JP7834073B2 - Current collector, battery, and HAPS - Google Patents

Description

This invention relates to a manufacturing method, program, manufacturing system, current collector, and battery.

Metal-plated resin films were known (see, for example, Patent Document 1).
[Prior art documents]
[Patent Documents]
[Patent Document 1] Japanese Unexamined Patent Publication No. 2018-181823

According to one embodiment of the present invention, a manufacturing method is provided. The manufacturing method may include a preparation step for preparing a resin layer. The manufacturing method may also include a forming step for forming holes penetrating from the upper surface to the lower surface of the resin layer, wherein the holes are of a size and number such that, when metal is formed on the inner surface of the holes, the resistance of the holes per 1 Ah of battery capacity using the current collector is 1 mΩ or less. The manufacturing method may also include a current collector manufacturing step for producing a current collector in which the metal layer on the upper surface and the metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the holes by forming metal in the resin layer.

The holes may be circular or elliptical. The holes may be circular, and their diameter may be 10 to 300 μm. The diameter of the holes may be 50 to 150 μm. When forming multiple holes in the resin layer in the forming step, the multiple holes may be formed such that the distance between the centers of adjacent holes is 20 to 500 μm. When forming multiple holes in the resin layer in the forming step, the multiple holes may be formed such that the distance between the centers of adjacent holes is 60 to 350 μm. The thickness of the resin layer may be 1 to 10 μm, the thickness of the upper metal layer may be 0.1 to 2.0 μm, and the thickness of the lower metal layer may be 0.1 to 2.0 μm. The thickness of the resin layer may be 3 to 7 μm, the thickness of the upper metal layer may be 0.3 to 1.0 μm, and the thickness of the lower metal layer may be 0.3 to 1.0 μm. The ratio of the volume of the metal on the inner surface of the hole to the volume of the hole may be 0.3 to 20%. Alternatively, the ratio may be 1.0 to 10%.

The above manufacturing method may include an acquisition step of acquiring battery information including information on the capacity of the battery in which the current collector is used, and a design step of determining the size and number of holes based on the battery information, and the forming step may form the holes of the size and number determined in the design step in the resin layer. The above current collector manufacturing step may produce a plurality of negative electrode current collectors, and the above manufacturing method may include a lamination step of laminating the plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, and a plurality of separators, a tab installation step of resistance welding the protruding portions of the plurality of negative electrode current collectors where the negative electrode mixture is not laminated between negative electrode tabs and negative electrode sub tabs, and a battery manufacturing step of producing a battery having the plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, a plurality of separators, a negative electrode tab, and a negative electrode sub tab. The above current collector manufacturing process may involve manufacturing the plurality of positive electrode current collectors, the tab installation process may involve sandwiching the protruding portions of the plurality of positive electrode current collectors where the positive electrode mixture is not laminated between the positive electrode tab and the positive electrode sub tab and resistance welding them, and the above battery manufacturing process may involve manufacturing a battery having the plurality of negative electrode current collectors, the plurality of negative electrode mixtures, the plurality of positive electrode current collectors, the plurality of positive electrode mixtures, the plurality of separators, the negative electrode tab, the negative electrode sub tab, the positive electrode tab, and the positive electrode sub tab. The above current collector manufacturing process may manufacture a plurality of positive electrode current collectors, and the above manufacturing method may include a lamination step of laminating a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, and a plurality of separators; a tab installation step of resistance welding the protruding portions of the plurality of positive electrode current collectors where the positive electrode mixture is not laminated between positive electrode tabs and positive electrode sub tabs; and a battery manufacturing step of manufacturing a battery having the plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, a plurality of separators, positive electrode tabs, and positive electrode sub tabs. The above forming step may form the holes in the region of the resin layer that is sandwiched between the positive electrode tabs and positive electrode sub tabs. When the above forming step produces the positive electrode current collector, the holes may be formed in the region of the resin layer that is resistance welded with the positive electrode tabs and positive electrode sub tabs. The lamination step may involve laminating the plurality of negative electrode current collectors, plurality of negative electrode mixtures, plurality of positive electrode current collectors, plurality of positive electrode mixtures, and plurality of separators so that there are at least three layers of positive electrode current collectors. The forming step may involve forming the holes in the region of the resin layer corresponding to the protruding portion. The forming step may involve forming the holes in the region of the resin layer sandwiched between the negative electrode tab and the negative electrode sub tab. When the forming step is used to produce the negative electrode current collector, the holes may be formed in the region of the resin layer that is resistance-welded to the negative electrode tab and the negative electrode sub tab. The manufacturing method may include an acquisition step of acquiring battery information, including information on the capacity of the battery in which the current collector is used, and a design step of determining the size and number of holes based on the battery information, and the forming step may involve forming the holes of the size and number determined in the design step in the resin layer. The above design process may determine the position and size of the holes and the spacing between them such that the holes formed in each of the protrusions of the multiple negative electrode current collectors overlap, at least partially, with the holes in the protrusions of adjacent negative electrode current collectors when stacked.

According to one embodiment of the present invention, a manufacturing method is provided. The manufacturing method may include a preparation step of preparing a plurality of resin layers. The manufacturing method may include a forming step of forming holes penetrating from the upper surface to the lower surface in the protruding portions of each of the plurality of resin layers. The manufacturing method may include a current collector generating step of generating a negative electrode current collector in which a metal layer on the upper surface and a metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the holes by forming metal in the resin layers in which holes have been formed by the forming step. The manufacturing method may include a lamination step of laminating a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, and a plurality of separators. The manufacturing method may include a tab installation step of resistance welding the protruding portions of the plurality of negative electrode current collectors by sandwiching them with negative electrode tabs and negative electrode sub tabs. The manufacturing method may include a battery manufacturing step of manufacturing a battery having a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, a plurality of separators, negative electrode tabs, and negative electrode sub tabs. The forming step may involve forming a hole in the region of the resin layer sandwiched between the negative electrode tab and the negative electrode sub tab. The current collector production step may involve plating the resin layer in which the hole was formed by the forming step with metal to produce a positive electrode current collector in which the metal layer on the upper surface and the metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the hole. The lamination step may involve laminating the plurality of negative electrode current collectors and the plurality of positive electrode current collectors produced in the current collector production step with the plurality of negative electrode mixtures, the plurality of positive electrode mixtures, and the plurality of separators. The tab installation step is: The protruding portions of the multiple positive electrode bodies described above may be sandwiched between positive electrode tabs and positive electrode sub-tabs and resistance welded. The battery manufacturing process may produce a battery having the multiple negative electrode current collectors, the multiple negative electrode mixtures, the multiple positive electrode current collectors, the multiple positive electrode mixtures, the multiple separators, the negative electrode tabs, the negative electrode sub-tabs, the positive electrode tabs, and the positive electrode sub-tabs. The forming process may involve forming the holes within the region of the resin layer sandwiched between the positive electrode tabs and the positive electrode sub-tabs.

According to one embodiment of the present invention, a manufacturing method is provided. The manufacturing method may include a preparation step of preparing a plurality of resin layers. The manufacturing method may include a forming step of forming holes penetrating from the upper surface to the lower surface in the protruding portions of each of the plurality of resin layers. The manufacturing method may include a current collector generating step of generating a positive electrode current collector in which a metal layer on the upper surface and a metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the holes by forming metal in the resin layers in which holes have been formed by the forming step. The manufacturing method may include a lamination step of laminating a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, and a plurality of separators. The manufacturing method may include a tab installation step of resistance welding the protruding portions of the plurality of positive electrode current collectors by sandwiching them with positive electrode tabs and positive electrode sub tabs. The manufacturing method may include a battery manufacturing step of manufacturing a battery having a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, a plurality of separators, positive electrode tabs, and positive electrode sub tabs. The forming process involves creating a pore within the region of the resin layer sandwiched between the positive electrode tab and the positive electrode sub tab.

According to one embodiment of the present invention, a program is provided for causing a computer to perform the above-described manufacturing method.

According to one embodiment of the present invention, a manufacturing system is provided. The manufacturing system may include a preparation unit for preparing a resin layer. The manufacturing system may also include a hole-forming unit for forming holes penetrating from the upper surface to the lower surface of the resin layer, wherein the hole-forming unit forms holes of a size and number such that, when metal is formed on the inner surface of the holes, the resistance of the holes per 1 Ah of battery capacity using the current collector is 1 mΩ or less. The manufacturing system may also include a current collector manufacturing unit for manufacturing a current collector in which the metal layer on the upper surface and the metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the holes by forming metal on the resin layer.

According to one embodiment of the present invention, a manufacturing system is provided. The manufacturing system may include a preparation section for preparing a plurality of resin layers. The manufacturing system may include a hole forming section for forming holes penetrating from the upper surface to the lower surface in the protruding portions of each of the plurality of resin layers. The manufacturing system may include a current collector manufacturing section for manufacturing a negative electrode current collector in which the metal layer on the upper surface and the metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the holes by forming metal in the resin layers in which holes have been formed by the forming process. The manufacturing system may include a lamination section for laminating a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, and a plurality of separators. The manufacturing system may include a tab installation section for resistance welding the protruding portions of the plurality of negative electrode current collectors by sandwiching them with negative electrode tabs and negative electrode sub tabs. The manufacturing system may include a battery manufacturing section for manufacturing a battery having a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, a plurality of separators, negative electrode tabs, and negative electrode sub tabs. The pore-forming portion may have pores formed within the area sandwiched between the negative electrode tab and the negative electrode sub tab of the resin layer.

According to one embodiment of the present invention, a manufacturing system is provided. The manufacturing system may include a preparation unit for preparing a plurality of resin layers. The manufacturing system may include a hole-forming unit for forming holes penetrating from the top surface to the bottom surface in the protruding portions of each of the plurality of resin layers. The manufacturing system may include a current collector manufacturing unit for manufacturing a positive electrode current collector in which the metal layer on the top surface and the metal layer on the bottom surface of the resin layer are electrically connected by the metal on the inner surface of the holes by forming metal in the resin layers in which holes have been formed by the hole-forming unit. The manufacturing system may include a lamination unit for laminating a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, and a plurality of separators. The manufacturing system may include a tab-installation unit for resistance welding the protruding portions of the plurality of positive electrode current collectors by sandwiching them with positive electrode tabs and positive electrode sub tabs. The manufacturing system may include a battery manufacturing unit for manufacturing a battery having a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode current collectors, a plurality of positive electrode mixtures, a plurality of separators, positive electrode tabs, and positive electrode sub tabs. The pore-forming portion may have pores formed within the region sandwiched between the positive electrode tab and the positive electrode sub tab of the resin layer.
Manufacturing system.

According to one embodiment of the present invention, a current collector is provided. The current collector may comprise a resin layer having at least one hole penetrating from the upper surface to the lower surface. The current collector may also comprise metal formed on the upper and lower surfaces of the resin layer and on the inner surface of the hole. In the current collector, the metal layer on the upper surface and the metal layer on the lower surface of the resin layer are electrically connected by the metal on the inner surface of the hole, and the resistance of the hole per 1 Ah of battery capacity in which the current collector is used may be 1 mΩ or less.

According to one embodiment of the present invention, a battery having the above-mentioned current collector is provided.

Furthermore, the above summary of the invention does not enumerate all the necessary features of the present invention. Subcombinations of these features may also constitute an invention.

A schematic example of the battery component 10 is shown below. A schematic example of the battery component 10 is shown below. A schematic example of the laminate 280 in which the negative electrode tab 204 and the negative electrode Sub tab 206 are welded is shown. A schematic example of the laminate 380 in which the positive electrode tab 304 and the positive electrode sub tab 306 are welded together is shown. A schematic example of a negative electrode current collector 200 is shown below. This is a cross-sectional view along the line X-X. A schematic example of a positive electrode current collector 300 is shown below. This is a Y-Y cross-section. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. An example of a protruding portion 210 of the negative electrode current collector 200 is schematically shown. Another example of the battery component 10 is schematically shown. An example of the functional configuration of the manufacturing system 400 is shown in general terms. An example of the processing flow by the manufacturing system 400 is shown in a schematic manner. A schematic example of the hardware configuration of a computer 1200 that functions as a manufacturing system 400 is shown.

The present invention will be described below through embodiments, but these embodiments are not intended to limit the scope of the claims. Furthermore, not all combinations of features described in the embodiments are necessarily essential to the solution of the invention.

Figures 1 and 2 schematically show an example of a battery component 10. The battery component 10 has multiple negative electrodes 20 and positive electrodes 30 stacked alternately with a separator 40 in between. The negative electrode 20 has a negative electrode current collector 200 and a negative electrode mixture 202. The positive electrode 30 has a positive electrode current collector 300 and a positive electrode mixture 302. The negative electrode current collector 200 has a protrusion 210. The positive electrode current collector 300 also has a protrusion 310.

Figures 1 and 2 illustrate the case where the protrusions 210 and 310 are arranged in the same direction, but the design is not limited to this. The protrusions 210 and 310 may be arranged in different directions. For example, the protrusions 210 and 310 may be arranged in opposite directions.

The battery component 10 may be a component of any type of battery. For example, the battery component 10 is a component of a lithium-ion battery. For instance, a lithium-ion battery is formed when a negative electrode tab 204 and a negative electrode sub-tab 206 are welded to a laminate 280 on which the protrusions 210 of the negative electrode current collector 200 are stacked, and a positive electrode tab 304 and a positive electrode sub-tab 306 are welded to a laminate 380 on which the protrusions 310 of the positive electrode current collector 300 are stacked, and the entire battery component 10 is placed in a housing or the like, and filled with electrolytic fluid. Note that the battery component 10 may also be a component of a lithium-air battery, or a component of another type of battery.

Figure 3 schematically shows an example of a laminate 280 in which the negative electrode tab 204 and the negative electrode sub tab 206 have been welded. The tips of the multiple protrusions 210 are sandwiched between the negative electrode tab 204 and the negative electrode sub tab 206 and welded. The welding method may be resistance welding.

Figure 4 schematically shows an example of a laminate 380 in which the positive electrode tab 304 and positive electrode sub-tab 306 have been welded. The tips of the multiple protrusions 310 are sandwiched between the positive electrode tab 304 and positive electrode sub-tab 306 and welded. The welding method may be resistance welding.

Figure 5 schematically shows a portion of the negative electrode current collector 200. Figure 6 is a cross-sectional view taken along line X-X. The negative electrode current collector 200 has a resin layer 220, a metal layer 230, a metal layer 240, and a metal layer 260. The negative electrode current collector 200 is manufactured by forming metal on the resin layer 220, which has holes 250 formed therein. The metal layer 230 is located on the upper surface 222 of the resin layer 220, the metal layer 240 is located on the lower surface 224 of the resin layer 220, and the metal layer 260 is located on the inner surface 226 of the holes 250 in the resin layer 220. The metal layer 230 and the metal layer 240 are electrically connected by the metal layer 260.

The resin used in the resin layer 220 is a resin with lower conductivity but lower density than the metals in the metal layers 230, 240, and 260. Examples of resins for the resin layer 220 include, but are not limited to, PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene), and PPE (polyphenylene ether). For example, if the battery component 10 is a lithium-ion battery component, the metals in the metal layers 230, 240, and 260 are copper, and the resin in the resin layer 220 may be PET. The metals in the metal layers 230, 240, and 260 may be other metals. Furthermore, the resin in the resin layer 220 may be other resins.

Depending on the battery's application, there are cases where a low current is acceptable but a low weight is desirable. For example, in HAPS (High Altitude Platform Station), which flies in the stratosphere equipped with solar panels and batteries to provide wireless communication services to the ground, the battery output current can be low because the flight speed changes little, but the overall weight of the HAPS needs to be light. There are other applications where low current is acceptable but weight is required.

For example, in lithium-ion batteries, copper foil is often used as the negative electrode current collector. This requirement can be met by reducing the thickness of the copper foil. However, there are technical limitations to reducing the thickness of the copper foil, and if the thickness is made too thin, the strength cannot be maintained, increasing the likelihood of breakage. Because the negative electrode current collector 200 according to this embodiment has a resin layer 220 in the middle, its electrical resistance is higher compared to a negative electrode current collector made solely of metal, but its density can be reduced. Furthermore, the strength of the negative electrode current collector 200 can be maintained.

For example, if the metal is copper and the resin is PET, the density of copper is approximately 8.96 g/ ^cm³ and the density of PET is approximately 1.38 g/ ^cm³ . Therefore, the weight can be significantly reduced compared to when the negative electrode current collector is made of copper alone.

For example, if the thickness of the negative electrode current collector 200 is 8 μm, and the thickness of the resin layer 220 is ⁶ μm, the density will be approximately 3.25 g/cm³, resulting in a weight ratio of about 35% compared to a case made only of copper, and a weight reduction of about 65%. Furthermore, if the thickness of the resin layer 220 is 7 μm, the density will be approximately 2.30 g/ ^cm³ , resulting in a weight ratio of about 25% compared to a case made only of copper, and a weight reduction of about 75%.

If the negative electrode current collector is composed solely of metal, even if the negative electrode current collector is multilayered, conductive paths can be ensured by welding using ultrasonic welding, resistance welding, or laser welding, since the materials are metals (conductive materials). In contrast, conventional metal-plated resin films bond the metal to the resin using adhesive bonding, and it is not possible to bond the metal to the edges. Therefore, conductive paths cannot be ensured when multilayered. For this reason, resistance welding cannot be performed directly. Furthermore, because the properties of the metal layer and the resin layer differ in terms of boiling point, thermal expansion, and strength, problems such as rupture or residual voids may occur when attempting laser welding. Similarly, cracks or fractures may occur when attempting ultrasonic welding.

The negative electrode current collector 200 according to this embodiment has holes 250, and the metal layer 260 in the holes 250 ensures a conductive path between the metal layer 230 and the metal layer 240. To ensure a sufficient conductive path, it is necessary to adjust the size and number of holes 250, the thickness of the metal layer 260, etc. In this case, if the number of holes 250 is too large, the strength of the negative electrode current collector 200 will decrease, so it is better not to have too many holes 250, and in some cases, it is better to keep them to the minimum necessary. The required resistance of the holes 250 will change depending on the capacity of the battery in which the battery component 10 is used.

Table 1 below shows the experimental results of battery variation and strength when the size, number, and thickness of the metal layer within the holes 250 are selected so that the resistance range is 0.01 mΩ or less, 0.01 to 0.1 mΩ, 0.1 to 1.0 mΩ, and 1.0 mΩ or more. This experiment focuses on a negative electrode current collector 200 used in a 1 Ah battery. The negative electrode current collector 200 has a resin layer 220 made of PET, and metal layers 230, 240, and 260 made of copper. The holes 250 are formed within the region sandwiched between the negative electrode tab 204 and the negative electrode sub tab 206 of the protrusion 210, but outside the welding region, and the shape of the holes 250 is circular.

Battery variability was assessed by creating 100 battery cells with 250 holes under identical conditions. After removing defective cells, the resistance was measured, the average value was calculated, and the maximum and minimum values relative to the average were determined. In this experiment, a variability of ±3% was desirable ("◎"), ±5% was acceptable ("〇"), and anything exceeding 5% was marked "×". Strength was assessed by creating 100 battery cells with 250 holes under identical conditions and conducting a vibration test according to UN38.3. The average resistance change was assessed as follows: a variability of 3% or less was desirable ("◎"), within 5% was acceptable ("◎"), and anything exceeding 5% was marked "×".

If the resistance is 1 mΩ or higher, the battery variation becomes large, so a resistance of 1 mΩ or less is desirable. If the resistance is 0.01 mΩ or lower, the strength is insufficient, so a resistance higher than 0.01 mΩ is desirable.

Regarding the number and size of the holes 250, the number of layers in the negative electrode current collector 200 is proportional to the number of holes 250. Furthermore, the capacitance surface density is proportional to the number of holes 250. Also, the thickness of the metal within the holes 250, i.e., the thickness of the metal layer 260, is inversely proportional to the number of holes 250. Finally, the size and number of holes 250 are inversely proportional.

For example, if the capacity of the battery using the negative electrode current collector 200 is 1 Ah, and the positive electrode has one layer (the negative electrode has two layers on one side), and the diameter of the hole 250 is 50 μm, and the thickness of the metal layer 260 is 0.5 μm, then one or more holes 250 are required.

If the battery capacity is 5Ah, and the positive electrode has 20 layers (negative electrode has 19 layers on both sides and 2 layers on one side), and the diameter of the pores 250 is 100 μm, and the thickness of the metal layer 260 is 0.5 μm, then 50 or more pores 250 (2.5 pores 250 per sheet) are required.

If the battery capacity is 10Ah, and the positive electrode has 20 layers (negative electrode has 19 layers on both sides and 2 layers on one side), and the diameter of the pores 250 is 100 μm, and the thickness of the metal layer 260 is 0.5 μm, then more than 100 pores 250 (5 pores 250 per sheet) are required.

If the battery capacity is 5Ah, and the positive electrode has 40 layers (39 layers on both sides of the negative electrode, and 2 layers on one side), and the diameter of the pores 250 is 100 μm, and the thickness of the metal layer 260 is 0.5 μm, then more than 100 pores 250 (2.5 pores 250 per sheet) are required.

If the battery capacity is 5Ah, and the positive electrode has 20 layers (negative electrode has 19 layers on both sides and 2 layers on one side), and the diameter of the pores 250 is 100 μm, and the thickness of the metal layer 260 is 0.1 μm, then at least 250 pores 250 (12.5 pores 250 per sheet) are required.

If the battery capacity is 5Ah, and the positive electrode has 20 layers (negative electrode has 19 layers on both sides and 2 layers on one side), and the diameter of the pores 250 is 50 μm, and the thickness of the metal layer 260 is 0.5 μm, then more than 100 pores 250 (5 pores 250 per sheet) are required.

Figure 7 schematically shows a portion of the positive electrode current collector 300. Figure 8 is a cross-sectional view taken along the Y-Y line. The positive electrode current collector 300 has a resin layer 320, a metal layer 330, a metal layer 340, and a metal layer 360. The positive electrode current collector 300 is manufactured by forming metal on the resin layer 320, which has holes 350 formed therein. The metal layer 330 is located on the upper surface 322 of the resin layer 320, the metal layer 340 is located on the lower surface 324 of the resin layer 320, and the metal layer 360 is located on the inner surface 326 of the holes 350 in the resin layer 320. The metal layer 330 and the metal layer 340 are electrically connected by the metal layer 360.

The resin used in the resin layer 320 is a resin with lower conductivity but lower density than the metals in the metal layers 330, 340, and 360. Examples of resins for the resin layer 320 include, but are not limited to, PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene), and PPE (polyphenylene ether). For example, if the battery component 10 is a lithium-ion battery component, the metals in the metal layers 330, 340, and 360 are aluminum, and the resin in the resin layer 320 may be PET. The metals in the metal layers 330, 340, and 230 may be other metals. Furthermore, the resin in the resin layer 320 may be other resins.

For example, if the metals of metal layers 330, 340, and 360 are aluminum, then since the resistance of aluminum is twice that of copper, the same requirements as the negative electrode current collector 200 can be met by doubling the number of holes 250 or by approximately doubling the size of the holes 250 compared to the negative electrode current collector 200 using copper.

Figure 9 schematically shows an example of a projection 210 of the negative electrode current collector 200. Figure 9 schematically shows a top view of multiple stacked projections 210. The negative electrode tab 204 is positioned on the uppermost projection 210 and is resistance-welded at the welded portion 208.

The protruding portion 210 has a perforated portion 212 containing the hole 250 and a non-perforated portion 214 not containing the hole 250. The perforated portion 212 may include the hole 250 in the region corresponding to the welded portion 208, and may also include a hole 250 in the region other than the region corresponding to the welded portion 208, designed so that the resistance per 1 Ah of battery capacity using the negative electrode current collector 200 is higher than 0.01 mΩ and 1 mΩ or less.

If there is no hole 250 in the area corresponding to the weld area 208, a power supply is required for heating and dissolving the resin layer 220, and another power supply is required for resistance welding. This is because, since there is a time lag between discharges, one power supply is insufficient. Furthermore, various parameters such as current, pulse pattern, time, and pressure need to be adjusted, resulting in a very narrow range of welding conditions. Adjustments are also necessary each time the metal or resin material, and the thickness of the metal or resin, are different, and in some cases, these adjustments can take several days.

In contrast, by including the holes 250 in the region corresponding to the welded portion 208, a space can be provided to receive the resin of the resin layer 220 that has dissolved when the negative electrode tab 204 and the negative electrode Sub tab 206 are resistance welded. This allows for a single power supply to be required, a wider range of welding conditions, and completion in just a few hours even under unfavorable conditions. Furthermore, by including the holes 250 in the region other than the region corresponding to the welded portion 208, designed so that the resistance per 1 Ah of battery capacity in which the negative electrode current collector 200 is used is higher than 0.01 mΩ and less than or equal to 1 mΩ, even if the welded portion 208 becomes non-conductive, the minimum necessary conductivity can be achieved. Note that the perforated portion 212 may include the holes 250 only in the region corresponding to the welded portion 208 and in the region other than the region corresponding to the welded portion 208 that overlaps with the negative electrode tab 204. The region overlapping with the negative electrode tab 204 is sandwiched between the negative electrode tab 204 and the negative electrode sub tab 206. Because the adhesion between the layers is higher compared to other regions, this contributes to more reliable securing of the conductive path.

Figure 10 schematically shows another example of the projection 210 of the negative electrode current collector 200. Here, we will mainly explain the differences from Figure 9. The projection 210 illustrated in Figure 10 has a non-perforated portion 214 at its tip.

Figure 11 schematically shows another example of the protrusion 210 of the negative electrode current collector 200. Here, we will mainly explain the differences from Figure 9. The protrusion 210 illustrated in Figure 11 has a perforated portion 212 shaped to follow the shape of the negative electrode tab 204, and a non-perforated portion 214.

Figure 12 schematically shows another example of the protrusion 210 of the negative electrode current collector 200. Here, we will mainly explain the differences from Figure 9. The protrusion 210 illustrated in Figure 12 has a perforated portion 212 surrounding the welded portion 208, and a non-perforated portion 214 surrounding the perforated portion 212.

Figure 13 schematically shows another example of the projection 210 of the negative electrode current collector 200. Here, we will mainly explain the differences from Figure 9. The projection 210 illustrated in Figure 13 has a non-perforated portion 214 at its end and a perforated portion 212 on its inner side.

Figure 14 schematically shows another example of the protrusion 210 of the negative electrode current collector 200. Here, we will mainly explain the differences from Figure 9. The protrusion 210 illustrated in Figure 14 has a non-perforated portion 214 and a non-perforated portion 216 at the base and tip, and a perforated portion 212 in the middle.

Figure 15 schematically shows another example of the protrusion 210 of the negative electrode current collector 200. Here, we will mainly explain the differences from Figure 9. The protrusion 210 illustrated in Figure 15 is entirely a perforated portion 212. While the protrusion 210 of the negative electrode current collector 200 has been explained using Figures 9 to 15, the protrusion 310 of the positive electrode current collector 300 may be similar.

Figure 16 schematically shows another example of the battery component 10. As shown in Figure 16, the battery component 10 has a laminated battery 50. From the laminated battery 50, protrusions 210 of the negative electrode current collector 200 and 310 of the positive electrode current collector 300 protrude. For example, if the battery component 10 is a lithium-ion battery component, the negative electrode tab 204 and negative electrode sub-tab 206 are welded to the laminate 280, and the positive electrode tab 304 and positive electrode sub-tab 306 are welded to the laminate 380. The entire battery component 10 is then placed in a housing or the like to form a lithium-ion battery.

Figure 16 illustrates a case where the protrusions 210 and 310 are arranged in the same direction, but it is not limited to this. The protrusions 210 and 310 may be arranged in different directions. For example, the protrusions 210 and 310 may be arranged in opposite directions.

Figure 17 schematically shows an example of the functional configuration of the manufacturing system 400. The manufacturing system 400 includes an information acquisition unit 402, a design unit 404, a preparation unit 406, a hole forming unit 408, a current collector manufacturing unit 410, a lamination unit 412, a tab installation unit 414, and a battery manufacturing unit 416. However, it is not necessarily required that the manufacturing system 400 include all of these. For example, if the manufacturing system 400 is a system for manufacturing current collectors, it does not need to include the tab installation unit 414 and the battery manufacturing unit 416.

The manufacturing system 400 may consist of a single device. Alternatively, the manufacturing system 400 may consist of multiple devices.

The information acquisition unit 402 acquires various types of information. For example, the information acquisition unit 402 acquires information input via the input device of the manufacturing system 400. The information acquisition unit 402 also receives information from other devices, for example.

The information acquisition unit 402 acquires, for example, current collector information related to the current collector to be manufactured. The current collector information may include information about the resin in the current collector's resin layer. The current collector information may also include information about the metal in the current collector's metal layer.

The information acquisition unit 402 acquires, for example, battery information related to the battery to be manufactured. The battery information may include information on the battery's capacity. The battery information may include information on the number of layers in the battery. The battery information may include the number of negative electrodes 20, positive electrodes 30, and separators 40.

The information acquisition unit 402 may acquire negative electrode hole information regarding the holes 250 in the negative electrode current collector 200. The negative electrode hole information may include information about the location of the holes 250 formed in the negative electrode current collector 200. The negative electrode hole information may include information about the size and number of holes 250 formed in the negative electrode current collector 200. The negative electrode hole information may include information about the thickness of the metal within the holes 250 formed in the negative electrode current collector 200. The negative electrode hole information may include information about the spacing between the holes 250 formed in the negative electrode current collector 200.

The information acquisition unit 402 may acquire positive electrode hole information regarding the holes 350 in the positive electrode current collector 300. The positive electrode hole information may include information about the position of the holes 350 formed in the positive electrode current collector 300. The positive electrode hole information may include information about the size and number of holes 350 formed in the positive electrode current collector 300. The positive electrode hole information may include information about the thickness of the metal within the holes 350 formed in the positive electrode current collector 300. The positive electrode hole information may include information about the spacing between the holes 350 formed in the positive electrode current collector 300.

The design unit 404 performs the design of the negative electrode current collector 200 based on the information acquired by the information acquisition unit 402. For example, the design unit 404 performs the design of the negative electrode current collector 200 based on the current collector information and battery information acquired by the information acquisition unit 402. For example, the design unit 404 determines the size and number of holes 250 such that the resistance of each hole 250 per 1 Ah of battery capacity is 1 mΩ or less. Furthermore, the design unit 404 determines the position and size of the holes 250 and the spacing between the holes 250 so that the holes 250 of the vertically overlapping negative electrode current collectors 200 overlap at least partially. For example, the design unit 404 makes the spacing between the holes 250 smaller than the diameter of the holes 250 so that the holes 250 of the vertically overlapping negative electrode current collectors 200 overlap at least partially.

The design unit 404 performs the design of the positive electrode current collector 300 based on the information acquired by the information acquisition unit 402. For example, the design unit 404 performs the design of the positive electrode current collector 300 based on the current collector information and battery information acquired by the information acquisition unit 402. For example, the design unit 404 determines the size and number of holes 350 such that the resistance of each hole 350 per 1 Ah of battery capacity is 1 mΩ or less. Furthermore, the design unit 404 determines the position and size of the holes 350 and the spacing between the holes 350 so that the holes 350 of the vertically overlapping positive electrode current collectors 300 overlap at least partially. For example, the design unit 404 makes the spacing between the holes 350 smaller than the diameter of the holes 350 so that the holes 350 of the vertically overlapping positive electrode current collectors 300 overlap at least partially.

The preparation unit 406 prepares the resin layer 220. The preparation unit 406 may prepare a resin layer 220 with a thickness of 1 to 10 μm. Alternatively, the preparation unit 406 may prepare a resin layer 220 with a thickness of 3 to 7 μm. For example, the preparation unit 406 prepares a resin layer 220 of 1 μm. For example, the preparation unit 406 prepares a resin layer 220 of 3 μm. For example, the preparation unit 406 prepares a resin layer 220 of 2 μm. For example, the preparation unit 406 prepares a resin layer 220 of 4 μm. For example, the preparation unit 406 prepares a resin layer 220 of 5 μm. For example, the preparation unit 406 prepares a resin layer 220 of 6 μm. For example, the preparation unit 406 prepares a resin layer 220 of 7 μm. Preparation unit 406 prepares, for example, an 8 μm thick resin layer 220. Preparation unit 406 prepares, for example, a 9 μm thick resin layer 220. Preparation unit 406 prepares, for example, a 10 μm thick resin layer 220.

Preparation unit 406 prepares the resin layer 320. Preparation unit 406 may prepare a resin layer 320 with a thickness of 1 to 10 μm. Alternatively, preparation unit 406 may prepare a resin layer 320 with a thickness of 3 to 7 μm. Preparation unit 406 prepares, for example, a 1 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 2 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 3 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 4 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 5 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 6 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 7 μm thick resin layer 320. Preparation unit 406 prepares, for example, an 8 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 9 μm thick resin layer 320. Preparation unit 406 prepares, for example, a 10 μm thick resin layer 320.

The hole-forming unit 408 forms holes 250 in the resin layer 220 prepared by the preparation unit 406, holes that penetrate from the upper surface to the lower surface of the resin layer 220. The hole-forming unit 408 may form holes 250 of a size and number such that the resistance of the holes 250 per 1 Ah of battery capacity using the negative electrode current collector 200 is 1 mΩ or less. The hole-forming unit 408 forms holes 250 in the resin layer 220 according to, for example, the negative electrode hole information acquired by the information acquisition unit 402. The hole-forming unit 408 also forms holes 250 in the resin layer 220 according to, for example, the design by the design unit 404.

The shape of the holes 250 formed in the resin layer 220 by the hole-forming portion 408 may be circular. The diameter of the holes 250 may be, for example, 10 to 300 μm. The diameter of the holes 250 may be 50 to 150 μm. The shape of the holes 250 may be elliptical. The shape of the holes 250 may be polygonal. The shape of the holes 250 may be any other arbitrary shape. If the shape of the holes 250 is not circular, the size of the holes 250 may be the same as the size of the holes 250 when they are circular. For example, if the shape of the holes 250 is not circular, the size of the holes 250 may be the same as the circumference when the holes 250 are circular. When forming multiple holes 250 in the resin layer 220, the hole-forming portion 408 may form multiple holes 250 such that the distance between the centers of adjacent holes 250 is 20 to 500 μm. The hole-forming portion 408 may have multiple holes 250 formed such that the distance between the centers of adjacent holes 250 is 60 to 350 μm.

The hole-forming section 408 may form holes 250 in the resin layer 220 by, for example, chemical etching. The hole-forming section 408 may also form holes 250 in the resin layer 220 by an ultrasonic laser. The hole-forming section 408 may also form holes 250 in the resin layer 220 by drilling using a drilling drill. The hole-forming section 408 may also form holes 250 in the resin layer 220 by a gas laser.

The hole-forming unit 408 forms holes 350 in the resin layer 320 prepared by the preparation unit 406, holes that penetrate from the upper surface to the lower surface of the resin layer 320. The hole-forming unit 408 may form holes 350 of a size and number such that the resistance of the holes 350 per 1 Ah of battery capacity using the positive electrode current collector 300 is 1 mΩ or less. The hole-forming unit 408 forms holes 350 in the resin layer 320 according to, for example, the positive electrode hole information acquired by the information acquisition unit 402. The hole-forming unit 408 also forms holes 350 in the resin layer 320 according to, for example, the design by the design unit 404.

The shape of the holes 350 formed in the resin layer 320 by the hole-forming portion 408 may be circular. The diameter of the holes 350 may be 50 to 150 μm. The shape of the holes 350 may be elliptical. The shape of the holes 350 may be polygonal. The shape of the holes 350 may be any other arbitrary shape. If the shape of the holes 350 is not circular, the size of the holes 350 may be the same as the size of the holes 350 when they are circular. For example, if the shape of the holes 350 is not circular, the size of the holes 350 may be the same as the circumference when the holes 350 are circular. When forming multiple holes 350 in the resin layer 320, the hole-forming portion 408 may form multiple holes 350 such that the distance between the centers of adjacent holes 350 is 20 to 500 μm. The hole-forming portion 408 may have multiple holes 350 formed such that the distance between the centers of adjacent holes 350 is 60 to 350 μm.

The hole-forming section 408 may, for example, form holes 350 in the resin layer 320 by chemical etching. The hole-forming section 408 may also form holes 250 in the resin layer 220 by an ultrasonic laser. The hole-forming section 408 may also form holes 250 in the resin layer 220 by drilling using a drilling drill. The hole-forming section 408 may also form holes 250 in the resin layer 220 by a gas laser.

The current collector manufacturing unit 410 manufactures current collectors. The current collector manufacturing unit 410 manufactures a negative electrode current collector 200 in which the metal layer on the upper surface of the resin layer 220 and the metal layer on the lower surface of the resin layer 220 are electrically connected by the metal on the inner surface of the hole 250, by forming metal in the resin layer 220 with the hole 250 formed by the hole forming unit 408.

The current collector manufacturing unit 410 manufactures, for example, a negative electrode current collector 200 with a metal thickness of 0.1 to 2.0 μm on its upper surface. The current collector manufacturing unit 410 manufactures, for example, a negative electrode current collector 200 with a metal thickness of 0.3 to 1.0 μm on its upper surface. The current collector manufacturing unit 410 manufactures, for example, a negative electrode current collector 200 with a metal thickness of 0.1 to 2.0 μm on its lower surface. The current collector manufacturing unit 410 manufactures, for example, a negative electrode current collector 200 with a metal thickness of 0.3 to 1.0 μm on its lower surface.

If the ratio of the volume of metal on the inner surface of hole 250 to the volume of hole 250 is too large, the space for the resin to flow in during resistance welding will be reduced, resulting in greater variation in weld strength. If the ratio of the volume of metal on the inner surface of hole 250 to the volume of hole 250 is too small, the resistance will be high, and the variation in weld strength will also be large. In response to this, the inventors, through repeated experiments, found that by setting the ratio of the volume of metal on the inner surface of hole 250 to the volume of hole 250 to 0.3% or more, the variation in weld strength falls within a desirable range, and by setting it to 1% or more, the variation in weld strength falls within a particularly desirable range. Furthermore, through repeated experiments, the inventors found that by setting the ratio of the volume of metal on the inner surface of hole 250 to the volume of hole 250 to less than 20%, the variation in resistance and weld strength falls within a desirable range, and by setting it to less than 10%, the variation in resistance and weld strength falls within a particularly desirable range. The current collector manufacturing unit 410 manufactures, for example, a negative electrode current collector 200 in which the ratio of the volume of metal on the inner surface of the hole 250 to the volume of the hole 250 is 0.3 to 20%. The current collector manufacturing unit 410 also manufactures, for example, a negative electrode current collector 200 in which the ratio of the volume of metal on the inner surface of the hole 250 to the volume of the hole 250 is 1 to 10%.

The current collector manufacturing unit 410 manufactures a positive electrode current collector 300 by forming metal in the resin layer 320 in which the hole forming unit 408 has formed a hole 350. This ensures that the metal layer on the upper surface of the resin layer 320 and the metal layer on the lower surface of the resin layer 320 are electrically connected by the metal on the inner surface of the hole 250.

The current collector manufacturing unit 410 manufactures, for example, a positive electrode current collector 300 with a metal thickness of 0.1 to 2.0 μm on its upper surface. The current collector manufacturing unit 410 manufactures, for example, a positive electrode current collector 300 with a metal thickness of 0.3 to 1.0 μm on its upper surface. The current collector manufacturing unit 410 manufactures, for example, a positive electrode current collector 300 with a metal thickness of 0.1 to 2.0 μm on its lower surface. The current collector manufacturing unit 410 manufactures, for example, a positive electrode current collector 300 with a metal thickness of 0.3 to 1.0 μm on its lower surface. The current collector manufacturing unit 410 manufactures, for example, a positive electrode current collector 300 in which the ratio of the volume of metal on the inner surface of the hole 350 to the volume of the hole 350 is 0.3 to 20%. The current collector manufacturing unit 410 manufactures, for example, a positive electrode current collector 300 in which the ratio of the volume of metal on the inner surface of the hole 350 to the volume of the hole 350 is 1 to 10%.

The current collector manufacturing unit 410 may form metal on the resin layer 220 and the resin layer 320 using any known forming method. Examples of forming methods used by the current collector manufacturing unit 410 include, but are not limited to, sputtering, vapor deposition, plating (electroplating, electroless plating), ion plating, and molecular bonding.

The laminated section 412 is formed by laminating multiple negative electrode current collectors 200 and multiple positive electrode current collectors 300 manufactured by the current collector manufacturing section 410, multiple negative electrode mixtures and multiple positive electrode mixtures, and multiple separators. As illustrated in Figures 1 and 2, the laminated section 412 may have the negative electrode mixture 202 laminated in the region of the negative electrode current collector 200 other than the protruding portion 210, and the positive electrode mixture 302 laminated in the region of the positive electrode current collector 300 other than the protruding portion 310.

The tab mounting section 414 resistance-welds the protruding portions 210 of multiple negative electrode current collectors 200 by sandwiching them between negative electrode tabs 204 and negative electrode sub-tabs 206. The thickness of the negative electrode tabs 204 may be 100 to 300 μm. The thickness of the negative electrode sub-tabs 206 may be 50 to 100 μm. The tab mounting section 414 resistance-welds the protruding portions 310 of multiple positive electrode current collectors 300 by sandwiching them between positive electrode tabs 304 and positive electrode sub-tabs 306. The thickness of the positive electrode tabs 304 may be 100 to 300 μm. The thickness of the positive electrode sub-tabs 306 may be 50 to 100 μm. As the resistance welding apparatus, for example, a precision resistance welding machine of the NAG system can be used.

The battery manufacturing unit 416 manufactures a battery having multiple negative electrode current collectors 200, multiple negative electrode mixtures, multiple positive electrode current collectors 300, multiple positive electrode mixtures, multiple separators, a negative electrode tab 204, a negative electrode sub-tab 206, a positive electrode tab 304, and a positive electrode sub-tab 306. For example, the battery manufacturing unit 416 manufactures the battery by placing the battery component 10, in which the negative electrode tabs 204, negative electrode sub-tabs 206, positive electrode tabs 304, and positive electrode sub-tabs 306 have been installed by the tab installation unit 414, into a housing and performing operations according to the type of battery, such as injecting electrolyte.

Figure 18 schematically shows an example of the processing flow by the manufacturing system 400. Here, the processing flow of the manufacturing system 400 acquiring battery information and manufacturing batteries according to that information is schematically shown.

In step 102 (sometimes abbreviated as S), the information acquisition unit 402 acquires battery information. In step S104, the design unit 404 executes the design based on the battery information acquired by the information acquisition unit 402 in S102.

In S106, the preparation unit 406 prepares the resin layer 220. In S108, the hole forming unit 408 forms holes 250 in the resin layer 220 according to the design by the design unit 404. In S110, the current collector manufacturing unit 410 forms metal in the resin layer 220 in which the holes 250 have been formed.

If the manufacturing of the current collector is complete (YES in S112), proceed to S114; otherwise, return to S106. In S106, if the manufacturing of the negative electrode current collector 200 is not complete, the preparation unit 406 prepares the resin layer 220; otherwise, it prepares the resin layer 320.

In S114, the lamination section 412 laminates the manufactured negative electrode current collectors 200 and positive electrode current collectors 300 with multiple negative electrode mixtures, multiple positive electrode mixtures, and multiple separators 40. In S116, the tab installation section 414 resistance welds the protruding portions 210 of the multiple negative electrode current collectors 200 by sandwiching them between negative electrode tabs 204 and negative electrode sub tabs 206, and resistance welds the protruding portions 310 of the multiple positive electrode current collectors 300 by sandwiching them between positive electrode tabs 304 and positive electrode sub tabs 306. In S118, the battery manufacturing section 416 manufactures the battery. The process then ends.

Figure 18 illustrates the process flow of the manufacturing system 400 in manufacturing batteries. However, when the manufacturing system 400 manufactures current collectors, the process may be terminated in S112 when the manufacturing of the current collectors is completed.

In the above embodiment, the case in which holes are provided in both the negative electrode current collector 200 and the positive electrode current collector 300 has been mainly described, but it is not limited to this. Holes may be formed only in the negative electrode current collector 200 of the negative electrode current collector 200 and the positive electrode current collector 300. In this case, the preparation unit 406 may prepare a resin layer to be used to produce the negative electrode current collector 200, as well as a plurality of positive electrode current collectors. The lamination unit 412 may laminate a plurality of negative electrode current collectors 200 manufactured by the current collector manufacturing unit 410, a plurality of positive electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode mixtures, and a plurality of separators prepared by the preparation unit 406. The tab installation unit 414 may resistance weld the protruding portions 210 of the plurality of negative electrode current collectors 200 by sandwiching them between the negative electrode tabs 204 and the negative electrode Sub tabs 206. The tab mounting section 414 may be welded by sandwiching the protruding portions of multiple positive electrode current collectors between positive electrode tabs and positive electrode sub tabs. The battery manufacturing section 416 may manufacture a battery having multiple negative electrode current collectors 200, multiple negative electrode mixtures, multiple positive electrode current collectors, multiple positive electrode mixtures, multiple separators, negative electrode tabs 204, negative electrode sub tabs 206, positive electrode tabs, and positive electrode sub tabs.

The holes may be formed only on the positive electrode current collector 300 of the negative electrode current collector 200 and positive electrode current collector 300. In this case, the preparation section 406 may prepare a resin layer to be used to produce the positive electrode current collector 300, as well as a plurality of negative electrode current collectors. The lamination section 412 may laminate a plurality of positive electrode current collectors 300 manufactured by the current collector manufacturing section 410 with a plurality of negative electrode current collectors, a plurality of negative electrode mixtures, a plurality of positive electrode mixtures, and a plurality of separators prepared by the preparation section 406. The tab installation section 414 may resistance weld the protruding portions 310 of the plurality of positive electrode current collectors 300 by sandwiching them between positive electrode tabs 304 and positive electrode sub tabs 306. The tab installation section 414 may weld the protruding portions of the plurality of negative electrode current collectors by sandwiching them between negative electrode tabs and negative electrode sub tabs. The battery manufacturing unit 416 may manufacture a battery having multiple negative electrode current collectors, multiple negative electrode mixtures, multiple positive electrode current collectors 300, multiple positive electrode mixtures, multiple separators, negative electrode tabs, negative electrode sub-tabs, positive electrode tabs 304, and positive electrode sub-tabs 306.

Figure 19 schematically shows an example of the hardware configuration of a computer 1200 functioning as a manufacturing system 400. A program installed on the computer 1200 can cause the computer 1200 to function as one or more "parts" of the apparatus according to this embodiment, or to execute operations associated with the apparatus according to this embodiment or such one or more "parts," and/or to execute a process or a stage of such process according to this embodiment. Such a program may be executed by the CPU 1212 to cause the computer 1200 to execute specific operations associated with some or all of the blocks in the flowcharts and block diagrams described herein.

The computer 1200 according to this embodiment includes a CPU 1212, RAM 1214, and a graphics controller 1216, which are interconnected by a host controller 1210. The computer 1200 also includes input/output units such as a communication interface 1222, a storage device 1224, a DVD drive, and an IC card drive, which are connected to the host controller 1210 via an input/output controller 1220. The DVD drive may be a DVD-ROM drive and a DVD-RAM drive, etc. The storage device 1224 may be a hard disk drive and a solid-state drive, etc. The computer 1200 also includes legacy input/output units such as a ROM 1230 and a keyboard, which are connected to the input/output controller 1220 via an input/output chip 1240.

The CPU 1212 operates according to the programs stored in the ROM 1230 and RAM 1214, thereby controlling each unit. The graphics controller 1216 acquires image data generated by the CPU 1212 and stores it in the frame buffer provided in RAM 1214 or within itself, and displays the image data on the display device 1218.

The communication interface 1222 communicates with other electronic devices via the network. The storage device 1224 stores programs and data used by the CPU 1212 in the computer 1200. The DVD drive reads programs or data from a DVD-ROM or similar and provides them to the storage device 1224. The IC card drive reads programs and data from an IC card and/or writes programs and data to an IC card.

The ROM 1230 stores boot programs and/or hardware-dependent programs of the computer 1200, which are executed by the computer 1200 upon activation. The input/output chip 1240 may also connect various input/output units to the input/output controller 1220 via USB ports, parallel ports, serial ports, keyboard ports, mouse ports, etc.

The program is provided on a computer-readable storage medium such as a DVD-ROM or IC card. The program is read from the computer-readable storage medium and installed on a storage device 1224, RAM 1214, or ROM 1230 (examples of computer-readable storage media), and executed by the CPU 1212. The information processing described within these programs is read by the computer 1200, resulting in coordination between the program and the various types of hardware resources described above. The apparatus or method may be configured to realize the operation or processing of information in accordance with the use of the computer 1200.

For example, when communication is performed between computer 1200 and an external device, the CPU 1212 may execute a communication program loaded into RAM 1214 and, based on the processing described in the communication program, instruct the communication interface 1222 to perform communication processing. Under the control of the CPU 1212, the communication interface 1222 reads transmission data stored in a transmission buffer area provided in a recording medium such as RAM 1214, storage device 1224, DVD-ROM, or IC card, transmits the read transmission data to the network, or writes received data from the network to a reception buffer area provided on the recording medium.

Furthermore, the CPU 1212 may read all or necessary parts of files or databases stored on external recording media such as the storage device 1224, DVD drive (DVD-ROM), or IC card into the RAM 1214, and perform various types of processing on the data in the RAM 1214. The CPU 1212 may then write the processed data back to the external recording media.

Various types of information, such as various types of programs, data, tables, and databases, may be stored on the recording medium and subjected to information processing. The CPU 1212 may perform various types of processing on the data read from the RAM 1214, including various types of operations, information processing, conditional judgments, conditional branching, unconditional branching, information retrieval/replacement, etc., as described throughout this disclosure and specified by the program instruction sequence, and write the results back to the RAM 1214. The CPU 1212 may also retrieve information in files, databases, etc., within the recording medium. For example, if multiple entries are stored in the recording medium, each having an attribute value of a first attribute associated with an attribute value of a second attribute, the CPU 1212 may search among these multiple entries for an entry that matches the specified condition for the attribute value of the first attribute, read the attribute value of the second attribute stored in that entry, and thereby obtain the attribute value of the second attribute associated with the first attribute that satisfies the predetermined condition.

The program or software module described above may be stored on or near the computer 1200 in a computer-readable storage medium. Alternatively, a recording medium such as a hard disk or RAM provided within a server system connected to a dedicated communication network or the Internet can be used as a computer-readable storage medium, thereby providing the program to the computer 1200 via the network.

In this embodiment, blocks in the flowchart and block diagram may represent stages in a process in which an operation is performed, or "parts" of a device that have the role of performing an operation. Specific stages and "parts" may be implemented by dedicated circuits, programmable circuits supplied with computer-readable instructions stored on a computer-readable storage medium, and/or processors supplied with computer-readable instructions stored on a computer-readable storage medium. Dedicated circuits may include digital and/or analog hardware circuits, and may include integrated circuits (ICs) and/or discrete circuits. Programmable circuits may include reconfigurable hardware circuits, such as field-programmable gate arrays (FPGAs) and programmable logic arrays (PLAs), which include logical AND, logical OR, exclusive OR, negated AND, negated OR, and other logical operations, flip-flops, registers, and memory elements.

A computer-readable storage medium may include any tangible device capable of storing instructions that can be executed by a suitable device. As a result, a computer-readable storage medium having instructions stored therein will comprise a product containing instructions that can be executed to create means for performing operations specified in a flowchart or block diagram. Examples of computer-readable storage media may include electronic storage media, magnetic storage media, optical storage media, electromagnetic storage media, semiconductor storage media, etc. More specific examples of computer-readable storage media may include floppy disks (registered trademark), diskettes, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), electrically erasable programmable read-only memory (EEPROM), static random access memory (SRAM), compact disk read-only memory (CD-ROM), digital multipurpose discs (DVDs), Blu-ray (registered trademark) discs, memory sticks, integrated circuit cards, etc.

Computer-readable instructions may include assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages such as Smalltalk®, Java®, C++, and conventional procedural programming languages such as the C programming language or similar languages.

Computer-readable instructions may be provided to a general-purpose computer, a special-purpose computer, or a programmable circuit's processor or programmable circuit, either locally or via a local area network (LAN), the Internet, or other wide area network (WAN), for the purpose of executing the computer-readable instructions to generate means for performing operations specified in a flowchart or block diagram. Examples of processors include computer processors, processing units, microprocessors, digital signal processors, controllers, and microcontrollers.

Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. It is clear from the claims that such modified or improved forms may also be included within the technical scope of the present invention.

The execution order of operations, procedures, steps, and stages in the devices, systems, programs, and methods described in the claims, specifications, and drawings is not explicitly stated as "before" or "prior to," and it should be noted that these processes can be implemented in any order unless the output of a previous process is used in a later process. Even if phrases such as "first," and "next" are used for convenience in describing the operation flow in the claims, specifications, and drawings, this does not mean that the process must be performed in that order.

10 Battery components, 20 Negative electrode, 30 Positive electrode, 40 Separator, 50 Laminated battery, 200 Negative electrode current collector, 202 Negative electrode mixture, 204 Negative electrode tab, 206 Negative electrode sub tab, 208 Welded part, 210 Protrusion, 212 Perforated part, 214 Non-perforated part, 216 Non-perforated part, 220 Resin layer, 222 Top surface, 224 Bottom surface, 226 Inner surface, 230 Metal layer, 240 Metal layer, 250 Hole, 260 Metal layer, 280 Laminate, 300 Positive electrode current collector, 302 Positive electrode mixture, 304 Positive electrode tab, 306 Positive electrode sub tab, 310 Protrusion, 320 Resin layer, 322 Top surface, 324 Bottom surface, 326 Inner surface, 330 Metal layer, 340; Metal layer, 350; Hole, 360; Metal layer, 380; Laminate, 400; Manufacturing system, 402; Information acquisition unit, 404; Design unit, 406; Preparation unit, 408; Hole formation unit, 410; Current collector manufacturing unit, 412; Lamination unit, 414; Tab installation unit, 416; Battery manufacturing unit, 1200; Computer, 1210; Host controller, 1212; CPU, 1214; RAM, 1216; Graphics controller, 1218; Display device, 1220; Input/output controller, 1222; Communication interface, 1224; Storage device, 1230; ROM, 1240; Input/output chip

Claims (5)

It is a current collector,
It comprises multiple negative electrodes and multiple positive electrodes stacked alternately with a separator in between,
Each of the aforementioned plurality of negative electrodes comprises two negative electrode mixtures and a negative electrode current collector sandwiched between the two negative electrode mixtures.
Each of the plurality of positive electrodes comprises two positive electrode mixtures and a positive electrode current collector sandwiched between the two positive electrode mixtures.
The negative electrode current collector includes a stacked portion and a protruding portion extending from the stacked portion.
The aforementioned negative electrode current collector is
A resin layer having multiple holes penetrating from the top surface to the bottom surface,
The resin layer includes a metal layer formed on the upper surface, a metal layer formed on the lower surface, and a metal layer formed on the inner surface of the plurality of holes.
The resin of the aforementioned resin layer is PET (polyethylene terephthalate),
The thickness of the resin layer is 1 to 10 μm.
The metal layer on the upper surface of the resin layer , the metal layer on the lower surface of the resin layer, and the metal layer in the plurality of holes are made of copper.
The thickness of the metal layer on the upper surface of the resin layer is 0.1 to 2.0 μm.
The thickness of the metal layer on the lower surface of the resin layer is 0.1 to 2.0 μm.
The plurality of holes are formed within the region of the negative electrode current collector that is sandwiched between the negative electrode tab and the negative electrode sub tab of the protruding portion, but outside the region that is welded.
The number of holes in the multiple negative electrode current collectors is uniform,
The shape of the aforementioned plurality of holes is circular.
The distance between the centers of adjacent holes in the aforementioned plurality of holes is 20 to 500 μm.
The metal layer on the upper surface of the resin layer and the metal layer on the lower surface of the resin layer are electrically connected by the metal layers on the inner surfaces of the plurality of holes.
The size, number, and thickness of the metal layer on the inner surface of the plurality of holes are such that, for every 1 Ah of battery capacity in which the current collector is used , the resistance of the conductive path formed by the plurality of metal layers on the upper surface, the metal layers in the plurality of holes, and the metal layer on the lower surface of the current collector is greater than 0.01 mΩ and less than or equal to 1 mΩ.
Current collector. The current collector according to claim 1, wherein the ratio of the volume of the metal layer on the inner surface of the hole to the volume of the hole is 0.3 to 20%. The current collector according to claim 2, wherein the ratio of the volume of the metal layer on the inner surface of the hole to the volume of the hole is 1 to 10%. A battery having a current collector according to any one of claims 1 to 3. A HAPS (Hyper-Aided Spatial Communication System) equipped with the battery described in claim 4, which flies in the stratosphere and provides wireless communication services to the ground.