JP7806821B2 - Exposure apparatus and manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus and a manufacturing method.

In the lithography process used to manufacture electronic devices such as liquid crystal display elements and semiconductor elements, an exposure apparatus is used to transfer a pattern formed on a mask (or reticle) onto a substrate (such as a substrate made of glass or plastic, or a semiconductor wafer) using an energy beam.

In this type of exposure apparatus, a substrate transport device is used to remove exposed substrates from the stage device that holds the substrates, and to load new substrates onto the stage device. One known substrate transport method is described in Patent Document 1, for example.

International Publication No. 2013/150787

The exposure apparatus includes an optical system that irradiates a substrate, a stage device that moves while holding the substrate, a holder that holds the substrate, a chamber that houses the optical system, the stage device, and the holder, and a control device that moves the stage device. The stage device includes a holder that is positioned so that it can hold the substrate while the substrate is located within the opening of the chamber. The control device, while the stage device is positioned below the holder, causes the holder to hold a portion of the substrate held by the holder that does not overlap with the exposure area, and, while the holding device holds this portion of the substrate so that the stage device receives the substrate from the holder, moves the stage device away from the holder, and causes the optical system to irradiate the substrate while moving the stage device holding the substrate relative to the optical system.

The configuration of the embodiments described below may be modified as appropriate, and at least a portion of it may be replaced with other components. Furthermore, components that are not specifically limited in their placement may be placed in any location that achieves their function, not limited to the placement disclosed in the embodiments.

FIG. 1A is a diagram that shows a schematic view of an exposure apparatus according to a first embodiment, and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A. FIG. 2 is a cross-sectional view of FIG. 3A is a diagram showing the substrate loading/unloading unit of FIG. 1A taken out, and FIG. 3B is a diagram showing the substrate loading/unloading unit of FIG. 3A as viewed from the +X side. 4A and 4B are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1A, respectively, and are diagrams (part 1) for explaining the substrate exchange operation of the first embodiment. 5A and 5B are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1A, respectively, and are diagrams (part 2) for explaining the substrate exchange operation of the first embodiment. 6A and 6B are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1A, respectively, and are diagrams (part 3) for explaining the substrate exchange operation of the first embodiment. 7A and 7B are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1A, respectively, and are diagrams (part 4) for explaining the substrate exchange operation of the first embodiment. 8A and 8B are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1A, respectively, and are diagrams (part 5) for explaining the substrate exchange operation of the first embodiment. 9A and 9B are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1A, respectively, and are diagrams (part 6) for explaining the substrate exchange operation of the first embodiment. 10(a) and 10(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are figures (part 7) for explaining the substrate exchange operation of the first embodiment. 11(a) and 11(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 8) for explaining the substrate exchange operation of the first embodiment. FIG. 1 is a diagram (part 1) showing an exposure apparatus according to a second embodiment. FIG. 10 is a diagram (part 2) showing the exposure apparatus according to the second embodiment. FIG. 11 is a cross-sectional view of an exposure apparatus according to a third embodiment. 15A and 15B are a plan view and a longitudinal sectional view of the vicinity of the stage device, respectively, and are diagrams (part 1) for explaining the substrate exchange operation of the third embodiment. 16A and 16B are a plan view and a longitudinal sectional view of the vicinity of the stage device, and are diagrams (part 2) for explaining the substrate exchange operation of the third embodiment. 17A and 17B are a plan view and a longitudinal sectional view of the vicinity of the stage device, respectively, and are views (part 3) for explaining the substrate exchange operation of the third embodiment. 18A and 18B are a plan view and a longitudinal sectional view of the vicinity of the stage device, respectively, and are diagrams (part 4) for explaining the substrate exchange operation of the third embodiment. 19(a) and 19(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device of the exposure apparatus according to the fourth embodiment, and are views (part 1) for explaining the substrate exchange operation. 20(a) and 20(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device of the exposure apparatus according to the fourth embodiment, and are views (part 2) for explaining the substrate exchange operation. 21A and 21B are diagrams for explaining a substrate carry-in/out unit according to the fifth embodiment. 22(a) and 22(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the sixth embodiment, and are views (part 1) for explaining the substrate exchange operation. 23(a) and 23(b) are a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to the sixth embodiment, and are views (part 2) for explaining the substrate exchange operation. FIG. 13 is a longitudinal sectional view of the exposure apparatus according to the sixth embodiment, and is a view (part 3) for explaining the substrate replacement operation. FIG. 13 is a vertical cross-sectional view of an exposure apparatus according to a seventh embodiment. 26(a) and 26(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the eighth embodiment, and are views (part 1) for explaining the substrate replacement operation. 27(a) and 27(b) are diagrams (part 2) for explaining the substrate replacement operation of the eighth embodiment. 28(a) and 28(b) are diagrams (part 3) for explaining the substrate replacement operation of the eighth embodiment. 29(a) and 29(b) are diagrams (part 4) for explaining the substrate replacement operation of the eighth embodiment. 30(a) and 30(b) are diagrams (part 5) for explaining the substrate replacement operation of the eighth embodiment. 31(a) and 31(b) are a horizontal cross-sectional view and a vertical cross-sectional view of the exposure apparatus according to the ninth embodiment, and are views (part 1) for explaining the substrate exchange operation. 32(a) and 32(b) are views (part 2) for explaining the substrate exchange operation in the exposure apparatus according to the ninth embodiment. 33(a) and 33(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 1) for explaining the substrate replacement operation. 34(a) and 34(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 2) for explaining the substrate replacement operation. 35(a) and 35(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to an eleventh embodiment, and are views (part 1) for explaining the substrate exchange operation. 36(a) and 36(b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the eleventh embodiment, and are views (part 2) for explaining the substrate exchange operation. 37(a) and 37(b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the eleventh embodiment, and are views (part 3) for explaining the substrate replacement operation. 38(a) to 38(c) are vertical cross-sectional views of the exposure apparatus according to the eleventh embodiment, and are views (part 4) for explaining the substrate exchange operation. 39(a) is a vertical cross-sectional view of the vicinity of the partition member according to the twelfth embodiment, and FIG. 39(b) is a cross-sectional view taken along line BB of FIG. 39(a). 40(a) and 40(b) are diagrams (part 1) for explaining the substrate replacement operation in the twelfth embodiment. 41(a) to 41(c) are diagrams (part 2) for explaining the substrate replacement operation in the twelfth embodiment. FIG. 10 is a diagram for explaining a modified example (part 1) of the board feeder. 43(a) and 43(b) are diagrams for explaining a modified example (part 2) of the board feeder.

First Embodiment
A first embodiment of the present invention will be described below with reference to FIGS. 1 to 11. FIG.

Figure 1(a) is a longitudinal cross-sectional view that schematically illustrates the configuration of an exposure apparatus 100 according to the first embodiment. Figure 1(b) shows a cross-sectional view taken along line A-A in Figure 1(a), and Figure 2 shows a transverse cross-sectional view of Figure 1(a). For convenience, the chamber 200 and illumination system 12 are omitted from Figure 1(b).

As shown in FIG. 1(a), the exposure apparatus 100 comprises a chamber 200, and an exposure apparatus main body 10, a substrate transfer unit 150, and a substrate slide hand 140 housed within the chamber 200. An external transfer robot 300 is provided outside the chamber 200 of the exposure apparatus 100, and the external transfer robot 300 transfers substrates P from an external device (not shown) to the exposure apparatus 100 and from the exposure apparatus 100 to the external device.

(Chamber 200)
The chamber 200 forms a space in which the internal environment (at least one of temperature, humidity, pressure, and cleanliness) is adjusted, and an opening 200a used for loading and unloading the substrate P is formed in part of the space.

(Exposure device main body 10)
The exposure apparatus main body 10 is a step-and-scan projection exposure apparatus, or so-called scanner, that uses a rectangular (square) glass substrate P (hereinafter simply referred to as substrate P) used in, for example, a liquid crystal display device (flat panel display) as the exposure object.

The exposure apparatus main body 10 includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, a stage device 20 that holds a substrate P whose surface (the surface facing the +Z side in Figure 1(a)) is coated with resist (sensitizer), and a control system for these components. In the following explanation, as shown in Figure 1(a), the X-axis, Y-axis, and Z-axis are set to be mutually orthogonal to each other with respect to the exposure apparatus main body 10, and the mask M and substrate P are respectively scanned along the X-axis with respect to the projection optical system 16 during exposure, with the Y-axis set within a horizontal plane. The rotation (tilt) directions around the X-axis, Y-axis, and Z-axis will be referred to as the θx, θy, and θz directions, respectively. Positions along the X-axis, Y-axis, and Z-axis will be referred to as the X-position, Y-position, and Z-position, respectively.

Illumination system 12 is configured similarly to the illumination system disclosed in, for example, U.S. Pat. No. 5,729,331, and irradiates exposure illumination light (illumination light) IL onto mask M. As illumination light IL, light including at least one wavelength selected from the i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) is used. Furthermore, the light source used in illumination system 12 and the wavelength of illumination light IL emitted from the light source are not particularly limited, and may be, for example, ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as _F2 laser light (wavelength 157 nm).

The mask stage 14 holds a transmissive mask M. The mask stage 14 is mounted in a non-contact state on a pair of mask stage guides 218 fixed to the lens barrel base 216. The pair of mask stage guides 218 are rectangular column-shaped members with their longitudinal direction along the X axis and are spaced a predetermined distance apart along the Y axis, as shown in FIG. 1(b). The mask stage 14 is driven by a mask stage drive system (not shown) including, for example, a linear motor, at a predetermined stroke in the scanning direction (X axis). The mask stage 14 is also driven by a fine-motion drive system that moves its X and Y positions by a stroke to adjust its relative position with respect to at least one of the illumination system 12, stage device 20, and projection optical system 16. Position information for the mask stage 14 is obtained by a mask stage position measurement system (not shown) including, for example, a linear encoder system and an interferometer system.

The projection optical system 16 is supported by the barrel base 216 below (on the -Z side of) the mask stage 14. The projection optical system 16 is a so-called multi-lens type projection optical system with a configuration similar to that of the projection optical system disclosed in, for example, U.S. Patent No. 6,552,775, and is equipped with, for example, multiple double-telecentric optical systems that form erect, normal images. Note that the projection optical system 16 does not have to be a multi-lens type. It may also be composed of a single projection optical system, such as those used in semiconductor exposure apparatuses.

In the exposure apparatus main body 10, when the mask M located within a predetermined illumination area is illuminated by illumination light IL from the illumination system 12, a projected image (partial pattern image) of the pattern on the mask M within that illumination area is formed in the exposure area by the projection optical system 16. Then, as the mask M moves relative to the illumination area (illumination light IL) in the scanning direction and the substrate P moves relative to the exposure area in the scanning direction, scanning exposure is performed on the substrate P, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

The stage device 20 includes a base plate 22, a substrate table 24, a support device 26, and a substrate holder 28.

The surface plate 22 is mounted on a pair of stage stands 212 supported from below by vibration isolation devices 210 installed on floor F. The pair of stage stands 212 support a pair of side columns 214, which in turn support a lens barrel surface plate 216. The surface plate 22 is made of a rectangular plate-like member in a plan view (seen from the +Z side) that is arranged so that its top surface (+Z surface) is parallel to the XY plane.

The support device 26 is placed on the base plate 22 in a non-contact manner and supports the substrate table 24 from below in a non-contact manner. The substrate holder 28 is placed on the substrate table 24, and the substrate table 24 and substrate holder 28 are driven together by a stage drive system (not shown) provided in the stage device 20. The stage drive system includes a coarse movement system, such as a linear motor, that can drive the substrate table 24 in the X-axis and Y-axis directions (along the top surface of the base plate 22) at a predetermined stroke, and a fine movement system, such as a voice coil motor, that minutely moves the substrate table 24 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz). The stage device 20 also includes a stage measurement system, such as an optical interferometer system and an encoder system, that determines positional information of the substrate table 24 in the six degrees of freedom. 1(b) and 2 also show a Y interferometer 32Y included in the stage measurement system, and a Y movable mirror (bar mirror) 34Y with a reflective surface perpendicular to the Y axis. The Y movable mirror 34Y is fixed to the substrate table 24.

The substrate holder 28 has a rectangular upper surface 28u (the surface on the +Z side) in a plan view, and the substrate P is placed on the upper surface 28u. As shown in FIG. 2, the aspect ratio of the upper surface 28u of the substrate holder 28 is approximately the same as that of the substrate P. As an example, the lengths of the long and short sides of the upper surface 28u are set to be slightly shorter than the lengths of the long and short sides of the substrate P, respectively.

The top surface 28u of the substrate holder 28 is flat across its entire surface. The top surface 28u of the substrate holder 28 is also formed with multiple micro-holes (not shown) for air blowout and vacuum suction. A common hole may be used for both the air blowout and vacuum suction. The substrate holder 28 uses vacuum suction force supplied by a vacuum device (not shown) to suck air between the top surface 28u and the substrate P through the multiple holes, thereby adsorbing the substrate P to the top surface 28u (correcting its flatness). The substrate holder 28 is a so-called pin chuck-type holder with multiple pins (very small, e.g., approximately 1 mm in diameter) arranged at approximately equal intervals. By including these multiple pins, the substrate holder 28 reduces the possibility of dust or foreign matter being trapped on the backside of the substrate P and supporting it, thereby reducing the possibility of deformation of the substrate P due to the trapped foreign matter. Substrate P is held (supported) by the upper surfaces of multiple pins. The XY plane formed by the upper surfaces of these multiple pins is the upper surface of substrate holder 28. Substrate holder 28 can supply (supply) pressurized gas (e.g., air) from a pressurized gas supply device (not shown) between upper surface 28u and substrate P through the holes, thereby separating the backside of substrate P, which is attracted to substrate holder 28, from upper surface 28u (floating substrate P). The contact state of substrate P can be controlled (e.g., to prevent air pockets from forming between the backside of substrate P and upper surface 28u of substrate holder 28) by varying the timing of pressurized gas supply for each of the multiple holes formed in substrate holder 28, appropriately switching the locations of the holes performing vacuum suction and the holes supplying pressurized gas, or appropriately changing the air pressure between suction and air supply.

The substrate holder 28 may also correct the flatness of the substrate P by supporting it in a floating state rather than by adsorbing it to the upper surface 28u. In this case, the substrate holder 28 supplies (intakes) pressurized gas (e.g., air) from a pressurized gas supply device (not shown) to the back surface of the substrate P through the holes, thereby interposing gas between the lower surface of the substrate P and the upper surface 28u of the substrate holder 28 (i.e., forming a gas film). The substrate holder 28 also uses a vacuum suction device to suck gas between the substrate holder 28 and the substrate P through the vacuum suction holes, applying a downward force (preload) in the direction of gravity to the substrate P, thereby imparting rigidity in the direction of gravity to the gas film. The substrate holder 28 may levitate the substrate P in the Z-axis direction via a small clearance and hold (support) it without contact by balancing the pressure and flow rate of the pressurized gas with the vacuum suction force, while exerting a force on the substrate P to control its flatness (for example, a force to correct or correct flatness). Note that the holes may be formed by processing the substrate holder 28, or the substrate holder 28 may be formed from a porous material so that air can be supplied or sucked. Furthermore, the upper surface 28u of the substrate holder 28 that levitates and supports the substrate P is not the surface on which the holes are formed, but a virtual surface located above that surface by the above-mentioned clearance; in other words, the upper surface of the substrate whose flatness has been corrected is referred to as the upper surface 28u.

As shown in Figures 1(a) and 2, two notches 28a are formed at the -X side end of the upper surface 28u of the substrate holder 28, spaced apart in the Y-axis direction. A substrate carry-in bearer device 25 is provided near the two notches 28a. The substrate carry-in bearer device 25 includes a suction pad 27 that suction-holds the underside of the substrate P using vacuum suction force supplied from a vacuum device (not shown), a Z drive mechanism 23Z that drives the suction pad 27 along the Z-axis direction, and a Y drive mechanism 23Y that drives the Z drive mechanism 23Z (and the suction pad 27) along the Y-axis direction. When the suction pad 27 is positioned at its -Z-most position, it is located within the notch 28a formed in the substrate holder 28. When the suction pad 27 is positioned at its +Z-most position, it is located above the substrate holder 28.

In the exposure apparatus main body 10, under the control of a main control device (not shown), a mask loader (not shown) loads a mask M onto the mask stage 14, and a substrate P is loaded onto the substrate holder 28 by a substrate load/unload unit 150 and a substrate slide hand 140 (described later). The main control device then performs alignment measurement using an alignment detection system (not shown). After the alignment measurement is completed, step-and-scan exposure operations are performed sequentially on multiple shot areas set on the substrate P. This exposure operation is similar to conventional step-and-scan exposure operations, so the X direction is the scan direction. A detailed description of the step-and-scan exposure operation will be omitted. The substrate P for which exposure processing has been completed is then removed from the substrate holder 28 by the substrate slide hand 140 or the like, and another substrate P to be exposed next is loaded into the substrate holder 28, thereby replacing the substrate P on the substrate holder 28 and performing a series of exposure operations consecutively for multiple substrates P.

(Substrate loading/unloading unit 150)
As shown in Fig. 1(a), the substrate transfer unit 150 is provided near the opening 200a of the chamber 200. Fig. 3(a) shows the substrate transfer unit 150 removed from Fig. 1(a), and Fig. 3(b) shows the substrate transfer unit 150 of Fig. 3(a) as viewed from the +X side.

As shown in FIG. 3(a), the substrate loading/unloading unit 150 comprises a partition member 152 having an inverted L-shaped XZ cross section, an inlet shutter 154 and an outlet shutter 156 provided on the partition member 152, and a substrate feeder 160 fixed to the partition member 152.

As shown in Figures 3(a) and 3(b), the partition member 152 has a rectangular shape when viewed from the X-axis direction, and has an inlet 152U and an outlet 152L that penetrate in the X-axis direction. The inlet 152U and outlet 152L are small enough to allow the substrate P to pass through, making it difficult for dust to enter the chamber 200 through the inlet 152U and outlet 152L. A inlet shutter 154 is provided near the inlet 152U, which opens and closes the inlet 152U by sliding in the vertical direction (Z-axis direction). In addition, a outlet shutter 156 is provided near the outlet 152L, which opens and closes the outlet 152L by rotating around a rotation axis 156a extending in the Y-axis direction.

The board feeder 160 is cantilevered by the partition member 152 at a predetermined height from the floor F. Here, "predetermined height" refers to a height position at which the stage device 20 can be positioned below the board feeder 160 when the stage device 20 moves to the board exchange position (see Figure 8(b)). The board feeder 160 includes a plate-shaped member whose XZ cross section is approximately a right-angled triangle, and the top surface of the board feeder 160 is inclined with respect to the XY plane. Note that in the example of Figure 3(a), the +X side end of the top surface of the board feeder 160 is parallel to the XY plane. Although not shown, the top surface of the board feeder 160 has multiple tiny holes (not shown) formed therein for blowing air. In the substrate feeder 160, pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) is supplied (air is supplied) to the backside of the substrate P placed on the upper surface of the substrate feeder 160 through holes, thereby separating the backside of the substrate P from the upper surface of the substrate feeder 160 (floating the substrate P). The substrate feeder 160 also has holes for suction-holding the underside of the substrate P using vacuum suction force supplied from a vacuum device (not shown). Note that the holes for supplying pressurized gas and the holes for vacuum suction may be the same hole. As shown in FIG. 2, the substrate feeder 160 is provided above the corners on the +X and +Y sides of the surface plate 22. As shown in FIG. 1(a), the -X side end of the substrate feeder 160 extends below the barrel surface plate 216, and a notch 216a is formed in part of the barrel surface plate 216 to avoid contact with the substrate P held by the substrate feeder 160.

(Substrate slide hand 140)
As shown in FIG. 2, the substrate slide hand 140 is provided on the +Y side of the substrate feeder 160. The substrate slide hand 140 has a suction pad 142 and a vertical movement mechanism 144 that moves the suction pad 142 up and down (by driving it back and forth along the Z-axis direction). The vertical movement mechanism 144 is movable in the X-axis direction along rails 146 that are laid at a predetermined height from the floor F along the X-axis direction. In other words, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 is able to suction and hold the underside of the substrate P by means of a vacuum suction force supplied by a vacuum device (not shown).

The substrate slide hand 140 sucks and holds a portion of the underside of the substrate P transported by the external transport robot 300 and moves in the -X direction, thereby drawing the substrate P from outside into the chamber 200. The substrate slide hand 140 also moves along the upper surface of the substrate feeder 160 while holding the substrate P that has been pulled into the chamber 200, thereby transferring the substrate P onto the substrate feeder 160. The substrate slide hand 140 also sucks and holds a portion of the underside of the exposed substrate P placed on the substrate holder 28 and moves in the +X direction, thereby sending the substrate P from inside the chamber 200 to the outside.

The external transfer robot 300 transfers substrate P between the exposure apparatus 100 (chamber 200) and an external device (not shown), such as a coater/developer, located outside the exposure apparatus 100. As shown in FIGS. 1(a) and 2, the external transfer robot 300 has a flat robot hand 300F. Although not shown, the upper surface of the robot hand 300F has multiple tiny holes (not shown) for blowing air. The robot hand 300F can separate the backside of the substrate P from the upper surface of the robot hand 300F (float the substrate P) by supplying (supplying) pressurized gas (e.g., air) from a pressurized gas supply device (not shown) to the backside of the substrate P placed on the upper surface of the robot hand 300F through the holes. The robot hand 300F also has holes for suction-holding the underside of the substrate P using the vacuum suction force of a vacuum device (not shown). The hole for supplying pressurized gas and the hole for vacuum suction may be a common hole.

(Board replacement operation)
The operation of replacing the substrate P on the substrate holder 28 in the exposure apparatus 100 will be described in detail below using FIGS. 1(a) to 2 and 4(a) to 11(b). The following substrate replacement operation is controlled by a main control device (not shown). Note that in each of FIGS. 4(a) to 11(b), which are used to explain the substrate replacement operation, the direction of movement of the components is indicated by outlined arrows to facilitate understanding. Furthermore, the state of gas suction or supply (intake) is indicated by solid arrows or dashed arrows. Note that FIGS. 4(a) and 4(b) show a plan view and a cross-sectional view along line A-A in FIG. 1(a) near the stage device 20 at the same timing. FIGS. 5(a) and 5(b), 6(a) and 6(b), ... and 11(a) and 11(b) also show plan views and cross-sectional views along line A-A near the stage device at the same timing. 4(a) to 11(b), illustration of components of the exposure apparatus 100 that are not necessary for explanation is omitted.

In addition, as a premise for explaining the substrate replacement operation, it is assumed that substrate P1 has already been placed on substrate holder 28 of stage device 20. Furthermore, the substrate replacement operation involves the operation of removing exposed substrate P1 and the operation of carrying in (placing) substrate P2 (different from substrate P1) to be newly exposed onto substrate holder 28. Note that substrate P2 may be an unexposed substrate (one that has never been exposed) or a substrate that will be exposed for the second or subsequent time.

As shown in Figures 1(a) and 2, while exposure is being performed on substrate P1 in the exposure apparatus main body 10, the main control device drives the external transfer robot 300, which holds the unexposed substrate P2, to the vicinity of the chamber 200 (near the loading entrance 152U). Note that the robot hand 300F of the external transfer robot 300 is in contact with most of the underside (-Z surface) of substrate P2, but is not in contact with the underside of the end on the -X side of substrate P2.

(Operations in Figures 4(a) and 4(b))
From this state, the main control device opens the loading entrance 152U by sliding the loading entrance shutter 154 in the +Z direction (see arrow A1 in FIG. 4(b)). Next, the main control device drives the external transfer robot 300 in the -X direction (see arrow A2 in FIGS. 4(a) and 4(b)) to cause the -X side end of the substrate P2 to enter the chamber 200. As a result, the -X side end of the substrate P2 is positioned above the substrate feeder 160. In the first embodiment, the external transfer robot 300 does not enter the chamber 200. This makes it possible to minimize the intrusion of dust into the chamber 200.

The main control device then drives the substrate slide hand 140 to move the suction pad 142 in the +X direction (the direction of arrow A3 in Figure 4(b)) and the +Z direction (the direction of arrow A4), thereby bringing the suction pad 142 into contact with a portion of the underside of substrate P2 (the end on the -X and +Y sides). The main control device also begins suction-holding a portion of the underside (-Z surface) of substrate P2 with the suction pad 142 (see black arrow A5 in Figure 4(b)).

(Operations in Figures 5(a) and 5(b))
Next, the main control device begins supplying (gas inlet) pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 160 (see arrows B1 and B2 in FIG. 5(b)). This causes the substrate P2 to float from the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160, and friction between the lower surface of the substrate P2 and the upper surfaces of the robot hand 300F and the substrate feeder 160 becomes negligible (low friction state). From this state, the main control device drives the suction pad 142 of the substrate slide hand 140 in the -X direction (arrow B2 direction in FIG. 5(b)) and the -Z direction (arrow B3 direction). That is, the suction pad 142 is moved in a direction along the upper surface of the substrate feeder 160 (the direction of arrow B5 in FIGS. 5(a) and 5(b), which is a direction inclined to the X-axis and Z-axis within the XZ plane). As a result, substrate P2 is transported into chamber 200 along the upper surface of robot hand 300F and the upper surface of substrate feeder 160. Substrate P2 is moved by substrate slide hand 140 while being supported by the upper surface of robot hand 300F and the upper surface of substrate feeder 160.

(Operations in Figures 6(a) and 6(b))
As described above, when substrate P2 is transported along the upper surface of robot hand 300F and the upper surface of substrate feeder 160 and reaches the position shown in FIGS. 6(a) and 6(b), the main controller slides load entrance shutter 154 in the -Z direction to close load entrance 152U (see arrow C1 in FIG. 6(b)). This prevents dust from entering the interior of chamber 200 from the outside via load entrance 152U. The main controller drives external transport robot 300 in the -X direction (see arrow C2 in FIGS. 6(a) and 6(b)). Note that exposure of substrate P1 continues in exposure apparatus main body 10.

(Operations in Figures 7(a) and 7(b))
Next, the main controller drives the vacuum device (not shown) of the substrate feeder 160 to suck and hold the substrate P2 by vacuum suction. The main controller then releases the suction hold by the suction pad 142 of the substrate slide hand 140 and drives the suction pad 142 downward in the -Z direction (see arrow D1 in FIG. 7B). The main controller also drives the external transfer robot 300 in the -Z direction (see arrow D2) and in the -X direction (see arrow D3) to bring the -X end of the robot hand 300F closer to the unloading port 152L. Furthermore, the main controller rotates the unloading port shutter 156 counterclockwise (in the direction of arrow D4) to open the unloading port 152L. This completes preparations for replacing the substrate on the substrate holder 28. At this stage, the exposure operation for the substrate P1 on the substrate holder 28 is considered to be complete.

(Operations in FIGS. 8(a) and 8(b))
After the exposure operation is completed, the main controller drives the stage device 20 to the substrate exchange position (below the substrate feeder 160) (see arrow E1 in FIGS. 8A and 8B). Next, the main controller slightly raises the suction pads 27 of the substrate carry-in bearer device 25 (see arrow E2) and causes the suction pads 27 to suction-hold the underside of the substrate P1 (see arrow E3). The main controller also starts the supply of pressurized gas (air supply) from the upper surface 28u of the substrate holder 28 (see arrow E4), thereby slightly floating the substrate P1 relative to the upper surface 28u of the substrate holder 28. Furthermore, the main controller moves the suction pads 27 that suction-hold the substrate P1 in the +Y direction (see arrow E5), thereby slightly offsetting the substrate P1 from the substrate holder 28 in the +Y direction. This offset allows the suction pads 142 of the substrate slide hand 140 to hold the corners on the -X and +Y sides of the underside of the substrate P1.

With substrate P1 offset from substrate holder 28, the main control device drives the suction pad 142 of the substrate slide hand 140 upward (see arrow E6), causing the suction pad 142 to suction and hold the underside of substrate P1. It is assumed that the main control device has already started supplying pressurized gas (air supply) from the upper surface of the robot hand 300F of the external transfer robot 300 at the stages shown in Figures 8(a) and 8(b) (see arrow E7). While the main control device rotates the unloading port shutter 156 counterclockwise (in the direction of arrow D4) at the stage shown in Figure 7(b) to open the unloading port 152L, it may also be configured to open the unloading port 152L at the stage shown in Figure 8(b).

(Operations in FIGS. 9(a) and 9(b))
Next, the main control device drives the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow F1 in Figures 9(a) and 9(b)), and slides and transports substrate P1 from substrate holder 28 onto robot hand 300F. This allows exposed substrate P1 to be transferred onto robot hand 300F. In other words, substrate P1 is moved by substrate slide hand 140 while being supported by the upper surface of substrate holder 28 and the upper surface of robot hand 300F. At the timing when robot hand 300F receives substrate P1, the main control device stops the supply (suction) of pressurized gas from robot hand 300F, and drives a vacuum device (not shown), causing robot hand 300F to suction and hold substrate P1 by vacuum suction force.

The main control device also drives the suction pad 27 of the substrate loading bearer device 25 upward (see arrow F2), bringing it into contact with the -X end of the underside of the substrate P2 held by the substrate feeder 160, and begins suction-holding the substrate P2 with the suction pad 27 (see arrow F3).

(Operations in FIGS. 10(a) and 10(b))
Next, the main control device drives stage device 20 in the -X direction (see arrow G1) with substrate P2 being sucked and held by suction pad 27 of substrate carry-in bearer device 25. In this case, as stage device 20 moves away from substrate feeder 160, the area of substrate P2 held by substrate feeder 160 gradually decreases, and the area of substrate P2 supported by substrate holder 28 gradually increases. As a result, substrate P2 is transferred from substrate feeder 160 onto substrate holder 28, as shown in FIG. 10(a).

After transferring substrate P1 to the robot hand 300F, the main control device drives the suction pad 142 downward (see arrow G2) and rotates the unloading port shutter 156 clockwise (see arrow G3), thereby closing the unloading port 152L. This prevents dust from entering the chamber 200 from the outside to the inside through the unloading port 152L. The main control device drives the external transport robot 300 holding substrate P1 in the +X direction (see arrow G4), causing the substrate P1 to be transported to an external device.

(Operations in FIGS. 11(a) and 11(b))
When the main controller completes the transfer of substrate P2 from substrate feeder 160 onto substrate holder 28, it stops the supply of pressurized gas (air supply) from the upper surface of substrate feeder 160. The main controller also finely drives suction pad 27 to align (adjust the position) substrate P2 (see arrow H1). Thereafter, the main controller drives suction pad 27 downward (see arrow H2), causing substrate holder 28 to begin suction-holding substrate P2, and begins exposure of substrate P2 newly placed on substrate holder 28.

After that, the processes shown in Figures 4(a), 4(b) to 11(a), and 11(b) are repeatedly performed, thereby repeatedly exposing multiple substrates P.

As explained in detail above, according to the first embodiment, the exposure apparatus 100 comprises the exposure apparatus main body 10, the chamber 200 that houses the exposure apparatus main body 10, a substrate feeder 160 that receives and holds the substrate P transported by the external transport robot 300 outside the chamber 200, and a substrate slide hand 140 and substrate carry-in bearer device 25 that transfer the substrate P from the external transport robot 300 to the substrate feeder 160, from the substrate feeder 160 to the substrate holder 28 of the exposure apparatus main body 10, and from the substrate holder 28 to the external transport robot 300. This eliminates the need for a substrate transfer port that was previously provided to transfer the substrate P from the external transport robot 300 to the substrate feeder 160 (for example, in JP 2001-332600 A). Because the substrate transfer port is provided at a position between the exposure apparatus main body 10 and the external transfer robot 300, an exposure apparatus 100 that does not have a substrate transfer port can be made smaller (have a smaller footprint) by the amount of the substrate transfer port. Furthermore, omitting the substrate transfer port can also reduce the cost of the exposure apparatus 100. Furthermore, in an exposure apparatus that has a substrate transfer port, the substrate P undergoes two transfer operations: from the external transfer robot 300 to the substrate transfer port, and from the substrate transfer port to the substrate holder 28. Each time a substrate is transferred, extra stress is applied to the substrate P, which could result in deformation or damage to the substrate P. Therefore, if the substrate transfer operation occurs only once between the exposure apparatus main body 10 and the external transfer robot 300, as in the first embodiment, there is the effect that the substrate P is less likely to be deformed or damaged.

In addition, in this first embodiment, the substrate slide hand 140, while holding a portion of the substrate P, moves in a direction including the X-axis direction in which the substrate feeder 160 and the substrate holder 28 are aligned when transferring the substrate P from the substrate feeder 160 onto the substrate holder 28. This allows the substrate P to be transferred from the substrate feeder 160 onto the substrate holder 28 as the substrate slide hand 140 moves.

In addition, in this first embodiment, the upper surface (substrate support surface) of the substrate feeder 160 is inclined relative to the upper surface of the substrate holder 28, and the stage device 20 moves in the -X direction while the substrate carry-in bearer device 25 holds a portion of the substrate P, thereby transferring the substrate P from the substrate feeder 160 onto the substrate holder 28. This allows the substrate P to be handed over to the substrate holder 28 while sliding along the upper surface of the substrate feeder 160, thereby preventing the substrate P from bending when being handed over to the substrate holder 28.

In addition, in this first embodiment, the external transfer robot 300 does not enter the chamber 200 of the exposure apparatus 100, so dust adhering to the external transfer robot 300 can be prevented from entering the chamber 200. Furthermore, the volume of the chamber 200 can be reduced, making it easier to control the temperature inside the chamber 200. Furthermore, because the external transfer robot 300 does not enter the chamber 200, contact between the external transfer robot 300 and various parts of the exposure apparatus 100 can be minimized. Furthermore, the only openings connecting the inside of the chamber 200 to the outside of the chamber 200 are the inlet 152U and the outlet 152L, which are large enough to move the substrate P, so dust can be prevented from entering the chamber.

Furthermore, in this first embodiment, the +X side end of the top surface of the substrate feeder 160 is parallel to the XY plane. This allows the substrate slide hand 140 to easily receive the substrate P transported by the external transport robot 300.

Furthermore, in this first embodiment, the substrate P on the substrate holder 28 is transferred to the external transport robot 300 while the substrate P is held on the upper surface of the substrate feeder 160, and immediately thereafter, the substrate P held by the substrate feeder 160 is transferred onto the substrate holder 28. This allows the substrate on the substrate holder 28 to be quickly replaced even without a substrate transfer port.

In addition, in this first embodiment, the loading entrance 152U and unloading exit 152L of the partition member 152 are provided separately, so that during the board replacement operation, the loading entrance 152U and unloading exit 152L are not opened simultaneously, but are opened and closed individually, thereby preventing the entry of dust.

In the first embodiment described above, the suction pad 27 of the substrate carry-in bearer device 25 is movable in the Y-axis direction, but this is not limited to this. For example, if the suction pad 142 of the substrate slide hand 140 can suction-hold the underside of the substrate P without moving (offsetting) the substrate P on the substrate holder 28 in the Y-axis direction, the suction pad 27 does not have to be able to move in the Y-axis direction.

In the first embodiment described above, the robot hand 300F of the external transfer robot 300 is described as a flat plate-shaped member capable of air-floating the substrate P on its upper surface, but this is not limited to this. For example, the robot hand 300F may be a fork-shaped member or the like as long as it can slide the substrate P without generating dust. The robot hand 300F may also have a rotating roller that feeds the substrate P in the X-axis direction by rolling contact. By providing the robot hand 300F with a rotating roller, friction when the substrate P comes into contact with the robot hand 300F can be reduced, and dust generation can be suppressed.

In the first embodiment, a mechanism for applying a levitation force to the substrate P by supplying (air supplying) pressurized gas may be provided near the loading entrance 152U or unloading exit 152L of the substrate loading/unloading unit 150. Furthermore, rotating rollers for feeding the substrate P in the X-axis direction by rolling contact may be provided near the loading entrance 152U or unloading exit 152L of the substrate loading/unloading unit 150.

In the first embodiment described above, the substrate feeder 160 is fixed to the partition member 152 of the substrate carry-in/out unit 150, but this is not limited to this. The substrate feeder 160 may also be fixed to a member different from the partition member 152.

In the first embodiment, the substrate feeder 160 is described as being located above the corners on the +X and +Y sides of the surface plate 22, but this is not limited to this. As long as it does not interfere with the exposure operation, the substrate feeder 160 may be located, for example, above the end of the +X side of the surface plate 22 and the center in the Y-axis direction.

In the first embodiment described above, the loading entrance shutter 154 and the unloading exit shutter 156 are provided on the partition member 152 of the substrate loading/unloading unit 150, but this is not limited to this. In other words, at least one of the loading entrance shutter 154 and the unloading exit shutter 156 may be provided in the chamber 200.

Second Embodiment
Next, an exposure apparatus according to a second embodiment will be described using Figures 12 and 13. The configuration of exposure apparatus 100A according to the second embodiment is the same as that of the first embodiment, except for differences in the configuration and operation of part of the substrate feeder, so only the differences will be described below, and elements that have the same configuration and function as those in the first embodiment will be assigned the same reference numerals as those in the first embodiment, and their description will be omitted.

Figure 12 is a diagram showing an exposure apparatus 100A according to the second embodiment (a diagram corresponding to Figure 1(a) of the first embodiment).

In the first embodiment, the substrate feeder 160 was fixed to the partition member 152 of the substrate carry-in/out unit 150, but in the substrate carry-in/out unit 150A of this second embodiment, as shown in Figure 12, the substrate feeder 161 is attached to a rotation shaft 162 provided on the partition member 152.

The shape and function of the board feeder 161 are similar to those of the board feeder 160 of the first embodiment, but the board feeder 161 is attached to a rotation shaft 162 extending in the Y-axis direction, allowing it to rotate freely around the rotation shaft 162. Although not shown in Figures 12 and 13, the board feeder 161 is rotated by a drive mechanism (including a motor, etc.) not shown.

In addition, in this second embodiment, since the substrate feeder 161 is rotatable, the notch 216b formed in the lens barrel base 216 is larger than the notch 216a in the first embodiment to avoid mechanical interference with the substrate feeder 161 and the substrate slide hand 140.

The substrate feeder 161 transitions between a state in which the upper surface (substrate support surface) is parallel to the XY plane, as shown in Figure 12, and a state in which the substrate support surface is inclined relative to the XY plane, as shown in Figure 13 (a state similar to that of the first embodiment).

(Board replacement operation)
In the second embodiment, when the substrate P (P2) is carried in from outside the chamber 200 by the substrate slide hand 140, the main control device controls the drive mechanism to keep the substrate support surface (upper surface) parallel to the XY plane, as shown in FIG. 12 . Furthermore, when the substrate slide hand 140 draws the substrate P (P2) onto the substrate feeder 161, the main control device supplies (gassifies) pressurized gas from the upper surface of the external transfer robot 300 and the substrate support surface of the substrate feeder 161. This allows the substrate support surface (upper surface) of the substrate feeder 161 and the support surface of the external transfer robot to be flush (within the same plane). In this state, the main control device moves the substrate P2 by the substrate slide hand 140, thereby preventing deformation or damage to the substrate P2 due to excessive stress being applied thereto.

Then, when substrate P (P2) is transferred onto substrate feeder 161 as shown in FIG. 12, the main control device begins suction and holding of substrate P (P2) by substrate feeder 161. The main control device also controls the drive mechanism to rotate substrate feeder 161 counterclockwise as shown in FIG. 13, tilting the substrate support surface of substrate feeder 161 relative to the XY plane, and then replacing the substrate on substrate holder 28, as in the first embodiment.

As described above, according to the second embodiment, the substrate feeder 161 is designed so that the substrate support surface can transition between a state in which it is parallel to the XY plane and a state in which it is tilted, and therefore can be set to an appropriate state (posture) when receiving the substrate P from the external transport robot 300 or when transferring it to the substrate holder 28. This reduces the possibility of the substrate P coming into contact with the loading entrance 152U or the substrate feeder 161.

In addition, when the substrate slide hand 140 transports the substrate P (P2) from the external transport robot 300 into the chamber 200, the height position (position in the Z-axis direction) of the suction pad 142 does not need to be changed, which simplifies control of the suction pad 142.

Furthermore, in this second embodiment, when replacing a substrate, the substrate support surface of the substrate feeder 161 can be tilted to bring the -X end of the substrate P (P2) newly placed on the substrate holder 28 close to the upper surface of the substrate holder 28. This shortens (or makes it zero) the Z-direction stroke of the suction pad 142 of the substrate carry-in bearer device 25, and allows the transfer of the substrate P (P2) to the substrate holder 28 to be carried out smoothly and without impact.

In the second embodiment described above, the rotation shaft 162 is located at the +X end of the board feeder 161, but this is not limiting, and the rotation shaft 162 may be located, for example, in the middle of the board feeder 161 in the X-axis direction.

Third Embodiment
Next, an exposure apparatus according to a third embodiment will be described with reference to Figures 14 to 18. Figure 14 shows a cross-sectional view of an exposure apparatus 100B according to the third embodiment (a view corresponding to Figure 2 of the first embodiment).

The exposure apparatus 100 of the first embodiment described above was equipped with a substrate slide hand 140, but the exposure apparatus 100B of this third embodiment is equipped with a first slide hand 240 and a second slide hand 340 instead of the substrate slide hand 140.

The first slide hand 240 is provided on the upper surface (substrate support surface) of the substrate feeder 163. The substrate feeder 163 has the same configuration and function as the substrate feeder 160 of the first embodiment. The first slide hand 240 has a rail 246 provided on the substrate support surface of the substrate feeder 163 and a suction pad 242 that moves along the rail 246. The rail 246 is embedded in the substrate feeder 163, and there is no step between the upper surface of the rail 246 and the upper surface (substrate support surface) of the substrate feeder 163. The first slide hand 240 can suck and hold a portion of the substrate P transported by the external transport robot 300 and move in the -X direction to draw the substrate P into the chamber 200 (on the substrate feeder 163).

The second slide hand 340 is provided on the +X side surface of the stage device 20 (substrate table 24). The second slide hand 340 has a configuration similar to that of the substrate slide hand 140 of the first embodiment, and includes a rail 346 extending in the X-axis direction, a Z drive mechanism 344 that moves in the X-axis direction along the rail 346, and a suction pad 342 that is driven in the Z-axis direction by the Z drive mechanism 344. The second slide hand 340 can transfer the substrate P from the substrate holder 28 to the external transport robot 300 by suction-holding a portion of the substrate P placed on the substrate holder 28 and moving in the +X direction.

In other words, in this third embodiment, the same function as the substrate slide hand 140 in the first embodiment is achieved by the first slide hand 240 and the second slide hand 340.

The other configurations of the exposure apparatus 100B are the same as those of the exposure apparatus 100 of the first embodiment.

(Board replacement operation)
The operation of replacing substrate P on substrate holder 28 in exposure apparatus 100B will be described in detail below using Figures 14 to 18(b). Note that Figures 15(a) and 15(b) show plan views and vertical cross-sectional views of the vicinity of stage device 20 at the same timing, and Figures 16(a) and 16(b), Figures 17(a) and 17(b), and Figures 18(a) and 18(b) also show plan views and vertical cross-sectional views of the vicinity of the stage device at the same timing. Note that in Figures 15(a) to 18(b), illustrations of components of exposure apparatus 100B that are not necessary for explanation are omitted.

The substrate replacement operation involves the operation of unloading the exposed substrate P1 and the operation of loading (placing) the newly exposed substrate P2 (different from substrate P1) onto the substrate holder 28. While exposure is being performed on substrate P1 on the substrate holder 28 in the exposure apparatus main body 10, the main control device drives the external transfer robot 300 holding the unexposed substrate P2 to the vicinity of the chamber 200 (near the load entrance 152U), as shown in FIG. 14. At this stage, the suction pad 242 of the first slide hand 240 is positioned at the +X end of the rail 246.

(Operations in FIGS. 15(a) and 15(b))
From this state, the main controller opens the loading entrance 152U by sliding the loading entrance shutter 154 in the +Z direction (see arrow J1 in FIG. 15(b)). Next, the main controller drives the external transfer robot 300 in the -X direction (see arrow J2 in FIGS. 15(a) and 15(b)), causing the -X side end of the substrate P2 to enter the chamber 200. This brings the -X side end of the underside of the substrate P2 into proximity with or into contact with the suction pad 242. The main controller also begins suction holding of a portion of the underside of the substrate P2 by the suction pad 242 (see arrow J3 in FIG. 15(b)).

(Operations in FIGS. 16(a) and 16(b))
Next, the main control device starts the supply (air supply) of pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 163, and drives the suction pad 242 of the first slide hand 240 along the rail 246 to the -X side (the direction of arrow K1 in Figures 16(a) and 16(b)). As a result, substrate P2 is transported into chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 163. After transporting substrate P2 onto the substrate feeder 163, the main control device stops the supply of pressurized gas from the substrate feeder 163 and the robot hand 300F, and starts suction holding of substrate P2 by the substrate feeder 163. Then, the main control device closes the load entrance shutter 154 and opens the unload exit shutter 156. Furthermore, when exposure of substrate P1 is completed in stage device 20, the main controller drives stage device 20 to the position (substrate exchange position) shown in Figures 16(a) and 16(b) (see arrow K2).

When the stage device 20 moves close to the substrate exchange position, the main control device starts supplying pressurized gas from the upper surface 28u of the substrate holder 28 and drives the suction pads 27 of the substrate carry-in bearer device 25 in the +Z and +Y directions to offset the substrate P1 from the substrate holder 28 to the +Y side (see arrow K3 in Figure 16(a)). The main control device also drives the external transfer robot 300 in the +X direction (see arrow K4).

(Operations in FIGS. 17(a) and 17(b))
The main control device drives the external transfer robot 300 in the -Z direction and the -X direction (see arrows L1 and L2 in FIG. 17(b)), thereby bringing the -X end of the robot hand 300F closer to the exit 152L. Then, the main control device starts supplying (air supplying) pressurized gas from the upper surface of the robot hand 300F.

The main control device also drives the suction pad 342 of the second slide hand 340 upward, causing the suction pad 342 to suction and hold the underside of substrate P1. The main control device then drives the suction pad 342 in the +X direction along the rail 346 (see arrow L3), sliding substrate P1 from the substrate holder 28 onto the robot hand 300F. After substrate P1 has been slid onto the robot hand 300F, the main control device drives the robot hand 300F in the +X direction, retracts substrate P1 to the outside of the chamber 200, and closes the unloading port shutter 156.

The main control device also drives the suction pad 27 of the substrate carry-in bearer device 25 to rise (see arrow L4), and the suction pad 27 begins to suction and hold the -X end of substrate P2 (see arrow L5). Furthermore, the main control device begins supplying pressurized gas from the top surface of the substrate feeder 163.

(Operations in FIGS. 18(a) and 18(b))
The main control device drives stage device 20 in the -X direction (see arrow N1) with substrate P2 being sucked and held by suction pad 27 of substrate carry-in bearer device 25. This causes substrate P2 to be transferred from substrate feeder 163 onto substrate holder 28. Note that while substrate P2 is being transferred from substrate feeder 163 onto substrate holder 28, pressurized gas is being supplied from the top surface of substrate holder 28.

Meanwhile, once the entire substrate P2 has been transferred from the substrate feeder 163 onto the substrate holder 28, the main control device stops the supply of pressurized gas from the top surface of the substrate feeder 163. The main control device also slightly drives the suction pad 27 to align (adjust the position) the substrate P2. The main control device then drives the suction pad 27 downward (see arrow N2) and begins exposure of the newly placed substrate P2 on the substrate holder 28.

The main control device also drives the external transfer robot 300 in the +X direction (see arrow N3) to transport substrate P1 to the external device.

After that, the processes shown in Figures 15(a), 15(b) to 18(a), and 18(b) are repeatedly performed, thereby repeatedly exposing multiple substrates P.

As described above in detail, the third embodiment is equipped with a first slide hand 240 that draws the substrate P from outside the chamber 200 into the chamber 200, and a second slide hand 340 that transports the substrate P from inside the chamber 200 to outside the chamber 200. This increases the degree of freedom in design, so that, for example, the substrate exchange position of the stage device 20 can be located near the +X side end and the center in the Y axis direction of the surface plate 22.

In addition, in this third embodiment, the first slide hand 240 is provided in the center of the board feeder 163 in the Y-axis direction, creating space on the +Y and -Y sides of the board feeder 163. This makes it possible to make design changes, such as holding the board feeder 163 from the Y-axis direction.

Furthermore, in this third embodiment, the second slide hand 340 is provided on the stage device 20, so the substrate removal operation can be started before the stage device 20 arrives at the substrate exchange position.

Furthermore, in this third embodiment, the rails 246 of the first slide hand 240 are provided along the upper surface (substrate support surface) of the substrate feeder 163, which simplifies control compared to the first embodiment, in which control is performed in two axial directions, the X axis and the Z axis, when driving the suction pad 242. Furthermore, there is no need to provide rails 146 as in the first and second embodiments, which reduces the number of parts.

Furthermore, in this third embodiment, the second slide hand 340 is provided on the stage device 20, so the substrate removal operation can be started before the stage device 20 arrives at the substrate exchange position.

In the third embodiment, the posture of the board feeder 163 (the inclination of the board support surface) may be changed as in the second embodiment.

Fourth Embodiment
Next, exposure apparatus 100C of the fourth embodiment will be described using Figures 19 and 20. As shown in Figures 19(a) and 19(b), exposure apparatus 100C of the fourth embodiment has substantially the same configuration as exposure apparatus 100 of the first embodiment, but differs in that substrate feeder 160 has the function of holding substrate P in a non-contact, suspending manner from its underside.

For example, holes for exhausting pressurized gas are formed on the underside of the substrate feeder 160, and by exhausting air in the manner of a known Bernoulli chuck, negative pressure can be generated between the upper surface of substrate P and the lower surface of the substrate feeder 160. Therefore, in the fourth embodiment, the negative pressure generated between the upper surface of substrate P and the lower surface of the substrate feeder 160 allows substrate P to be held in a non-contact, suspended state (i.e., the upper surface of substrate P is held in a non-contact state on the lower surface of the substrate feeder 160). However, this is not limiting, and holes for vacuum suction and holes for exhausting pressurized gas can also be formed on the underside of the substrate feeder 160, and substrate P can be held in a non-contact, suspended state by balancing vacuum suction and air exhaust using these holes.

(Board replacement operation)
19(a) and 19(b) show views corresponding to FIGS. 8(a) and 8(b) of the first embodiment. In the states shown in FIGS. 19(a) and 19(b), unexposed substrate P2 is held on the upper surface of substrate feeder 160, and stage device 20 and exposed substrate P1 are positioned opposite the lower surface of substrate feeder 160. In this state, substrate P1 is slightly offset in the +Y direction relative to substrate holder 28, and pressurized gas is supplied from upper surface 28u of substrate holder 28, resulting in a non-contact state between the lower surface of substrate P1 and the upper surface of substrate holder 28. Furthermore, suction pad 142 of substrate slide hand 140 is in a state of suction-holding a portion of the lower surface of substrate P1.

From this state, the main control device exhausts the pressurized gas from the underside of the substrate feeder 160, thereby suspending and holding substrate P1 in a non-contact manner on the underside of the substrate feeder 160 using the Bernoulli chuck principle.

Next, the main control device causes the suction pad 27 of the substrate carry-in bearer device 25 to suction-hold a portion of substrate P2 on the substrate feeder 160, and begins supplying pressurized gas from the top surface of the substrate feeder 160. Then, as shown in FIGS. 20(a) and 20(b), the main control device moves the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow Q1) to begin transferring substrate P1 to the external transfer robot 300, and drives the stage device 20 in the -X direction (see arrow Q2) to transfer substrate P2 from the substrate feeder 160 onto the substrate holder 28. Note that, because negative pressure is generated on the underside of the substrate feeder 160 to hold substrate P1 in a non-contact, suspended state as described above, when substrate P1 is slidably transported by the substrate carry-in bearer device 25, as shown in FIG. 20(b), substrate P1 can be smoothly slidably transported to the external transfer robot 300 even if the substrate holder 28 is not present below substrate P1.

As described above, according to the fourth embodiment, the substrate P1 to be transported externally is held in a non-contact suspended state on the underside of the substrate feeder 160, so the stage device 20 does not need to wait at the substrate exchange position until the substrate P1 is transferred from the substrate holder 28 to the external transport robot 300. This allows the operation of placing a new substrate P2 on the substrate holder 28 to begin before the substrate P1 is transferred to the external transport robot 300, as shown in FIG. 20(b). Therefore, according to the fourth embodiment, the time required for substrate exchange can be shortened. Furthermore, after the substrate P2 is placed on the substrate holder 28 and the stage device 20 is moved in the -X direction, the substrate P1 held in a non-contact state on the underside of the substrate feeder 160 may be transferred to the external transport robot 300. As a result, when the stage device 20 is positioned near the unloading port 152L, the unloading port shutter 156 can be kept closed, and even if dust enters the chamber 200 through the unloading port 152L, there is little risk of the dust adhering to the stage device 20.

The board feeder 160 of the fourth embodiment may be rotatably mounted on the partition member 152, as in the second embodiment. In other words, the top surface of the board feeder 160 may be configured to transition between a horizontal state and an inclined state relative to the XY plane.

In the fourth embodiment, as in the third embodiment, a first slide hand 240 and a second slide hand 340 may be provided instead of the substrate slide hand 140.

Fifth Embodiment
Next, a fifth embodiment will be described with reference to Fig. 21. Fig. 21(a) shows a substrate carry-in/out unit 150' according to the fifth embodiment. Substrate carry-in/out unit 150' has a substrate feeder 165 instead of substrate feeder 160 of substrate carry-in/out unit 150 of the first embodiment, and has an unloading port shutter 156' instead of unloading port shutter 156.

The substrate feeder 165 has a first portion 165a fixed to the -X side surface of the partition member 152, and a second portion 165b that is slidable relative to the first portion 165a. The sliding direction of the second portion 165b is the same as the tilt direction (the direction tilting relative to the X-axis and Z-axis within the XZ plane) of the upper surface (substrate support surface) of the second portion 165b. As shown in FIG. 21(b), a drive mechanism 165c, for example, of a feed screw type, is provided between the first portion 165a and the second portion 165b. The drive mechanism 165c drives the second portion 165b so as to change the distance between the second portion 165b and the first portion 165a. Note that the drive mechanism 165c is not limited to a feed screw type, and may be another type of drive mechanism, such as a drive mechanism including a linear motor.

In the fifth embodiment, by adopting the above-described configuration for the substrate feeder 165, the first portion 165a and the second portion 165b are brought closer together as shown in FIG. 21(a) except during substrate replacement. This prevents the substrate feeder 165 from interfering with exposure operations, maintenance, and other tasks. Furthermore, during substrate replacement, the second portion 165b of the substrate feeder 165 can be moved as shown in FIG. 21(b), allowing the substrate replacement position to be set closer to the -X side. This shortens the stroke in the X-axis direction when the stage device 20 moves to the substrate replacement position.

In the fifth embodiment, by adopting the substrate feeder 165 described above, the substrate exchange position is set closer to the -X side than in the first embodiment, etc., which may increase the distance between the substrate holder 28 and the external transfer robot 300 during substrate exchange. Therefore, in the fifth embodiment, as shown in FIG. 21(b), the length of the unloading port shutter 156' in the X-axis direction when the unloading port 152L is open is set longer than that of the unloading port shutter 156 shown in FIG. 1(b), etc., and the unloading port shutter 156' is provided with a levitation force imparting mechanism that supplies pressurized gas upward from the +Z side surface in the state shown in FIG. 21(b). Furthermore, when opening or closing the unloading port 152L, the unloading port shutter 156' moves in the opposite direction to the unloading port shutter 156 (it moves clockwise when opening the unloading port 152L and counterclockwise when closing it). This allows the unloading port shutter 156' to act as a bridge for the substrate P between the substrate holder 28 and the external transfer robot 300. Therefore, according to the fifth embodiment, the substrate P can be transferred from the substrate holder 28 to the external transfer robot 300 without bending the substrate.

Furthermore, in the fifth embodiment, when the unloading port shutter 156' opens the unloading port 152L (Figure 21(b)), the +X end of the unloading port shutter 156' is positioned at approximately the same position as the +X end of the unloading port 152L. This allows the external transfer robot 300 to receive the substrate from the substrate holder 28 at a position on the +X side of the unloading port 152L, thereby minimizing the intrusion of dust into the chamber 200.

In the fifth embodiment, the exit shutter 156' may be replaced with the exit shutter 156 similar to those used in the first to fourth embodiments.

Incidentally, like the unloading port shutter 156' in the fifth embodiment, the unloading port shutter 156 described in the first to fourth embodiments may be provided with a function to supply pressurized gas from the upper surface while the unloading port 152L is open.

In the fifth embodiment, the substrate feeder 165 may also be rotatably mounted, as in the second embodiment.

Sixth Embodiment
Next, a sixth embodiment will be described using FIGS. 22 to 24. FIGS. 22(a) and 22(b) show a cross-sectional view and a longitudinal section of an exposure apparatus according to the sixth embodiment. This sixth embodiment is a modification of the third embodiment (FIGS. 14 to 18). As shown in FIG. 22(a), the width of the substrate feeder 166 in the Y-axis direction is set wider than the width of the substrate feeder 163 in FIG. 14. As shown in FIG. 22(b), the substrate feeder 166 is rotatably supported near its +X end by a rotation shaft 176 extending in the Y-axis direction. The substrate feeder 166 is suspended and supported at two locations near both ends in the Y-axis direction by suspension mechanisms 186 provided on the partition member 152. Unlike the partition members 152 of the first to fifth embodiments, the partition member 152 of the sixth embodiment is provided with a holder 155 for holding the suspension mechanism 186.

The hanging mechanism 186 has two ropes 196 that suspend and support the substrate feeder 166, and the tilt of the upper surface (substrate support surface) of the substrate feeder 166 is adjusted by winding and unwinding the two ropes 196 to adjust their length. In the sixth embodiment, by adopting the above-described configuration for the substrate feeder 166, even when the rigidity of the substrate feeder 166 near the rotation axis 176 is low, the small force of the hanging mechanism 186 can accurately control the attitude of the substrate feeder 166 while suppressing deflection of the substrate feeder 166.

(Board replacement operation)
In the sixth embodiment, when a substrate replacement operation is performed, the main control device controls the hanging mechanism 186 to maintain the upper surface (substrate support surface) of the substrate feeder 166 horizontal, as shown in FIG. 22(b). The main control device then slides the loading entrance shutter 154 in the +Z direction to open the loading entrance 152U (see arrow R1), and moves the external transfer robot 300 closer to the loading entrance 152U (see arrow R2), thereby positioning the -X end of the substrate P2 near the +X end of the substrate support surface of the substrate feeder 166. Note that at this stage, the suction pad 242 of the first slide hand 240 is positioned at the +X end of the rail 246.

The main control device then begins suction-holding a portion of the underside of substrate P2 using suction pad 242 (see arrow R3 in Figure 22(b)).

The main control device then begins the supply (air intake) of pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 166, and drives the suction pad 242 of the first slide hand 240 along the rail 246 toward the -X side (see arrow R4), as shown in Figures 23(a) and 23(b). As a result, substrate P2 is drawn into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 166. After transporting substrate P2 onto the substrate feeder 166, the main control device stops the supply of pressurized gas from the substrate feeder 166 and the robot hand 300F, and begins suction holding of substrate P2 by the substrate feeder 166.

The main control device then closes the loading entrance shutter 154 and opens the unloading exit shutter 156. Furthermore, when exposure of substrate P1 in stage device 20 is complete, the main control device drives stage device 20 to the position shown in FIG. 24 (substrate exchange position) (see arrow R5).

Next, as shown in FIG. 24, the main control device controls the hanging mechanism 186 to adjust the length of the rope 196 (see arrow R6), thereby tilting the substrate support surface of the substrate feeder 166. The main control device also starts the supply of pressurized gas from the upper surface 28u of the substrate holder 28, and drives the suction pads 27 of the substrate carry-in bearer device 25 in the +Z and +Y directions to offset the substrate P1 from the substrate holder 28 to the +Y side. The main control device also positions the external transport robot 300 near the unloading port 152L shown in FIG. 24, and starts the supply (air supply) of pressurized gas from the upper surface of the robot hand 300F.

The main control device also drives the suction pad 342 of the second slide hand 340 upward, causing the suction pad 342 to suction and hold the underside of substrate P1. The main control device then drives the suction pad 342 in the +X direction along the rail 346, causing substrate P1 to slide from the substrate holder 28 onto the robot hand 300F. After substrate P1 has been slid onto the robot hand 300F, the main control device drives the robot hand 300F in the +X direction, retracts substrate P1 to the outside of chamber 200, and closes the unloading port shutter 156. The main control device also drives the external transport robot 300 in the +X direction, causing substrate P1 to be transported to an external device.

The main control device also drives the suction pad 27 of the substrate carry-in bearer device 25 to rise (see arrow R7), and begins suction-holding the -X end of substrate P2 with the suction pad 27 (see arrow R8). Furthermore, the main control device begins supplying pressurized gas from the top surface of the substrate feeder 166.

Then, the main control device drives the stage device 20 in the -X direction while the suction pads 27 of the substrate carry-in bearer device 25 are holding substrate P2 by suction. As a result, as in Figure 18(b), substrate P2 is transferred from the substrate feeder 166 onto the substrate holder 28. Note that while substrate P2 is being transferred from the substrate feeder 166 onto the substrate holder 28, pressurized gas is supplied from the top surface of the substrate holder 28.

Meanwhile, once substrate P2 has been transferred from substrate feeder 166 onto substrate holder 28, the main control device stops the supply of pressurized gas from the top surface of substrate feeder 166. After aligning (adjusting the position) substrate P2, the main control device drives the suction pad 27 downward and begins exposure of substrate P2, which has now been placed on substrate holder 28.

Then, the above-mentioned process is repeatedly performed to repeatedly expose multiple substrates P.

In the sixth embodiment, the board feeder 166 is suspended and supported by a pair of ropes 196, but this is not limited to this. For example, the board feeder 166 may be suspended and supported by a non-flexible mechanism. For example, the board feeder 166 may be suspended and supported by an air cylinder or the like.

The substrate feeder 166 may also have a first portion and a second portion, as in the fifth embodiment (see Figure 21(a)).

Seventh Embodiment
Next, the seventh embodiment will be described with reference to Fig. 25. Fig. 25 shows a state in which stage device 20 is positioned at the substrate exchange position in an exposure apparatus according to the seventh embodiment.

In the seventh embodiment, the substrate feeder 167 is supported on its upper surface by a support frame 78 provided on the +Y side of the substrate feeder 167. The substrate feeder 167 is also characterized in that it holds a substrate P (P2) newly loaded onto the substrate holder 28 in a non-contact suspended manner on its underside. The mechanism for non-contact suspended holding is the same as in the fourth embodiment. Note that the seventh embodiment does not have the partition member 152 present in the first to sixth embodiments, and the chamber 200 is provided with opening and closing doors 198a and 198b that open and close the opening 200a.

In the seventh embodiment, as described above, the partition member 152 is omitted, which allows the footprint of the entire exposure apparatus to be reduced. Furthermore, because the substrate feeder 167 is supported from the top side, it is possible to suppress the occurrence of bending in the substrate feeder 167 compared to when the substrate feeder 167 is cantilevered.

(Board replacement operation)
While the exposure operation is being performed in stage device 20, the main controller opens doors 198a and 198b (see arrow S1), and controls external transport robot 300 to position the −X end of newly loaded substrate P2 below the +X end of the underside of substrate feeder 167. Then, the main controller begins non-contact suspending and holding substrate P2 on the underside of substrate feeder 167, and uses substrate slide hand 140 to transport substrate P2 to the position shown in FIG.

Furthermore, as in the previous embodiments, the main control device causes the substrate slide hand 140 to hold the substrate P1 on the substrate holder 28 and drives it in the +X direction, sliding the exposed substrate P1 from the substrate holder 28 onto the robot hand 300F of the external transfer robot 300 (see arrow S2).

Then, the main control device causes the suction pad 27 of the substrate carry-in bearer device 25 to suction-hold substrate P2, and drives the stage device 20 in the -X direction to transfer substrate P2 from the substrate feeder 167 onto the substrate holder 28.

The subsequent operations are the same as those in the third embodiment described above.

Eighth Embodiment
Next, the eighth embodiment will be described in detail with reference to Figures 26 to 30. Figures 26(a) and 26(b) show a cross-sectional view and a longitudinal cross-sectional view of an exposure apparatus according to the eighth embodiment. Note that, for convenience, the chamber 200 is not shown in Figures 26 to 30.

In this eighth embodiment, the robot hand 300F' of the external transfer robot 300' has a flat plate-shaped member whose end on the -X side is processed into a comb-like shape. However, as in the previous embodiments, the robot hand 300F' is capable of supporting the substrate P in an air-floating manner by supplying pressurized gas from above, and is also capable of vacuum-adsorbing the substrate P.

In addition, in the eighth embodiment, a partition member 172 is used instead of the partition member 152 described in the first embodiment and the like. The partition member 172 has a box-shaped portion that forms a space 173, and a substrate feeder 168 is provided on the upper surface of the upper wall (the wall on the +Z side) of the box-shaped portion. An unloading port 172L is provided on the +X side wall of the box-shaped portion, and a substrate passage opening 172M is provided on the -X side wall of the box-shaped portion. An inlet 172U is provided above the unloading port 172L of the partition member 172. An unloading port shutter 156 is provided near the unloading port 172L, and an inlet shutter 154 is provided near the inlet 172U. Because Figure 26(b) is a cross-sectional view, the +Y and -Y sides of the box-shaped portion are closed by walls, although this is not shown.

The board feeder 168 is capable of reciprocating movement in the X-axis direction along a pair of rails 174 laid along the X-axis direction on the upper surface of the upper wall of the box-shaped portion of the partition member 172. The range of movement of the board feeder 168 in the X-axis direction is approximately half the length of the board P in the X-axis direction.

In addition, in this eighth embodiment, multiple (four in Figure 26(a)) rod-shaped air floating members 29 are provided at predetermined intervals in the Y-axis direction on the +X side end surface of the substrate holder 28. An opening (not shown) is provided on the upper surface (+Z surface) of the air floating member 29, and pressurized gas is supplied from this opening.

(Board replacement operation)
Next, the substrate exchange operation in the eighth embodiment will be explained using Figures 26 to 30. Figures 26(a) and 26(b), 27(a) and 27(b), and 28(a) and 28(b) show horizontal and vertical cross-sectional views of the vicinity of the stage device at the same timing. Figures 26(a) to 30(b) omit illustrations of components of the exposure apparatus that are not necessary for explanation.

(Operations in Figures 26(a) and 26(b))
In the states shown in FIGS. 26(a) and 26(b), exposure is being performed on substrate P1 in stage device 20. Meanwhile, in order to receive substrate P2, which will be exposed next, into chamber 200, the main controller slides loading entrance shutter 154 in the +Z direction to open loading entrance 152U (see arrow T1 in FIG. 26(b)). Next, the main controller drives external transfer robot 300' in the -X direction (see arrow T2 in FIGS. 26(a) and 26(b)) to cause the -X side end of substrate P2 to enter chamber 200. As a result, the -X side end of substrate P2 is positioned above the +X end of substrate feeder 168. Then, the main controller brings suction pad 142 of substrate slide hand 140 into contact with a portion of the underside of substrate P2 to begin suction and holding. The main controller also begins supplying pressurized gas from the upper surface of robot hand 300F' of external transfer robot 300' and the upper surface of substrate feeder 168.

(Operations in Figures 27(a) and 27(b))
The main control device drives suction pad 142 to move substrate P2 along the substrate support surface (upper surface) of substrate feeder 168 (see arrow T3).

(Operations in Figures 28(a) and 28(b))
28(a) and 28(b) due to the movement of suction pad 142, the main controller drives external transfer robot 300' downward (in the -Z direction) (see arrow T4) and positions it near unloading port 172L. The main controller also slides unloading port shutter 154 in the -Z direction to close unloading port 172U (see arrow T5).

(Operation of FIG. 29(a))
Thereafter, when exposure of substrate P1 in stage device 20 is completed, the main controller moves stage device 20 to the substrate exchange position (see arrow T6). With stage device 20 positioned at the substrate exchange position, air floating member 29 enters space 173 through substrate passage opening 172M, as shown in FIG. 29( a). The main controller also initiates suction and holding of substrate P2 by substrate feeder 168, and drives substrate feeder 168 in the −X direction along rails 174 (see arrow T7). Note that suction pad 142 holding substrate P2 may be moved in the −X direction in synchronization with the movement of substrate feeder 168, or, alternatively, suction and holding of substrate P2 by suction pad 142 may be released and suction pad 142 may be moved in the −X direction beforehand when substrate feeder 168 moves.

The main control device also slides the exit shutter 156 in the -Z direction to open the exit 172L (see arrow T8). The main control device also drives the external transfer robot 300' in the -X direction, causing the external transfer robot 300 to enter the space 173 formed by the partition member 172 (see arrow T9). In this state, the heights of the substrate holder 28 and air levitation member 29 and the upper surface of the robot hand 300F' of the external transfer robot 300' are approximately the same. Furthermore, the comb-like portions of the air levitation member 29 and the robot hand 300F' are nested, avoiding mechanical interference (contact).

(Operation of FIG. 29(b))
Next, the main control device slightly raises suction pad 27 of substrate carry-in bearer device 25 and causes suction pad 27 to suction-hold the underside of substrate P1. The main control device also begins the supply (air supply) of pressurized gas from the upper surface of substrate holder 28, and moves suction pad 27, which is suction-holding substrate P1, in the +Y direction, thereby slightly offsetting substrate P1 in the +Y direction from substrate holder 28. This offset allows suction pad 142 of substrate slide hand 140 to hold the corners on the -X and +Y sides of the underside of substrate P1.

The main control device then causes the suction pad 142 of the substrate slide hand 140 to suction and hold a portion of the underside of substrate P1. Note that at the stage shown in Figure 29(b), the main control device has already begun supplying pressurized gas (air supply) from the air floating member 29 and the upper surface of the robot hand 300F'.

Next, the main control device begins moving the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow T10). Also, when substrate P1 has moved a predetermined distance in the -X direction, the main control device drives the suction pad 27 of the substrate carry-in bearer device 25 in the +Z direction (see arrow T11), causing the suction pad 27 to begin suction-holding the -X end of substrate P2 on the substrate feeder 168.

(Operation of FIG. 30(a))
Next, the main control device begins supplying (gas inlet) pressurized gas from the top surface of the substrate feeder 168. Then, with the suction pad 27 of the substrate loading bearer device 25 suction-holding the substrate P2, the main control device drives the stage device 20 in the -X direction (see arrow T12). The main control device also moves the substrate feeder 168 in the +X direction while driving the stage device 20 in the -X direction. As a result, as shown in FIG. 10( a), substrate P2 is transferred from the substrate feeder 168 to the substrate holder 28. By driving the stage device 20 and the substrate feeder 168 in directions away from each other in the X direction, substrate P2 can be loaded onto the substrate holder 28 more quickly than by simply driving the stage device 20 in the -X direction. This is possible because the device is configured such that the substrate feeder 168 can be driven in the +X direction by providing a space 173 within the chamber 200. The timing for driving stage device 20 in the -X direction may be different from the timing for moving substrate feeder 168 in the +X direction. The main control device may also move substrate feeder 168 in the +X direction after transferring substrate P2 to substrate holder 28.

(Operation in FIG. 30(b))
The main control device continues to move the suction pad 142 in the +X direction, thereby transferring the substrate P1 onto the robot hand 300F' of the external transport robot 300', as shown in Figure 30(b). When this transfer is complete, the main control device stops the suction holding of the substrate P1 by the suction pad 142. The main control device also drives the external transport robot 300' holding the substrate P1 in the +X direction (see arrow T13), causing the substrate P1 to be transferred to the external device. The main control device also closes the transfer port 172L by sliding the transfer port shutter 156 in the +Z direction (see arrow T14).

Subsequent operations are the same as those in the first embodiment above.

As described in detail above, according to the eighth embodiment, the operation of loading substrate P2 into substrate holder 28 and the operation of unloading substrate P1 from substrate holder 28 can be performed in parallel, thereby reducing the time required for substrate replacement operations.

In addition, in the eighth embodiment, an air floating member 29 is provided on the +X side of the substrate holder 28, and the -X side end of the robot hand 300F' of the external transfer robot 300' is comb-shaped. This allows the air floating member 29 and the robot hand 300F' to be nested, making it possible to suppress bending of the substrate P when the substrate P is transferred.

In the eighth embodiment, as in the fourth embodiment, the substrate (the substrate to be transported) may be supported in a non-contact manner on the underside of the substrate feeder 168.

In the eighth embodiment, a shutter may be provided to open and close the substrate passage opening 172M. Alternatively, a shutter may be provided to open and close the substrate passage opening 172M, and the unloading exit shutter 156 may be omitted.

In the eighth embodiment, the rail 146 of the substrate slide hand 140 may be provided on the substrate feeder 168. In this case, since the substrate feeder 168 is movable in the X-axis direction, the length of the rail 146, i.e., the X-stroke of the suction pad 142, can be shortened.

Ninth Embodiment
Next, the ninth embodiment will be described with reference to Figures 31 and 32. Figures 31(a) and 31(b) show a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the ninth embodiment.

The exposure apparatus of the ninth embodiment is characterized in that it employs a substrate feeder 169 instead of the substrate feeder 168 of the eighth embodiment described above. Multiple grooves 169a (three in Figure 31(a)) are formed on the +X side of the top surface of the substrate feeder 169. The dimensions and spacing of the grooves 169a are set so that the substrate feeder 169 and the robot hand 300F' of the external transfer robot 300' do not come into contact with each other, even when the robot hand 300F' enters through the carry-in opening 172U. The rest of the configuration is the same as in the eighth embodiment.

(Board replacement operation)
Next, the substrate exchange operation in the ninth embodiment will be described with reference to Figures 31 and 32. Figures 31(a) and 31(b) and Figures 32(a) and 32(b) show horizontal and vertical cross-sectional views of the vicinity of the stage device at the same timing. Figures 31(a) to 32(b) omit illustration of components of the exposure apparatus that are not necessary for the explanation.

In the state shown in Figures 31(a) and 31(b), exposure is being performed on substrate P1 placed on substrate holder 28 in stage device 20. In this state, the main control device opens load entrance 172U by sliding load entrance shutter 154 in the +Z direction to accept substrate P2, which will be exposed next, into chamber 200 (see arrow U1 in Figure 31(b)). Next, the main control device drives external transfer robot 300' in the -X direction (see arrow U2 in Figures 31(a) and 31(b)). This operation of external transfer robot 300' positions approximately the -X half of robot hand 300F' and approximately the -X half of substrate P2 above substrate feeder 169, as shown in Figures 32(a) and 32(b).

The main control device then drives the robot hand 300F' downward to transfer a portion of the substrate P2 to the substrate feeder 169.

The main control device then begins supplying pressurized gas from the substrate support surface (top surface) of the substrate feeder 169 and the top surface of the robot hand 300F'. The main control device also drives the suction pad 142, causing the +Y side and -X side ends of substrate P2 to be suction-held by the suction pad 142.

Then, the main control device performs the same operations as in the eighth embodiment to replace the substrate on the substrate holder 28.

As described above, according to the ninth embodiment, the external transfer robot 300' enters the chamber 200 and transfers approximately the -X side half of the substrate P2 to the substrate feeder 169, thereby shortening the X-direction movement range (stroke) and Z-direction movement range of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200. This also shortens the movement time of the suction pad 142.

In addition, when the substrate is transferred from the external transfer robot 300' to the substrate feeder 169, it is transferred from above, which reduces the possibility of the substrate coming into contact with the substrate feeder 169 due to bending (sagging) of the substrate tip compared to when the substrate is transferred by sliding it.

Tenth Embodiment
Next, a tenth embodiment will be described using Figures 33 and 34. Figures 33(a) to 34(b) show cross-sectional views of an exposure apparatus according to the tenth embodiment. As shown in Figure 33(a), the exposure apparatus of the tenth embodiment is characterized in that, unlike the ninth embodiment described above, the rails 146 of the substrate slide hand 140 are fixed to a substrate feeder 169. The rest of the configuration is the same as in the ninth embodiment.

(Board replacement operation)
The substrate exchange operation in the exposure apparatus of the tenth embodiment will be explained below with reference to FIGS. 33(a) to 34(b).

In Figure 33(a), exposure is being performed on substrate P1 placed on substrate holder 28 in stage device 20. In this state, the main control device opens load entrance 172U by sliding the load entrance shutter 154 in the +Z direction to accept substrate P2, which will be exposed next, into chamber 200. Next, the main control device drives external transfer robot 300' in the -X direction (see arrow V1). This operation of external transfer robot 300' positions approximately the -X half of robot hand 300F' and approximately the -X half of substrate P2 above substrate feeder 169, as shown in Figure 33(b).

The main control device then drives the robot hand 300F' downward until the top surface of the robot hand 300F' is at a height that is approximately flush with the top surface of the substrate feeder 169, thereby transferring a portion of the substrate P2 to the substrate feeder 169. The main control device then begins supplying pressurized gas from the substrate support surface (top surface) of the substrate feeder 169 and the top surface of the robot hand 300F'. The main control device also drives the suction pad 142, causing the +Y and -X side ends of the substrate P2 to be suction-held by the suction pad 142.

Next, as shown in FIG. 34(a), the main control device drives the suction pad 142 in the -X direction to move substrate P2 along the substrate support surface of the substrate feeder 169 (see arrow V2). Thereafter, when exposure of substrate P1 in the stage device 20 is completed, the main control device drives the substrate feeder 169 in the -X direction (see arrow V3) and drives the external transfer robot 300' in the +X direction to retract it from the chamber 200 (see arrow V4), as shown in FIG. 34(b). The main control device then replaces the substrate on the substrate holder 28 by performing operations similar to those of the eighth embodiment described above (operations in FIGS. 29(a) to 30).

As described above, according to the tenth embodiment, the external transfer robot 300' enters the chamber 200 and transfers approximately the -X side half of the substrate P2 to the substrate feeder 169, thereby shortening the X-direction movement range (stroke) and Z-direction movement range of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200. This also shortens the movement time of the suction pad 142.

In addition, when the substrate is transferred from the external transfer robot 300' to the substrate feeder 169, it is transferred from above, which reduces the possibility of the substrate coming into contact with the substrate feeder 169 due to bending (sagging) of the substrate tip compared to when the substrate is transferred by sliding it.

In addition, in the tenth embodiment, the rail 146 of the substrate slide hand 140 is provided on the substrate feeder 169, making it possible to shorten the movement range (stroke) of the substrate slide hand 140 in the X-axis direction compared to the ninth embodiment.

Eleventh Embodiment
Next, an exposure apparatus according to an eleventh embodiment will be described with reference to FIGS.

Figures 35(a) and 35(b) show a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eleventh embodiment. For convenience, the chamber 200 is not shown in Figures 35(a), 35(b), etc.

As shown in Figures 35(a) and 35(b), in this eleventh embodiment, an external transfer robot 301 is used instead of the external transfer robot 300' of the ninth embodiment. Furthermore, the partition member 172 is provided with a surrounding member 182 that forms a space 171 that covers the substrate feeder 169.

As shown in FIG. 35(a), the external transfer robot 301 has multiple (e.g., five) fingers 301F, but unlike the external transfer robots 300 and 300', it does not have the function of air-floating the substrate P. Furthermore, to match the finger 301F of the external transfer robot 301, the length of the groove 169a in the substrate feeder 169 in the X-axis direction is set longer than in the ninth embodiment. Note that an uneven member such as a substrate support pad may be present on the upper surface of the finger 301F of the external transfer robot 301.

An opening 172N is formed in the surrounding member 182 attached to the partition member 172. In this eleventh embodiment, the finger 301F of the external transfer robot 301 enters the chamber 200, but the range of entry is limited to the spaces 171 and 173. In this eleventh embodiment, an air exhaust device 183 that exhausts air in the +Z direction is provided in the space 173. The air exhaust device 183 may be supplied with high-pressure air from a compressor commonly used in factory equipment. The air exhaust device 183 may also use a fan, such as that disclosed in Japanese Patent Application Laid-Open No. 2009-073660.

The rest of the configuration is the same as in the ninth embodiment.

(Board replacement operation)
Next, the substrate exchange operation in the eleventh embodiment will be described in detail using Figures 35(a) to 38(c). Figures 35(a) and 35(b), 36(a) and 36(b), and 37(a) and 37(b) show horizontal and vertical cross-sectional views of the vicinity of the stage device at the same timing. Figures 35(a) to 38(c) omit illustrations of components of the exposure apparatus that are not necessary for the explanation.

(Operations in Figures 35(a) and 35(b))
35(a) and 35(b), exposure is being performed on substrate P1 in stage device 20. Meanwhile, the main control device opens load port 152U by sliding load port shutter 154 in the +Z direction (see arrow α1 in FIG. 35(b)) to receive substrate P2, which will be exposed next, into chamber 200 (inside space 171).

(Operations in Figures 36(a) and 36(b))
Next, the main controller drives the external transfer robot 301 in the -X direction (see arrow α2 in Figures 36(a) and 36(b)). This operation of the external transfer robot 301 positions approximately the -X side half of the fingers 301F of the external transfer robot 301 and approximately the -X side half of the substrate P2 above the substrate feeder 169, as shown in Figures 36(a) and 36(b). In this state, the main controller drives the external transfer robot 301 downward, thereby transferring a portion of the substrate P2 to the substrate feeder 169. The main controller then commences the supply of pressurized gas from the substrate feeder 169. The main controller also drives the suction pad 142 to suction-hold the end of the substrate P2 on the +Y side and the -X side onto the suction pad 142.

(Operations in Figures 37(a) and 37(b))
Next, the main control device moves substrate P2 to the position shown in Figures 37(a) and 37(b) by driving suction pad 142 in a direction intersecting the X-axis and Z-axis within the XZ plane (the tilt direction of the substrate support surface of substrate feeder 169) (see arrow α3). The main control device also drives external transfer robot 301 in the +X direction to move finger 301F out of space 171. Then, when the +X end of substrate P2 is positioned on the -X side of load entrance shutter 154 and the -X end of finger 301F of external transfer robot 301 is positioned on the +X side of load entrance shutter 154, the main control device slides load entrance shutter 154 in the -Z direction to close load entrance 172U (see arrow α4). The main control device also drives external transfer robot 301 in the -Z direction to position the -X end of finger 301F near load exit 172L (see arrow α5).

(Operation of FIG. 38(a))
Next, the main control device initiates suction and holding of substrate P2 by substrate feeder 169 and drives substrate feeder 169 in the -X direction (see arrow α6). Note that suction pad 142 holding substrate P2 may be moved in the -X direction in synchronization with the movement of substrate feeder 169, or, when substrate feeder 169 moves, suction and holding of substrate P2 by suction pad 142 may be released and suction pad 142 may be moved in the -X direction in advance. The main control device also slides exit shutter 156 in the -Z direction to open exit 172L (see arrow α7). Furthermore, the main control device drives external transport robot 301 in the -X direction (see arrow α8) to cause finger 301F to penetrate exit 172L and substrate passage port 172M.

(Operation of FIG. 38(b))
Thereafter, when exposure of substrate P1 in stage device 20 is completed, the main control device moves stage device 20 to the substrate exchange position below substrate feeder 169 (see arrow α9). At this time, air floating member 29 provided on substrate holder 28 and finger portion 301F of external transfer robot 301 become nested.

The main control device also controls the air exhaust device 183 to begin exhausting high-pressure air upward (see dashed arrow α10). The main control device also begins supplying pressurized gas from the upper surface of the substrate holder 28 and the upper surface of the air floating member 29. The main control device also uses the substrate carry-in bearer device 25 to offset substrate P1 in the +Y direction, causes the suction pad 27 to suction and hold a portion of substrate P2, and drives the suction pad 27 in the +X direction (see arrow α11 in Figure 38(c)).

The main control device then drives the suction pad 27 of the substrate loading bearer device 25 upward, causing the suction pad 27 to suction-hold the -X end of substrate P2. The main control device also begins supplying pressurized gas (air supply) from the top surface of the substrate feeder 169. Then, with the suction pad 27 of the substrate loading bearer device 25 suction-holding substrate P2, the main control device drives the stage device 20 in the -X direction (see arrow α12) and simultaneously moves the substrate feeder 169 in the +X direction (see arrow α13). As a result, as shown in FIG. 38(c), substrate P2 is transferred from the substrate feeder 169 onto the substrate holder 28. This allows substrate P2 to be loaded onto the substrate holder 28 more quickly by driving the stage device 20 and the substrate feeder 169 away from each other in the X direction, rather than simply loading substrate P2 onto the substrate holder 28 by driving the stage device 20 in the -X direction. This is possible because the device is configured so that the substrate feeder 169 can be driven in the +X direction by providing space 173 within chamber 200. The timing for driving stage device 20 in the -X direction and the timing for moving substrate feeder 168 in the +X direction may be different. The main control device may move substrate feeder 169 in the +X direction after transferring substrate P2 to substrate holder 28. The main control device also finely drives suction pad 27 to align (adjust the position) substrate P2. The main control device then drives suction pad 27 downward, causing substrate holder 28 to begin suction-holding substrate P2, and begins exposure of substrate P2 newly placed on substrate holder 28. The main control device may also move substrate feeder 169 in the +X direction after transferring substrate P2 to substrate holder 28 (see arrow α13).

Furthermore, the main control device continues to drive the suction pad 142 in the +X direction (see arrow α11), thereby transferring substrate P1 from the substrate holder 28 and air floating member 29 to the external transfer robot 301. During this transfer of substrate P1, high-pressure air is ejected upward from the air exhaust device 183, preventing contact between the fingers 301F of the external transfer robot 301 and substrate P1, even if the external transfer robot 301 does not have the function of supplying pressurized gas. The main control device then stops the air exhaust device 183 and begins suction-holding substrate P1 with the fingers 301F. The main control device then drives the external transfer robot 301 in the +X direction to transfer substrate P1 out of the chamber 200 and closes the transfer port shutter 156.

This completes the board replacement operation.

As explained above, in addition to achieving the same effects as in the ninth embodiment, by using the air exhaust device 183, it is possible to prevent contact between the finger portion 301F and the substrate P1 even if the external transfer robot 301 does not have a mechanism for supplying pressurized gas. Furthermore, by providing the spaces 171 and 173 in the partition member 172, it is possible to prevent dust from entering the vicinity of the exposure apparatus main body 10.

In the eleventh embodiment, shutters may be provided at the substrate passage opening 172M and the opening 172N. This can prevent dust from entering the chamber 200.

Twelfth Embodiment
Next, the twelfth embodiment will be described in detail with reference to Figures 39 to 41. Figure 39(a) shows a vertical cross-sectional view of the vicinity of a partition member 172 according to the twelfth embodiment, and Figure 39(b) shows a cross-sectional view taken along line B-B in Figure 39(a).

In addition to the configuration of the eleventh embodiment described above, the twelfth embodiment is characterized in that a belt retraction mechanism 40 is provided in the air exhaust device 183 provided in the space 173.

The belt reeling mechanism 40 includes a pair of rails 41 mounted on the air exhaust device 183 with their longitudinal direction in the X-axis direction, a pair of movable bodies 43 movable in the X-axis direction along the rails 41, and movable members 42 connected to each of the movable bodies 43 with their longitudinal direction in the Y-axis direction. The movable members 42 have multiple (e.g., four) convex portions protruding in the Z direction at predetermined intervals in the Y-axis direction. The belt reeling mechanism 40 also includes multiple (e.g., four) belts 45, one end of which is fixed to each of the convex portions of the movable members 42, and a weight member 47 fixed to the other end of each belt 45. Each belt 45 is threaded around a pulley 48 fixed to a shaft member extending in the Y-axis direction mounted on the air exhaust device 183.

In the belt reeling mechanism 40, when no driving force in the -X direction is applied to the movable body 43, the weight member 47 abuts against the bottom surface of the space 173, as shown in Figure 39(a), and the state shown in Figure 39(a) is maintained. On the other hand, when a driving force in the -X direction is applied to the movable body 43, the moving member 42 moves in the -X direction, and the length of the portion of the belt 45 extending in the X-axis direction increases.

(Board replacement operation)
Next, the substrate exchange operation in the exposure apparatus of the twelfth embodiment will be described in detail based on Figures 40(a) to 41(c).

Figure 40(a) shows a state in which exposure of substrate P1 has been completed in stage device 20, and substrate P2 has been transported onto substrate feeder 169 by external transport robot 301, as in the 11th embodiment described above, and substrate feeder 169 has moved in the -X direction. In this case, weight member 47 of belt payout mechanism 40 is in contact with the bottom surface of space 173.

In FIG. 40(a), the main control device opens the unloading port 172L by sliding the unloading port shutter 156 in the -Z direction (see arrow β1 in FIG. 40(a)). Then, as shown in FIG. 40(b), the main control device causes the finger 301F of the external transfer robot 301 to enter through the unloading port 172L (see arrow β2) and drives the stage device 20 to the substrate exchange position (below the substrate feeder 169) (see arrow β3). In this case, as shown in FIG. 41(a), each of the air levitation members 29 provided on the substrate holder 28 is aligned in the same line as each belt 45. Furthermore, because the finger 301F of the external transfer robot 301 is nested within the belt 45 and the air levitation member 29, the finger 301F does not come into contact with the belt 45 or the air levitation member 29. Furthermore, the belt 45 has many small holes, and when high-pressure air is supplied from the air exhaust device 183, some of the high-pressure air passes through the holes. This allows the belt 45 to have the same function as the air floating member 29. This allows the substrate P1 to slide while floating or semi-floating relative to the belt 45.

In other words, in the state shown in Figure 41(a), by sliding the substrate P1 placed on the substrate holder 28 in the +X direction using the substrate slide hand 140, the substrate P1 can be moved above the finger portions 301F of the external transport robot 301 without bending the substrate P1, even if the finger portions 301F of the external transport robot 301 do not have the function of air levitation.

After that, as in the 11th embodiment, substrate P2 is transferred from substrate feeder 169 onto substrate holder 28, and substrate P1 is transferred from substrate holder 28 to external transfer robot 300. In this operation, the main control device drives stage device 20 in the -X direction, and moves moving member 42 in the -X direction to follow the driving of stage device 20 in the -X direction. This makes it possible to maintain a state in which air floating member 29 or belt 45 is positioned with almost no gap between fingers 301F of external transfer robot 301, as shown in Figure 41(b).

Figure 41 (c) shows a state in which substrate P2 is placed on substrate holder 28 and substrate P1 is positioned above finger portions 301F of external transfer robot 301. From this state, the main control device drives external transfer robot 301 upward, thereby transferring substrate P1 to external transfer robot 301. The main control device then stops air exhaust device 183 and begins suction-holding substrate P1 with finger portions 301F. The main control device then drives external transfer robot 301 in the +X direction to retract it from space 173, and slides exit shutter 156 in the +Z direction to close exit 172L.

In the above explanation, the external transport robot 301 is inserted into the space 173, and then the substrate P1 is slid into the space 173, but this is not limited to this. For example, the external transport robot 301 may be inserted into the space 173 after the substrate P1 has been slid into the space 173.

(Modification)
In the above embodiments, the case where an unloading outlet shutter and an inlet shutter are provided near the unloading outlet and inlet of the partition members 152, 172 has been described, but this is not limited to this, and the unloading outlet shutter and the inlet shutter may also be provided in the chamber 200.

The board feeder of each of the above embodiments may be a board feeder 264 as shown in Figure 42, and the top surface of the board feeder 264 may be covered by fixing a cover 199 to a pair of block-shaped members 265 provided on the +Y side and -Y side surfaces of the board feeder 264. Furthermore, in the case of a board feeder with a groove formed on the top surface, the cover 199 may be provided so as to cover all but the area above the groove.

The cover 199 has an inverted U-shaped YZ cross section, and substrates can be slid in and out of the space between the cover 199 and the substrate feeder 264 from the +X side and the -X side, respectively. While Figure 42 shows a case where the cover 199 is transparent, the cover 199 does not have to be transparent. In this modified example, providing the cover 199 prevents dust from adhering to the substrate P and allows the temperature of the substrate P to be kept constant.

In the sixth embodiment (Figures 22(a), 22(b), etc.), if the board feeder 264 of Figure 42 is used, the upper surface of the cover 199 may be suspended and supported by the suspension mechanism 186. In the seventh embodiment (Figure 25), if the board feeder 264 of Figure 42 is used, the cover 199 may be provided on the underside of the board feeder.

Furthermore, the substrate feeder of each of the above embodiments may employ a substrate feeder 364 as shown in Figure 43(a). The top surface of the substrate feeder 364 is curved. By curving the top surface (substrate support surface) of the substrate feeder 364 in this way, the section modulus of the substrate can be increased. In other words, the same effect can be obtained as if the thickness of the substrate were several to several hundred times larger than its actual thickness in response to the bending of the substrate.

By doing this, even if substrate P is placed on substrate feeder 364 with the -X end protruding as shown in Figure 43 (b), it is possible to prevent bending (sagging) at the -X end of substrate P. Furthermore, because bending (sagging) of substrate P is prevented, when substrate P is brought into contact with substrate holder 28, it is possible to bring substrate P into contact from the center of the -X side in the Y-axis direction, making it less likely that wrinkles will occur at the -X end of substrate P.

An ionizer may also be installed near the substrate feeder. This allows for static elimination as a countermeasure against static electricity on the substrates before they are placed on the substrate holder 28.

The above-described embodiment is a preferred example of the present invention. However, it is not limited to this, and various modifications are possible within the scope of the gist of the present invention.

10 Exposure apparatus main body 100 Exposure apparatus 200 Chamber 300 External transfer robot 28 Substrate holder 160 Substrate feeder

Claims (16)

an optical system for illuminating the substrate;
a stage device that moves while holding the substrate;
a holder for holding the substrate;
a chamber that accommodates the optical system, the stage device, and the holder;
a control device that moves the stage device,
the stage device includes a holding device;
the holder is located at a position where the substrate can be held while the substrate is positioned within the opening of the chamber;
The control device
With the stage device positioned below the holding unit, a portion of the substrate held by the holding unit that does not overlap with an exposure region is held by the holding device;
moving the stage device away from the holder while the portion of the substrate is held by the holder so that the stage device receives the substrate from the holder; and
causing the optical system to irradiate the substrate while moving the stage device holding the substrate relative to the optical system;
Exposure equipment. The exposure apparatus according to claim 1, wherein the holding unit holds the substrate so that the substrate is inclined relative to the upper surface of the stage device. the holder changes the attitude of the substrate held by the holder so that the substrate moves from a state inclined with respect to the upper surface of the stage device to a state approaching parallel to the upper surface of the stage device.
2. The exposure apparatus according to claim 1. The control device
With the stage device positioned below the holding unit, the part held in a non-contact manner by the holding unit is brought into contact with the holding device and held thereon;
moving the stage device away from the holder while the portion of the substrate is held in contact with the holding device so that the stage device holds the substrate in a non-contact state; and lowering the holding device that is holding the portion of the substrate in contact with the stage device, so that the substrate is held in contact with the stage device.
The exposure apparatus according to any one of claims 1 to 3. the stage device includes a hole for supplying gas to the rear surface of the substrate;
The control device
the gas is supplied to the rear surface of the substrate through the hole, thereby causing the stage device to hold the substrate in a non-contact manner.
5. The exposure apparatus according to claim 4. The exposure apparatus of claim 1, wherein the control device moves the stage device away from the holder while the portion of the substrate is held by the holder so that the substrate slides on the holder and the stage device receives the substrate from the holder. The exposure apparatus according to claim 1, wherein the holding device is provided at an end of the stage device in the direction in which the stage device moves. The exposure apparatus of claim 1, wherein the holding portion is located between the opening and the optical system. the stage device moves in a scanning direction relative to the optical system while holding the substrate;
the holding portion is located between the opening and the optical system in the scanning direction.
2. The exposure apparatus according to claim 1. The exposure apparatus of claim 1, wherein the control device moves the stage device closer to the optical system and farther away from the holder while the portion of the substrate is held by the holder so that the stage device receives the substrate from the holder. a base supporting the optical system;
The exposure apparatus according to claim 1 , wherein the surface plate has a notch for avoiding contact with the substrate held by the holder . The exposure apparatus of claim 1, wherein the opening is openable and closable. a vibration isolation device installed on a first area of the floor and supporting the optical system;
2. The exposure apparatus according to claim 1, further comprising: a support member that is installed on the second area of the floor and that supports the holder. The exposure apparatus of claim 1, wherein the holding unit holds the substrate in a non-contact manner below the holding unit. 2. The exposure apparatus according to claim 1, wherein the control device moves the stage device away from the holder, and moves the holder in a direction opposite to the direction of movement of the stage device . exposing a substrate using the exposure apparatus according to any one of claims 1 to 3 and 6 to 15 ;
and developing the exposed substrate.