JP7822360B2 - Resin composition, film, optical filter, solid-state imaging device, image display device, resin, and method for producing resin - Google Patents

Description

The present invention relates to a resin composition, a film, an optical filter, a solid-state imaging element, an image display device, a resin, and a method for producing the resin.

In recent years, the widespread use of digital cameras and camera-equipped mobile phones has led to a significant increase in demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors. Solid-state imaging devices use films containing pigments, such as color filters. Films containing color materials, such as color filters, are manufactured using resin compositions containing pigments, resins, and solvents.

For example, Patent Document 1 describes an invention relating to a resin composition containing a pigment, a dispersant, a binder resin, an epoxy compound, and a solvent, in which the dispersant contains a polyester portion X1' having a carboxy group, which is formed by reacting an acid anhydride group in one or more acid anhydrides (b) selected from tetracarboxylic acid anhydrides (b1) and tricarboxylic acid anhydrides (b2) with a hydroxyl group in a hydroxyl group-containing compound (a), and a vinyl polymer portion X2' formed by radical polymerization of an ethylenically unsaturated monomer (c) and having a thermally crosslinkable functional group, and which contains a dispersant (X) which is at least one selected from the group consisting of a hydroxyl group, an oxetane group, a t-butyl group, a blocked isocyanate group, and a (meth)acryloyl group.

Japanese Patent Application Laid-Open No. 2016-170325

In resin compositions containing pigments, resins, and solvents, it is preferable for the pigments to be well dispersible. If the pigments are not well dispersible, the pigments may aggregate and become coarse in the resin composition, and the viscosity of the resin composition may increase. Furthermore, even if the viscosity of a resin composition is low immediately after production, the viscosity may increase over time.

In addition, in recent years, in the manufacturing process of solid-state imaging devices, it has been considered to form films such as color filters using resin compositions containing color materials, resins, and solvents, and then subject the films to a process requiring high-temperature heating (e.g., 300°C or higher). For this reason, there has been a demand in recent years for further improvements in the heat resistance of films obtained using resin compositions containing color materials, resins, and solvents.

The inventors' investigations have revealed that even in the resin composition described in Patent Document 1, the pigment dispersibility is insufficient and there is room for further improvement. They have also found that there is room for improvement in the heat resistance of films obtained using the resin composition described in Patent Document 1.

Therefore, an object of the present invention is to provide a resin composition that can form a film with excellent pigment dispersibility and heat resistance. Another object of the present invention is to provide a film, an optical filter, a solid-state imaging device, and an image display device that use the resin composition. Another object of the present invention is to provide a resin and a method for producing the resin.

Examples of typical embodiments of the present invention are shown below.

<1> A colorant A containing a pigment;
Resin B,
a solvent C;
The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal.
Resin composition.
<2> The resin composition according to <1>, wherein the resin B1 is a resin containing a structure represented by formula (b1);
In formula (b1), the wavy line represents a bond, X ^b1 represents an (n+2)valent linking group, X ^b2 represents O or NR ^x1 , R ^x1 represents a hydrogen atom or a substituent, L ^b1 represents a single bond or a divalent linking group, P ^b1 represents a polymer chain, R ^b1 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more.
<3> The resin composition according to <1> or <2>, wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3);
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, L ⁴ represents a single bond or a divalent linking group, X ^b11 represents an (n+2)valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a divalent linking group, P ^b11 represents a polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or greater.
<4> The resin composition according to <3>, wherein L ^b11 in the formula (1-1), L ^b11 in the formula (1-2), and L ^b11 in the formula (1-3) are divalent linking groups containing a sulfur atom.
<5> The resin composition according to <3> or <4>, wherein the polymer chain represented by P ^b11 in the formula (1-1), the polymer chain represented by P ^b11 in the formula (1-2), and the polymer chain represented by P ^b11 in the formula (1-3) are polymer chains containing repeating units of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure.
<6> The resin composition according to any one of <3> to <5>, wherein the polymer chain represented by P ^b11 in the formula (1-1), the polymer chain represented by P ^b11 in the formula (1-2), and the polymer chain represented by P ^b11 in the formula (1-3) contain at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group.
<7> The resin B1 contains a repeating unit represented by the formula (1-1), and the content of the repeating unit represented by the formula (1-1) in the resin B1 is 30 mol% or more,
The resin B1 contains a repeating unit represented by the formula (1-2), and the content of the repeating unit represented by the formula (1-2) in the resin B1 is 30 mol% or more, or
The resin B1 contains a repeating unit represented by the formula (1-3), and the content of the repeating unit represented by the formula (1-3) in the resin B1 is 30 mol% or more.
<3><6> The resin composition according to any one of <3> to <6>.
<8> The repeating unit represented by the above formula (1-1) is a repeating unit represented by the following formula (2-1):
The repeating unit represented by the above formula (1-2) is a repeating unit represented by the following formula (2-2):
The resin composition according to any one of <3> to <7>, wherein the repeating unit represented by the formula (1-3) is a repeating unit represented by the following formula (2-3):
In the formula, ^L1 represents a single bond or a divalent linking group, ^L2 and ^L3 each independently represent a divalent linking group, ^L4 represents a single bond or a divalent linking group, ^Lb11 represents a single bond or a divalent linking group, and ^Pb11 represents a polymer chain.
<9> The resin composition according to any one of <1> to <8>, wherein the colorant A contains at least one pigment selected from the group consisting of a diketopyrrolopyrrole pigment and a phthalocyanine pigment.
<10> The resin composition according to any one of <1> to <9>, further comprising a polymerizable monomer.
<11> The resin composition according to any one of <1> to <10>, further comprising a photopolymerization initiator.
<12> A film obtained using the resin composition according to any one of <1> to <11>.
<13> An optical filter having the film according to <12>.
<14> A solid-state imaging device having the film according to <12>.
<15> An image display device having the film according to <12>.
<16> A resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3);
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, L ⁴ represents a single bond or a divalent linking group, X ^b11 represents an (n+2)valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a divalent linking group, P ^b11 represents a polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or greater.
<17> A method for producing a resin, comprising a step of reacting a resin having a primary amino group or a secondary amino group with a macromonomer having an acid anhydride structure at its terminal.

The present invention provides a resin composition that can form a film with excellent pigment dispersibility and heat resistance. It also provides films, optical filters, solid-state imaging devices, and image display devices that use the resin composition. It also provides resins and methods for producing resins.

The main embodiments of the present invention will be described below, but the present invention is not limited to the embodiments explicitly described.
In this specification, the word "to" is used to mean that the numerical values before and after it are included as the lower limit and upper limit.
In the description of groups (atomic groups) in this specification, when a notation does not specify whether the group is substituted or unsubstituted, it encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups).
In this specification, unless otherwise specified, the term "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation.
In this specification, the term "(meth)allyl group" refers to either or both of allyl and methallyl, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl.
In this specification, the weight average molecular weight and number average molecular weight are values measured by GPC (gel permeation chromatography) in terms of polystyrene.
In this specification, near-infrared light refers to light with a wavelength of 700 to 2500 nm.
In this specification, the total solid content refers to the total mass of all components of the composition excluding the solvent.
In this specification, the term "process" does not only refer to an independent process, but also includes processes that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved.
In this specification, a pigment means a coloring material that is difficult to dissolve in a solvent.
In this specification, symbols (e.g., A) added before or after a name are terms used to distinguish components, and do not limit the type, number, or superiority of the components.

<Resin composition>
The resin composition of the present invention comprises:
a color material A containing a pigment;
Resin B,
a solvent C;
Resin B is characterized by containing resin B1, which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal.

The resin composition of the present invention has excellent pigment dispersibility. While the exact reasons for this effect are unknown, it is presumed that Resin B1 has a structure in which amide bonds are formed by the reaction of a resin containing a primary or secondary amino group with a macromonomer having an acid anhydride structure at its terminal, and polymer chains are bonded via these amide bonds. Therefore, it is presumed that the amide bond sites in Resin B1 promote the adsorption of Resin B1 to the pigment surface, and the polymer chains act as steric repulsive groups, suppressing aggregation of pigments, resulting in a resin composition with excellent pigment dispersibility.

Furthermore, by using the resin composition of the present invention, it is possible to form a film with excellent heat resistance that is resistant to decomposition even at high temperatures and does not shrink even after high-temperature heat treatment. While the exact reasons for this effect are unclear, it is presumed that the reaction between the resin B1 containing a primary or secondary amino group and a macromonomer having an acid anhydride structure at its terminal results in the amide bond site being closed by heating during film formation to form an imide ring. Therefore, even if a film is formed using the resin composition of the present invention and then subjected to a high-temperature heat treatment (e.g., 300°C or higher), film shrinkage is suppressed, and even if other films, such as inorganic films, are formed on the film, cracking of the other films is suppressed. Therefore, the resin composition of the present invention can widen the process window for subsequent film production steps.

When the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes, the thickness of the film after heat treatment at 300° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more of the thickness of the film before heat treatment.
Furthermore, the thickness of the film after heat treatment at 350°C for 5 hours in a nitrogen atmosphere is preferably 70% or more, more preferably 80% or more, even more preferably 90% or more, and particularly preferably 95% or more of the thickness of the film before heat treatment.
Furthermore, the thickness of the film after heat treatment at 400°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, and particularly preferably 95% or more.

Furthermore, when the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes and then heat-treating the film at 300° C. for 5 hours in a nitrogen atmosphere, the rate of change ΔA in absorbance of the film after the heat treatment, which is represented by the following formula (A1), is preferably 50% or less, more preferably 45% or less, even more preferably 40% or less, and particularly preferably 35% or less.
ΔA (%) = |100-(A2/A1)×100| ...(A1)
ΔA is the rate of change in absorbance of the film after heat treatment,
A1 is the maximum absorbance value of the film before heat treatment in the wavelength range of 400 to 1100 nm,
A2 is the absorbance of the film after heat treatment, and is the absorbance at the wavelength that shows the maximum absorbance in the wavelength range of 400 to 1100 nm of the film before heat treatment.
The above physical properties can be achieved by adjusting the type and content of the specific resin used.

Furthermore, when the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes, the absolute value of the difference between the wavelength λ1 showing the maximum absorbance of the film in the wavelength range of 400 to 1100 nm and the wavelength λ2 showing the maximum absorbance of the film after heat treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere is preferably 50 nm or less, more preferably 45 nm or less, and even more preferably 40 nm or less.
The above physical properties can be achieved by adjusting the type and content of the specific resin used.

Furthermore, when the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes and then heat-treating the film at 300° C. for 5 hours in a nitrogen atmosphere, the maximum value of the rate of change in absorbance ΔA _λ of the film after heat treatment in the wavelength range of 400 to 1100 nm is preferably 30% or less, more preferably 27% or less, and even more preferably 25% or less. The rate of change in absorbance is a value calculated from the following formula (2):
ΔA _λ = |100-(A2 _λ /A1 _λ )×100| ...(2)
ΔA _λ is the rate of change in absorbance at wavelength λ of the film after heat treatment;
A1 _λ is the absorbance at wavelength λ of the film before heat treatment,
A2 _λ is the absorbance of the film after heat treatment at wavelength λ.
The above physical properties can be achieved by adjusting the type and content of the specific resin used.

The resin composition of the present invention is preferably used as a resin composition for optical filters. Examples of optical filters include color filters, near-infrared transmission filters, and near-infrared cut filters, with color filters being preferred. The resin composition of the present invention is also preferably used as a resin composition for solid-state imaging devices, and is more preferably used as a resin composition for forming pixels in optical filters used in solid-state imaging devices.

Examples of color filters include filters having colored pixels that transmit light of a specific wavelength, and are preferably filters having at least one colored pixel selected from red, blue, green, yellow, cyan, and magenta pixels. Color filters can be formed using a resin composition containing a chromatic colorant.

Near-infrared cut filters include those with a maximum absorption wavelength in the wavelength range of 700 to 1800 nm. The maximum absorption wavelength of the near-infrared cut filter is preferably in the wavelength range of 700 to 1300 nm, and more preferably in the wavelength range of 700 to 1100 nm. Furthermore, the transmittance of the near-infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Furthermore, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. Furthermore, the ratio of absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to absorbance A550 at a wavelength of 550 nm, i.e., absorbance Amax/absorbance A550, is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing coloring material.

The near-infrared transmission filter is a filter that transmits at least a portion of near-infrared light. The near-infrared transmission filter is preferably a filter that blocks at least a portion of visible light and transmits at least a portion of near-infrared light. Preferred examples of the near-infrared transmission filter include filters that satisfy the spectral characteristics of a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. The near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5).
(1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm.
(2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm.
(3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm.
(4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm.
(5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm.

A preferred embodiment of the spectral characteristics of the resin composition of the present invention is one in which, when a 5 μm-thick film is formed using the resin composition, the maximum light transmittance in the thickness direction of the film in the wavelength range of 360 to 700 nm is 50% or more. Resin compositions that satisfy such spectral characteristics can be preferably used as resin compositions for forming pixels in color filters. Specifically, they can be preferably used as resin compositions for forming colored pixels selected from red, blue, green, yellow, cyan, and magenta pixels.

It is preferable that a resin composition having the above-mentioned spectral characteristics contains a chromatic colorant. For example, a resin composition containing a red colorant and a yellow colorant can be preferably used as a resin composition for forming red pixels. A resin composition containing a blue colorant and a purple colorant can be preferably used as a resin composition for forming blue pixels. A resin composition containing a green colorant can be preferably used as a resin composition for forming green or cyan pixels. When a resin composition is used as a resin composition for forming green pixels, it is also preferable that it further contains a yellow colorant in addition to the green colorant.

Another preferred aspect of the spectral characteristics of the resin composition of the present invention is that it satisfies the spectral characteristic of Amin/B, which is the ratio of the minimum absorbance value Amin in the wavelength range of 400 to 640 nm to the absorbance B at a wavelength of 1500 nm, being 5 or greater. Resin compositions that satisfy such spectral characteristics can be preferably used as resin compositions for forming near-infrared transmission filters. The value of Amin/B, which is the absorbance ratio, is preferably 7.5 or greater, more preferably 15 or greater, and even more preferably 30 or greater.

Here, the absorbance Aλ at a wavelength λ is defined by the following formula (λ1):
Aλ=-log(Tλ/100) ...(λ1)
Aλ is the absorbance at wavelength λ, and Tλ is the transmittance (%) at wavelength λ.
In the present invention, the absorbance value may be a value measured in the state of a solution, or may be a value of a film formed using the composition. When measuring the absorbance in the state of a film, it is preferable to measure the absorbance using a film obtained by applying the composition to a glass substrate by a method such as spin coating and drying it at 100°C for 120 seconds using a hot plate or the like.

The resin composition of the present invention preferably satisfies any one of the following spectral characteristics (Ir1) to (Ir5).
(Ir1): The value of A1/B1, which is the ratio of the minimum absorbance A1 in the wavelength range of 400 to 640 nm to the maximum absorbance B1 in the wavelength range of 800 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, it is possible to form a film that can block light in the wavelength range of 400 to 640 nm and transmit light with a wavelength of more than 750 nm.
(Ir2): The value of A2/B2, which is the ratio of the minimum absorbance A2 in the wavelength range of 400 to 750 nm to the maximum absorbance B2 in the wavelength range of 900 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, it is possible to form a film that can block light in the wavelength range of 400 to 750 nm and transmit light with a wavelength of more than 850 nm.
(Ir3): The value of A3/B3, which is the ratio of the minimum absorbance A3 in the wavelength range of 400 to 830 nm to the maximum absorbance B3 in the wavelength range of 1000 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, it is possible to form a film that can block light in the wavelength range of 400 to 830 nm and transmit light with a wavelength of more than 950 nm.
(Ir4): The value of A4/B4, which is the ratio of the minimum absorbance A4 in the wavelength range of 400 to 950 nm to the maximum absorbance B4 in the wavelength range of 1100 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 950 nm and transmits light with a wavelength of more than 1050 nm.
(Ir5): The value of A5/B5, which is the ratio of the minimum absorbance A5 in the wavelength range of 400 to 1050 nm to the maximum absorbance B5 in the wavelength range of 1200 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 1050 nm and transmits light with a wavelength of more than 1150 nm.

The resin composition of the present invention is also preferably a resin composition for pattern formation by photolithography. According to this embodiment, finely sized pixels can be easily formed. Therefore, it is particularly preferably used as a resin composition for forming pixels of optical filters used in solid-state imaging devices. For example, a resin composition containing a component having an ethylenically unsaturated bond-containing group (e.g., a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group) and a photopolymerization initiator can be preferably used as a resin composition for pattern formation by photolithography. It is also preferable that the resin composition for pattern formation by photolithography further contains an alkali-soluble resin.

The resin composition of the present invention can also be used as a resin composition for forming a black matrix or a resin composition for forming a light-shielding film.

The following describes each component used in the resin composition of the present invention.

<<Colorant A>>
The resin composition of the present invention contains a color material A (hereinafter referred to as a color material). Examples of the color material include a white color material, a black color material, a chromatic color material, and a near-infrared absorbing color material. In the present invention, the white color material includes not only pure white color materials but also light gray color materials close to white (e.g., off-white, light gray, etc.).

The colorant preferably includes at least one selected from the group consisting of chromatic colorants, black colorants, and near-infrared absorbing colorants; more preferably includes at least one selected from the group consisting of chromatic colorants and near-infrared absorbing colorants; even more preferably includes a chromatic colorant; and even more preferably includes at least one chromatic colorant selected from the group consisting of red colorants, yellow colorants, blue colorants, and purple colorants.

The colorant preferably includes a chromatic colorant and a near-infrared absorbing colorant, and more preferably includes two or more chromatic colorants and a near-infrared absorbing colorant. A black color may also be formed by combining two or more chromatic colorants. The colorant preferably includes a black colorant and a near-infrared absorbing colorant. According to these aspects, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. For combinations of colorants that form a black color by combining two or more chromatic colorants, see JP 2013-077009 A, JP 2014-130338 A, WO 2015/166779, etc.

The colorant contained in the resin composition of the present invention includes a pigment. The pigment may be either an inorganic pigment or an organic pigment, but organic pigments are preferred from the standpoints of wide color variation, ease of dispersion, safety, etc. Furthermore, the pigment preferably includes at least one selected from chromatic pigments and near-infrared absorbing pigments, and more preferably includes a chromatic pigment.

Furthermore, the pigment preferably contains at least one selected from phthalocyanine pigments, dioxazine pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, diketopyrrolopyrrole pigments, pyrrolopyrrole pigments, isoindoline pigments, quinophthalone pigments, and pteridine pigments; more preferably, it contains at least one selected from phthalocyanine pigments, diketopyrrolopyrrole pigments, and pyrrolopyrrole pigments; and even more preferably, it contains a phthalocyanine pigment or a diketopyrrolopyrrole pigment. Furthermore, because they are more likely to form films whose spectral characteristics are less likely to change even after heating to high temperatures (e.g., 300°C or higher), preferred phthalocyanine pigments are phthalocyanine pigments that do not have a central metal or that have copper or zinc as a central metal.

The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. When the average primary particle diameter of the pigment is within the above range, the pigment has good dispersion stability in the resin composition. In the present invention, the primary particle diameter of the pigment can be determined from a photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. In the present invention, the average primary particle diameter is the arithmetic mean value of the primary particle diameters of 400 primary particles of the pigment. Furthermore, primary particles of the pigment refer to independent particles that are not aggregated.

(Chromatic color materials)
Examples of chromatic colorants include colorants having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. Examples include yellow colorants, orange colorants, red colorants, green colorants, purple colorants, and blue colorants. From the viewpoint of heat resistance, the chromatic colorant is preferably a pigment (chromatic pigment), more preferably a red pigment, yellow pigment, or blue pigment, and even more preferably a red pigment or blue pigment. Specific examples of chromatic color pigments include those shown below.

C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 12 5, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. (above, yellow pigments),
C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (orange pigments),
C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48: 1, 48: 2, 48: 3, 48: 4, 49, 49: 1, 49: 2, 52: 1, 52: 2, 53: 1, 57: 1, 60: 1, 63: 1, 66, 67, 81: 1, 81: 2, 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297, etc. (above, red pigments),
C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine), 65, 66, etc. (all green pigments),
C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, 61, etc. (all purple pigments),
C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88, etc. (all blue pigments).

Of these chromatic pigments, C.I. Pigment Red 254, C.I. Pigment Red 264, C.I. Pigment Red 272, C.I. Pigment Red 122, C.I. Pigment Red 177, and C.I. Pigment Red 179 are preferred as red pigments because they are able to form films whose spectral characteristics do not change even after heating to high temperatures (e.g., 300°C or higher). Furthermore, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:6, and C.I. Pigment Blue 16 are preferred as blue pigments.

Also usable as a green pigment is a halogenated zinc phthalocyanine pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule. Specific examples include the compounds described in WO 2015/118720. Other green pigments that can be used include the compounds described in Chinese Patent Application No. 106909027, phthalocyanine compounds having a phosphate ester as a ligand described in WO 2012/102395, phthalocyanine compounds described in JP 2019-008014 A, phthalocyanine compounds described in JP 2018-180023 A, compounds described in JP 2019-038958 A, aluminum phthalocyanine compounds described in JP 2020-070426 A, and core-shell pigments described in JP 2020-076995 A.

Also, aluminum phthalocyanine pigments containing phosphorus atoms can be used as blue pigments. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

Furthermore, azobarbituric acid nickel complex having the following structure can also be used as a yellow pigment.

Further, as yellow pigments, compounds described in JP-A-2017-201003, compounds described in JP-A-2017-197719, compounds described in JP-A-2017-171912, paragraphs 0011 to 0062 and 0137 to 0276, compounds described in JP-A-2017-171913, paragraphs 0010 to 0062 and 0138 to 0295, compounds described in JP-A-2017-171914, paragraphs 0011 to 0062 and 0139 to 0190, compounds described in JP-A-2017-171915, paragraphs 0010 to 0065 and 0142 to 0222; quinophthalone compounds described in JP-A-2013-054339, paragraphs 0011 to 0034; quinophthalone compounds described in JP-A-2014-026228, paragraphs 0013 to 0058; isoindoline compounds described in JP-A-2018-062644; quinophthalone compounds described in JP-A-2018-203798 talon compounds, quinophthalone compounds described in JP 2018-062578 A, quinophthalone compounds described in Japanese Patent No. 6432076 A, quinophthalone compounds described in JP 2018-155881 A, quinophthalone compounds described in JP 2018-111757 A, quinophthalone compounds described in JP 2018-040835 A, quinophthalone compounds described in JP 2017-197640 A, JP 2016-14528 Quinophthalone compounds described in JP-A-2014-085565, JP-A-2014-021139, JP-A-2013-209614, JP-A-2013-209435, JP-A-2013-181015, JP-A-2013-061622 , quinophthalone compounds described in JP-A-2013-032486, quinophthalone compounds described in JP-A-2012-226110, quinophthalone compounds described in JP-A-2008-074987, quinophthalone compounds described in JP-A-2008-081565, quinophthalone compounds described in JP-A-2008-074986, quinophthalone compounds described in JP-A-2008-074985, quinophthalone compounds described in JP-A-2008-050420 quinophthalone compounds described in JP-A-2008-031281, quinophthalone compounds described in JP-B-48-032765, quinophthalone compounds described in JP-A-2019-008014, quinophthalone compounds described in Japanese Patent No. 6607427, compounds described in Korean Patent Publication No. 10-2014-0034963, compounds described in JP-A-2017-095706, Taiwan Patent Publication No. Compounds described in JP 201920495 A, compounds described in JP 6607427 A, compounds described in JP 2020-033525 A, compounds described in JP 2020-033524 A, compounds described in JP 2020-033523 A, compounds described in JP 2020-033522 A, compounds described in JP 2020-033521 A, compounds described in WO 2020/045200, WO 2020/ Compounds described in Patent Publication No. 045199, compounds described in WO 2020/045197, azo compounds described in JP 2020-093994, perylene compounds described in JP 2020-083982, perylene compounds described in WO 2020/105346, quinophthalone compounds described in JP 2020-517791, compounds represented by the following formula (QP1), and compounds represented by the following formula (QP2) can also be used. Polymerized versions of these compounds are also preferably used from the viewpoint of improving color value.

In formula (QP1), X ¹ to X ¹⁶ each independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by formula (QP1) include the compounds described in paragraph 0016 of Japanese Patent No. 6,443,711.

In formula (QP2), Y ¹ to Y ³ each independently represent a halogen atom. n and m represent integers of 0 to 6, and p represents an integer of 0 to 5. (n+m) is 1 or greater. Specific examples of the compound represented by formula (QP2) include the compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6,432,077.

Red pigments include diketopyrrolopyrrole compounds having at least one bromine atom substituted in the structure described in JP 2017-201384 A, diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 A, diketopyrrolopyrrole compounds described in WO 2012/102399 A, diketopyrrolopyrrole compounds described in WO 2012/117965 A, brominated diketopyrrolopyrrole compounds described in JP 2020-085947 A, naphthol azo compounds described in JP 2012-229344 A, and Japanese Patent No. 6516 A. 119, the red pigment described in Japanese Patent No. 6525101, the brominated diketopyrrolopyrrole compound described in paragraph 0229 of JP 2020-090632, the anthraquinone compound described in Korean Patent Publication No. 10-2019-0140741, the anthraquinone compound described in Korean Patent Publication No. 10-2019-0140744, the perylene compound described in JP 2020-079396, the diketopyrrolopyrrole compound described in paragraphs 0025 to 0041 of JP 2020-066702, etc. can also be used. In addition, as the red pigment, a compound having a structure in which an aromatic ring group in which a group in which an oxygen atom, a sulfur atom, or a nitrogen atom is bonded to the aromatic ring is bonded to a diketopyrrolopyrrole skeleton can also be used.

For the diffraction angles that various pigments preferably have, please refer to the descriptions in Japanese Patent No. 6561862, Japanese Patent No. 6413872, Japanese Patent No. 6281345, JP 2020-026503, and JP 2020-033526, the contents of which are incorporated herein by reference. It is also preferable to use a pyrrolopyrrole pigment in which the crystallite size in the plane direction corresponding to the maximum peak in the X-ray diffraction pattern among the eight (±1±1±1) crystal lattice planes is 140 Å or less. It is also preferable to set the physical properties of the pyrrolopyrrole pigment as described in paragraphs 0028 to 0073 of JP 2020-097744.

In addition, as chromatic colorants, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in Japanese Patent Publication No. 2020-117638, phthalocyanine compounds described in International Publication No. 2020/174991, isoindoline compounds described in Japanese Patent Publication No. 2020-160279, or salts thereof can be used.

Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, the combination of two or more chromatic colorants may form a black color. Examples of such combinations include the following embodiments (1) to (7). When the resin composition contains two or more chromatic colorants and exhibits a black color through the combination of two or more chromatic colorants, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter.
(1) An embodiment containing a red coloring material and a blue coloring material.
(2) An embodiment containing a red coloring material, a blue coloring material, and a yellow coloring material.
(3) An embodiment containing a red color material, a blue color material, a yellow color material, and a purple color material.
(4) An embodiment containing a red color material, a blue color material, a yellow color material, a purple color material, and a green color material.
(5) An embodiment containing a red color material, a blue color material, a yellow color material, and a green color material.
(6) An embodiment containing a red color material, a blue color material, and a green color material.
(7) An embodiment containing a yellow coloring material and a purple coloring material.

(white coloring material)
Examples of white coloring materials include inorganic pigments (white pigments) such as titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, hollow resin particles, and zinc sulfide. The white pigment is preferably a particle having a titanium atom, more preferably titanium oxide. Furthermore, the white pigment is preferably a particle having a refractive index of 2.10 or more for light with a wavelength of 589 nm. The refractive index is preferably 2.10 to 3.00, more preferably 2.50 to 2.75.

Also, the white pigment can be titanium oxide as described in "Titanium Oxide: Physical Properties and Application Technology, by Kiyono Manabu, pages 13-45, published June 25, 1991, by Gihodo Publishing."

White pigments may be composed not only of a single inorganic substance, but also of particles composited with other materials. For example, it is preferable to use particles with internal voids or other materials, particles with a large number of inorganic particles attached to a core particle, or core-shell composite particles consisting of a core particle made of a polymer particle and a shell layer made of inorganic nanoparticles. For examples of core-shell composite particles consisting of a core particle made of a polymer particle and a shell layer made of inorganic nanoparticles, see, for example, the description in paragraphs 0012 to 0042 of JP 2015-047520 A, the contents of which are incorporated herein by reference.

Hollow inorganic particles can also be used as the white pigment. Hollow inorganic particles are inorganic particles with a structure that has a hollow interior, and refer to inorganic particles with a hollow interior surrounded by an outer shell. Examples of hollow inorganic particles include those described in JP 2011-075786 A, WO 2013/061621 A, JP 2015-164881 A, etc., the contents of which are incorporated herein by reference.

(black color material)
The black colorant is not particularly limited, and known materials can be used. Examples of inorganic black colorants include inorganic pigments (inorganic black pigments) such as carbon black, titanium black, and graphite. Carbon black and titanium black are preferred, with titanium black being more preferred. Titanium black refers to black particles containing titanium atoms, and low-order titanium oxide or titanium oxynitride is preferred. Titanium black can be surface-modified as needed to improve dispersibility, inhibit aggregation, and the like. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide. It can also be treated with a water-repellent substance, as disclosed in JP 2007-302836 A. It is preferable that both the primary particle size and average primary particle size of individual particles of titanium black are small. Specifically, the average primary particle size is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles, in which the ratio of Si atoms to Ti atoms in the dispersion is adjusted to a range of 0.20 to 0.50, can be mentioned. Regarding the above dispersion, the description in paragraphs 0020 to 0105 of JP 2012-169556 A can be referred to, the contents of which are incorporated herein by reference. Examples of commercially available titanium black products include Titanium Black 10S, 12S, 13R, 13M, 13M-C, 13R-N, and 13M-T (trade names: manufactured by Mitsubishi Materials Corporation) and Tilack D (trade name: manufactured by Ako Kasei Co., Ltd.). C.I. Pigment Black 1, 7, and the like can also be used as an inorganic black pigment.

Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds. Examples of bisbenzofuranone compounds include those described in JP-A Nos. 2010-534726, 2012-515233, and 2012-515234, and are available, for example, as "Irgaphor Black" manufactured by BASF. Examples of perylene compounds include those described in paragraphs 0016 to 0020 of JP-A No. 2017-226821, C.I. Pigment Black 31 and 32, etc. Examples of the azomethine compound include compounds described in JP-A Nos. 01-170601 and 02-034664, and are available as "Chromofine Black A1103" manufactured by Dainichiseika Color & Chemicals Co., Ltd.

The colorant used in the resin composition of the present invention may consist solely of the black colorant described above, or may further contain a chromatic colorant. This embodiment makes it easier to obtain a resin composition that can form a film with excellent light-blocking properties in the visible light range. When a black colorant and a chromatic colorant are used in combination as colorants, the mass ratio of the two is preferably black colorant:chromatic colorant = 100:10 to 300, and more preferably 100:20 to 200. Furthermore, it is preferable to use a black pigment as the black colorant, and a chromatic pigment as the chromatic colorant.

Preferable combinations of black coloring materials and chromatic coloring materials include, for example, the following.
(A-1) An embodiment containing an organic black color material and a blue color material.
(A-2) An embodiment containing an organic black color material, a blue color material, and a yellow color material.
(A-3) An embodiment containing an organic black color material, a blue color material, a yellow color material, and a red color material.
(A-4) An embodiment containing an organic black color material, a blue color material, a yellow color material, and a purple color material.

In the above embodiment (A-1), the mass ratio of the organic black colorant to the blue colorant is preferably organic black colorant:blue colorant=100:1 to 70, more preferably 100:5 to 60, and even more preferably 100:10 to 50.
In the above embodiment (A-2), the mass ratio of the organic black colorant, the blue colorant, and the yellow colorant is preferably organic black colorant:blue colorant:yellow colorant=100:10 to 90:10 to 90, more preferably 100:15 to 85:15 to 80, and even more preferably 100:20 to 80:20 to 70.
In the above embodiment (A-3), the mass ratio of the organic black colorant, blue colorant, yellow colorant, and red colorant is preferably organic black colorant:blue colorant:yellow colorant:red colorant=100:20 to 150:1 to 60:10 to 100, more preferably 100:30 to 130:5 to 50:20 to 90, and even more preferably 100:40 to 120:10 to 40:30 to 80.
In the above embodiment (A-4), the mass ratio of the organic black colorant, blue colorant, yellow colorant, and violet colorant is preferably organic black colorant:blue colorant:yellow colorant:violet colorant=100:20 to 150:1 to 60:10 to 100, more preferably 100:30 to 130:5 to 50:20 to 90, and even more preferably 100:40 to 120:10 to 40:30 to 80.

(Near infrared absorbing colorant)
The near-infrared absorbing colorant is preferably a pigment, more preferably an organic pigment. The near-infrared absorbing colorant preferably has a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm. The maximum absorption wavelength of the near-infrared absorbing colorant is preferably 1200 nm or less, more preferably 1000 nm or less, and even more preferably 950 nm or less. The near-infrared absorbing colorant preferably has a ratio A ₅₅₀ /A _max of the absorbance A ₅₅₀ at a wavelength of 550 nm to the absorbance A _max at the maximum absorption wavelength of 0.1 or less, more preferably 0.05 or less, even more preferably 0.03 or less, and particularly preferably 0.02 or less. The lower limit is not particularly limited, but can be, for example, 0.0001 or more, or 0.0005 or more. When the absorbance ratio is within the above range, the near-infrared absorbing colorant can have excellent visible light transparency and near-infrared shielding properties. In the present invention, the maximum absorption wavelength and the absorbance value at each wavelength of the near-infrared absorbing colorant are values determined from the absorption spectrum of a film formed using a resin composition containing the near-infrared absorbing colorant.

Examples of near-infrared absorbing colorants include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, metal borides, etc. Examples of pyrrolopyrrole compounds include the compounds described in paragraphs 0016 to 0058 of JP 2009-263614 A, the compounds described in paragraphs 0037 to 0052 of JP 2011-068731 A, and the compounds described in paragraphs 0010 to 0033 of WO 2015/166873 A. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of JP-A-2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169, compounds described in paragraph 0040 of WO 2016/181987, compounds described in JP-A-2015-176046, and compounds described in paragraph 0072 of WO 2016/190162. Compounds, compounds described in paragraphs 0196 to 0228 of JP-A-2016-074649, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in WO 2017/135359, compounds described in JP-A-2017-114956, compounds described in Japanese Patent No. 6197940, compounds described in WO 2016/120166, and the like. Examples of cyanine compounds include the compounds described in paragraphs 0044 to 0045 of JP-A-2009-108267, the compounds described in paragraphs 0026 to 0030 of JP-A-2002-194040, the compounds described in JP-A-2015-172004, the compounds described in JP-A-2015-172102, the compounds described in JP-A-2008-088426, the compounds described in paragraph 0090 of WO 2016/190162, and the compounds described in JP-A-2017-031394. Examples of croconium compounds include the compounds described in JP-A-2017-082029. Examples of the iminium compound include the compounds described in JP-T-2008-528706, JP-A-2012-012399, JP-A-2007-092060, and WO 2018/043564, paragraphs 0048 to 0063. Examples of phthalocyanine compounds include the compounds described in paragraph 0093 of JP-A-2012-077153, oxytitanium phthalocyanine described in JP-A-2006-343631, the compounds described in paragraphs 0013 to 0029 of JP-A-2013-195480, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, vanadium phthalocyanine compounds described in WO 2020/071486, and phthalocyanine compounds described in WO 2020/071470. Examples of naphthalocyanine compounds include the compounds described in paragraph 0093 of JP-A-2012-077153. Examples of dithiolene metal complexes include the compounds described in Japanese Patent No. 5733804. Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details about tungsten oxide, see paragraph 0080 of JP 2016-006476 A, the contents of which are incorporated herein by reference. Examples of metal borides include lanthanum boride. Commercially available lanthanum boride products include LaB ₆ -F (manufactured by Nippon Shinkinzoku Co., Ltd.). Furthermore, compounds described in WO 2017/119394 can also be used as metal borides. Commercially available indium tin oxide products include F-ITO (manufactured by Dowa Hi-Tech Co., Ltd.).

Furthermore, examples of near-infrared absorbing colorants include squarylium compounds described in JP 2017-197437 A, squarylium compounds described in JP 2017-025311 A, squarylium compounds described in WO 2016/154782 A, squarylium compounds described in Japanese Patent No. 5884953 A, squarylium compounds described in Japanese Patent No. 6036689 A, squarylium compounds described in Japanese Patent No. 58106 A, squarylium compounds described in Japanese Patent No. 58106 B, squarylium compounds described in Japanese Patent No. 58106 C, squarylium compounds described in Japanese Patent No. 58106 D, squarylium compounds described in Japanese Patent No. 58106 E, squarylium compounds described in Japanese Patent No. 58106 F, squarylium compounds described in Japanese Patent No. 58106 G, squarylium compounds described in Japanese Patent No. 58106 H ... squarylium compounds described in WO 2017/213047, paragraphs 0090 to 0107; pyrrole ring-containing compounds described in JP 2018-054760, paragraphs 0019 to 0075; pyrrole ring-containing compounds described in JP 2018-040955, paragraphs 0078 to 0082; Pyrrole ring-containing compounds described in Nos. 0043 to 0069, squarylium compounds having an aromatic ring at the amide α-position described in paragraphs 0024 to 0086 of JP-A-2018-041047, amide-linked squarylium compounds described in JP-A-2017-179131, compounds having a pyrrole bis-type squarylium skeleton or a croconium skeleton described in JP-A-2017-141215, dihydrocarbazole bis-type squarylium compounds described in JP-A-2017-082029, asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-2017-068120, pyrrole ring-containing compounds (carbazole type) described in JP-A-2017-067963, phthalocyanine compounds described in Japanese Patent No. 6251530, and the like can also be used.

The content of the colorant in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 70% by mass or less.
The content of the pigment in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 70% by mass or less.
The content of the dye in the coloring material is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less.
In addition, it is also preferable that the resin composition of the present invention is substantially free of dyes, since this makes it easier to more effectively suppress changes in film thickness when the resulting film is heated to a high temperature. When the resin composition of the present invention is substantially free of dyes, the content of the dye in the total solid content of the resin composition of the present invention is preferably 0.1 mass % or less, more preferably 0.05 mass % or less, and particularly preferably zero.

<<Resin B>>
(Specific Resin (Resin B1))
The resin composition of the present invention contains Resin B (hereinafter also referred to as "resin"). The resin contained in the resin composition includes Resin B1 (hereinafter also referred to as "specific resin"), which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at its terminal.

First, the resin having a primary amino group or a secondary amino group (hereinafter also referred to as amine polymer M) relating to the specific resin will be described. The amine polymer M may be any resin having a primary amino group or a secondary amino group, and examples thereof include polyalkyleneimine, polyallylamine, polydiallylamine, and aminoethylated acrylic polymer. In this specification, a primary amino group refers to a group represented by _-NH2 . A secondary amino group refers to a group represented by *-NH-*, where * is the linking moiety to the carbon atom.

Amine polymer M is preferably a resin having a primary amino group. Furthermore, amine polymer M is preferably a resin having three or more amino groups, more preferably a resin having a total of three or more primary amino groups and secondary amino groups, and even more preferably a resin having three or more primary amino groups.

Here, polyalkyleneimine refers to a polymer obtained by ring-opening polymerization of alkyleneimine, and is a polymer having at least a secondary amino group. In addition to secondary amino groups, polyalkyleneimine may also contain primary amino groups and tertiary amino groups. Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine. Ethyleneimine or propyleneimine is preferred, and ethyleneimine is more preferred. In other words, the polyalkyleneimine is preferably polyethyleneimine.

Polyalkyleneimine may be a linear polymer or a polymer with a branched structure. Examples of linear polyethyleneimine include polyethyleneimine commercially available from Fujifilm Wako Pure Chemical Industries, Ltd. Commercially available branched polyethyleneimine products include the Epomin series (manufactured by Nippon Shokubai Co., Ltd.).

Commercially available polyallylamine products include the PAA series (manufactured by Nittobo Medical Co., Ltd.). Commercially available polydiallylamine products include the PAS series (manufactured by Nittobo Medical Co., Ltd.). Commercially available aminoethylated acrylic polymer products include the Polyment series (manufactured by Nippon Shokubai Co., Ltd.).

Amine polymer M is preferably a compound having a molecular weight distribution. The molecular weight of amine polymer M is preferably 300 to 100,000, more preferably 300 to 10,000, and even more preferably 300 to 2,000. When the molecular weight of amine polymer M can be measured by boiling point elevation, the number average molecular weight measured by boiling point elevation is used. When the molecular weight cannot be measured by boiling point elevation or is difficult to measure, the number average molecular weight measured by viscosity is used. When the molecular weight cannot be measured by viscosity or is difficult to measure, the number average molecular weight measured in terms of polystyrene by GPC (gel permeation chromatography) is used.

The amine value of the amine polymer M is preferably 5 mgKOH/g or more, more preferably 280 mgKOH/g or more, even more preferably 560 mgKOH/g or more, and most preferably 840 mgKOH/g or more. There is no upper limit, but a value of 1500 mgKOH/g or less is typical.

Next, we will explain the macromonomer (hereinafter also referred to as macromonomer AH) having an acid anhydride structure at the end related to the specific resin.

Here, the term "macromonomer" refers to a polymer compound having a reactive group at its terminal. The macromonomer AH is preferably a compound having an acid anhydride structure at the terminal of the polymer chain. The number of acid anhydride structures at the terminal of the macromonomer AH is preferably one. The macromonomer AH is preferably a compound represented by formula (AH1).
R ^AH1 -(L ^AH1 -P ^AH1 ) _m ...(AH1)
In formula (AH1), ^R represents a group having an acid anhydride structure;
L ^AH1 represents a divalent linking group;
P ^AH1 represents a polymer chain;
m represents an integer of 1 to 5;

The group having an acid anhydride structure represented by R ^AH1 in formula (AH1) is preferably a group having a cyclic acid anhydride structure. Examples of the group containing a cyclic acid anhydride structure include groups containing structures represented by formulas (AH-1) to (AH-6) shown below, with formula (AH-3) being preferred.

Specific examples of the group having an acid anhydride structure represented by R ^AH1 include groups represented by the following formulae (AAH-1) to (AAH-10), with the group represented by formula (AAH-10) being preferred. In the following formulae, * represents the linking portion between formula (AH1) and L ^AH1 .

Examples of the divalent linking group represented by L ^AH1 in formula (AH1) include a hydrocarbon group, a heterocyclic group, -NR ^LH1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^LH1 CO-, -CONR ^LH1 -, and groups combining two or more of these. R ^LH1 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom.
Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. Furthermore, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Furthermore, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10.
The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic group or a condensed ring.
The hydrocarbon group and heterocyclic group may have a substituent, such as the substituent T described below.

The polymer chain represented by P ^AH1 in formula (AH1) is preferably a polymer chain containing a repeating unit of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure, more preferably a polymer chain containing a repeating unit of at least one structure selected from a poly(meth)acrylic structure and a polystyrene structure, and from the viewpoint of pigment dispersibility and heat resistance, even more preferably a polymer chain containing a repeating unit of a poly(meth)acrylic structure.

The polymer chain represented by P ^AH1 may have a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl groups, (meth)allyl groups, and (meth)acryloyl groups; cyclic ether groups such as epoxy groups and oxetane groups; and blocked isocyanate groups. In this specification, the term "blocked isocyanate group" refers to a group capable of generating an isocyanate group by heat. For example, a preferred example is a group in which an isocyanate group is protected by reacting a blocking agent with an isocyanate group. Examples of blocking agents include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds. Examples of blocking agents include the compounds described in paragraphs 0115 to 0117 of JP 2017-067930 A, the contents of which are incorporated herein by reference. The blocked isocyanate group is preferably a group that can generate an isocyanate group when heated at 90 to 260°C.

The polymer chain represented by ^PAH1 preferably has a tertiary alkyl group, such as a t-butyl group.

It is also preferred that the polymer chain represented by ^PAH1 contains an epoxy group or an oxetane group and a t-butyl group, respectively.

The polymer chain represented by P ^AH1 preferably contains a repeating unit represented by any one of formulas (P1-1) to (P1-6), more preferably contains a repeating unit represented by formula (P1-5) or formula (P1-6), and even more preferably contains a repeating unit represented by formula (P1-5).

In the above formula, R ^G1 and R ^G2 each represent an alkylene group. The alkylene group represented by R ^G1 and R ^G2 is preferably a linear or branched alkylene group having 1 to 20 carbon atoms, more preferably a linear or branched alkylene group having 2 to 16 carbon atoms, and even more preferably a linear or branched alkylene group having 3 to 12 carbon atoms.

In the above formula, R ^G3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group, and is preferably a hydrogen atom or a methyl group.

In the above formula, Q ^G1 represents —O— or —NR ^q —, where R ^q represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group. ^{Q G1} is preferably —O—.
The number of carbon atoms in the alkyl group represented by ^Rq is preferably 1 to 30, more preferably 1 to 15, still more preferably 1 to 8, still more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched, and more preferably linear.
The aryl group represented by ^Rq preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms.
The heterocyclic group represented by ^Rq may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring.
The alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the substituent T described below.

In the above formula, L ^G1 represents a single bond or an arylene group, and is preferably a single bond.

In the above formula, L ^G2 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NR ^LG1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^LG1 CO-, -CONR ^LG1 -, and groups formed by combining two or more of these, and a group containing an alkylene group or an arylene group is preferred. ^{R LG1} represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. The above-mentioned alkylene group and arylene may have a substituent or may be unsubstituted. Examples of the substituent include the substituent T described below.

In the above formula, R ^G4 represents a hydrogen atom or a substituent. Examples of the substituent include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, a heterocyclic thioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group. ^{R G4} is preferably at least one selected from an alkyl group, an aryl group, an ethylenically unsaturated bond-containing group, an epoxy group, and an oxetanyl group, and more preferably at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group.

In the above formula, R ^G5 represents a hydrogen atom or a methyl group, and R ^G6 represents an aryl group. The aryl group represented by ^{R G6} preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms. The aryl group represented by ^{R G6} may have a substituent. Examples of the substituent include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, a heterocyclic thioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group.

The polymer chain represented by ^PAH1 may contain two or more types of repeating units.

The weight-average molecular weight of the polymer chain represented by P ^AH1 is preferably 500 to 100,000, more preferably 1,000 to 50,000, and even more preferably 2,000 to 20,000. When the weight-average molecular weight of the polymer chain is within the above range, better pigment dispersibility is likely to be obtained. The weight-average molecular weight of the polymer chain can be measured by GPC (gel permeation chromatography). More specifically, it can be calculated from the weight-average molecular weight of the raw material monomer used to introduce the polymer chain.

Examples of the aforementioned substituent T include the following groups: alkyl groups (preferably alkyl groups having 1 to 30 carbon atoms), alkenyl groups (preferably alkenyl groups having 2 to 30 carbon atoms), alkynyl groups (preferably alkynyl groups having 2 to 30 carbon atoms), aryl groups (preferably aryl groups having 6 to 30 carbon atoms), amino groups (preferably amino groups having 0 to 30 carbon atoms), alkoxy groups (preferably alkoxy groups having 1 to 30 carbon atoms), aryloxy groups (preferably aryloxy groups having 6 to 30 carbon atoms), heteroaryloxy groups (preferably heteroaryloxy groups having 1 to 30 carbon atoms), acyl groups (preferably acyl groups having 2 to 30 carbon atoms), alkoxy groups (preferably aryloxy groups having 6 to 30 carbon atoms), heteroaryloxy groups (preferably heteroaryloxy groups having 1 to 30 carbon atoms), acyl groups (preferably acyl groups having 2 to 30 carbon atoms), alkoxy groups (preferably aryloxy groups having 6 to 30 carbon atoms), alkoxy groups (preferably aryloxy groups having 6 to 30 carbon atoms), heteroaryloxy groups (preferably heteroaryloxy groups having 1 to 30 carbon atoms), alkoxy groups (preferably aryloxy groups having 2 ... a cycloalkyl group (preferably an alkoxycarbonyl group having 2 to 30 carbon atoms), an aryloxycarbonyl group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), an acyloxy group (preferably an acyloxy group having 2 to 30 carbon atoms), an acylamino group (preferably an acylamino group having 2 to 30 carbon atoms), an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms), an aryloxycarbonylamino group (preferably an aryloxycarbonylamino group having 7 to 30 carbon atoms), a sulfamoyl group (preferably a sulfamoyl group having 0 to 30 carbon atoms). , a carbamoyl group (preferably a carbamoyl group having 1 to 30 carbon atoms), an alkylthio group (preferably an alkylthio group having 1 to 30 carbon atoms), an arylthio group (preferably an arylthio group having 6 to 30 carbon atoms), a heteroarylthio group (preferably a heteroarylthio group having 1 to 30 carbon atoms), an alkylsulfonyl group (preferably an alkylsulfonyl group having 1 to 30 carbon atoms), an arylsulfonyl group (preferably an arylsulfonyl group having 6 to 30 carbon atoms), a heteroarylsulfonyl group (preferably a heteroarylsulfonyl group having 1 to 30 carbon atoms), an alkylsulfinyl group (preferably a carbon Examples of the substituent include alkylsulfinyl groups having 1 to 30 carbon atoms, arylsulfinyl groups (preferably arylsulfinyl groups having 6 to 30 carbon atoms), heteroarylsulfinyl groups (preferably heteroarylsulfinyl groups having 1 to 30 carbon atoms), ureido groups (preferably ureido groups having 1 to 30 carbon atoms), phosphoric acid amide groups (preferably phosphoric acid amide groups having 1 to 30 carbon atoms), hydroxy groups, mercapto groups, halogen atoms (fluorine atoms, chlorine atoms, bromine atoms, iodine atoms, etc.), cyano groups, sulfo groups, carboxy groups, nitro groups, hydroxamic acid groups, sulfino groups, hydrazino groups, imino groups, and heterocyclic groups. When these groups are further substitutable, they may further have a substituent. Examples of the further substituent include the groups described above for the substituent T, crosslinkable groups, and the like.

In formula (AH1), m represents an integer of 1 to 5, preferably 1 or 2, and more preferably 1.

The macromonomer AH is preferably a compound represented by formula (AH2).
In formula (AH2), L ^AH2 represents a divalent linking group, and P ^AH2 represents a polymer chain.

Examples of the divalent linking group represented by L ^AH2 in formula (AH2) include hydrocarbon groups, heterocyclic groups, -NR ^LH2 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^LH2 CO-, -CONR ^LH2 -, and groups combining two or more of these. R ^LH2 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be monocyclic or may be a fused ring. The cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The hydrocarbon group and the heterocyclic group may have a substituent. Examples of the substituent include the substituent T described above.

P ^AH2 in formula (AH2) has the same meaning as P ^AH1 in formula (AH1).

The weight average molecular weight of macromonomer AH is preferably 500 to 100,000, more preferably 1,000 to 50,000, and even more preferably 2,000 to 20,000.

The macromonomer AH can be synthesized, for example, by the following method.
[1] A synthesis method in which a polymer obtained by radically polymerizing a radically polymerizable compound using a thiol chain transfer agent having a hydroxy group or an amino group is reacted with an acid anhydride.
[2] A method of synthesizing a polymer having a thiol group at its terminal by enethiol addition to an unsaturated acid anhydride.
[3] A synthesis method in which a radical polymerizable compound is radically polymerized using a thiol chain transfer agent having an acid anhydride group.

The specific resin is preferably a resin containing a structure represented by formula (b1).
In formula (b1), the wavy line represents a bond, X ^b1 represents an (n+2)valent linking group, X ^b2 represents O or NR ^x1 , R ^x1 represents a hydrogen atom or a substituent, L ^b1 represents a single bond or a divalent linking group, P ^b1 represents a polymer chain, R ^b1 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more.

Examples of the (n+2)-valent linking group represented by X ^b1 in formula (b1) include groups containing a hydrocarbon group.
Examples of the group containing a hydrocarbon group include a hydrocarbon group; and a group combining a hydrocarbon group with at least one group selected from a heterocyclic group, —C(CF ₃ ) ₂ —, —NR ^Xb1 —, —SO—, —SO ₂ —, —CO—, —O—, —COO—, —OCO—, —S—, —NR ^Xb1 CO— and —CONR ^Xb1 —.
R ^Xb1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom.
Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. Furthermore, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Furthermore, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10.
The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic group or a condensed ring.
The hydrocarbon group and heterocyclic group may have a substituent, such as the substituent T described above.
The (n+2)-valent linking group represented by X ^b1 in formula (b1) is preferably a group containing a cyclic aliphatic hydrocarbon group or a group containing an aromatic hydrocarbon group, more preferably a group containing an aromatic hydrocarbon group, and even more preferably a group containing a benzene ring group.

X ^b2 in formula (b1) represents O or NR ^x1 , where R ^x1 represents a hydrogen atom or a substituent. Examples of the substituent represented by ^{R x1} include an alkyl group and an aryl group. The alkyl group or aryl group may further have a substituent. Examples of the substituent include the groups explained above for the substituent T. X ^b2 in formula (b1) is preferably O.

In formula (b1), L ^b1 represents a single bond or a divalent linking group, preferably a divalent linking group. Examples of the divalent linking group represented by ^{L b1} include hydrocarbon groups, heterocyclic groups, -NR ^Lb1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^Lb1 CO-, -CONR ^Lb1 -, and groups combining two or more of these. R ^Lb1 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. Furthermore, the cyclic aliphatic hydrocarbon group may be a monocyclic or fused ring. Furthermore, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 10 carbon atoms. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The hydrocarbon group and the heterocyclic group may have a substituent. Examples of the substituent include the substituent T described above.

The divalent linking group represented by L ^b1 is preferably a divalent linking group containing a sulfur atom, and more preferably a group represented by formula (L-1).
In formula (L-1), *1 represents a linking portion with X ^b2 in formula (b1), *2 represents a linking portion with P ^b1 in formula (b1), and L ^b10 represents a hydrocarbon group or a group in which two or more hydrocarbon groups are linked via a single bond or a linking group.

Examples of the hydrocarbon group represented by L ^b10 include the hydrocarbon groups described for L ^b1 . Examples of the linking group linking two or more hydrocarbon groups include -NR ^Lb1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^Lb1 CO-, and -CONR ^Lb1 -. R ^Lb1 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom.

P ^b1 in formula (b1) represents a polymer chain. The polymer chain represented by P ^b1 in formula (b1) has the same meaning as the polymer chain represented by ^PAH1 in formula (AH1), and the preferred range is also the same.

R ^b1 in formula (b1) represents a hydrogen atom, a substituent, or a counter ion. Examples of the substituent represented by R ^b1 include an alkyl group, an aryl group, and a group containing a crosslinkable group. Examples of the crosslinkable group include an ethylenically unsaturated bond-containing group such as a vinyl group, a (meth)allyl group, or a (meth)acryloyl group, an epoxy group, a cyclic ether group such as an oxetane group, and a blocked isocyanate group. The alkyl group or aryl group may further have a substituent. Examples of the substituent include the groups described above for the substituent T. Examples of the counter ion represented by ^{R b1} include an alkali metal ion (Li ⁺ , Na ⁺ , K ^{+ ,} etc.), an ammonium ion, an imidazolium ion, a pyridinium ion, and a phosphonium ion. R ^b1 in formula (b1) is preferably a hydrogen atom or a substituent, more preferably a hydrogen atom or a group containing a crosslinkable group, and even more preferably a hydrogen atom.

In formula (b1), n represents an integer of 1 or greater, preferably an integer of 1 to 4, more preferably 1 or 2, and even more preferably 1.

Resin B1 is preferably a resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), more preferably a resin containing a repeating unit represented by formula (1-1) or formula (1-3), and even more preferably a resin containing a repeating unit represented by formula (1-3). Resins containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) are resins of the present invention.
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, L ⁴ represents a single bond or a divalent linking group, X ^b11 represents an (n+2)valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a divalent linking group, P ^b11 represents a polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or greater.

The substituents represented by R ¹ to R ⁹ include an alkyl group, an aryl group and a halogen atom, and are preferably an alkyl group. ^{R 1} to R ⁹ are preferably a hydrogen atom.

In formula (1-1), L ¹ represents a single bond or a divalent linking group. Examples of the divalent linking group include hydrocarbon groups, -NR ^L11 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^L11 CO-, -CONR ^L11 -, and groups combining two or more of these. R ^L11 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be monocyclic or fused ring. The cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the substituent T described above.
L ¹ in formula (1-1) is preferably a single bond or a hydrocarbon group, more preferably a single bond or an aliphatic hydrocarbon group, still more preferably a single bond or an alkylene group, and particularly preferably a single bond, —CH ₂ — or —C ₂ H ₄ —.

In formula (1-2), ^L2 and ^L3 each independently represent a divalent linking group. Examples of the divalent linking group include the groups described for ^L1 . ^L2 and ^L3 are preferably hydrocarbon groups, more preferably aliphatic hydrocarbon groups, further preferably alkylene groups, and particularly preferably _-CH2- .

In formula (1-3), ^L4 represents a single bond or a divalent linking group. Examples of the divalent linking group include the groups described for ^L1 . ^L4 is preferably a hydrocarbon group, more preferably an aliphatic hydrocarbon group, still more preferably an alkylene group, and particularly preferably —C ₂ H ₄ —.

X ^b11 , X ^b12 , L ^b11 , P ^b11 and R ^b11 in formulas (1-1) to (1-3) have the same meanings as X ^b1 , X ^b2 , L ^b1 , P ^b1 and R ^b1 in formula (b1), and the preferred ranges are also the same.

The repeating unit represented by the formula (1-1) above is preferably a repeating unit represented by the following formula (2-1). The repeating unit represented by the formula (1-2) above is preferably a repeating unit represented by the following formula (2-2). The repeating unit represented by the formula (1-3) above is preferably a repeating unit represented by the following formula (2-3).
In the formula, ^L1 represents a single bond or a divalent linking group, ^L2 and ^L2 each independently represent a divalent linking group, ^L4 represents a single bond or a divalent linking group, ^Lb11 represents a single bond or a divalent linking group, and ^Pb11 represents a polymer chain.

L ¹ to L ⁴ , L ^b11 and P ^b11 in the formulae (2-1) to (2-3) have the same meanings as L ¹ to L ⁴ , L ^b11 and P ^b11 in the formulae (1-1) to (1-3).

When the specific resin is a resin containing a repeating unit represented by formula (1-1), the content of the repeating unit represented by formula (1-1) in the specific resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of pigment dispersibility and the heat resistance of the resulting film. The upper limit can be 100 mol%, or can be 80 mol% or less, or can be 60 mol% or less.
Furthermore, when the specific resin is a resin containing a repeating unit represented by the above formula (1-2), the content of the repeating unit represented by formula (1-2) in the specific resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of the dispersibility of the pigment and the heat resistance of the resulting film. The upper limit can be 100 mol%, or can be 80 mol% or less, or can be 60 mol% or less.
Furthermore, when the specific resin is a resin containing a repeating unit represented by the above formula (1-3), the content of the repeating unit represented by formula (1-3) in the specific resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of the dispersibility of the pigment and the heat resistance of the resulting film. The upper limit can be 100 mol%, or can be 80 mol% or less, or can be 60 mol% or less.

The specific resin may further contain repeating units other than those represented by formulas (1-1) to (1-3). Examples of other repeating units include repeating units having an acid group, repeating units having a hydroxy group, repeating units having an amino group, repeating units having an ammonium salt, repeating units having a crosslinkable group, repeating units having a group with a dye partial structure, and repeating units having other functional groups. The acid groups and amino groups may be in the form of salts.

Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl groups, (meth)allyl groups and (meth)acryloyl groups, cyclic ether groups such as epoxy groups and oxetane groups, and blocked isocyanate groups.
Examples of the acid group include a carboxy group, a sulfo group, and a phosphate group.
Examples of the group having a dye partial structure include groups having a partial structure derived from a dye selected from benzimidazolone dyes, benzimidazolinone dyes, quinophthalone dyes, phthalocyanine dyes, anthraquinone dyes, diketopyrrolopyrrole dyes, quinacridone dyes, azo dyes, isoindolinone dyes, isoindoline dyes, dioxazine dyes, perylene dyes, and thioindigo dyes. Specific examples of the group having a dye partial structure include groups having the structures shown below.
Other functional groups include alkyl groups and aryl groups.

When the specific resin contains other repeating units, the content of other repeating units in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

When the specific resin contains repeating units having an acid group, the content of repeating units having an acid group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

When the specific resin contains repeating units having a hydroxy group, the content of repeating units having a hydroxy group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

When the specific resin contains repeating units having an amino group, the content of repeating units having an amino group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

When the specific resin contains repeating units having crosslinkable groups, the content of repeating units having crosslinkable groups in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

When the specific resin contains repeating units having a dye partial structure, the content of repeating units having a dye partial structure in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

When the specific resin contains repeating units having other functional groups, the content of repeating units having other functional groups in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

Preferred embodiments of the specific resin include the following embodiments [1] to [10].
[1] An embodiment in which the specific resin is composed only of repeating units represented by formula (1-1), formula (1-2), or formula (1-3).
[2] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having an amino group.
[3] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having an acid group or a hydroxy group.
[4] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), a repeating unit having an acid group or a hydroxy group, and a repeating unit having an amino group.
[5] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) and a repeating unit having a crosslinkable group.
[6] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), a repeating unit having a crosslinkable group, and a repeating unit having an amino group.
[7] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3), a repeating unit having a crosslinkable group, a repeating unit having an acid group or a hydroxy group, and a repeating unit having an amino group.
[8] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) and a repeating unit having a dye moiety structure.
[9] In any of the above [2] to [7], the compound further comprises a repeating unit having a dye moiety.
[10] In the above [2] to [9], an embodiment further comprising a repeating unit having another functional group.

The acid value of the specific resin is preferably 1 mgKOH/g or more, more preferably 5 mgKOH/g or more, and even more preferably 10 mgKOH/g or more. The upper limit is preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, and even more preferably 100 mgKOH/g or less.

The weight-average molecular weight of the specific resin is preferably 1,000 to 200,000. The upper limit is preferably 100,000 or less, and more preferably 50,000 or less. The lower limit is preferably 1,500 or more, more preferably 2,000 or more, and even more preferably 3,000 or more.

It is preferable that the primary amino groups of the amine polymer M in the specific resin are all consumed in the reaction with the macromonomer AH. This configuration further improves the storage stability of the resin composition.

The amine value of the specific resin is preferably 560 mgKOH/g or less, more preferably 300 mgKOH/g or less, and even more preferably 150 mgKOH/g or less. The lower limit may be 0 mgKOH/g, 5 mgKOH/g or more, 25 mgKOH/g or more, 50 mgKOH/g or more, or 100 mgKOH/g or more. When the amine value of the specific resin is 0 mgKOH/g, improved transparency of the resin can be expected. Furthermore, when the amine value of the specific resin is 5 mgKOH/g or more (preferably 25 mgKOH/g or more, more preferably 50 mgKOH/g or more, and even more preferably 100 mgKOH/g or more), good pigment adsorption and improved dispersibility can be expected.

The specific resin preferably has a 5% mass loss temperature of 280°C or higher, more preferably 300°C or higher, and even more preferably 320°C or higher, as measured by TG/DTA (thermogravimetry/differential thermal analysis) under a nitrogen atmosphere. The upper limit of the 5% mass loss temperature is not particularly limited, and may be, for example, 1,000°C or lower. The 5% mass loss temperature is determined by a known TG/DTA measurement method as the temperature at which the mass loss rate becomes 5% when the resin is left to stand at a specific temperature for 5 hours under a nitrogen atmosphere.
Furthermore, the specific resin preferably has a mass loss rate of 10% or less, more preferably 5% or less, and even more preferably 2% or less when left to stand for 5 hours at 300°C in a nitrogen atmosphere. There is no particular lower limit to the mass loss rate, and it is sufficient as long as it is 0% or more.
The mass loss rate is a value calculated as the ratio of mass loss in a specific resin before and after leaving the resin at rest at 300° C. for 5 hours in a nitrogen atmosphere.

Specific examples of specific resins include resins B-1 to B-35 described in the examples below.

The specific resin can be synthesized by reacting the above-mentioned amine polymer M with the above-mentioned macromonomer AH. By reacting the above-mentioned amine polymer M with the above-mentioned macromonomer AH, the amino group of the amine polymer M undergoes an addition ring-opening reaction with the acid anhydride group of the macromonomer AH, resulting in the formation of an amide bond and a carboxyl group as a result of the ring-opening of the acid anhydride group. This synthesis method allows the reaction to proceed under very mild conditions without the need for a catalyst. Furthermore, because no by-products such as halogens or water are generated, purification processes can be omitted or simplified.

When the amine polymer M and the macromonomer AH are mixed to react with each other, the ratio of acid anhydride groups of the macromonomer AH to 1 mole of amino groups of the amine polymer M is preferably 0.05 to 1 mole, more preferably 0.1 to 1 mole, and even more preferably 0.2 to 1 mole.

In the production of specific resins, cyclic acid anhydrides (succinic anhydride, glutaric anhydride, maleic anhydride, phthalic anhydride, itaconic anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, (±)-trans-1,2-cyclohexanedicarboxylic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, 4-methylcyclohexane-1,2-dicarboxylic anhydride, trimellitic anhydride At least one compound selected from the group consisting of tetrachlorophthalic anhydride, 2,3-naphthalenedicarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 2-sulfobenzoic anhydride, tetrabromo-o-sulfobenzoic anhydride, etc.), acid chloride compounds having an ethylenically unsaturated bond-containing group, acid chloride compounds having an epoxy group, acid chloride compounds having an oxetanyl group, and compounds having a dye moiety and an ethylenically unsaturated bond-containing group may be added during or after the reaction of the amine polymer M with the macromonomer AH. This allows the amino groups of the amine polymer M to react with the compound, thereby adding functional groups such as acid groups, ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups, and groups having a dye moiety to the resin.

(Other resins)
The resin composition of the present invention may contain other resins in addition to the specific resins described above. Examples of other resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Other resins include resins described in the examples of WO 2016/088645, resins described in JP 2017-057265 A, resins described in JP 2017-032685 A, resins described in JP 2017-075248 A, resins described in JP 2017-066240 A, resins described in JP 2017-167513 A, resins described in JP 2017-173787 A, and resins described in paragraphs 0041 to 0060 of JP 2017-206689 A. Resins described in paragraphs 0022 to 0071 of JP 2018-010856 A, blocked polyisocyanate resins described in JP 2016-222891 A, resins described in JP 2020-122052 A, resins described in JP 2020-111656 A, resins described in JP 2020-139021 A, and resins containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain described in JP 2017-138503 A can also be used. In addition, by-products produced when synthesizing specific resins may be included as other resins.

The weight average molecular weight (Mw) of the other resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

It is preferable to use other resins that have alkaline developability or resins that act as dispersants.

[Alkali-developable resin]
The weight average molecular weight (Mw) of the alkali-developable resin is preferably 3,000 to 2,000,000. The upper limit is more preferably 1,000,000 or less, and even more preferably 500,000 or less. The lower limit is more preferably 4,000 or more, and even more preferably 5,000 or more.

Examples of alkaline-developable resins include (meth)acrylic resins, polyimine resins, polyether resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and polyimide resins. (Meth)acrylic resins and polyimine resins are preferred, and (meth)acrylic resins are more preferred.

As a resin with alkaline developability, it is preferable to use a resin having an acid group. Examples of acid groups include phenolic hydroxy groups, carboxy groups, sulfo groups, phosphate groups, phosphonate groups, activated imide groups, and sulfonamide groups, with carboxy groups being preferred. Alternatively, as a resin having an acid group, a resin in which an acid group has been introduced by reacting an acid anhydride with the hydroxy group generated by epoxy ring-opening may be used. Examples of such resins include the resins described in Japanese Patent No. 6,349,629. Resins having acid groups can be used, for example, as alkali-soluble resins.

The alkaline-developable resin preferably contains repeating units having an acid group, and more preferably contains 1 to 70 mol% of repeating units having an acid group based on the total repeating units of the resin. The upper limit of the content of repeating units having an acid group is preferably 50 mol% or less, and more preferably 40 mol% or less. The lower limit of the content of repeating units having an acid group is preferably 2 mol% or more, and more preferably 5 mol% or more.

The acid value of the alkaline-developable resin is preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, even more preferably 120 mgKOH/g or less, and particularly preferably 100 mgKOH/g or less. The acid value of the alkaline-developable resin is preferably 5 mgKOH/g or more, more preferably 10 mgKOH/g or more, and even more preferably 20 mgKOH/g or more.

It is also preferable that the alkali-developable resin further contains an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, an allyl group, and a (meth)acryloyl group. Allyl groups and (meth)acryloyl groups are preferred, and (meth)acryloyl groups are more preferred.

It is also preferable that the alkaline-developable resin contains a repeating unit derived from a monomer component containing a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as "ether dimers").

In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.
In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of formula (ED2), reference can be made to the description in JP-A-2010-168539, the contents of which are incorporated herein by reference.

Specific examples of ether dimers can be found, for example, in paragraph 0317 of JP 2013-029760 A, the contents of which are incorporated herein by reference.

The alkali-developable resin also preferably contains a repeating unit derived from a compound represented by the following formula (X).
In formula (X), _R1 represents a hydrogen atom or a methyl group, _R2 represents an alkylene group having 2 to 10 carbon atoms, _R3 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may contain a benzene ring, and n represents an integer of 1 to 15.

Examples of alkali-developable resins include resins having the following structures: In the following structural formula, Me represents a methyl group.

[Dispersant]
The resin composition of the present invention can also contain a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. When the total amount of acid groups and basic groups is taken as 100 mol%, the acidic dispersant (acidic resin) is preferably a resin in which the amount of acid groups is 70 mol% or more, and more preferably a resin consisting essentially of acid groups. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 40 to 105 mgKOH/g, more preferably 50 to 105 mgKOH/g, and even more preferably 60 to 105 mgKOH/g. Furthermore, the term "basic dispersant (basic resin)" refers to a resin in which the amount of basic groups is greater than the amount of acid groups. The basic dispersant (basic resin) is preferably a resin in which the amount of basic groups exceeds 50 mol % when the total amount of acid groups and basic groups is taken as 100 mol %. The basic groups possessed by the basic dispersant are preferably amino groups.

It is preferable that the resin used as a dispersant contains a repeating unit having an acid group.

The resin used as the dispersant is preferably a graft polymer. Examples of graft polymers include the resins described in paragraphs 0025 to 0094 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

The resin used as the dispersant is preferably a polyimine-based dispersant (polyimine resin) containing nitrogen atoms in at least one of the main chain and side chain. A preferred polyimine-based dispersant is a resin that has a main chain with a partial structure containing a functional group with a pKa of 14 or less, a side chain with 40 to 10,000 atoms, and a basic nitrogen atom in at least one of the main chain and side chain. There are no particular restrictions on the basic nitrogen atom, as long as it is a nitrogen atom that exhibits basicity. Examples of polyimine-based dispersants include the resins described in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

The resin used as the dispersant is preferably one with a structure in which multiple polymer chains are bonded to a core. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP 2013-043962 A.

In addition, dispersants that can be used include block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, resins described in JP 2018-087939 A, polyethyleneimines having polyester side chains described in WO 2016/104803 A, block copolymers described in WO 2019/125940 A, block polymers having acrylamide structural units described in JP 2020-066687 A, block polymers having acrylamide structural units described in JP 2020-066688 A, dispersants described in WO 2016/104803 A, and resins described in JP 2019-095548 A.

Dispersants are also commercially available. Specific examples include the DISPERBYK series manufactured by BYK Chemie (e.g., DISPERBYK-111, 161, etc.) and the Solsperse series manufactured by Lubrizol (e.g., Solsperse 36000, etc.). Pigment dispersants described in paragraphs 0041 to 0130 of JP 2014-130338 A can also be used, the contents of which are incorporated herein by reference.

The resins described above as dispersants can also be used for purposes other than as dispersants. For example, they can be used as binders.

The resin content of the total solids content of the resin composition is preferably 5 to 60% by mass. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less.

The content of the specific resin described above in relation to the total solid content of the resin composition is preferably 5 to 60% by mass. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less.

The content of the specific resin described above is preferably 10 to 80 parts by weight per 100 parts by weight of pigment. The lower limit is preferably 20 parts by weight or more, and more preferably 30 parts by weight or more. The upper limit is preferably 70 parts by weight or less, and more preferably 50 parts by weight or less.

Furthermore, the resin composition of the present invention preferably contains 20% by mass or more of the specific resin in the components excluding the colorant from the total solid content of the resin composition, more preferably 30% by mass or more, and even more preferably 40% by mass or more. The upper limit can be 100% by mass, or 90% by mass or less, or even 85% by mass or less. If the content of the specific resin is within the above range, it is easy to form a film with excellent heat resistance, and it is easier to suppress film shrinkage after heating. Furthermore, when an inorganic film or the like is formed on the surface of a film obtained using the resin composition of the present invention, even if this laminate is exposed to high temperatures, it is possible to suppress the occurrence of cracks in the inorganic film.
The total content of the colorant and the specific resin in the total solid content of the resin composition is preferably 25 to 100% by mass. The lower limit is more preferably 30% by mass or more, and even more preferably 40% by mass or more. The upper limit is more preferably 90% by mass or less, and even more preferably 80% by mass or less.

In the resin composition, the content of the other resins described above is preferably 230 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 150 parts by mass or less, per 100 parts by mass of the specific resin described above. The lower limit may be 0 parts by mass, or may be 5 parts by mass or more, or may be 10 parts by mass or more. It is also preferable that the resin composition is substantially free of the other resins described above. This embodiment makes it easier to form a film with superior heat resistance. "Substantially free of other resins" means that the content of other resins in the total solids content of the resin composition is 0.1% by mass or less, preferably 0.05% by mass or less, and more preferably none.

<<Solvent C>>
The resin composition of the present invention contains solvent C (hereinafter referred to as solvent). The solvent is basically not particularly limited as long as it satisfies the solubility of each component and the coatability of the resin composition. The solvent is preferably an organic solvent. Examples of organic solvents include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents. For details, see paragraph 0223 of International Publication No. 2015/166779, the contents of which are incorporated herein by reference. Furthermore, ester solvents substituted with a cyclic alkyl group and ketone solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol. However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

In the present invention, it is preferable to use an organic solvent with a low metal content, preferably 10 parts per billion (ppb) by mass or less. If necessary, organic solvents with a ppt (parts per trillion) by mass level may also be used, and such organic solvents are provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015). Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

The organic solvent may contain isomers (compounds with the same number of atoms but different structures). Furthermore, the organic solvent may contain only one type of isomer, or multiple types of isomers.

It is preferable that the peroxide content in the organic solvent is 0.8 mmol/L or less, and it is even more preferable that it is substantially free of peroxides.

The solvent content in the resin composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 30 to 90% by mass.

<<Pigment derivatives>>
The resin composition of the present invention may contain a pigment derivative, such as a compound having a structure in which an acid group or a basic group is bonded to a pigment skeleton.

Examples of dye skeletons that make up pigment derivatives include quinoline dye skeletons, benzimidazolone dye skeletons, benzisoindole dye skeletons, benzothiazole dye skeletons, iminium dye skeletons, squarylium dye skeletons, croconium dye skeletons, oxonol dye skeletons, pyrrolopyrrole dye skeletons, diketopyrrolopyrrole dye skeletons, azo dye skeletons, azomethine dye skeletons, phthalocyanine dye skeletons, naphthalocyanine dye skeletons, anthraquinone dye skeletons, quinacridone dye skeletons, dioxazine dye skeletons, perinone dye skeletons, perylene dye skeletons, thioindigo dye skeletons, isoindoline dye skeletons, isoindolinone dye skeletons, quinophthalone dye skeletons, iminium dye skeletons, dithiol dye skeletons, triarylmethane dye skeletons, and pyrromethene dye skeletons.

Examples of the acid group include a carboxy group, a sulfo group, a phosphate group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. Examples of atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), alkaline earth metal ions (Ca ²⁺ , Mg ²⁺ , etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions. Examples of the carboxylic acid amide group include a group represented by -NHCOR ^X1 . Examples of the sulfonic acid amide group include a group represented by -NHSO ₂ R ^X2 . Examples of the imidic acid group include a group represented by -SO ₂ NHSO ₂ R ^X3 , -CONHSO ₂ R ^X4 , -CONHCOR ^X5 , or -SO ₂ NHCOR ^X6 , with -SO ₂ NHSO ₂ R ^X3 being more preferred. R ^X1 to R ^X6 each independently represent an alkyl group or an aryl group. The alkyl group and aryl group represented by ^{R X1} to R ^X6 may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom.

Basic groups include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Atoms or atomic groups that constitute salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

As the pigment derivative, a pigment derivative having excellent visible light transparency (hereinafter also referred to as a transparent pigment derivative) can also be used. The maximum molar absorption coefficient (εmax) of the transparent pigment derivative in ^{the wavelength region of 400 to 700 nm is preferably 3000 L mol cm −1 or} less, more preferably 1000 L mol cm ⁻¹ or less, and even more preferably 100 L mol cm ⁻¹ or less. The lower limit of ^εmax is, for example ^{, 1 L mol cm −1 or} more, and may be 10 ^L mol cm ^{−1 or} more.

Specific examples of pigment derivatives include the compounds described in the examples below, JP-A Nos. 56-118462, 63-264674, 01-217077, 03-009961, 03-026767, 03-153780, 03-045662, and JP-A Nos. JP-A-04-285669, JP-A-06-145546, JP-A-06-212088, JP-A-06-240158, JP-A-10-030063, JP-A-10-195326, paragraphs 0086 to 0098 of WO 2011/024896, paragraphs 0012/102399 Paragraph numbers 0063 to 0094, paragraph number 0082 of International Publication No. 2017/038252, paragraph number 0171 of JP-A-2015-151530, paragraph numbers 0162 to 0183 of JP-A-2011-252065, JP-A-2003-081972, Japanese Patent No. 5299151, JP-A-2015-172732 , JP 2014-199308 A, JP 2014-085562 A, JP 2014-035351 A, JP 2008-081565 A, JP 2019-109512 A compounds described in, and WO 2020/002106 A diketopyrrolopyrrole compounds having a thiol linking group described.

The content of the pigment derivative is preferably 1 to 30 parts by mass, and more preferably 3 to 20 parts by mass, per 100 parts by mass of the pigment. Only one type of pigment derivative may be used, or two or more types may be used in combination.

<<Polymerizable Monomer>>
The resin composition of the present invention preferably contains a polymerizable monomer. For example, known compounds that can be crosslinked by radicals, acids, or heat can be used as the polymerizable monomer. Examples of the polymerizable monomer include compounds having an ethylenically unsaturated bond-containing group and compounds having a cyclic ether group, with compounds having an ethylenically unsaturated bond-containing group being preferred. Examples of the ethylenically unsaturated bond-containing group include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups. Examples of the cyclic ether group include epoxy groups and oxetane groups. Compounds having an ethylenically unsaturated bond-containing group are preferably used as radical polymerizable monomers. Furthermore, compounds having a cyclic ether group are preferably used as cationic polymerizable monomers. The polymerizable monomer is preferably a polyfunctional polymerizable monomer. That is, the polymerizable monomer is preferably a monomer having two or more polymerizable groups, such as an ethylenically unsaturated bond-containing group or a cyclic ether group.

The molecular weight of the polymerizable monomer is preferably 100 to 3,000. The upper limit is more preferably 2,000 or less, and even more preferably 1,500 or less. The lower limit is more preferably 150 or more, and even more preferably 250 or more.

(Compound having an ethylenically unsaturated bond-containing group)
The compound having an ethylenically unsaturated bond-containing group used as a polymerizable monomer is preferably a polyfunctional compound. That is, it is preferably a compound having two or more ethylenically unsaturated bond-containing groups, more preferably a compound having three or more ethylenically unsaturated bond-containing groups, even more preferably a compound having 3 to 15 ethylenically unsaturated bond-containing groups, and even more preferably a compound having 3 to 6 ethylenically unsaturated bond-containing groups. Furthermore, the compound having an ethylenically unsaturated bond-containing group is preferably a trifunctional to 15functional (meth)acrylate compound, and more preferably a trifunctional to hexafunctional (meth)acrylate compound. Specific examples of compounds having an ethylenically unsaturated bond-containing group include compounds described in paragraphs 0095 to 0108 of JP-A-2009-288705, paragraph 0227 of JP-A-2013-029760, paragraphs 0254 to 0257 of JP-A-2008-292970, paragraphs 0034 to 0038 of JP-A-2013-253224, paragraph 0477 of JP-A-2012-208494, JP-A-2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, and JP-A-2017-194662, the contents of which are incorporated herein by reference.

Preferred examples of the compound having an ethylenically unsaturated bond-containing group include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl group is bonded via an ethylene glycol and/or propylene glycol residue (e.g., SR454 and SR499, commercially available from Sartomer Corporation). Furthermore, examples of the compound having an ethylenically unsaturated bond-containing group that can be used include diglycerin EO (ethylene oxide)-modified (meth)acrylate (commercially available product is M-460; manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (KAYARAD HDDA, manufactured by Nippon Kayaku Co., Ltd.), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), and light acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.).

It is also preferable to use trifunctional (meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide-modified tri(meth)acrylate, trimethylolpropane ethylene oxide-modified tri(meth)acrylate, isocyanuric acid ethylene oxide-modified tri(meth)acrylate, and pentaerythritol tri(meth)acrylate as compounds having an ethylenically unsaturated bond-containing group. Commercially available trifunctional (meth)acrylate compounds include Aronix M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, and M-450 (manufactured by Toagosei Co., Ltd.), NK Ester A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, and TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, and PET-30 (manufactured by Nippon Kayaku Co., Ltd.).

The compound having an ethylenically unsaturated bond-containing group can also be a compound having an acid group. Using a compound having an acid group can suppress the generation of development residues. Examples of acid groups include carboxy groups, sulfo groups, and phosphate groups, with carboxy groups being preferred. Commercially available polymerizable monomers having an acid group include Aronix M-305, M-510, M-520, and Aronix TO-2349 (manufactured by Toagosei Co., Ltd.). The acid value of the polymerizable monomer having an acid group is preferably 0.1 to 40 mgKOH/g, and more preferably 5 to 30 mgKOH/g.

In another preferred embodiment, the compound having an ethylenically unsaturated bond-containing group is a compound having a caprolactone structure. Compounds having a caprolactone structure are commercially available, for example, from Nippon Kayaku Co., Ltd. as the KAYARAD DPCA series, including DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

The compound having an ethylenically unsaturated bond-containing group can also be a compound having an alkyleneoxy group. The compound having an alkyleneoxy group is preferably a compound having an ethyleneoxy group and/or a propyleneoxy group, more preferably a compound having an ethyleneoxy group, and even more preferably a tri- to hexa-functional (meth)acrylate compound having 4 to 20 ethyleneoxy groups. Commercially available compounds having alkyleneoxy groups include SR-494, a tetrafunctional (meth)acrylate having four ethyleneoxy groups manufactured by Sartomer Corporation, and KAYARAD TPA-330, a trifunctional (meth)acrylate having three isobutyleneoxy groups manufactured by Nippon Kayaku Co., Ltd.

The compound having an ethylenically unsaturated bond-containing group may also be a compound having a fluorene skeleton. Commercially available compounds having a fluorene skeleton include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).

It is also preferable to use compounds that are substantially free of environmentally restricted substances such as toluene as compounds having an ethylenically unsaturated bond-containing group. Commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

Suitable compounds containing an ethylenically unsaturated bond-containing group include urethane acrylates such as those described in JP-B No. 48-041708, JP-A No. 51-037193, JP-B No. 02-032293, and JP-B No. 02-016765, as well as urethane compounds with an ethylene oxide skeleton such as those described in JP-B No. 58-049860, JP-B No. 56-017654, JP-B No. 62-039417, and JP-B No. 62-039418. It is also preferable to use polymerizable monomers containing an amino structure or sulfide structure in the molecule, such as those described in JP-A Nos. 63-277653, 63-260909, and JP-A No. 01-105238. Furthermore, commercially available polymerizable monomers such as UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, and LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.) can also be used.

(Compound having a cyclic ether group)
Compounds having a cyclic ether group that can also be used as polymerizable monomers include compounds having an epoxy group (hereinafter also referred to as epoxy compounds) and compounds having an oxetane group (hereinafter also referred to as oxetane compounds). The epoxy compound is preferably a polyfunctional epoxy compound. That is, the epoxy compound is preferably a compound having two or more epoxy groups. The upper limit of the number of epoxy groups is preferably 20 or less, more preferably 10 or less. Furthermore, the oxetane compound is preferably a polyfunctional oxetane compound. That is, the oxetane compound is preferably a compound having two or more oxetane groups. The upper limit of the number of oxetane groups is preferably 20 or less, more preferably 10 or less.

Commercially available epoxy compounds include JER828, JER1007, JER157S70 (manufactured by Mitsubishi Chemical Corporation), and JER157S65 (manufactured by Mitsubishi Chemical Holdings Corporation), as well as those listed in paragraph 0189 of JP 2011-221494 A. Other commercially available products include ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (all manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (all manufactured by ADEKA Corporation), Denacol EX-611, EX-612, EX-614, EX-614B, EX-622, EX -512, EX-521, EX-411, EX-421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX- 850, EX-851, EX-821, EX-830, EX-832, EX-841, EX-911, EX-941, EX-920, EX-931, EX-212L, EX-2 14L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC-204, DLC-205, DLC-206, DLC-301, DLC-402, EX-111, EX-121, EX-141, EX-145, EX-146, EX-147, EX-171, EX-192 (all manufactured by Nagase Chemtec), YH-3 00, YH-301, YH-302, YH-315, YH-324, YH-325 (all manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), Celoxide 2021P, 2081, 2000, 3000, EHPE3150, Epolead GT400, Celvinarce B0134, B0177 (manufactured by Daicel Corporation), and TETRAD-X (manufactured by Mitsubishi Gas Chemical Company, Inc.).

Commercially available oxetane compounds include OXT-201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, and OX-SQ TX-100 (all manufactured by Toagosei Co., Ltd.).

The content of the polymerizable monomer in the total solid content of the resin composition is preferably 0.1 to 40% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 30% by mass or less, and more preferably 20% by mass or less.

When a compound having an ethylenically unsaturated bond-containing group is used as the polymerizable monomer, the content of the compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer is preferably 1 to 50 parts by mass per 100 parts by mass of the specific resin described above. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.

When a compound having a cyclic ether group is used as the polymerizable monomer, the content of the compound having a cyclic ether group as the polymerizable monomer is preferably 1 to 50 parts by mass per 100 parts by mass of the specific resin described above. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.

When a compound having an ethylenically unsaturated bond-containing group and a compound having a cyclic ether group are used as polymerizable monomers, the resin composition preferably contains 10 to 500 parts by mass of the compound having a cyclic ether group per 100 parts by mass of the compound having an ethylenically unsaturated bond-containing group. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. The upper limit is preferably 400 parts by mass or less, and more preferably 300 parts by mass or less. If the ratio of the two is within the above range, a film with better heat resistance (suppression of cracking and film shrinkage) can be formed.

<<Photopolymerization initiator>>
The resin composition of the present invention preferably contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, biimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, and α-aminoketone compounds. From the standpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a biimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound. A compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound is more preferred, with an oxime compound being even more preferred. Further, as the photopolymerization initiator, compounds described in paragraphs 0065 to 0111 of JP-A No. 2014-130173, compounds described in Japanese Patent No. 6301489, compounds described in MATERIAL STAGE 37-60pp, vol. 19, No. 3,2019, the peroxide-based photopolymerization initiator described in WO 2018/221177, the photopolymerization initiator described in WO 2018/110179, the photopolymerization initiator described in JP 2019-043864 A, the photopolymerization initiator described in JP 2019-044030 A, the peroxide-based initiator described in JP 2019-167313 A, the aminoacetophenone-based initiator having an oxazolidine group described in JP 2020-055992 A, the oxime-based photopolymerization initiator described in JP 2013-190459 A, the polymer described in JP 2020-172619 A, and the like, the contents of which are incorporated herein by reference.

Examples of biimidazole compounds include 2,2-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5-tetrakis(3,4,5-trimethoxyphenyl)-1,2'-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(o-chlorophenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidazole. Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF), and Api307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one) (manufactured by MFCI). Commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (both manufactured by IGM Resins B.V.), Irgacure 819 and Irgacure TPO (both manufactured by BASF).

Examples of oxime compounds include compounds described in JP-A-2001-233842, JP-A-2000-080068, JP-A-2006-342166, J. C. S. Perkin II (1979, pp. 1653-1660), J. C. S. Perkin II (1979, pp. 156-162), and compounds described in Journal of Photopolymer Science and Technology (1995, pp.202-232) described compounds, compounds described in JP-A-2000-066385, compounds described in JP-T-2004-534797, compounds described in JP-A-2006-342166, compounds described in JP-A-2017-019766, compounds described in Japanese Patent No. 6065596, compounds described in WO 2015/152153, compounds described in WO 2017/051680, compounds described in JP-A-2017-198865, compounds described in paragraphs 0025 to 0038 of WO 2017/164127, compounds described in WO 2013/167515 and the like. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, and 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, and Irgacure OXE04 (manufactured by BASF), TR-PBG-304 (manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), and Adeka Optomer N-1919 (manufactured by ADEKA Corporation, photopolymerization initiator 2 described in JP 2012-014052 A). In addition, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA Arcles NCI-730, NCI-831, and NCI-930 (manufactured by ADEKA Corporation).

An oxime compound having a fluorene ring can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorene ring include the compounds described in JP 2014-137466 A.

Also, as a photopolymerization initiator, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring can be used. Specific examples of such oxime compounds include the compounds described in WO 2013/083505.

An oxime compound containing a fluorine atom can also be used as a photopolymerization initiator. Specific examples of oxime compounds containing a fluorine atom include the compounds described in JP 2010-262028 A, compounds 24, 36 to 40 described in JP 2014-500852 A, and compound (C-3) described in JP 2013-164471 A.

Oxime compounds in which a hydroxyl-containing substituent is bonded to a carbazole skeleton can also be used as photopolymerization initiators. Examples of such photopolymerization initiators include the compounds described in WO 2019/088055.

An oxime compound having a nitro group can be used as a photopolymerization initiator. It is also preferable that the oxime compound having a nitro group be a dimer. Specific examples of oxime compounds having a nitro group include the compounds described in paragraphs 0031 to 0047 of JP 2013-114249 A, paragraphs 0008 to 0012 and 0070 to 0079 of JP 2014-137466 A, the compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071 A, and ADEKA ARCLES NCI-831 (manufactured by ADEKA Corporation).

Oxime compounds with a benzofuran skeleton can also be used as photopolymerization initiators. Specific examples include OE-01 to OE-75 described in WO 2015/036910.

Oxime compounds in which a hydroxyl-containing substituent is bonded to a carbazole skeleton can also be used as photopolymerization initiators. Examples of such photopolymerization initiators include the compounds described in WO 2019/088055.

Specific examples of oxime compounds are shown below, but the present invention is not limited to these.

The oxime compound preferably has a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably has a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the standpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using known methods. For example, it is preferable to measure using ethyl acetate at a concentration of 0.01 g/L using a spectrophotometer (Varian Cary-5 spectrophotometer).

Bifunctional, trifunctional, or higher functional photoradical polymerization initiators may be used as the photopolymerization initiator. By using such photoradical polymerization initiators, two or more radicals are generated from one molecule of the photoradical polymerization initiator, resulting in good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced, improving solubility in solvents, etc., making it less likely to precipitate over time and improving the stability of the resin composition over time. Specific examples of bifunctional, trifunctional, or higher functional photoradical polymerization initiators include the dimers of oxime compounds described in JP-A Nos. 2010-527339, 2011-524436, WO 2015/004565, and WO 2016-532675, paragraphs [0407] to [0412], and WO 2017/033680, paragraphs [0039] to [0055]; Compound (E) and Compound (G) described in JP-A No. 2013-522445; Examples of the photoinitiator include Cmpd1 to 7 described in WO 2016/034963, the oxime ester photoinitiator described in paragraph 0007 of JP-T-2017-523465, the photoinitiator described in paragraphs 0020 to 0033 of JP-A-2017-167399, the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of JP-A-2017-151342, and the oxime compound described in Japanese Patent No. 6,469,669.

The content of the photopolymerization initiator in the total solids content of the resin composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 20% by mass or less, and more preferably 15% by mass or less. Only one type of photopolymerization initiator may be used, or two or more types may be used.

<<Silane coupling agent>>
The resin composition of the present invention may contain a silane coupling agent. In this specification, the term "silane coupling agent" refers to a silane compound having a hydrolyzable group and other functional groups. The term "hydrolyzable group" refers to a substituent directly bonded to a silicon atom that can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of hydrolyzable groups include halogen atoms, alkoxy groups, and acyloxy groups, with alkoxy groups being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include vinyl groups, (meth)allyl groups, (meth)acryloyl groups, mercapto groups, epoxy groups, amino groups, ureido groups, sulfide groups, isocyanate groups, and phenyl groups, with amino groups, (meth)acryloyl groups, and epoxy groups being preferred. Specific examples of the silane coupling agent include the compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and the compounds described in paragraphs 0056 to 0066 of JP-A-2009-242604, the contents of which are incorporated herein by reference.

The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The upper limit is preferably 3% by mass or less, and more preferably 2% by mass or less. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. Only one type of silane coupling agent may be used, or two or more types may be used.

<<Curing accelerator>>
The resin composition of the present invention may further contain a curing accelerator for the purposes of accelerating the reaction of the resin and polymerizable monomers and lowering the curing temperature. Curing accelerators include methylol compounds (e.g., compounds exemplified as crosslinking agents in paragraph 0246 of JP-A-2015-034963), amines, phosphonium salts, amidine salts, amide compounds (for example, curing agents described in paragraph 0186 of JP-A-2013-041165), base generators (e.g., ionic compounds described in JP-A-2014-055114), cyanate compounds (e.g., compounds described in paragraph 0071 of JP-A-2012-150180), alkoxysilane compounds (e.g., alkoxysilane compounds having an epoxy group described in JP-A-2011-253054), onium salt compounds (e.g., compounds exemplified as acid generators in paragraph 0216 of JP-A-2015-034963, compounds described in JP-A-2009-180949), and the like.

When the resin composition of the present invention contains a curing accelerator, the content of the curing accelerator is preferably 0.3 to 8.9 mass% of the total solids content of the resin composition, and more preferably 0.8 to 6.4 mass%.

<<Polymerization inhibitor>>
The resin composition of the present invention may contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Among these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5 mass%.

<<Surfactants>>
The resin composition of the present invention may contain a surfactant. Various surfactants can be used as the surfactant, such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, or a silicone-based surfactant. The surfactant is preferably a fluorine-based surfactant or a silicone-based surfactant. Examples of the surfactant include those described in paragraphs 0238 to 0245 of WO 2015/166779, the contents of which are incorporated herein by reference.

The fluorine content in the fluorosurfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. Fluorosurfactants with a fluorine content within this range are effective in terms of uniformity of the coating film thickness and liquid saving, and also have good solubility in resin compositions.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 A (corresponding paragraphs 0060 to 0064 of WO 2014/017669 A), and those described in paragraphs 0117 to 0132 of JP 2011-132503 A, the contents of which are incorporated herein by reference. Commercially available fluorine-based surfactants include, for example, Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, R-30, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, and R-01. , R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox Examples include PF636, PF656, PF6320, PF6520, and PF7002 (all manufactured by OMNOVA), Ftergent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, and FTX-218 (all manufactured by NEOS Corporation).

It is also preferred to use a polymer of a hydrophilic vinyl ether compound and a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group as the fluorosurfactant. For information on such fluorosurfactants, please refer to the description in JP 2016-216602 A, the contents of which are incorporated herein by reference.

The fluorosurfactant may also be a block polymer. Examples include the compounds described in JP-A-2011-089090. The fluorosurfactant may also preferably be a fluorine-containing polymer compound containing a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a repeating unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups or propyleneoxy groups). The following compounds are also exemplified as fluorosurfactants usable in the present invention.
The weight average molecular weight of the above compound is preferably 3,000 to 50,000, for example, 14,000. In the above compound, the percentage indicating the proportion of repeating units is mol%.

The fluorosurfactant may also be a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain. Specific examples include the compounds described in paragraphs 0050-0090 and 0289-0295 of JP 2010-164965 A, and Megafac RS-101, RS-102, RS-718K, and RS-72-K manufactured by DIC Corporation. The fluorosurfactant may also be the compounds described in paragraphs 0015-0158 of JP 2015-117327 A.

In addition, from the perspective of environmental regulations, it is also preferable to use the surfactants described in WO 2020/084854 as an alternative to surfactants having a perfluoroalkyl group with 6 or more carbon atoms.

It is also preferable to use a fluorine-containing imide salt compound represented by formula (fi-1) as a surfactant.
In formula (fi-1), m represents 1 or 2, n represents an integer of 1 to 4, a represents 1 or 2, and X ^a+ represents an a-valent metal ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, a quaternary ammonium ion, or NH ₄ ⁺ .

Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, and sorbitan fatty acid. Examples of suitable esters include Pluronic L10, L31, L61, L62, 10R5, 17R2, and 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, and 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Lubrizol Japan Co., Ltd.), NCW-101, NCW-1001, and NCW-1002 (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.), Paionin D-6112, D-6112-W, and D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, and Surfynol 104, 400, and 440 (manufactured by Nissin Chemical Industry Co., Ltd.).

Cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium salts, alkylpyridium salts, imidazolium salts, etc. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzylammonium chloride, cetylpyridinium chloride, and stearamidomethylpyridium chloride.

Anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyl ether disulfonate, sodium alkylnaphthalenesulfonate, sodium dialkylsulfosuccinate, sodium stearate, potassium oleate, sodium dioctyl sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkylsulfosuccinate, sodium stearate, sodium oleate, and sodium t-octylphenoxyethoxypolyethoxyethyl sulfate.

Silicone surfactants include DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419 OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie).

Furthermore, the silicone surfactant may also be a compound having the following structure:

The content of surfactant in the total solid content of the resin composition is preferably 0.001% to 5.0% by mass, more preferably 0.005 to 3.0% by mass. Only one type of surfactant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be within the above range.

<<Ultraviolet absorber>>
The resin composition of the present invention may contain an ultraviolet absorber. Examples of ultraviolet absorbers that can be used include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, and triazine compounds. For details, see paragraphs 0052 to 0072 of JP 2012-208374 A, paragraphs 0317 to 0334 of JP 2013-068814 A, and paragraphs 0061 to 0080 of JP 2016-162946 A, the contents of which are incorporated herein by reference. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by Daito Chemical Co., Ltd.), the Tinuvin series and Uvinul series manufactured by BASF, and the Sumisorb series manufactured by Sumika Chemtex Co., Ltd. Examples of benzotriazole compounds include the MYUA series manufactured by Miyoshi Oil & Fats (The Chemical Daily, February 1, 2016). Examples of ultraviolet absorbers include the compounds described in paragraphs 0049-0059 of Japanese Patent No. 6268967, the compounds described in paragraphs 0059-0076 of International Publication No. 2016/181987, and the thioaryl group-substituted benzotriazole ultraviolet absorbers described in International Publication No. 2020/137819. The content of the ultraviolet absorber in the total solids content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be within the above range.

<<Antioxidants>>
The resin composition of the present invention may contain an antioxidant. Examples of antioxidants include phenolic compounds, phosphite ester compounds, and thioether compounds. Any phenolic compound known as a phenolic antioxidant can be used as the phenolic compound. Preferred phenolic compounds include hindered phenolic compounds. Compounds having a substituent at the ortho position adjacent to the phenolic hydroxy group are preferred. The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. Compounds having a phenolic group and a phosphite ester group in the same molecule are also preferred. Phosphorus-based antioxidants can also be suitably used as the antioxidant. The compounds described in Korean Patent Publication No. 10-2019-0059371 can also be used as the antioxidant. The content of the antioxidant in the total solids content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Only one antioxidant may be used, or two or more antioxidants may be used. When two or more antioxidants are used, the total amount is preferably within the above range.

<<Other ingredients>>
The resin composition of the present invention may contain, as needed, sensitizers, fillers, thermosetting accelerators, plasticizers, and other auxiliary agents (e.g., conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, properties such as film physical properties can be adjusted. For details of these components, please refer to, for example, paragraphs 0183 and after of JP 2012-003225 A (corresponding to paragraph 0237 of U.S. Patent Application Publication No. 2013/0034812), and paragraphs 0101 to 0104 and 0107 to 0109 of JP 2008-250074 A, the contents of which are incorporated herein by reference. Furthermore, the resin composition may contain, as needed, a latent antioxidant. Examples of latent antioxidants include compounds in which a moiety functioning as an antioxidant is protected with a protecting group, and which function as an antioxidant when heated at 100 to 250°C or at 80 to 200°C in the presence of an acid/base catalyst, resulting in the elimination of the protecting group. Examples of latent antioxidants include the compounds described in WO 2014/021023, WO 2017/030005, and JP 2017-008219 A. Commercially available products include ADEKA ARCLES GPA-5001 (manufactured by ADEKA Corporation).

The resin composition of the present invention may contain a metal oxide to adjust the refractive index of the resulting film. Examples of metal oxides include TiO ₂ , ZrO ₂ , Al ₂ O ₃ , and SiO ₂ . The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core may be hollow.

The resin composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, compounds described in paragraphs 0029 to 0034 of JP-A-2017-146350, compounds described in paragraphs 0036 to 0037 and 0049 to 0052 of JP-A-2017-129774, compounds described in paragraphs 0031 to 0034 and 0058 to 0059 of JP-A-2017-129674, compounds described in paragraphs 0036 to 0037 and 0051 to 0054 of JP-A-2017-122803, compounds described in paragraphs 0025 to 0039 of WO 2017/164127, and compounds described in paragraphs 0017-186546. JP-A-2015-025116, paragraphs 0019 to 0041 of the compounds described, JP-A-2012-145604, paragraphs 0101 to 0125 of the compounds described, JP-A-2012-103475, paragraphs 0018 to 0021 of the compounds described, JP-A-2011-257591, paragraphs 0015 to 0018 of the compounds described, JP-A-2011-191483, paragraphs 0017 to 0021 of the compounds described, JP-A-2011-145668, paragraphs 0108 to 0116 of the compounds described, JP-A-2011-253174, paragraphs 0103 to 0153 of the compounds described, and the like.

The resin composition of the present invention preferably contains 100 ppm or less of free metal that is not bonded or coordinated to pigments or the like, more preferably 50 ppm or less, even more preferably 10 ppm or less, and particularly preferably contains substantially no free metal. This embodiment can be expected to provide effects such as stabilization of pigment dispersibility (prevention of aggregation), improvement of spectral characteristics due to improved dispersibility, stabilization of curable components, prevention of conductivity fluctuations due to elution of metal atoms and metal ions, and improvement of display characteristics. In addition, the effects described in JP 2012-153796 A, JP 2000-345085 A, JP 2005-200560 A, JP 08-043620 A, JP 2004-145078 A, JP 2014-119487 A, JP 2010-083997 A, JP 2017-090930 A, JP 2018-025612 A, JP 2018-025797 A, JP 2017-155228 A, JP 2018-036521 A, etc. can also be obtained. Examples of the free metals include Na, K, Ca, Sc, Ti, Mn, Cu, Zn, Fe, Cr, Co, Mg, Al, Sn, Zr, Ga, Ge, Ag, Au, Pt, Cs, Ni, Cd, Pb, and Bi. Furthermore, the resin composition of the present invention preferably contains 100 ppm or less of free halogens that are not bonded or coordinated with pigments or the like, more preferably 50 ppm or less, even more preferably 10 ppm or less, and particularly preferably substantially no halogens. Examples of halogens include F, Cl, Br, I, and anions thereof. Methods for reducing the amount of free metals and halogens in the resin composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification with ion-exchange resins.

In light of environmental regulations, the use of perfluoroalkylsulfonic acids and their salts, and perfluoroalkylcarboxylic acids and their salts may be restricted. When the content of the above-mentioned compounds in the resin composition of the present invention is reduced, the content of perfluoroalkylsulfonic acids (particularly perfluoroalkylsulfonic acids having a perfluoroalkyl group with 6 to 8 carbon atoms) and their salts, and perfluoroalkylcarboxylic acids (particularly perfluoroalkylcarboxylic acids having a perfluoroalkyl group with 6 to 8 carbon atoms) and their salts is preferably in the range of 0.01 ppb to 1,000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, based on the total solids content of the resin composition. The resin composition of the present invention may be substantially free of perfluoroalkylsulfonic acids and their salts, and perfluoroalkylcarboxylic acids and their salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salts, and a compound that can replace perfluoroalkyl carboxylic acid and its salts, a resin composition that is substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, may be selected. Examples of compounds that can replace regulated compounds include compounds that are exempt from regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above content does not preclude the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. The resin composition of the present invention may contain perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, within the maximum allowable range.

It is also preferable that the resin composition of the present invention is substantially free of terephthalic acid esters. Here, "substantially free" means that the content of terephthalic acid esters in the total amount of the resin composition is 1,000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably zero.

<Storage container>
The container for storing the resin composition is not particularly limited, and known containers can be used. Furthermore, in order to prevent impurities from being mixed into the raw materials or the resin composition, it is also preferable to use a multi-layer bottle whose inner wall is made of six types of six-layer resin or a bottle with a seven-layer structure made of six types of resin. Examples of such containers include the container described in JP 2015-123351 A. Furthermore, it is also preferable to make the inner wall of the container out of glass or stainless steel in order to prevent metal elution from the inner wall, improve the storage stability of the resin composition, and suppress deterioration of the components.

<Method for preparing resin composition>
The resin composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the resin composition, all components may be simultaneously dissolved and/or dispersed in an organic solvent to prepare the resin composition, or, if necessary, each component may be prepared as two or more appropriate solutions or dispersions, which are mixed at the time of use (application) to prepare the resin composition.

Preparation of the resin composition preferably includes a process for dispersing the pigment. Mechanical forces used in this process include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include bead mills, sand mills, roll mills, ball mills, paint shakers, microfluidizers, high-speed impellers, sand grinders, flow jet mixers, high-pressure wet atomization, and ultrasonic dispersion. When grinding the pigment in a sand mill (bead mill), it is preferable to use small-diameter beads or increase the bead packing ratio to increase grinding efficiency. After grinding, it is also preferable to remove coarse particles by filtration, centrifugation, or other methods. In addition, the process and disperser for dispersing pigments can be suitably used, for example, the process and disperser described in "Dispersion Technology Encyclopedia, published by Joho Kiko Co., Ltd., July 15, 2005" or "Dispersion Technology and Industrial Applications Focused on Suspension (Solid/Liquid Dispersion System) - Comprehensive Data Collection, published by the Management Development Center Publishing Department, October 10, 1978," and paragraph 0022 of JP-A No. 2015-157893. In addition, in the process for dispersing pigments, particle refinement may be performed in a salt milling step. The materials, equipment, processing conditions, etc. used in the salt milling step can be found in, for example, JP-A Nos. 2015-194521 and 2012-046629.

When preparing a resin composition, it is preferable to filter the resin composition for purposes such as removing foreign matter and reducing defects. Any filter conventionally used for filtration purposes can be used without any particular limitation. Examples include filters made from materials such as fluororesins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (e.g., nylon-6, nylon-6,6), and polyolefin resins (including high-density and ultra-high-molecular-weight polyolefin resins) such as polyethylene and polypropylene (PP). Of these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The filter pore size is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and even more preferably 0.05 to 0.5 μm. A filter pore size within the above range ensures more reliable removal of fine foreign matter. For filter pore size values, refer to the nominal values provided by the filter manufacturer. Various filters provided by Nippon Pall Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantech Toyo Co., Ltd., Nippon Integris Co., Ltd. (formerly Nippon Microlith Co., Ltd.), Kitz Microfilter Co., Ltd., and others can be used.

It is also preferable to use fibrous filter media as the filter. Examples of fibrous filter media include polypropylene fiber, nylon fiber, and glass fiber. Commercially available products include the SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by Roki Techno Co., Ltd.

When using filters, different filters (for example, a first filter and a second filter) may be combined. In this case, filtration with each filter may be performed once or twice or more times. Filters with different pore sizes within the above-mentioned range may also be combined. Filtration with the first filter may be performed on the dispersion liquid alone, and filtration with the second filter may be performed after mixing with other components. Appropriate filters can be selected depending on the hydrophilicity or hydrophobicity of the resin composition.

<Resin manufacturing method>
Next, a method for producing the resin of the present invention will be described. The method for producing the resin of the present invention includes a step of reacting a resin having a primary amino group or a secondary amino group with a macromonomer having an acid anhydride structure at its terminal. Examples of the resin having a primary amino group or a secondary amino group include the amine polymer M described in the section on specific resins. Examples of the macromonomer having an acid anhydride structure at its terminal include the macromonomer AH described in the section on specific resins.

By reacting a resin having a primary or secondary amino group with a macromonomer having an acid anhydride structure at its terminal, the amino group of the resin having a primary or secondary amino group (amine polymer M) undergoes an addition ring-opening reaction with the acid anhydride group of the macromonomer having an acid anhydride structure at its terminal (macromonomer AH), and a carboxyl group is formed along with an amide bond as the acid anhydride group opens.

When the amine polymer M and the macromonomer AH are mixed to react with each other, the ratio of acid anhydride groups of the macromonomer AH to 1 mole of amino groups of the amine polymer M is preferably 0.05 to 1 mole, more preferably 0.1 to 1 mole, and even more preferably 0.2 to 1 mole.

In the resin manufacturing method of the present invention, cyclic acid anhydrides (succinic anhydride, glutaric anhydride, maleic anhydride, phthalic anhydride, itaconic anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, (±)-trans-1,2-cyclohexanedicarboxylic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, 4-methylcyclohexane-1,2-dicarboxylic anhydride, trimellitic anhydride, At least one compound selected from the group consisting of phthalic anhydride, 2,3-naphthalenedicarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 2-sulfobenzoic anhydride, tetrabromo-o-sulfobenzoic anhydride, etc.), acid chloride compounds having an ethylenically unsaturated bond-containing group, acid chloride compounds having an epoxy group, acid chloride compounds having an oxetanyl group, and compounds having a dye moiety and an ethylenically unsaturated bond-containing group may be added during or after the reaction of the amine polymer M with the macromonomer AH. This allows the amino groups of the amine polymer M to react with the compound, thereby adding functional groups such as acid groups, ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups, and groups having a dye moiety to the resin.

<Membrane>
The film of the present invention is a film obtained from the resin composition of the present invention described above. The film of the present invention can be used for optical filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. The film of the present invention can also be used for black matrices, light-shielding films, etc.

The film thickness of the film of the present invention can be adjusted appropriately depending on the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

When the film of the present invention is used as a color filter, it is preferable that the film of the present invention has a green, red, blue, cyan, magenta, or yellow hue. Furthermore, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

When the film of the present invention is used as a near-infrared cut filter, the maximum absorption wavelength of the film of the present invention preferably lies in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1100 nm. Furthermore, the transmittance of the film over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Furthermore, the transmittance of the film at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. Furthermore, the ratio of absorbance Amax at the maximum absorption wavelength to absorbance A550 at a wavelength of 550 nm, absorbance Amax/absorbance A550, is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400.

When the film of the present invention is used as a near-infrared transmission filter, the film of the present invention preferably has, for example, any one of the following spectral characteristics (i1) to (i5).
(i1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 640 nm and transmit light with a wavelength of more than 750 nm.
(i2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 750 nm and transmit light with a wavelength of more than 850 nm.
(i3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 830 nm and transmit light with a wavelength of more than 950 nm.
(i4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 950 nm and transmit light with a wavelength of more than 1050 nm.
(i5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 1050 nm and transmit light with a wavelength longer than 1150 nm.

The thickness of the film of the present invention after heat treatment at 300°C for 5 hours in a nitrogen atmosphere is preferably 70% or more, more preferably 80% or more, even more preferably 90% or more, still more preferably 95% or more, and particularly preferably 99% or more of the thickness of the film before heat treatment.
Furthermore, the thickness of the film after heat treatment at 350°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, even more preferably 95% or more, and particularly preferably 99% or more.
Furthermore, the thickness of the film after heat treatment at 400°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, even more preferably 95% or more, and particularly preferably 99% or more.

<Membrane manufacturing method>
The film of the present invention can be produced by applying the above-described resin composition of the present invention to a support. The film production method of the present invention preferably further includes a step of forming a pattern (pixel). Examples of the pattern (pixel) formation method include photolithography and dry etching, and photolithography is preferred.

(Photolithography method)
First, a case where a film is produced by forming a pattern by photolithography will be described. Pattern formation by photolithography preferably includes a step of forming a resin composition layer on a support using the resin composition of the present invention, a step of exposing the resin composition layer to light in a pattern, and a step of developing and removing the unexposed portions of the resin composition layer to form a pattern (pixel). If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixel) (post-baking step) may be provided.

In the resin composition layer formation process, a resin composition layer is formed on a support using the resin composition of the present invention. The support is not particularly limited and can be selected appropriately depending on the application. Examples include glass substrates and silicon substrates, with a silicon substrate being preferred. The silicon substrate may also be formed with a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a transparent conductive film. A black matrix is sometimes formed on the silicon substrate to isolate each pixel. The silicon substrate may also be provided with an underlayer to improve adhesion to the upper layer, prevent material diffusion, or flatten the substrate surface. The surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane. It is also preferably 30 to 80° when measured with water. A surface contact angle of the underlayer within the above range ensures good wettability of the resin composition. The surface contact angle of the underlayer can be adjusted, for example, by adding a surfactant.

The resin composition can be applied using known methods. Examples include drop casting, slit coating, spraying, roll coating, spin coating, casting, slit-and-spin, pre-wetting (such as the method described in JP 2009-145395 A), various printing methods such as inkjet (e.g., on-demand, piezo, and thermal), nozzle jet printing, and other ejection-based printing, flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing, transfer methods using molds, and nanoimprinting. The inkjet application method is not particularly limited, and examples thereof include the method described in "Expanding and Usable Inkjet - Infinite Possibilities Seen in Patents -", published February 2005, by Sumibe Techno Research (particularly pages 115 to 133), and methods described in JP 2003-262716 A, JP 2003-185831 A, JP 2003-261827 A, JP 2012-126830 A, JP 2006-169325 A, etc. In addition, the resin composition can also be applied using the methods described in WO 2017/030174 and WO 2017/018419 A, the contents of which are incorporated herein by reference.

The resin composition layer formed on the support may be dried (prebaked). When producing a film using a low-temperature process, prebaking is not necessary. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or even 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, oven, etc.

Next, the resin composition layer is exposed to light in a pattern (exposure process). For example, the resin composition layer can be exposed to light in a pattern by using a stepper exposure machine or scanner exposure machine through a mask with a predetermined mask pattern. This allows the exposed areas to harden.

Radiation (light) that can be used for exposure includes g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wavelength light sources of 300 nm or more can also be used.

Furthermore, during exposure, light may be continuously irradiated to expose the film, or may be irradiated in pulses (pulse exposure). Pulse exposure refers to an exposure method in which light irradiation and pauses are repeated in short cycles (e.g., milliseconds or less). In the case of pulse exposure, the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and even more preferably 30 nanoseconds or less. The lower limit of the pulse width is not particularly limited, but can be 1 femtosecond (fs) or more, and can also be 10 femtoseconds or more. The frequency is preferably 1 kHz or more, more preferably 2 kHz or more, and even more preferably 4 kHz or more. The upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and even more preferably 10 kHz or less. The maximum instantaneous irradiance is preferably 50,000,000 W/ ^m² or more, more preferably 100,000,000 W/ ^m² or more, and even more preferably 200,000,000 W/ ^m² or more. The upper limit of the maximum instantaneous irradiance is preferably 100,000,000 W/ ^m² or less, more preferably 800,000,000 W/ ^m² or less, and even more preferably 500,000,000 W/ ^m² or less. The pulse width refers to the time during which light is irradiated in a pulse cycle. The frequency refers to the number of pulse cycles per second. The maximum instantaneous irradiance refers to the average irradiance during the time during which light is irradiated in a pulse cycle. The pulse cycle refers to the period during which light irradiation and pauses occur in pulse exposure.

The irradiation amount (exposure amount) is, for example, preferably 0.03 to 2.5 J/cm ² , and more preferably 0.05 to 1.0 J/cm ^2. The oxygen concentration during exposure can be selected appropriately. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19 vol% or less (e.g., 15 vol%, 5 vol%, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21 vol% (e.g., 22 vol%, 30 vol%, or 50 vol%). The exposure illuminance can be set appropriately and can usually be selected from the range of 1000 W/m ² to 100,000 W/m ² (e.g., 5,000 W/m ² , 15,000 W/m ² , or 35,000 W/m ² ). The oxygen concentration and exposure illuminance may be appropriately combined, for example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W/m ² , and an oxygen concentration of 35% by volume and an illuminance of 20,000 W/m ² .

Next, the unexposed portions of the resin composition layer are developed and removed to form a pattern (pixels). The unexposed portions of the resin composition layer can be developed and removed using a developer. This allows the unexposed portions of the resin composition layer in the exposure step to dissolve into the developer, leaving only the photocured portions. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. Additionally, to improve residue removal, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

Developers include organic solvents and alkaline developers, with alkaline developers being preferred. An alkaline aqueous solution (alkaline developer) prepared by diluting an alkaline agent with pure water is preferred. Examples of alkaline agents include organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxyamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo[5.4.0]-7-undecene, as well as inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate. Alkaline agents with a high molecular weight are preferred from an environmental and safety perspective. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. The developer may further contain a surfactant. Examples of surfactants include those described above, with nonionic surfactants being preferred. For ease of transportation and storage, the developer may be prepared as a concentrated solution and then diluted to the required concentration upon use. The dilution ratio is not particularly limited, but can be set, for example, in the range of 1.5 to 100 times. It is also preferable to wash (rinse) the developed layer with pure water. Rinsing is preferably performed by supplying a rinse solution to the developed resin composition layer while rotating the support on which the developed resin composition layer is formed. It is also preferable to move the nozzle ejecting the rinse solution from the center of the support to the periphery of the support. In this case, the nozzle movement speed may be gradually reduced as the nozzle moves from the center to the periphery of the support. Rinsing in this manner can suppress in-plane variations in the rinse. The same effect can also be obtained by gradually decreasing the rotation speed of the support while moving the nozzle from the center to the periphery of the support.

After development and drying, it is preferable to perform additional exposure or heating (post-baking). Additional exposure or post-baking is a post-development curing treatment to ensure complete curing. The heating temperature for post-baking is preferably 100 to 240°C, more preferably 200 to 240°C. The heating temperature for post-baking can also be 240 to 400°C, 250 to 350°C, or 300 to 350°C. The heating time for post-baking is preferably 5 minutes to 5 hours, more preferably 1 to 4 hours, and even more preferably 2 to 4 hours. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater to achieve the above conditions for the developed film. When additional exposure is performed, the light used for exposure is preferably light with a wavelength of 400 nm or less. The additional exposure process may be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

(Dry etching method)
Pattern formation by the dry etching method preferably includes the steps of forming a resin composition layer on a support using the resin composition of the present invention and curing the entire resin composition layer to form a cured layer, forming a photoresist layer on the cured layer, exposing the photoresist layer to light in a pattern and then developing it to form a resist pattern, and dry etching the cured layer using an etching gas as a mask. In forming the photoresist layer, it is preferable to further perform a pre-bake treatment. In particular, the photoresist layer formation process preferably includes a heat treatment after exposure and a heat treatment after development (post-bake treatment). For pattern formation by the dry etching method, the description in paragraphs 0010 to 0067 of JP 2013-064993 A can be referred to, and the contents thereof are incorporated herein by reference.

<Optical filter>
The optical filter of the present invention has the above-described film of the present invention. Examples of types of optical filters include color filters, near-infrared transmission filters, and near-infrared cut filters, with color filters being preferred. Color filters preferably have the film of the present invention as colored pixels of the color filter. The optical filter of the present invention can be used in solid-state imaging devices such as CCDs (charge-coupled devices) and CMOSs (complementary metal-oxide semiconductors), image display devices, and the like.

The film thickness of the film of the present invention in an optical filter can be adjusted appropriately depending on the purpose. The film thickness is preferably 5 μm or less, more preferably 1 μm or less, and even more preferably 0.6 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

The width of the pixels included in the optical filter is preferably 0.4 to 10.0 μm. The lower limit is preferably 0.4 μm or more, more preferably 0.5 μm or more, and even more preferably 0.6 μm or more. The upper limit is preferably 5.0 μm or less, more preferably 2.0 μm or less, even more preferably 1.0 μm or less, and even more preferably 0.8 μm or less. The Young's modulus of the pixels is preferably 0.5 to 20 GPa, and more preferably 2.5 to 15 GPa.

Each pixel included in the optical filter preferably has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and even more preferably 15 nm or less. While no lower limit is specified, it is preferably 0.1 nm or more, for example. The surface roughness of the pixel can be measured using, for example, a Veeco Dimension 3100 AFM (atomic force microscope). The water contact angle on the pixel can be set to any suitable value, but is typically in the range of 50 to 110°. The contact angle can be measured using, for example, a contact angle meter CV-DT Type A (Kyowa Interface Science Co., Ltd.). The pixel preferably has a high volume resistance. Specifically, the pixel's volume resistance is preferably 10 ⁹ Ω·cm or more, and more preferably 10 ¹¹ Ω·cm or more. While no upper limit is specified, it is preferably 10 ¹⁴ Ω·cm or less, for example. The volume resistance value of the pixel can be measured using an ultra-high resistance meter 5410 (manufactured by Advantest Corporation).

In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing a protective layer, various functions can be imparted, such as oxygen blocking, low reflectivity, hydrophilicity/hydrophobicity, and blocking of light of specific wavelengths (ultraviolet rays, near-infrared rays, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Methods for forming the protective layer include a method of applying a resin composition for forming a protective layer dissolved in an organic solvent, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive. Components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, polyol resins, polyvinylidene chloride resins, melamine resins, urethane resins, aramid resins, polyamide resins, alkyd resins, epoxy resins, modified silicone resins, fluorine resins, polycarbonate resins, polyacrylonitrile resins, cellulose resins, Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , and Si ₂ N ₄ , and the protective layer may contain two or more of these components. For example, in the case of a protective layer intended to block oxygen, the protective layer preferably contains a polyol resin, SiO ₂ , and Si ₂ N ₄ . In the case of a protective layer intended to reduce reflection, the protective layer preferably contains a (meth)acrylic resin and a fluorine resin.

When forming a protective layer by applying a resin composition for forming a protective layer, known methods such as spin coating, casting, screen printing, and inkjet printing can be used to apply the resin composition for forming a protective layer. Known organic solvents (e.g., propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used as the organic solvent contained in the resin composition for forming a protective layer. When forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical vapor deposition) can be used as the chemical vapor deposition method.

The protective layer may optionally contain additives such as organic or inorganic fine particles, absorbers for specific wavelengths of light (e.g., ultraviolet, near-infrared, etc.), refractive index adjusters, antioxidants, adhesives, and surfactants. Examples of organic or inorganic fine particles include polymeric fine particles (e.g., silicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silica, calcium carbonate, and barium sulfate. Known absorbers for specific wavelengths of light can be used. The content of these additives can be adjusted as needed, but is preferably 0.1 to 70% by weight, and more preferably 1 to 60% by weight, of the total weight of the protective layer. The protective layer may also be the protective layer described in paragraphs 0073 to 0092 of JP 2017-151176 A.

The optical filter may have a structure in which each pixel is embedded in a space partitioned by partitions, for example, in a grid pattern. The resin composition of the present invention can also be suitably used for the pixel configuration described in WO 2019/102887.

<Solid-state imaging element>
The solid-state imaging device of the present invention has the above-described film of the present invention. The configuration of the solid-state imaging device of the present invention is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device, but examples thereof include the following configurations.

The device has a substrate on which multiple photodiodes constituting the light-receiving area of a solid-state imaging device (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide semiconductor) image sensor) and transfer electrodes made of polysilicon or the like; a light-shielding film on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed; a device protective film made of silicon nitride or the like formed on the light-shielding film to cover the entire light-shielding film and the light-receiving portions of the photodiodes; and a color filter on the device protective film. Furthermore, the device protective film may have a light-focusing means (e.g., a microlens, etc.; the same applies below) on the device protective film below the color filter (closer to the substrate), or a light-focusing means on the color filter. The color filter may also have a structure in which each colored pixel is embedded in a space partitioned by partitions, for example, in a grid pattern. In this case, it is preferable that the partitions have a lower refractive index than the colored pixels. Examples of imaging devices having such a structure include those described in JP 2012-227478 A, JP 2014-179577 A, WO 2018/043654 A, and U.S. Patent Application Publication No. 2018/0040656 A. Furthermore, as in JP 2019-211559 A, an ultraviolet absorbing layer may be provided within the structure of the solid-state imaging element to improve light resistance. Imaging devices equipped with the solid-state imaging element of the present invention can be used for digital cameras, electronic devices with imaging functions (such as mobile phones), as well as in-vehicle cameras and surveillance cameras. Furthermore, solid-state imaging elements incorporating the color filter of the present invention may incorporate, in addition to the color filter of the present invention, other color filters, near-infrared cut filters, organic photoelectric conversion films, and the like.

<Image display device>
The image display device of the present invention has the above-described film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescence display devices. Definitions of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology."

The present invention will be explained in more detail below with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be modified as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

<Method for measuring weight average molecular weight (Mw)>
The weight average molecular weight of the sample was measured by gel permeation chromatography (GPC) under the following conditions.
Column type: TOSOH TSKgel Super HZM-H, TOSOH TSKgel Super HZ4000, and TOSOH TSKgel Super HZ2000 connected together. Developing solvent: tetrahydrofuran. Column temperature: 40°C.
Flow rate (sample injection amount): 1.0 μL (sample concentration: 0.1% by mass)
Device name: Tosoh HLC-8220GPC
Detector: RI (refractive index) detector Calibration curve Base resin: Polystyrene resin

<Method for measuring acid value>
The acid value of the sample was measured as follows: The sample was dissolved in a mixed solvent of tetrahydrofuran and water at a mass ratio of 9:1, and the resulting solution was neutralized with a 0.1 mol/L aqueous potassium hydroxide solution at 25°C using a potentiometric titrator (product name: AT-510, manufactured by Kyoto Electronics Manufacturing Co., Ltd.). The inflection point on the titration pH curve was used as the titration endpoint, and the acid value was calculated according to the following formula.
A=56.11×Vs×0.5×f/w
A: Acid value (mgKOH/g)
Vs: Amount (mL) of 0.1 mol/L potassium hydroxide aqueous solution required for titration
f: Titer of 0.1 mol/L potassium hydroxide aqueous solution w: Mass of sample (g) (solid content equivalent)

<Method for measuring amine value>
The amine value of the sample was measured as follows: The sample was dissolved in acetic acid, and the resulting solution was neutralized with a 0.1 mol/L perchloric acid/acetic acid solution at 25°C using a potentiometric titrator (product name: AT-510, manufactured by Kyoto Electronics Manufacturing Co., Ltd.). The inflection point of the titration pH curve was used as the titration endpoint, and the amine value was calculated using the following formula.
B=56.11×Vs×0.1×f/w
B: Amine value (mg KOH/g)
Vs: Amount (mL) of 0.1 mol/L perchloric acid/acetic acid solution required for titration
f: Titer of 0.1 mol/L perchloric acid/acetic acid solution w: Mass of sample (g) (solid content equivalent)

<Method of synthesizing resin>
Synthesis Example 1 Synthesis of Resin B-1 100.1 g of methyl methacrylate and 128.2 g of butyl acrylate were added to a nitrogen-purged three-neck flask and diluted with 350 g of propylene glycol monomethyl ether acetate. This was heated to 75°C under a nitrogen atmosphere. Next, 20.9 g of mercaptoethanol and 2.0 g of a polymerization initiator (V-601, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) were added, and the mixture was heated and stirred at 75°C under a nitrogen atmosphere for 8 hours to obtain a solution of a hydroxy-terminated polymer having the following structure. The weight-average molecular weight of the resulting hydroxy-terminated polymer was 2,300.

Next, the obtained solution of the hydroxy-terminated polymer was cooled to 5°C, 32.1 g of trimellitic anhydride chloride was added, and 15.3 g of pyridine was added dropwise over 6 hours. The mixture was further stirred at room temperature for 24 hours, and insoluble matter was removed by filtration to obtain a solution of a macromonomer having an acid anhydride structure at its terminal, as shown below. The weight-average molecular weight of the obtained macromonomer having an acid anhydride structure at its terminal was 2,500.

Next, the resulting solution of macromonomer having an acid anhydride structure at its end was heated to 50°C, and 7.1 g of polyethyleneimine (Epomin SP-003, manufactured by Nippon Shokubai Co., Ltd.) was added. The mixture was then heated and stirred at 50°C for an additional 5 hours. 280 g of propylene glycol monomethyl ether acetate was added to adjust the solids concentration, yielding a propylene glycol monomethyl ether acetate solution with a solids concentration of 30% by mass of resin B-1, which has the following structure. The resulting resin B-1 had a weight average molecular weight of 6,600, an acid value of 21 mg KOH/g, and an amine value of 33 mg KOH/g.

(Synthesis Examples 2 to 35) Synthesis of Resins B-2 to B-35 Resins B-2 to B-35 were synthesized in the same manner as for Resin B-1.

The structures, weight-average molecular weights (Mw), acid values, and amine values of Resins B-1 to B-35 are shown below. The numbers attached to the main chain indicate molar ratios. In addition, in Polym, the numbers attached to the repeating units indicate the number of repeating units.

<Preparation of Dispersion>
A mixture of the raw materials listed in the table below was mixed and dispersed for 3 hours using a bead mill (using zirconia beads with a diameter of 0.3 mm), and then further dispersed using a high-pressure disperser equipped with a pressure reducing mechanism, NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.), at a pressure of 2000 MPa and a flow rate of 500 g/min. This dispersion process was repeated 10 times to obtain each dispersion.

The units of the values indicating the blending amounts of each raw material listed in the above table are parts by mass. Details of the raw materials listed in the above table, indicated by abbreviations, are as follows:
[Colorant]
PR122: C.I. Pigment Red 122 (red pigment, quinacridone pigment)
PR179: C.I. Pigment Red 179 (red pigment, perylene pigment)
PR254: C.I. Pigment Red 254 (red pigment, diketopyrrolopyrrole pigment)
PR264: C.I. Pigment Red 264 (red pigment, diketopyrrolopyrrole pigment)
PR291: C.I. Pigment Red 291 (red pigment, diketopyrrolopyrrole pigment)
PO71: C.I. Pigment Orange 71 (orange pigment, diketopyrrolopyrrole pigment)
PB15:6: C.I. Pigment Blue 15:6 (blue pigment, phthalocyanine pigment)
PB16: C.I. Pigment Blue 16 (blue pigment, phthalocyanine pigment)
PG7: C.I. Pigment Green 7 (green pigment, phthalocyanine pigment)
PG36: C.I. Pigment Green 36 (green pigment, phthalocyanine pigment)
PG58: C.I. Pigment Green 58 (green pigment, phthalocyanine pigment)
PY185: C.I. Pigment Yellow 185 (yellow pigment, isoindoline pigment)
PY215: C.I. Pigment Yellow 215 (yellow pigment, pteridine pigment)
PV23: C.I. Pigment Violet 23 (purple pigment, dioxazine pigment)
IR dye: a compound having the following structure (near-infrared absorbing pigment, in the structural formula, Me represents a methyl group and Ph represents a phenyl group)
IRGAPHORE: Irgaphor Black S 0100 CF (manufactured by BASF, compound having the following structure, lactam pigment)
PBk32: C.I. Pigment Black 32 (compound having the following structure, perylene pigment)

[Pigment Derivatives]
Derivative 1: Compound having the following structure
Derivative 2: Compound having the following structure
Derivative 3: Compound having the following structure

[Resin (dispersant)]
(Specific resin)
B-1 to B-32: The above-mentioned resins

(Comparative resin)
cB-1: Resin having the following structure (weight average molecular weight of 10,885, acid value of 74 mgKOH/g. The description "Polym" indicates that a polymer chain having a structure in which repeating units of the structure shown in "Polym" are bonded in the number indicated by the subscript is bonded to a sulfur atom (S).)

〔solvent〕
S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclohexanone

<Production of Resin Composition>
The resin compositions of the examples and comparative examples were prepared by mixing the raw materials shown in the table below.

Details of the ingredients listed in the table above, indicated by abbreviations, are as follows:

[Dispersion]
Dispersions R1 to R14, B1 to B14, G1 to G14, I1 to I7, Bk1 to Bk21, CR1, CR2, CB1, CB2, CG1, CG2, CI1, CI2, CBk1 to CBk4: the above-mentioned dispersions

〔resin〕
Ba-1: Resin having the following structure (the number attached to the main chain is the molar ratio. Weight-average molecular weight: 11,000)
Ba-2: Resin having the following structure (the number attached to the main chain is the molar ratio. Weight-average molecular weight: 15,000)
Ba-3: Resin having the following structure (the numbers attached to the main chain are molar ratios. The total value of x, y, and z is 50. Mw=15,000)
Bb-1: Resin having the following structure (the number attached to the main chain is the molar ratio; weight-average molecular weight: 13,000)
Bb-2: Resin cB-1 described above
B-1, B-6, B-11, B-14, B-24, B-26, B-29, B-30: Resins B-1, B-6, B-11, B-14, B-24, B-26, B-29, B-30 having the above-described structures

[Polymerizable Monomer]
D-1: Acrylate compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate)
D-2: Epoxy compound (TETRAD-X, manufactured by Mitsubishi Gas Chemical Company, Inc., N,N,N',N'-tetraglycidyl-m-xylylenediamine)
D-3: Oxetane compound (OXT-221, manufactured by Toagosei Co., Ltd., 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane)
D-4: Oxetane compound (OX-SQ TX-100, manufactured by Toagosei Co., Ltd.)

[Photopolymerization initiator]
E-1: Omnirad 379EG (manufactured by IGM Resins B.V., 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one)
E-2: Irgacure OXE01 (manufactured by BASF, oxime compound)
E-3: Compound of the following structure

〔solvent〕
S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclohexanone

<Evaluation>
[Evaluation of Dispersibility]
(Storage stability)
The viscosity (mPa s) of the resin compositions of each example and comparative example was measured using an "RE-85L" manufactured by Toki Sangyo Co., Ltd. After the above measurement, the resin composition was allowed to stand at 45°C, shielded from light, for 3 days, and the viscosity (mPa s) was measured again. The storage stability was evaluated based on the difference in viscosity (ΔVis) before and after the above standing, according to the following evaluation criteria. The smaller the viscosity difference (ΔVis), the better the storage stability of the resin composition and the better the pigment dispersibility. All of the above viscosity measurements were carried out in a laboratory where the temperature and humidity were controlled to 22±5°C and 60±20%, with the temperature of the resin composition adjusted to 25°C.

-Evaluation criteria-
A: ΔVis was 0.5 mPa·s or less.
B: ΔVis was more than 0.5 mPa·s and 1.0 mPa·s or less.
C: ΔVis was more than 1.0 mPa·s and 2.0 mPa·s or less.
D: ΔVis was more than 2.0 mPa·s and 2.5 mPa·s or less.
E: ΔVis exceeded 2.5 mPa·s.

(Particle diameter)
Using a dynamic light scattering particle size distribution analyzer (LB-500, manufactured by Horiba, Ltd.) conforming to JIS 8826:2005, the resin composition obtained above was dispensed into a 20 ml sample bottle and diluted with propylene glycol monomethyl ether acetate to a solids concentration of 0.2 mass%. Using a 2 ml quartz measuring cell at 25°C, data for the diluted solution was collected 50 times, and the resulting arithmetic mean particle size (number average particle size) of the pigment on a number basis was determined. The smaller the value of the number average particle size of the pigment, the better the dispersibility of the pigment.
-Evaluation criteria-
A: The number average particle size of the pigment was 0.05 μm or less.
B: The number average particle size of the pigment was more than 0.05 μm and 0.10 μm or less.
C: The number average particle size of the pigment was more than 0.10 μm and 0.20 μm or less.
D: The number average particle size of the pigment was more than 0.20 μm and 0.50 μm or less.
E: The number average particle size of the pigment exceeded 0.50 μm.

[Evaluation of film shrinkage rate]
The resin composition of each example and comparative example was spin-coated onto a glass substrate, dried (pre-baked) at 100°C for 120 seconds using a hot plate, and then heated (post-baked) at 200°C for 30 minutes using an oven to produce a film with a thickness of 0.60 μm. The film thickness was measured by scraping off a portion of the film to expose the glass substrate surface, and the step between the glass substrate surface and the coating film (coating film thickness) was measured using a stylus-type step height gauge (DektakXT, manufactured by BRUKER). The resulting film was then heat-treated at 300°C for 5 hours in a nitrogen atmosphere. The film thickness after heat treatment was measured in the same manner, and the film shrinkage rate was calculated using the following formula and evaluated according to the following evaluation criteria. _T0 and _T1 below were both measured in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, with the substrate temperature adjusted to 25°C. The smaller the film shrinkage rate, the more suppressed the film shrinkage, which can be said to be a preferable result.
Membrane shrinkage rate (%) = (1-(T ₁ /T ₀ )) x 100
T ₀ : Film thickness immediately after production (=0.60 μm)
T ₁ : Film thickness after heat treatment at 300° C. for 5 hours in a nitrogen atmosphere - Evaluation criteria -
A: The membrane shrinkage rate was 1% or less.
B: The membrane shrinkage rate was more than 1% and 5% or less.
C: The membrane shrinkage rate was more than 5% and 10% or less.
D: The membrane shrinkage rate was more than 10% and 30% or less.
E: The film shrinkage rate exceeded 30%.

[Crack evaluation]
The resin compositions of each example and comparative example were spin-coated onto a glass substrate, dried (pre-baked) at 100°C for 120 seconds using a hot plate, and then heated (post-baked) at 200°C for 30 minutes using an oven to produce a 0.60 μm thick film. Next, 200 nm of _SiO2 was deposited on the surface of the obtained film by sputtering to form an inorganic film. The film with this inorganic film formed on its surface was heat-treated at 300°C for 5 hours in a nitrogen atmosphere. The surface of the inorganic film after heat treatment was observed with an optical microscope, and the number of cracks per 1 ^cm2 was counted and evaluated for the presence or absence of cracks according to the following evaluation criteria.
-Evaluation criteria-
A: The number of cracks per 1 ^cm2 was 0.
B: The number of cracks per 1 ^cm2 was 1 to 10.
C: The number of cracks per 1 ^cm2 was 11 to 50.
D: The number of cracks per 1 ^cm2 was 51 to 100.
E: The number of cracks per 1 ^cm2 was 101 or more.

[Method for evaluating precipitation defects]
The resin composition of each example and comparative example was spin-coated onto a silicon wafer and dried (pre-baked) at 100 ° C for 120 seconds using a hot plate to produce a film with a thickness of 0.60 μm. For the silicon wafer on which this film was formed, the number of foreign particles (number of foreign particles 1) with a size of 1.0 μm or more present in the film was counted using a defect evaluation device (ComPLUS, manufactured by AMAT). Next, the silicon wafer on which this film was formed was heated at 250 ° C for 10 minutes, and then the number of foreign particles (number of foreign particles 2) with a size of 1.0 μm or more present in the film was counted, and the foreign particle increase rate was calculated using the following formula, and the degree of precipitation of defects (precipitation defects) was evaluated according to the following criteria. Criterion C or higher is practically desirable.
The foreign matter increase rate was calculated as follows: (number of foreign matters: 2/number of foreign matters: 1).
A: Foreign matter increase rate <1.1
B: 1.1≦foreign matter increase rate<1.3
C: 1.3≦foreign matter increase rate<1.5
D: 1.5≦foreign matter increase rate<3.0
E: 3.0≦Foreign matter increase rate

When the resin compositions of the Examples were used, they were evaluated as having superior storage stability and particle size, and had excellent pigment dispersibility, compared to the resin compositions of the Comparative Examples. Furthermore, when the resin compositions of the Examples were used, they were evaluated as having lower film shrinkage rates and suppressed the occurrence of cracks and deposition defects, compared to the resin compositions of the Comparative Examples. Therefore, it can be said that the resin compositions of the Examples can expand the process window in the post-film production process, compared to the resin compositions of the Comparative Examples.

(Example 1000: Pattern formation by photolithography)
The resin composition of Example 1 was applied by spin coating onto a silicon wafer, dried (pre-baked) at 100 ° C. for 120 seconds using a hot plate, and then heated (post-baked) at 200 ° C. for 30 minutes using an oven to form a 0.60 μm thick resin composition layer. Next, this resin composition layer was exposed to light with a wavelength of 365 nm using an i-line stepper exposure system FPA-3000i5 + (manufactured by Canon Corporation) through a mask pattern in which square unmasked portions with sides of 1.1 μm were arranged in a 4 mm x 3 mm area. The exposure was performed at an exposure dose of 500 mJ / cm ^2. Next, the silicon wafer on which the exposed resin composition layer was formed was placed on the horizontal rotary table of a spin shower developer (DW-30 type, manufactured by Chemitronics Corporation), and paddle development was performed for 60 seconds at 23 ° C. using a developer (CD-2000, manufactured by FUJIFILM Electronic Materials Co., Ltd.). Next, while rotating the silicon wafer at a rotation speed of 50 rpm, pure water was supplied in the form of a shower from a jet nozzle above the center of rotation to perform a rinse treatment, and then the wafer was spray-dried to form a pattern (pixel).

The pixelated silicon wafer was divided into two, and one half was heat-treated at 300°C for five hours in a nitrogen atmosphere (hereafter, one half will be referred to as the substrate before 300°C heat treatment, and the other half as the substrate after 300°C heat treatment). When the cross sections of the pixels formed on the substrate before 300°C heat treatment and the substrate after 300°C heat treatment were evaluated using a scanning electron microscope (SEM), the height (thickness) of the pixels formed on the substrate after 300°C heat treatment was 96% of the height (thickness) of the pixels formed on the substrate before 300°C heat treatment.

Claims (15)

a color material A containing a pigment;
Resin B,
a solvent C;
The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal,
a resin composition , wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) ;
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent.
L1 represents a single bond or a divalent linking group ^;
L2 ^and L3 each independently represent a divalent linking group ^;
L4 represents a single bond or a divalent linking group ^;
X ^b11 represents an (n+2)-valent linking group;
X ^b12 represents O or NR ^x11 ;
R ^x11 represents a hydrogen atom or a substituent;
L ^b11 represents a divalent linking group containing a sulfur atom;
P ^b11 represents a polymer chain;
R ^b11 represents a hydrogen atom, a substituent, or a counter ion;
n represents an integer of 1 or more. a color material A containing a pigment;
Resin B,
a solvent C;
The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal,
a resin composition , wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) ;
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent.
L1 represents a single bond or a divalent linking group ^;
L2 ^and L3 each independently represent a divalent linking group ^;
L4 represents a single bond or a divalent linking group ^;
X ^b11 represents an (n+2)-valent linking group;
X ^b12 represents O or NR ^x11 ;
R ^x11 represents a hydrogen atom or a substituent;
L ^b11 represents a single bond or a divalent linking group;
P ^b11 represents a polymer chain containing at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group;
R ^b11 represents a hydrogen atom, a substituent, or a counter ion;
n represents an integer of 1 or more. a color material A containing a pigment;
Resin B,
a solvent C;
The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal,
a resin composition , wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) ;
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent.
L1 represents a single bond or a divalent linking group ^;
L2 ^and L3 each independently represent a divalent linking group ^;
L4 represents a single bond or a divalent linking group ^;
X ^b11 represents an (n+2)-valent linking group;
X ^b12 represents O or NR ^x11 ;
R ^x11 represents a hydrogen atom or a substituent;
L ^b11 represents a single bond or a divalent linking group;
P ^b11 represents a polymer chain containing a repeating unit of a polyether structure;
R ^b11 represents a hydrogen atom, a substituent, or a counter ion;
n represents an integer of 1 or more. The polymer chain represented by P ^b11 of formula (1-1), the polymer chain represented by P ^b11 of formula (1-2), and the polymer chain represented by P ^b11 of formula (1-3) are polymer chains containing a repeating unit of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure. The resin composition according to claim 1 or 2 . The resin B1 contains a repeating unit represented by the formula (1-1), and the content of the repeating unit represented by the formula (1-1) in the resin B1 is 30 mol% or more,
The resin B1 contains a repeating unit represented by the formula (1-2), and the content of the repeating unit represented by the formula (1-2) in the resin B1 is 30 mol% or more, or
The resin B1 contains a repeating unit represented by the formula (1-3), and the content of the repeating unit represented by the formula (1-3) in the resin B1 is 30 mol% or more.
The resin composition according to any one of claims 1 to 4 . 6. The resin composition according to claim 1 , wherein the colorant A contains at least one pigment selected from the group consisting of a diketopyrrolopyrrole pigment and a phthalocyanine pigment. The resin composition according to any one of claims 1 to 6 , further comprising a polymerizable monomer. The resin composition according to any one of claims 1 to 7 , further comprising a photopolymerization initiator. A film obtained by using the resin composition according to any one of claims 1 to 8 . An optical filter comprising the film according to claim 9 . A solid-state imaging device comprising the film according to claim 9 . An image display device comprising the film according to claim 9 . A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3);
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent.
^L1 represents a single bond or a divalent linking group;
^L2 and ^L3 each independently represent a divalent linking group;
^L4 represents a single bond or a divalent linking group;
X ^b11 represents an (n+2)-valent linking group; X ^b12 represents O or NR ^x11 ;
R ^x11 represents a hydrogen atom or a substituent;
L ^b11 represents a divalent linking group containing a sulfur atom ;
P ^b11 represents a polymer chain;
R ^b11 represents a hydrogen atom, a substituent, or a counter ion;
n represents an integer of 1 or more. A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3);
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent.
^L1 represents a single bond or a divalent linking group;
^L2 and ^L3 each independently represent a divalent linking group;
^L4 represents a single bond or a divalent linking group;
X ^b11 represents an (n+2)-valent linking group; X ^b12 represents O or NR ^x11 ;
R ^x11 represents a hydrogen atom or a substituent;
L ^b11 represents a single bond or a divalent linking group;
P ^b11 represents a polymer chain containing at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group ;
R ^b11 represents a hydrogen atom, a substituent, or a counter ion;
n represents an integer of 1 or more. A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3);
In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent.
^L1 represents a single bond or a divalent linking group;
^L2 and ^L3 each independently represent a divalent linking group;
^L4 represents a single bond or a divalent linking group;
X ^b11 represents an (n+2)-valent linking group; X ^b12 represents O or NR ^x11 ;
R ^x11 represents a hydrogen atom or a substituent;
L ^b11 represents a single bond or a divalent linking group;
P ^b11 represents a polymer chain containing a repeating unit of a polyether structure ;
R ^b11 represents a hydrogen atom, a substituent, or a counter ion;
n represents an integer of 1 or more.