JP7836713B2 - Component mounting machine - Google Patents

Description

The technology disclosed herein relates to a component mounting machine for mounting electronic components onto a substrate.

Some component mounting machines, which mount electronic components onto a substrate, use a nozzle to attract the components and then move them to the substrate. In this type of component mounting machine, a check is performed to determine if there are any abnormalities in the attachment state of the electronic component to the nozzle. For example, Patent Document 1 discloses a component mounting machine equipped with an imaging device that images the nozzle and the electronic component attracted to the nozzle. The image captured by the imaging device is used to confirm the attachment state of the electronic component to the nozzle. In Patent Document 1, the imaging device is installed to move integrally with the head that holds the nozzle.

Patent Application No. 2020-107638

In the component mounting machine described in Patent Document 1, the imaging device that images the nozzle and the electronic component attached to the nozzle is installed in a position that moves integrally with the head. Therefore, the part that moves with the head due to the imaging device becomes large, which creates a problem in that it becomes difficult to move the head at high speed.

This specification discloses a technology for enabling the head to move at high speed.

The component mounting machine disclosed herein mounts electronic components onto a substrate. The component mounting machine comprises a nozzle for picking up electronic components, a head for detachably holding the nozzle, a moving device for moving the head, and an imaging device for imaging the nozzle and the electronic components picked up by the nozzle. The imaging device is positioned so as not to be moved by the moving device, and so as to be able to image the nozzle and the electronic components picked up by the nozzle from the side.

In the component mounting machine described above, the imaging device is positioned in a location that is not moved by the moving mechanism. That is, the imaging device images the nozzle and the electronic component attached to the nozzle without moving with the head. Therefore, it is possible to avoid increasing the size of the part that moves with the head due to the imaging device, enabling high-speed movement of the head.

A diagram showing the schematic configuration of the component mounting machine according to Examples 1 and 2. Cross-sectional view along line II-II in Figure 1. A perspective view showing the configuration of the first imaging device, light source, parts feeder, and feeder holding unit. A block diagram showing the control system of the component mounting machine according to Examples 1 and 2. A flowchart illustrating an example of a process for determining whether a nozzle has properly attracted an electronic component. This figure shows an example of an image captured when the nozzle properly attracts an electronic component. This figure shows an example of an image captured when the nozzle is not properly adsorbing the electronic component. This figure shows an example of an image captured when the parts feeder is not properly held in the feeder holder.

The main features of the embodiments described below are listed. Note that the technical elements described below are independent elements that exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

The component mounting machine disclosed herein may further comprise a supply device for supplying electronic components and a holding unit that detachably holds the supply device. An imaging device may be supported by the holding unit. Such a configuration allows the imaging device to be positioned in a suitable location.

The component mounting machine disclosed herein may further include a supply device for supplying electronic components. The imaging device may be configured to further image at least a portion of the area between the supply device and the substrate, where the nozzle held by the head is moved by the moving device. The component mounting machine may further include a determination unit that determines, based on the image captured by the imaging device, whether the nozzle held by the head interferes within the component mounting machine. With such a configuration, it is possible to determine, using the image captured by the imaging device, whether the nozzle held by the head interferes with components within the component mounting machine when the head is moved within the imaging range by the moving device. For example, when determining nozzle interference within the component mounting machine using sensors, it can be difficult to optimize the interference location where the nozzle interferes with components within the component mounting machine, and the placement of the sensor for determining whether or not there is interference at that interference location. For example, it may not be possible to place the sensor at a desired location near the interference location, forcing the adoption of a complex structure. Since nozzle interference within the component mounting machine is determined from the captured image, it is possible to easily confirm nozzle interference within the component mounting machine.

In the component mounting machine disclosed herein, the imaging device may include a camera and a light source. The camera may be positioned to capture images of the nozzle and the imaging surface of the electronic component attached to the nozzle. The light source may be positioned to illuminate the nozzle and the surface of the electronic component attached to the nozzle that is opposite to the imaging surface. Such a configuration allows for suitable imaging of the nozzle and the electronic component attached to the nozzle.

(Example 1)
Referring to the drawings, a component mounting machine 10 according to an embodiment will be described. The component mounting machine 10 is a device for mounting electronic components 4 onto a circuit board 2. The component mounting machine 10 is also called an electronic component mounting device or a chip mounter. Typically, the component mounting machine 10 is installed together with other circuit board work machines such as a solder printing machine and a circuit board inspection machine to form a series of mounting lines.

As shown in Figures 1 and 2, the component mounting machine 10 comprises a plurality of component feeders 12, a feeder holding unit 14, a head 16, a head moving device 18, a substrate conveyor 20, a first imaging device 30, a light source 34, a second imaging device 40, a component retrieval unit 42, a control device 26, and a touch panel 24. A management device 8, configured to communicate with the component mounting machine 10, is located outside the component mounting machine 10. Note that in Figure 1, the first imaging device 30 and the light source 34 are omitted from the illustration for clarity.

Each component feeder 12 contains multiple electronic components 4. The component feeders 12 are detachably attached to the feeder holder 14 and supply the electronic components 4 to the head 16. The specific configuration of the component feeders 12 is not particularly limited. Each component feeder 12 may be, for example, a tape-type feeder supplying multiple electronic components 4 contained on a tape, a tray-type feeder supplying multiple electronic components 4 contained on a tray, or a bulk-type feeder supplying multiple electronic components 4 randomly contained in a container.

The feeder holder 14 has multiple slots, and a component feeder 12 can be detachably installed in each of these slots. In this embodiment, the feeder holder 14 was fixedly mounted on the component mounting machine 10, but it may also be detachable from the component mounting machine.

The head 16 has a nozzle 6 for attracting electronic components 4. The nozzle 6 is detachably attached to the head 16. The head 16 is movable in the Z direction (here, the vertical direction), allowing the nozzle 6 to move closer to and further away from the component feeder 12 and the circuit board 2. The head 16 can attract electronic components 4 from the component feeder 12 using the nozzle 6, and can also mount the attracted electronic components 4 onto the circuit board 2.

The head moving device 18 moves the head 16 between the parts feeder 12 and the circuit board 2. In this example, the head moving device 18 is an XY robot that moves the moving base 18a in the X and Y directions, and the head 16 is fixed to the moving base 18a. The head moving device 18 can move the nozzle 6 in parallel on a plane (XY plane) parallel to the surface of the circuit board 2. Note that the head 16 is not limited to being fixed to the moving base 18a; it may also be detachably attached to the moving base 18a.

The circuit board conveyor 20 is a device for loading, positioning, and unloading circuit boards 2. In this embodiment, the circuit board conveyor 20 includes a pair of belt conveyors and a support device (not shown) that supports the circuit boards 2 from below.

As shown in Figures 2 and 3, the first imaging device 30 is positioned on the feeder holding section 14. The first imaging device 30 is supported by a support section 32, which is fixed to the feeder holding section 14. The first imaging device 30 is positioned outside the multiple slots of the feeder holding section 14 (on the +X side in Figures 2 and 3). When component feeders 12 are inserted into the multiple slots of the feeder holding section 14, the supply positions of the electronic components 4 of the multiple component feeders 12 (hereinafter also referred to as "component supply positions") align on a straight line perpendicular to the insertion direction of the component feeders 12. The first imaging device 30 is positioned on the straight line where the component supply positions of the multiple component feeders 12 are aligned. For example, a CCD camera may be used as the first imaging device 30. The first imaging device 30 is installed so that its imaging direction is perpendicular to the insertion direction of the component feeder 12. It images the nozzle 6 that has picked up the electronic component 4 at the component supply position of the component feeder 12, and the picked-up electronic component 4, from the side.

The light source 34 is positioned on the feeder holding unit 14. The light source 34 is supported by a support unit 36, which is fixed to the feeder holding unit 14. The light source 34 is positioned on the outside of the multiple slots opposite to the location where the first imaging device 30 is installed (on the -X direction in Figures 2 and 3). Furthermore, the light source 34 is positioned on a straight line where the component supply positions of the multiple component feeders 12 are aligned. That is, the component supply positions of the multiple component feeders 12 are positioned between the first imaging device 30 and the light source 34. The light source 34 is composed of LEDs and is positioned to irradiate light toward the imaging surface of the first imaging device 30. Therefore, the first imaging device 30 images the nozzle 6 holding the electronic component 4 and the held electronic component 4 while they are illuminated from behind.

The second imaging device 40 is positioned between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20). The second imaging device 40 includes a camera and a light source (not shown). The camera of the second imaging device 40 is positioned so that its imaging direction faces upward, and it images the nozzle 6 from below while the electronic component 4 is being held in place. That is, when the nozzle 6 holds the electronic component 4, the camera photographs the underside of the electronic component 4 held by the nozzle 6. For example, a CCD camera is used for the camera of the second imaging device 40. The light source is composed of LEDs and illuminates the underside (imaging surface) of the electronic component 4 held by the nozzle 6. The image data of the image captured by the second imaging device 40 is stored in the memory (not shown) of the control device 26.

The component recovery unit 42 recovers electronic components 4 supplied from the component feeder 12 that were not properly picked up by the nozzle 6. When the nozzle 6 picks up the electronic components 4 supplied from the component feeder 12, the electronic components 4 may be picked up at a position misaligned from the appropriate pick-up position on the nozzle 6. If the electronic components 4 are not properly picked up by the nozzle 6, they cannot be mounted in the correct position on the circuit board 2. Electronic components 4 that are determined not to be properly picked up by the nozzle 6 are not mounted on the circuit board 2 and are instead stored in the component recovery unit 42.

The control device 26 is configured using a computer equipped with a CPU and a memory device. The control device 26 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in Figure 4, the control device 26 is connected to the head movement device 18, the substrate conveyor 20, the touch panel 24, the first imaging device 30, and the second imaging device 40, and controls each part of the head movement device 18, the substrate conveyor 20, the touch panel 24, the first imaging device 30, and the second imaging device 40. The touch panel 24 is a display device that provides various information about the component mounting machine 10 to the operator, and also an input device that receives instructions and information from the operator.

Next, we will explain the process of determining whether the electronic component 4 has been properly attracted to the nozzle 6 using the image captured by the first imaging device 30. First, the control device 26 moves the nozzle 6 above the component supply position of the component feeder 12 (S12). Specifically, the control device 26 moves the moving base 18a so that the nozzle 6 is positioned above the component supply position of the component feeder 12.

Next, the control device 26 causes the nozzle 6 to attract the electronic component 4 (S14). Specifically, the control device 26 controls the head 16 so that the nozzle 6 descends. When the nozzle 6 contacts the electronic component 4, the nozzle 6 attracts the electronic component 4. Once the nozzle 6 has attracted the electronic component 4, the control device 26 controls the head 16 so that the nozzle 6 rises.

Next, the control device 26 uses the first imaging device 30 to image the electronic component 4 attracted to the nozzle 6 and the nozzle 6 (S16). As described above, the first imaging device 30 is positioned to image the component supply position of the component feeder 12. Therefore, when imaging is performed with the first imaging device 30, the nozzle 6 located above the component supply position of the component feeder 12 and the electronic component 4 attracted to the nozzle 6 are also imaged.

Next, the control device 26 determines from the image captured in step S16 whether the nozzle 6 is properly adsorbing the electronic component 4 (S18). Specifically, the control device 26 identifies the nozzle 6 and the electronic component 4 in the image captured in step S16 and detects the orientation of the electronic component 4 while it is adsorbed by the nozzle 6. Then, the control device 26 determines whether the detected orientation of the electronic component 4 is appropriate.

For example, in the image captured in Figure 6, the upper surface of the electronic component 4 is in contact with the lower end of the nozzle 6, and both the upper and lower surfaces of the electronic component 4 are horizontal. In such an image, the control device 26 determines that the nozzle 6 is properly attracting the electronic component 4.

On the other hand, if the captured image is not like that of Figure 6, the control device 26 determines that the nozzle 6 is not properly adsorbing the electronic component 4. For example, in the captured image of Figure 7, the upper surface of the electronic component 4 is not in contact with the lower end of the nozzle 6, and both the upper and lower surfaces of the electronic component 4 are tilted, not horizontal. In other words, the nozzle 6 is not adsorbing the upper surface of the electronic component 4. In the case of such an captured image, the control device 26 determines that the nozzle 6 is not properly adsorbing the electronic component 4.

If the nozzle 6 properly attracts the electronic component 4 (YES in step S18), the control device 26 mounts the electronic component 4 attracted by the nozzle 6 onto the circuit board 2 (S20). On the other hand, if the nozzle 6 does not properly attract the electronic component 4 (NO in step S18), the control device 26 collects the electronic component 4 attracted by the nozzle 6 into the component recovery unit 42 (S22).

In this embodiment, the first imaging device 30 and the light source 34 are supported by the feeder holding unit 14. In conventional component mounting machines, the imaging device that images the nozzle 6 from the side was installed to move integrally with the head 16. That is, the imaging device that images the nozzle 6 from the side had a configuration in which it was fixed to the moving base 18a in this embodiment. When the imaging device is installed to move integrally with the head 16, the imaging device and its light source need to be lightweight and compact, and also need to be vibration resistant. In this embodiment, since the first imaging device 30 and the light source 34 are supported by the feeder holding unit 14, it is not necessary to install the imaging device and its light source that images the nozzle 6 with the electronic component 4 attached from the side to move integrally with the head 16 (i.e., on the moving base 18a). This makes it possible to miniaturize the part that moves integrally with the head 16. As a result, it becomes possible to move the head 16 at high speed, and productivity can be improved. Furthermore, since the first imaging device 30 and light source 34 do not move integrally with the head 16, the requirements for lightness, compactness, and vibration resistance are reduced compared to imaging devices and light sources that move integrally with the head 16. Therefore, the range of selection for the imaging device and light source used as the first imaging device 30 and light source 34 can be expanded. For example, the first imaging device 30 and light source 34 can be designed with improved maintainability or without prioritizing miniaturization. Also, because miniaturization is not a priority for the first imaging device 30 and light source 34, less expensive options can be used, potentially reducing costs.

Furthermore, if the imaging device and light source are installed to move integrally with the head 16, as in conventional component mounting machines, constraints arise on the installation position of the imaging device and light source, making it impossible to position them so as to sandwich the nozzle 6. In other words, the light source cannot be placed behind the nozzle 6, and the imaging device and light source may be placed in front of the nozzle 6. In this case, in order to image the nozzle 6 and electronic component 4, it becomes necessary to install a reflector that reflects the light from the light source in order to illuminate the nozzle 6 and electronic component 4 from behind, and to move the nozzle 6 and electronic component 4 in front of the reflector so that they can be imaged by the imaging device and light source. In this embodiment, since the first imaging device 30 and light source 34 are not installed on the moving base 18a, the constraints on the installation position of the first imaging device 30 and light source 34 are relatively reduced, and the first imaging device 30 and light source 34 can be positioned such that the nozzle 6 and the electronic component 4 attracted by the nozzle 6 are located between the first imaging device 30 and light source 34. In other words, the first imaging device 30 and light source 34 can be installed in a position suitable for imaging the nozzle 6 and electronic component 4. Therefore, it is not necessary to move the nozzle 6, the first imaging device 30, and the light source 34 to specific positions in order to image the nozzle 6 and the electronic component 4, thus shortening the time required to image the nozzle 6 and the electronic component 4.

In this embodiment, the first imaging device 30 and the light source 34 were supported by the feeder holding unit 14, but the configuration is not limited to this. The first imaging device 30 and the light source 34 only need to be positioned above the component supply position of the component feeder 12, allowing them to image the nozzle 6 that has picked up the electronic component 4 from the side. For example, the first imaging device 30 and the light source 34 may be fixed to the base of the component mounting machine 10 on which the feeder holding unit 14 is supported.

(Example 2)
In the above embodiment 1, the control device 26 determined whether the electronic component 4 was properly attracted to the nozzle 6 using the image captured by the first imaging device 30, but the configuration is not limited to this. For example, the control device 26 may also determine whether the nozzle 6 interferes with other members, etc., using the image captured by the first imaging device 30. For example, when the component feeder 12 is installed in the slot of the feeder holding unit 14, if the component feeder 12 is not properly inserted into the slot, the component feeder 12 will be displaced from its proper position in the slot. Specifically, as shown in Figure 8, the tip of the component feeder 12 in the insertion direction may lift up. If the nozzle 6 is moved above the component supply position of the component feeder 12 in this state, the tip of the nozzle 6 may interfere with the lifted portion of the component feeder 12. In this embodiment, it is detected whether there is a member that interferes with the nozzle 6 within the range of movement of the nozzle 6 (more specifically, the range captured by the first imaging device 30).

The process of determining whether the parts feeder 12 is properly installed (i.e., determining whether there are any components interfering with the nozzle 6) using the image captured by the first imaging device 30 will be described. When the parts feeder 12 is inserted into the slot, the control device 26 uses the first imaging device 30 to image the parts supply position of the parts feeder 12. As described above, the first imaging device 30 is positioned to capture the nozzle 6 located above the parts supply position of the parts feeder 12 and the electronic components 4 attracted to the nozzle 6. Therefore, the image captured by the first imaging device 30 can include the tip of the parts feeder 12 in the insertion direction.

Next, the control device 26 determines from the captured image whether the parts feeder 12 is properly inserted. The control device 26's memory (not shown) stores images of the parts feeder 12 when it is properly inserted. The control device 26 determines that the parts feeder 12 is not properly inserted if the parts feeder 12 in the image captured by the first imaging device 30 is deviated by a predetermined range or more from the parts feeder 12 in the stored images. In other words, it determines that the nozzle 6 may interfere with the tip of the parts feeder 12 in the insertion direction.

In this embodiment, a first imaging device 30, which images the nozzle 6 and the electronic component 4 attracted to the nozzle 6 from the side, is used to determine whether the component feeder 12 is properly inserted. Therefore, it is possible to determine whether the component feeder 12 is properly inserted without adding any additional configuration for detecting whether the component feeder 12 is properly inserted. Conventional component mounting machines used detection mechanisms, such as sensors, to detect whether the component feeder 12 was properly inserted. However, this not only required the installation of dedicated components for detecting whether the component feeder 12 was properly inserted, but also presented the problem of difficulty in optimizing the installation position of detection mechanisms such as sensors. In this embodiment, since the determination of whether the component feeder 12 is properly inserted is made using the captured image, it is possible to explicitly and easily determine whether the component feeder 12 is properly inserted.

In this embodiment, the first imaging device 30 was used to determine whether the component feeder 12 was properly inserted, but the configuration is not limited to this. For example, the control device 26 may detect other components that interfere with the nozzle 6 within the nozzle's movement range from the captured image. The nozzle 6 moves between the component supply position of the component feeder 12 and the circuit board 2. The control device 26 may use the first imaging device 30 to image components installed within the nozzle 6's movement range and detect whether the components are in a state where they may interfere with the nozzle 6. For example, as shown in Figures 1 and 2, the second imaging device 40 and the component retrieval unit 42 are installed within the nozzle 6's movement range (i.e., between the supply position of the electronic components 4 of the component feeder 12 and the circuit board 2). For example, a fallen component may get caught at the upper end of the second imaging device 40 and the component retrieval unit 42, and such a fallen component may interfere with the nozzle 6. Therefore, the first imaging device 30 may image the upper part of the second imaging device 40 and the upper part of the parts retrieval unit 42, and the control device 26 may detect from the captured image whether there is a possibility of interference between the falling parts on the second imaging device 40 or the parts retrieval unit 42 and the nozzle 6. In this case, for example, the support portion 32 that supports the first imaging device 30 may be configured to rotate around its axis, and by changing the imaging direction of the first imaging device 30, the upper part of the second imaging device 40 and the upper part of the parts retrieval unit 42 may be imaged. Alternatively, an additional imaging device may be installed to image the upper part of the second imaging device 40 and the upper part of the parts retrieval unit 42.

The following points should be noted regarding the component mounting machine 10 described in the embodiment. In the embodiment, the component feeder 12 is an example of a "supplying device," the head moving device 18 is an example of a "moving device," the control device 26 is an example of a "determination unit," and the first imaging device 30 is an example of a "camera."

The specific examples of the technology disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical utility individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Also, the technology illustrated herein or in the drawings achieves multiple objectives simultaneously, and achieving even one of these objectives constitutes technical utility.

2: Circuit board 4: Electronic components 6: Nozzle 10: Component mounting machine 12: Component feeder 14: Feeder holding unit 16: Mounting head 18: Head moving device 18a: Moving base 20: Board conveyor 24: Touch panel 26: Control device 30: First imaging device 34: Light source 40: Second imaging device 42: Component recovery unit

Claims (3)

A component mounting machine for mounting electronic components onto a circuit board,
A nozzle for adsorbing the aforementioned electronic component,
A head that detachably holds the nozzle,
A moving device for moving the head,
An imaging device for imaging the nozzle and the electronic component attached to the nozzle, wherein the imaging device is installed in a position that is not moved by the moving device and in a position that allows imaging of the nozzle and the electronic component attached to the nozzle from the side,
A supply device for supplying the aforementioned electronic components to the nozzle,
Equipped with ,
The imaging device is configured to further image at least a portion of the area between the supply device and the substrate, in which the nozzle held in the head is moved by the moving device.
A component mounting machine further comprising a determination unit that determines, based on an image captured by the imaging device, whether the nozzle is properly adsorbing the electronic component, and whether the nozzle held in the head interferes within the component mounting machine . The system further comprises a supply device for supplying the aforementioned electronic components, and a holding unit that detachably holds the supply device.
The component mounting machine according to claim 1, wherein the imaging device is supported by the holding portion. The imaging device comprises a camera and a light source.
The camera is positioned to capture images of the nozzle and the imaging surface of the electronic component adsorbed to the nozzle.
The component mounting machine according to claim 1 or 2 , wherein the light source is installed to illuminate the nozzle and the side of the electronic component adsorbed to the nozzle that is opposite to the imaging surface.