

(Variation 8)
Fig. 15 shows a wiring board 10H according to Modification 8. In Fig. 15, the boundary line B between the antenna pattern region 20 and the first dummy pattern region 301, the boundary line B1 between the first dummy pattern region 301 and the second dummy pattern region 302, and the boundary line B2 between the second dummy pattern region 302 and the third dummy pattern region 303 are each formed in a wave shape.

In this modified example, the boundaries between the antenna pattern area 20 and each dummy pattern area 30 can also be made less clear. This makes it possible to make the antenna pattern area 20 and each dummy pattern area 30 less visible on the surface of the display 91, making it more difficult for a user of the image display device 90 to recognize the antenna pattern area 20 and each dummy pattern area 30 with the naked eye.

(Variation 9)
16 and 17 show a wiring board 10I according to Modification 9. In Fig. 16 and 17, at least a part of the outer edge of the first dummy pattern region 301 has an arc shape.

As described above, the antenna pattern region 20 has a rectangular shape in a planar view. In this case, the outer edge of the antenna pattern region 20 includes a pair of first sides 201 extending in the longitudinal direction (Y direction) and a pair of second sides 202 extending in the width direction (X direction) in a planar view. The first sides 201 and second sides 202 intersect with each other. Note that the antenna wiring 21 or the antenna connecting wiring 22 does not have to overlap the first side 201 of the outer edge of the antenna pattern region 20 so as to be parallel to the first side 201. Similarly, the antenna wiring 21 or the antenna connecting wiring 22 does not have to overlap the second side 202 of the outer edge of the antenna pattern region 20 so as to be parallel to the second side 202. In other words, the first side 201 and the second side 202 of the outer edge of the antenna pattern region 20 are the sides on which the outermost portions (the sides farthest from the antenna pattern region 20) of the antenna wiring 21 or the antenna connecting wiring 22 are located.

Here, as shown in FIG. 17, the vertex where the first side 201 and the second side 202 intersect is defined as the first vertex V1. The extension line of the first side 201 extending from the first vertex V1 is defined as the first virtual line IL1. The extension line of the second side 202 extending from the first vertex V1 is defined as the second virtual line IL2. In this case, in the region R1 sandwiched between the first virtual line IL1 and the second virtual line IL2, the outer edge of the first dummy pattern region 301 has an arc shape centered at the first vertex V1. That is, the boundary line B1 between the first dummy pattern region 301 and the second dummy pattern region 302 is formed in the shape of an arc centered at the first vertex V1 in the region R1.

In addition, in region R1 sandwiched between first virtual line IL1 and second virtual line IL2, the outer edge of second dummy pattern region 302 has an arc shape centered at first vertex V1. That is, boundary line B2 between second dummy pattern region 302 and third dummy pattern region 303 is formed in region R1 as an arc shape centered at first vertex V1. As mentioned above, the number of dummy pattern regions 30 provided on wiring board 10 (wiring board 10I) is arbitrary and may be, for example, approximately 2 to 50, or approximately 2 to 10. In this case, the outer edge of each dummy pattern region 30 may have an arc shape centered at first vertex V1.

Here, if the antenna pattern region 20 has a rectangular shape in a planar view, the boundary of the antenna pattern region 20 may be easily visible near the corners of the rectangular shape (e.g., the first vertex V1). Furthermore, in this case, due to the reflection of visible light, etc., streaks of light may be visible extending outward (away from the antenna pattern region 20) from the corners of the rectangular shape, non-parallel to both the X and Y directions. In contrast, according to this modified example, in the region R1 between the first virtual line IL1 and the second virtual line IL2, the outer edge of the first dummy pattern region 301 has an arc shape centered at the first vertex V1. This effectively makes the antenna pattern region 20 and the streaks of light less visible, even if the antenna pattern region 20 has a rectangular shape in a planar view.

Furthermore, according to this modified example, in the region R1 sandwiched between the first virtual line IL1 and the second virtual line IL2, the outer edge of the second dummy pattern region 302 has an arc shape centered on the first vertex V1. This makes it even more effective at making the antenna pattern region 20 and the light streaks less visible.

Furthermore, in this modified example, as shown in FIG. 18, the antenna pattern region 20 may be provided in a corner 91a of the display 91 in the image display device. FIG. 18 shows an image display device 90A according to the modified example. In this modified example, each dummy pattern region 30 is formed to surround the entire circumferential area (negative X side and positive Y side) of the antenna pattern region 20 except for the positive X side and negative Y side (the power supply unit 40 side). In this case, the above-mentioned light streaks can be made even less visible.

(Variation 10)
19 shows a wiring board 10J according to Modification 10. In Fig. 19, the wiring board 10J has a single dummy pattern region 30. That is, the wiring board 10J has only a first dummy pattern region 301 adjacent to the antenna pattern region 20.

In this modified example, in the region R1 between the first virtual line IL1 and the second virtual line IL2, the outer edge of the first dummy pattern region 301 has an arc shape centered on the first vertex V1. This effectively makes the antenna pattern region 20 and the light streaks less visible, even if the antenna pattern region 20 has a rectangular shape in a plan view.

(Modification 11)
FIG. 20 shows a wiring board 10K according to Modification 11. In FIG. 20 , the antenna pattern area 20 has a base end portion 203 on the power supply unit 40 side and a tip end portion 204 connected to the base end portion 203. The base end portion 203 and the tip end portion 204 each have a rectangular shape in a plan view. In this case, the length (distance in the Y direction) of the tip end portion 204 is longer than the length (distance in the Y direction) of the base end portion 203, and the width (distance in the X direction) of the tip end portion 204 is wider than the width (distance in the X direction) of the base end portion 203. Even in this case, the antenna pattern area 20 can be effectively made less visible. In the illustrated example, the wiring board 10K includes two dummy pattern areas 30 (301, 302). However, this is not limited to this, and the wiring board 10K may include three or more dummy pattern areas 30. In this case, the outer edge of each dummy pattern region 30 may have an arc shape centered at the first vertex V1.

(Variation 12)
Fig. 21 shows a wiring board 10L according to Modification 12. In Fig. 21, the outer edge of the first dummy pattern region 301 does not have an arc shape centered on the first vertex V1.

In this case, the outer edge of the first dummy pattern region 301 includes, in a plan view, a pair of third sides 3011 extending in the longitudinal direction (Y direction) and a fourth side 3012 extending in the width direction (X direction). The third side 3011 and the fourth side 3012 intersect with each other. Note that the first dummy wiring portion 311 or the second dummy wiring portion 321 does not have to overlap the third side 3011 of the outer edge of the first dummy pattern region 301 so as to be parallel to the third side 3011. Similarly, the first dummy wiring portion 311 or the second dummy wiring portion 321 does not have to overlap the fourth side 3012 of the outer edge of the first dummy pattern region 301 so as to be parallel to the fourth side 3012. That is, the third side 3011 and fourth side 3012 of the outer edge of the first dummy pattern region 301 are the sides on which the outermost (side farthest from the antenna pattern region 20) portion of the first dummy wiring portion 311 or the second dummy wiring portion 321 is located.

21 , the vertex where the third side 3011 and the fourth side 3012 intersect is defined as the second vertex V2. The extension of the third side 3011 extending from the second vertex V2 is defined as the third virtual line IL3. The extension of the fourth side 3012 extending from the second vertex V2 is defined as the fourth virtual line IL4. In this case, in the region R2 sandwiched between the third virtual line IL3 and the fourth virtual line IL4, the outer edge of the second dummy pattern region 302 has an arc shape centered on the second vertex V2. As described above, the number of dummy pattern regions 30 included in the wiring board 10 (wiring board 10L) is arbitrary and may be, for example, between 2 and 50, or between 2 and 10. In this case, the outer edge of each dummy pattern region 30 other than the first dummy pattern region 301 may have an arc shape centered on the second vertex V2.

As described above, the aperture ratio A21 of the first dummy pattern region 301 is equal to or greater than the aperture ratio A1 of the antenna pattern region 20. Here, when the aperture ratio A21 is equal to the aperture ratio A1, it is possible to prevent the boundary of the antenna pattern region 20 from becoming easily visible near the corners of the antenna pattern region 20 (e.g., the first vertex V1). Therefore, in the region R1 sandwiched between the first virtual line IL1 and the second virtual line IL2, even if the outer edge of the first dummy pattern region 301 does not have an arc shape centered on the first vertex V1, it is possible to make the antenna pattern region 20 and the light streak less visible.

On the other hand, in this case, the aperture ratio A21 of the first dummy pattern region 301 may be smaller than the aperture ratio A22 of the second dummy pattern region 302. In other words, in order to increase the overall aperture ratio A3 of the wiring substrate 10L, the aperture ratio A22 of the second dummy pattern region 302 may be larger than the aperture ratio A21 of the first dummy pattern region 301.

Here, if the outer edge of the first dummy pattern region 301 includes a third side 3011 and a fourth side 3012 that intersect with each other in a planar view, the boundary of the first dummy pattern region 301 may be easily visible near the second vertex V2 where the third side 3011 and the fourth side 3012 intersect. In this case, due to the reflection of visible light or the like, a streak of light may be visible extending outward from the second vertex V2 so as to be non-parallel to both the X and Y directions. In contrast, according to this modification, in the region R2 between the third virtual line IL3 and the fourth virtual line IL4, the outer edge of the second dummy pattern region 302 has an arc shape centered at the second vertex V2. This effectively makes the first dummy pattern region 301 and the streak of light less visible.

(Variation 13)
22 shows a wiring board 10M according to Modification 13. In FIG. 22, the antenna pattern region 20 has a rectangular shape with rounded corners in a plan view. Therefore, the antenna pattern region 20 does not have a shape that includes corners that could make the boundary of the antenna pattern region 20 more visible. Therefore, even if the outer edge of the first dummy pattern region 301 does not have an arc shape centered on the first vertex V1 in the above-described region R1 (see FIG. 21, etc.), the antenna pattern region 20 and the light streak can be made less visible.

Also in this modified example, in the region R2 sandwiched between the third virtual line IL3 and the fourth virtual line IL4, the outer edge of the second dummy pattern region 302 may have an arc shape centered on the second vertex V2. This effectively makes the first dummy pattern region 301 and the light streaks less visible.

(Variation 14)
FIG. 23 shows a wiring board 10N according to Modification 14. In FIG. 23, the antenna pattern area 20 has a pair of first transmitting units 205 connected to the power supply unit 40, a pair of second transmitting units 206 connected to each of the first transmitting units 205, and a transceiver unit 207 connected to the pair of second transmitting units 206. Each of the pair of first transmitting units 205 extends in the longitudinal direction (Y direction) of the antenna pattern area 20. Each of the pair of second transmitting units 206 extends at an angle with respect to the Y direction so as to approach each other toward the positive side of the Y direction. In plan view, the transceiver unit 207 has a rectangular shape including a diagonal extending in the X direction and a diagonal extending in the Y direction.

In this modified example, if the aperture ratio A21 of the first dummy pattern region 301 is equal to the aperture ratio A1, the antenna pattern region 20 and the light streaks can be made less visible.

Also in this modified example, in the region R2 sandwiched between the third virtual line IL3 and the fourth virtual line IL4, the outer edge of the second dummy pattern region 302 may have an arc shape centered on the second vertex V2. This effectively makes the first dummy pattern region 301 and the light streaks less visible.

(Variation 15)
Fig. 24 shows a wiring board 10O according to Modification 15. In Fig. 24, a transmitting/receiving section 207 has a circular shape in a plan view.

In this modified example, if the aperture ratio A21 of the first dummy pattern region 301 is equal to the aperture ratio A1, the antenna pattern region 20 and the light streaks can be made less visible.

Also in this modified example, in the region R2 sandwiched between the third virtual line IL3 and the fourth virtual line IL4, the outer edge of the second dummy pattern region 302 may have an arc shape centered on the second vertex V2. This effectively makes the first dummy pattern region 301 and the light streaks less visible.

The multiple components disclosed in the above embodiment and each modified example may be combined as needed. Alternatively, some components may be omitted from all of the components shown in the above embodiment and each modified example.

10, 10A to 10O: Wiring board 11: Substrate 20: Antenna pattern area 30: Dummy pattern area 50: Surrounding area 90, 90A: Image display device 91: Display 91
91a Corner 201 First side 202 Second side 301 First dummy pattern area 301a Dummy wiring 302 Second dummy pattern area 302a Dummy wiring 303 Third dummy pattern area 303a Dummy wiring 311 First dummy wiring portion 312 First dummy wiring portion 313 First dummy wiring portion 321 Second dummy wiring portion 322 Second dummy wiring portion 323 Second dummy wiring portion 3011 Third side 3012 Fourth side IL1 First virtual line IL2 Second virtual line IL3 Third virtual line IL4 Fourth virtual line R1 Region R2 Region V1 First vertex V2 Second vertex

Claims (14)

A wiring board,
A substrate;
a wiring pattern area disposed on the substrate and including a plurality of wirings;
a plurality of dummy pattern regions arranged around the wiring pattern region and electrically independent from the wiring;
The substrate is transparent,
an aperture ratio of a first dummy pattern region adjacent to the wiring pattern region among the plurality of dummy pattern regions is equal to or greater than the aperture ratio of the wiring pattern region;
a second dummy pattern region, among the plurality of dummy pattern regions, adjacent to the first dummy pattern region and farther from the wiring pattern region than the first dummy pattern region, has an aperture ratio greater than the aperture ratio of the first dummy pattern region;
the outer edge of the wiring pattern region includes a first side and a second side that intersect with each other in a plan view,
a vertex where the first side and the second side intersect is defined as a first vertex;
an extension line of the first side extending from the first vertex is defined as a first virtual line;
When an extension line of the second side extending from the first vertex is defined as a second virtual line,
In a region sandwiched between the first virtual line and the second virtual line, the outer edge of the first dummy pattern region has an arc shape centered on the first vertex. 2. The wiring board according to claim 1 , wherein in the region sandwiched between the first virtual line and the second virtual line, the outer edge of the second dummy pattern region has an arc shape centered on the first vertex. 3. The wiring board according to claim 1, wherein a plurality of said wiring pattern regions are present, and at least one of said dummy pattern regions is provided so as to surround said plurality of wiring pattern regions. 4. The wiring board according to claim 1, wherein the opening ratios of the wiring pattern region and the plurality of dummy pattern regions gradually increase from the wiring pattern region toward the dummy pattern region farthest from the wiring pattern region, the difference between the opening ratio of the first dummy pattern region and the opening ratio of the wiring pattern region is 0% or more and 2% or less, and the difference between the opening ratios of adjacent dummy pattern regions is 0.02% or more and 2 % or less. 5. The wiring board according to claim 1 , further comprising a peripheral region disposed around the dummy pattern region farthest from the wiring pattern region, wherein the aperture ratio of the peripheral region is 100%. 6. The wiring board of claim 5, wherein the opening ratios of the wiring pattern region and the plurality of dummy pattern regions gradually increase from the wiring pattern region toward the dummy pattern region farthest from the wiring pattern region, the difference between the opening ratio of the first dummy pattern region and the opening ratio of the wiring pattern region is 0% or more and 2 % or less, and the difference in opening ratio between adjacent dummy pattern regions and the difference in opening ratio between the surrounding region and the dummy pattern region adjacent to the surrounding region are each 0.02% or more and 2% or less. A wiring board,
A substrate;
a wiring pattern area disposed on the substrate and including a plurality of wirings;
a plurality of dummy pattern regions arranged around the wiring pattern region and electrically independent from the wiring;
The substrate is transparent,
an aperture ratio of a first dummy pattern region adjacent to the wiring pattern region among the plurality of dummy pattern regions is smaller than an aperture ratio of a second dummy pattern region adjacent to the first dummy pattern region and farther from the wiring pattern region than the first dummy pattern region among the plurality of dummy pattern regions;
an outer edge of the first dummy pattern region includes a third side and a fourth side that intersect with each other in a plan view;
a vertex where the third side and the fourth side intersect is a second vertex;
an extension line of the third side extending from the second vertex is defined as a third virtual line;
When an extension line of the fourth side extending from the second vertex is defined as a fourth virtual line,
In the region sandwiched between the third virtual line and the fourth virtual line, the outer edge of the second dummy pattern region has an arc shape centered on the second vertex. 8. The wiring board according to claim 1, wherein the plurality of dummy pattern regions each include a plurality of dummy wirings electrically independent from the wirings, and the plurality of dummy wirings each have a first dummy wiring portion and a second dummy wiring portion, and the first dummy wiring portions of adjacent dummy pattern regions are arranged parallel to each other, and the second dummy wiring portions of adjacent dummy pattern regions are arranged parallel to each other. 9. The wiring substrate according to claim 1, wherein the wiring pattern region further includes a plurality of connecting wires that connect the plurality of wirings, the plurality of dummy pattern regions each include a plurality of dummy wires that are electrically independent of the wirings and the connecting wires, the plurality of dummy wires each have a first dummy wiring portion and a second dummy wiring portion, the wirings and the first dummy wiring portion of each dummy pattern region are arranged parallel to each other, and the connecting wires and the second dummy wiring portion of each dummy pattern region are arranged parallel to each other. A wiring board,
A substrate;
a wiring pattern area disposed on the substrate and including a plurality of wirings;
a dummy pattern area disposed around the wiring pattern area and electrically independent from the wiring,
The substrate is transparent,
the outer edge of the wiring pattern region includes a first side and a second side that intersect with each other in a plan view,
a vertex where the first side and the second side intersect is defined as a first vertex;
an extension line of the first side extending from the first vertex is defined as a first virtual line;
When an extension line of the second side extending from the first vertex is defined as a second virtual line,
In the region sandwiched between the first virtual line and the second virtual line, the outer edge of the dummy pattern region has an arc shape centered on the first vertex. The wiring board according to claim 1 , having a radio wave transmitting and receiving function. The wiring substrate according to any one of claims 1 to 11 ,
a display device laminated on the wiring substrate,
The image display device, wherein the wiring pattern area is provided in a corner of the display device. A method for manufacturing a wiring substrate,
providing a substrate;
forming, on the substrate, a wiring pattern region including a plurality of wirings, and a dummy pattern region disposed around the wiring pattern region and electrically independent from the wirings;
The substrate is transparent,
the outer edge of the wiring pattern region includes a first side and a second side that intersect with each other in a plan view,
a vertex where the first side and the second side intersect is defined as a first vertex;
an extension line of the first side extending from the first vertex is defined as a first virtual line;
When an extension line of the second side extending from the first vertex is defined as a second virtual line,
In the region sandwiched between the first virtual line and the second virtual line, the outer edge of the dummy pattern region has an arc shape centered on the first vertex. A method for manufacturing a wiring substrate,
providing a substrate;
forming, on the substrate, a wiring pattern region including a plurality of wirings, and a plurality of dummy pattern regions arranged around the wiring pattern region and electrically independent from the wirings;
The substrate is transparent,
an aperture ratio of a first dummy pattern region adjacent to the wiring pattern region among the plurality of dummy pattern regions is smaller than an aperture ratio of a second dummy pattern region adjacent to the first dummy pattern region and farther from the wiring pattern region than the first dummy pattern region among the plurality of dummy pattern regions;
an outer edge of the first dummy pattern region includes a third side and a fourth side that intersect with each other in a plan view;
a vertex where the third side and the fourth side intersect is a second vertex;
an extension line of the third side extending from the second vertex is defined as a third virtual line;
When an extension line of the fourth side extending from the second vertex is defined as a fourth virtual line,
In the region sandwiched between the third virtual line and the fourth virtual line, the outer edge of the second dummy pattern region has an arc shape centered on the second vertex.