JP7836964B2

JP7836964B2 - Laser processing equipment

Info

Publication number: JP7836964B2
Application number: JP2022014616A
Authority: JP
Inventors: 龍幸中川; 通雄櫻井
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2022-02-02
Filing date: 2022-02-02
Publication date: 2026-03-30
Anticipated expiration: 2042-02-02
Also published as: JP2023112732A

Description

本発明は、レーザ加工装置に関するものである。 This invention relates to a laser processing apparatus.

特許文献１には、長波長と短波長の２つのレーザを同軸の光路に導いて重畳させる光学系と、同軸の光路に重畳した２つのレーザの出力ビームをワーク（被加工物）上に集光する集光レンズとを備えたレーザ加工光学装置が開示されている。 Patent Document 1 discloses a laser processing optical apparatus comprising an optical system that guides two lasers, one with a long wavelength and the other with a short wavelength, into a coaxial optical path and superimposes them, and a focusing lens that focuses the output beams of the two lasers superimposed in the coaxial optical path onto the workpiece (object to be processed).

特開２００５－３２４２５４号公報Japanese Patent Publication No. 2005-324254

ところで、短波長のレーザ光は、銅やアルミのような高反射率材料のワークに対するレーザ吸収率が高いが、レーザ光の最大出力が低く、加工速度が遅くなる。 Incidentally, short-wavelength laser light has a high laser absorption rate for workpieces made of highly reflective materials such as copper and aluminum, but its maximum laser output is low, resulting in slower processing speeds.

一方、長波長のレーザ光は、短波長のレーザ光よりもレーザ光の最大出力が高いが、高反射率材料のワークに対するレーザ吸収率が低い。そのため、長波長のレーザ光では、ワークの溶け込み深さを一定にすることが困難であり、加工品質が低下するおそれがある。 On the other hand, while long-wavelength laser light has a higher maximum output than short-wavelength laser light, it has a lower laser absorption rate for workpieces made of highly reflective materials. Therefore, with long-wavelength laser light, it is difficult to maintain a consistent penetration depth in the workpiece, which may lead to a decrease in processing quality.

本発明は、かかる点に鑑みてなされたものであり、その目的は、ワークの加工品質及び加工速度を高めることにある。 This invention has been made in view of the above points, and its purpose is to improve the machining quality and machining speed of the workpiece.

第１の発明は、レーザ光を出射してワークを加工するレーザ加工装置であって、第１レーザ光を発振する第１レーザ発振器と、前記第１レーザ光よりも波長の長い第２レーザ光を発振する第２レーザ発振器と、前記第１レーザ発振器及び前記第２レーザ発振器から入射された前記第１レーザ光及び前記第２レーザ光を、前記ワークに対して出射するレーザ加工ヘッドとを備え、前記レーザ加工ヘッドは、前記第１レーザ光を平行化する第１コリメートレンズと、前記第２レーザ光を平行化する第２コリメートレンズと、前記第１コリメートレンズ及び前記第２コリメートレンズを通過した前記第１レーザ光及び前記第２レーザ光を重ね合わせる第１光学部材と、前記第１光学部材で重ね合わされた前記第１レーザ光及び前記第２レーザ光を前記ワークに向けて集光させる第２光学部材と、前記第１光学部材に対する前記第１レーザ光の入射位置を調整して、前記第２レーザ光に対する前記第１レーザ光の出射位置を相対的に変更する第１調整機構とを有し、前記ワークの加工位置における溶融状態を示すデータを検出する検出部と、前記検出部で検出されたデータに基づいて、前記レーザ加工ヘッド、前記第１レーザ発振器、及び前記第２レーザ発振器のうち少なくとも１つの動作を制御する制御部とを備え、前記検出部は、前記第１レーザ光に対応する前記ワークの加工位置における溶融状態を示すデータを検出する第１検出部を含み、前記第１レーザ発振器を発振する一方、前記第２レーザ発振器を停止することで、前記レーザ加工ヘッドから前記第１レーザ光が出射され、前記第１検出部では、前記ワークで反射された前記第１レーザ光の散乱光の光量が検出され、前記制御部は、前記第１検出部で検出された前記散乱光の光量が所定の閾値よりも低い場合に、前記第２レーザ発振器を発振させ、前記レーザ加工ヘッドから前記ワークの加工位置に前記第２レーザ光を出射させることを特徴とする。 The first invention is a laser processing apparatus for processing a workpiece by emitting laser light, comprising: a first laser oscillator that emits a first laser beam; a second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam; and a laser processing head that emits the first laser beam and the second laser beam incident from the first laser oscillator and the second laser oscillator toward the workpiece, wherein the laser processing head comprises: a first collimating lens that parallelizes the first laser beam; a second collimating lens that parallelizes the second laser beam; a first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens; a second optical member that focuses the first laser beam and the second laser beam superimposed by the first optical member toward the workpiece; and a mechanism that adjusts the incident position of the first laser beam toward the second laser beam. The laser processing device includes a first adjustment mechanism for relatively changing the emission position, a detection unit for detecting data indicating the melting state at the processing position of the workpiece, and a control unit for controlling the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit, wherein the detection unit includes a first detection unit for detecting data indicating the melting state at the processing position of the workpiece corresponding to the first laser beam, and by oscillating the first laser oscillator while stopping the second laser oscillator, the first laser beam is emitted from the laser processing head, the first detection unit detects the amount of scattered light of the first laser beam reflected by the workpiece, and the control unit oscillates the second laser oscillator and emits the second laser beam from the laser processing head to the processing position of the workpiece when the amount of scattered light detected by the first detection unit is lower than a predetermined threshold .

このように、第１光学部材に対する第１レーザ光の入射位置を調整して、第２レーザ光に対する第１レーザ光の出射位置を相対的に変更することで、ワークの加工品質及び加工速度を高めることができる。また、ワークの加工位置における溶融状態を示すデータが検出部で検出される。そして、検出部で検出されたデータに基づいて、レーザ光の出射位置や出射タイミング等を制御することができる。また、短波長の第１レーザ光でワークの表面を先行して荒らした後、ワークが溶融したことを第１検出部で検出された第１レーザ光の散乱光の光量に基づいて判断し、長波長の第２レーザ光でワークの仕上げ加工を行うことで、ワークの加工品質及び加工速度を高めることができる。 In this way, by adjusting the incident position of the first laser beam on the first optical element and relatively changing the emission position of the first laser beam relative to the second laser beam, the processing quality and processing speed of the workpiece can be improved. In addition, data indicating the melting state at the processing position of the workpiece is detected by the detection unit. Based on the data detected by the detection unit, the emission position and emission timing of the laser beam can be controlled. Furthermore, by first roughening the surface of the workpiece with the short-wavelength first laser beam, and then determining that the workpiece has melted based on the amount of scattered light from the first laser beam detected by the first detection unit, the processing quality and processing speed of the workpiece can be improved by performing finishing processing on the workpiece with the long-wavelength second laser beam.

第２の発明は、レーザ光を出射してワークを加工するレーザ加工装置であって、第１レーザ光を発振する第１レーザ発振器と、前記第１レーザ光よりも波長の長い第２レーザ光を発振する第２レーザ発振器と、前記第１レーザ発振器及び前記第２レーザ発振器から入射された前記第１レーザ光及び前記第２レーザ光を、前記ワークに対して出射するレーザ加工ヘッドとを備え、前記レーザ加工ヘッドは、前記第１レーザ光を平行化する第１コリメートレンズと、前記第２レーザ光を平行化する第２コリメートレンズと、前記第１コリメートレンズ及び前記第２コリメートレンズを通過した前記第１レーザ光及び前記第２レーザ光を重ね合わせる第１光学部材と、前記第１光学部材で重ね合わされた前記第１レーザ光及び前記第２レーザ光を前記ワークに向けて集光させる第２光学部材と、前記第１光学部材に対する前記第１レーザ光の入射位置を調整して、前記第２レーザ光に対する前記第１レーザ光の出射位置を相対的に変更する第１調整機構とを有し、前記ワークの加工位置における溶融状態を示すデータを検出する検出部と、前記検出部で検出されたデータに基づいて、前記レーザ加工ヘッド、前記第１レーザ発振器、及び前記第２レーザ発振器のうち少なくとも１つの動作を制御する制御部とを備え、前記検出部は、前記第２レーザ光に対応する前記ワークの加工位置における溶融状態を示すデータを検出する第２検出部を含み、前記第１レーザ発振器及び前記第２レーザ発振器を発振することで、前記レーザ加工ヘッドから前記第１レーザ光及び前記第２レーザ光が出射され、前記第２検出部では、前記ワークで反射された前記第２レーザ光の散乱光の光量が検出され、前記制御部は、前記第２検出部で検出された前記散乱光の光量が所定の閾値よりも低い場合に、前記第２レーザ光の出力を段階的又は徐々に上げるように、前記第２レーザ発振器の動作を制御することを特徴とする。 The second invention is a laser processing apparatus for processing a workpiece by emitting laser light, comprising: a first laser oscillator that emits a first laser beam; a second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam; and a laser processing head that emits the first laser beam and the second laser beam incident from the first laser oscillator and the second laser oscillator toward the workpiece, wherein the laser processing head includes: a first collimating lens that parallelizes the first laser beam; a second collimating lens that parallelizes the second laser beam; a first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens; a second optical member that focuses the first laser beam and the second laser beam superimposed by the first optical member toward the workpiece; and an optical member that adjusts the incident position of the first laser beam toward the first optical member, thereby adjusting the first laser beam toward the second laser beam. The laser processing device includes a first adjustment mechanism for relatively changing the emission position of light, a detection unit for detecting data indicating the melting state at the processing position of the workpiece, and a control unit for controlling the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit , wherein the detection unit includes a second detection unit for detecting data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam, the first laser beam and the second laser beam are emitted from the laser processing head by oscillating the first laser oscillator and the second laser oscillator, the second detection unit detects the amount of scattered light of the second laser beam reflected by the workpiece, and the control unit controls the operation of the second laser oscillator so as to gradually or stepwise increase the output of the second laser beam when the amount of scattered light detected by the second detection unit is lower than a predetermined threshold.

第２の発明では、このように、第１光学部材に対する第１レーザ光の入射位置を調整して、第２レーザ光に対する第１レーザ光の出射位置を相対的に変更することで、ワークの加工品質及び加工速度を高めることができる。また、ワークの加工位置における溶融状態を示すデータが検出部で検出される。そして、検出部で検出されたデータに基づいて、レーザ光の出射位置や出射タイミング等を制御することができる。また、長波長の第２レーザ光を低出力で出射した後、ワークが溶融したことを第２検出部で検出された第２レーザ光の散乱光の光量に基づいて判断し、第２レーザ光の出力を高めてワークの加工を行うことで、ワークの加工品質及び加工速度を高めることができる。 In the second invention, by adjusting the incident position of the first laser beam on the first optical member and relatively changing the emission position of the first laser beam relative to the second laser beam, the processing quality and processing speed of the workpiece can be improved. In addition, data indicating the melting state at the processing position of the workpiece is detected by the detection unit. Based on the data detected by the detection unit, the emission position and timing of the laser beam can be controlled. Furthermore, after emitting a long-wavelength second laser beam at low power, the second detection unit determines that the workpiece has melted based on the amount of scattered light from the second laser beam detected, and by increasing the output of the second laser beam to process the workpiece, the processing quality and processing speed of the workpiece can be improved.

第３の発明は、レーザ光を出射してワークを加工するレーザ加工装置であって、第１レーザ光を発振する第１レーザ発振器と、前記第１レーザ光よりも波長の長い第２レーザ光を発振する第２レーザ発振器と、前記第１レーザ発振器及び前記第２レーザ発振器から入射された前記第１レーザ光及び前記第２レーザ光を、前記ワークに対して出射するレーザ加工ヘッドとを備え、前記レーザ加工ヘッドは、前記第１レーザ光を平行化する第１コリメートレンズと、前記第２レーザ光を平行化する第２コリメートレンズと、前記第１コリメートレンズ及び前記第２コリメートレンズを通過した前記第１レーザ光及び前記第２レーザ光を重ね合わせる第１光学部材と、前記第１光学部材で重ね合わされた前記第１レーザ光及び前記第２レーザ光を前記ワークに向けて集光させる第２光学部材と、前記第１光学部材に対する前記第１レーザ光の入射位置を調整して、前記第２レーザ光に対する前記第１レーザ光の出射位置を相対的に変更する第１調整機構とを有し、前記ワークの加工位置における溶融状態を示すデータを検出する検出部と、前記検出部で検出されたデータに基づいて、前記レーザ加工ヘッド、前記第１レーザ発振器、及び前記第２レーザ発振器のうち少なくとも１つの動作を制御する制御部とを備え、前記検出部は、前記第２レーザ光に対応する前記ワークの加工位置における溶融状態を示すデータを検出する第２検出部を含み、前記第１レーザ発振器及び前記第２レーザ発振器を発振することで、前記レーザ加工ヘッドから前記第１レーザ光及び前記第２レーザ光が出射され、前記第２検出部では、前記ワークで反射された前記第２レーザ光の散乱光の光量が検出され、前記制御部は、前記第２検出部で検出された前記散乱光の光量が所定の閾値よりも高い場合に、前記ワークの加工位置に前記第１レーザ光を出射するように、前記レーザ加工ヘッドの動作を制御することを特徴とする。 The third invention is a laser processing apparatus for processing a workpiece by emitting laser light, comprising: a first laser oscillator that emits a first laser beam; a second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam; and a laser processing head that emits the first laser beam and the second laser beam incident from the first laser oscillator and the second laser oscillator toward the workpiece, wherein the laser processing head includes: a first collimating lens that parallelizes the first laser beam; a second collimating lens that parallelizes the second laser beam; a first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens; a second optical member that focuses the first laser beam and the second laser beam superimposed by the first optical member toward the workpiece; and an optical member that adjusts the incident position of the first laser beam toward the first optical member, thereby adjusting the first laser beam toward the second laser beam. The laser processing head is characterized in that it has a first adjustment mechanism for relatively changing the light emission position, a detection unit for detecting data indicating the melting state at the processing position of the workpiece, and a control unit for controlling the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit, wherein the detection unit includes a second detection unit for detecting data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam, the first laser beam and the second laser beam are emitted from the laser processing head by oscillating the first laser oscillator and the second laser oscillator, the amount of scattered light of the second laser beam reflected by the workpiece is detected by the second detection unit, and the control unit controls the operation of the laser processing head so as to emit the first laser beam at the processing position of the workpiece when the amount of scattered light detected by the second detection unit is higher than a predetermined threshold.

第３の発明では、このように、第１光学部材に対する第１レーザ光の入射位置を調整して、第２レーザ光に対する第１レーザ光の出射位置を相対的に変更することで、ワークの加工品質及び加工速度を高めることができる。また、ワークの加工位置における溶融状態を示すデータが検出部で検出される。そして、検出部で検出されたデータに基づいて、レーザ光の出射位置や出射タイミング等を制御することができる。また、長波長の第２レーザ光をワークに出射した後、ワークが十分に溶融していないことを第２検出部で検出された第２レーザ光の散乱光の光量に基づいて判断し、ワークの加工位置に短波長の第１レーザ光を出射することで、ワークの溶融を促進することができる。 In the third invention, by adjusting the incident position of the first laser beam on the first optical member and relatively changing the emission position of the first laser beam relative to the second laser beam, the processing quality and processing speed of the workpiece can be improved. In addition, data indicating the melting state at the processing position of the workpiece is detected by the detection unit. Based on the data detected by the detection unit, the emission position and timing of the laser beam can be controlled. Furthermore, after emitting a long-wavelength second laser beam to the workpiece, if the workpiece is not sufficiently melted, the second detection unit determines based on the amount of scattered light from the second laser beam detected, and the melting of the workpiece can be promoted by emitting a short-wavelength first laser beam at the processing position of the workpiece.

第４の発明は、レーザ光を出射してワークを加工するレーザ加工装置であって、第１レーザ光を発振する第１レーザ発振器と、前記第１レーザ光よりも波長の長い第２レーザ光を発振する第２レーザ発振器と、前記第１レーザ発振器及び前記第２レーザ発振器から入射された前記第１レーザ光及び前記第２レーザ光を、前記ワークに対して出射するレーザ加工ヘッドとを備え、前記レーザ加工ヘッドは、前記第１レーザ光を平行化する第１コリメートレンズと、前記第２レーザ光を平行化する第２コリメートレンズと、前記第１コリメートレンズ及び前記第２コリメートレンズを通過した前記第１レーザ光及び前記第２レーザ光を重ね合わせる第１光学部材と、前記第１光学部材で重ね合わされた前記第１レーザ光及び前記第２レーザ光を前記ワークに向けて集光させる第２光学部材と、前記第１光学部材に対する前記第１レーザ光の入射位置を調整して、前記第２レーザ光に対する前記第１レーザ光の出射位置を相対的に変更する第１調整機構とを有し、前記ワークの加工位置における溶融状態を示すデータを検出する検出部と、前記検出部で検出されたデータに基づいて、前記レーザ加工ヘッド、前記第１レーザ発振器、及び前記第２レーザ発振器のうち少なくとも１つの動作を制御する制御部とを備え、前記検出部は、前記第２レーザ光に対応する前記ワークの加工位置における溶融状態を示すデータを検出する第２検出部を含み、前記第１レーザ発振器及び前記第２レーザ発振器を発振することで、前記レーザ加工ヘッドから前記第１レーザ光及び前記第２レーザ光が出射され、前記第２検出部では、前記ワークで反射された前記第２レーザ光の散乱光の光量が検出され、前記制御部は、前記第２検出部で検出された前記散乱光の光量が所定の閾値よりも高い場合に、前記第１レーザ光の出力を段階的又は徐々に上げるように、前記第１レーザ発振器の動作を制御することを特徴とする。 The fourth invention is a laser processing apparatus for processing a workpiece by emitting laser light, comprising: a first laser oscillator that emits a first laser beam; a second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam; and a laser processing head that emits the first laser beam and the second laser beam incident from the first laser oscillator and the second laser oscillator toward the workpiece, wherein the laser processing head includes: a first collimating lens that parallelizes the first laser beam; a second collimating lens that parallelizes the second laser beam; a first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens; a second optical member that focuses the first laser beam and the second laser beam superimposed by the first optical member toward the workpiece; and an adjustment of the incident position of the first laser beam toward the first optical member, thereby adjusting the first laser beam toward the second laser beam. The laser processing device includes a first adjustment mechanism for relatively changing the emission position of light, a detection unit for detecting data indicating the melting state at the processing position of the workpiece, and a control unit for controlling the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit , wherein the detection unit includes a second detection unit for detecting data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam, the first laser beam and the second laser beam are emitted from the laser processing head by oscillating the first laser oscillator and the second laser oscillator, the second detection unit detects the amount of scattered light of the second laser beam reflected by the workpiece, and the control unit controls the operation of the first laser oscillator so as to gradually or stepwise increase the output of the first laser beam when the amount of scattered light detected by the second detection unit is higher than a predetermined threshold.

第４の発明では、このように、第１光学部材に対する第１レーザ光の入射位置を調整して、第２レーザ光に対する第１レーザ光の出射位置を相対的に変更することで、ワークの加工品質及び加工速度を高めることができる。また、ワークの加工位置における溶融状態を示すデータが検出部で検出される。そして、検出部で検出されたデータに基づいて、レーザ光の出射位置や出射タイミング等を制御することができる。また、長波長の第２レーザ光をワークに出射した後、ワークが十分に溶融していないことを第２検出部で検出された第２レーザ光の散乱光の光量に基づいて判断し、短波長の第１レーザ光の出力をさらに上げることでワークの予熱を十分に行い、ワークの溶融を促進することができる。 In the fourth invention, by adjusting the incident position of the first laser beam on the first optical member and relatively changing the emission position of the first laser beam relative to the second laser beam, the processing quality and processing speed of the workpiece can be improved. In addition, data indicating the melting state at the processing position of the workpiece is detected by the detection unit. Based on the data detected by the detection unit, the emission position and emission timing of the laser beam can be controlled. Furthermore, after emitting the long-wavelength second laser beam to the workpiece, if the workpiece is not sufficiently melted, the second detection unit determines based on the amount of scattered light from the second laser beam detected, and by further increasing the output of the short-wavelength first laser beam, the workpiece can be sufficiently preheated and the melting of the workpiece can be promoted.

第５の発明は、レーザ光を出射してワークを加工するレーザ加工装置であって、第１レーザ光を発振する第１レーザ発振器と、前記第１レーザ光よりも波長の長い第２レーザ光を発振する第２レーザ発振器と、前記第１レーザ発振器及び前記第２レーザ発振器から入射された前記第１レーザ光及び前記第２レーザ光を、前記ワークに対して出射するレーザ加工ヘッドとを備え、前記レーザ加工ヘッドは、前記第１レーザ光を平行化する第１コリメートレンズと、前記第２レーザ光を平行化する第２コリメートレンズと、前記第１コリメートレンズ及び前記第２コリメートレンズを通過した前記第１レーザ光及び前記第２レーザ光を重ね合わせる第１光学部材と、前記第１光学部材で重ね合わされた前記第１レーザ光及び前記第２レーザ光を前記ワークに向けて集光させる第２光学部材と、前記第１光学部材に対する前記第１レーザ光の入射位置を調整して、前記第２レーザ光に対する前記第１レーザ光の出射位置を相対的に変更する第１調整機構とを有し、前記ワークの加工位置における溶融状態を示すデータを検出する検出部と、前記検出部で検出されたデータに基づいて、前記レーザ加工ヘッド、前記第１レーザ発振器、及び前記第２レーザ発振器のうち少なくとも１つの動作を制御する制御部とを備え、前記検出部は、前記第２レーザ光に対応する前記ワークの加工位置における溶融状態を示すデータを検出する第２検出部を含み、前記第１レーザ発振器及び前記第２レーザ発振器を発振することで、前記レーザ加工ヘッドから前記第１レーザ光及び前記第２レーザ光が出射され、前記第２検出部では、前記ワークで反射された前記第２レーザ光の散乱光の光量が検出され、前記制御部は、前記第２検出部で検出された前記散乱光の光量が所定の上限値よりも高い場合に、前記第２レーザ光の出力を停止するように、前記第２レーザ発振器の動作を制御することを特徴とする。 The fifth invention is a laser processing apparatus for processing a workpiece by emitting laser light, comprising: a first laser oscillator that emits a first laser beam; a second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam; and a laser processing head that emits the first laser beam and the second laser beam incident from the first laser oscillator and the second laser oscillator toward the workpiece, wherein the laser processing head comprises: a first collimating lens that parallelizes the first laser beam; a second collimating lens that parallelizes the second laser beam; a first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens; a second optical member that focuses the first laser beam and the second laser beam superimposed by the first optical member toward the workpiece; and the first optical member that adjusts the incident position of the first laser beam toward the first laser beam toward the second laser beam. The laser processing device includes a first adjustment mechanism for relatively changing the emission position of the laser beam, a detection unit for detecting data indicating the melting state at the processing position of the workpiece, and a control unit for controlling the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit, wherein the detection unit includes a second detection unit for detecting data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam, the first laser beam and the second laser beam are emitted from the laser processing head by oscillating the first laser oscillator and the second laser oscillator, the second detection unit detects the amount of scattered light of the second laser beam reflected by the workpiece, and the control unit controls the operation of the second laser oscillator to stop the output of the second laser beam when the amount of scattered light detected by the second detection unit is higher than a predetermined upper limit.

第５の発明では、このように、第１光学部材に対する第１レーザ光の入射位置を調整して、第２レーザ光に対する第１レーザ光の出射位置を相対的に変更することで、ワークの加工品質及び加工速度を高めることができる。また、ワークの加工位置における溶融状態を示すデータが検出部で検出される。そして、検出部で検出されたデータに基づいて、レーザ光の出射位置や出射タイミング等を制御することができる。また、ワークで反射した高出力な第２レーザ光の散乱光がレーザ加工ヘッドに照射されてしまい、レーザ加工ヘッドが破損するのを抑えることができる。 In the fifth invention, by adjusting the incident position of the first laser beam on the first optical member and relatively changing the emission position of the first laser beam relative to the second laser beam, the processing quality and processing speed of the workpiece can be improved. In addition, data indicating the melting state at the processing position of the workpiece is detected by the detection unit. Based on the data detected by the detection unit, the emission position and emission timing of the laser beam can be controlled. Furthermore, it is possible to prevent damage to the laser processing head caused by scattered light of the high-power second laser beam reflected by the workpiece being irradiated onto the laser processing head.

本発明によれば、ワークの加工品質及び加工速度を高めることができる。 According to the present invention, the machining quality and machining speed of the workpiece can be improved.

本実施形態１に係るレーザ加工装置の概略構成を示す側面図である。This is a side view showing the schematic configuration of the laser processing apparatus according to this embodiment 1. レーザ光の波長と反射率との関係を示すグラフ図である。This graph shows the relationship between the wavelength of laser light and its reflectivity. レーザ開始位置に第１レーザ光を出射した状態を示す平面図である。This is a plan view showing the state when the first laser beam is emitted from the laser starting position. レーザ開始位置に第２レーザ光を出射した状態を示す平面図である。This is a plan view showing the state after the second laser beam has been emitted from the laser starting position. ワークのレーザ加工中の状態を示す平面図である。This is a plan view showing the state of the workpiece during laser processing. 本実施形態２に係るレーザ加工装置の概略構成を示す側面図である。This is a side view showing the schematic configuration of the laser processing apparatus according to this second embodiment. 第２レーザ光の散乱光強度と経過時間との関係を示すグラフ図である。This graph shows the relationship between the scattered light intensity of the second laser beam and the elapsed time.

以下、本発明の実施形態を図面に基づいて説明する。なお、以下の好ましい実施形態の説明は、本質的に例示に過ぎず、本発明、その適用物或いはその用途を制限することを意図するものではない。 The embodiments of the present invention will be described below with reference to the drawings. The following description of preferred embodiments is essentially illustrative and is not intended to limit the present invention, its applications, or its uses.

《実施形態１》
図１に示すように、レーザ加工装置１は、第１レーザ発振器１１と、第２レーザ発振器１２と、第１伝送ファイバ１５と、第２伝送ファイバ１６と、レーザ加工ヘッド２０と、ロボット２と、制御部５とを備える。 Embodiment 1
As shown in Figure 1, the laser processing apparatus 1 comprises a first laser oscillator 11, a second laser oscillator 12, a first transmission fiber 15, a second transmission fiber 16, a laser processing head 20, a robot 2, and a control unit 5.

第１レーザ発振器１１は、制御部５からの指令に基づいて、第１レーザ光Ｌ１を出力する。第１レーザ光Ｌ１は、短波長のレーザ光である。短波長の第１レーザ光Ｌ１は、波長が６００ｎｍ以下（例えば、２６６ｎｍ～６００ｎｍ）の青色レーザ光又は緑色レーザ光である。 The first laser oscillator 11 outputs the first laser beam L1 based on a command from the control unit 5. The first laser beam L1 is a short-wavelength laser beam. The short-wavelength first laser beam L1 is a blue or green laser beam with a wavelength of 600 nm or less (for example, 266 nm to 600 nm).

第１レーザ発振器１１とレーザ加工ヘッド２０とは、第１伝送ファイバ１５で接続される。第１レーザ光Ｌ１は、第１伝送ファイバ１５を介して、第１レーザ発振器１１からレーザ加工ヘッド２０に伝送される。 The first laser oscillator 11 and the laser processing head 20 are connected by a first transmission fiber 15. The first laser beam L1 is transmitted from the first laser oscillator 11 to the laser processing head 20 via the first transmission fiber 15.

第２レーザ発振器１２は、制御部５からの指令に基づいて、第２レーザ光Ｌ２を出力する。第２レーザ光Ｌ２は、第１レーザ光Ｌ１よりも波長の長い、長波長のレーザ光である。長波長の第２レーザ光Ｌ２は、波長が８００ｎｍ以上（例えば、８００ｎｍ～１６０００ｎｍ程度）の赤外レーザ光である。 The second laser oscillator 12 outputs the second laser beam L2 based on a command from the control unit 5. The second laser beam L2 is a long-wavelength laser beam with a longer wavelength than the first laser beam L1. The long-wavelength second laser beam L2 is an infrared laser beam with a wavelength of 800 nm or more (for example, approximately 800 nm to 16000 nm).

第２レーザ発振器１２とレーザ加工ヘッド２０とは、第２伝送ファイバ１６で接続される。第２レーザ光Ｌ２は、第２伝送ファイバ１６を介して、第２レーザ発振器１２からレーザ加工ヘッド２０に伝送される。 The second laser oscillator 12 and the laser processing head 20 are connected by a second transmission fiber 16. The second laser beam L2 is transmitted from the second laser oscillator 12 to the laser processing head 20 via the second transmission fiber 16.

レーザ加工ヘッド２０は、第１伝送ファイバ１５及び第２伝送ファイバ１６から入射される第１レーザ光Ｌ１及び第２レーザ光Ｌ２を、ワークＷに出射する。 The laser processing head 20 emits the first laser beam L1 and the second laser beam L2, which are incident from the first transmission fiber 15 and the second transmission fiber 16, to the workpiece W.

レーザ加工ヘッド２０は、第１コリメートレンズ２１と、第２コリメートレンズ２２と、第１ミラー２３と、第１調整機構２４と、第２調整機構２５と、ダイクロイックミラー２６（第１光学部材）と、ｆθレンズ２７（第２光学部材）と、第１検出部２８とを有する。 The laser processing head 20 includes a first collimating lens 21, a second collimating lens 22, a first mirror 23, a first adjustment mechanism 24, a second adjustment mechanism 25, a dichroic mirror 26 (first optical element), an fθ lens 27 (second optical element), and a first detection unit 28.

第１コリメートレンズ２１は、第１伝送ファイバ１５の出射端から出射された第１レーザ光Ｌ１を平行化する。第２コリメートレンズ２２は、第２伝送ファイバ１６の出射端から出射された第２レーザ光Ｌ２を平行化する。第１ミラー２３は、第１コリメートレンズ２１で平行化された第１レーザ光Ｌ１を反射して、第１調整機構２４に導光する。 The first collimating lens 21 parallelizes the first laser beam L1 emitted from the output end of the first transmission fiber 15. The second collimating lens 22 parallelizes the second laser beam L2 emitted from the output end of the second transmission fiber 16. The first mirror 23 reflects the first laser beam L1, which has been parallelized by the first collimating lens 21, and guides it to the first adjustment mechanism 24.

第１調整機構２４は、２軸ＭＥＭＳ（Micro Electro Mechanical Systems）ミラーで構成される。第１調整機構２４は、第１ミラー２３で反射された第１レーザ光Ｌ１をさらに反射して、ダイクロイックミラー２６に導光する。第１調整機構２４は、ミラーの角度を変更することで、ダイクロイックミラー２６に対する第１レーザ光Ｌ１の入射位置を変更する。なお、第１調整機構２４は、２軸のガルバノメータ（ガルバノミラー）を用いた構成としてもよい。 The first adjustment mechanism 24 is composed of a two-axis MEMS (Micro Electro Mechanical Systems) mirror. The first adjustment mechanism 24 further reflects the first laser beam L1 reflected by the first mirror 23 and guides it to the dichroic mirror 26. The first adjustment mechanism 24 changes the incident position of the first laser beam L1 on the dichroic mirror 26 by changing the angle of the mirrors. Note that the first adjustment mechanism 24 may also be configured using a two-axis galvanometer (galvanometer mirror).

第２調整機構２５は、２軸ＭＥＭＳミラーで構成される。第２調整機構２５は、第２コリメートレンズ２２で平行化された第２レーザ光Ｌ２を反射して、ダイクロイックミラー２６に導光する。第２調整機構２５は、ミラーの角度を変更することで、ダイクロイックミラー２６に対する第２レーザ光Ｌ２の入射位置を変更する。なお、第２調整機構２５は、２軸のガルバノメータを用いた構成としてもよい。 The second adjustment mechanism 25 is composed of a two-axis MEMS mirror. The second adjustment mechanism 25 reflects the second laser beam L2, which has been parallelized by the second collimating lens 22, and guides it to the dichroic mirror 26. The second adjustment mechanism 25 changes the incident position of the second laser beam L2 on the dichroic mirror 26 by changing the angle of the mirror. Note that the second adjustment mechanism 25 may also be configured using a two-axis galvanometer.

ダイクロイックミラー２６は、第２レーザ光Ｌ２を透過するとともに、第１レーザ光Ｌ１を反射する。ダイクロイックミラー２６は、第１レーザ光Ｌ１及び第２レーザ光Ｌ２を重ね合わせて、ｆθレンズ２７に導光する。 The dichroic mirror 26 transmits the second laser beam L2 and reflects the first laser beam L1. The dichroic mirror 26 superimposes the first laser beam L1 and the second laser beam L2 and guides them to the fθ lens 27.

ｆθレンズ２７は、第１レーザ光Ｌ１及び第２レーザ光Ｌ２の入射位置において、第１レーザ光Ｌ１及び第２レーザ光Ｌ２をそれぞれ、ワークＷの面（像面）に対して垂直入射するビームとなるように集光する。ｆθレンズ２７で集光された第１レーザ光Ｌ１及び第２レーザ光Ｌ２は、互いに平行光（言い換えると主光線が光軸に対して平行な平行光）としてワークＷに出射される。 The fθ lens 27 focuses the first laser beam L1 and the second laser beam L2 at their respective incident positions so that they become beams perpendicular to the surface (image plane) of the workpiece W. The first laser beam L1 and the second laser beam L2, focused by the fθ lens 27, are emitted to the workpiece W as parallel light (in other words, parallel light with principal rays parallel to the optical axis).

ここで、ｆθレンズ２７に対する第１レーザ光Ｌ１及び第２レーザ光Ｌ２の入射位置は、第１調整機構２４及び第２調整機構２５の角度をそれぞれ変更することで移動する。これにより、第１調整機構２４及び第２調整機構２５によって、ワークＷに対する第１レーザ光Ｌ１及び第２レーザ光Ｌ２の出射位置が相対的に変更可能となる。 Here, the incident positions of the first laser beam L1 and the second laser beam L2 on the fθ lens 27 are moved by changing the angles of the first adjustment mechanism 24 and the second adjustment mechanism 25, respectively. This allows the emission positions of the first laser beam L1 and the second laser beam L2 relative to the workpiece W to be changed relatively by the first adjustment mechanism 24 and the second adjustment mechanism 25.

なお、ここで、第１コリメートレンズ２１、第２コリメートレンズ２２を光軸方向に移動することで、第１レーザ光Ｌ１及び第２レーザ光Ｌ２のビーム径をそれぞれ拡大又は縮小するように変更することができる。 Furthermore, by moving the first collimating lens 21 and the second collimating lens 22 along the optical axis, the beam diameters of the first laser beam L1 and the second laser beam L2 can be increased or decreased, respectively.

第１検出部２８は、例えば、フォトダイオードで構成される。第１検出部２８は、ワークＷの加工位置における溶融状態を示すデータを検出する。ここで、溶融状態を示すデータとは、ワークＷで反射された第１レーザ光Ｌ１の散乱光の光量である。 The first detection unit 28 is composed of, for example, a photodiode. The first detection unit 28 detects data indicating the melting state at the processing position of the workpiece W. Here, the data indicating the melting state is the amount of scattered light from the first laser beam L1 reflected by the workpiece W.

第１検出部２８とワークＷとの間には、第１フィルタ２９が配置される。第１フィルタ２９は、ワークＷで反射された第２レーザ光Ｌ２の散乱光を遮光する一方、第１レーザ光Ｌ１の散乱光を通過させる。 A first filter 29 is positioned between the first detection unit 28 and the workpiece W. The first filter 29 blocks the scattered light of the second laser beam L2 reflected by the workpiece W, while allowing the scattered light of the first laser beam L1 to pass through.

第１検出部２８は、第１フィルタ２９を通過した第１レーザ光Ｌ１の散乱光の光量を検出する。第１検出部２８の検出結果は、制御部５に送られる。 The first detection unit 28 detects the amount of scattered light from the first laser beam L1 that has passed through the first filter 29. The detection result from the first detection unit 28 is sent to the control unit 5.

制御部５は、第１レーザ光Ｌ１の散乱光の光量が所定の閾値よりも小さい場合に、第１レーザ光Ｌ１によるワークＷの予熱が十分に行われたと判断する。 The control unit 5 determines that the workpiece W has been sufficiently preheated by the first laser beam L1 when the amount of scattered light from the first laser beam L1 is less than a predetermined threshold.

具体的に、第１レーザ光Ｌ１の散乱光の光量は、ワークＷの表面の溶融状態に応じて変化する。例えば、ワークＷの表面が第１レーザ光Ｌ１で十分に予熱されておらず、ワークＷの溶融量が小さい場合、第１レーザ光Ｌ１の散乱光の光量が大きくなる。一方、ワークＷの表面が第１レーザ光Ｌ１で十分に予熱されており、ワークＷの溶融量が大きい場合、第１レーザ光Ｌ１の散乱光の光量が小さくなる。 Specifically, the amount of scattered light from the first laser beam L1 changes depending on the melting state of the workpiece W's surface. For example, if the surface of the workpiece W is not sufficiently preheated by the first laser beam L1 and the amount of melted workpiece W is small, the amount of scattered light from the first laser beam L1 will be large. On the other hand, if the surface of the workpiece W is sufficiently preheated by the first laser beam L1 and the amount of melted workpiece W is large, the amount of scattered light from the first laser beam L1 will be small.

ロボット２は、ロボットアーム３を有する。ロボットアーム３の先端部には、レーザ加工ヘッド２０が取り付けられる。ロボットアーム３は、複数の関節部４を有する。 Robot 2 has a robotic arm 3. A laser processing head 20 is attached to the tip of the robotic arm 3. The robotic arm 3 has multiple joints 4.

ロボット２は、制御部５からの指令に基づいて、レーザ加工ヘッド２０を所定の加工方向に沿って移動させ、ワークＷに対するレーザ加工ヘッド２０の位置を変更する。これにより、ワークＷに対する第１レーザ光Ｌ１及び第２レーザ光Ｌ２の位置を移動させ、レーザ加工を行う。 Based on commands from the control unit 5, the robot 2 moves the laser processing head 20 along a predetermined processing direction, changing the position of the laser processing head 20 relative to the workpiece W. This changes the positions of the first laser beam L1 and the second laser beam L2 relative to the workpiece W, thereby performing laser processing.

制御部５は、第１レーザ発振器１１、第２レーザ発振器１２、レーザ加工ヘッド２０、及びロボット２に接続される。制御部５は、第１レーザ発振器１１、第２レーザ発振器１２、レーザ加工ヘッド２０、及びロボット２の動作を制御する。 The control unit 5 is connected to the first laser oscillator 11, the second laser oscillator 12, the laser processing head 20, and the robot 2. The control unit 5 controls the operation of the first laser oscillator 11, the second laser oscillator 12, the laser processing head 20, and the robot 2.

制御部５は、レーザ加工ヘッド２０の移動速度の他に、第１レーザ光Ｌ１及び第２レーザ光Ｌ２の出力開始や停止、第１レーザ光Ｌ１及び第２レーザ光Ｌ２の出力強度などを制御する機能も備える。なお、制御部５は、ここで１つの構成になっているが、複数で構成しても良い。 The control unit 5 also has functions to control the movement speed of the laser processing head 20, as well as the start and stop of the output of the first laser beam L1 and the second laser beam L2, and the output intensity of the first laser beam L1 and the second laser beam L2. Although the control unit 5 is shown as a single unit here, it may be configured as multiple units.

ワークＷは、第１部材Ｗ１と、第２部材Ｗ２とを有する。第１部材Ｗ１及び第２部材Ｗ２は、板状に形成される。第１部材Ｗ１は、第２部材Ｗ２の上面に重ね合わされる。 The workpiece W comprises a first member W1 and a second member W2. Both the first member W1 and the second member W2 are formed in a plate shape. The first member W1 is superimposed on the upper surface of the second member W2.

ワークＷは、レーザ吸収率の低い高反射率材料で構成される。具体的に、図２に示すように、レーザ光の反射率は、ワークＷの材質によって異なる。例えば、波長が８００ｎｍ以上の長波長としての赤外レーザ光を基準とした場合、銅（Ｃｕ）、アルミニウム（Ａｌ）、金（Ａｕ）、銀（Ａｇ）は、鉄（Ｆｅ）に比べてレーザ光の波長の反射率（％）が高く、言い換えるとレーザ吸収率の低い高反射率材料であることが分かる。一方、鉄（Ｆｅ）は、相対的にレーザ光の波長の反射率（％）が低く、言い換えるとレーザ吸収率の高い低反射率材料であることが分かる。 The workpiece W is composed of a highly reflective material with low laser absorption. Specifically, as shown in Figure 2, the reflectivity of laser light differs depending on the material of the workpiece W. For example, using infrared laser light with a long wavelength of 800 nm or more as a reference, copper (Cu), aluminum (Al), gold (Au), and silver (Ag) have higher reflectivity (%) at the laser light wavelength compared to iron (Fe). In other words, they are highly reflective materials with low laser absorption. On the other hand, iron (Fe) has a relatively low reflectivity (%) at the laser light wavelength. In other words, it is a low-reflectivity material with high laser absorption.

そこで、本実施形態では、ワークＷをレーザ吸収率の低い高反射率材料である銅で構成している。なお、ワークＷを金又は銀で構成してもよい。 Therefore, in this embodiment, the workpiece W is made of copper, a highly reflective material with low laser absorption. Alternatively, the workpiece W may be made of gold or silver.

〈レーザ加工装置の動作〉
ところで、短波長の第１レーザ光Ｌ１は、銅などの高反射率材料のワークＷに対するレーザ吸収率が高いが、レーザ光の最大出力が低い。そのため、必要な溶接ビード幅を得るためには、ビーム径を大きくしなければならないが、パワー密度が低下するため、加工速度を遅くする必要がある。 <Operation of the laser processing machine>
Incidentally, the short-wavelength first laser beam L1 has a high laser absorption rate for workpieces W made of highly reflective materials such as copper, but its maximum laser output is low. Therefore, in order to obtain the required weld bead width, the beam diameter must be increased, but this reduces the power density, so the processing speed must be slowed down.

一方、長波長の第２レーザ光Ｌ２は、短波長の第１レーザ光Ｌ１よりもレーザ光の最大出力が高いが、高反射率材料のワークＷに対するレーザ吸収率が低い。そのため、長波長の第２レーザ光Ｌ２では、ワークＷの溶け込み深さを一定にすることが困難であり、加工品質が低下するおそれがある。 On the other hand, while the long-wavelength second laser beam L2 has a higher maximum output than the short-wavelength first laser beam L1, it has a lower laser absorption rate for the highly reflective workpiece W. Therefore, with the long-wavelength second laser beam L2, it is difficult to maintain a consistent penetration depth in the workpiece W, potentially leading to a decrease in processing quality.

そこで、本実施形態では、第１レーザ光Ｌ１及び第２レーザ光Ｌ２の出射位置を工夫することで、ワークＷの加工品質及び加工速度を高めることができるようにしている。 Therefore, in this embodiment, the processing quality and processing speed of the workpiece W can be improved by optimizing the emission positions of the first laser beam L1 and the second laser beam L2.

図３に示すように、レーザ加工ヘッド２０は、ワークＷに対して短波長の第１レーザ光Ｌ１を出射する。レーザ開始位置では、レーザ加工ヘッド２０は、短波長の第１レーザ光Ｌ１をパルス状に出射する。このように、パワー密度の低い第１レーザ光Ｌ１であっても、パルス状に繰り返し出射してトータルの出力を高めることで、ワークＷが十分に予熱される。これにより、レーザ開始位置には、ワークＷの一部が溶融した予熱部３０が形成される。 As shown in Figure 3, the laser processing head 20 emits a short-wavelength first laser beam L1 to the workpiece W. At the laser start position, the laser processing head 20 emits the short-wavelength first laser beam L1 in a pulsed manner. In this way, even with the low power density of the first laser beam L1, the workpiece W is sufficiently preheated by repeatedly emitting it in a pulsed manner to increase the total output. As a result, a preheated area 30 is formed at the laser start position, where a portion of the workpiece W is molten.

具体的に、レーザ加工ヘッド２０は、高反射率材料に対するレーザ吸収率の高い第１レーザ光Ｌ１を、ワークＷの表面に先行して出射することで、ワークＷの表面を酸化させたり、ワークＷの表面を先に一部溶融させる等の表面改質を行う。 Specifically, the laser processing head 20 emits a first laser beam L1, which has a high laser absorption rate for high-reflectivity materials, onto the surface of the workpiece W in advance, thereby performing surface modification such as oxidation or partial melting of the workpiece W's surface.

第１検出部２８は、レーザ開始位置における短波長の第１レーザ光Ｌ１の散乱光の光量を検出する。第１検出部２８の検出結果は、制御部５に送られる。制御部５は、第１レーザ光Ｌ１の散乱光の光量が所定の閾値よりも小さい場合に、ワークＷの予熱が十分に行われ、予熱部３０が形成されたと判断する。 The first detection unit 28 detects the amount of scattered light from the short-wavelength first laser beam L1 at the laser start position. The detection result from the first detection unit 28 is sent to the control unit 5. The control unit 5 determines that the workpiece W has been sufficiently preheated and the preheating section 30 has been formed when the amount of scattered light from the first laser beam L1 is less than a predetermined threshold.

図４に示すように、レーザ加工ヘッド２０は、第１調整機構２４（図１参照）の角度調整を行うことで、第１レーザ光Ｌ１の出射位置を変更する。具体的に、第１レーザ光Ｌ１は、レーザ開始位置よりも加工方向（図４で左方向）の前方に出射される。ワークＷには、第１レーザ光Ｌ１の出射経路に沿って、予熱部３０が形成される。 As shown in Figure 4, the laser processing head 20 changes the emission position of the first laser beam L1 by adjusting the angle of the first adjustment mechanism 24 (see Figure 1). Specifically, the first laser beam L1 is emitted forward in the processing direction (leftward in Figure 4) from the laser start position. A preheating section 30 is formed on the workpiece W along the emission path of the first laser beam L1.

レーザ加工ヘッド２０は、レーザ開始位置に第２レーザ光Ｌ２を出射する。レーザ開始位置は、第１レーザ光Ｌ１で予熱されているため、第２レーザ光Ｌ２がワークＷに吸収されやすくなっている。レーザ開始位置には、第２レーザ光Ｌ２によって溶融池３１が形成される。 The laser processing head 20 emits a second laser beam L2 at the laser starting position. Because the laser starting position is preheated by the first laser beam L1, the second laser beam L2 is easily absorbed by the workpiece W. A molten pool 31 is formed at the laser starting position by the second laser beam L2.

具体的には、第１レーザ光Ｌ１の散乱光の光量が所定の閾値よりも小さい場合に、ワークＷの予熱が十分に行われ、予熱部３０が形成されたと判断し、レーザ加工ヘッド２０は、高反射率材料のワークＷに対するレーザ吸収率が高い短波長の第１レーザ光Ｌ１により、高反射率材料のワークＷにおける表面改質が行われた部分に対して、その直後に追従して、パワー密度の高い、長波長の第２レーザ光Ｌ２を出射する。これにより、高反射率材料のワークＷに対するレーザ吸収率の低い第２レーザ光Ｌ２が高反射率材料のワークＷに吸収されやすくなる。 Specifically, when the amount of scattered light from the first laser beam L1 is less than a predetermined threshold, the laser processing head 20 determines that the workpiece W has been sufficiently preheated and the preheating section 30 has been formed. Immediately following the portion of the workpiece W surface modified by the short-wavelength first laser beam L1, which has a high laser absorption rate for the high-reflectivity material workpiece W, the laser processing head 20 emits a long-wavelength second laser beam L2 with high power density. This makes the second laser beam L2, which has a low laser absorption rate for the high-reflectivity material workpiece W, more easily absorbed by the workpiece W.

図５に示すように、レーザ加工装置１は、レーザ加工ヘッド２０を加工方向に移動させる。レーザ加工ヘッド２０は、ワークＷに対して第１レーザ光Ｌ１及び第２レーザ光Ｌ２を連続的に出射する。 As shown in Figure 5, the laser processing apparatus 1 moves the laser processing head 20 in the processing direction. The laser processing head 20 continuously emits a first laser beam L1 and a second laser beam L2 onto the workpiece W.

レーザ加工ヘッド２０は、高反射率材料に対するレーザ吸収率の高い第１レーザ光Ｌ１を、ワークＷの表面に先行して出射する。第１レーザ光Ｌ１が出射されることでワークＷの予熱が行われ、予熱部３０が形成される。 The laser processing head 20 emits a first laser beam L1, which has a high laser absorption rate for high-reflectivity materials, onto the surface of the workpiece W in advance. The emission of the first laser beam L1 preheats the workpiece W, forming a preheating section 30.

レーザ加工ヘッド２０は、ワークＷの予熱部３０に対して、パワー密度の高い第２レーザ光Ｌ２を出射する。これにより、第２レーザ光Ｌ２がワークＷに吸収されやすくなり、溶融池３１を短時間で作成することができる。溶融池３１が凝固すると、溶接ビード３２が形成され、ワークＷの第１部材Ｗ１及び第２部材Ｗ２が溶接される。 The laser processing head 20 emits a second laser beam L2 with high power density towards the preheating section 30 of the workpiece W. This makes the second laser beam L2 more easily absorbed by the workpiece W, allowing the molten pool 31 to be created in a short time. Once the molten pool 31 solidifies, a weld bead 32 is formed, and the first member W1 and the second member W2 of the workpiece W are welded together.

このように、レーザ加工ヘッド２０は、第１レーザ光Ｌ１の少なくとも一部を、第２レーザ光Ｌ２よりも移動方向の前方に出射して、第２レーザ光Ｌ２が吸収され易くするように、予熱部３０を形成する。レーザ加工ヘッド２０は、第２レーザ光Ｌ２に先行して第１レーザ光Ｌ１によりワークＷの表面改質を行い、表面改質されたワークＷの表面をさらに第２レーザ光Ｌ２により出射してレーザ加工する。これにより、ワークの加工品質及び加工速度を高めることができる。 Thus, the laser processing head 20 forms a preheating section 30 by emitting at least a portion of the first laser beam L1 ahead of the second laser beam L2 in the direction of movement, making the second laser beam L2 more easily absorbed. The laser processing head 20 modifies the surface of the workpiece W with the first laser beam L1 prior to the second laser beam L2, and then laser processes the surface of the modified workpiece W by emitting the second laser beam L2. This improves both the processing quality and processing speed of the workpiece.

ここで、レーザ加工ヘッド２０の移動中にも、第１検出部２８で短波長の第１レーザ光Ｌ１の散乱光の光量を検出することで、予熱部３０が十分に形成された後、予熱部３０に対して、タイミング良く安定して長波長の第２レーザ光Ｌ２を出射することができる。 Here, even while the laser processing head 20 is moving, the first detection unit 28 detects the amount of scattered light from the short-wavelength first laser beam L1. This allows the long-wavelength second laser beam L2 to be emitted to the preheating unit 30 in a timely and stable manner after the preheating unit 30 has been sufficiently formed.

図５に示すように、レーザ加工ヘッド２０は、ワークＷに対して第１レーザ光Ｌ１及び第２レーザ光Ｌ２を出射しながら、第１調整機構２４（図１参照）の角度調整を行うことで、第１レーザ光Ｌ１の少なくとも一部を、第２レーザ光Ｌ２よりも加工方向（移動方向）の前方に出射するように、第２レーザ光Ｌ２に対して相対的に第１レーザ光Ｌ１の出射位置を変更する。第１レーザ光Ｌ１は、第２レーザ光Ｌ２よりも加工方向の前方に出射され、第２レーザ光Ｌ２は、第１レーザ光Ｌ１に対して加工方向に少なくとも追従して出射される。 As shown in Figure 5, the laser processing head 20 emits the first laser beam L1 and the second laser beam L2 to the workpiece W while adjusting the angle of the first adjustment mechanism 24 (see Figure 1). This adjusts the emission position of the first laser beam L1 relative to the second laser beam L2, so that at least a portion of the first laser beam L1 is emitted forward in the processing direction (movement direction) compared to the second laser beam L2. The first laser beam L1 is emitted forward in the processing direction compared to the second laser beam L2, and the second laser beam L2 is emitted at least following the first laser beam L1 in the processing direction.

より具体的に、レーザ加工ヘッド２０は、第１レーザ光Ｌ１の出射位置を、前方位置と後方位置との間で変更させる。前方位置では、第１レーザ光Ｌ１が第２レーザ光Ｌ２よりも加工方向の前方に位置する。後方位置では、第１レーザ光Ｌ１が第２レーザ光Ｌ２よりも加工方向の後方に位置する。 More specifically, the laser processing head 20 changes the emission position of the first laser beam L1 between a forward position and a backward position. In the forward position, the first laser beam L1 is positioned ahead of the second laser beam L2 in the processing direction. In the backward position, the first laser beam L1 is positioned behind the second laser beam L2 in the processing direction.

このように、前方位置では、短波長の第１レーザ光Ｌ１でワークＷの表面を少なくとも先行して表面改質として一部溶融させて荒らした後、長波長の第２レーザ光Ｌ２でワークＷの仕上げ加工を行うことで、ワークＷの加工品質及び加工速度を高めることができる。 Thus, at the forward position, the surface of the workpiece W is first partially melted and roughened as a surface modification using the short-wavelength first laser beam L1, and then the workpiece W is finished using the long-wavelength second laser beam L2. This process improves both the processing quality and speed of the workpiece W.

また、後方位置では、長波長の第２レーザ光Ｌ２の後方に短波長の第１レーザ光Ｌ１を出射することで、第２レーザ光Ｌ２で加工されたワークＷの加工表面をきれいにすることができる。例えば、第２レーザ光Ｌ２で溶接後に凝固した溶接ビード３２に第１レーザ光Ｌ１を出射することでスラグを除去して、溶接ビード３２の外観を滑らかにすることができる。また、レーザ終了位置において、第２レーザ光Ｌ２の後方に第１レーザ光Ｌ１を出射することで、クレータの発生を抑えることができる。 Furthermore, at the rear position, by emitting the short-wavelength first laser beam L1 behind the long-wavelength second laser beam L2, the processed surface of the workpiece W processed by the second laser beam L2 can be cleaned. For example, by emitting the first laser beam L1 onto the weld bead 32 that has solidified after welding with the second laser beam L2, slag can be removed, and the appearance of the weld bead 32 can be made smooth. Also, at the laser termination position, emitting the first laser beam L1 behind the second laser beam L2 can suppress the generation of craters.

なお、本実施形態では、ワークＷをレーザ溶接する場合について説明したが、ワークＷをレーザ切断する場合にも適用可能である。例えば、これにより第２レーザ光Ｌ２でレーザ切断した切断面に第１レーザ光Ｌ１を出射することで、切断面をきれいにすることができる。 In this embodiment, the case of laser welding the workpiece W has been described, but it is also applicable to laser cutting the workpiece W. For example, by emitting the first laser beam L1 onto the cut surface cut by the second laser beam L2, the cut surface can be made cleaner.

《実施形態２》
以下、前記実施形態１と同じ部分については同じ符号を付し、相違点についてのみ説明する。 Embodiment 2
In the following description, the same reference numerals are used for parts that are the same as those in Embodiment 1, and only the differences will be explained.

図６に示すように、レーザ加工ヘッド２０は、第１検出部２８と、第２検出部３８とを有する。第１検出部２８は、ワークＷで反射されて第１フィルタ２９を通過した短波長の第１レーザ光Ｌ１の散乱光の光量を検出する。第１検出部２８の検出結果は、制御部５に送られる。 As shown in Figure 6, the laser processing head 20 has a first detection unit 28 and a second detection unit 38. The first detection unit 28 detects the amount of scattered light from the short-wavelength first laser beam L1 that has been reflected by the workpiece W and passed through the first filter 29. The detection result from the first detection unit 28 is sent to the control unit 5.

第２検出部３８は、例えば、フォトダイオードで構成される。第２検出部３８は、ワークＷの加工位置における溶融状態を示すデータを検出する。ここで、第２検出部３８が検出する溶融状態を示すデータとは、ワークＷで反射された長波長の第２レーザ光Ｌ２の散乱光の光量である。 The second detection unit 38 is composed of, for example, a photodiode. The second detection unit 38 detects data indicating the melting state at the processing position of the workpiece W. Here, the data indicating the melting state detected by the second detection unit 38 is the amount of scattered light from the long-wavelength second laser beam L2 reflected by the workpiece W.

第２検出部３８とワークＷとの間には、第２フィルタ３９が配置される。第２フィルタ３９は、ワークＷで反射された短波長の第１レーザ光Ｌ１の散乱光を遮光する一方、長波長の第２レーザ光Ｌ２の散乱光を通過させる。 A second filter 39 is positioned between the second detection unit 38 and the workpiece W. The second filter 39 blocks the scattered light of the short-wavelength first laser beam L1 reflected by the workpiece W, while allowing the scattered light of the long-wavelength second laser beam L2 to pass through.

第２検出部３８は、第２フィルタ３９を通過した長波長の第２レーザ光Ｌ２の散乱光の光量を検出する。第２検出部３８の検出結果は、制御部５に送られる。 The second detection unit 38 detects the amount of scattered light from the long-wavelength second laser beam L2 that has passed through the second filter 39. The detection result from the second detection unit 38 is sent to the control unit 5.

制御部５は、第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量が所定の閾値よりも小さい場合に、第２レーザ光Ｌ２の出力を上げるように、第２レーザ発振器１２の動作を制御する。 The control unit 5 controls the operation of the second laser oscillator 12 to increase the output of the second laser beam L2 when the amount of scattered light from the long-wavelength second laser beam L2 detected by the second detection unit 38 is less than a predetermined threshold.

具体的に、長波長の第２レーザ光Ｌ２の散乱光の光量は、ワークＷの表面の溶融状態に応じて変化する。例えば、ワークＷの表面が第２レーザ光Ｌ２で十分に溶融されていない場合、第２レーザ光Ｌ２の散乱光の光量が大きくなる。一方、ワークＷの表面が第２レーザ光Ｌ２で十分に溶融されている場合、第２レーザ光Ｌ２の散乱光の光量が小さくなる。 Specifically, the amount of scattered light from the long-wavelength second laser beam L2 changes depending on the melting state of the workpiece W's surface. For example, if the surface of the workpiece W is not sufficiently melted by the second laser beam L2, the amount of scattered light from the second laser beam L2 increases. On the other hand, if the surface of the workpiece W is sufficiently melted by the second laser beam L2, the amount of scattered light from the second laser beam L2 decreases.

そこで、長波長の第２レーザ光Ｌ２を低出力で出射した後、ワークＷが溶融したことを第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量に基づいて判断し、第２レーザ光Ｌ２の出力を段階的又は徐々に高めてワークＷの加工を行うことで、スパッタの発生を抑制するとともにワークＷの加工品質及び加工速度を高めることができる。 Therefore, after emitting a long-wavelength second laser beam L2 at low power, the second detection unit 38 determines that the workpiece W has melted based on the amount of scattered light from the long-wavelength second laser beam L2 detected by the second detection unit 38. By gradually increasing the output of the second laser beam L2 in stages to process the workpiece W, sputter generation can be suppressed, and the processing quality and processing speed of the workpiece W can be improved.

－実施形態２の変形例１－
図６に示すレーザ加工装置１において、制御部５は、第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量が所定の閾値よりも高い場合に、ワークＷの加工位置に第１レーザ光Ｌ１を出射するように、レーザ加工ヘッド２０の動作を制御する。 - Modification 1 of Embodiment 2 -
In the laser processing apparatus 1 shown in Figure 6, the control unit 5 controls the operation of the laser processing head 20 so that when the amount of scattered light from the long-wavelength second laser beam L2 detected by the second detection unit 38 is higher than a predetermined threshold, the first laser beam L1 is emitted to the processing position of the workpiece W.

これにより、長波長の第２レーザ光Ｌ２をワークＷに出射した後、ワークＷが十分に溶融していないことを、第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量に基づいて判断し、高反射材料のワークＷの加工位置に短波長の第１レーザ光Ｌ１を出射することで、高反射材料のワークＷの溶融を促進することができる。 This allows the system to determine, based on the amount of scattered light from the long-wavelength second laser beam L2 detected by the second detection unit 38, whether the workpiece W has not melted sufficiently after emitting the long-wavelength second laser beam L2 to the workpiece W. By emitting the short-wavelength first laser beam L1 to the processing position of the highly reflective workpiece W, the melting of the highly reflective workpiece W can be promoted.

－実施形態２の変形例２－
図６に示すレーザ加工装置１において、制御部５は、第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量が所定の閾値よりも高い場合に、短波長の第１レーザ光Ｌ１の出力を段階的又は徐々に上げるように、第１レーザ発振器１１の動作を制御する。 -Modification 2 of Embodiment 2-
In the laser processing apparatus 1 shown in Figure 6, the control unit 5 controls the operation of the first laser oscillator 11 so as to gradually or stepwise increase the output of the short-wavelength first laser beam L1 when the amount of scattered light from the long-wavelength second laser beam L2 detected by the second detection unit 38 is higher than a predetermined threshold.

これにより、長波長の第２レーザ光Ｌ２を高反射材料のワークＷに出射した後、ワークＷが十分に溶融していないことを、第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量に基づいて判断し、短波長の第１レーザ光Ｌ１を高出力で出射してワークＷの予熱を十分に行うことで、スパッタを抑制して高反射材料のワークＷの溶融を促進することができる。 This allows the system to determine, based on the amount of scattered light from the long-wavelength second laser beam L2 detected by the second detection unit 38, whether the workpiece W is sufficiently melted after emitting the long-wavelength second laser beam L2. Then, by emitting the short-wavelength first laser beam L1 at high power to sufficiently preheat the workpiece W, sputtering can be suppressed and the melting of the high-reflectivity workpiece W can be promoted.

－実施形態２の変形例３－
図６に示すレーザ加工装置１において、制御部５は、第２検出部３８で検出された長波長の第２レーザ光Ｌ２の散乱光の光量が所定の上限値よりも高い場合に、第２レーザ光Ｌ２の出力を停止するように、第２レーザ発振器１２の動作を制御する（図７参照）。 - Modification 3 of Embodiment 2 -
In the laser processing apparatus 1 shown in Figure 6, the control unit 5 controls the operation of the second laser oscillator 12 so as to stop the output of the second laser beam L2 when the amount of scattered light of the long-wavelength second laser beam L2 detected by the second detection unit 38 is higher than a predetermined upper limit (see Figure 7).

これにより、ワークＷで反射された高出力な第２レーザ光Ｌ２の散乱光がレーザ加工ヘッド２０に照射されてしまい、レーザ加工ヘッド２０が破損するのを抑えることができる。 This prevents the scattered light of the high-power second laser beam L2 reflected from the workpiece W from irradiating the laser processing head 20, thus preventing damage to the laser processing head 20.

なお、第１レーザ発振器１１については、レーザ発振を継続させ、短波長の第１レーザ光Ｌ１でワークＷを予熱することで、高反射材料のワークＷの溶融を促進するようにすればよい。 Furthermore, the first laser oscillator 11 can be kept oscillating to preheat the workpiece W with the short-wavelength first laser light L1, thereby promoting the melting of the highly reflective workpiece W.

《その他の実施形態》
前記実施形態については、以下のような構成としてもよい。 Other embodiments
The above embodiment may also have the following configuration.

本実施形態では、第１検出部２８及び第２検出部３８をフォトダイオードで構成したが、この形態に限定するものではない。例えば、第１検出部２８及び第２検出部３８として、カメラ、温度センサ、光干渉計などを用いてもよい。 In this embodiment, the first detection unit 28 and the second detection unit 38 are configured with photodiodes, but the system is not limited to this configuration. For example, the first detection unit 28 and the second detection unit 38 may be replaced with a camera, a temperature sensor, an optical interferometer, or the like.

例えば、カメラを用いた場合、ワークＷの溶融状態を示すデータは、ワークＷの加工位置に形成された予熱部３０又は溶融池３１の輪郭を撮像した撮像データである。そして、予熱部３０又は溶融池３１の外径が所定の閾値（例えば、第２レーザ光Ｌ２のビーム径）よりも大きい場合に、ワークＷが十分に溶融していると判断すればよい。 For example, when using a camera, the data indicating the molten state of the workpiece W is image data of the contour of the preheating section 30 or molten pool 31 formed at the processing position of the workpiece W. Then, if the outer diameter of the preheating section 30 or molten pool 31 is greater than a predetermined threshold (for example, the beam diameter of the second laser beam L2), it can be determined that the workpiece W is sufficiently molten.

また、温度センサを用いた場合、ワークＷの溶融状態を示すデータは、ワークＷの加工位置の温度である。そして、ワークＷの加工位置の温度が所定の閾値（例えば、ワークＷの融点）よりも大きい場合に、ワークＷが十分に溶融していると判断すればよい。 Furthermore, when using a temperature sensor, the data indicating the molten state of the workpiece W is the temperature at the processing location of the workpiece W. If the temperature at the processing location of the workpiece W is greater than a predetermined threshold (for example, the melting point of the workpiece W), it can be determined that the workpiece W is sufficiently molten.

また、光干渉計を用いた場合、ワークＷの溶融状態を示すデータは、ワークＷの加工位置に形成された溶融池３１のキーホールの溶け込み深さである。なお、キーホールの溶け込み深さがそれほど深くない場合には、溶融池３１の表面の揺れを計測する。そして、キーホールの溶け込み深さ、又は溶融池３１の表面の揺れが所定の閾値よりも大きい場合に、ワークＷが十分に溶融していると判断すればよい。 Furthermore, when using an optical interferometer, the data indicating the molten state of the workpiece W is the penetration depth of the keyhole in the molten pool 31 formed at the machining position of the workpiece W. If the keyhole penetration depth is not very deep, the surface vibration of the molten pool 31 is measured. Then, if the keyhole penetration depth or the surface vibration of the molten pool 31 is greater than a predetermined threshold, it can be determined that the workpiece W is sufficiently molten.

本実施形態では、ロボット２でレーザ加工ヘッド２０を移動させ、ワークＷに対するレーザ加工ヘッド２０の位置を変更するようにしたが、この形態に限定するものではない。例えば、ワークＷを移動テーブル（図示省略）に搭載して、レーザ加工ヘッド２０に対して、ワークＷを相対的に移動させる構成であってもよい。 In this embodiment, the laser processing head 20 is moved by the robot 2 to change its position relative to the workpiece W, but the embodiment is not limited to this. For example, the workpiece W may be mounted on a moving table (not shown), and the workpiece W may be moved relative to the laser processing head 20.

また、レーザ加工ヘッド２０とワークＷを搭載した移動テーブルとを相対的に移動させ、ワークＷに対して相対的に第１レーザ光Ｌ１及び第２レーザ光Ｌ２を移動させて加工する構成であっても良い。 Alternatively, the laser processing head 20 and the mobile table on which the workpiece W is mounted may be moved relative to each other, and the first laser beam L1 and the second laser beam L2 may be moved relative to the workpiece W to perform the processing.

本実施形態では、１つのレーザ加工ヘッド２０から短波長の第１レーザ光Ｌ１及び長波長の第２レーザ光Ｌ２を出射するようにした形態について説明したが、この形態に限定するものではない。例えば、短波長の第１レーザ光Ｌ１を出射するレーザ加工ヘッドと、長波長の第２レーザ光Ｌ２を出射するレーザ加工ヘッドとを別々に設けた構成であってもよい。 In this embodiment, a configuration in which a short-wavelength first laser beam L1 and a long-wavelength second laser beam L2 are emitted from a single laser processing head 20 has been described, but the system is not limited to this configuration. For example, a configuration in which a laser processing head emitting the short-wavelength first laser beam L1 and a laser processing head emitting the long-wavelength second laser beam L2 are provided separately may also be used.

以上説明したように、本発明は、ワークの加工品質及び加工速度を高めることができるという実用性の高い効果が得られることから、きわめて有用で産業上の利用可能性は高い。 As described above, the present invention is extremely useful and has high industrial applicability because it provides highly practical effects, such as improving the machining quality and speed of the workpiece.

１レーザ加工装置
５制御部
１１第１レーザ発振器
１２第２レーザ発振器
２０レーザ加工ヘッド
２１第１コリメートレンズ
２２第２コリメートレンズ
２４第１調整機構
２５第２調整機構
２６ダイクロイックミラー（第１光学部材）
２７ｆθレンズ（第２光学部材）
２８第１検出部
３８第２検出部
Ｌ１第１レーザ光
Ｌ２第２レーザ光
Ｗワーク 1 Laser processing apparatus 5 Control unit 11 First laser oscillator 12 Second laser oscillator 20 Laser processing head 21 First collimating lens 22 Second collimating lens 24 First adjustment mechanism 25 Second adjustment mechanism 26 Dichroic mirror (first optical component)
27 fθ lens (second optical component)
28 First detection unit 38 Second detection unit L1 First laser beam L2 Second laser beam W Workpiece

Claims

A laser processing device that processes a workpiece by emitting laser light,
A first laser oscillator that emits a first laser beam,
A second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam,
The system comprises a laser processing head that emits the first laser beam and the second laser beam, which are incident on the workpiece, from the first laser oscillator and the second laser oscillator,
The aforementioned laser processing head is
A first collimating lens that parallelizes the first laser beam,
A second collimating lens that parallelizes the second laser beam,
A first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens,
A second optical member that focuses the first laser beam and the second laser beam, which are superimposed by the first optical member, toward the workpiece,
The system includes a first adjustment mechanism that adjusts the incident position of the first laser beam on the first optical member to relatively change the emission position of the first laser beam relative to the second laser beam, and further includes a detection unit that detects data indicating the melting state at the processing position of the workpiece.
The system includes a control unit that controls the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit,
The detection unit includes a first detection unit that detects data indicating the melting state at the processing position of the workpiece corresponding to the first laser beam.
By oscillating the first laser oscillator while stopping the second laser oscillator, the first laser beam is emitted from the laser processing head.
The first detection unit detects the amount of scattered light from the first laser beam reflected by the workpiece.
The laser processing apparatus is characterized in that the control unit causes the second laser oscillator to oscillate when the amount of scattered light detected by the first detection unit is lower than a predetermined threshold, and emits the second laser light from the laser processing head to the processing position of the workpiece .

A laser processing device that processes a workpiece by emitting laser light,
A first laser oscillator that emits a first laser beam,
A second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam,
The system comprises a laser processing head that emits the first laser beam and the second laser beam, which are incident on the workpiece, from the first laser oscillator and the second laser oscillator,
The aforementioned laser processing head is
A first collimating lens that parallelizes the first laser beam,
A second collimating lens that parallelizes the second laser beam,
A first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens,
A second optical member that focuses the first laser beam and the second laser beam, which are superimposed by the first optical member, toward the workpiece,
The system includes a first adjustment mechanism that adjusts the incident position of the first laser beam on the first optical member to relatively change the emission position of the first laser beam relative to the second laser beam, and further includes a detection unit that detects data indicating the melting state at the processing position of the workpiece.
The system includes a control unit that controls the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit,
The detection unit includes a second detection unit that detects data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam.
By oscillating the first laser oscillator and the second laser oscillator, the first laser beam and the second laser beam are emitted from the laser processing head.
The second detection unit detects the amount of scattered light from the second laser beam reflected by the workpiece.
The laser processing apparatus is characterized in that the control unit controls the operation of the second laser oscillator so as to increase the output of the second laser light stepwise or gradually when the amount of scattered light detected by the second detection unit is lower than a predetermined threshold.

A laser processing device that processes a workpiece by emitting laser light,
A first laser oscillator that emits a first laser beam,
A second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam,
The system comprises a laser processing head that emits the first laser beam and the second laser beam, which are incident on the workpiece, from the first laser oscillator and the second laser oscillator,
The aforementioned laser processing head is
A first collimating lens that parallelizes the first laser beam,
A second collimating lens that parallelizes the second laser beam,
A first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens,
A second optical member that focuses the first laser beam and the second laser beam, which are superimposed by the first optical member, toward the workpiece,
The system includes a first adjustment mechanism that adjusts the incident position of the first laser beam on the first optical member to relatively change the emission position of the first laser beam relative to the second laser beam, and further includes a detection unit that detects data indicating the melting state at the processing position of the workpiece.
The system includes a control unit that controls the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit,
The detection unit includes a second detection unit that detects data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam.
By oscillating the first laser oscillator and the second laser oscillator, the first laser beam and the second laser beam are emitted from the laser processing head.
The second detection unit detects the amount of scattered light from the second laser beam reflected by the workpiece.
The laser processing apparatus is characterized in that the control unit controls the operation of the laser processing head so that the first laser beam is emitted to the processing position of the workpiece when the amount of scattered light detected by the second detection unit is higher than a predetermined threshold.

A laser processing device that processes a workpiece by emitting laser light,
A first laser oscillator that emits a first laser beam,
A second laser oscillator that emits a second laser beam having a longer wavelength than the first laser beam,
The system comprises a laser processing head that emits the first laser beam and the second laser beam, which are incident on the workpiece, from the first laser oscillator and the second laser oscillator,
The aforementioned laser processing head is
A first collimating lens that parallelizes the first laser beam,
A second collimating lens that parallelizes the second laser beam,
A first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens,
A second optical member that focuses the first laser beam and the second laser beam, which are superimposed by the first optical member, toward the workpiece,
The system includes a first adjustment mechanism that adjusts the incident position of the first laser beam on the first optical member to relatively change the emission position of the first laser beam relative to the second laser beam, and further includes a detection unit that detects data indicating the melting state at the processing position of the workpiece.
The system includes a control unit that controls the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit,
The detection unit includes a second detection unit that detects data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam.
By oscillating the first laser oscillator and the second laser oscillator, the first laser beam and the second laser beam are emitted from the laser processing head.
The second detection unit detects the amount of scattered light from the second laser beam reflected by the workpiece.
The laser processing apparatus is characterized in that the control unit controls the operation of the first laser oscillator so as to increase the output of the first laser light stepwise or gradually when the amount of scattered light detected by the second detection unit is higher than a predetermined threshold.

A laser processing device that processes a workpiece by emitting laser light,
A first laser oscillator that emits a first laser beam,
A second laser oscillator that emits a second laser beam with a longer wavelength than the first laser beam,
The system comprises a laser processing head that emits the first laser beam and the second laser beam, which are incident on the workpiece, from the first laser oscillator and the second laser oscillator,
The aforementioned laser processing head is
A first collimating lens that parallelizes the first laser beam,
A second collimating lens that parallelizes the second laser beam,
A first optical member that superimposes the first laser beam and the second laser beam that have passed through the first collimating lens and the second collimating lens,
A second optical member that focuses the first laser beam and the second laser beam, which are superimposed by the first optical member, toward the workpiece,
The system includes a first adjustment mechanism that adjusts the incident position of the first laser beam on the first optical member to relatively change the emission position of the first laser beam relative to the second laser beam, and further includes a detection unit that detects data indicating the melting state at the processing position of the workpiece.
The system includes a control unit that controls the operation of at least one of the laser processing head, the first laser oscillator, and the second laser oscillator based on the data detected by the detection unit,
The detection unit includes a second detection unit that detects data indicating the melting state at the processing position of the workpiece corresponding to the second laser beam.
By oscillating the first laser oscillator and the second laser oscillator, the first laser beam and the second laser beam are emitted from the laser processing head.
The second detection unit detects the amount of scattered light from the second laser beam reflected by the workpiece.
The laser processing apparatus is characterized in that the control unit controls the operation of the second laser oscillator so as to stop the output of the second laser light when the amount of scattered light detected by the second detection unit is higher than a predetermined upper limit.

In any one of claims 1 to 5 ,
A laser processing apparatus characterized by comprising a second adjustment mechanism for adjusting the incident position of the second laser beam on the first optical member, thereby relatively changing the emission position of the second laser beam relative to the first laser beam.