JP7829167B2 - Paste-like bonding material composition and bond - Google Patents
Paste-like bonding material composition and bondInfo
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- JP7829167B2 JP7829167B2 JP2020167534A JP2020167534A JP7829167B2 JP 7829167 B2 JP7829167 B2 JP 7829167B2 JP 2020167534 A JP2020167534 A JP 2020167534A JP 2020167534 A JP2020167534 A JP 2020167534A JP 7829167 B2 JP7829167 B2 JP 7829167B2
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Description
本発明は、ペースト状の接合材に関し、電子部品等の接合に用いられるペースト状接合材組成物、及び当該ペースト状接合材組成物を用いた接合体に関する。 This invention relates to a paste-like bonding material, specifically a paste-like bonding material composition used for bonding electronic components and the like, and a bonded body using the paste-like bonding material composition.
従来、半導体素子にはシリコン（Ｓｉ）が多く用いられている。近年では、特性の良さが認められていたがコスト等問題で普及が遅れていたシリコンカーバイト（ＳｉＣ）等の素材が普及し始めている。
そして、これらの半導体の接合材料として高温での接合信頼性を有する鉛が８０％以上含有している高温鉛はんだ材や銀又は銅の微粒子を用いた焼結タイプの接合材が検討されている。
しかし、高温鉛はんだ材は環境負荷の問題、銀又は銅の微粒子を用いた焼結タイプの接合材はコストや技術確立の課題を有している。
Traditionally, silicon (Si) has been widely used in semiconductor devices. In recent years, however, materials such as silicon carbide (SiC), which had been recognized for their superior properties but whose widespread adoption had been slow due to cost and other issues, are beginning to gain popularity.
Furthermore, as bonding materials for these semiconductors, high-temperature lead solder materials containing 80% or more lead, which have high bonding reliability at high temperatures, and sintered bonding materials using fine particles of silver or copper are being considered.
However, high-temperature lead solder materials have environmental impact issues, and sintered bonding materials using silver or copper nanoparticles have cost and technical establishment challenges.
一方、従来の拡散接合方法ははんだ粒子と金属粒子を混合してペースト状等の形状に加工し、リフロー炉等で溶融させて接合する方法が検討されている。
しかし、従来のはんだ粒子と金属粒子、及びフラックスと混合するはんだペーストでは、製造工程途中やはんだ付け工程中ではんだ粒子や金属粒子が酸化してはんだ粒子や金属粒子の不ヌレが発生する場合があり、また、接合層に金属粒子の拡散が急速に進むこにより母材へのなじみが不足することもあるため、それに起因してはんだ接合体内部に空隙や酸化膜の層が形成され、金属元素や組成の拡散が進まず、接合後にははんだ接合体内部に金属間化合物が均一に形成されないという問題が残存している。
On the other hand, conventional diffusion bonding methods involve mixing solder particles and metal particles to form a paste or similar shape, which is then melted and bonded in a reflow oven or the like.
However, with conventional solder pastes that mix solder particles, metal particles, and flux, oxidation of the solder particles or metal particles can occur during the manufacturing or soldering process, resulting in non-wetting of the solder particles or metal particles. Furthermore, the rapid diffusion of metal particles into the bonding layer can lead to insufficient adhesion to the base material. As a result, voids and oxide film layers are formed within the solder joint, preventing the diffusion of metal elements and composition, and resulting in the problem of uneven formation of intermetallic compounds within the solder joint after bonding.
そこで、特許文献１及び特許文献２のような接合方法が提案されている。
特許文献１では、半導体チップとＣｕ配線との間の接合層に、Ｃｕ配線側にはＣｕ３Ｓｎの金属間化合物を、半導体チップ側には（Ｃｕ，Ｎｉ）６Ｓｎ５の金属間化合物の２層構造をなす接合層を設けることにより、従来の鉛フリーはんだ材料と同等の価格で耐熱性を有する接合を提供するという技術の開示がなされている。
特許文献２では、拡散はんだ接合を形成するためのはんだプリフォームに関し、はんだ
プリフォーム内に一定の間隔以上で金属間化合物を予め分散させた状態ではんだプリフォームを製造し、はんだ付け工程に於いてはんだプリフォームが溶解してはんだ接合を形成する際に金属間化合物が素早く接合層全体に拡散、安定化するためのはんだプリフォームに製造に関する技術が開示されている。
Therefore, joining methods such as those described in Patent Documents 1 and 2 have been proposed.
Patent Document 1 discloses a technology that provides a heat-resistant bond at a price equivalent to conventional lead-free solder materials by providing a two-layer bonding layer between a semiconductor chip and a Cu wiring, with a Cu3Sn intermetallic compound on the Cu wiring side and a (Cu,Ni) 6Sn5 intermetallic compound on the semiconductor chip side.
Patent Document 2 discloses a solder preform for forming a diffusion solder joint, in which an intermetallic compound is pre-dispersed within the solder preform at a certain interval or greater, and the solder preform is manufactured in such a state that when the solder preform melts and forms a solder joint during the soldering process, the intermetallic compound quickly diffuses and stabilizes throughout the entire joint layer.
しかし、特許文献１では接合層に２種の金属間化合物を形成させるために、特許文献２でもはんだプリフォーム中に予め金属間化合物を形成する必要が有り、接合材の製造方法自体やはんだ付け工程が煩雑になるという課題を有していた。 However, since Patent Document 1 requires the formation of two types of intermetallic compounds in the bonding layer, Patent Document 2 also requires the pre-formation of intermetallic compounds in the solder preform. This presented a challenge in that the manufacturing method of the bonding material and the soldering process itself became complicated.
また、特許文献２ははんだプリフォームに含有する金属粒子の酸化膜に起因する不ヌレの解消が不十分であり、また、はんだプリフォームという形状であるため、接合対象や接合条件に制限があるため、はんだペーストのように汎用的に使用可能ではんだ接合体も耐熱性に優れ、安価な接合材や当該接合材を用いた接合方法が求められている。 Furthermore, Patent Document 2 fails to adequately resolve non-wetting caused by the oxide film of metal particles contained in the solder preform. Also, due to its solder preform form, there are limitations on the objects to be joined and the joining conditions. Therefore, there is a need for a joining material and joining method that can be used more generally, like solder paste, and that provides a soldered joint with excellent heat resistance and is inexpensive.
本発明は、このような状況に鑑み、ペースト形状を有した接合材であって、当該接合材を用いた接合体が耐熱性に優れ、しかも、接合体に空隙等の不具合が発生しない接合が可能なペースト状接合材及び当該接合材を用いた接合体の提供を目的とする。
In view of these circumstances, the present invention aims to provide a paste-like bonding material and a joint using the said bonding material that exhibits excellent heat resistance and enables bonding without defects such as voids in the joint.
本発明は、前記課題解決の為、ペースト形状をなす接合材に於いて同接合材に含有する拡散を目的とする金属粒子の酸化が発生しない方法を検討した結果、当該金属粒子を予め特定の金属不活性化剤で処理することにより、ペースト状接合材の製造工程並びに当該接合材を用いた接合工程に於いて、金属粒子の酸化が抑制でき、接合時に接合体内部で金属粒子が不ヌレ等を発生することなく拡散し、金属間化合物を迅速に形成することに加え、反応速度を下げて母材へのなじみ優先させることが可能なことを見出し、本発明の完成に至った。 To solve the aforementioned problems, the present invention investigated a method for preventing oxidation of metal particles intended for diffusion contained in a paste-like bonding material. The results showed that by pre-treating the metal particles with a specific metal deactivator, oxidation of the metal particles can be suppressed during the manufacturing process of the paste-like bonding material and during the bonding process using the bonding material. This allows the metal particles to diffuse within the bonded material without causing non-wetting during bonding, rapidly forming intermetallic compounds. Furthermore, it is possible to reduce the reaction rate and prioritize compatibility with the base material, leading to the completion of the present invention.
本発明のペースト状接合材組成物並びに当該接合材を用いた接合体は、接合時に接合体内部に存在する金属粒子の不ヌレ等により発生するボイドの不具合が少なく、接合後の接合体内部に金属間化合物が広範囲に存在しているため、耐熱性にも優れ、しかも、従来のはんだ材と大差ないコストにて提供可能なため、パワー半導体をはじめとする耐熱性が必要な接合用途に広く応用が可能である。 The paste-like bonding material composition and the bonded body using this bonding material exhibit fewer void defects caused by non-wetting of metal particles within the bonded body during bonding. Furthermore, because intermetallic compounds are widely present within the bonded body after bonding, it exhibits excellent heat resistance. Moreover, it can be provided at a cost comparable to conventional solder materials, making it widely applicable to bonding applications requiring heat resistance, such as power semiconductors.
本発明の接合材組成物は、基本組成としてはんだ粒子及び／又は融点の低い金属粒子、及び融点の高い金属粒子及びフラックスより構成されていることを特徴としている。
なお、本発明の接合材組成物の構成成分である融点の低い金属粒子とは鉛フリーはんだ合金を例とする融点が４００℃以下の金属及び合金（以下、低融点金属粒子と記載）を指し、融点の高い金属粒子とは融点が４００℃を超える金属及び合金（以下、高融点金属粒子と記載）を指す。
The bonding material composition of the present invention is characterized in that its basic composition consists of solder particles and/or metal particles with a low melting point, metal particles with a high melting point, and flux.
In the present invention, the low-melting-point metal particles that constitute the bonding material composition refer to metals and alloys with a melting point of 400°C or less, such as lead-free solder alloys (hereinafter referred to as "low-melting-point metal particles"), while the high-melting-point metal particles refer to metals and alloys with a melting point exceeding 400°C (hereinafter referred to as "high-melting-point metal particles").
本発明の接合材組成物に用いることのできる低融点金属粒子は、本発明の効果を有する範囲に於いて組成や粒径に制限はなく、はんだ合金粒子の組成ではＳｎ－Ａｇ－Ｃｕ系、Ｓｎ－Ｃｕ系、Ｓｎ－Ｃｕ－Ｎｉ系等の鉛フリーはんだ組成等が例示でき、融点の低い金属粒子ではＳｎが例示できる。
また、夫々の粒子の粒径は、ＪＩＳ規格Ｚ３２８４－２付属書Ａに記載の粒径サイズが好ましい。
更に、配合量としては、接合材組成全体を１００とした場合、１０～９０質量％が好ましい。
The low-melting-point metal particles that can be used in the bonding material composition of the present invention are not limited in composition or particle size within the range in which the effects of the present invention are achieved. Examples of solder alloy particle compositions include lead-free solder compositions such as Sn-Ag-Cu, Sn-Cu, and Sn-Cu-Ni, while examples of low-melting-point metal particles include Sn.
Furthermore, the particle size of each particle is preferably the particle size specified in JIS standard Z3284-2 Annex A.
Furthermore, regarding the amount added, it is preferable to use 10 to 90% by mass, when the total composition of the bonding material is considered as 100.
また、本発明の接合材組成物に用いることのできる高融点金属粒子は、本発明の効果を有する範囲に於いて、はんだ接合体内部に金属間化合物が形成されるものであれば組成や粒径、形状に制限はない。
そして、当該金属粒子の組成は、Ｃｕ、Ｎｉ、Ｃｕ－Ｎｉ合金、Ｃｕ－Ｃｏ合金等が例示でき、粒径では０．１μｍ～１００μｍ、形状では球状、不定形等が例示できる。
更に、配合量としては、接合材組成物の組成全体を１００とした場合、０．１～７０質量％が好ましい。
そして、粒径や形状および組成の異なる金属粒子を複数種、接合材組成物中に用いても構わない。
Furthermore, the high-melting-point metal particles that can be used in the bonding material composition of the present invention are not limited in composition, particle size, or shape, as long as they form an intermetallic compound inside the solder joint within the range in which the effects of the present invention are achieved.
The composition of the metal particles can be exemplified by Cu, Ni, Cu-Ni alloy, Cu-Co alloy, etc., with particle sizes ranging from 0.1 μm to 100 μm, and shapes such as spherical or amorphous.
Furthermore, the amount added is preferably 0.1 to 70% by mass, when the total composition of the bonding material composition is considered as 100.
Furthermore, multiple types of metal particles with different particle sizes, shapes, and compositions may be used in the bonding material composition.
一方、金属粒子を処理する成分や方法は、本発明の効果を有する範囲に於いて制限はなく、金属不活化効果を有する金属不活性化剤であれば問題ない。
金属不活性化剤としては、市販の金属不活性化剤で良く、トリアゾール系、イミダゾール系、及びチアジアゾール系が例示でき、含有するはんだ粉末の融点より高い融点を有する金属不活性化剤が好ましい。
配合量に関しても、本発明の効果を有する範囲に於いて制限はないが、含有量が多くなるとはんだ接合後にはんだ接合体内部やはんだ接合体の周囲に当該金属不活性化剤又は当該金属不活性化剤に由来する成分が残存し、不具合を発生する可能性があるため、少ない方が好ましい。具体的な量としては、フラックス組成に含有される溶剤成分を１００とした場合、０．１質量％以下が好ましい。
また、処理の方法に特段の制限はなく、金属粒子表面に金属不活性化剤が被覆され、はんだ接合工程まで金属粒子の酸化を防止並びに抑制ができれば構わない。
On the other hand, the components and methods for processing metal particles are not limited within the scope of the effects of the present invention; any metal deactivator having a metal deactivation effect is acceptable.
Any commercially available metal deactivator is suitable as the metal deactivator, and examples include triazole-based, imidazole-based, and thiadiazole-based metal deactivators. Metal deactivators having a melting point higher than the melting point of the contained solder powder are preferred.
Regarding the amount to be blended, there are no restrictions as long as the effects of the present invention are achieved. However, if the content is high, the metal deactivator or components derived from the metal deactivator may remain inside or around the soldered joint after soldering, which may cause problems. Therefore, a lower amount is preferable. Specifically, when the solvent component contained in the flux composition is set to 100, 0.1% by mass or less is preferable.
Furthermore, there are no particular restrictions on the processing method; it is acceptable as long as the metal particle surface is coated with a metal deactivator and oxidation of the metal particles is prevented or suppressed until the soldering process.
そして、本発明のペースト状接合材組成物のフラックスに用いることができる有機酸は、本発明の効果を有する範囲に於いて特に制限はないが、ジカルボン酸やカルボン酸が好ましく、ジカルボン酸としてマロン酸、マレイン酸、コハク酸、グルタル酸、アジピン酸等が、カルボン酸として安息香酸、乳酸、シユウ酸、ギ酸、酢酸等が例示できる。
本発明のはんだペースト組成物用フラックス組成物に用いることができる溶剤は、本発明の効果を有する範囲に於いて特に制限はないが金属不活性化剤を溶解できるものが好ましく、アルコール類やグリコール類が例示できる。
更に、本発明のペースト状接合材組成物のフラックスには、適宜、酸化防止剤、バインダー、ロジン等の樹脂成分等を含有させることができる。
また、本発明のペースト状接合材組成物のフラックスに用いることができる各成分の配合量も本発明の効果を有する範囲に於いて特に制限はなく、接合材として印刷特性等の作業性が良い範囲が好ましい。
Furthermore, the organic acid that can be used as the flux in the paste-like bonding material composition of the present invention is not particularly limited within the range that provides the effects of the present invention, but dicarboxylic acids and carboxylic acids are preferred. Examples of dicarboxylic acids include malonic acid, maleic acid, succinic acid, glutaric acid, adipic acid, etc., and examples of carboxylic acids include benzoic acid, lactic acid, oxalic acid, formic acid, acetic acid, etc.
The solvent that can be used in the flux composition for solder paste compositions of the present invention is not particularly limited as long as it is within the range that the effects of the present invention are achieved, but it is preferable that it is capable of dissolving the metal deactivator, and alcohols and glycols are examples.
Furthermore, the flux of the paste-like bonding material composition of the present invention may optionally contain antioxidants, binders, resin components such as rosin, etc.
Furthermore, there are no particular restrictions on the amount of each component that can be used in the flux of the paste-like bonding material composition of the present invention, as long as it is within the range that provides the effects of the present invention. It is preferable that the amount of each component is within a range that provides good workability, such as printing characteristics, as a bonding material.
本発明のペースト状接合材組成物を用いて接合体を形成させる場合、本発明の効果を有する範囲に於いて制限はなく、実施例に記載したように加圧焼成装置を用いる方法や無加圧での方法、例えば従来のリフロー方式、オーブンでの加熱方式、やギ酸雰囲気下、減圧雰囲気下等の接合方法が例示できる。 When forming a bonded body using the paste-like bonding material composition of the present invention, there are no limitations within the range in which the effects of the present invention are achieved. Examples of bonding methods include those using a pressurized firing apparatus as described in the examples, methods without pressurization, such as the conventional reflow method, oven heating method, or bonding methods under a formic acid atmosphere or reduced pressure atmosphere.
以下、本発明について実施例を基に詳細に説明する。
〔金属粒子の処理〕
１）トリアゾール系金属不活性化剤として、株式会社ＡＤＥＫＡ社製アデカスタブＣＤＡ－１（ＣＤＡ－１）０．１ｇをＮ－メチルー２－ピロリドン（ＮＭＰ）を１５ｇ計量後に混合し、均一に溶解させ、処理液とする。
２）Ｎｉ含有量が５．５ａｔｍ％（５．１質量％）Ｃｕ－５．５Ｎｉ合金粒子（平均粒径（約６μｍ）１０ｇをガラス製サンプル瓶に計量した後、ＣＤＡ－１とＮＭＰ処理液５ｇを加え、密栓し、室温にて静置した。
３）２）を６５時間放置した後、ＣＤＡ－１とＮＭＰ処理液をろ過にて取り去り、Ｃｕ－５．５Ｎｉ金属粒子を乾燥し、処理を終了する。
（実施例１に用いる金属粒子とした。）
４）次に、比較例１に使用する金属粒子に関して、Ｃｕ－５．５Ｎｉ合金粒子（平均粒径（約１０μｍ）１０ｇをガラス製サンプル瓶に計量した後、ＮＭＰ５ｇを加え、密栓し、室温にて静置した。
５）４）を６５時間放置した後、ＮＭＰ液をろ過にて取り去り、Ｃｕ－５．５Ｎｉ金属粒子を乾燥し、コート処理を終了する。
（比較例１に用いる金属粒子とした。）
〔はんだペースト組成物の作製〕
表１に示す成分準備し、通常のはんだペーストの通常製法にて本発明並びに比較品の測定用接合材ペースト組成物の試料を夫々作製した。
・はんだ粒子：株式会社日本スペリア社製ＳＮ１００ＣＴｙｐｅ６粉末
・アジピン酸（活性剤）、デカノール（溶剤）、イソボルニルシクロヘキサノール
（バインダー）は市販のものを用いた。
The present invention will be described in detail below based on examples.
[Processing of metal particles]
1) As a triazole-based metal deactivator, 0.1 g of ADEKA Stab CDA-1 (CDA-1) manufactured by ADEKA Corporation is mixed with 15 g of N-methyl-2-pyrrolidone (NMP) after weighing, and the mixture is uniformly dissolved to obtain the treatment solution.
2) Cu-5.5Ni alloy particles with a Ni content of 5.5 atm% (5.1 mass%) (average particle size (approx. 6 μm)) were weighed into a glass sample bottle, then 5 g of CDA-1 and NMP treatment solution were added, the bottle was sealed tightly, and left to stand at room temperature.
3) After leaving step 2) for 65 hours, the CDA-1 and NMP treatment solution are removed by filtration, the Cu-5.5Ni metal particles are dried, and the process is completed.
(These were the metal particles used in Example 1.)
4) Next, regarding the metal particles used in Comparative Example 1, 10 g of Cu-5.5Ni alloy particles (average particle size (approximately 10 μm)) were weighed into a glass sample bottle, 5 g of NMP was added, the bottle was sealed tightly, and left to stand at room temperature.
5) After leaving step 4) for 65 hours, the NMP solution is removed by filtration, the Cu-5.5Ni metal particles are dried, and the coating process is completed.
(These were the metal particles used in Comparative Example 1.)
[Preparation of solder paste composition]
The components shown in Table 1 were prepared, and samples of the present invention and comparative bonding paste compositions for measurement were prepared using the standard method for manufacturing ordinary solder paste.
Solder particles: SN100C Type 6 powder manufactured by Nippon Superior Co., Ltd. Adipic acid (activator), decanol (solvent), and isobornylcyclohexanol (binder) were commercially available.
〔評価試料の作製〕
本発明のペースト状接合材組成物である実施例１と比較対象の比較例１のペースト状接合材組成物を準備し、１０ｍｍΦ銅試験片上に直径約５ｍｍ、膜厚１００μｍになるように各はんだペースト組成物を塗布した後、１３０℃のホットプレート上に６０秒間試料を放置して予備乾燥させる。その後、５ｍｍΦ銅試験片を予備乾燥が終了したはんだペースト組成物の上に塗布域と銅試験片が重なるように静置させる。
その後、明昌機工株式会社製シンタリング装置ＨＴＭ－３０００を用いて、下記シンタリング条件にて接合を行い、測定試料を作製した。
（シンタリング条件）
・荷重：５ＭＰａ、シンタリング温度:２５０℃、焼成時間：５分間、Ｎ２雰囲気
[Preparation of evaluation samples]
Example 1, which is the paste-type bonding material composition of the present invention, and Comparative Example 1, which is a comparative example, are prepared. Each solder paste composition is applied to a 10 mmΦ copper test piece to a diameter of approximately 5 mm and a film thickness of 100 μm. The sample is then left on a hot plate at 130°C for 60 seconds to pre-dry. After that, a 5 mmΦ copper test piece is placed on the pre-dried solder paste composition so that the applied area and the copper test piece overlap.
Subsequently, a sample for measurement was prepared by joining the materials using the HTM-3000 sintering device manufactured by Meisho Kiko Co., Ltd. under the following sintering conditions.
(Sintering conditions)
Load: 5 MPa, Sintering temperature: 250°C, Firing time: 5 minutes, N2 atmosphere
〔評価〕
作製した試料は、「ＪＩＳ Ｚ ３１９８－５はんだ継手の引張およびせん断試験方法」に準拠し、シェア強度を測定した。
具体的には、株式会社エー・アンド・デイ製テンシロン万能材料試験機を用いて、下記条件にて、シェア強度を測定した。
・シェア速度：６ｍｍ／分、室温（２０℃～２５℃）
また、接合状態を日本電子株式会社製ＪＳＭ－５７００走査型電子顕微鏡を用いて接合断面の観察を行い接合状態を評価した。
シェア強度の結果を表２に、断面観察の結果を図１、図２に示す。
〔evaluation〕
The prepared samples were subjected to shear strength testing in accordance with "JIS Z 3198-5 Tensile and Shear Test Methods for Solder Joints".
Specifically, the shear strength was measured using the Tensilon universal material testing machine manufactured by A&D Co., Ltd. under the following conditions.
• Shearing speed: 6 mm/min, room temperature (20°C to 25°C)
Furthermore, the bonding state was evaluated by observing the bonded cross-section using a JEOL Ltd. JSM-5700 scanning electron microscope.
The shear strength results are shown in Table 2, and the results of the cross-sectional observation are shown in Figures 1 and 2.
表２に示す通り、本発明のペースト状接合材組成物を用いて接合した試料は、比較例１に比べ１．５倍以上の高いシェア強度を有しており、はんだ接合体が比較例に比べ緻密で均一であることが想定でき、高い信頼性が期待できる。
また、図１及び図２より、本発明のペースト状接合材組成物を用いて接合した試料は、接合層に空隙が極めて少ないことがわかった。
このことは、本発明のペースト状接合材組成物に含有される金属粒子がはんだ接合工程まで酸化されることなく保たれ、金属粒子の酸化による不ヌレは発生しなかったことに加え、処理剤である金属不活性化剤が殆ど残存していないことを示している。
これに対して、比較例１は接合層に多くの空隙が見られ、不ヌレ等が発生して接合状態が不完全であったことがわかる。
このように本発明のペースト状接合材組成物を用いて接合した接合体は、ボイドが少なく金属間化合物が接合層全体に広く形成され、良好な接合体を形成している。
そして、接合体に広く分布する金属間化合物は主な組成がＣｕ６Ｓｎ５又は（Ｃｕ，Ｎｉ）６Ｓｎ５であるため、融点が４００℃以上と高温であることから耐熱性にも優れ、高い信頼性が期待できる。
As shown in Table 2, the samples joined using the paste-like bonding material composition of the present invention have a shear strength 1.5 times higher than that of Comparative Example 1, suggesting that the soldered joints are denser and more uniform than those in the comparative example, and thus high reliability can be expected.
Furthermore, Figures 1 and 2 show that the samples joined using the paste-like bonding material composition of the present invention have extremely few voids in the bonded layer.
This indicates that the metal particles contained in the paste-like bonding material composition of the present invention remained unoxidized until the soldering process, preventing non-wetting due to oxidation of the metal particles, and that virtually no metal deactivator, which is a treatment agent, remained.
In contrast, Comparative Example 1 shows many voids in the bonding layer, indicating that the bonding state was incomplete due to issues such as non-wetting.
As described above, the bonded body formed using the paste-like bonding material composition of the present invention has few voids, and the intermetallic compound is widely formed throughout the bonding layer, resulting in a good bonded body.
Furthermore, since the intermetallic compounds widely distributed in the joint have a main composition of Cu 6 Sn 5 or (Cu,Ni) 6 Sn 5 , they have a high melting point of 400°C or higher, resulting in excellent heat resistance and high reliability.
本発明のペースト状接合材及び当該ペースト状接合材組成物を用いて接合した接合体は耐熱性に優れた接合層を安価で提供可能なため、パワーモジュールの接合や従来の電子部品接合に加え、半導体の接合に広く応用が期待できる。 The paste-like bonding material and the bonded body formed using this paste-like bonding material composition offer a heat-resistant bonding layer at a low cost. Therefore, it is expected to have broad applications in semiconductor bonding, in addition to bonding power modules and conventional electronic component bonding.
１ ５ｍｍΦ銅試験片
２ 接合層
３ 空隙（ボイド）
４ １０ｍｍΦ銅試験片
1. 5mm diameter copper test piece 2. Bonding layer 3. Void
4. 10mm diameter copper test piece
Claims (1)
鉛フリーはんだ合金組成からなる融点が４００℃以下の低融点金属粒子と、融点が４００℃を超える高融点金属粒子と、フラックスを含有し、
融点４００℃以下の低融点金属粒子がＳｎ－Ａｇ－Ｃｕ系又はＳｎ－Ｃｕ系又はＳｎ－Ｃｕ－Ｎｉ系の鉛フリーはんだ合金からなり、
融点４００℃を超える高融点金属粒子がＣｕ又はＮｉ又はＣｕ－Ｎｉ合金又はＣｕ－Ｃｏ合金からなり、当該高融点金属粒子がトリアゾール系又はイミダゾール系の金属不活性剤でコート処理され、
フラックス組成は有機酸と溶剤とバインダーを含有し、
当該有機酸がジカルボン酸及びカルボン酸であり、
当該バインダーがイソボルニルシクロヘキサノールであることを特徴とするペースト状接合材組成物。
A bonding material composition having a paste-like consistency,
It contains low-melting-point metal particles with a melting point of 400°C or less , high-melting-point metal particles with a melting point exceeding 400°C , and flux,
The low-melting-point metal particles with a melting point of 400°C or less consist of lead-free solder alloys of the Sn-Ag-Cu, Sn-Cu, or Sn-Cu-Ni type.
High-melting-point metal particles with a melting point exceeding 400°C consist of Cu, Ni, Cu-Ni alloy, or Cu-Co alloy, and these high-melting-point metal particles are coated with a triazole-based or imidazole-based metal deactivator.
The flux composition contains organic acids, solvents, and binders.
The organic acid in question is a dicarboxylic acid and a carboxylic acid.
A paste-like bonding material composition characterized in that the binder is isobornylcyclohexanol .
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| WO2014031358A1 (en) | 2012-08-09 | 2014-02-27 | Ormet Circuits, Inc | Electrically conductive compositions comprising non-eutectic solder alloys |
| WO2017007011A1 (en) | 2015-07-09 | 2017-01-12 | 古河電気工業株式会社 | Metal fine particle-containing composition |
| JP2017101313A (en) | 2015-03-20 | 2017-06-08 | 株式会社豊田中央研究所 | Joint material, joint method using the same, joint material paste and semiconductor device |
| JP2019070174A (en) | 2017-10-06 | 2019-05-09 | 株式会社豊田中央研究所 | Bonding paste and semiconductor device using same |
| KR102314236B1 (en) | 2020-09-22 | 2021-10-19 | 엘티메탈 주식회사 | Bonding paste with high temperature stability and manufacturing method thereof |
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|---|---|---|---|---|
| WO2014031358A1 (en) | 2012-08-09 | 2014-02-27 | Ormet Circuits, Inc | Electrically conductive compositions comprising non-eutectic solder alloys |
| JP2017101313A (en) | 2015-03-20 | 2017-06-08 | 株式会社豊田中央研究所 | Joint material, joint method using the same, joint material paste and semiconductor device |
| WO2017007011A1 (en) | 2015-07-09 | 2017-01-12 | 古河電気工業株式会社 | Metal fine particle-containing composition |
| JP2019070174A (en) | 2017-10-06 | 2019-05-09 | 株式会社豊田中央研究所 | Bonding paste and semiconductor device using same |
| KR102314236B1 (en) | 2020-09-22 | 2021-10-19 | 엘티메탈 주식회사 | Bonding paste with high temperature stability and manufacturing method thereof |
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