JP7814005B2 - Component mounting system, management device, component mounting device, inspection device, and component mounting method - Google Patents

Description

The present invention relates to a component mounting system for mounting components on a board, a management device, a component mounting device, an inspection device, and a component mounting method.

In component mounting systems that produce mounted boards by mounting components on boards, an inspection device acquires misalignment information for components mounted on the board, and the acquired misalignment information is used to correct the mounting position when the component mounting device mounts components on a subsequent board (see, for example, Patent Document 1). Patent Document 1 discloses a mounting line management system in which, when a component mounting defect is detected by an inspection device and the board with the repaired mounting defect is re-introduced into the mounting line, the misalignment information for the re-introduced board is not used to correct the mounting position.

Japanese Patent Application Laid-Open No. 2019-134051

However, with conventional technologies including Patent Document 1, some cases in which the inspection device judged a mounting defect were erroneous judgments caused by inappropriate imaging conditions or defect judgment conditions for the inspection device's camera, even though the component was properly mounted on the board. Therefore, there was room for further improvement in order to properly feed back the inspection results obtained by the inspection device to the component mounting device.

The present invention therefore aims to provide a component mounting system, management device, component mounting device, inspection device, and component mounting method that can provide appropriate feedback on the inspection results of components mounted on a board.

The component mounting system of the present invention comprises an inspection device that captures images of components mounted on a board and inspects the condition of the components mounted on the board; a correction value calculation unit that calculates correction values for mounting the components on the board based on the inspection results obtained by the inspection device; and a component mounting unit that mounts the components on the board using the correction values, and the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device in which the inspection conditions have been adjusted after inspecting the first board.

The management device of the present invention includes a correction value calculation unit that calculates correction values used when a component mounting device mounts components on a board, based on inspection results obtained by an inspection device that captures images of components mounted on a board and inspects the condition of the components mounted on the board. The inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device, whose inspection conditions have been adjusted after inspecting the first board.

The component mounting device of the present invention includes a component mounting unit that mounts components on a board using correction values calculated based on inspection results obtained by an inspection device that captures images of the components mounted on the board and inspects the condition of the components mounted on the board, and the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device in which the inspection conditions have been adjusted after inspection of the first board.

The inspection device of the present invention comprises an inspection unit that captures images of components mounted on a board and inspects the condition of the components mounted on the board, and an output unit that outputs inspection results obtained by the inspection unit, where the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection unit with inspection conditions adjusted after inspecting the first board.

The component mounting method of the present invention includes: capturing an image of a component mounted on a board to inspect the state of the component mounted on the board; calculating a correction value when mounting the component on the board based on the obtained inspection results; and mounting the component on the board using the correction value; adjusting the inspection conditions after inspecting the first board; inspecting the first board using the adjusted inspection conditions to obtain post-adjustment inspection results; and calculating a correction value when mounting the component on the board based on the post-adjustment inspection results.

This invention allows for appropriate feedback of inspection results for components mounted on a board.

FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. FIG. 1 is a plan view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a block diagram showing the configuration of a control system of a component mounting system according to an embodiment of the present invention. FIG. 10 is an explanatory diagram of the amount of component mounting position deviation acquired by the inspection device according to the embodiment of the present invention. FIG. 10 is an explanatory diagram of an example of a pass/fail judgment screen displayed on the inspection display unit of the inspection device according to the embodiment of the present invention. FIG. 10 is an explanatory diagram of an example of an inspection condition adjustment screen displayed on an inspection display unit of an inspection device according to an embodiment of the present invention. 1 is a flow diagram of a component mounting method according to an embodiment of the present invention;

An embodiment of the present invention will be described in detail below using the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, component mounting device, and inspection device. Corresponding elements in all drawings will be denoted by the same reference numerals below, and duplicate explanations will be omitted. In Figure 1 and in some sections described below, two axes that are orthogonal to each other in the horizontal plane are shown: the X axis in the board transport direction (left-right direction in Figure 1) and the Y axis that is orthogonal to the board transport direction (up-down direction in Figure 1). In Figure 4 and in some sections described below, the θ direction, which is the direction of rotation around the Z axis, is shown.

First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of manufacturing mounted boards by mounting components on boards. Component mounting system 1 comprises a first conveyor M1, two component mounting devices M2-M3, an inspection device M4, and a second conveyor M5, connected in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction. Each device is connected to a management computer 3 via a communications network 2. Each device also transmits and receives data to and from each other via communications network 2. Note that the number of component mounting devices M2-M3 included in component mounting system 1 is not limited to two, and may be one or three or more.

The first conveyor M1, two component mounting devices M2-M3, inspection device M4, and second conveyor M5 each have board transport sections 4, 5, 6, and 8, and transport boards B in order from upstream to downstream. The first conveyor M1 receives boards B (arrow a) from upstream production equipment, such as a printing device (not shown) that prints solder paste on electrodes E formed on boards B, and transports them to component mounting device M2. The first conveyor M1 also has a built-in reader (not shown) that reads board labels L, such as barcodes or two-dimensional codes, attached to boards B to read the board number (board ID) that identifies board B. The first conveyor M1 reads the board number from the board label L of board B and transmits it to the downstream component mounting device M2 and management computer 3.

In Figure 1, component mounting device M2 performs component mounting work by using a mounting head to pick up component D from the component supply unit and place it at the mounting position on board B transported from first conveyor M1, and then transports board B to downstream component mounting device M3. Similarly, component mounting device M3 performs component mounting work by placing component D at the mounting position on board B transported from upstream component mounting device M2. When component mounting devices M2-M3 transport board B to downstream equipment, they send the board number of board B to the downstream equipment and management computer 3.

Inspection device M4 uses illumination unit 7a (see Figure 3) to illuminate board B on which components D have been mounted by component mounting devices M2-M3, while using inspection camera 7 to capture images. This captures information such as the amount of deviation in the mounting position of components D from their correct positions, and determines the quality of the mounted board. When inspecting board B and transferring it to the downstream second conveyor M5, inspection device M4 transmits the board number of board B to the second conveyor M5 and management computer 3. The second conveyor M5 receives the component-mounted board B transferred from inspection device M4 and transfers it downstream to a reflow device (not shown) that heats the board B to melt the solder paste (arrow b). Management computer 3 has the function of overall control of component mounting system 1, which includes first conveyor M1, component mounting devices M2-M3, inspection device M4, and second conveyor M5.

In Figure 1, the first conveyor M1 and second conveyor M5 temporarily store (place) boards B received from upstream and transport them downstream, and also allow workers to load and unload boards B from the board transport sections 4 and 8. If the inspection device M4 detects a board B1 with a defective component D mounting condition, such as missing components, misalignment, or a component standing or floating, the board B1 is removed from the second conveyor M5 by a worker (arrow c). The worker then performs repair work, such as removing the defective component D or correcting the mounting condition of the component D (arrow d), and then re-inserts the repaired board B1 from the first conveyor M1 (arrow e). Component mounting devices M2 and M3 then mount components D in the previously vacant mounting positions on the re-inserted board B1.

Next, the configuration of component mounting devices M2-M3 will be described with reference to Figure 2. A board transport unit 4 is installed along the X axis in the center of the base 10. The board transport unit 4 transports boards B carried out from upstream devices and positions and holds them at the mounting work position using the mounting head, which will be described below. Furthermore, the board transport unit 4 carries boards B after component mounting work (component mounting work) has been completed to downstream devices.

A component supply unit 11 is installed on each side of the board transport unit 4 (front and rear direction of the Y axis). In the component supply unit 11, multiple tape feeders 12 are arranged in parallel along the X axis. The tape feeders 12 feed a component tape, which has pockets for storing components D, at a pitch in a direction (tape feed direction) from the outside of the component supply unit 11 toward the board transport unit 4, thereby supplying components D to the component supply position where the mounting head picks up the components.

In Figure 2, Y-axis tables 13 equipped with linear drive mechanisms are arranged at both ends of the X-axis on the top surface of the base 10. A beam 14, similarly equipped with a linear mechanism, is connected between the two Y-axis tables 13 so as to be freely movable along the Y-axis. A mounting head 15 is attached to the beam 14 via a plate 14a so as to be freely movable along the X-axis. The mounting head 15 is equipped with multiple nozzle lifting units. A nozzle that sucks and holds a component D is attached to the lower end of each nozzle lifting unit. Each nozzle lifting unit raises and lowers the nozzle along the Z-axis and rotates it in the θ direction around the Z-axis as the rotation axis.

The Y-axis table 13 and beam 14 constitute a head movement mechanism that moves the mounting head 15 horizontally (in the X-axis and Y-axis directions). The head movement mechanism and mounting head 15 constitute a component mounting unit 16 that performs component mounting work by picking up components D from the component supply position of the tape feeder 12 attached to the component supply unit 11 and mounting them at the mounting position on the board B held by the board transport unit 4. During component mounting work, the mounting head 15 moves above the component supply unit 11, picks up a specified component D with each nozzle, moves above the board B, and repeats a series of mounting turns to mount the components D held by each nozzle at their respective mounting positions.

In Figure 2, a head camera 17 is attached to the plate 14a on which the mounting head 15 is attached. As the mounting head 15 moves, the head camera 17 moves above the board B positioned at the mounting work position of the board transport unit 4, and captures an image of the board mark (not shown) provided on the board B and the mounting position of the board B. The head camera 17 also captures an image of the board label L provided on the board B. The board number (board ID) that identifies the board B is read from the image of the board label L.

A component recognition camera 18 is installed between the component supply unit 11 and the board transport unit 4. When the mounting head 15, which has picked up a component D from the component supply unit 11, is positioned above the component recognition camera 18, the component recognition camera 18 captures an image of the component D held by the nozzle from below. When the mounting head 15 mounts the component D on the board B, the mounting position is corrected taking into account the recognition results of the board B by the head camera 17 and the component recognition results by the component recognition camera 18.

In Figure 2, a touch panel 19 operated by the operator is installed in front of component mounting devices M2-M3 at the position where the operator works. The touch panel 19 displays various information on its display, and the operator inputs data and operates component mounting devices M2-M3 using operation buttons displayed on the display.

Next, the configuration of the control system of component mounting system 1 will be described with reference to Figure 3. Among the functions of component mounting system 1, the following will focus on the function of feeding back inspection results of component D mounted on board B to component mounting devices M2-M3. The management computer 3, first conveyor M1, component mounting devices M2-M3, inspection device M4, and second conveyor M5 are interconnected via communication network 2. Component mounting devices M2-M3 each include a mounting control device 20, a board transport unit 5, a tape feeder 12, a component mounting unit 16, a head camera 17, a component recognition camera 18, and a touch panel 19. The mounting control device 20 includes a mounting memory unit 21, an acquisition unit 22, a correction value calculation unit 23, a mounting control unit 24, and a mounting communication unit 25.

The mounting communication unit 25 transmits and receives data between the inspection device M4, management computer 3, first conveyor M1, and second conveyor M5 via the communication network 2. The mounting memory unit 21 is a storage device that stores mounting data 21a, inspection results 21b, correction value information 21c, etc. The mounting data 21a includes information such as the production model name (board name) of the mounting board, the type (component name) of component D to be mounted on board B, the mounting position (XY coordinates), the mounting direction (θ direction), the installation position of the tape feeder 12 that supplies component D, and the installation position of the nozzle.

In FIG. 3, the acquisition unit 22 acquires the mounting position deviation amounts ΔX, ΔY, and Δθ of component D mounted on board B calculated by inspection device M4 by capturing an image of component D mounted on board B, and stores these in the mounting memory unit 21 as inspection results 21b. The correction value calculation unit 23 calculates correction values to be used by component mounting devices M2 and M3 when mounting component D on board B, based on the mounting position deviation amounts ΔX, ΔY, and Δθ of component D included in inspection results 21b. The correction value calculation unit 23 stores the calculated correction values in the mounting memory unit 21 as correction value information 21c.

In FIG. 3, the mounting control unit 24 (control unit) controls the board transport unit 5, tape feeder 12, component mounting unit 16, head camera 17, and component recognition camera 18 to mount component D on board B based on the mounting position and mounting direction included in the mounting data 21a and the correction values included in the correction value information 21c. That is, the component mounting unit 16 corrects the position of the mounting head 15 based on the position of board B imaged by the head camera 17, pickup position deviation information, and the correction values included in the correction value information 21c, to mount component D on board B.

In this way, the component mounting unit 16 mounts component D on board B using a correction value for mounting component D on board B, which is calculated based on the inspection results 21b obtained by inspection device M4, which captures an image of component D mounted on board B and inspects the condition of component D mounted on board B.

In FIG. 3, the inspection device M4 comprises an inspection control device 30, a substrate transport unit 6, an inspection camera 7, an illumination unit 7a, an inspection camera movement mechanism 31, an inspection input unit 32, and an inspection display unit 33. The inspection control device 30 comprises an inspection memory unit 34, an inspection control unit 35, a recognition processing unit 36, a judgment unit 37, a display processing unit 38, an instruction unit 39, an output unit 40, and an inspection communication unit 41. The inspection input unit 32 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The inspection display unit 33 is a display device such as an LCD panel, and displays various information such as various screens, including an operation screen for operation by the inspection input unit 32.

The inspection communication unit 41 transmits and receives data between the component mounting devices M2-M3, the management computer 3, and the second conveyor M5 via the communication network 2. The inspection memory unit 34 is a storage device that stores inspection data 34a, inspection conditions 34b, provisional inspection results 34c, and the like. The inspection data 34a includes the production model name (board name) of the mounted board, the type of component (component name) mounted on board B, the mounting position (XY coordinates), the mounting direction (θ direction), and the defect judgment value. The inspection conditions 34b include the illumination conditions for the light emitted by the illumination unit 7a when the inspection camera 7 captures an image of component D mounted on board B, the image filter used by the recognition processing unit 36 when performing recognition processing on the captured image, and recognition conditions such as an algorithm for detecting the center of component D.

In FIG. 3, the inspection control unit 35 controls the board transport unit 6 to transport, position, and hold the mounted board B, which has been removed from the upstream component mounting device M3, to the inspection position, and then transports the board B downstream after the inspection work has been completed. Furthermore, the inspection control unit 35 controls the inspection camera movement mechanism 31 and the lighting unit 7a based on the lighting conditions included in the inspection data 34a and inspection conditions 34b to sequentially move the inspection camera 7 above the mounting position of the board B held at the inspection position, and causes the inspection camera 7 to capture images of the components D mounted on the board B while illuminating them with the lighting unit 7a.

The recognition processing unit 36 recognizes and processes the image captured by the inspection camera 7 based on the inspection data 34a and the recognition conditions included in the inspection conditions 34b, and calculates the mounting position deviation amounts ΔX, ΔY, and Δθ (see Figure 4) of component D mounted on board B from the correct mounting position Q. The recognition processing unit 36 stores the captured image and the mounting position deviation amounts ΔX, ΔY, and Δθ in the inspection memory unit 34 as provisional inspection results 34c.

Now, referring to Figure 4, an example of a method by which the recognition processing unit 36 calculates the mounting position deviation amounts ΔX, ΔY, and Δθ of component D mounted on board B from its normal mounting position Q will be described. The inspection control unit 35 causes the inspection camera 7 to capture an image of component D mounted on board B at a position where the center of the image coincides with the normal mounting position Q of component D. The recognition processing unit 36 detects the center C of the mounted component D by performing recognition processing on the captured image. The recognition processing unit 36 then calculates the position deviation amount ΔX in the X-axis direction and the position deviation amount ΔY in the Y-axis direction from the difference between the center C (ΔX, ΔY) and the mounting position Q (0, 0). Furthermore, the recognition processing unit 36 calculates the tilt of component D in the θ direction as the position deviation amount Δθ.

In FIG. 3, the judgment unit 37 judges whether component D has been properly mounted on board B based on the mounting position deviations ΔX, ΔY, and Δθ included in the provisional inspection result 34c and the defect judgment value included in the inspection data 34a. For example, if the mounting position deviations ΔX, ΔY, and Δθ exceed the defect judgment value, the judgment unit 37 judges that component D has a mounting defect (the board B is a defective board). Furthermore, if component D is not recognized, the judgment unit 37 judges that component D has a mounting defect (missing). In other words, the judgment unit 37 judges whether the inspection result (provisional inspection result 34c) is normal. The judgment unit 37 stores the pass/fail judgment result in the provisional inspection result 34c.

In this way, the provisional inspection result 34c stores the captured image, the mounting position deviation amounts ΔX, ΔY, and Δθ, and the pass/fail judgment result, all associated with the mounting position of component D. Furthermore, the inspection camera 7, lighting unit 7a, inspection camera movement mechanism 31, inspection control unit 35, recognition processing unit 36, and judgment unit 37 constitute an inspection unit 42 that captures an image of component D mounted on board B and inspects the condition of component D mounted on board B (mounting position deviation amounts ΔX, ΔY, Δθ, and the pass/fail judgment result).

In FIG. 3, the display processing unit 38 displays a pass/fail judgment screen, an inspection condition adjustment screen, etc. on the inspection display unit 33 to assist the operator in adjusting the inspection conditions 34b.

Now, referring to Figure 5, an example of the pass/fail judgment screen 60 displayed on the inspection display unit 33 by the display processing unit 38 will be described. The pass/fail judgment screen 60 is displayed on the inspection display unit 33 when the inspection unit 42 inspects the state of board B (hereinafter referred to as the "first board Ba") and determines that there is a component D (hereinafter referred to as the "unconfirmed component D1") whose mounting cannot be confirmed. The pass/fail judgment screen 60 has a recognition processing result display area 61, a captured image display area 62, a defective button 63, and an inspection condition adjustment button 64.

The recognition processing result display area 61 displays the recognition processing result (in this example, "No component present") for the unconfirmed component D1 included in the provisional inspection result 34c. The captured image display area 62 displays the captured image of the unconfirmed component D1 included in the provisional inspection result 34c. The captured image display area 62 also displays a center line 62x in the X-axis direction and a center line 62y in the Y-axis direction superimposed on the captured image. The intersection of the center line 62x in the X-axis direction and the center line 62y in the Y-axis direction is the mounting position (mounting coordinates) of the unconfirmed component D1. The worker looks at the captured image displayed in the captured image display area 62 and determines whether the unconfirmed component D1 has been mounted at the mounting position.

In Figure 5, if an operator determines that board repair is necessary, for example, because unconfirmed component D1 is not installed in the mounting position or is installed far from the mounting position (has fallen), the operator operates the inspection input unit 32 to press the defective button 63. When the defective button 63 is pressed, the instruction unit 39 transports the first board Ba from the inspection device M4 and instructs the second conveyor M5 that the first board Ba is to be repaired. Upon receiving the instruction, the second conveyor M5 holds the first board Ba without transporting it downstream, waiting for the operator to remove it.

In this way, if the worker's inspection results are abnormal, the instruction unit 39 instructs the worker to repair the first board Ba. Furthermore, the inspection display unit 33 is a display unit that displays an image of the mounting position of component D (unconfirmed component D1) acquired by the inspection unit 42 of the inspection device M4 if the inspection results by the inspection unit 42 are abnormal.

In Figure 5, if the worker can confirm from the captured image that unconfirmed component D1 has been installed at the installation position, or if the inspection conditions 34b are inappropriate and the presence or absence of unconfirmed component D1 cannot be determined from the current captured image, the worker determines that adjustment of inspection conditions 34b is necessary. In this case, the worker operates the inspection input unit 32 to press the inspection condition adjustment button 64. When the inspection condition adjustment button 64 is pressed, the display processing unit 38 displays an inspection condition adjustment screen on the inspection display unit 33.

Now, referring to Figure 6, an example of the inspection condition adjustment screen 70 that is displayed on the inspection display unit 33 by the display processing unit 38 when the inspection condition adjustment button 64 is pressed on the pass/fail judgment screen 60 will be described. The inspection condition adjustment screen 70 has a recognition processing result display area 71, a captured image display area 72, an illumination condition change area 73, a recognition condition change area 74, an automatic adjustment button 75, a re-recognition button 76, a decision button 77, and a defective button 78.

The lighting condition change area 73 displays buttons for setting (adjusting) the lighting conditions used by the lighting unit 7a when the inspection camera 7 captures an image of the unconfirmed part D1. In this example, a Lighting 1 button 73a and a Lighting 2 button 73b are provided for changing the lighting conditions. The lighting conditions are changed by the worker operating the increase or decrease buttons on the Lighting 1 button 73a and the Lighting 2 button 73b.

In Figure 6, the recognition condition change area 74 displays buttons for setting (adjusting) the recognition conditions used by the recognition processing unit 36 to recognize images captured by the inspection camera 7. In this example, a filter setting button 74a and an advanced setting button 74b are provided. When the operator operates the filter setting button 74a, the image filter used to recognize and process the captured image is changed. When the advanced setting button 74b is pressed, a recognition condition advanced setting screen (not shown) is displayed, which allows detailed setting of recognition conditions such as the binarization (black and white) reference value and color (RGB).

When the re-recognition button 76 is pressed, the mounting position of the unconfirmed component D1 on the first board Ba is re-imaged by the inspection camera 7 using the lighting conditions set in the lighting condition change area 73. The re-imaged image is then re-recognized by the recognition processing unit 36 using the recognition conditions set in the recognition condition change area 74. The recognition processing result display area 71 displays the re-recognition processing result by the recognition processing unit 36 (in this example, "Normal installation"). The re-imaged image is also displayed in the captured image display area 72. Note that re-imaging by the inspection camera 7 and re-recognition processing by the recognition processing unit 36 can be performed by pressing the re-recognition button 76, or can be performed each time the conditions are changed by operating the buttons in the lighting condition change area 73 and recognition condition change area 74.

In Figure 6, when the automatic adjustment button 75 is pressed, the lighting conditions and recognition conditions are automatically changed in a predetermined procedure, re-imaging is performed by the inspection camera 7 and re-recognition processing is performed by the recognition processing unit 36, and the displays in the recognition processing result display area 71 and captured image display area 72 are updated. When the decision button 77 is pressed, the inspection conditions 34b are changed to the conditions set in the lighting condition change area 73 and recognition condition change area 74, and the inspection results are changed to the inspection results after the re-recognition processing (hereinafter referred to as the "adjusted inspection results").

Specifically, the output unit 40 replaces the inspection result of the unconfirmed component D1 included in the provisional inspection result 34c with the adjusted inspection result, and outputs it to the component mounting devices M2-M3 as the inspection result 21b for the first board Ba. The output unit 40 also replaces the pass/fail judgment result of the unconfirmed component D1 included in the provisional inspection result 34c with the result of the re-recognition process, and outputs it to the management computer 3 as the pass/fail judgment result 51b for the first board Ba. Note that rather than replacing only the re-inspection result of the unconfirmed component D1 with the provisional inspection result 34c, the inspection unit 42 may re-inspect the entire first board Ba under the adjusted inspection conditions 34b and use the adjusted inspection result as the inspection result 21b.

In this way, the output unit 40, which outputs the inspection results 21b obtained by the inspection unit 42, outputs the inspection results 21b to the component mounting devices M2-M4, including the post-adjustment inspection results of the first board Ba inspected by the inspection unit 42 of the inspection device M4, whose inspection conditions 34b were adjusted after the inspection of the first board Ba. In other words, the inspection results 21b do not include at least the inspection results of the unconfirmed component D1 on the first board Ba before the inspection conditions 34b were adjusted. The correction value calculation units 23 of the component mounting devices M2-M3 then calculate the correction value when mounting the component D on the board B based on the inspection results 21b, including the post-adjustment inspection results of the unconfirmed component D1 mounted on the first board Ba, obtained by the inspection device M4, whose inspection conditions 34b were adjusted after the inspection of the first board Ba.

In FIG. 6, when the worker views the captured image in which the inspection conditions 34b have been adjusted and determines that the unconfirmed component D1 is not mounted on the first board Ba, the worker presses the defective button 78. The processing after the defective button 78 is pressed is the same as when the defective button 63 on the pass/fail determination screen 60 is pressed, and a detailed description will be omitted. In this way, the inspection input unit 32 is an input unit that accepts input of the worker's confirmation results of the captured image. Note that when the inspection condition adjustment button 64 on the pass/fail determination screen 60 is pressed, the inspection conditions 34b may be adjusted and the post-adjustment inspection results may be obtained automatically. In other words, when the worker's confirmation results based on the pass/fail determination screen 60 are normal (the inspection condition adjustment button 64 is pressed), the instruction unit 39 may instruct the worker to adjust the inspection conditions 34b.

In FIG. 3, the management processing device 50 of the management computer 3 comprises a management memory unit 51, a repair processing unit 52, a management input unit 53, a management display unit 54, and a management communication unit 55. The management input unit 53 is an input device such as a keyboard, touch panel, or mouse, and is used to input operation commands and data. The management display unit 54 is a display device such as an LCD panel, and displays various information such as various screens, including an operation screen for operation by the management input unit 53. The management communication unit 55 is a communication interface, and sends and receives signals and data between the first conveyor M1, component mounting devices M2-M3, inspection device M4, and second conveyor M5 via the communication network 2.

Management memory unit 51 is a storage device that stores production data 51a, pass/fail judgment results 51b, etc. Production data 51a includes information such as the production model name of the mounted board (board name), the type of component D (component name) to be mounted on board B, the size of component D, the mounting position (XY coordinates), the mounting direction (θ direction), component mounting devices M2-M3 (component mounting units 16) that mount component D, the installation position of tape feeders 12 that supply component D, information identifying the mounting head 15, and the installation position of the nozzle. Pass/fail judgment results 51b store the pass/fail judgment results for each board B sent (output) from inspection device M4.

In FIG. 3, the repair processing unit 52 supports the repair processing of defective boards in the component mounting system 1 based on the pass/fail judgment result 51b. Specifically, when a defective board is transported from the inspection device M4 to the second conveyor M5, the repair processing unit 52 displays instructions on an information terminal (not shown) carried by the worker to remove the defective board B1 (see FIG. 1) from the second conveyor M5 and perform repair work.

Furthermore, when the repaired board B1 is reloaded from the first conveyor M1, component mounting devices M2-M3 are instructed to mount components D in the vacant mounting positions, and inspection device M4 is instructed to inspect the condition of the mounted components D. Note that the condition of the mounted components D on the reloaded board B1 inspected by inspection device M4 is used to determine whether the board B1 passes or fails, but is not fed back to component mounting devices M2-M3 as inspection results 21b.

Next, following the flow chart in Figure 7, a component mounting method for mounting component D on the first board Ba in the component mounting system 1 will be described. First, the component mounting unit 16 of component mounting devices M2-M3 in the component mounting system 1 mounts component D on the first board Ba using the correction values contained in the correction value information 21c (ST1: component mounting process). The first board Ba on which component D has been mounted is transported to inspection device M4. The inspection unit 42 of inspection device M4 captures an image of component D mounted on the first board Ba and inspects the condition of component D mounted on the first board Ba (ST2: inspection process). The inspection results are stored in the inspection memory unit 34 as provisional inspection results 34c.

Then, the judgment unit 37 determines whether the inspection result is normal based on the provisional inspection result 34c (ST3: judgment process). If the inspection result is determined to be normal (Yes in ST3), the output unit 40 outputs (transmits) the mounting position deviation amounts ΔX, ΔY, and Δθ included in the provisional inspection result 34c as the inspection result 21b to the component mounting devices M2-M3 (ST4: inspection result output process). Next, the correction value calculation unit 23 of the component mounting devices M2-M3 calculates the correction value when mounting component D on board B based on the inspection result 21b obtained by the inspection device M4 (ST5: correction value calculation process). Next, if there is an unmounted board B in the component mounting devices M2-M3 (No in ST6), the process returns to the component mounting process (ST1), and component D is mounted on board B using the calculated correction value.

In FIG. 7, if the inspection results are determined to be abnormal in the judgment process (ST3) (No in ST3), the display processing unit 38 causes the inspection display unit 33 to display the pass/fail judgment screen 60 and causes the captured image of the mounting position of the unconfirmed component D1 on the first board Ba to be displayed in the captured image display area 62 (ST7: captured image display process) (FIG. 5).

When the worker checks the captured image, determines that the inspection conditions 34b need to be adjusted, and presses the inspection condition adjustment button 64 on the pass/fail judgment screen 60 (Yes in ST8), the display processing unit 38 displays the inspection condition adjustment screen 70 on the inspection display unit 33 (Figure 6). The worker uses the inspection condition adjustment screen 70 to adjust the inspection conditions 34b (ST9: inspection condition adjustment process), and has the inspection camera 7 re-image the mounting position of the unconfirmed component D1 using the adjusted inspection conditions 34b, causing the recognition processing unit 36 to re-recognize the unconfirmed component D1 (ST10: re-inspection process).

In FIG. 7, when the operator determines that the reinspection results are normal and presses the decision button 77 (Yes in ST11), the output unit 40 outputs (transmits) the post-adjustment inspection results to component mounting devices M2-M3 (ST12: Post-adjustment inspection result output process). Next, the correction value calculation process (ST5) is executed, and the correction value calculation units 23 of component mounting devices M2-M3 calculate correction values based on the post-adjustment inspection results (inspection results 21b) obtained by inspection device M4. If there is still an unmounted board B (No in ST6), the process returns to the component mounting process (ST1), and component D is mounted on board B using the calculated correction value.

In this way, in the component mounting method of this embodiment, after inspecting the first board Ba (after ST2), the inspection conditions 34b of the inspection device M4 are adjusted (ST9), the first board Ba is inspected using the inspection device M4 with the adjusted inspection conditions 34b to obtain the adjusted inspection results (ST10), and based on the adjusted inspection results, a correction value for mounting the component D on the board B is calculated (ST5). This allows for appropriate feedback of the inspection results 21b of the component D mounted on the board B.

In FIG. 7, if the confirmation result is abnormal and the Fault button 63 is pressed on the pass/fail judgment screen 60 (No in ST8), or if the reinspection result is abnormal and the Fault button 78 is pressed on the inspection condition adjustment screen 70 (No in ST11), the instruction unit 39 instructs repair of the first board Ba (ST13: repair instruction process). If there is an unmounted board B thereafter (No in ST6), the process returns to the component mounting process (ST1), and components D are mounted on board B using the correction value. In this way, in the component mounting method of this embodiment, after the inspection conditions 34b are adjusted (after ST9), the post-adjustment inspection results for the first board Ba are obtained (ST10) before the first board Ba is removed from the inspection device M4.

As described above, the component mounting system 1 of this embodiment includes an inspection device M4 that captures an image of a component D mounted on a board B and inspects the state of the component D mounted on the board B; a correction value calculation unit 23 that calculates a correction value for mounting the component D on the board B based on the inspection results 21b obtained by the inspection device M4; and a component mounting unit 16 that mounts the component D on the board B using the correction value. The inspection results 21b include post-adjustment inspection results obtained by inspecting the first board Ba using the inspection device M4, in which the inspection conditions 34b have been adjusted after the inspection of the first board Ba. This allows for appropriate feedback of the inspection results 21b of the component D mounted on the board B.

Note that, while the component mounting system 1 described above has been described as transmitting the inspection results 21b of the inspection device M4 to the component mounting devices M2 to M3, which then calculate the correction values, this configuration is not limited to this. For example, the management computer 3 (management device) may be configured to include a correction value calculation unit 23, transmit the inspection results 21b of the inspection device M4 to the management computer 3, and have the management computer 3 calculate and transmit the correction values to the component mounting devices M2 to M3. In other words, the management computer 3 (management device) includes a correction value calculation unit 23 that calculates, based on the inspection results 21b obtained by the inspection device M4, the correction values used when the component mounting devices M2 to M3 mount the component D on the board B, and the inspection results 21b include the post-adjustment inspection results.

In addition, in the above example, the pass/fail judgment screen 60 and the inspection condition adjustment screen 70 are displayed on the inspection display unit 33 (display unit) of the inspection device M4, and the operator operates the inspection input unit 32 (input unit) to input confirmation results, judge reinspection results, and adjust inspection conditions 34b, but this configuration is not limited to this. For example, the display processing unit 38 may be configured to display the pass/fail judgment screen 60 and the inspection condition adjustment screen 70 on the management display unit 54 of the management computer 3 (management device), and accept operations from the management input unit 53 (input unit). In this configuration, the operator can adjust inspection conditions 34b remotely from the management computer 3 installed away from the inspection device M4.

The component mounting system, management device, component mounting device, inspection device, and component mounting method of the present invention have the effect of providing appropriate feedback on the inspection results of components mounted on a board, and are useful in fields where components are mounted on boards.

1. Component mounting system 3. Management computer (management device)
16 Component mounting section 42 Inspection section B, B1 Board Ba First board (board)
D Parts D1 Unidentified parts (parts)
M2-M3 Component mounting equipment M4 Inspection equipment

Claims (10)

an inspection device that takes an image of a component mounted on a board and inspects the state of the component mounted on the board;
a correction value calculation unit that calculates a correction value when mounting the component on the board based on the inspection result obtained by the inspection device;
a component mounting unit that mounts components on a board using the correction value,
A component mounting system, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device whose inspection conditions have been adjusted after the inspection of the first board. The component mounting system of claim 1, wherein the inspection results do not include inspection results of the first substrate before the inspection conditions were adjusted. The component mounting system of claim 1 or 2, wherein after the inspection conditions are adjusted, the post-adjustment inspection results of the first substrate are obtained before the first substrate is removed from the inspection device. a determination unit that determines whether the test result is normal;
The component mounting system according to claim 1 , further comprising: a display unit that displays an image of the component acquired by the inspection device if the inspection result is not normal. an input unit that receives an input of a confirmation result of the image by an operator;
The component mounting system according to claim 4 , further comprising: an instruction unit that instructs adjustment of the inspection conditions when the confirmation result is normal. The component mounting system of claim 5, wherein if the confirmation result is abnormal, the instruction unit instructs repair of the first board. a correction value calculation unit that calculates a correction value when a component mounting device mounts a component on a board based on an inspection result obtained by an inspection device that takes an image of the component mounted on the board and inspects the state of the component mounted on the board,
The inspection results include post-adjustment inspection results obtained by inspecting the first substrate using the inspection device whose inspection conditions have been adjusted after the inspection of the first substrate. a component mounting unit that mounts the component on the board using a correction value for mounting the component on the board, the correction value being calculated based on an inspection result obtained by an inspection device that takes an image of the component mounted on the board and inspects the state of the component mounted on the board;
The component mounting device, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device whose inspection conditions have been adjusted after the inspection of the first board. an inspection unit that takes an image of a component mounted on a board and inspects the state of the component mounted on the board;
an output unit that outputs the inspection result obtained by the inspection unit,
The inspection device, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first substrate by the inspection unit whose inspection conditions have been adjusted after the inspection of the first substrate. taking an image of the components mounted on the board to inspect the state of the components mounted on the board;
calculating a correction value for mounting the component on the board based on the inspection results obtained;
Mounting the component on the board using the correction value;
After inspecting the first substrate, adjust the inspection conditions;
Inspecting the first substrate under the adjusted inspection conditions to obtain an adjusted inspection result;
a component mounting method for calculating a correction value to be used when mounting the component on the board based on the post-adjustment inspection result.