JP7837799B2 - Wiring bending jig and wiring bending method using this jig - Google Patents

Description

This invention relates to a jig for inducing a bend in the direction of guidance when guiding wiring connected to a substrate to a desired position at a short distance from the connection point to the substrate, and to a method for bending wiring using this jig.

When guiding wiring connected to a circuit board to a location close to the connection point between the board and the wiring, it is necessary to bend the wiring in the desired direction. Traditionally, this wiring bending process was performed manually. However, manual bending can result in significant variations in bending angles and radii. Especially with large radii, if the bending point is near the connection point between the board and the wiring, a large load is placed on the connection point, potentially causing malfunctions such as wire breakage.

Therefore, as shown in Patent Document 1, a method for pre-bending wiring is already known.
Japanese Patent Publication No. 2012-190616

However, while the conventional methods described above allow for bending the wires, preventing damage to the connections between the wires and the circuit board remains difficult. Therefore, this problem remains unresolved.

Therefore, the first and second inventions of this application aim to solve the above-mentioned problems, and to enable the application of a desired bending characteristic to the wiring while preventing damage to the connection between the substrate and the wiring.

The first invention of this application solves the above-mentioned problems and comprises a base plate and a covering plate covering the surface of the base plate. The base plate is provided with an engaging portion for fixing the position of the covering plate on its upper surface, an insertion recess into which a substrate can be inserted, and a guide groove for wiring bending that extends from the insertion recess to the edge of the base plate. The covering plate is provided with an engaged portion that can engage with the engaging portion.

Furthermore, the second invention of this application is a wiring bending method using the jig of the first invention, wherein a substrate is placed in an insertion recess provided in a base plate, and wiring continuous from the substrate in the insertion recess is inserted into a guide groove for wiring bending provided on the base plate, which extends from the insertion recess to the edge, and the leading end of the wiring is positioned outside the base plate from the guide groove, and then the surface of the base plate is covered with the cover plate with the engaging portion provided on the cover plate engaged with the engaging portion provided on the base plate, and then the leading end of the wiring is bent along the outer surface of the edge of the base plate to give the wiring a bend.

Furthermore, in the first invention of this application, the covering plate may be transparent or translucent.

Furthermore, in the first invention of this application, the engaging portion may be a pin member, and a through-hole for inserting the pin member may be provided at a corresponding position on the covering plate, with the insertion-hole serving as the engaged portion.

Furthermore, in the first invention of this application, the guide groove may be provided perpendicular to the edge of the base plate. This results in a right-angle corner formed by the guide groove and the edge of the base plate. Therefore, when wiring is bent along this corner, it becomes possible to create a near-right-angle bend in the wiring at a position away from the connection point between the wiring and the substrate.

As described above, the first and second inventions of this application provide a base plate with an insertion recess into which a substrate can be inserted, and a guide groove for bending wiring that extends from this insertion recess to the edge of the base plate. Therefore, the connection between the substrate and the wiring extending from the substrate can be fixed by the base plate, making it possible to maintain a good condition.

Furthermore, because the angle between the guide groove and the edge of the base plate is constant, the wiring extending from the guide groove can be bent along the edge of the base plate, thereby creating a consistent bend in the wiring at a position away from the connection point with the circuit board. Therefore, this reduces the load on the connection point of the wiring to the circuit board and allows multiple wires to be bent at a consistent angle, thus preventing variations in the bending angle of the wiring.

A plan view of a jig, substrate, and wiring illustrating Embodiment 1 of the first and second inventions of this application. A plan view showing the base plate and covering plate of Example 1. A perspective view showing the opposing state of the base plate and the covering plate in Example 1. A plan view showing the base plate on which the circuit board and wiring are arranged in Example 1. Plan view of the substrate and wiring that underwent bending in Example 1.

Embodiment 1 of the first and second inventions of this application will be described below. As shown in Figure 1, (1) is a jig for bending wiring. As shown in Figure 2, this jig (1) consists of a flat, rectangular base plate (2) and a transparent covering plate (3) of the same dimensions and shape as the base plate (2). The base plate (2) has a rectangular insertion recess (5) on the edge (4) side of the center. This insertion recess (5) is sized to allow insertion of a substrate (7) to which the wiring (6) to be bent is connected. Furthermore, as shown in Figure 2, this insertion recess (5) is positioned parallel to the edge (4) of the base plate (2) at a certain distance from it.

Furthermore, a guide groove (8) is provided between the insertion recess (5) and the edge (4) of the base plate (2), perpendicular to the edge (4). As shown in Figure 2, this guide groove (8) is formed continuously from the insertion recess (5) to the edge (4), and its depth is shallower than that of the insertion recess (5). Additionally, the base plate (2) has a corner (10) near the insertion recess (5) and pin members (12), which are the engaging parts (11) of this embodiment, protruding from the corner (10) and diagonally across the insertion recess (5).

Furthermore, the covering plate (3) is formed to have the same dimensions and shape as the base plate (2), and when the two are superimposed, they are formed to fit together perfectly as shown in Figure 1. In the covering plate (3), two through-holes (13) are provided at corresponding positions to the pin members (12) on the base plate (2), as shown in Figure 3, and these through-holes (13) constitute the engaged portion (14) in this embodiment. The covering plate (3) also has an insertion opening (16) at a position corresponding to where the protrusion (15) of the substrate (7), which is inserted into the insertion recess (5), is located, as shown in Figure 1.

The method for bending the wiring (6) using the jig (1) formed as described above will be explained below. First, the substrate (7) is inserted into the insertion recess (5) formed as described above. At this time, since multiple wirings (6) are connected to the substrate (7), these wirings (6) are inserted into the guide groove (8) in parallel, as shown in Figure 4.

At this time, since the guide groove (8) is formed shallower than the insertion recess (5), the wiring (6) can be inserted into the guide groove (8) without putting stress on the connection portion (17) between the wiring (6) and the substrate (7). Therefore, the connection between the substrate (7) and the wiring (6) can be maintained in good condition.

Then, as described above, the substrate (7) and all the wiring (6) are placed in the insertion recess (5) and guide groove (8), respectively, and with the leading ends (20) of the wiring (6) positioned outside the base plate (2) from the guide groove (8), the covering plate (3) is placed over the base plate (2) from above, as shown in Figure 3.

At this time, since insertion holes (13) of a size that allows the pin members (12) to be inserted are provided at corresponding positions on the base plate (2), the two pin members (12) on the base plate (2) are inserted into the insertion holes (13), and the covering plate (3) is placed on the base plate (2) with the pin members (12) and insertion holes (13) engaged.

Furthermore, the covering plate (3) has an insertion opening (16) positioned at the same location as the protrusion (15) of the substrate (7) placed in the insertion recess (5). Therefore, by covering the base plate (2) with the covering plate (3), the protrusion (15) of the substrate (7) protrudes from the insertion opening (16). Thus, as shown in Figure 1, the base plate (2) and the covering plate (3) are joined in a state where they fit together perfectly on their outer periphery and opposing surfaces, and the substrate (7) and wiring (6) on the base plate (2) are fixed in place by the covering plate (3).

Therefore, as described above, the connection portion (17) between the substrate (7) placed on the base plate (2) and the wiring (6) continuous with the substrate (7) is fixed by the insertion recess (5), guide groove (8), and covering plate (3) of the base plate (2). Subsequently, by bending the wiring (6) in the desired direction in this state, the load on the connection portion (17) between the substrate (7) and the wiring (6) is reduced, preventing damage or breakage of the wiring (6) or the connection portion (17). This allows for bending of the multiple wirings (6) while maintaining good connection between the substrate (7) and the multiple wirings (6) connected to it.

In this state, the wiring (6) located outward from the base plate (2) is bent one by one. That is, the tip (20) of each wiring (6) is bent along the outer surface (18) on the edge (4) side of the base plate (2). This allows the wiring (6) to be bent in the desired direction at a position away from the connection point (17) between the wiring (6) and the substrate (7). Because the angle between the guide groove (8) and the edge (4) of the base plate (2) is constant, bending the wiring (6) extending from the guide groove (8) along the edge (4) of the base plate (2) as described above allows the wiring (6) to be given a consistent bend at a specific angle.

After all the wiring (6) has been bent, the circuit board (7) and wiring (6) are removed from the base plate (2). At this point, as shown in Figure 5, all the wiring (6) are bent to a consistent angle, thus preventing variations in the bending angles of the wiring (6). Furthermore, since the wiring (6) bending process is performed with the covering plate (3) covering the base plate (2), direct contact between the worker's hands and the circuit board is prevented. This also helps to reduce fiber adhesion from the work gloves worn during the process.

1. Jig 2. Base plate 3. Covering plate 4. Edge 5. Insertion recess 6. Wiring 7. Circuit board 8. Guide groove 11. Engaging part 12. Pin member 13. Insertion hole 14. Engaged part 18. Outer surface 20. Tip side.

Claims (5)

A wiring bending jig comprising a base plate and a covering plate covering the surface of the base plate, wherein the base plate is provided with an engaging portion for positioning and fixing the covering plate on its upper surface, an insertion recess into which a substrate can be inserted, and a guide groove for wiring bending that extends continuously from the insertion recess to the edge of the base plate, and the covering plate is provided with an engaged portion that can engage with the engaging portion. The wiring bending jig according to claim 1, characterized in that the covering plate is transparent or translucent. The above-mentioned engaging portion is a pin member, and the covering plate is provided with an insertion hole through which the pin member can be inserted at a corresponding position, with the insertion hole being the engaged portion, characterized in that it is the jig for bending wiring according to claim 1. The wiring bending jig according to claim 1 is characterized in that the above-mentioned guide groove is provided in a direction perpendicular to the edge of the base plate. A wiring bending method using a wiring bending jig, characterized by placing a substrate in an insertion recess provided in a base plate, inserting wiring continuous from the substrate in the insertion recess into a guide groove for wiring bending processing provided on the base plate from the insertion recess to the edge, positioning the leading end of the wiring outward from the guide groove to the base plate, then covering the surface of the base plate with the cover plate while engaging the engaging portion provided on the cover plate, and finally bending the leading end of the wiring along the outer surface of the base plate's edge to create a bend in the wiring.