JP7809740B2 - High melting Ni-based alloy containing P - Google Patents
High melting Ni-based alloy containing PInfo
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- JP7809740B2 JP7809740B2 JP2024048940A JP2024048940A JP7809740B2 JP 7809740 B2 JP7809740 B2 JP 7809740B2 JP 2024048940 A JP2024048940 A JP 2024048940A JP 2024048940 A JP2024048940 A JP 2024048940A JP 7809740 B2 JP7809740 B2 JP 7809740B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22—CASTING; POWDER METALLURGY
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
- C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C30/00—Alloys containing less than 50% by weight of each constituent
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
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- Coating By Spraying Or Casting (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
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Description
本発明は、Pを含有するNi基自溶合金およびそのアトマイズ粉末、ならびにこれらを用いた耐食性、耐割れ性、高靭性に優れる金属皮膜、鋼部品に関する。とりわけ、固相線温度が低く、低温での皮膜形成や緻密化処理が可能であって、γNiマトリックス中にPが固溶及び/又はPを含有する化合物が微細分散する組織を有する高溶融性Ni基合金に関する。 The present invention relates to a Ni-based self-fluxing alloy containing P, its atomized powder, and metal coatings and steel parts using these alloys that have excellent corrosion resistance, crack resistance, and toughness. In particular, the present invention relates to a high-melting Ni-based alloy that has a low solidus temperature, allows for low-temperature coating formation and densification, and has a structure in which P is dissolved in a γNi matrix and/or P-containing compounds are finely dispersed.
従来より、自溶性合金として、日本産業規格(JIS)H8303(自溶合金溶射)に規定されたNi基合金やCo基合金がある。これらの自溶性合金は主に溶射法や肉盛溶接法などの表面処理に適用され、耐食性や耐摩耗性に優れた皮膜形成に用いられている。それらの皮膜の硬度は、15~60HRC程度である。 Traditionally, self-fluxing alloys include Ni-based alloys and Co-based alloys, as specified in Japanese Industrial Standard (JIS) H8303 (Self-fluxing alloy thermal spraying). These self-fluxing alloys are primarily used in surface treatments such as thermal spraying and overlay welding, and are used to form coatings with excellent corrosion and wear resistance. The hardness of these coatings is approximately 15 to 60 HRC.
そして、ニッケル基及びコバルト基合金にB(ボロン)、Si(シリコン)などのフラックス成分を含有させたものを用いた溶射では、溶射後にフュージング処理を行うことで緻密な皮膜を得ることができる。JIS H8303に規定の成分では、Bが1.0~4.5質量%程度、Siが1.5~5.0質量%程度の範囲で必須に含有されている。 When thermal spraying is performed using nickel-based or cobalt-based alloys containing flux components such as B (boron) and Si (silicon), a dense coating can be obtained by performing a fusing process after thermal spraying. The components specified in JIS H8303 require an essential content of approximately 1.0 to 4.5 mass% B and 1.5 to 5.0 mass% Si.
このフュージング温度は、通常は1000~1200℃程度である。その際、合金中の酸化されやすいBやSiの一部がB2O3やSiO2となり、溶射皮膜中および基材表面の金属酸化物を溶解し、一種の硼珪酸ガラスとなりスラグのように溶射皮膜の表面に浮上する。このフラックス作用により、溶射皮膜が酸化物や気孔の極めて少ないものとなる。また、このフュージング時に溶射皮膜内で溶射粒子同士が融合し、組織が均一化する。さらに、フュージング時に基材と溶射皮膜との間で相互拡散し、その境界に数10μm程度の合金層が形成され、冶金的に結合される。 The fusing temperature is usually around 1000 to 1200°C. During this process, some of the easily oxidized B and Si in the alloy become B2O3 and SiO2 , dissolving the metal oxides in the thermal spray coating and on the substrate surface, forming a type of borosilicate glass that floats to the surface of the thermal spray coating like slag. This flux action results in a thermal spray coating with very few oxides and pores. During this fusing process, spray particles fuse together within the thermal spray coating, resulting in a uniform structure. Furthermore, interdiffusion occurs between the substrate and the thermal spray coating during fusing, forming an alloy layer of approximately several tens of microns at the boundary, which is metallurgically bonded.
このように、自溶性合金は、組織中に初晶や共晶の酸化物や炭化物を含んでいるため、優れた耐摩耗性を示す。また、塩酸、硫酸、弗酸、苛性ソーダなどの各種腐食環境に対して優れた耐食性を示す。 As such, self-fluxing alloys exhibit excellent wear resistance because they contain primary and eutectic oxides and carbides in their structure. They also exhibit excellent corrosion resistance in various corrosive environments, such as hydrochloric acid, sulfuric acid, hydrofluoric acid, and caustic soda.
自溶性合金は、主に溶射法や肉盛溶接法などの表面処理に適用され、耐食性や耐摩耗性に優れた皮膜形成に用いられる。それらの硬度としては、15~60HRC程度である。また、皮膜の緻密性に関して、自溶性合金の特徴を以下に述べる。JIS H 8303(自溶合金溶射)に規定されており、ニッケル基及びコバルト基合金にB、Siなどのフラックス成分を含有させたものである。溶射後にフュージング処理を行うことで緻密な皮膜を得ることができる。それらJIS規定の成分は、Bを1.0~4.5質量%程度、Siを1.5~5.0質量%程度の範囲で必須で含有している。 Self-fluxing alloys are primarily used in surface treatments such as thermal spraying and build-up welding, forming coatings with excellent corrosion and wear resistance. Their hardness ranges from approximately 15 to 60 HRC. Regarding the density of the coating, the characteristics of self-fluxing alloys are described below. Specified in JIS H 8303 (Self-fluxing alloy thermal spraying), these alloys contain flux components such as B and Si in nickel-based and cobalt-based alloys. A dense coating can be obtained by performing a fusing process after thermal spraying. The JIS-specified components essentially contain approximately 1.0 to 4.5 mass% B and 1.5 to 5.0 mass% Si.
通常、このフュージング温度は1000~1200℃程度で行い、その際、合金中の酸化されやすいBやSiの一部がB2O3やSiO2となり、溶射皮膜中および基材表面の金属酸化物を溶解し、一種のほうけい酸ガラスとなりスラグのように溶射皮膜の表面に浮上する。このフラックス作用により、溶射皮膜が酸化物や気孔が少ない皮膜が得られやすい。また、このフュージング時に溶射皮膜内で溶射粒子同士が融合し、組織が均一化しやすい。さらに、フュージング時に基材と溶射皮膜との間で相互拡散し、その境界に数10μm程度の合金層を形成、冶金的に結合させやすい。 Typically, this fusing temperature is around 1000 to 1200°C, during which some of the easily oxidized B and Si in the alloy become B2O3 and SiO2 , dissolving the metal oxides in the thermal spray coating and on the substrate surface, forming a type of borosilicate glass that floats to the surface of the thermal spray coating like slag. This flux action makes it easy to obtain a thermal spray coating with few oxides and pores. Furthermore, during this fusing, the spray particles fuse together within the thermal spray coating, facilitating a homogenous structure. Furthermore, interdiffusion occurs between the substrate and the thermal spray coating during fusing, forming an alloy layer of about several tens of micrometers at the boundary, facilitating metallurgical bonding.
自溶性合金は、組織中に初晶や共晶の酸化物や炭化物を含んでいるため、一般的に優れた耐摩耗性が高くなることが期待されている。また、塩酸、硫酸、弗酸、苛性ソーダなどの各種腐食環境に対しての耐食性も期待されている。 Self-fluxing alloys contain primary and eutectic oxides and carbides in their structure, so they are generally expected to have excellent wear resistance. They are also expected to have corrosion resistance in various corrosive environments such as hydrochloric acid, sulfuric acid, hydrofluoric acid, and caustic soda.
また、本願出願人は、P:0.2~6.0%、B:0.1~4.5%、Si:0.1~5.0%、C:0.00~2.00%、Cr:0.0~30.0%、Mo:0.0~9.0%、W:0.0~18.0%、Cu:0.0~10.0%、Mn:0.0~10.0%、Fe:0.0~10.0%、Co:0.0~10.0%、Al:0.00~0.20%、Ti:0.00~0.20%、Zr:0.00~0.20%、Hf:0.00~0.20%からなり、2.3≦P%+B%+Si%≦ 11.0、Mo%+W%/2≦9.0、Al%+Ti%+Zr%+Hf%≦0.20を満足するNi基自溶合金を提案している(特許出願1参照。)。 The applicant has also developed a steel sheet with a composition consisting of P: 0.2-6.0%, B: 0.1-4.5%, Si: 0.1-5.0%, C: 0.00-2.00%, Cr: 0.0-30.0%, Mo: 0.0-9.0%, W: 0.0-18.0%, Cu: 0.0-10.0%, Mn: 0.0-10.0%, Fe: 0.0-10.0%, Co: 0.0-10.0%, Al: 0.00-0.20%, Ti: 0.00-0.20%, Zr: 0.00-0.20%, and Hf: 0.00-0.20%, where 2.3≦P%+B%+Si%≦ We have proposed a Ni-based self-fluxing alloy that satisfies the following conditions: 11.0, Mo% + W%/2≦9.0, Al% + Ti% + Zr% + Hf%≦0.20 (see Patent Application 1).
近年、自溶性合金が使用されてきた表面処理において、使用用途も拡大し、これまでの適用場面よりも、より耐久性が必要とされる航空機、自動車、ボイラー、農業機械分野など幅広い分野への適用が検討され始めている。そこで、従来の使用用途に加えて異なった使用環境へも適用できるようにと、その要求特性が高まりつつある。 In recent years, the applications of self-fluxing alloys for surface treatment have expanded, with consideration being given to their application in a wide range of fields, including aircraft, automobiles, boilers, and agricultural machinery, where greater durability is required than in previous applications. Therefore, the required characteristics are increasing, so that they can be used in different environments in addition to their traditional applications.
これまでは、SUS304(融点1398~1427℃)や一般構造用鋼(融点約1580℃)などのFe基を代表とした高融点の基材として、これにNi基自溶合金を皮膜し、耐食性や耐摩耗性などを向上させることが一般的であった。そのため、溶射などの施工時や、その後の再溶融処理の温度が基材の溶融や変形に与える影響は小さかった。 Until now, it has been common to use high-melting-point substrates, typically Fe-based materials such as SUS304 (melting point 1398-1427°C) and general structural steel (melting point approximately 1580°C), and then coat them with a Ni-based self-fluxing alloy to improve corrosion resistance and wear resistance. As a result, the temperature during thermal spraying and subsequent remelting processes has had little effect on the melting and deformation of the substrate.
一方で、高い熱伝導性や電気伝導性を必要とする部材では、従来よりも低融点であるCu(融点1084℃)などの基材への表面処理も必要とされている。ところがそれら低融点基材へのNi基自溶合金による皮膜形成については、施工時の温度だけでなく、再溶融処理の温度が基材に与える影響が非常に大きいものとなる。従来のNi基自溶合金での再溶融には1000~1200℃程度で再溶融処理が必要となるが、すると、基材の溶融や変形、それら熱的影響による基板の特性劣化は否めないものとなってしまう。 On the other hand, for components that require high thermal and electrical conductivity, surface treatments are also required for substrates such as Cu (melting point 1084°C), which has a lower melting point than conventional materials. However, when forming a coating using a Ni-based self-fluxing alloy on such low-melting-point substrates, the temperature of the re-melting process, as well as the temperature during application, have a significant impact on the substrate. Re-melting with conventional Ni-based self-fluxing alloys requires re-melting at around 1000-1200°C, which inevitably leads to melting and deformation of the substrate, as well as degradation of the substrate's properties due to these thermal effects.
加えて、皮膜施工時や再溶融処理時の温度が高温になればなるほど、含有しているBが拡散し易くなり、基板のFeやCrなどと反応し、硬質で粗大な硼化物を晶出させ、基材と皮膜の密着性を損なうおそれがある。 In addition, the higher the temperature during coating application or remelting treatment, the more easily the contained B diffuses, reacting with Fe, Cr, etc. in the substrate and causing the crystallization of hard, coarse borides, which may impair the adhesion between the substrate and the coating.
また、ステンレス鋼基材の結晶粒が粗大化し強度低下を起こしたり、Ni基自溶合金皮膜との界面で過度に耐食性が劣化する原因となったりする。 In addition, the crystal grains in the stainless steel substrate become coarse, causing a decrease in strength, and can cause excessive deterioration in corrosion resistance at the interface with the Ni-based self-fluxing alloy coating.
他にも、皮膜施工時や再溶融処理時の温度が高温になればなるほど、使用する燃料が増え、多量のCO2排出に至ってしまう。 In addition, the higher the temperature during coating and remelting treatment, the more fuel is used, resulting in a large amount of CO2 emissions.
また、従来材はB、Siが硬質な硼化物や珪化物は晶出し、硬さや耐摩耗性には効果的な役割を果すことができている。一方で、硬さや耐摩耗性よりも耐割れ性や高靭性が必要となるところにおいては、Cr含有量を下げることで、それらの硬質相の晶出を抑えたSFNi1(15~30HRC)、SFNi2(30~40HRC)、SFNi3(40~50HRC)などにより対応しようとしていた。もっとも、これらの従来材は硬質相の晶出の硬さを制御するのみであるから、硬さと靭性を両立させることは不可能であった。さらに、硬質相が減少することで耐摩耗性などの他の特性を得ることも難しかった。 Furthermore, in conventional materials, B and Si crystallize hard borides and silicides, which play an effective role in improving hardness and wear resistance. However, in areas where crack resistance and high toughness are more important than hardness and wear resistance, attempts have been made to address this by lowering the Cr content, thereby suppressing the crystallization of these hard phases, using materials such as SFNi1 (15-30 HRC), SFNi2 (30-40 HRC), and SFNi3 (40-50 HRC). However, because these conventional materials only control the hardness of the hard phase crystallization, it is impossible to achieve both hardness and toughness. Furthermore, the reduction in hard phase makes it difficult to obtain other properties such as wear resistance.
このような問題に対処するべく、従来材よりも低い温度で施工、緻密化処理できる材料であって、より幅広い分野、用途にも適用することが可能な高溶融性Ni基合金の開発が望まれている。 To address these issues, there is a need for the development of a high-melting Ni-based alloy that can be processed and densified at lower temperatures than conventional materials and that can be used in a wider range of fields and applications.
特許文献1のNi基自溶性合金は、Pを含有していることから、その固相線温度又は液相線温度は低く、比較的低温での処理により皮膜が形成でき、主部が高温に曝されにくい。もっとも、再溶融熱処理温度は従前のように高いままであることから、粗大なP化合物が形成してしまいやすく、微細な組織が得られておらず、また皮膜を形成させる際には基板が変形しやすいものとなるなど、未だ十分ではなかった。 The Ni-based self-fluxing alloy in Patent Document 1 contains P, so its solidus or liquidus temperature is low, allowing a coating to be formed by processing at a relatively low temperature, and the main part is less likely to be exposed to high temperatures. However, because the remelting heat treatment temperature remains high as before, coarse P compounds tend to form, a fine structure is not obtained, and the substrate is prone to deformation when forming the coating, so it is still not satisfactory.
そこで、本発明は、(1)Pを含有させることで従来の自溶性合金(JIS H 8303)よりも低い固相線温度を有し、低温度で容易に皮膜形成でき、その後の熱処理も低温で緻密な皮膜を形成可能であること、かつ、(2)γNiマトリックス中にPが固溶及び/又はPを含有する化合物が微細分散する組織を有する高溶融性Ni基合金およびアトマイズ粉末を提供することを目的とする。また、これを用いた耐食性、耐割れ性、高靭性に優れる皮膜を提供すること、及び、かかる皮膜を備えた部品を提供すること、を目的とする。 The present invention aims to provide (1) a high-melting Ni-based alloy and atomized powder that, by incorporating P, has a lower solidus temperature than conventional self-fluxing alloys (JIS H 8303), allowing for easy film formation at low temperatures and subsequent heat treatment to form a dense film at low temperatures, and (2) has a structure in which P is solid-solved and/or compounds containing P are finely dispersed in a gamma Ni matrix. It also aims to provide a film using this that has excellent corrosion resistance, crack resistance, and toughness, and to provide a part equipped with such a film.
そこで発明者らは、従来のNi-Si-Bの三元共晶温度よりも低温で共晶組織を有することができれば、固相線温度を下げることができるのではないかと考え、Pに着目した。Ni-Pの共晶温度は870℃であり、Pを添加することで従来材(Ni-Si-B系)よりも飛躍的に低い固相線温度となるのでは、と考えたためである。 The inventors therefore focused on P, thinking that if they could create a eutectic structure at a temperature lower than the conventional Ni-Si-B ternary eutectic temperature, they might be able to lower the solidus temperature. The eutectic temperature of Ni-P is 870°C, and they thought that adding P would result in a solidus temperature that was dramatically lower than that of conventional materials (Ni-Si-B system).
実際にB、SiをP置換することでCrP化合物ではなく、Ni-Ni3P共晶構造をとることが判明した。そこで、従来の固相線温度よりも100℃以上低下させることに成功した。 It was found that by substituting P for B and Si, the material takes on a Ni-Ni 3 P eutectic structure rather than a CrP compound, and this has resulted in a reduction of the solidus temperature by more than 100°C compared to conventional materials.
すると、従来よりも低温で処理が可能となるため、再溶融処理時の基材の溶融や変形、Bの拡散により生じる硬質で粗大な硼化物による基材と皮膜の密着性低下、基材の結晶粒が粗大化による強度低下や耐食性劣化、使用燃料の増大によるCO2排出量の増加、といった課題を全て解決することができた。 This allows processing at lower temperatures than before, solving all of the problems that arise, such as melting and deformation of the substrate during remelting processing, reduced adhesion between the substrate and the coating due to hard, coarse borides formed by the diffusion of B, reduced strength and corrosion resistance due to coarsening of the substrate's crystal grains, and increased CO2 emissions due to increased fuel use.
さらに、低温処理が可能になったことで皮膜施工時、例えば本発明材のアトマイズ粉末を溶射して皮膜形成させる場合、従来よりも低温で溶射することができ、再溶融処理だけでなく、溶射時の低温化にも成功している。また、従来では溶射距離に制限があったものが、今まで以上に長い距離でも溶射することが可能になり、溶射施工のハンドリングの改善にもつながっている。 Furthermore, the ability to perform low-temperature processing means that when applying a coating, for example when spraying atomized powder of the material of the present invention to form a coating, it is possible to spray at a lower temperature than before, successfully reducing the temperature not only for the remelting process but also during spraying. Furthermore, whereas there was previously a limit to the spraying distance, it is now possible to spray over longer distances, which also leads to improved handling during spraying.
Pを添加することで、γNiマトリックス中にPが固溶及び/又はPを含有する10μm以下である化合物が分散し、さらにそれらが網目状のネットワークとなった組織構造を有することで、マトリックスの強度を向上させた。それだけではなく、Ni-Ni3P共晶で10μm以下の化合物が微細分散しているため、マトリックスの均一な強度を維持することができ、皮膜としても均一な硬さが得られた。これにより、耐摩耗性だけでなく、従来では困難であった硬さと靭性を両立させることに成功した。 By adding P, P is dissolved in the γNi matrix and/or P-containing compounds of 10 μm or less are dispersed, forming a mesh-like network structure, which improves the strength of the matrix. Furthermore, because compounds of 10 μm or less are finely dispersed in the Ni-Ni 3 P eutectic, it is possible to maintain uniform strength in the matrix and obtain uniform hardness in the coating. This has succeeded in achieving not only wear resistance but also both hardness and toughness, which was previously difficult to achieve.
このようにこれまでPの効果とその組織構造について詳細に検討した事例はない。 As such, there has been no previous case in which the effects of P and its organizational structure have been examined in detail.
そこで、本発明の課題を解決する第1の手段は、質量%で
P:0.1~7.0%、
B:0.0(0%を含む)~5.0%、
Si:0.0(0%を含む)~5.0%、
C:0.0(0%を含む)~2.0%、
Cr:0.0(0%を含む)~30.0%、
Mo,W:MoとWの1種もしくは2種をMo+W/2で0.0(0%を含む)~9.0%、
Cu:0.0(0%を含む)~10.0%、
Mn,Fe,Co:Mn,Fe,Coの1種もしくは2種以上を各0.0(0%を含む)~10.0%、
残部Niおよび不可避的不純物からなるNi基合金であり、
P含有量が1%以下の硬質相とγNiマトリックス中にPが固溶及び/又はPを含有する10μm以下である化合物が分散する組織を有し、
さらに800℃以上950℃以下の固相線温度を有すること、
を特徴とする高溶融性Ni基合金である。
なお、ここで高溶融性とは、いわゆる自溶性であることを意味している。すなわち、低温で溶けやすい、処理しやすい合金である。
Therefore, the first means for solving the problems of the present invention is to provide a composition containing, in mass %, P: 0.1 to 7.0%,
B: 0.0 (including 0%) to 5.0%,
Si: 0.0 (including 0%) to 5.0%
C: 0.0 (including 0%) to 2.0%,
Cr: 0.0 (including 0%) to 30.0%,
Mo, W: One or both of Mo and W are 0.0 (including 0%) to 9.0% at Mo+W/2;
Cu: 0.0 (including 0%) to 10.0%,
Mn, Fe, Co: one or more of Mn, Fe, and Co are each 0.0 (including 0%) to 10.0%;
The balance is a Ni-based alloy consisting of Ni and unavoidable impurities,
The alloy has a structure in which P is dissolved in a hard phase having a P content of 1% or less and a γNi matrix in which P is dispersed and/or a compound containing P and having a size of 10 μm or less is dispersed,
Further, it has a solidus temperature of 800°C or higher and 950°C or lower.
It is a high melting Ni-based alloy characterized by the above.
Here, the term "high melting property" means that the alloy is self-fluxing, i.e., it is an alloy that melts easily at low temperatures and is easy to process.
その第2の手段は、硬質相は、硼化物あるいは炭化物であって、
その円相当径サイズは20μm以下であり、
その面積率は20%以下であること、を特徴とする第1の手段に記載の高溶融性Ni基合金である。
The second means is that the hard phase is a boride or a carbide,
The equivalent circle diameter is 20 μm or less,
The high melting property Ni-based alloy according to the first aspect is characterized in that the area ratio is 20% or less.
その第3の手段は、1000℃以上の液相線温度を有すること、を特徴とする第1又は第2の手段に記載の高溶融性Ni基合金である。 The third means is a high-melting Ni-based alloy according to the first or second means, characterized in that it has a liquidus temperature of 1000°C or higher.
その第4の手段は第1~第3のいずれか1の手段に記載の高溶融性Ni基合金からなる高溶融性Ni基合金皮膜である。 The fourth means is a high-melting Ni-based alloy coating made of the high-melting Ni-based alloy described in any one of the first to third means.
その第5の手段は、940℃未満での再溶融処理された状態の皮膜であって、皮膜の空隙率が、再溶融皮膜中の空隙率/溶射皮膜中の空隙率≦0.5であり、さらにその皮膜はPを含有したγNiマトリックスが網目構造を有すること、を特徴とする第4の手段に記載の高溶融性Ni基合金皮膜である。 The fifth means is the high-melting Ni-based alloy coating according to the fourth means, characterized in that the coating is in a state where it has been remelted at less than 940°C, the porosity of the coating is porosity in the remelted coating/porosity in the thermal spray coating ≦ 0.5, and the coating has a P-containing gamma Ni matrix with a network structure.
その第6の手段は、第1~第3のいずれか1の手段に記載の高溶融性Ni基合金からなる皮膜形成用アトマイズ粉末である。 The sixth aspect is an atomized powder for forming a coating, which is made of a high-melting Ni-based alloy described in any one of the first to third aspects.
その第7の手段は、第4又は第5に記載する皮膜を有する硬さ、耐食性、耐割れ性に優れる部品である。 The seventh means is a part that has the coating described in the fourth or fifth means and has excellent hardness, corrosion resistance, and crack resistance.
本発明は、Pを添加することで、従来よりも低温で処理が可能なため、再溶融処理時の基材の溶融や変形、Bの拡散により生じる硬質で粗大な硼化物による基材と皮膜の密着性低下、基材の結晶粒が粗大化による強度低下や耐食性劣化、使用燃料の増大によるCO2排出量の増加、といった課題をいずれも解決することができる。さらに、低温処理が可能になったことで皮膜施工時、例えば本発明材のアトマイズ粉末を溶射して皮膜形成させる場合、従来よりも低温で溶射することができ、再溶融処理だけでなく、溶射時の低温下の効果も得られる。また、従来では溶射距離に制限があったものが、今まで以上に長い距離でも溶射することが可能になり、溶射施工のハンドリングの改善にもつながっている。 The addition of P in the present invention allows processing at lower temperatures than conventional methods, thereby resolving a variety of issues, including melting and deformation of the substrate during remelting, reduced adhesion between the substrate and the coating due to hard, coarse borides formed by the diffusion of B, reduced strength and corrosion resistance due to coarsening of the substrate's crystal grains, and increased CO2 emissions due to increased fuel consumption. Furthermore, the ability to perform low-temperature processing means that when applying a coating, for example, by thermal spraying the atomized powder of the material of the present invention, the coating can be sprayed at a lower temperature than conventional methods, providing the benefits of not only the remelting process but also the low temperature during thermal spraying. Furthermore, whereas conventional methods were limited in the spraying distance, it is now possible to spray over longer distances, leading to improved handling during thermal spraying.
さらに、Pを添加することで、γNiマトリックス中にPが固溶及び/又はPを含有する10μm以下である化合物が分散し、さらにそれらが網目状のネットワークとなった組織構造を有することで、マトリックスの強度を向上させることができる。それだけではなく、Ni-Ni3P共晶で10μm以下の化合物が微細分散しているため、マトリックスの均一な強度を維持することができ、皮膜としても均一な硬さが得られた。これにより、耐摩耗性だけでなく、従来では困難であった硬さと靭性を両立させることができる。 Furthermore, by adding P, P dissolves in the γNi matrix and/or P-containing compounds of 10 μm or less are dispersed, forming a mesh-like network structure, which improves the strength of the matrix. Furthermore, because compounds of 10 μm or less are finely dispersed in the Ni-Ni 3 P eutectic, it is possible to maintain uniform strength in the matrix and obtain uniform hardness in the coating. This not only improves wear resistance, but also achieves both hardness and toughness, which was previously difficult to achieve.
本発明を実施するための形態の説明に先立ち、本発明の合金の成分を規定する理由について説明する。なお、以下成分における%の記載は質量%のことである。 Before describing the embodiments of the present invention, we will explain the reasons for specifying the alloy components of the present invention. Note that the percentages used in the following descriptions of the components refer to mass percent.
P:0.1~7.0%
本発明合金においてPは固相線温度低下のための必須元素である。しかしながら、添加量が多すぎると粗大な燐化物の晶出により過度に高硬度となり皮膜を脆化させたり機械加工を困難してしまったりする。0.1%未満の添加では固相線温度低下の効果が十分でなく、7.0%を超えて添加すると液相線温度が過度に上昇してしまう。好ましくは0.2%を超え6.0%未満、より好ましくは0.5%を超え5.0%未満である。
P: 0.1-7.0%
In the alloy of the present invention, P is an essential element for lowering the solidus temperature. However, if added in an excessive amount, coarse phosphides crystallize, resulting in excessively high hardness, embrittling the coating, and making machining difficult. If added in an amount of less than 0.1%, the effect of lowering the solidus temperature is insufficient, and if added in excess of 7.0%, the liquidus temperature rises excessively. The P content is preferably more than 0.2% and less than 6.0%, and more preferably more than 0.5% and less than 5.0%.
特にPの効果により、BやSi添加だけでは得られなかった従来にない低い固相線温度が得られ、1000℃未満、さらには950℃未満、最も低温では800℃台での再溶融処理が可能となる。 In particular, the effect of P allows for an unprecedentedly low solidus temperature that could not be achieved by adding B or Si alone, making remelting possible at temperatures below 1000°C, even below 950°C, and even as low as the 800°C range.
このように固相線温度が低いため、従来よりも低温で溶射することが可能になる。そのため、再溶融処理だけでなく、皮膜施工時にかかる熱エネルギーを1~2割低下させた場合においても皮膜化可能である。 Because the solidus temperature is so low, thermal spraying is possible at lower temperatures than before. This means that not only can it be applied by remelting, but it can also be applied to coatings even when the thermal energy used during coating application is reduced by 10 to 20 percent.
さらに、従来通りの施工条件で皮膜を作製した場合、皮膜施工時の距離(溶射距離)を通常の1.5倍に延長することも可能となる。 Furthermore, if the coating is produced under conventional application conditions, it is possible to extend the distance (spraying distance) during coating application by 1.5 times the normal distance.
ここで、P添加による高い固相線温度低下効果は、Niとの2元状態図における固相線温度が、Bの約1093℃、Siの約1143℃に対し、Pは約870℃と著しく低いことが影響しているものと推測される。 Here, it is speculated that the significant effect of adding P in lowering the solidus temperature is due to the fact that the solidus temperature in the binary phase diagram with Ni is significantly lower at approximately 870°C for P, compared to approximately 1093°C for B and approximately 1143°C for Si.
さらに、Pを添加することで、基材と皮膜界面の耐食性劣化が抑制される。本合金をSUS304母材に溶射、再溶融処理し塩水噴霧試験を実施すると、従来のP無添加のNi自溶合金より界面の発銹が抑制された。母材との界面のミクロ組織観察の結果、従来のP無添加Ni自溶合金においては、Ni自溶合金に含有されるBが母材のSUS304の粒界に過度に拡散し、SUS304中のCrと反応しCr系硼化物を生成しており、結果として周囲のSUS304基地のCr濃度が下がり、いわゆるステンレス鋼の鋭敏化に類似の現象が見られ、耐食性が劣化していた。これに対しPを含有する本発明合金の場合、このBの粒界拡散が抑制されており、Bと同様に粒界に拡散するPにより、Bの拡散が抑制されたものと推測される。なお、P無添加Ni自溶合金のBの粒界拡散は、例えばSUS316母材であればCr、Mo系硼化物を生成し周囲の基地の耐食性を劣化し、軟鋼母材であれば生成するFe硼化物そのものが周囲の基地より耐食性が低い。 Furthermore, the addition of P suppresses deterioration of corrosion resistance at the interface between the substrate and the coating. When this alloy was thermally sprayed onto SUS304 substrate, remelted, and subjected to salt spray testing, rusting at the interface was suppressed compared to conventional P-free Ni self-fluxing alloys. Microstructural observation of the interface with the substrate revealed that in conventional P-free Ni self-fluxing alloys, the B contained in the Ni self-fluxing alloy diffused excessively to the grain boundaries of the SUS304 substrate, reacting with Cr in the SUS304 to form Cr-based borides. As a result, the Cr concentration in the surrounding SUS304 matrix decreased, a phenomenon similar to the sensitization of stainless steel was observed, and corrosion resistance deteriorated. In contrast, in the P-containing alloy of the present invention, this B grain boundary diffusion was suppressed, and it is presumed that this was suppressed by P, which also diffuses to grain boundaries in the same way as B. Furthermore, grain boundary diffusion of B in P-free Ni self-fluxing alloys produces Cr and Mo borides in SUS316 base material, degrading the corrosion resistance of the surrounding base material; in mild steel base material, the Fe borides that form themselves have lower corrosion resistance than the surrounding base material.
またさらに、Pは再溶融処理を行なっていない溶射ままの皮膜においても緻密化が促進される。この現象についての詳細な理由は不明であるが、単に低い固相線温度を有することのほか、溶射により本合金粒子が高温で飛翔している間に、Pを含む比較的昇華温度の低い酸化物がわずかながらガス化し、皮膜中の酸化物が低減されることにも起因すると推察される。すなわち、溶射法においては、高温で粒子が飛翔する間に、わずかながら粒子の酸化は不可避であるが、その酸化物が皮膜の緻密化を阻害してしまう効果をガス化により無害化もしくは低減していると推察される。 Furthermore, P promotes densification even in as-sprayed coatings that have not been remelted. The detailed reasons for this phenomenon are unknown, but in addition to the fact that it simply has a low solidus temperature, it is thought to be due to the fact that oxides containing P, which have relatively low sublimation temperatures, gasify slightly while the alloy particles are flying at high temperatures during thermal spraying, reducing the amount of oxide in the coating. In other words, in the thermal spraying method, slight oxidation of the particles is unavoidable while the particles are flying at high temperatures, but it is thought that the effect of these oxides, which inhibits densification of the coating, is neutralized or reduced by gasification.
加えて、PはγNiマトリックス中にPが固溶及び/又はPを含有する10μm以下である化合物が分散し、さらにそれらが網目状のネットワークとなった組織構造を有することで、マトリックスの強度を向上させることができる。図2、3の皮膜中のやや濃い灰色に現れるエリアが、Pが固溶及び/又はPを含有する10μm以下である化合物が分散した部分に該当する。それだけではなく、Ni-Ni3P共晶で10μm以下の化合物が微細分散しているため、マトリックスの均一な強度を維持することができ、皮膜としても均一な硬さが得られる。これにより、耐摩耗性だけでなく、従来では困難であった硬さと靭性を両立させることに役立っている。こうしたP化合物が微細分された均一な硬さの組織は、たとえば皮膜においては、Pの添加に加えてさらに再溶融処理温度を940℃よりも低い温度とすることによって得ることができる。 In addition, P improves the strength of the matrix by dispersing P-containing and/or P-containing compounds of 10 μm or less in size in the γ-Ni matrix, forming a network structure. The dark gray areas in Figures 2 and 3 correspond to the dispersed P-containing and/or P-containing compounds of 10 μm or less. Furthermore, the fine dispersion of compounds of 10 μm or less in the Ni-Ni 3 P eutectic maintains uniform matrix strength and provides uniform hardness for the coating. This not only improves wear resistance, but also helps achieve both hardness and toughness, which was previously difficult to achieve. A uniformly hard structure with finely dispersed P compounds can be achieved, for example, by adding P and remelting the coating at a temperature lower than 940°C.
B:0.0~5.0%
本発明合金においてBは固相線温度低下および皮膜中酸化物の還元作用のため、必要に応じて添加しても良い。BやSiの一部がB2O3やSiO2となり、溶射皮膜中および基材表面の金属酸化物を溶解し、一種のほうけい酸ガラスとなりスラグのように溶射皮膜の表面に浮上するフラックス作用により、溶射皮膜の酸化物や気孔の削減、緻密化に効果がある。しかしながら、過度に添加すると粗大な硼化物の晶出により液相線温度を上昇させてしまう。また、硼化物を形成することで硬くなってしまう。Pが固相線温度の低下の役割を担うため、無添加でもよい。一方、5.0%を超えて添加すると液相線温度が過度に上昇してしまうため、好ましくは4.0%未満、好ましくは2.0%未満である。
B: 0.0-5.0%
In the alloy of the present invention , B may be added as needed to lower the solidus temperature and reduce oxides in the coating. Part of the B and Si forms B2O3 and SiO2 , dissolving metal oxides in the thermal spray coating and on the substrate surface. This forms a type of borosilicate glass, which floats to the surface of the thermal spray coating like slag, acting as a flux, reducing oxides and pores in the thermal spray coating and increasing its density. However, excessive addition raises the liquidus temperature due to the crystallization of coarse borides. Furthermore, the formation of borides increases the hardness. Since P lowers the solidus temperature, no addition is necessary. However, adding more than 5.0% of B excessively raises the liquidus temperature, so the content is preferably less than 4.0%, and more preferably less than 2.0%.
Si:0.0~5.0%
本発明合金においてSiは固相線温度低下および皮膜中酸化物の還元作用のため、必要に応じて添加しても良い。BやSiの一部がB2O3やSiO2となり、溶射皮膜中および基材表面の金属酸化物を溶解し、一種のほうけい酸ガラスとなりスラグのように溶射皮膜の表面に浮上するフラックス作用により、溶射皮膜の酸化物や気孔の削減、緻密化に効果がある。しかしながら、添加量が多すぎると皮膜を過度に硬くし、脆化させたり、機械加工を困難にしてしまったりする。Pが固相線温度の低下の役割を担うため、無添加でもよい。5.0%を超えて添加すると過度に高硬度となるため、好ましくは4.0%未満、より好ましくは3.0%未満である。
Si: 0.0-5.0%
In the alloy of the present invention , Si may be added as needed to lower the solidus temperature and reduce oxides in the coating. A portion of the B and Si forms B2O3 and SiO2 , dissolving metal oxides in the thermal spray coating and on the substrate surface. This forms a type of borosilicate glass, which floats to the surface of the thermal spray coating like slag, acting as a flux, reducing oxides and pores in the thermal spray coating and increasing its density. However, adding too much Si can make the coating excessively hard, embrittling it and making it difficult to machine. Since P plays a role in lowering the solidus temperature, no addition is necessary. Adding more than 5.0% Si results in excessively high hardness, so the content is preferably less than 4.0%, more preferably less than 3.0%.
C:0.0~2.0%
本発明合金においてCは硬さ増加の効果があり、必要に応じ添加してもよい。しかしながら、添加量が多すぎると皮膜を過度に硬くし脆化させたり、機械加工を困難にしてしまったりする。2.0%を超えて添加すると過度に高硬度となる。好ましくは1.8%未満、より好ましくは1.6%未満である。
C: 0.0-2.0%
In the alloy of the present invention, C has the effect of increasing hardness and may be added as needed. However, if the amount added is too large, the coating becomes excessively hard and embrittled, and machining becomes difficult. If added in excess of 2.0%, the hardness becomes excessively high. Preferably, the C content is less than 1.8%, more preferably less than 1.6%.
Cr:0.0~30.0%
本発明合金においてCrは耐食性改善の効果があり、必要に応じ添加してもよい。しかしながら、30.0%を超えて添加すると液相線温度が過度に上昇してしまう。好ましくは20.0%未満、より好ましくは18.0%未満である。
Cr: 0.0-30.0%
In the alloy of the present invention, Cr has the effect of improving corrosion resistance and may be added as needed. However, if the content exceeds 30.0%, the liquidus temperature will rise excessively. Preferably, the content is less than 20.0%, more preferably less than 18.0%.
Mo+W/2:0.0~9.0%
本発明合金においてMo、Wは耐食性改善の効果があり、必要に応じ添加してもよい。なお、WはMoと比較し質量%で1/2の効果である。しかしながら、過度に添加すると液相線温度が上昇してしまうとともにMoおよび/またはWを高濃度に含む粗大燐化物が生成し、過度に高硬度となり皮膜を脆化させたり機械加工を困難にしてしまったりする。Mo+W/2が9.0%を超えて添加すると液相線温度が過度に上昇してしまう。好ましくは5.0%未満、より好ましくは4.0%未満である。
Mo+W/2: 0.0~9.0%
In the alloy of the present invention, Mo and W have the effect of improving corrosion resistance and may be added as needed. The effect of W is half that of Mo, in terms of mass percent. However, excessive addition of W increases the liquidus temperature and generates coarse phosphides containing high concentrations of Mo and/or W, resulting in excessively high hardness, embrittlement of the coating, and difficulty in machining. Addition of Mo+W/2 exceeding 9.0% excessively increases the liquidus temperature. The content is preferably less than 5.0%, more preferably less than 4.0%.
Cu:0.0~10.0%
本発明合金においてCuは耐食性改善の効果があり、必要に応じ添加してもよい。しかしながら、過度に添加すると耐食性が低下してしまう。10.0%を超えて添加すると耐食性が低下する。好ましくは5.0%未満、より好ましくは4.0%未満である。
Cu: 0.0-10.0%
In the alloy of the present invention, Cu has the effect of improving corrosion resistance and may be added as needed. However, excessive addition of Cu reduces corrosion resistance. If Cu is added in excess of 10.0%, corrosion resistance will also decrease. Preferably, Cu is less than 5.0%, more preferably less than 4.0%.
Mn,Fe,Co:0.0~10.0%
本発明合金においてMn,Fe,Coは特性に大きな影響を与えない元素であり、それぞれ10%を上限として添加してもよい。
Mn, Fe, Co: 0.0-10.0%
In the alloy of the present invention, Mn, Fe, and Co are elements that do not have a significant effect on the properties, and may be added up to an upper limit of 10% each.
(組織の特徴)
P含有量が1%以下の硬質相とγNiマトリックス中にPが固溶及び/又はPを含有する10μm以下である化合物が分散する組織であること
Pは硬質相にはわずかに含まれるのみで、主としてγNiマトリックス中に存在する。Pが固溶及び/又はPを含有する10μm以下である化合物が分散し(図2、3の皮膜中に濃いグレーに現れた部分。)、さらにそれらが網目状のネットワークとなった組織構造を有することで、マトリックスの強度を向上させることができる。それだけではなく、Ni-Ni3P共晶で10μm以下の化合物が微細分散しているため、マトリックスの均一な強度を維持することができ、皮膜としても均一な硬さが得られる。これにより、耐摩耗性だけでなく、従来では困難であった硬さと靭性の両立を可能としている。
(Organizational characteristics)
The structure is one in which P is dissolved in a hard phase containing 1% or less of P and compounds containing P with a size of 10 μm or less are dispersed in a gamma-Ni matrix. P is only present in trace amounts in the hard phase, primarily in the gamma-Ni matrix. The dispersion of P is dissolved in a solid phase and/or compounds containing P with a size of 10 μm or less (the dark gray areas in Figures 2 and 3) and these compounds form a mesh-like network, improving the strength of the matrix. Furthermore, the fine dispersion of compounds with a size of 10 μm or less in the Ni-Ni 3 P eutectic maintains uniform strength in the matrix, resulting in uniform hardness for the coating. This not only improves wear resistance, but also enables the combination of hardness and toughness, which was previously difficult to achieve.
800℃以上950℃以下の固相線温度であること
P添加により固相線温度の低下が得られるが、他方でCr,B,Siなどの含有量によって液相線温度が変化する。固相線温度が950℃を越えると、再溶融処理の際に基板に及ぼす熱的影響が大きくなる。
Solidus temperature must be between 800°C and 950°C. The addition of P lowers the solidus temperature, but the liquidus temperature varies depending on the content of Cr, B, Si, etc. If the solidus temperature exceeds 950°C, the thermal impact on the substrate during remelting processing becomes significant.
1000℃以上の液相線温度であること
本発明合金では、液相線温度が1000℃以上であることが好ましい。液相線温度が1000℃未満であり、固相線と液相線の温度の幅が非常に狭い場合には、再溶融処理条件が困難になる。
Liquidus temperature of 1000° C. or higher: The liquidus temperature of the alloy of the present invention is preferably 1000° C. or higher. If the liquidus temperature is lower than 1000° C. and the temperature range between the solidus and liquidus is very narrow, the remelting treatment conditions become difficult.
硬質相は硼化物、炭化物であり、その円相当径サイズは20μm以下であり、その面積率は20%以下であること
20μm(サイズは円相当径で算出している。)を超える粗大な硬質相が20%以上存在すると、過度に硬く、脆化させたり、機械加工を困難にしてしまったりする。また、腐食は硬質相の粒界でも生じるため、硬質相のサイズ20μm未満でその面積率が20%を超える場合、腐食が進行しやすい。一方、硬質相のサイズ20μmを超え、その面積率が20%以下であれば粗大な硬質相を起点に割れるなど、機械加工性に影響を及ぼす。そこで、その円相当径サイズは20μm以下であり、その面積率は20%以下とすることが好ましい。
The hard phase is a boride or carbide, and its equivalent circle diameter is 20 μm or less, and its area ratio is 20% or less. If 20% or more of coarse hard phases exceeding 20 μm (the size is calculated as the equivalent circle diameter), the material becomes excessively hard, embrittling, and making machining difficult. Furthermore, since corrosion also occurs at the grain boundaries of the hard phase, if the hard phase size is less than 20 μm and its area ratio exceeds 20%, corrosion is likely to progress. On the other hand, if the hard phase size exceeds 20 μm and its area ratio is 20% or less, cracks may originate from the coarse hard phase, affecting machinability. Therefore, it is preferable that the equivalent circle diameter is 20 μm or less, and its area ratio is 20% or less.
940℃未満での再溶融処理を行った皮膜の空隙率が、再溶融皮膜中の空隙率/溶射皮膜中の空隙率≦0.5であること
固相線温度を低下させた場合でも、940℃以上、例えば従来通りの1000℃程度で再溶融処理をすると当然、皮膜は緻密になる(空隙率:再溶融皮膜中の空隙率/溶射皮膜中の空隙率≦0.5)。たとえば特許文献1においても940℃の再溶融処理しか行っておらず、その場合も当然緻密にはなる(空隙率:再溶融皮膜中の空隙率/溶射皮膜中の空隙率≦0.5)。しかしながら、高温過ぎるために材料が溶解し、形を維持できなくなり、ダレる現象が生じてしまう。他方で、本発明ではさらなる940℃未満の低温で処理などによって、上述の組織構造と緻密化の双方を達成することができる。
The porosity of a coating that has undergone remelting treatment at less than 940°C must be porosity in the remelted coating/porosity in the thermal spray coating ≦0.5. Even if the solidus temperature is lowered, if the remelting treatment is performed at 940°C or higher, for example, at the conventional temperature of around 1000°C, the coating will naturally become dense (porosity: porosity in the remelted coating/porosity in the thermal spray coating ≦0.5). For example, Patent Document 1 only performs remelting treatment at 940°C, and in this case, the coating will naturally become dense (porosity: porosity in the remelted coating/porosity in the thermal spray coating ≦0.5). However, because the temperature is too high, the material melts, losing its shape and causing sagging. On the other hand, in the present invention, both the above-mentioned structure and densification can be achieved by treatment at even lower temperatures, such as below 940°C.
低温での再溶融処理をする前の図1と低温で再溶融処理をした図2とで比較すると、図2では空隙が減少していることが確認できる。また、再溶融処理温度が高くなり過ぎると、図3に示すように、粗大組織構造となる。 Comparing Figure 1, which shows the sample before remelting at low temperature, with Figure 2, which shows the sample after remelting at low temperature, it can be seen that the number of voids has decreased in Figure 2. Furthermore, if the remelting temperature is too high, a coarse structure will result, as shown in Figure 3.
(実施例)
粉末の作製方法について
表1のNo.1~20に示す組成に秤量した原料を、それぞれ真空溶解炉により溶解し、高圧窒素ガスにより噴霧し、ガスアトマイズ粉末を得た。この粉末を篩分けによって45μm~125μmの粒度幅の粉末となるように分級し、供試粉末とした。
(Example)
Powder preparation method: Raw materials weighed to the compositions shown in Nos. 1 to 20 in Table 1 were melted in a vacuum melting furnace and atomized with high-pressure nitrogen gas to obtain gas atomized powders. These powders were classified by sieving to obtain powders with a particle size range of 45 μm to 125 μm, and used as test powders.
粉末の固相線温度の評価について
熱分析装置(DTA)を用い、供試粉末の固相線温度を評価した。測定には粉末を約30g使用し、真空引きした後にArガスを200ml/分でフローさせながら行なった。昇温速度20℃/分で室温から1500℃まで加熱し、1500℃で5分保持した。保持後、-20℃/分の速度で室温まで冷却し、冷却中のDTA信号に現れる発熱ピークについて、最も低温で発熱が終了する温度を固相線温度として評価した。
Evaluation of the solidus temperature of the powder The solidus temperature of the test powder was evaluated using a thermal analyzer (DTA). Approximately 30 g of powder was used for the measurement. After evacuation, Ar gas was flowed at 200 ml/min. The powder was heated from room temperature to 1500°C at a temperature increase rate of 20°C/min and held at 1500°C for 5 minutes. After holding, the powder was cooled to room temperature at a rate of -20°C/min. The lowest temperature at which the exothermic peaks appearing in the DTA signal during cooling ended was evaluated as the solidus temperature.
溶射皮膜の作製方法について
50×50×9mmのSUS304板を基板とし、50×50mmの面にブラスト処理を行った後、供試粉末の大気プラズマ溶射を行ない、皮膜を得た。その際、基板はエアーで冷却させながら溶射を行った。次いで、溶射皮膜が付された基板を電気炉に入れ、Arフロー中にて、本発明例No.1~12では表2に記載のとおり、固相線温度以上940℃未満の温度まで加熱し、20分間保持した後、炉冷によりフュージング皮膜を得た。皮膜厚さは約300μmとした。他方、比較例の再溶融処理温度については、表2に記載のとおりであり、940℃以上での比較も行なった。
Regarding the method for producing the thermal spray coating, a 50 x 50 x 9 mm SUS304 plate was used as a substrate. After blasting the 50 x 50 mm surface, the test powder was atmospherically plasma sprayed to obtain a coating. The substrate was cooled with air during the thermal spraying process. The substrate with the thermal spray coating was then placed in an electric furnace and heated in an Ar flow atmosphere to a temperature above the solidus temperature but below 940°C, as shown in Table 2 for invention examples 1 to 12. The temperature was then held for 20 minutes, and the furnace was cooled to obtain a fused coating. The coating thickness was approximately 300 μm. The remelting temperatures for the comparative examples were as shown in Table 2, and comparisons were also made at temperatures above 940°C.
溶射皮膜の残留ポアおよび残留酸化物の評価について
再溶融処理前の溶射皮膜と、再溶融処理をした皮膜(本発明例では固相線温度以上940℃未満の温度で再溶融処理をした。)について、断面観察用の試験片を切り出し、研磨し、光学顕微鏡の100倍で皮膜の厚さ方向の中心部付近を撮影し、500μm四方における20μm以上の残留ポアと残留酸化物の合計個数を評価した。なお、撮影された残留ポアもしくは残留酸化物の形状が円形ではなく楕円形の場合は、長径が20μm以上のものの個数を算出した。再溶融皮膜の個数/溶射皮膜の個数の値で評価した。
Evaluation of Residual Pores and Residual Oxides in Thermal Spray Coatings Test specimens for cross-sectional observation were cut out from the thermal spray coating before remelting treatment and from the remelted coating (in the present invention, the remelting treatment was performed at a temperature above the solidus temperature but below 940°C), polished, and photographed near the center of the coating in the thickness direction at 100x magnification using an optical microscope. The total number of residual pores and residual oxides of 20 μm or more per 500 μm square was evaluated. Note that when the shape of the photographed residual pores or residual oxides was elliptical rather than circular, the number of pores with a major axis of 20 μm or more was calculated. Evaluation was performed using the value of number of remelted coatings / number of thermal spray coatings.
溶射、再溶融皮膜の耐食性評価について
再溶融処理した皮膜(本発明例では固相線温度以上940℃未満の温度で再溶融処理をした。)について、断面を切り出し、研磨した試料を用い、耐食試験を実施した。塩水噴霧試験(5%NaCl-35℃-96h)を行い、皮膜および/または皮膜と母材の界面において発銹が一部にとどまったものをA、発銹が全体に渡るものBとした。
Regarding the corrosion resistance evaluation of thermal spray and remelted coatings, a corrosion resistance test was carried out on a cross-section of a remelted coating (in the present invention, the remelting was carried out at a temperature above the solidus temperature but below 940°C), which was cut out and polished. A salt spray test (5% NaCl, 35°C, 96 hours) was carried out, and samples in which rusting was limited to a small area on the coating and/or at the interface between the coating and the base metal were rated as A, and samples in which rusting was widespread were rated as B.
再溶融皮膜の硬さ評価について
再溶融処理した皮膜(本発明例では固相線温度以上940℃未満の温度で再溶融処理をした。)について、断面を切り出し、研磨した試料を用い、ビッカース硬さを評価した。試験力は2.94Nとし、5回測定の平均値を評価した。
Hardness evaluation of remelted coatings: For the remelted coatings (in the present invention, the remelting was performed at a temperature equal to or higher than the solidus temperature but lower than 940°C), cross sections were cut out and polished to evaluate the Vickers hardness. The test force was 2.94 N, and the average value of five measurements was used to evaluate the hardness.
再溶融処理後の基材の変形評価
再溶融処理した皮膜(基板込み)について、平面な土台の上に置いた際、土台と接地していないものは、変形していると判断した。(本発明例では固相線温度以上940℃未満の温度で再溶融処理をした。)接地しているものはA、土台に置いた基板が接地していない、不安定でガタガタしているものはBと評価した。
Evaluation of deformation of substrate after remelting treatment When the remelted coating (including substrate) was placed on a flat base, those that were not in contact with the base were judged to be deformed. (In the present invention, the remelting treatment was performed at a temperature above the solidus temperature but below 940°C.) Those that were in contact with the base were rated A, and those where the substrate placed on the base was not in contact with the base or was unstable and wobbly were rated B.
本発明例No.1~12のNi基合金では、いずれの皮膜もその再溶融熱処理温度が850~920℃と低く、皮膜中のP化合物のサイズは10μm以下で、Pがほぼ含有されていない硬質相の円相当径のサイズは20μm以下であり、皮膜の空隙率はいずれも0.5以下であり、Pが微細分散された組織が得られており、その耐食性、基板の変形評価のいずれも良好なAの皮膜を得ることができている。なお、発明例における硬質相のPの含有量は、SEM/EDSによる分析では、0.04~0.09%程度であり硬質相のPは1%以下であった。そこで、マトリックスの均一な強度、皮膜の均一な硬さ、硬さと靭性の両立が得られている。 For the Ni-based alloys of invention examples 1 to 12, the remelting heat treatment temperatures for all of the coatings were low, at 850 to 920°C. The size of the P compounds in the coating was 10 μm or less, the circle-equivalent diameter of the hard phase, which contained almost no P, was 20 μm or less, and the porosity of the coating was 0.5 or less in all cases, resulting in a structure with finely dispersed P. Coatings with excellent corrosion resistance and substrate deformation evaluation were obtained. Furthermore, the P content of the hard phase in the invention examples was approximately 0.04 to 0.09%, and P in the hard phase was 1% or less, as determined by SEM/EDS analysis. Therefore, uniform strength of the matrix, uniform hardness of the coating, and a balance of hardness and toughness were achieved.
比較例No.13は、Ni基合金中にPが添加されておらず、固相線温度が高いため、再溶融熱処理温度も高いものとなっており、基板の変形が認められた。
比較例No.14は、Pが過剰であり、粗大なP化合物が晶出しており、再溶融熱処理温度が高いので、基板の変形も認められた。
比較例No.15は、P及びCuが過剰であり、耐食性に劣っている。また、基板の変形も認められた。
比較例No.16は、B,Si,Cが過剰であるため皮膜が硬すぎており、粗大なP化合物が観察され、耐食性に劣り、基板の変形も認められた。
比較例No.17は、Crが過剰であり液相線温度が上昇しており、粗大なP化合物が観察され、耐食性に劣り、基板の変形も認められた。
比較例No.18は、Ni基合金中にPが添加されておらず、固相線温度が高いため、再溶融熱処理温度も高いものとなっており、基板の変形が認められた。また、Mo、Wの合計量、Mn,Fe,Coの合計量がいずれも過剰であり、液相線温度が過度に上昇しており、皮膜の硬さも高すぎるものであって、耐食性にも劣っている。
比較例No.19、20は、再溶融熱処理温度が940℃と温度が高いことから、粗大なP化合物が観察されており、基板の変形も認められた。
In Comparative Example No. 13, P was not added to the Ni-based alloy, and the solidus temperature was high, so the remelting heat treatment temperature was also high, and deformation of the substrate was observed.
In Comparative Example No. 14, P was excessive, coarse P compounds were crystallized, and deformation of the substrate was also observed due to the high remelting heat treatment temperature.
Comparative Example No. 15 contained excessive amounts of P and Cu, and was therefore inferior in corrosion resistance. Deformation of the substrate was also observed.
In Comparative Example No. 16, the coating was too hard due to the excess B, Si, and C, coarse P compounds were observed, the corrosion resistance was poor, and deformation of the substrate was also observed.
In Comparative Example No. 17, the Cr content was excessive, the liquidus temperature was elevated, coarse P compounds were observed, the corrosion resistance was poor, and deformation of the substrate was also observed.
In Comparative Example No. 18, P was not added to the Ni-based alloy, and the solidus temperature was high, so the remelting heat treatment temperature was also high, and deformation of the substrate was observed. In addition, the total amount of Mo and W and the total amount of Mn, Fe, and Co were all excessive, so the liquidus temperature was excessively high, and the hardness of the coating was too high, resulting in poor corrosion resistance.
In Comparative Examples 19 and 20, the remelting heat treatment temperature was as high as 940° C., so coarse P compounds were observed and deformation of the substrate was also observed.
本発明は、溶射皮膜の再溶融熱処理温度を低くすることができるので、従来からNi基自溶合金の溶射皮膜が適用されている場面に加えて、航空機、自動車、ボイラー、農業機械分野などにも幅広く適用していくことができる。 The present invention can lower the remelting heat treatment temperature of thermal spray coatings, so in addition to the applications where Ni-based self-fluxing alloy thermal spray coatings have traditionally been used, it can also be widely applied to fields such as aircraft, automobiles, boilers, and agricultural machinery.
Claims (8)
P:0.1~7.0%、
B:0.0(0%を含む)~5.0%、
Si:0.0(0%を含む)~5.0%、
C:0.0(0%を含む)~2.0%、
Cr:0.0(0%を含む)~30.0%、
Mo,W:MoとWの1種もしくは2種をMo+W/2で0.0(0%を含む)~9.0%、
Cu:0.0(0%を含む)~10.0%、
Mn,Fe,Co:Mn,Fe,Coの1種もしくは2種以上を各0.0(0%を含む)~10.0%、
残部Niおよび不可避的不純物からなるNi基合金であり、
P含有量が1%以下の硬質相とγNiマトリックス中にPが固溶及び/又はPを含有する10μm以下である化合物が分散する組織を有し、
さらに800℃以上950℃以下の固相線温度を有すること、
を特徴とする高溶融性Ni基合金。 P in mass%: 0.1 to 7.0%,
B: 0.0 (including 0%) to 5.0%,
Si: 0.0 (including 0%) to 5.0%
C: 0.0 (including 0%) to 2.0%,
Cr: 0.0 (including 0%) to 30.0%,
Mo, W: One or both of Mo and W are 0.0 (including 0%) to 9.0% at Mo+W/2;
Cu: 0.0 (including 0%) to 10.0%,
Mn, Fe, Co: one or more of Mn, Fe, and Co are each 0.0 (including 0%) to 10.0%;
The balance is a Ni-based alloy consisting of Ni and unavoidable impurities,
The alloy has a structure in which P is dissolved in a hard phase having a P content of 1% or less and a γNi matrix in which P is dispersed and/or a compound containing P and having a size of 10 μm or less is dispersed,
Further, it has a solidus temperature of 800°C or higher and 950°C or lower.
A highly meltable Ni-based alloy characterized by:
その円相当径サイズは20μm以下であり、
その面積率は20%以下であること、を特徴とする請求項1に記載の高溶融性Ni基合金。 The hard phase is borides and carbides,
The equivalent circle diameter is 20 μm or less,
2. The high melting property Ni-based alloy according to claim 1, wherein the area ratio is 20% or less.
さらにその皮膜はPを含有したγNiマトリックスが網目構造を有すること、
を特徴とする請求項5に記載の高溶融性Ni基合金皮膜。 A coating in a state that has been remelted at less than 940°C, wherein the porosity of the coating is such that the porosity in the remelted coating/the porosity in the thermal spray coating is ≦0.5;
Furthermore, the coating has a network structure of a γNi matrix containing P.
The high melting property Ni-based alloy coating according to claim 5, characterized in that
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| PCT/JP2025/009093 WO2025204861A1 (en) | 2024-03-26 | 2025-03-11 | HIGHLY FUSIBLE Ni-BASED ALLOY CONTAINING P |
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| JP2022079445A (en) | 2020-11-16 | 2022-05-26 | 東洋製罐グループホールディングス株式会社 | Ni-BASED SELF-FLUXING ALLOY, COMPONENT MADE OF Ni-BASED SELF-FLUXING ALLOY FOR GLASS MANUFACTURING, AND MOLD AND COMPONENT FOR TRANSPORTING GLASS GOB MADE OF COMPONENT FOR GLASS MANUFACTURING |
| JP2023031420A (en) | 2021-08-25 | 2023-03-09 | 山陽特殊製鋼株式会社 | Ni-based self-fluxing alloy |
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| JP2022079445A (en) | 2020-11-16 | 2022-05-26 | 東洋製罐グループホールディングス株式会社 | Ni-BASED SELF-FLUXING ALLOY, COMPONENT MADE OF Ni-BASED SELF-FLUXING ALLOY FOR GLASS MANUFACTURING, AND MOLD AND COMPONENT FOR TRANSPORTING GLASS GOB MADE OF COMPONENT FOR GLASS MANUFACTURING |
| JP2023031420A (en) | 2021-08-25 | 2023-03-09 | 山陽特殊製鋼株式会社 | Ni-based self-fluxing alloy |
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