JP7843442B2 - Probe chuck - Google Patents

Description

This invention relates to a prober chuck, and more particularly to a prober chuck for holding semiconductor wafers.

In the semiconductor manufacturing process, various processes are applied to semiconductor wafers (hereinafter referred to as "wafers") to form multiple chips containing devices. Each chip is then inspected for electrical characteristics, subsequently diced using a dicer, and finally fixed to a lead frame or similar component for assembly.

Electrical characteristics testing is performed using a prober equipped with a tester. The prober holds the wafer in the chuck's holding surface and contacts the electrode pads of each chip with its probe. The tester supplies power and various test signals to the chip through terminals connected to the probe, and verifies whether the chip is functioning correctly by analyzing the signals output from the chip's electrodes (see, for example, Patent Document 1).

Japanese Patent Publication No. 2019-169549

In testing the electrical characteristics of a chip, the wafer and heater generate heat, so the wafer temperature is adjusted by cooling the chuck holding the wafer with a medium. In some cases, the chuck temperature is adjusted to around 20 to 30 degrees Celsius, close to room temperature, for testing. For measurements near room temperature, the chuck temperature is adjusted to the desired temperature by supplying a medium such as liquid or air into the chuck. However, using liquid requires a cooling device (chiller), resulting in a large-scale system. Therefore, for temperatures near room temperature, it is possible to adjust the temperature by cooling compressed air with a simple cooler, allowing for a simpler system than using liquid.

However, when air is used as the fluid medium, its specific heat is lower than that of the liquid. Therefore, heat exchange from the chuck to the air may almost completely finish near the air inlet, for example. As a result, a temperature difference arises on the chuck's holding surface, from the air inlet to the air outlet.

In recent years, temperature uniformity of the chuck's holding surface has become a crucial requirement because it affects the yield of device measurements. Therefore, temperature uniformity of the holding surface is required in chucks.

This invention has been made in view of these circumstances, and aims to provide a prober chuck that uses air as a medium capable of achieving temperature uniformity on the wafer holding surface.

The prober chuck of the present invention, in order to achieve the object of the present invention, is a prober chuck for holding a wafer, comprising: a chuck body having a holding surface capable of holding a wafer; an air inlet provided at one end of the chuck body; an air outlet provided at the other end of the chuck body, different from the one end; an introduction channel that guides the air introduced from the air inlet to multiple heat exchange positions dispersed at the in-plane direction of the holding surface inside the chuck body; and an outlet channel that guides the air from each heat exchange position to the air outlet.

In one embodiment of the present invention, it is preferable that the cross-sectional area of the introduction channel at each heat exchange location is larger than the cross-sectional area of the outlet channel, and that each heat exchange location is provided with a heat exchange promoting surface formed by a stepped surface between the introduction channel and the outlet channel.

In one embodiment of the present invention, it is preferable that each heat exchange position is arranged on concentric circles equidistant from the center of the chuck body.

In one embodiment of the present invention, it is preferable that each heat exchange position is evenly distributed along the circumferential direction of concentric circles.

In one embodiment of the present invention, the heat exchange positions are distributed at least three times, including a first heat exchange position, a second heat exchange position, and a third heat exchange position. Preferably, the introduction channel includes a main channel extending from the air inlet to the first heat exchange position, a first branch channel branching from the main channel and extending to the second heat exchange position, and a second branch channel branching from the main channel and extending to the third heat exchange position.

In one embodiment of the present invention, it is preferable that the first branch channel and the second branch channel are provided along the same straight line perpendicular to the flow direction of the main channel.

In one embodiment of the present invention, it is preferable that at least a portion of the introduction channel is made of plastic pipe material.

In one embodiment of the present invention, it is preferable that the pipe material is arranged with a gap between it and the inner wall surface of the chuck body.

In one embodiment of the present invention, it is preferable that the pipe material is connected to the air inlet via a rubber gasket.

In one embodiment of the present invention, it is preferable that the outlet channels have interconnected channels that communicate with each other on their way from each heat exchange position to the air outlet.

According to the present invention, it becomes possible to achieve temperature uniformity on the wafer holding surface.

This is a schematic diagram showing the configuration of the prober. This is a perspective view showing the internal structure of the zipper body. This is an enlarged perspective view showing the configuration of the heat exchange location provided in the chuck body. This is a cross-sectional view showing the arrangement of pipe material with respect to the chuck body. This is a cross-sectional view of the air inlet and its vicinity, including the pipe material.

The following describes in detail an embodiment of the prober chuck according to the present invention, with reference to the attached drawings.

Figure 1 is a schematic diagram showing the configuration of a prober 12 equipped with a prober chuck (hereinafter referred to as "chuck") 10 of an embodiment. As shown in Figure 1, the prober 12 is equipped with a chuck 10 for holding wafers W, and this chuck 10 comprises a chuck body 16 having a holding surface 14 capable of holding wafers W. The chuck body 16 is made of a material such as aluminum, copper, or ceramic with good thermal conductivity. The chuck body 16 in this example is an example of the chuck body of the present invention.

Furthermore, the prober 12 includes a probe card 20 having probes 18 that contact the electrodes of the chip to be tested, and a tester 22. The tester 22 has a tester body 24 and an interface 26 that electrically connects the terminals of the tester body 24 to the terminals of the probe card 20. The tester 22 supplies power and various test signals to the chip from the terminals connected to the probes 18, and verifies whether the chip is functioning correctly by analyzing the signals output to the chip's electrodes.

Next, a cooling system for cooling the chuck body 16 to, for example, around 20 to 30 degrees Celsius, near room temperature, will be described. The cooling system in this example includes a cooler 28 for cooling compressed air, a supply-side flow path 32 for supplying the air cooled by the cooler 28 to the air inlet 30 of the chuck body 16, and an air outlet 34 and an exhaust-side flow path 36 for the air after heat exchange. Furthermore, a refrigerant flow path 38 is provided within the chuck body 16 to guide air from the air inlet 30 to the air outlet 34. Therefore, the cooling system in this example has a configuration in which the air cooled by the cooler 28 is supplied from the supply-side flow path 32 to the refrigerant flow path 38, and then released from the refrigerant flow path 38 to the atmosphere via the exhaust-side flow path 36.

In this embodiment, the chuck 10 has the following configuration in order to achieve temperature uniformity of the holding surface 14.

Figure 2 is a perspective view showing the internal structure of the chuck body 16, and in particular, a perspective view showing the configuration of the refrigerant flow path 38. As shown in Figure 2, the chuck body 16 in this example has a disc-shaped external structure. Note that when explaining the configuration of the chuck body 16, the so-called clock position, represented from 1 o'clock to 12 o'clock, may be used.

As shown in Figure 2, the outer circumferential surface 40 of the chuck body 16 is provided with a joint 42 connected to the air inlet 30 and a joint 44 connected to the air outlet 34. For example, if the air inlet 30 is positioned at the 6 o'clock position, the air outlet 34 is positioned approximately at the 12 o'clock position. That is, the air inlet 30 is located at one end of the chuck body 16 (at the 6 o'clock position), and the air outlet 34 is located at the other end of the chuck body 16 (approximately at the 12 o'clock position). The air inlet 30 in this example is an example of an air inlet according to the present invention, and the air outlet 34 in this example is an example of an air outlet according to the present invention.

The refrigerant flow path 38 described above is arranged within the plane of the chuck body 16. The refrigerant flow path 38 comprises an inlet flow path 52 and an outlet flow path 54. The inlet flow path 52 guides the air introduced from the air inlet 30 (see Figure 1) to the heat exchange positions 46, 48, and 50 inside the chuck body 16. The outlet flow path 54 guides the air from the heat exchange positions 46, 48, and 50 to the air outlet 34. The heat exchange positions 46, 48, and 50 will be described later. In this example, the inlet flow path 52 also has a main flow path 56, which will be described later, made of pipe material 70. Furthermore, the inlet flow path 52 and the outlet flow path 54 (excluding the portion where the pipe material 70 is installed) have a cross-sectional shape perpendicular to the flow direction, which is, for example, a concave shape.

The introduction channel 52 has a main channel 56 extending from the air inlet 30 to the heat exchange position 46, a first branch channel 58 branching off from the main channel 56 and extending to the heat exchange position 48, and a second branch channel 60 branching off from the main channel 56 and extending to the heat exchange position 50. The first branch channel 58 and the second branch channel 60 branch off from the side portion of the main channel 56, respectively. Furthermore, the first branch channel 58 and the second branch channel 60 are provided along the same straight line perpendicular to the flow direction of the main channel 56. With the introduction channel 52 configured in this way, air introduced into the introduction channel 52 from the air inlet 30 flows through the main channel 56 and reaches the heat exchange position 46. Also, air introduced into the first branch channel 58 midway through the main channel 56 flows through the first branch channel 58 and reaches the heat exchange position 48. Furthermore, air introduced into the second branch channel 60 midway through the main channel 56 flows through the second branch channel 60 and reaches the heat exchange position 50.

As shown in Figure 2, the outlet channel 54 includes a first communication channel 62 leading from the heat exchange position 46 to the air outlet 34, a second communication channel 64 leading from the heat exchange position 48 to the first communication channel 62, and a third communication channel 66 leading from the heat exchange position 50 to the first communication channel 62.

The second communication channel 64 extends from the heat exchange position 48 toward the outer circumference (9 o'clock direction) of the chuck body 16, and then bends back toward the air outlet 34 at the outer circumference of the chuck body 16, and is arranged in an arc shape along the outer circumference of the chuck body 16. The second communication channel 64 is connected to the first communication channel 62 near the air outlet 34. The third communication channel 66 extends from the heat exchange position 50 toward the outer circumference (3 o'clock direction) of the chuck body 16, and then bends back toward the air outlet 34 at the outer circumference of the chuck body 16, and is arranged in an arc shape along the outer circumference of the chuck body 16. The third communication channel 66 is connected to the first communication channel 62 near the air outlet 34. In other words, the outlet channel 54 has interconnected channels (first to third interconnected channels 62, 64, and 66) that are connected to each other on the way from each heat exchange position 46, 48, and 50 to the air outlet 34. With this configuration, the outlet channel 54 can guide the air that has reached each heat exchange position 46, 48, and 50 to the air outlet 34. Note that the channel configurations of the second interconnected channel 64 and the third interconnected channel 66 described above are examples.

Next, we will describe the configurations for promoting heat exchange by air at each heat exchange position 46, 48, and 50. Figure 3 is an enlarged perspective view showing the configuration of heat exchange position 50. In this example, we will use the configuration of heat exchange position 50 as an example for explanation; the configurations of heat exchange positions 46 and 48 are similar to those of heat exchange position 50, so their explanation will be omitted.

As shown in Figure 3, the cross-sectional area of the second branch channel 60 (inlet channel 52) at the heat exchange position 50 is larger than the cross-sectional area of the third connecting channel 66 (outlet channel 54). For example, the second branch channel 60 has a cross-sectional area 5 to 10 times larger than that of the third connecting channel 66. With this configuration, the heat exchange position 50 is provided with a heat exchange promoting surface 68, which is formed by a stepped surface between the second branch channel 60 and the third connecting channel 66. This heat exchange promoting surface 68 is configured, for example, as a surface perpendicular to the flow direction indicated by arrow A in the second branch channel 60. In the chuck 10 of this embodiment having such a heat exchange promoting surface 68, the air introduced into the second branch channel 60 flows through the second branch channel 60, which has a larger cross-sectional area, and collides with the heat exchange promoting surface 68 provided at the heat exchange position 50 at approximately perpendicular. As a result, heat exchange between the air and the chuck body 16 is effectively promoted at the heat exchange position 50. Furthermore, in the chuck 10 of this embodiment, similar heat exchange promoting surfaces 68 are also provided at the other two heat exchange positions 46 and 48 (see Figure 2), allowing for effective promotion of heat exchange by air within the plane of the chuck body 16. As a result, it is possible to achieve uniform temperature of the holding surface 14.

As shown in Figure 2, the heat exchange positions 46, 48, and 50 are dispersed in the in-plane direction of the holding surface 14 (see Figure 1) of the chuck body 16.

Each heat exchange position 46, 48, and 50 is, for example, positioned on a concentric circle S, shown by a dashed line, equidistant from the center C of the chuck body 16. The radius of the concentric circle S is, for example, approximately 50-80% of the radius of the chuck body 16. Furthermore, each heat exchange position 46, 48, and 50 is evenly distributed along the circumferential direction of the concentric circle S. That is, using clock positions, when viewed from the center C, heat exchange position 46 is approximately at the 12 o'clock position, heat exchange position 48 is approximately at the 8 o'clock position, and heat exchange position 50 is approximately at the 4 o'clock position.

Here, heat exchange positions 46, 48, and 50 in this example are examples of heat exchange positions according to the present invention. Furthermore, heat exchange position 46 in this example is an example of a first heat exchange position according to the present invention, heat exchange position 48 is an example of a second heat exchange position according to the present invention, and heat exchange position 50 is an example of a third heat exchange position according to the present invention.

Furthermore, according to the chuck 10 of this embodiment, the following configuration is provided to more effectively promote heat exchange by air. Specifically, as shown in Figure 2, a plastic pipe material 70 is provided in the main flow path 56. As the material constituting the pipe material 70, for example, a plastic with low thermal conductivity is used. One end of this pipe material 70 has an opening 70A connected to the air inlet 30 of the chuck body 16, and the other end has an opening 70B facing the heat exchange promoting surface 68 of the heat exchange position 46. In other words, in this example, the introduction flow path 52 has the main flow path 56 made of pipe material 70. Therefore, the air introduced from the supply side flow path 32 (see Figure 1) to the air inlet 30 is introduced into the pipe material 70 from the opening 70A of the pipe material 70, flows through the pipe material 70, and is injected from the opening 70B of the pipe material 70 onto the heat exchange promoting surface 68 of the heat exchange position 46. By constructing the main flow path 56 using a plastic pipe material 70 with low thermal conductivity, the heat insulation effect on the chuck body 16 can be enhanced, thereby suppressing temperature changes (temperature rise) of the air passing through the pipe material 70. In other words, heat exchange with the air by the chuck body 16 can be suppressed.

As shown in Figure 3, the pipe material 70 has an opening 72 communicating with the first branch channel 58 and an opening 74 communicating with the second branch channel 60. Therefore, a portion of the air introduced into the pipe material 70 flows through the first branch channel 58 from opening 72 and collides with the heat exchange promoting surface 68 (see Figure 2) at the heat exchange position 48, and also flows through the second branch channel 60 from opening 74 and collides with the heat exchange promoting surface 68 at the heat exchange position 50. In this example, the introduction channel 52 is constructed with the main channel 56, which is part of the introduction channel 52, made of pipe material 70, in order to suppress temperature changes in the air flowing through the introduction channel 52. However, one or both of the first branch channel 58 and the second branch channel 60 may also be constructed with pipe material 70.

Figure 4 is a cross-sectional view showing an example of the arrangement of the pipe material 70 relative to the chuck body 16. As shown in Figure 4, the pipe material 70 is arranged with a gap 76 between it and the inner wall surface 16A (the wall surface of the main flow path 56) of the chuck body 16. This configuration enhances the heat insulation effect on the chuck body 16 due to the gap 76, thereby further suppressing temperature changes in the air flowing through the introduction flow path 52.

Figure 5 is a cross-sectional view of the air inlet 30 and its vicinity, including the pipe material 70. As shown in Figure 5, the air inlet 30 is formed at the end of a short pipe material 82 on which a flange 80 is formed. This pipe material 82 is made of metal, and the flange 80 of the pipe material 82 is abutted against a flange 84 formed at the end of the pipe member 70 via a rubber packing 78, and connected to the pipe material 70 by a screw 86. Furthermore, the side of the flange 84 opposite to the side where the rubber packing 78 is located is connected to the chuck body 16 via the rubber packing 88. With this configuration, the heat insulation effect on the pipe material 82 can be enhanced by the rubber packing 78, and the heat insulation effect on the chuck body 16 can also be enhanced by the rubber packing 88, thereby further suppressing temperature changes in the air flowing through the inlet channel 52.

Next, the operation of the chuck 10 configured as described above will be explained. Air cooled to a predetermined temperature by the cooler 28 in Figure 1 is introduced from the supply-side flow path 32 to the air inlet 30, and then into the pipe material 70 through the opening 70A. The air then branches at the openings 72 and 74 of the pipe material 70 (see Figure 3) into a first direction (12 o'clock direction) toward the heat exchange position 46, a second direction (9 o'clock direction) toward the heat exchange position 48, and a third direction (3 o'clock direction) toward the heat exchange position 50.

As shown in Figure 2, air flowing in the first direction flows through the pipe material 70 and collides with the heat exchange promoting surface 68 at the heat exchange position 46, air flowing in the second direction flows through the first branch channel 58 and collides with the heat exchange promoting surface 68 at the heat exchange position 48, and air flowing in the third direction flows through the second branch channel 60 and collides with the heat exchange promoting surface 68 at the heat exchange position 50. As a result, the chuck body 16 effectively exchanges heat with the air at the three heat exchange positions 46, 48, and 50, and the entire chuck is cooled uniformly starting from these three heat exchange positions 46, 48, and 50. Consequently, according to the chuck 10 of this embodiment, it is possible to achieve uniform temperature of the holding surface 14.

Then, the air, after heat exchange has been completed at the three heat exchange locations 46, 48, and 50, flows from the air outlet 34 to the exhaust side flow path 36 via the first communication passage 62, the second communication passage 64, and the third communication passage 66, and is subsequently released into the atmosphere.

Therefore, according to the chuck 10 of this embodiment, an introduction channel 52 guides the air introduced from the air inlet 30 to at least three dispersed heat exchange positions 46, 48, and 50, and an outlet channel 54 guides the air from each heat exchange position 46, 48, and 50 to the air outlet 34. Since a heat exchange promoting surface 68 is provided at each heat exchange position 46, 48, and 50, it becomes possible to equalize the temperature of the holding surface 14 of the chuck body 16. As a result, the temperature of the holding surface 14 can be uniformly adjusted by air to, for example, a temperature near room temperature.

Furthermore, according to the chuck 10 of this embodiment, since at least a portion of the introduction channel 52 is constructed from pipe material 70, temperature changes in the air flowing through the introduction channel 52 can be suppressed. As a result, heat exchange at heat exchange positions 46, 48, and 50 is effectively promoted.

Furthermore, according to the chuck 10 of this embodiment, when the heat exchange positions 46, 48, and 50 are evenly distributed along the circumferential direction of the concentric circle S as described above, the first branch flow path 58 and the second branch flow path 60 are provided along the same straight line perpendicular to the flow direction of the main flow path 56. This allows the flow path lengths of the first branch flow path 58 and the second branch flow path 60 to be minimized. As a result, temperature changes in the air flowing through the first branch flow path 58 and the second branch flow path 60 can be minimized. Consequently, heat exchange at the heat exchange positions 48 and 50 is effectively promoted.

Furthermore, according to the chuck 10 of this embodiment, as shown in Figure 4, the pipe material 70 is positioned with a gap 76 between it and the inner wall surface 16A (main flow path 56) of the chuck body 16, thereby suppressing temperature changes in the air flowing through the introduction flow path 52. As a result, heat exchange at heat exchange positions 46, 48, and 50 is promoted even more effectively.

Furthermore, according to the chuck 10 of this embodiment, as shown in Figure 5, the pipe material 70 is connected to the pipe material 82 via the rubber packing 78, and the pipe material 70 is connected to the chuck body 16 via the rubber packing 88. This suppresses temperature changes in the air flowing through the introduction channel 52. As a result, heat exchange at the heat exchange positions 46, 48, and 50 is promoted even more effectively.

The following briefly describes some variations of the present invention.

<First variation>
In the prober chuck 10 of this embodiment, a preferred example is a chuck body 16 having three heat exchange positions 46, 48, and 50 distributed at three locations. However, the number of heat exchange positions is not limited to three, and there may be four or more heat exchange positions.

<Second variation>
In the prober chuck 10 of the embodiment, a chuck body 16 is shown with the heat exchange positions 46, 48, and 50 arranged on concentric circles S. However, the invention is not limited to this arrangement, and the heat exchange positions 46, 48, and 50 do not necessarily have to be arranged on concentric circles S. However, from the viewpoint of achieving uniform temperature on the holding surface 14 (see Figure 1), it is preferable that the heat exchange positions 46, 48, and 50 are arranged on concentric circles S. Furthermore, multiple heat exchange positions (for example, three heat exchange positions on each concentric circle S) may be arranged on multiple concentric circles S.

<Third variation>
In the prober chuck 10 of the embodiment, the chuck body 16 is shown as having the heat exchange positions 46, 48, and 50 evenly distributed along the circumferential direction of the concentric circle S. However, the invention is not limited to this arrangement example, and for example, the heat exchange positions 46, 48, and 50 may be spaced differently from each other along the circumferential direction of the concentric circle S. However, from the viewpoint of achieving temperature uniformity on the holding surface 14 (see Figure 1), it is more preferable to distribute them evenly along the circumferential direction of the concentric circle S.

<Fourth variation>
In the prober chuck 10 of the embodiment, as shown in Figure 2, as an example of a preferred configuration in which each heat exchange position 46, 48, and 50 is evenly distributed along the circumferential direction of the concentric circle S, a configuration in which the first branch flow path 58 and the second branch flow path 60 are provided along the same straight line perpendicular to the flow direction of the main flow path 56 is illustrated, but the embodiment is not limited to this configuration. For example, the first branch flow path 58 may be provided radially from the part located at the center C of the chuck body 16 in the main flow path 56 toward the heat exchange position 48, and the second branch flow path 60 may be provided toward the heat exchange position 50. However, in this configuration, the flow path lengths of the first branch flow path 58 and the second branch flow path 60 become longer compared to the configuration in Figure 2, so the configuration in Figure 2 is preferred from the viewpoint of achieving temperature uniformity on the holding surface 14 (see Figure 1).

<Fifth variation>
In the prober chuck 10 of the embodiment, a chuck body 16 is provided as an example in which the heat exchange promoting surface 68 is configured as a surface perpendicular to the flow direction. However, the invention is not limited to this, and a chuck body configured as an inclined surface inclined in the flow direction can also be applied. Furthermore, although the heat exchange promoting surface 68 is formed by making the cross-sectional area of the introduction flow path 52 larger than the cross-sectional area of the outlet flow path 54, it may also be formed by providing orifice tubes or venturi tubes at each heat exchange position 46, 48, 50 even if the cross-sectional areas of the introduction flow path 52 and the outlet flow path 54 are equal.

<Sixth variation>
The shape of the chuck body 16 is not limited to a circle. In that case, it is more preferable to evenly distribute the heat exchange positions, which are provided at multiple locations in the in-plane direction of the chuck body 16.

The above describes an example of a prober chuck according to the present invention. However, the technology of the present invention is not limited to the embodiments, and several improvements or modifications may be made without departing from the spirit of the invention.

10...Chuck, 12...Probe, 14...Holding surface, 16...Chuck body, 18...Probe, 20...Probe card, 22...Tester, 24...Tester body, 26...Interface, 28...Cooler, 30...Air inlet, 32...Supply side flow path, 34...Air outlet, 36...Exhaust side flow path, 38...Refrigerant flow path, 40...Outer surface, 42...Joint, 44...Joint, 46...Heat exchange position, 48...Heat exchange position 50…Heat exchange position, 52…Inlet channel, 54…Outlet channel, 56…Main channel, 58…First branch channel, 60…Second branch channel, 62…First connecting channel, 64…Second connecting channel, 66…Third connecting channel, 68…Heat exchange promoting surface, 70…Pipe material, 72…Opening, 74…Opening, 76…Gap, 78…Rubber gasket, 80…Flange, 82…Pipe material, 84…Flange, 86…Screw, 88…Rubber gasket

Claims (10)

A prober chuck for holding wafers,
A chuck body having a holding surface capable of holding the wafer,
An air inlet is provided at one end of the chuck body,
An air outlet is provided at the other end of the chuck body, which is different from the one end mentioned above.
An introduction channel guides the air introduced from the air inlet to heat exchange positions which are dispersed at multiple locations in the in-plane direction of the holding surface inside the chuck body,
An outlet channel that guides the air introduced to each of the heat exchange positions to the air outlet,
Equipped with,
The cross-sectional area of the introduction channel at each of the heat exchange locations is formed to be larger than the cross-sectional area of the outlet channel.
Each of the heat exchange locations is provided with a heat exchange promoting surface, which is formed by a stepped surface between the introduction channel and the discharge channel .
Probe chuck. Each of the heat exchange positions is arranged on a concentric circle equidistant from the center of the chuck body.
A prober chuck according to claim 1 . A prober chuck for holding wafers,
A chuck body having a holding surface capable of holding the wafer,
An air inlet is provided at one end of the chuck body,
An air outlet is provided at the other end of the chuck body, which is different from the one end mentioned above.
An introduction channel guides the air introduced from the air inlet to heat exchange positions which are dispersed at multiple locations in the in-plane direction of the holding surface inside the chuck body,
An outlet channel that guides the air introduced to each of the heat exchange positions to the air outlet,
Equipped with,
Each of the heat exchange positions is arranged on a concentric circle equidistant from the center of the chuck body.
Probe chuck. Each of the heat exchange positions is evenly distributed along the circumferential direction of the concentric circles.
A prober chuck according to claim 2 or 3. The heat exchange positions are distributed across at least three locations, including a first heat exchange position, a second heat exchange position, and a third heat exchange position.
The introduction channel comprises a main channel extending from the air inlet to the first heat exchange position, a first branch channel branching from the main channel and extending to the second heat exchange position, and a second branch channel branching from the main channel and extending to the third heat exchange position.
A prober chuck according to any one of claims 1 to 4. The first branch channel and the second branch channel are provided along the same straight line perpendicular to the flow direction of the main channel.
A prober chuck according to claim 5. At least a portion of the aforementioned introduction channel is made of plastic pipe material.
A prober chuck according to any one of claims 1 to 6. The pipe material is positioned with a gap between it and the inner wall surface of the chuck body.
A prober chuck according to claim 7. The aforementioned pipe material is connected to the air inlet via a rubber gasket.
A prober chuck according to claim 7 or 8. The aforementioned outlet channels have communicating channels that are connected to each other on their way from each of the heat exchange positions to the air outlet.
A prober chuck according to any one of claims 1 to 9.