JP7823827B2 - Method for recovering solder containing Sn - Google Patents
Method for recovering solder containing SnInfo
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- JP7823827B2 JP7823827B2 JP2022006969A JP2022006969A JP7823827B2 JP 7823827 B2 JP7823827 B2 JP 7823827B2 JP 2022006969 A JP2022006969 A JP 2022006969A JP 2022006969 A JP2022006969 A JP 2022006969A JP 7823827 B2 JP7823827 B2 JP 7823827B2
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
本発明は、Ｓｎを含むはんだの回収方法に関し、特に、Ｓｎを含むはんだにより電子部品などの部品がはんだ付けされた電子基板などの基板からＳｎを含むはんだを回収する方法に関する。 The present invention relates to a method for recovering solder containing Sn, and in particular to a method for recovering solder containing Sn from substrates such as electronic boards to which electronic components and other parts have been soldered with solder containing Sn.
従来、電子部品が基板上に搭載された電子基板では、電子部品がはんだにより基板上に固定されており、電子部品の固定に使用するはんだとして、近年、人体や環境などへの負荷を考慮して、従来の（Ｐｂ－Ｓｎ系合金などからなる共晶はんだなどの）鉛を含むはんだから（鉛を含まない）鉛フリーはんだへの移行がなされている。 Traditionally, electronic components mounted on electronic boards have been secured to the board with solder. In recent years, there has been a shift from conventional lead-containing solder (such as eutectic solder made from Pb-Sn alloys) to lead-free solder (which does not contain lead) to reduce the burden on the human body and the environment.
このような鉛フリーはんだとして、Ｓｎ－Ａｇ－Ｃｕ系、Ｓｎ－Ｚｎ－Ｂｉ系、Ｓｎ－Ｃｕ系、Ｓｎ－Ａｇ－Ｉｎ－Ｂｉ系、Ｓｎ－Ｚｎ－Ａｌ系などの鉛フリーはんだがあり、電子基板中のＳｎ含有量が増加する傾向にある。 Such lead-free solders include Sn-Ag-Cu, Sn-Zn-Bi, Sn-Cu, Sn-Ag-In-Bi, and Sn-Zn-Al systems, and the Sn content in electronic substrates is tending to increase.
そのため、廃電子基板から貴金属などの種々の金属を効率的に回収するために、廃電子基板を銅精錬炉などの精錬炉で処理する前に、予めＳｎを含むはんだを回収することが望まれており、廃電子基板からはんだを回収する方法として、溶剤を用いて廃電子基板からはんだを化学的に溶解させる方法（例えば、特許文献１照）が知られている。 Therefore, in order to efficiently recover various metals, such as precious metals, from waste electronic substrates, it is desirable to recover solder containing Sn before processing the waste electronic substrates in a refining furnace such as a copper refining furnace.One known method for recovering solder from waste electronic substrates is to chemically dissolve the solder from the waste electronic substrates using a solvent (see, for example, Patent Document 1).
しかし、特許文献１の方法によりはんだを回収すると、溶剤を用いてはんだを化学的に溶解させるために長時間を要し、また、廃液処理などにより回収コストが増大して、効率的にはんだを回収することができない。また、溶剤で浸出中にはんだのＳｎ相の表面に酸化物が形成され、浸出率が低下して、はんだの回収率が低下する。 However, when recovering solder using the method described in Patent Document 1, it takes a long time to chemically dissolve the solder using a solvent, and recovery costs increase due to waste liquid treatment, making it impossible to recover the solder efficiently. Furthermore, oxides form on the surface of the Sn phase of the solder during leaching with the solvent, reducing the leaching rate and the solder recovery rate.
したがって、本発明は、このような従来の問題点に鑑み、Ｓｎを含むはんだにより部品がはんだ付けされた基板からＳｎを含むはんだを安価に且つ効率的に回収することができる、Ｓｎを含むはんだの回収方法を提供することを目的とする。 Therefore, in consideration of these conventional problems, the present invention aims to provide a method for recovering solder containing Sn that can inexpensively and efficiently recover solder containing Sn from a substrate to which components have been soldered using solder containing Sn.
本発明者らは、上記課題を解決するために鋭意研究した結果、Ｓｎを含むはんだにより部品がはんだ付けされた基板から部品を除去した後、基板をＰｂ－Ｓｎ合金の溶湯に浸漬することにより、Ｓｎを含むはんだをＰｂ－Ｓｎ合金の溶湯中に回収すれば、Ｓｎを含むはんだにより部品がはんだ付けされた基板からＳｎを含むはんだを安価に且つ効率的に回収することができることを見出し、本発明を完成するに至った。 As a result of extensive research to solve the above-mentioned problems, the inventors discovered that Sn-containing solder can be recovered inexpensively and efficiently from a substrate to which components have been soldered using Sn-containing solder by removing the components from the substrate and then immersing the substrate in molten Pb-Sn alloy, thereby recovering the Sn-containing solder in the molten Pb-Sn alloy, which led to the completion of the present invention.
すなわち、本発明によるＳｎを含むはんだの回収方法は、Ｓｎを含むはんだにより部品がはんだ付けされた基板から部品を除去した後、基板をＰｂ－Ｓｎ合金の溶湯に浸漬することにより、Ｓｎを含むはんだをＰｂ－Ｓｎ合金の溶湯中に回収することを特徴とする。 In other words, the method for recovering Sn-containing solder according to the present invention involves removing components from a substrate to which the components have been soldered using Sn-containing solder, and then immersing the substrate in molten Pb-Sn alloy, thereby recovering the Sn-containing solder in the molten Pb-Sn alloy.
このＳｎを含むはんだの回収方法において、Ｐｂ－Ｓｎ合金中のＰｂとＳｎの含有量（質量％）の比がＰｂ：Ｓｎ＝１０～９０：９０～１０であるのが好ましく、Ｐｂ－Ｓｎ合金の溶湯の温度が１９０～３２０℃であるのが好ましい。 In this method for recovering solder containing Sn, the ratio of Pb to Sn content (mass%) in the Pb-Sn alloy is preferably Pb:Sn = 10-90:90-10, and the temperature of the molten Pb-Sn alloy is preferably 190-320°C.
本発明によれば、Ｓｎを含むはんだにより部品がはんだ付けされた基板からＳｎを含むはんだを安価に且つ効率的に回収することができる。 According to the present invention, Sn-containing solder can be recovered inexpensively and efficiently from substrates to which components have been soldered using Sn-containing solder.
本発明によるＳｎを含むはんだの回収方法の実施の形態では、Ｓｎを含むはんだにより部品がはんだ付けされた基板から部品を除去した後、基板をＰｂ－Ｓｎ合金の溶湯に浸漬することにより、Ｓｎを含むはんだをＰｂ－Ｓｎ合金の溶湯中に回収する。このように基板をＰｂ－Ｓｎ合金の溶湯に浸漬することにより、基板中のＳｎがＰｂ－Ｓｎ合金として溶湯中に短時間で吸収され、Ｓｎを含むはんだの回収率を飛躍的に向上させることができる。 In an embodiment of the method for recovering Sn-containing solder according to the present invention, after components soldered with Sn-containing solder are removed from a substrate, the substrate is immersed in molten Pb-Sn alloy, thereby recovering the Sn-containing solder in the molten Pb-Sn alloy. By immersing the substrate in molten Pb-Sn alloy in this manner, the Sn in the substrate is quickly absorbed into the molten Pb-Sn alloy, dramatically improving the recovery rate of Sn-containing solder.
このＳｎを含むはんだの回収方法において、Ｐｂ－Ｓｎ合金中のＰｂとＳｎの含有量（質量％）の比は、Ｐｂ：Ｓｎ＝１０～９０：９０～１０であるのが好ましく、Ｐｂ：Ｓｎ＝３０～７０：７０～３０であるのがさらに好ましく、Ｐｂ：Ｓｎ＝４０～６０：６０～４０であるのが最も好ましい。また、Ｐｂ－Ｓｎ合金の溶湯の温度は、１９０～３２０℃であるのが好ましく、２００～３００℃であるのがさらに好ましく、２３０～２７０℃であるのが最も好ましい。このような低温の溶湯を使用することができるため、メタルポンプを使用することもできる。なお、Ｐｂ－Ｓｎ合金の溶湯に代えて、Ｐｂ溶湯（Ｐｂを１００質量％含む溶湯）を使用することも理論的には可能であるが、基板がガラスエポキシ基板である場合には、Ｐｂの融点で熱分解反応が起こり、大気雰囲気中では燃焼することもあるため、Ｐｂ溶湯を使用するのは好ましくない。 In this method for recovering solder containing Sn, the ratio of Pb to Sn (by mass) in the Pb-Sn alloy is preferably 10-90:90-10, more preferably 30-70:70-30, and most preferably 40-60:60-40. Furthermore, the temperature of the molten Pb-Sn alloy is preferably 190-320°C, more preferably 200-300°C, and most preferably 230-270°C. Because such low-temperature molten metal can be used, a metal pump can also be used. While it is theoretically possible to use molten Pb (containing 100% Pb by mass) instead of molten Pb-Sn alloy, using molten Pb is not recommended when the substrate is a glass epoxy board, as this can cause thermal decomposition at the melting point of Pb and may result in combustion in the atmosphere.
Ｐｂ－Ｓｎ合金の溶湯への浸漬は、Ｐｂ－Ｓｎ合金を黒鉛坩堝に入れて１９０～３２０℃に加熱して得られた溶湯中に、基板を入れた（ステンレス網などの）かごを１０～６０分間、好ましくは１５～３０分間浸漬する操作を繰り返すことによって行うことができる。この浸漬後のＰｂ－Ｓｎ合金の溶湯は、鉛精錬の原料として使用することができる。また、この浸漬後のＰｂ－Ｓｎ合金の溶湯を循環して浸漬に使用することによりＳｎ含有量を増大させた後に、Ｓｎを回収して精製することもできる。 Immersion in molten Pb-Sn alloy can be achieved by repeatedly immersing a basket (such as a stainless steel mesh basket) containing a substrate in the molten Pb-Sn alloy, which is placed in a graphite crucible and heated to 190-320°C, for 10-60 minutes, preferably 15-30 minutes. The molten Pb-Sn alloy after this immersion can be used as a raw material for lead refining. Alternatively, the molten Pb-Sn alloy after this immersion can be circulated and used again for immersion to increase the Sn content, after which the Sn can be recovered and refined.
また、上記のＳｎを含むはんだの回収方法において、基板から部品を除去した後、基板をＰｂ－Ｓｎ合金の溶湯に浸漬する前に、基板を加熱して振動させるのが好ましい。この加熱の温度が２５０～３００℃であるのが好ましく、振動を３０～１００Ｈｚで行うのが好ましい。また、基板のはんだ付けされた面が、水平方向に延び且つ鉛直方向の下向きになるときの基板の傾きの角度を０°とし、鉛直方向に延びるときの基板の角度を９０°とすると、基板を加熱して振動させる際に、基板を０～９０°の角度になるように配置するのが好ましい。 In addition, in the above-mentioned method for recovering solder containing Sn, after removing the components from the substrate, the substrate is preferably heated and vibrated before being immersed in molten Pb-Sn alloy. The heating temperature is preferably 250 to 300°C, and the vibration is preferably performed at 30 to 100 Hz. Furthermore, if the angle of inclination of the substrate when the soldered surface of the substrate extends horizontally and faces downward vertically is defined as 0°, and the angle of the substrate when the surface extends vertically is defined as 90°, then when the substrate is heated and vibrated, it is preferable to position the substrate so that it is at an angle of 0 to 90°.
以下、本発明によるＳｎを含むはんだの回収方法の実施例について詳細に説明する。 Below, we will explain in detail an example of the method for recovering solder containing Sn according to the present invention.
［実施例１］
まず、Ｓｎを含むはんだにより電子部品がはんだ付けされたガラスエポキシ基板を用意し、この基板から電子部品を除去した。この電子部品を除去したガラスエポキシ基板について、重量を測定し、蛍光Ｘ線分析により組成分析したところ、重量は４０４．０３ｇであり、８６ｇ（２１質量％）のＳｎと８１ｇ（２０質量％）のＣｕを含有していた。
[Example 1]
First, a glass epoxy substrate with electronic components soldered with solder containing Sn was prepared, and the electronic components were removed from the substrate. The weight of the glass epoxy substrate from which the electronic components had been removed was measured, and composition analysis by X-ray fluorescence analysis revealed that the weight was 404.03 g and contained 86 g (21 mass%) of Sn and 81 g (20 mass%) of Cu.
また、Ｐｂ－Ｓｎ合金を用意し、その重量を測定し、蛍光Ｘ線分析により組成分析したところ、重量は２６３０ｇであり、１３１１ｇ（４９．８４質量％）のＳｎと１２８２ｇ（４８．７４５質量％）のＰｂを含有していた。 A Pb-Sn alloy was also prepared, its weight measured, and its composition analyzed using X-ray fluorescence analysis. The weight was found to be 2,630 g, containing 1,311 g (49.84% by mass) of Sn and 1,282 g (48.745% by mass) of Pb.
このＰｂ－Ｓｎ合金を黒鉛坩堝に入れて２５０℃に加熱して得られた溶湯中に、上記の電子部品を除去したガラスエポキシ基板を入れたステンレス網のかごを２０分間浸漬した。 This Pb-Sn alloy was placed in a graphite crucible and heated to 250°C. The resulting molten metal was immersed for 20 minutes in a stainless steel mesh basket containing the glass epoxy substrate from which the electronic components had been removed.
この浸漬後のＰｂ－Ｓｎ合金について、重量を測定し、蛍光Ｘ線分析により組成分析したところ、重量は２５３０ｇであり、１３９７ｇ（５５．２０質量％）のＳｎと６ｇ（０．２５質量％）のＣｕを含有していた。 After immersion, the Pb-Sn alloy was weighed and its composition analyzed using X-ray fluorescence analysis. The weight was found to be 2,530 g, and it contained 1,397 g (55.20% by mass) of Sn and 6 g (0.25% by mass) of Cu.
この結果から、浸漬後のＰｂ－Ｓｎ合金中のＳｎの含有量が５．３６質量％（＝５５．２０質量％－４９．８４質量％）上昇していることがわかる。 These results show that the Sn content in the Pb-Sn alloy after immersion increased by 5.36 mass% (= 55.20 mass% - 49.84 mass%).
［実施例２］
まず、Ｓｎを含むはんだにより電子部品がはんだ付けされたガラスエポキシ基板を用意し、この基板から電子部品を除去した。この電子部品を除去したガラスエポキシ基板について、重量を測定し、蛍光Ｘ線分析により組成分析したところ、重量は４０６．７２ｇであり、４３ｇ（１１質量％）のＳｎと８１ｇ（２０質量％）のＣｕを含有していた。
[Example 2]
First, a glass epoxy substrate with electronic components soldered with solder containing Sn was prepared, and the electronic components were removed from the substrate. The weight of the glass epoxy substrate from which the electronic components had been removed was measured, and composition analysis by X-ray fluorescence analysis revealed that the weight was 406.72 g and contained 43 g (11 mass%) of Sn and 81 g (20 mass%) of Cu.
また、Ｐｂ－Ｓｎ合金を用意し、その重量を測定し、蛍光Ｘ線分析により組成分析したところ、重量は２６３０ｇであり、１３７９ｇ（５２．４３質量％）のＳｎと１１６５ｇ（４４．２９質量％）のＰｂを含有していた。 A Pb-Sn alloy was also prepared, its weight measured, and its composition analyzed using X-ray fluorescence analysis. The weight was found to be 2,630 g, containing 1,379 g (52.43% by mass) of Sn and 1,165 g (44.29% by mass) of Pb.
このＰｂ－Ｓｎ合金を黒鉛坩堝に入れて２５０℃に加熱して得られた溶湯中に、上記の電子部品を除去したガラスエポキシ基板を入れたかごを２０分間浸漬した。 This Pb-Sn alloy was placed in a graphite crucible and heated to 250°C. The resulting molten metal was immersed for 20 minutes in a basket containing the glass epoxy substrate from which the electronic components had been removed.
この浸漬後のＰｂ－Ｓｎ合金について、重量を測定し、蛍光Ｘ線分析により組成分析したところ、重量は２５３０ｇであり、１４２２ｇ（５６．２１質量％）のＳｎと５ｇ（０．２１質量％）のＣｕを含有していた。 After immersion, the Pb-Sn alloy was weighed and its composition analyzed using X-ray fluorescence analysis. The weight was found to be 2,530 g, and it contained 1,422 g (56.21% by mass) of Sn and 5 g (0.21% by mass) of Cu.
この結果から、浸漬後のＰｂ－Ｓｎ合金中のＳｎの含有量が３．７８質量％（＝５６．２１質量％－５２．４３質量％）上昇していることがわかる。 These results show that the Sn content in the Pb-Sn alloy after immersion increased by 3.78 mass% (= 56.21 mass% - 52.43 mass%).
［実施例３］
実施例１と同様のＰｂ－Ｓｎ合金を黒鉛坩堝に入れて２５０℃に加熱して得られた溶湯中に、実施例１と同様の電子部品を除去したガラスエポキシ基板を入れたかごを１分間浸漬した後、３分間浸漬した後、５分間浸出した後に、基板から抜けたはんだの数（基板に空いた穴の数）を数えて、はんだの回収率（％）（＝（基板から抜けたはんだの数）×１００／（浸出前の基板上のはんだの数）を産出したところ、１分間浸漬した基板では、浸出前の基板上のはんだの数が９０個、基板から抜けたはんだの数が７８個、はんだの回収率が８６．７％であり、３分間浸漬した基板では、浸出前の基板上のはんだの数が１０１個、基板から抜けたはんだの数が８１個、はんだの回収率が８０．２％であり、５分間浸漬した基板では、浸出前の基板上のはんだの数が１８０個、基板から抜けたはんだの数が１５７個、はんだの回収率が８７．２％であった。
[Example 3]
The same Pb-Sn alloy as in Example 1 was placed in a graphite crucible and heated to 250°C. A basket containing a glass epoxy substrate from which the same electronic components as in Example 1 had been removed was immersed in the molten metal for 1 minute, then for 3 minutes, and then for 5 minutes after leaching. The number of solder particles removed from the substrate (the number of holes in the substrate) was counted, and the solder recovery rate (%) (= (number of solder particles removed from the substrate) x 100/(number of solder particles on the substrate before leaching) was calculated. For the board immersed for 3 minutes, the number of solder pieces on the board before leaching was 90, the number of solder pieces that had come off the board was 78, and the solder recovery rate was 86.7%.For the board immersed for 3 minutes, the number of solder pieces on the board before leaching was 101, the number of solder pieces that had come off the board was 81, and the solder recovery rate was 80.2%.For the board immersed for 5 minutes, the number of solder pieces on the board before leaching was 180, the number of solder pieces that had come off the board was 157, and the solder recovery rate was 87.2%.
この結果から、浸出時間が非常に短時間（１～５分間）でも、非常に高い回収率（８０％以上）ではんだを回収することができることがわかる。 These results show that even with a very short leaching time (1 to 5 minutes), solder can be recovered with a very high recovery rate (over 80%).
本発明によるＳｎを含むはんだの回収方法は、Ｓｎを含むはんだにより電子部品などの部品がはんだ付けされた電子基板などの基板からＳｎを含むはんだを回収する方法として使用することができる。 The method for recovering Sn-containing solder according to the present invention can be used to recover Sn-containing solder from substrates such as electronic boards to which electronic components and other parts have been soldered with Sn-containing solder.
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| JP2004022607A (en) | 2002-06-12 | 2004-01-22 | Sharp Corp | Dismantling method and dismantling device for printed circuit board |
| CN109500050A (en) | 2018-10-18 | 2019-03-22 | 东莞理工学院 | Method for preparing composite board by recycling waste circuit board |
| JP2020143350A (en) | 2019-03-07 | 2020-09-10 | 三菱マテリアル株式会社 | Waste electronic board processing method and processing equipment |
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