JP7847739B2 - A method for manufacturing a pressing plate, and a method for processing a workpiece using a pressing plate manufactured by the same method. - Google Patents

Description

The present invention relates to a method for manufacturing a pressing plate used to process workpieces such as paper, corrugated cardboard, plastic products, sheet-like transfer foil materials, metal products, and composite products thereof into a predetermined shape by pressing, a pressing plate manufactured by the same manufacturing method, and a processing method for processing workpieces using the pressing plate.

For pressing processes, depending on the application, plates made of metal, plastic, resin, or rubber are used, and include foil stamping plates, die stamping plates, die cutout dies, and processing plates that combine these. A foil stamping plate is a pressing process plate used to transfer a transfer foil material onto a workpiece in accordance with the raised and recessed graphic and character patterns formed on the pressing process plate. A die stamping plate is a pressing process plate used to transfer a raised and recessed graphic and character pattern onto a workpiece in accordance with the raised and recessed graphic and character patterns formed on the die stamping plate. A die cutout die is a pressing process plate used to cut or punch out a workpiece into a predetermined shape in accordance with the raised and recessed graphic and character patterns formed on the die cutout die.

Figure 16 shows a schematic diagram of a known pressing device comprising a pressing plate. In Figure 16, (A) is a flat plate type pressing device, in which a pressing plate 100 is mounted on the surface of a first base 92 that is movable up and down, and a receiving plate 94 is mounted on a second base 93 that is also movable up and down and is located opposite the first base 92, and a workpiece 108 is placed between these pressing plate 100 and receiving plate 94, and in this state, when at least one of the first base 92 and the second base 93 is operated, the pressing plate 100 presses the workpiece 108, and a graphic character pattern that matches the graphic character pattern formed in a recessed shape on the pressing plate 100 is formed in a recessed shape on the workpiece.
In this flat plate type pressing apparatus, when the workpiece 108 is in a strip shape, the workpiece 108 is intermittently supplied between the pressing plate 100 and the receiving plate 94 in conjunction with the operation of at least one of the first base plate 92 and the second base plate 93, and is processed and formed into a predetermined uneven shape.
Furthermore, although not shown in the diagram, in the case of a molded product that can be placed on the receiving plate 94, the workpiece 108 is placed and supplied between the pressing plate 100 and the receiving plate 94 in conjunction with the operation of at least one of the first base plate 92 and the second base plate 93, and the workpiece is pressed to obtain a workpiece that has been processed and formed into a predetermined shape.
In this way, a workpiece processed to have a predetermined uneven shape, and/or a cut and cut workpiece, can be obtained.

Figure 16(B) shows a roll-type pressing device in which a pressing plate 100 is formed on the surface of a rotatable main roll 96 having a cylindrical or columnar shape, and a rotatable counter roll 97 is formed at a position opposite the main roll 96. A workpiece 108 is placed between the main roll 96 and the counter roll 97, and in this state, as the main roll 96 and the counter roll 97 are operated, the pressing plate 100 presses the workpiece 108, and a workpiece processed into a predetermined uneven shape is obtained. In this case, the pressing plate 100 can be a pressing plate 100 that has enough flexibility to be mounted around the main roll 96, or a non-flexible pressing plate 100 can be fixed and installed at a predetermined position on the main roll 96 by a fixing jig.
Alternatively, the main roll 96 may have a graphic or symbolic pattern formed directly on its surface in a predetermined uneven shape.
As the counter-roll 97, an anvil roll having a smooth surface that does not form irregularities, or a counter-roll having an irregular surface formed with an irregular shape that can engage with the irregular shape formed on the main roll, are also implemented.
In such a roll-type pressing device, a strip-shaped workpiece 108 is continuously supplied between the main roll 96 and the opposing roll 97. In this state, the main roll 96 and the opposing roll 97 operate, pressing the workpiece 108 against them to obtain a workpiece processed into a predetermined uneven shape, and/or a cut and cut-out workpiece.

Various materials such as paper, various plastic materials, rubber, soft materials, flexible materials, leather, cloth, and metal are used as workpieces, as well as various products such as corrugated cardboard, plastic products, leather products, cloth products, metal products, and emblems, and composite products composed of multiple materials such as labels, adhesive tapes, adhesives, and adhesives.

When the pressing plate is a foil stamping plate, the surface of the foil stamping plate has a predetermined graphic, character, or pictorial pattern formed in a raised or recessed shape, such as letters, numbers, patterns, designs, images, etc. By pressing this foil stamping plate onto the workpiece via a transfer foil material, the graphic, character, or pictorial pattern formed by the transfer foil material that matches the raised or recessed graphic, character, or pictorial pattern is transferred and formed on the surface of the workpiece. Almost any material can be used as the workpiece, including paper, various plastic materials, leather, wood, cloth, and metal, and it is applied to various products such as packaging containers, wrapping paper, decorative items, books, labels, plastic products, leather products, cloth products, metal products, and emblems. A foil stamping plate with such uneven surfaces is installed in a pressing device equipped with opposing substrates such as a support plate or receiving part. When at least one of the foil stamping plate and the opposing substrate is driven, the foil stamping plate and the opposing substrate are pressed against each other, and a foil-stamped graphic or graphic pattern that matches the graphic or graphic pattern formed by the uneven surface is transferred and formed on the surface of the workpiece.

Generally, foil stamping plates are made from materials such as steel, brass, copper, magnesium, stainless steel, other metals, plastics, or resins, while the opposing substrate is made from metal, plastic, resin, rubber, or other materials. A predetermined design, character, or pattern is engraved in a raised or recessed shape on the surface of the foil stamping plate.
With the transfer foil material positioned between the foil stamping plate and the workpiece, the foil stamping plate and the opposing substrate are pressed against each other. As a result, the entire surfaces of both the foil stamping plate and the opposing substrate are simultaneously pressed and in contact, and a predetermined graphic, letter, or pictographic pattern formed by the transfer foil material is transferred and formed on the surface of the workpiece in an uneven, raised or recessed shape. In this process, a stamping system that uses a foil stamping plate heated with a hot plate is also used; this is known as a hot stamping stamping system. Furthermore, in such stamping systems, there are cases where a single foil stamping plate is used, and cases where multiple foil stamping plates are used simultaneously.

When the pressing plate is an embossing plate, it is used in an embossing system that directly presses the embossing plate onto processed products such as paper, plastic, leather, wood, cloth, and laminate materials without using transfer foil material, thereby transferring a predetermined relief shape of a graphic character or pattern, engraved on the embossing plate, onto the surface of the workpiece. Such an embossing system is composed of an embossing plate and a counter substrate, similar to the foil pressing system described above, with a graphic character or pattern formed in a relief shape on the surface of the embossing plate. For example, at least one of the embossing plate and the counter substrate is driven to press the embossing plate and the counter substrate against each other. With the workpiece positioned between the counter substrate and the embossing plate, the entire surface areas of the embossing plate and the counter substrate are simultaneously pressed against each other via the workpiece, transferring and forming a predetermined relief shape of a graphic character or pattern onto the workpiece. In such a pressing system, materials that deform under pressure, such as paper, paper products, soft plastics, leather, wood, and cloth, can be used as workpieces. Furthermore, either a single embossing plate or multiple embossing plates can be used simultaneously.

When the pressing plate is a cutting die, the cutting die is used in a pressing system to cut or punch out thin workpieces such as paper, plastic, leather, wood, cloth, laminate materials, adhesive sheets, and transfer foil materials into a predetermined shape by pressing the cutting die onto the workpiece. The cutting die has a predetermined blade shape with raised and recessed edges, and the processed product is cut or punched in accordance with the shape of these blades. Such a pressing system is similar to the pressing system using the embossing plate or foil stamping plate described above, and consists of a cutting die and a counter substrate, with a raised and recessed die pattern formed on the surface of the cutting die. For example, the mechanism involves driving at least one of the cutting die and the counter substrate so that the cutting die and the counter substrate press against each other. With the workpiece positioned between the opposing substrate and the cutting die, the cutting die and the opposing substrate are pressed against each other. As a result, the entire surfaces of the cutting die and the opposing substrate are simultaneously pressed against each other through the workpiece, causing a predetermined area of the workpiece to be cut or punched out in a predetermined shape. In such a pressing system, one cutting die may be used, or multiple cutting dies may be used simultaneously. Furthermore, it is possible to perform this cutting and punching process in combination with the foil stamping or embossing process described above.

The following technologies are known as examples of plates for such pressing processes.
Japanese Patent Publication No. 2002-99196 discloses a press transfer processing method in which a hot stamping plate, which is a foil stamping plate used as a pressing plate, and a receiving portion, which is a counter substrate, are placed between a hologram transfer foil, which is a transfer foil material, and a workpiece.
Furthermore, Japanese Utility Model Publication No. 7-55065 discloses a hot stamping transfer machine in which a hot stamping die, which serves as a plate for foil stamping, and a support base, which serves as an opposing substrate, are arranged with a transfer foil, which serves as a transfer foil material, and a workpiece, which serves as a workpiece. In particular, a processing die is disclosed in which a rubber material is attached to the recesses formed by the unevenness of the processing die, so that the surface of the processing die is flush with the convex parts.
Furthermore, Utility Model Registration No. 3130674 discloses a flatbed transfer apparatus comprising: a processing die on which a graphic character and pictogram pattern is engraved in a raised and recessed shape, the surface of which at least one direction of the surface of the processing die has a surface shape consisting of a curved or rounded top and an inclined surface that becomes continuously and smoothly lower as it moves away from the top; a support plate having a planar surface as a counter substrate; a transfer foil film as a transfer foil material positioned between the processing die and the support plate; and a transfer object as a processed product.

Japanese Patent Publication No. 8-85099 discloses a method for manufacturing a die having a high cutting edge and a low cutting edge by chemical corrosion etching, and also describes a method for rounding the tip of the low cutting edge with a file or the like after etching. Furthermore, as prior art, a method of forming the low cutting edge by grinding with a grinder or the like after etching is also disclosed.
Publication No. 2002-53332 discloses a flexible die and a method for manufacturing a flexible die, in which a flexible base and a projection protruding from the base are formed by etching, the sides of the projection are cut to form a vertical projection, and then a double-edged or single-edged cutting edge is machined at the tip of the vertical projection to form a push-cutting blade. This makes it possible to reduce the width of the base side of the push-cutting blade compared to the base side of a conventional flexible die, thereby reducing the difference in dimensions between the upper and lower parts of the material when punching out thick materials, improving processing accuracy. Furthermore, since the cutting edge is machined only at the tip of the vertical projection, less pressure is required on the push-cutting blade when punching out material, improving the durability of the push-cutting blade, and resulting in improved productivity and reduced product costs.

When manufacturing a pressing plate comprising a recess and a projection protruding from the recess, wherein the surface of the projection has a plurality of uneven surfaces having a plurality of recesses and a plurality of protrusions, conventionally, the known methods for manufacturing pressing plates are a manufacturing method by mechanical processing, a manufacturing method by chemical etching, and a manufacturing method by a combination of chemical etching and mechanical processing.
Generally, the depth dimension of the recess (which has the same meaning as the height dimension of the protrusion) varies depending on the type of workpiece, but is approximately 0.5 mm or more. Furthermore, there are no particular restrictions on the width dimension of the recess or protrusion; it can be any desired dimension.

Figure 18 shows a schematic cross-sectional diagram illustrating a conventional method for manufacturing a pressing plate by mechanical processing. In Figure 18, (A) a plate mold substrate 1 with a thickness of approximately 3 mm and a smooth surface is prepared, and (B) a desired area of the surface of the plate mold substrate 1 is mechanically cut to form a plurality of pre-existing concave recesses 452, and a plurality of pre-existing protrusions 451 protruding from the pre-existing concave recesses 452, thereby forming a pre-existing multiple uneven surface 45. In this case, the depth dimension "D1" of the pre-existing multiple uneven surface recesses 452 (the height dimension "D1" of the pre-existing multiple uneven surface protrusions 451) is, for example, approximately 0.9 mm.
(C) Next, the area around the pre-existing multiple uneven portion 45, which consists of multiple pre-existing multiple uneven portion recesses 452 and multiple pre-existing multiple uneven portion protrusions 451 formed as described above, is cut by machining to form a conventional second recess-forming portion 121a. This produces a pressing plate having a conventional conventional machined uneven portion protrusion 450 formed by conventional machining, which has multiple pre-existing multiple uneven portion protrusions 451 and multiple pre-existing multiple uneven portion recesses 452, and a conventional second recess-forming portion 121a. In this case, the depth dimension "D12a" of the conventional second recess-forming portion 121a is, for example, about 2 mm.

Figure 19 shows a schematic cross-sectional diagram illustrating a manufacturing method in which, after forming multiple pre-existing uneven portions 45 by conventional chemical etching, the area around the pre-existing multiple uneven portions 45 is further processed by machining to form conventionally machined uneven portions 450 formed by conventional machining.
In Figure 19, (A) a conventional resist material 20 is attached to a desired area on the surface of a printing substrate 1 with a thickness of approximately 3 mm (and if a liquid resist material is used, it is further dried), (B) an exposure mask member 23 is installed to cover the conventional resist material and form an opening for a predetermined graphic character pattern, and ultraviolet light or the like is irradiated onto the printing substrate via the exposure mask member to expose and chemically alter the conventional resist material, (C) the unwanted resist material is dissolved and removed and developed to match the graphic character pattern of the exposure mask member. (D) A conventional resist-cured film 30 is formed, and after baking is performed as necessary. (D) An etching solution is brought into contact with the surface of the plate-making substrate 100 on which the conventional resist-cured film 30 is formed, and the surface of the plate-making substrate in the area where the plate-making substrate surface without the conventional resist material 30 is exposed is etched to form a concave conventional recess 452. (E) The conventional resist-cured film is removed, thereby forming a concave pre-existing multiple recess 452 and a convex pre-existing multiple protrusion 451, thereby forming a pre-existing multiple recess 45. In this case, the depth dimension D1 of the pre-existing multiple recess 452 (height dimension D1 of the pre-existing multiple protrusion 451) is, for example, about 0.9 mm.
(F) Furthermore, the area around the pre-existing uneven portion 45, which consists of a plurality of pre-existing concave recesses 452 and a plurality of pre-existing convex protrusions 451 formed as described above, is cut by machining to form a conventional second concave forming portion 121a. Thus, a pressing plate is manufactured which has a conventional machined uneven portion protrusion 450 formed by conventional machining having a plurality of pre-existing convex protrusions 451 and a plurality of pre-existing concave recesses 452, and a conventional second concave forming portion 121a. In this case, the depth dimension "D12a" of the conventional second concave forming portion 121a is, for example, about 2 mm.

In Figure 19(A), conventional conventional resist materials 20 generally include conventional liquid resist materials or conventional dry film resist materials in sheet or film form.
Conventionally, liquid resist materials are generally attached to a desired area of a printing plate substrate by conventional methods such as screen printing, spray coating, or curtain coating.
The screen printing method involves applying liquid resist material to a desired area of a printing plate substrate via a screen printing plate with predetermined through-holes. The spray coating method involves spraying liquid resist material from a nozzle having a predetermined number of fine holes and applying it to a desired area of the printing plate substrate.
Conventional dry film resist materials are attached to the desired area of the printing plate substrate by an adhesive method.
In Figures 19(B) and (C), a method is also employed in which conventional resist materials are chemically altered by directly irradiating them with a laser, electron beam, etc., without using an exposure mask.

Publication No. 7-55065 Japanese Patent Publication No. 2002-99196 Utility Model Registration No. 3130674 Gazette Japanese Patent Application Publication No. 8-85099 Re-table No. 2002-53332

Conventionally, when manufacturing a pressing plate having a recess and a projection protruding from the recess, and having a plurality of uneven surfaces having a plurality of recesses and a plurality of protrusions on the surface of the projection, the manufacturing methods for pressing plates are generally known to be a manufacturing method by mechanical processing, a manufacturing method by chemical etching, and a manufacturing method by a combination of chemical etching and mechanical processing.
In the manufacturing method using mechanical processing as shown in Figure 18, and the manufacturing method combining chemical etching and mechanical processing as shown in Figure 19, mechanical processing has the challenge of being inferior to conventional chemical etching in terms of manufacturing cost and the number of skilled personnel, due to reasons such as the need for expensive precision machining equipment and the need for skilled machinists who can process with the desired precision.

Furthermore, in conventional chemical corrosion etching processes, a conventional resist film is formed using conventional general-purpose liquid resist materials and conventional resist coating methods such as spray coating, screen printing, curtain coating, and spin coating. This resist film is then exposed to light through an exposure mask to form a conventionally cured resist film with a desired shape, and this conventionally cured resist film is used as an etching mask to corrosion and etch the substrate. However, this corrosion etching process suffers from poor processing accuracy, such as shape accuracy and dimensional accuracy, when the purpose is to form high heights or deep depths, such as the height dimensions of recesses and protrusions or the depth dimensions of recesses.

Furthermore, the thickness of conventional resist coatings is generally less than approximately 50 μm (approximately 0.05 mm).
When the thickness of the applied conventional resist film is approximately 50 μm or more, the variation in the thickness of the planar region of the conventional resist film increases as the thickness increases, making it difficult to form a uniform conventional resist film. As a result, variations in exposure occur when using an exposure mask with ultraviolet light, making it impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when the conventional resist-cured film is used as an etching mask to etch the plate mold container, it becomes impossible to form uneven areas with the desired shape and dimensional accuracy, resulting in poor etching accuracy.

In particular, when attempting to adhere a general-purpose conventional liquid resist material to the sides of desired recesses or protrusions, the conventional liquid resist material applied to the sides tends to flow down to the bottom of the recess, making it difficult to adhere the conventional liquid resist material to the desired area on the sides of the protrusions or recesses. Furthermore, when the cured conventional resist film formed by this adhesion is used as an etching mask to etch a plate-making substrate, it becomes impossible to form the desired recesses, protrusions, and other uneven surfaces, resulting in a problem of inferior processing accuracy, such as shape accuracy and dimensional accuracy.
Even when conventional resist coating methods such as spray coating, screen printing, curtain coating, and spin coating are used to fill the entire recess of the uneven areas formed on the printing plate substrate and to form a conventional resist-cured film on the sides of the recesses and protrusions, the thickness of the conventional resist-cured film varies greatly, making it impossible to form a uniform conventional resist-cured film. Consequently, variations in exposure occur during exposure using ultraviolet light or other exposure masks, leading to a decrease in dimensional accuracy. As a result, it becomes impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when this conventional resist-cured film is used as an etching mask for corrosion etching, it becomes impossible to form uneven areas with the desired shape and dimensional accuracy, resulting in poor etching accuracy.

Conventional corrosion etching processes that use general-purpose sheet-type dry film resist materials to form a resist-cured film have the problem of poor processing accuracy, such as shape accuracy and dimensional accuracy, when it comes to forming high heights and deep depths, such as the height dimensions of recesses and protrusions, and recesses and protrusions. In particular, when using a plate-making substrate with an uneven surface to further form desired recesses and protrusions on the plate-making substrate with an uneven surface, the adhesion between the plate-making substrate with the uneven surface and the conventional dry film resist material becomes insufficient, resulting in gaps between the plate-making substrate and the conventional dry film resist material. As a result, the sides and bottom surfaces of the recesses are not covered by the resist material, and etching occurs through the gaps between the resist material and the substrate, resulting in poor processing accuracy, such as the desired shape accuracy and dimensional accuracy.

Furthermore, in the conventional technology, when manufacturing a pressing plate that includes a recess and a projection protruding from the recess, and in which a plurality of uneven surfaces having a plurality of recesses and a plurality of protrusions are formed on the surface of the projection, there is a problem that the sides of each of the recesses and protrusions are etched, and as a result, it is not possible to form a projection with the desired uneven surface.

When manufacturing a pressing plate having recesses and protrusions extending from the recesses, and having multiple uneven surfaces formed on the surface of the protrusions, an example of a conventional manufacturing method using chemical etching will be explained with reference to Figure 20.
Figure 20 is a schematic diagram illustrating the process of manufacturing a plate for pressing using a conventional chemical etching process with a conventional resist material.
In Figure 20, (A) a substrate for printing plates is prepared in which a pre-existing multiple uneven surface 45 having multiple pre-existing multiple uneven surfaces protrusions 451 and multiple pre-existing multiple uneven surface recesses 452 is formed by machining or chemical etching using a conventional resist material. The depth dimension D1 of the pre-existing multiple uneven surface recesses 452 (the same as the height dimension of the pre-existing multiple uneven surface protrusions 451) is approximately 0.9 mm.
(B) A conventional liquid resist material 20 is applied to the surface of the pre-existing multiple uneven portions 45. In this case, the conventional liquid resist material tends to fall to the bottom surface of the pre-existing multiple uneven portion recesses 452 without adhering to the side surfaces of the recesses 452. The thickness of the conventional liquid resist material 20 applied to the upper surface of the pre-existing multiple uneven portion protrusions 451 and the bottom surface of the pre-existing multiple uneven portion recesses 452 is about 10 μm (about 0.01 mm) or more and less than about 50 μm (about 0.05 mm).
(C) A conventional liquid resist material attached to the surface of the multiple existing uneven parts 45 is covered, and a pre-prepared exposure mask member 23 is installed. Then, (D) exposure such as ultraviolet irradiation, development, curing, etc. are performed to form a conventional cured resist film 30 having the desired shape.
(E) The etching solution is brought into contact with the substrate to which the conventional resist-cured film 30 is attached, and the surface of the plate-making substrate in areas where the conventional resist-cured film 30 is not attached is etched by corrosion, and the area around the existing multiple uneven parts 45 is etched by corrosion to a depth of approximately 1 mm in etching depth dimension "D3", thereby forming the second etched recessed part 121b during etching.
(F) Further, corrosion etching is continued until the depth of the area surrounding the existing multiple recessed portions 45 reaches a predetermined depth, thereby forming a conventional second recessed portion 121a with a depth dimension "D12a" of approximately 2 mm.
(G) Remove the conventionally cured resist film 30.

In this manufacturing method, in (E), the recessed side surface of the pre-existing multiple uneven portion recess 452 to which the conventional resist-cured film 30 is not attached is also corroded and etched, and a side-etched area is created in which the side surface of the pre-existing multiple uneven portion protrusion 451 is corroded and etched by the side etching phenomenon, forming a side-etched pre-existing multiple uneven portion protrusion side surface 451s (side-etched pre-existing multiple uneven portion recess side surface 452s), and as a result, there is a problem that a pre-existing uneven portion protrusion that maintains the shape of a normal uneven pattern is not formed. Note that the side surface of the pre-existing multiple uneven portion protrusion 451 means the same area as the side surface of the pre-existing multiple uneven portion recess 452, so the side-etched pre-existing multiple uneven portion protrusion side surface 451s means the same area as the side-etched pre-existing multiple uneven portion recess side surface 452s. Also, "side etching" has the same meaning as "side etching," and refers to the phenomenon in which the side surface of the protrusion of the uneven portion or the side surface of the recess of the uneven portion is etched.
In (F), a pressing plate is manufactured which comprises a recess (conventionally used second recess forming portion 121a) with a depth dimension "D12a" of approximately 2 mm and a projection that protrudes from the recess, and on the surface of the projection, a plurality of side-etched pre-existing recessed projection portions 455s are formed, each having a side-etched surface portion 451s of the protruding portion and a side-etched surface portion 452s of the recessed portion. Furthermore, the conventional second recess forming portion 121a has the form of a side-etched eroded second recess forming portion 121s.

As described above, in the conventional method of manufacturing a pressing plate using conventional liquid resist material 20, the sides of the multiple pre-existing multiple protrusions 451 (or the sides of the multiple pre-existing multiple recesses 452) are also etched, making it impossible to maintain the initial shape of the multiple pre-existing multiple protrusions 451 and multiple pre-existing multiple recesses 452, and thus there is a problem in that a desired normal pressing plate cannot be manufactured.

Furthermore, in the conventional technology, when manufacturing a pressing plate comprising a recess and a projection protruding from the recess, and having a plurality of pre-existing multiple fine uneven surfaces 466 having a plurality of pre-existing multiple fine uneven surfaces protruding portions 461 and a plurality of pre-existing multiple fine uneven surfaces recesses 462 formed on the surface of the projection, there is a problem that the sides of the plurality of pre-existing multiple fine uneven surfaces protruding portions 461 and a plurality of pre-existing multiple fine uneven surfaces recesses 462 are etched, and as a result, it is not possible to form the desired projection having a plurality of pre-existing multiple fine uneven surfaces protruding portions 461 and a plurality of pre-existing multiple fine uneven surfaces recesses 462.
When manufacturing a pressing plate having a recess and a projection protruding from the recess, and having a plurality of pre-existing multiple fine uneven surfaces formed on the surface of the projection, each having a plurality of pre-existing multiple fine uneven surfaces protruding 461 and a plurality of pre-existing multiple fine uneven surfaces recessed 462, an example of a conventional manufacturing method by chemical etching will be explained with reference to Figure 21.

Figure 21 is a schematic diagram illustrating the process of manufacturing a plate for pressing using a conventional chemical corrosion etching process with a conventional resist material.
In Figure 21, (A) a substrate for printing plates is prepared in which a pre-existing multiple fine uneven surface 46 having multiple pre-existing multiple fine uneven surface protrusions 461 and multiple pre-existing multiple fine uneven surface recesses 462 is formed by machining or chemical etching using a conventional resist material. The depth dimension "d1" of the multiple pre-existing multiple fine uneven surface recesses 462 (height dimension of the pre-existing multiple fine uneven surface protrusions 461) is approximately 0.05 mm (approximately 50 μm) to approximately 1 mm (approximately 1000 μm), and the width dimension of the multiple pre-existing multiple fine uneven surface recesses 462 and the width dimension of the pre-existing multiple fine uneven surface protrusions 461 are approximately 0.01 mm (approximately 10 μm) to approximately 1 mm (approximately 1000 μm).
(B) A conventional sheet-like dry film resist material 20 is attached to the surface of the existing multiple fine uneven areas 46. In this case, the sheet-like general-purpose conventional dry film resist material 20 does not adhere completely to the upper surface of the protrusions 461 of the existing multiple fine uneven areas, nor does the sheet-like conventional dry film resist material 20 adhere completely to the sides and bottom surfaces of the recesses 452 of the existing multiple fine uneven areas, and a gap tends to be created between the sheet-like conventional dry film resist material 30 and the existing multiple fine uneven areas 45. The thickness dimension of the sheet-like conventional dry film resist material 30 is approximately 0.02 mm to 0.04 mm (approximately 20 μm to approximately 40 μm).
(C) A conventional dry film resist material attached to the surface of the multiple existing fine uneven parts 46 is covered, and a pre-prepared exposure mask member 23 is set up. Then, (D) exposure such as ultraviolet irradiation, development, curing, etc. are performed to form a conventional cured resist film 30 having the desired shape.
(D) The etching solution is brought into contact with the substrate to which the conventional resist-cured film 30 is attached, and the surface of the plate-making substrate in areas where the conventional resist-cured film 30 is not attached is etched by corrosion, and the area around the multiple existing fine uneven parts 46 is etched by corrosion to a depth of approximately 1 mm in etching depth dimension "d3", thereby forming a second etched recess 121b in the etching process.
(E) Further, the etching process is continued until the depth of the area surrounding the multiple existing fine uneven surfaces 46 reaches a predetermined depth, thereby forming a conventional second etched recess 121a with a depth dimension "d12a" of approximately 2 mm.
(F) Remove the conventionally cured resist film 30.

In this manufacturing method, in (E), the recessed side surface of the pre-existing multiple fine unevenness recess 462 to which the conventional resist-cured film 30 is not attached is also corroded and etched, and a side-etched portion is created in which the side surface of the pre-existing multiple fine unevenness protrusion 461 is corroded and etched by the side-etching phenomenon, forming a side-etched pre-existing multiple fine unevenness protrusion side surface 461s (side-etched pre-existing multiple fine unevenness recess side surface 462s), and as a result, there is a problem that a pre-existing multiple fine unevenness protrusion that maintains the shape of a normal multiple fine unevenness pattern is not formed. Note that the side surface of the pre-existing multiple fine unevenness protrusion 461 means the same part as the side surface of the pre-existing multiple fine unevenness recess 462, so the side-etched pre-existing multiple fine unevenness protrusion side surface 461s means the same part as the side-etched pre-existing multiple fine unevenness recess side surface 462s.
(F) A pressing plate is manufactured which comprises a recess (conventionally used second recess forming portion 121a) with a depth dimension "D12a" of approximately 2 mm and a projection that protrudes from the recess, and on the surface of the projection a side-etched pre-existing multiple fine uneven surface projection portion 466s is formed, having a side-etched pre-existing multiple fine uneven surface projection portion side surface 461s and a side-etched pre-existing multiple fine uneven surface recess side surface 462s. In addition, the conventional second recess forming portion 121a has the form of a side-etched eroded second recess forming portion 121s.

As described above, in the conventional method of manufacturing a pressing plate using conventional dry film resist material 20, the sides of the existing multiple fine uneven protrusions 461 (or the sides of the existing multiple fine uneven recesses 462) are also etched, making it impossible to maintain the initial shape of the existing multiple fine uneven protrusions 461 and the existing multiple fine uneven recesses 462. This presents a problem in that it is not possible to manufacture a pressing plate with the desired shape accuracy and dimensional accuracy.

Furthermore, in the method for manufacturing a pressing plate as described using Figure 21 above, although not shown, even when the pressing plate is manufactured by replacing the (B) step of "attaching the conventional dry film resist material 30" with a step similar to the case where the conventional liquid resist material 20 in Figure 20 is used, "attaching the conventional liquid resist material 20 to the surface of the multiple pre-existing fine irregularities 46", followed by (C) development and resist hardening film formation (setup of exposure mask member, exposure, development), (D) corrosion etching, (E) continuation of corrosion etching, (F) removal of the resist hardening film, etc., there is a problem in that a pressing plate with the desired shape accuracy and dimensional accuracy cannot be manufactured.
In other words, even in this case, a pressing plate is manufactured which comprises a recess (conventionally used second recess forming portion 121a) with a depth dimension "d12a" of approximately 2 mm, and a projection that protrudes from the recess, and a side-etched pre-existing multiple fine unevenness projection 466s is formed on the surface of the projection, having a side-etched pre-existing multiple fine unevenness projection side 461s and a side-etched pre-existing multiple fine unevenness recess side 462s. However, the side of the pre-existing multiple fine unevenness projection 461 (or the side of the pre-existing multiple fine unevenness recess 462) is also etched, making it impossible to maintain the initial shape of the pre-existing multiple fine unevenness projection 461 and the pre-existing multiple fine unevenness recess 462, and thus there is a problem that a pressing plate with the desired shape accuracy and dimensional accuracy cannot be manufactured.

There is a problem in that when a workpiece is processed using a pressing plate with the desired shape and dimensional accuracy, it is not possible to form a workpiece with the desired shape and dimensional accuracy.

The present invention provides a method for manufacturing a pressing plate, which solves the above-mentioned conventional problems. It is a method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, and provides a method for manufacturing a pressing plate that has desired shapes such as desired convex portions, desired recesses, desired uneven portions, desired fine uneven portions, etc., and has desired shape accuracy and dimensional accuracy, while suppressing erosive etching in "areas of the plate-making substrate that must not be etched".

The present invention provides a pressing plate that has desired shapes such as desired convex portions, desired recesses, desired uneven portions, and desired fine uneven portions, and that also has desired shape accuracy and dimensional accuracy, while suppressing corrosive etching in the "areas of the plate-making substrate that must not be etched".

The present invention provides a method for processing workpieces such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, and laminates thereof, which can be processed to produce workpieces having desired shapes such as desired convex portions, desired recesses, desired uneven surfaces, and desired fine uneven surfaces, while also having desired shape accuracy and dimensional accuracy.

The present invention's method for manufacturing a plate for pressing is:
A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing,
(A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12),
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and
A desired region inkjet resist curing film is performed to form a desired region inkjet resist cured film (3) by curing the aforementioned desired region inkjet resist adhesive film.
(C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate to which the desired region inkjet resist cured film (3) is not attached is etched.
This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1),
And,
(D) A step to remove the inkjet resist cured film in the desired region,
It is characterized by comprising the following:

Preferably,
In step (A) above,
The second region surface (12) of the plate-type substrate has one or more smooth, non-irregular areas.
The first region surface (11) of the plate-type substrate has one or more pre-existing uneven surfaces (4),
(i) The surface (12) of the second region of the substrate for the plate mold has a single smooth surface without any irregularities,
When the first region surface (11) of the substrate for the plate mold has one pre-existing uneven portion (4),
The smooth portion is located in the area surrounding the pre-existing uneven portion (4).
The aforementioned pre-existing uneven portion (4) is
(a) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes,
Or,
(b) Having a plurality of pre-existing multiple micro-recessed portions (46) which have a plurality of pre-existing multiple micro-recessed portions (461) formed by a plurality of micro-convex shapes and a plurality of pre-existing multiple micro-recessed portions (462) formed by a plurality of micro-concave shapes,
(ii) The second region surface (12) of the plate-type substrate has a plurality of smooth, even portions,
When the first region surface (11) of the substrate for the plate mold has a plurality of pre-existing uneven portions (4),
Each of the aforementioned smooth areas is located in the surrounding region of each of the aforementioned predetermined areas (4)
Each of the aforementioned multiple pre-existing uneven surfaces (4) is,
(a) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes,
and/or,
(b) Having a plurality of pre-existing multiple micro-recessed portions (46) which have a plurality of pre-existing multiple micro-recessed portions (461) formed by a plurality of micro-convex shapes and a plurality of pre-existing multiple micro-recessed portions (462) formed by a plurality of micro-concave shapes,
In step (B) above,
A desired region inkjet resist film formation step, in which an inkjet resist material (2) is attached by an inkjet method to cover the pre-existing uneven portion (4) on the first region surface (11) of the plate-type substrate (1) to form a desired region inkjet resist film,
And,
The process includes a desired region inkjet resist curing step, which involves curing the aforementioned desired region inkjet resist deposition film to form a desired region inkjet resist cured film (3),
In step (C) above,
The process includes an etching step for a printing plate substrate in which an etching solution is brought into contact with the surface of the printing plate substrate (1) on which the desired region inkjet resist cured film (3) is formed, thereby etching the second region surface (12) of the printing plate substrate where the desired region inkjet resist cured film is not attached, thereby etching the second region surface (12) of the printing plate substrate without etching the pre-existing uneven portion (4), and forming a second recessed portion 121 formed in the shape of a recess, where the second recessed portion 121 formed in the shape of a recess corresponds to the inkjet resist film corrosion recessed portion.
In step (D) above,
The system includes a step for removing the inkjet resist cured film (3) in the desired region,
This allows etching of the second region surface (12) of the plate-type substrate without etching the pre-existing uneven portion (4) to form a second recessed portion (121) for inkjet resist film corrosion, which is formed in a recessed shape, and also forms the pre-existing uneven portion (4) into a protruding shape that protrudes from the second recessed portion (121) for inkjet resist film corrosion.
It is characterized by the following:

The pressing plate of the present invention is a pressing plate manufactured by the method for manufacturing a pressing plate of the present invention.

The present invention's method for processing a workpiece is:
(S-a) A step of supplying a pressing plate (10) manufactured by the pressing plate manufacturing method of the present invention,
(S-b) A step of preparing a pressing device equipped with a first base (92) and a second base (93) facing each other,
(S-d) A step of installing a predetermined receiving plate (94) on the second base (93) of the pressing device,
(S-e) With the workpiece (108) positioned between the pressing plate (10) and the receiving plate (94), the process of driving at least one of the first base (92) and the second base (93) so that the pressing plate (10) and the receiving plate (94) press the workpiece,
This creates a workpiece surface (108) with a surface shape that matches the surface shape of the pre-existing surface (4),
And,
(S-f) A step of driving at least one base of the pressing plate (10) and the receiving plate (94) to separate the pressing plate (10) and the receiving plate (94) from each other and to release the pressure on the workpiece,
This prepares a workpiece in which the workpiece surface (108) has a workpiece surface formed with a workpiece surface area that has been transferred and formed in a manner that matches the surface shape of the pre-existing surface area (4).
It is characterized by comprising the following:

The present invention provides a method for manufacturing a plate for pressing, which offers the following advantages: [(Effect of manufacturing method A: Effect of forming a surface shape with irregularities of desired dimensions using inkjet resist) By using a process that includes chemical etching, which has a simpler process than conventional general-purpose chemical etching, it becomes possible to manufacture a plate for pressing that has desired shapes such as desired protrusions, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing the etching of areas of the plate-making substrate that should not be etched].

In particular, the method for manufacturing a pressing plate of the present invention provides the effect of [(Effect of manufacturing method I-a: Effect of forming pre-existing uneven parts of desired dimensions having a protruding shape by inkjet resist) a chemical corrosion etching process in which a recess and a projection protruding from the recess, and a pre-existing multiple uneven parts having a plurality of pre-existing multiple uneven recesses and a plurality of pre-existing multiple uneven protrusions on the surface of the protrusion, and/or a pre-existing multiple fine uneven parts having a plurality of pre-existing multiple fine uneven protrusions and a plurality of pre-existing multiple fine uneven recesses are formed, and corrosion etching of the "area of the plate mold substrate that must not be etched" is suppressed, thereby enabling the manufacture of a pressing plate having a desired shape].

The pressing plate of the present invention provides the following effect: [Effect of the pressing plate configuration: to obtain a pressing plate having desired shapes such as desired convex portions, desired recesses, desired uneven portions, desired fine uneven portions, etc., and having desired shape accuracy and dimensional accuracy, while suppressing corrosive etching in the "areas of the plate mold substrate that must not be etched"].

The workpiece processing method of the present invention provides the following effect: [Effect of workpiece processing method A: It is possible to prepare workpieces such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, and laminates thereof that have desired shapes such as desired protrusions, desired recesses, desired uneven surfaces, and desired fine uneven surfaces, and that are processed and formed with desired shape accuracy and dimensional accuracy].

A schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to one embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating a plurality of pre-existing fine irregularities formed on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. A schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. This is a schematic diagram of a known pressing device that has a pressing plate configured for pressing, and which can also be used with the pressing plate of the present invention, where (A) is a processing device that has a flat plate type pressing plate configured, and (B) is a roll-type pressing device. A schematic diagram of a known pressing device comprising a pressing plate, which can also be used with the pressing plate of the present invention. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes.

<Regarding the manufacturing method of the pressing plate of the present invention>
[Basic configuration 1]
The present invention's method for manufacturing a plate for pressing has the following configuration.
A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, comprising: (A) a plate-type substrate supply step of supplying a plate-type substrate 1 having a first plate-type substrate surface area 11 and a second plate-type substrate surface area 12; (B) a desired-area inkjet resist film formation step of forming a desired-area inkjet resist film by attaching an inkjet resist material 2 to a desired area of the first plate-type substrate surface area 11 of the plate-type substrate 1 using an inkjet method; and a desired-area inkjet resist cured film formation step of curing the desired-area inkjet resist film to form a desired-area inkjet resist cured film 3; (C) a plate-type substrate etching step of contacting an etching solution with the surface of the plate-type substrate 1 on which the desired-area inkjet resist cured film 3 has been formed, thereby etching the surface of the plate-type substrate 1 where the desired-area inkjet resist cured film 3 is not attached, thereby forming an erosion recess formed in a recess shape on the surface of the plate-type substrate 1; and (D) a desired-area inkjet resist cured film removal step of removing the desired-area inkjet resist cured film 3.
In this way, a pressing plate with a desired uneven surface shape is manufactured.

In addition, in step (A) above, the "process of supplying the substrate for printing plates 1" can also be performed as the "process of preparing the substrate for printing plates 1," as "supply" and "prepare" have similar meanings.
Furthermore, the first region surface 11 of the printing plate substrate is a virtual first region surface of the printing plate substrate, and the second region surface 12 of the printing plate substrate is a virtual second region surface of the printing plate substrate. That is, the first region surface 11 of the printing plate substrate is a virtual first region surface of the printing plate substrate, and the second region surface 12 of the printing plate substrate is a virtual second region surface of the printing plate substrate.
Furthermore, it is preferable to implement a configuration in which the first region surface 11 and the second region surface 12 of the printing substrate are located on adjacent region surfaces, and/or a configuration in which the second region surface 12 of the printing substrate is located on the surrounding region surface of the first region surface 11, and/or a configuration in which the first region surface 11 of the printing substrate is located on the surrounding region surface of the second region surface 12.
Furthermore, as will be explained in "Dependent Configuration 4" and "Dependent Configuration 7" described later, the pre-existing multiple uneven parts 45 having pre-existing multiple uneven parts convex parts 451 and pre-existing multiple uneven parts recessed parts 452 can preferably be a desired graphic character picture pattern formed with at least one uneven shape selected from the group consisting of (a) characters, (b) symbols, (c) figures, (d) patterns, and (e) designs, or a desired fine graphic character picture pattern in which these graphic character picture patterns are formed with fine uneven shapes.

The present invention provides a method for manufacturing a plate for pressing, which offers the following advantages: [(Effect of manufacturing method A: Effect of forming a surface shape with irregularities of desired dimensions using inkjet resist) By using a process that includes chemical etching, which has a simpler process than conventional general-purpose chemical etching, it becomes possible to manufacture a plate for pressing that has desired shapes such as desired protrusions, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing the etching of areas of the plate-making substrate that should not be etched].

The plate-making substrate 1 is not particularly limited. For example, a plate-making substrate 1 made of metal, plastic, or resin, which is commonly used as a plate for pressing processes, can be used.
Particularly preferred are plate mold substrates 1 made of metals such as stainless steel, brass, copper, magnesium, and duralumin, and steels such as iron, cemented carbide (GM MF), powder high-speed steel (YXM), high-speed steel (SKH, HSS), die steel (SKD), alloy tool steel (SKT, SKS), and carbon tool steel (SK).
Cemented carbide is a composite material that possesses hard properties and is not particularly limited, but for example, it is made by sintering carbides of group IVa, Va, and VIa metals of the wear resistance periodic table (e.g., tungsten carbide, WC) with iron-based metals such as Fe, Co, and Ni. It has excellent mechanical properties and is the steel material with the least occurrence of breakage or scratching. Cemented carbides such as WC-Co, WC-TiC-Co, WC-TaC-Co, WC-TiC-TaC-Co, WC-Ni, and WC-Ni-Cr can be used. As cemented carbide, for example, cemented carbides having a hardness of HRA 90 or higher, or a hardness of HRC 70 or higher, such as GM30 (hardness HRA 90) and MF20 (hardness HRA 91), can be preferably used.
High-speed steel is tough, possesses excellent resilience, high resistance, and high heat resistance, and contains 3 to 10% molybdenum-based components. For example, steel materials such as SKH51 (hardness HRC 62 to 64), DC53 (hardness HRC 59 to 61), and SKD (hardness HRC 59 to 61) are preferably used.
Powdered high-speed steel has high toughness, wear resistance, and a hardness greater than that of high-speed steel. It contains 4.7 to 5.3% molybdenum-based components, such as YXM1, and steel materials with a hardness of HRC 64 to 67 are preferably used.
The die steel is resistant to heat and physical impact, and preferably uses steel materials such as SKD11, KD21, KD11, DC53, D2, etc., with a hardness of HRC 59 to 61.

Thus, cemented carbide has a harder hardness than high-speed steel, die steel, alloy tool steel, and carbon tool steel. The types and properties of these steels can be selected as desired from those listed in the Japanese Industrial Standards (JIS). The hardness symbols HRA, HRC, etc., represent the Rockwell hardness according to the Japanese Industrial Standards (JIS).
In this invention, metals containing at least an iron component are defined as steel.
Furthermore, metals such as iron, copper, magnesium, and duralumin refer to metals whose main component is one of these metals, or metals whose main component is one of these metals, with other metals added and contained within.
For pressing plates, these metal, plastic, resin, or rubber plate mold substrates are selected as desired, and plate mold substrates having a desired size and shape are used.

As a desired region inkjet resist film formation step, which involves depositing an inkjet resist material 2 onto a desired region of the first region surface 11 of the printing substrate 1 using an inkjet method, for example, an apparatus similar to an inkjet printing system apparatus commonly used in the field of wiring boards for electronic components and printing can be used to deposit the inkjet resist material 2 onto the desired region of the printing substrate using an inkjet method. For example, using an on-demand inkjet printing system apparatus, the inkjet resist material 2 is ejected from an ejection nozzle equipped with a predetermined number of fine holes, and controlled by CAD data to move relative to the printing substrate, so that the inkjet resist material 2 is deposited and coated onto the desired region of the printing substrate surface with high precision in the form of fine droplets, thereby forming a desired region inkjet resist film deposited on the desired region of the printing substrate 1 with high precision.
As the discharge nozzle, for example, an inkjet printing system device equipped with a nozzle head having a large number (approximately 1,000 to 10,000) discharge nozzles with minute diameters can be used.
The inkjet printing system equipment is not particularly limited, but for example, on-demand inkjet printing system equipment manufactured by Microcraft, Fujifilm, Ishii Hyoki, Keyence, SSI Japan, or other companies similar to these inkjet printing system equipment can be used, provided that the specifications such as the desired ejection frequency, resolution, droplet volume, number of nozzles, etc., have been modified to the desired specifications.
In the embodiment described later, an on-demand inkjet printing system manufactured by Microcraft was used to deposit the inkjet resist material onto the printing plate substrate using an inkjet method.

Preferably, an inkjet printing system apparatus having the following specifications is preferred.
The amount of inkjet resist material droplets ejected from the ejection nozzle is 3 pl to 15 pl, the lateral resolution is 360 dpi, 720 dpi, 1080 dpi, 1440 dpi, or 600 dpi, 900 dpi, 1200 dpi, 1500 dpi, 2400 dpi, the vertical resolution is 720 dpi, 1440 dpi, 2160 dpi, or 1200 dpi, 2400 dpi, the standard resolution is 720 dpi to 1200 dpi, and the minimum line width when the inkjet resist film attached to the desired area is linear is 40 μm to 90 μm.
The thickness of the desired region inkjet resist film is not particularly limited, but for example, a desired region inkjet resist film with a cured thickness of approximately 5 μm to approximately 100 μm is preferably used. More preferably, a desired region inkjet resist film with a thickness of approximately 5 μm to approximately 50 μm is also preferably used.

When using conventional liquid resist materials, the thickness is approximately 50 μm or more, and as the thickness increases, the variation in the thickness of the planar region of the conventional resist coating material increases, making it difficult to form a uniform conventional resist coating. As a result, when using an exposure mask component with ultraviolet light or the like, variations in exposure occur, making it impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when the conventional resist-cured film is used as an etching mask to etch a plate-making substrate, it tends not to be possible to form uneven surfaces with the desired shape and dimensional accuracy.

In contrast, when a desired region inkjet resist film is formed, it is possible to adhere it to a thickness of approximately 100 μm, which is thicker than when using conventional liquid resist materials. Furthermore, by directly exposing the desired region inkjet resist film without developing it using an exposure mask, it is possible to form a desired region inkjet resist cured film even with a desired region inkjet resist film of approximately 50 μm or more in thickness. As a result, when the desired region inkjet resist cured film is used as an etching mask to etch a plate-making substrate, it is possible to form uneven areas with desired shape and dimensional accuracy.
However, when using an inkjet resist material, a desired region inkjet resist film in the range of approximately 5 μm to approximately 50 μm can preferably be produced.

The inkjet resist material 2 is not particularly limited, but can be any conventional general-purpose liquid inkjet resist material used in fields such as the manufacturing of electronic component wiring boards and the photolithography technology field, having the desired viscosity, photoreactivity, temperature reactivity, etc. The inkjet resist material is used for partial protection during chemical corrosion etching, that is, as a corrosion etching mask against etching during chemical corrosion etching. Depending on the etching chemicals used during the corrosion etching of the plate-making substrate, an etching resist material 2 having alkali resistance, acid resistance, etc., and solubility to the etching solution can be selected and used as desired.
For example, a general-purpose conventional inkjet resist material 2 can be used, which is a type of negative-type photoresist that is a fluid material mainly composed of a two-dimensional chemical structure organic polymer material and has the property of chemically crosslinking and curing into a three-dimensional chemical structure crosslinked organic polymer state by ultraviolet irradiation, electron beam irradiation, laser irradiation, or heating and temperature increase. Particularly preferred is an inkjet resist material that chemically reacts and crosslinks by general-purpose ultraviolet irradiation or ultraviolet exposure. Furthermore, it is also preferable to further heat the material at a temperature of 80°C to 150°C after curing into a three-dimensional chemical structure crosslinked organic polymer state to form a further matured cured film.
The inkjet resist cured film 3 formed in this manner provides partial protection during chemical corrosion etching, that is, it functions as a corrosion etching mask during corrosion etching.

Furthermore, the viscosity of the inkjet resist material 2 is not particularly limited. For example, an inkjet resist material 2 having a viscosity of 5 mPa·s to 100 mPa·s (25°C) is preferred, and more preferably 10 mPa·s to 50 mPa·s (25°C) is preferred.
As the viscosity of the inkjet resist material 2 decreases, the thickness of the inkjet resist film tends to decrease, and as the viscosity of the inkjet resist material 2 increases, the thickness of the inkjet resist film tends to increase. An inkjet resist material having a viscosity that allows for the formation of an inkjet resist film of the desired thickness required for its function as a corrosion etching mask is selected and used. Using an inkjet resist material 2 with optimal viscosity, a desired region inkjet resist film having the desired graphic, character, and pattern shape is formed in a desired area on the surface of the printing plate substrate with high precision.

When a printing plate substrate with an uneven surface formed using the above-described inkjet resist material 2 is used, the inkjet resist material can be applied to the desired area of the uneven surface without dripping onto the sides of the recesses or protrusions.
Then, the desired region inkjet resist cured film (3) formed by curing the desired region inkjet resist adhesive film is used as a corrosion etching mask, acting as a partial protective film on the sides of the uneven parts of the plate-making substrate during etching. This exhibits a remarkable effect of enabling etching only the desired region where corrosion etching of the sides of the uneven parts is suppressed.

The specific material of the inkjet resist material is not particularly limited. For example, general-purpose inkjet resist materials used for corroding and etching metals on printed circuit boards in the field of electronic components can be used. Various types of inkjet resist materials with different physical properties are commercially available and supplied by companies such as Taiyo Ink Manufacturing Co., Ltd., Mitsui Chemicals, Go-O Chemical Industries, Ltd., JNC Corporation, Nikko Material Co., Ltd., Asahi Kasei Corporation, Agfarewald Japan Ltd., and Tokyo Ohka Kogyo Co., Ltd., and can be selected and used as desired, such as an inkjet resist material with a desired viscosity that chemically reacts and becomes insoluble under ultraviolet irradiation to form a resist-cured film.

The etching solution used to corrode and etch a desired area of the plate-making substrate 1 is not particularly limited, and a general-purpose etching solution used in the manufacture of pressing processes can be selected and used as desired. The etching solution is not limited, but for example, a general-purpose "ferric chloride aqueous solution" is preferably used.
For example, if the printing plate substrate 1 is made of copper, brass, magnesium alloy, iron, or steel, the etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed using a ferric chloride aqueous solution, and the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has not been attached is etched.
For example, if the printing plate substrate is made of resin, plastic, or rubber, an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed, using a liquid agent capable of dissolving the resin, plastic, or rubber, to etch the surface of the printing plate substrate 1 where the inkjet resist cured film 3 in the desired area is not attached.

The method of contacting the surface of the printing plate substrate 1 with the etching solution is not particularly limited. For example, a method of contacting the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in a desired area has been formed with the etching solution in a shower manner, a method of immersing the printing plate substrate 1 on which the inkjet resist cured film 3 in a desired area has been formed in an etching solution container containing the etching solution, or a paddle blowing method are all preferred contact methods.
Furthermore, as the contact time of the etching solution with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 is formed in the desired region increases, the etching depth of the printing plate substrate increases. Therefore, etching is performed by controlling the etching time to achieve the desired etching depth.

The resist removal method for removing the inkjet resist cured film in a desired region is not particularly limited, and involves using a liquid agent capable of chemically decomposing the inkjet resist cured film, such as an aqueous sodium hydroxide solution, and bringing the aqueous sodium hydroxide solution into contact with the inkjet resist cured film to chemically decompose, dissolve, swell, and/or peel off the inkjet resist cured film, thereby removing the inkjet resist cured film from the plate-type substrate in which the desired region has been etched.

Subsequently, after processes such as washing and drying, a recessed corrosion area is formed on the surface of the printing plate substrate 1.
As described above, the area covered by the inkjet resist cured film 3 in the desired region remains unetched, and an erosion protrusion formation portion is formed as a convex shape, having a shape that protrudes from the bottom surface of the concave shape of the erosion recess formation portion.
In this way, a pressing plate with an uneven surface shape is manufactured.

[Dependency Structure 2]
In the manufacturing method of the pressing plate of the present invention described in [Basic Configuration 1] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented.
In step (A) of [Basic Configuration 1], the second region surface 12 of the plate-making substrate has one or more smooth, non-irregular areas, and the first region surface 11 of the plate-making substrate has one or more pre-existing irregular areas 4.
(i) When the second region surface 12 of the substrate for printing plates has one smooth surface and the first region surface 11 of the substrate for printing plates has one pre-existing uneven surface 4, the smooth surface is located in the area surrounding the pre-existing uneven surface (4), and the pre-existing uneven surface 4 has (a) a pre-existing multiple uneven surface 45 having a plurality of convex shapes and a plurality of pre-existing multiple uneven surface recesses 452 having a plurality of concave shapes, or (b) a pre-existing multiple fine uneven surface 46 having a plurality of fine convex shapes and a plurality of pre-existing multiple fine uneven surface recesses 462 having a plurality of fine concave shapes.
(ii) When the second region surface 12 of the substrate for printing plates has a plurality of smooth areas without irregularities, and the first region surface 11 of the substrate for printing plates has a plurality of pre-existing irregularities 4, each of the plurality of smooth areas is located in the surrounding region of each of the plurality of pre-existing irregularities 4, and each of the plurality of pre-existing irregularities 4 has (a) a plurality of pre-existing multiple irregularities 45 having a plurality of pre-existing multiple irregularity protrusions 451 formed by a plurality of convex shapes and a plurality of pre-existing multiple irregularity recesses 452 formed by a plurality of concave shapes, and/or (b) a plurality of pre-existing multiple fine irregularities 46 having a plurality of pre-existing multiple fine irregularity protrusions 461 formed by a plurality of fine convex shapes and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of fine concave shapes.

In step (B) of [Basic Configuration 1], the process includes a desired region inkjet resist film formation step, in which an inkjet resist material 2 is attached by an inkjet method to cover the pre-existing uneven portion 4 on the surface 11 of the first region of the printing substrate 1 to form a desired region inkjet resist film, and a desired region inkjet resist cured film formation step, in which the desired region inkjet resist film is cured to form a desired region inkjet resist cured film 3.

In step (C) of [Basic Configuration 1], an etching step for the plate-making substrate is provided, in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the inkjet resist cured film 3 in the desired area is formed, and the surface of the second area 12 of the plate-making substrate, on which the inkjet resist cured film in the desired area is not attached, is etched, thereby forming the inkjet resist film corrosion second recess-forming portion 121 which is formed in a recessed shape, without etching the pre-existing uneven portion 4.
Here, the "inkjet resist film corrosion second recess forming portion 121" formed in a recessed shape corresponds to the "corrosion recess forming portion" formed in a recessed shape in the "basic configuration 1" described above.
In step (D) of [Basic Configuration 1], a desired region inkjet resist curing film removal step is provided for removing the desired region inkjet resist curing film 3.

As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the existing uneven portion 4, forming the inkjet resist film corrosion second recess-forming portion 121 which is formed in a recessed shape, and the existing uneven portion 4 is formed into a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.
In this way, a plate for pressing is manufactured.
In addition, the "inkjet resist film corrosion second recess forming section 121" in this dependent configuration 2 corresponds to the "corrosion recess forming section" in the basic configuration 1 described above.

In this configuration, as mentioned above, the viscosity of the inkjet resist material 2 is not particularly limited. For example, an inkjet resist material 2 having a viscosity of 5 mPa·s to 100 mPa·s (25°C) is preferred, and more preferably 10 mPa·s to 50 mPa·s (25°C) is preferred.
As the viscosity of the inkjet resist material 2 decreases, the thickness of the inkjet resist film tends to decrease, and as the viscosity of the inkjet resist material 2 increases, the thickness of the inkjet resist film tends to increase. An inkjet resist material having a viscosity that allows for the formation of an inkjet resist film of the desired thickness required for its function as a corrosion etching mask is selected and used.
By using an inkjet resist material 2 having optimal viscosity, it becomes possible to form an inkjet resist film with a desired thickness and high precision in a desired area on the surface of the printing plate substrate. Furthermore, for example, when a printing plate substrate with multiple pre-existing uneven areas 4 is used, the inkjet resist material attached to each side of the multiple pre-existing multiple uneven areas convex portions 451 formed by multiple convex shapes and multiple pre-existing multiple uneven areas recessed portions 452 formed by multiple concave shapes, and/or multiple pre-existing multiple fine uneven areas convex portions 461 formed by multiple fine convex shapes and multiple pre-existing multiple fine uneven areas recessed portions 462 formed by multiple fine concave shapes does not drip off, and an inkjet resist film is formed in the desired area on each side.
Furthermore, the inkjet resist film attached to the desired area acts as a partial protective film on the sides of the multiple pre-existing multiple protrusions 451 and multiple pre-existing multiple recesses 452, and/or multiple pre-existing multiple fine protrusions 461 and multiple pre-existing multiple fine recesses 462 of the uneven surface during corrosion etching of the substrate for printing plates. As a result, corrosion etching of the sides of the multiple pre-existing multiple protrusions 451 and multiple pre-existing multiple recesses 452, and/or multiple pre-existing multiple fine protrusions 461 and multiple pre-existing multiple fine recesses 462 is suppressed, and a significant effect is achieved in that only the desired area around the pre-existing uneven surface 4 can be etched.

The configuration of the present invention provides the above-mentioned "(Manufacturing method effect a: Effect that enables the formation of a desired uneven surface shape by inkjet resist)," and in particular, "(Manufacturing method effect a-a: Effect that enables the formation of a desired uneven portion having a protruding shape by inkjet resist) a chemical corrosion etching process that produces a plate for pressing with a desired shape, having a recess, a projection protruding from the recess, a plurality of pre-existing multiple uneven portions having a plurality of pre-existing multiple uneven portion recesses and a plurality of pre-existing multiple uneven portion protrusions on the surface of the protrusion, and/or a plurality of pre-existing multiple fine uneven portion protrusions and a plurality of pre-existing multiple fine uneven portion recesses, and suppressing corrosion etching of the "area of the plate-making substrate that must not be etched"."

The method for manufacturing a pressing plate according to the present invention will be described below with reference to the drawings. In the drawings, the shape, size, dimensions, etc. of the pressing plate and its components are not shown precisely, but are schematic outlines to explain the characteristics such as shape, structure, system, and effects.

[Dependency Structure 3]
In the manufacturing method of the pressing plate of the present invention described in [Basic Configuration 1] above, preferably, a manufacturing method of the pressing plate comprising the following "Dependent Configuration 3" can be implemented.
Figures 1 and 2 are schematic diagrams illustrating the manufacturing process of a method for manufacturing a pressing plate according to one embodiment of the present invention.
(A-b), (B-b), (C-b), and (D-b) in Figures 1 and 2 are schematic planar diagrams, while (A), (B), (C), and (D) are schematic cross-sectional diagrams along the line A-A in the schematic planar diagrams.
Figure 3 is a schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention, where (A), (B), (C), and (D) in Figure 3 are schematic cross-sectional diagrams.

In step (A) of the aforementioned dependent configuration 2, as shown in Figures 1, 2(A), (A-b), and 3(A), the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, and the second region surface 12 of the plate-making substrate is located in the peripheral region of the first region surface 11. The pre-existing irregularity 4 has a plurality of pre-existing irregularities 45.
(a) The pre-existing multiple recesses 45 has a plurality of pre-existing multiple recesses 451 formed with a plurality of convex shapes and a plurality of pre-existing multiple recesses 452 formed with a plurality of concave shapes, the plurality of pre-existing multiple recesses 451 has a plurality of pre-existing multiple recesses upper surfaces 451a and a plurality of pre-existing multiple recesses side surfaces 451b, and the plurality of pre-existing multiple recesses 452 has a plurality of pre-existing multiple recesses bottom surfaces 452c and a plurality of pre-existing multiple recesses side surfaces 452b.
Here, the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b correspond to the same surface region.

In step (B) of the aforementioned dependent configuration 2, as shown in Figures 1, 2(B), (B-b), and 3(B), the inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, and the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, thereby forming an inkjet resist film attached to the upper surface of the uneven parts, an inkjet resist film attached to the side surfaces of the uneven parts, and an inkjet resist film attached to the bottom surface of the inkjet recesses. Here, the inkjet resist material 2 is not applied to the surface 12 of the second region of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45.
The (B) step further comprises a desired region inkjet resist curing film step, in which the inkjet resist film attached to the upper surface of the protrusions, the inkjet resist film attached to the side of the protrusions, and the inkjet resist film attached to the bottom surface of the recesses are cured to form a desired region inkjet resist cured film 3 having a desired region inkjet resist film cured on the upper surface of the protrusions, a desired region inkjet resist film cured on the side of the protrusions, and a desired region inkjet resist film cured on the bottom surface of the recesses.
In this way, a desired region inkjet resist cured film 3 is formed, having a cured upper surface film 3a of the desired region inkjet resist protrusions, a cured side surface film 3b of the desired region inkjet resist protrusions, and a cured bottom surface film 3c of the desired region inkjet resist recesses.

Here, since the multiple pre-existing multiple uneven surface areas (convex side surfaces 451b and multiple pre-existing multiple uneven surface areas (concave side surfaces 452b) correspond to the same side surface region, the inkjet resist convex side surface attachment film and the inkjet resist concave side surface attachment film correspond to the same attachment film, and the desired region inkjet resist convex side surface cured film 3b means the same cured film as the desired region inkjet resist concave side surface cured film.

In step (C) of the dependent configuration 2 described above, as shown in Figures 1, 2(C), (C-b), and 3(C), the etching step involves contacting an etching solution with the surface of the plate-making substrate 1, which has a hardened upper surface film 3a of the desired region inkjet resist protrusions, a hardened side surface film 3b of the desired region inkjet resist protrusions, and a hardened bottom surface film 3c of the desired region inkjet resist recesses, to etch the second region surface 12 of the plate-making substrate to which the hardened upper surface film 3 of the desired region inkjet resist is not attached.
As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the pre-existing multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the pre-existing multiple uneven portions 45 are formed into inkjet film corrosion pre-existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

In step (D) of the dependent configuration 2 described above, as shown in Figures 1, 2(D), (D-b), and 3(D), the process includes a resist curing film removal step in which the curing film 3a on the upper surface of the desired region inkjet resist protrusions, the curing film 3b on the side surface of the desired region inkjet resist protrusions, and the curing film 3c on the bottom surface of the desired region inkjet resist are removed.

As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the pre-existing multiple recesses 45, and the first region surface 11 of the plate-making substrate, which has a pre-existing multiple recesses 45 having a plurality of pre-existing multiple recesses 451 and a plurality of pre-existing multiple recesses 452, is formed in the form of an inkjet film corrosion pre-existing multiple recesses projection portion 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
As shown in Figures 1, 2(D), (D-b), and 3(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "D12", and the depth dimensions of the multiple pre-existing multiple uneven portions convex portions 451 and the multiple pre-existing multiple uneven portions concave portions 452 each maintain the initial depth dimension "D1".
In this way, a plate for pressing is manufactured.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, "(Manufacturing method effect A-a: Effect that enables the formation of a desired uneven portion having a protruding shape using an inkjet resist) a chemical corrosion etching process that produces a pressing plate having a desired shape, in which a recess, a projection protruding from the recess, and a plurality of pre-existing multiple uneven portions having a plurality of pre-existing multiple uneven recesses and a plurality of pre-existing multiple uneven protrusions on the surface of the projection, are formed, and corrosion etching of the "area of the plate-making substrate that must not be etched" is suppressed."
In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the multiple pre-existing multiple uneven portion protrusions side surfaces 451b (the same side surfaces as the multiple pre-existing multiple uneven portion recess surfaces 452b)" which are areas of the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape."

The manufacturing processes for the pressing plates shown in Figures 1, 2, and 3 differ from each other in the following respects.

In the manufacturing process of the pressing plate shown in Figure 1, in step (A), the recessed portion 452 of the pre-existing multiple uneven portion 45 in Figure 1(A) has a depth of "D1", and the surface of the second region 12 of the plate mold substrate has the same height as the upper surface 451a of the pre-existing multiple uneven portion 45.
In step (B), as shown in Figure 1(B), an inkjet resist cured film 3 is formed to cover all areas of the pre-existing multiple uneven surfaces, including the convex side surfaces 451b, the concave bottom surfaces 452c, and the concave side surfaces 452b.
(C) In step (C), as shown in Figure 1(C), the areas where the inkjet resist cured film 3 has not been formed in the desired area are etched by corrosion to form the inkjet resist film corrosion second recess formation area 121.
In step (D), as shown in Figure 1(D), the inkjet resist cured film 3 in the desired area is removed, thereby forming the inkjet film corrosion multiple uneven portion protrusions 455 which have a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion 121.
In other words, as shown in Figure 1(D), the surrounding region of the pre-existing multiple uneven portions 45 maintains the depth "D1" of the initial pre-existing multiple uneven portion recess bottom surface 452c, and a second inkjet resist film corrosion recess forming portion 121 having a depth "D12" is formed in the surrounding region, thereby forming an inkjet film corrosion pre-existing multiple uneven portion protrusion portion 455 that protrudes from the second inkjet resist film corrosion recess forming portion 121.

In the manufacturing process for a pressing plate shown in Figure 2, in step (A), the pre-existing multiple recesses 452 of the pre-existing multiple recesses 45 in Figure 2(A) have a depth "D1", and the second region surface 12 of the plate mold substrate has the same height shape as the bottom surface of the pre-existing multiple recesses 452c of the pre-existing multiple recesses 45. This height shape of the second region surface 12 of the plate mold substrate is different from the height shape of the second region surface 12 of the plate mold substrate in Figure 1(A).
In step (B), as shown in Figure 2(B), an inkjet resist cured film 3 is formed in the desired region by covering all areas of the pre-existing multiple uneven surface convex side surface 451b, the multiple pre-existing multiple uneven surface recess bottom surface 452c, and the multiple pre-existing multiple uneven surface recess side surface 452b.
In step (C), as shown in Figure 2(C), the areas where the inkjet resist cured film 3 has not been formed in the desired area are etched by corrosion to form the inkjet resist film corrosion second recess formation area 121.
In step (D), as shown in Figure 2(D), the desired region of the inkjet resist cured film 3 is removed, thereby forming the inkjet film corrosion multiple uneven portion protrusions 455 which have a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion 121.
In other words, as shown in Figure 2(D), the surrounding region of the pre-existing multiple uneven portions 45 forms an inkjet resist film corrosion second recess forming portion 121 having a depth "D12", and the pre-existing multiple uneven portions 45 are formed on an inkjet film corrosion pre-existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion 121.

In the manufacturing process for the pressing plate shown in Figure 3, in step (A), as shown in Figure 3(A), the second region surface 12 of the plate mold substrate has a plurality of smooth, even areas, and the first region surface 11 of the plate mold substrate has a plurality of pre-existing uneven areas 4.
Each of the multiple pre-existing uneven surfaces 4 has a pre-existing multiple uneven surface 45, and the pre-existing multiple uneven surface recess 452 of the pre-existing multiple uneven surface 45 has a depth (the same as the height of the pre-existing multiple uneven surface protrusion 451) of "D1".
The surface of each smooth, non-irregular portion of the second region surface 12 of the printing plate substrate has the same height and shape as the upper surface 451a of the pre-existing multiple irregular portions 45.
In step (B), as shown in Figure 3(B), a desired region inkjet resist cured film 3 is formed to cover all areas of each of the pre-existing multiple uneven portion protrusions side surfaces 451b, each of the pre-existing multiple uneven portion recesses bottom surfaces 452c, and each of the pre-existing multiple uneven portion recesses side surfaces 452b. Furthermore, a desired region inkjet resist cured film 3 is also formed on the area of the second region surface 12 of the plate-making substrate that is only in the area surrounding the pre-existing multiple uneven portion 45. In this case, the desired region inkjet resist cured film 3 is not formed in the central area of the second region surface 12 of the plate-making substrate that is located between adjacent pre-existing multiple uneven portion 45.
In step (C), as shown in Figure 3(C), the areas where the inkjet resist cured film 3 has not been formed in the desired area are etched by corrosion to form the inkjet resist film corrosion second recess forming area 121.
In step (D), as shown in Figure 3(D), the desired region of the inkjet resist cured film 3 is removed, thereby forming a plurality of inkjet resist film corrosion second recess forming portions 121, and the plurality of pre-existing uneven portions 45 are formed in the form of inkjet film corrosion pre-existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portions 121.
In other words, as shown in Figure 3(D), multiple inkjet resist film corrosion second recess formation portions 121 having a depth "D12" are formed, and multiple inkjet film corrosion pre-existing multiple uneven portion protrusions 455 are formed, each having a state in which the pre-existing multiple uneven portion 45 maintains the initial depth "D1" of the bottom surface 452c of the pre-existing multiple uneven portion recess.

In Figures 1, 2, and 3, "D1" represents the height dimension of the protrusions 451 and the depth dimension of the recesses 452 of the existing multiple uneven surfaces. Since the depth of the recesses 452 of the existing multiple uneven surfaces represents the same area as the height of the protrusions 451, the depth dimension of the recesses 452 of the existing multiple uneven surfaces has the same "D1" as the height dimension of the protrusions 451.
"W1" indicates the width dimension of the protrusions 451 of the pre-existing multiple uneven surfaces, and "W2" indicates the width dimension of the recesses 452 of the pre-existing multiple uneven surfaces.

[Dependency Structure 4]
In the manufacturing method of the pressing plate described in [Dependent Configuration 3] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented.
In step (A) above, the pre-existing multiple uneven parts 45 having pre-existing multiple uneven parts convex parts 451 and pre-existing multiple uneven parts recessed parts 452 is formed to have a graphic character picture pattern formed by at least one uneven shape selected from the group consisting of (a) letters, (b) symbols, (c) figures, (d) pictures, and (e) patterns.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired dimensional uneven surface shape using inkjet resist)" and "(Manufacturing method effect A-a: Effect that enables the formation of a desired dimensional uneven portion having a protruding shape using inkjet resist)," and in particular, "(Manufacturing method effect A-ab: Effect that enables the manufacture of a pressing plate having a surface formed of recesses, protrusions, and/or uneven portions having a desired graphic, character, or pattern shape) having a desired dimensional shape, (a) character, (b) symbol, (c) figure, (d) pattern The effect is obtained that it is possible to manufacture a pressing plate having a surface formed of recesses, protrusions, and/or uneven surfaces having desired graphic character patterns such as (e) patterns, and that corrosion etching of areas that should not be etched is suppressed, and it is possible to manufacture a pressing plate that has the desired shape and desired dimensions such as the desired height dimension of the protrusions, the depth dimension of the recesses, the desired height dimension and depth dimension of the uneven surfaces, etc.
In particular, "side etching," which occurs when "the sides of each pre-existing multiple uneven surface, specifically the convex side surface 451b and the concave side surface 452b of each pre-existing multiple uneven surface," are corroded and etched, is suppressed.

[Dependency Structure 5]
In the manufacturing method of the pressing plate of the above-described [dependent configuration 3] and/or [dependent configuration 4], the respective shapes and dimensions are not particularly limited, but for example, a manufacturing method of the pressing plate having the following configuration is preferably implementable.
In step (A) of the above-described [dependent configuration 3] and/or [dependent configuration 4], the height dimension "D1" of each of the multiple pre-existing multiple recessed and recessed protrusions 451 is not particularly limited, but is preferably 0.1 mm or more, more preferably 0.1 mm to 3.0 mm, even more preferably 0.3 mm to 2.0 mm, and even more preferably 0.5 mm to 1.0 mm.
The width dimension "W1" of each of the multiple pre-existing multiple recessed or protruding parts 451 is not particularly limited.
The depth dimension "D1" of each of the multiple pre-existing multiple recesses 452 is not particularly limited, but is preferably 0.1 mm or more, more preferably 0.1 mm to 3.0 mm, even more preferably 0.3 mm to 2.0 mm, and even more preferably 0.5 mm to 1.0 mm.
The width dimension "W2" of each of the multiple pre-existing multiple recesses 452 is not particularly limited.
Here, the depth of the pre-existing multiple uneven portion recess 452 is the same as the height of the pre-existing multiple uneven portion protrusion 451, and the depth dimension "D1" of the pre-existing multiple uneven portion recess 452 is the height dimension "D1" of the pre-existing multiple uneven portion protrusion 451.
If the depth dimension "D1" of the pre-formed multiple uneven recesses 452 (the height dimension "D1" of the pre-formed multiple uneven protrusions 451) is less than 0.1 mm, when a workpiece is pressed using a pressing plate on which the pre-formed multiple uneven protrusions 45 have been formed, it tends not to be possible to obtain a workpiece with an uneven shape having the pre-formed multiple uneven recesses 452 of the desired depth and the pre-formed multiple uneven protrusions 451 of the desired height.

Generally, for flat-pressure type pressing devices, a plate-type plate-type pressing device base with a thickness of 7 mm is commonly used, corresponding to the movable stroke of the base of the rated flat-pressure device. Then, taking into account the thickness of the workpiece to be processed, the depth of the uneven parts, etc., a pressing plate having a depth dimension "D1" of the pre-existing multiple uneven recesses 452 is manufactured. From this viewpoint, a depth dimension "D1" of the pre-existing multiple uneven recesses 452 is preferably 0.1 mm to 3 mm.

The depth dimension "D12" of the inkjet resist film corrosion second recess formation portion 121 is not particularly limited, but is greater than the depth dimension "D1" of the aforementioned pre-existing multiple recesses, and is preferably 1.0 mm or more, more preferably 1.5 mm to 5 mm, and even more preferably 1.8 mm to 3 mm.
When the depth dimension "D12" of the second recess formation portion 121 of the inkjet resist film corrosion is smaller than the depth dimension "D1" of the pre-existing multiple uneven portion recess 452, when a workpiece is pressed using a pressing plate on which the pre-existing multiple uneven portion 45 has been formed, the area of the pre-existing multiple uneven portion 45 on the pressing plate tends not to be able to press the surface of the workpiece to the desired depth, and a workpiece processed with an uneven shape having the pre-existing multiple uneven portion recess 452 of the desired depth and the pre-existing multiple uneven portion protrusion 451 of the desired height tends not to be obtained.

Generally, as a conventional technique, if the dimensions of each of the pre-existing multiple protrusions 45 do not fall within the above range, it tends to become impossible to process the workpiece into the desired shape. However, in the present invention, it is possible to implement the method even if the dimensions do not fall within the above range, although in this case, it tends to be more difficult to obtain a workpiece with the desired shape compared to when the dimensions fall within the above range.

Figure 8 is a schematic diagram illustrating the shape of a graphic character or pictogram pattern formed by relief on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention.
In the present invention, a pressing plate equipped with multiple inkjet-etched pre-formed uneven protrusions 455 is also possible. For example, a pressing plate equipped with multiple inkjet-etched pre-formed uneven protrusions 455 as shown in Figure 8(A) is possible. In Figure 8, the "ABCDE pattern,""heartpattern," and "star pattern" shown in black are pressing plates formed as inkjet-etched pre-formed uneven protrusions 455.

[Dependency Structure 6]
In the manufacturing method of the pressing plate of the present invention described in [Basic Configuration 1] above, it is preferable that a manufacturing method of the pressing plate comprising the following "Dependent Configuration 6" can be implemented.
Figures 4 and 6 are schematic diagrams illustrating the manufacturing process for a method of manufacturing a pressing plate according to one embodiment of the present invention.
Figures 4 (A-b), (B-b), (C-b), and (D-b) are schematic planar diagrams, and (A), (B), (C), and (D) are schematic cross-sectional diagrams along the line B-B in the schematic planar diagrams.
In Figure 4, the schematic plan view and the schematic cross-sectional view do not represent identical convex and concave shapes. For example, the "heart pattern" in the schematic plan view is formed by multiple fine convex and concave shapes as shown in the schematic cross-sectional view, illustrating a structure that forms a heart pattern as a whole. Furthermore, the number of convex and concave shapes in the schematic cross-sectional view does not correspond to the number of convex and concave shapes forming the "heart pattern" in the schematic plan view. In reality, the number of concave and convex shapes in the schematic cross-sectional view is significantly greater than the number shown.

As shown in Figures 4(A) and 4(A-b), in step (A) of the aforementioned dependent configuration 2, the plate-making substrate 1 has a first plate-making substrate surface area 11 and a second plate-making substrate surface area 12, the second plate-making substrate surface area 12 has a smooth surface without irregularities, and the first plate-making substrate surface area 11 has a pre-existing irregularity 4. The second plate-making substrate surface area 12 is located in the peripheral region of the first plate-making substrate surface area 11.
In Figure 4, the first region surface 11 of the substrate for printing plates has a single pre-existing uneven surface 4.
(b) The pre-existing uneven portion 4 has a plurality of pre-existing fine uneven portions 46, the plurality of pre-existing fine uneven portions 46 has a plurality of pre-existing fine uneven portion protrusions 461 and a plurality of pre-existing fine uneven portion recesses 462, the plurality of pre-existing fine uneven portion protrusions 461 has a plurality of pre-existing fine uneven portion upper surfaces 461a and a plurality of pre-existing fine uneven portion protrusion sides 461b, and the plurality of pre-existing fine uneven portion recesses 462 has a plurality of pre-existing fine uneven portion bottom surfaces 462c and a plurality of pre-existing fine uneven portion recess sides 462b.
Here, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b correspond to the same side region.
As shown in Figure 4(A), the thickness dimension of the plate-making substrate 1 is "h", the depth dimension "d1" of each of the multiple pre-made multiple fine uneven recesses 462 is "w2", and the width dimension is "w2". Similarly, the height dimension "d1" of each of the multiple pre-made multiple fine uneven protrusions 461 is "w1". Here, the depth of the pre-made multiple fine uneven recesses 462 is the same as the height of the pre-made multiple fine uneven protrusions 461, and the depth dimension "d1" of the pre-made multiple fine uneven recesses 462 is the same as the height dimension "d1" of the pre-made multiple fine uneven protrusions 461.

As shown in Figures 4(B) and 4(B-b), step (B) includes an inkjet resist film formation step in which an inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces 461a of the multiple pre-existing multiple fine uneven parts, the side surfaces 461b of the multiple pre-existing multiple fine uneven parts, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven parts, thereby forming an inkjet resist film attached to the upper surface of the fine uneven parts, an inkjet resist film attached to the side surfaces of the fine uneven parts, and an inkjet resist film attached to the bottom surface of the fine recesses. Here, the inkjet resist material 2 is not applied to the surface 12 of the second region of the plate-making substrate located in the area surrounding the pre-existing multiple fine uneven parts 46.
Furthermore, the method includes an inkjet resist curing film formation step, in which an inkjet resist curing film is formed by curing the inkjet resist curing film attached to the upper surface of the fine protrusions of the inkjet resist, the inkjet resist curing film attached to the side of the fine protrusions of the inkjet resist, and the inkjet resist curing film attached to the side of the fine recesses of the inkjet resist to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film on the upper surface of the fine protrusions of the inkjet resist, a desired region inkjet resist curing film on the side of the fine protrusions of the inkjet resist, and a desired region inkjet resist curing film on the bottom surface of the fine recesses of the inkjet resist.
In this way, a desired region inkjet resist cured film 3 is formed, having a desired region inkjet resist fine protrusion upper surface cured film 3e, a desired region inkjet resist fine protrusion side surface cured film 3f, and a desired region inkjet resist fine recess bottom surface cured film 3g.

Here, since the multiple pre-existing fine multiple uneven surface convex side surfaces 461b and the multiple pre-existing fine multiple uneven surface concave side surfaces 462b correspond to the same side surface region, the inkjet resist fine convex side surface attachment film and the inkjet resist fine concave side surface attachment film correspond to the same attachment film, and the desired region inkjet resist fine convex side surface cured film 3f means the same cured film as the desired region inkjet resist fine concave side surface cured film.

As shown in Figures 4(C) and 4(C-b), step (C) includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1, which has a hardened upper surface film 3e of the desired region inkjet resist fine protrusions, a hardened side surface film 3f of the desired region inkjet resist fine protrusions, and a hardened bottom surface film 3g of the desired region inkjet resist fine recesses, to etch the second region surface 12 of the plate-making substrate to which the hardened upper surface film 3 of the desired region inkjet resist does not adhere.
As a result, without etching the existing multiple fine uneven areas 46, the surface 12 of the second region of the plate-making substrate is etched to a depth dimension of "d12", forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the existing multiple fine uneven areas 46 are formed into inkjet film corrosion existing multiple fine uneven area protrusions 466 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

As shown in Figures 4(D) and (D-b), step (D) includes a resist curing film removal step in which the upper surface curing film 3e of the desired region inkjet resist fine protrusions, the side surface curing film 3f of the desired region inkjet resist fine protrusions, and the bottom surface curing film 3g of the desired region inkjet resist fine recesses are removed.
As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the existing multiple fine uneven portions 46, and the first region surface 11 of the plate-making substrate, which has an existing multiple fine uneven portion 46 having a plurality of existing multiple fine uneven portion protrusions 461 and a plurality of existing multiple fine uneven portion recesses 462, is formed in the form of an inkjet film corrosion existing multiple fine uneven portion protrusion 466 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
As shown in Figure 4(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "d12", and the depth dimensions of the multiple pre-existing multiple fine uneven portions convex portions 461 and the multiple pre-existing multiple fine uneven portions concave portions 462 each maintain the initial depth dimension "d1".
In this way, a plate for pressing is manufactured.

This configuration provides the aforementioned "(Manufacturing method effect a: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, "(Manufacturing method effect a-b: Effect that enables the formation of a desired number of pre-existing fine uneven parts of a desired size having a protruding shape using an inkjet resist) Effect that enables the manufacture of a pressing plate having a desired shape, in which a recess and a projection protruding from the recess and a plurality of pre-existing fine uneven parts having a plurality of pre-existing multiple fine uneven recesses and a plurality of pre-existing multiple fine uneven protrusions on the surface of the projection are formed, and corrosion etching of the "area of the plate-making substrate that must not be etched" is suppressed."
In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the multiple pre-existing multiple fine uneven portion protrusions side surfaces 461b (the same side surfaces as the multiple pre-existing multiple fine uneven portion recess surfaces 462b)" which are areas of the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape."
In particular, "side etching," which occurs when "the sides of each of the pre-existing multiple micro-protrusions, protrusions 461b and recesses 462b," which are areas that should not be etched, is corroded and etched, is suppressed.

In the "dependent configuration 6" described above, it is also possible to implement a configuration in which the first region surface 11 of the plate-making substrate has a plurality of pre-existing uneven portions 4.
Figures 6 (A-b), (B-b), (C-b), and (D-b) are schematic planar diagrams, and (A), (B), (C), and (D) are schematic cross-sectional diagrams along the line B-B in the schematic planar diagrams.
In step (A) of the aforementioned "dependent configuration 2", the plate mold substrate 1 has a first plate mold substrate surface area 11 and a second plate mold substrate surface area 12, the second plate mold substrate surface area 12 has a smooth surface without irregularities, and the first plate mold substrate surface area 11 has a plurality of pre-existing irregularities 4.
In Figure 6, the first region surface 11 of the plate-making substrate has a plurality of pre-existing uneven surfaces 4.
(b) Each of the multiple pre-existing uneven surfaces 4 has multiple pre-existing fine uneven surfaces 46, and each of the multiple pre-existing fine uneven surfaces 461 has multiple pre-existing fine uneven surface protrusions 461 and multiple pre-existing fine uneven surface recesses 462, each of the multiple pre-existing fine uneven surface protrusions 461 has multiple pre-existing fine uneven surface protrusions upper surfaces and multiple pre-existing fine uneven surface protrusions side surfaces, and each of the multiple pre-existing fine uneven surface recesses 462 has multiple pre-existing fine uneven surface recesses bottom surfaces and multiple pre-existing fine uneven surface recesses side surfaces.
Here, the side surfaces of the multiple pre-existing multiple micro-uneven areas and the side surfaces of the multiple pre-existing multiple micro-uneven areas correspond to the same side surface region.

As shown in Figures 6(B) and (B-b), step (B) includes an inkjet resist film formation step in which an inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces of multiple pre-existing multiple fine uneven parts, the side surfaces of multiple pre-existing multiple fine uneven parts (side surfaces of multiple pre-existing multiple fine uneven parts), and the bottom surfaces of multiple pre-existing multiple fine uneven parts, thereby forming an inkjet resist film attached to the upper surface of the fine uneven parts, an inkjet resist film attached to the side surfaces of the fine uneven parts, and an inkjet resist film attached to the bottom surface of the fine uneven parts. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate-making substrate located in the area surrounding the pre-existing multiple fine uneven parts 46.
Furthermore, the method includes a desired region inkjet resist curing film formation step, in which the inkjet resist fine protrusion upper surface film, the inkjet resist fine protrusion side surface film, and the inkjet resist fine recess bottom surface film are cured to form a desired region inkjet resist fine protrusion upper surface cured film 3e, a desired region inkjet resist fine protrusion side surface cured film 3f, and a desired region inkjet resist fine recess bottom surface cured film 3g.

As shown in Figures 6(C) and (C-b), step (C) includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1, which has a hardened film 3e on the upper surface of the desired region inkjet resist fine protrusions, a hardened film 3f on the side surface of the desired region inkjet resist fine protrusions, and a hardened film 3g on the bottom surface of the desired region inkjet resist fine recesses, to etch the second region surface 12 of the plate-making substrate to which the hardened film of the desired region inkjet resist is not attached.
As a result, without etching the multiple pre-existing multiple fine uneven areas 46, the surface 12 of the second region of the plate-making substrate is etched to a depth dimension of "d12", forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the multiple pre-existing multiple fine uneven areas 46 are formed into inkjet film corrosion pre-existing multiple fine uneven area protrusions 466 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

As shown in Figures 6(D) and (D-b), step (D) includes a resist curing film removal step in which the upper surface curing film 3e of the desired region inkjet resist fine protrusions, the side surface curing film 3f of the desired region inkjet resist fine protrusions, and the bottom surface curing film 3g of the desired region inkjet resist fine recesses are removed.
As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the multiple pre-existing multiple fine uneven portions 46, and the first region surface 11 of the plate-making substrate, each having multiple pre-existing multiple fine uneven portions 46 having multiple pre-existing multiple fine uneven portions protrusions 461 and multiple pre-existing multiple fine uneven portions recesses 462, is formed in the form of an inkjet film corrosion pre-existing multiple fine uneven portion protrusion 466 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
As shown in Figure 6(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "d13", and the depth dimensions of the multiple pre-existing multiple fine uneven portions convex portions 461 and the multiple pre-existing multiple fine uneven portions concave portions 462 each maintain the initial depth dimension "d1".
In this way, a plate for pressing is manufactured.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a surface shape with irregularities of desired dimensions using an inkjet resist)," and in particular, the aforementioned "(Manufacturing method effect A-b: Effect that enables the formation of multiple pre-existing fine irregularities of desired dimensions having a protruding shape using an inkjet resist)."

[Dependency Structure 9]
In the manufacturing method of the pressing plate of the present invention described in [Dependent Configuration 6] above, preferably, a manufacturing method of the pressing plate comprising the following "Dependent Configuration 10" can be implemented.
Figure 5 is a schematic diagram illustrating a plurality of pre-existing fine irregularities formed on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. In Figure 5, (A-b) is a schematic plan view, (A-a) is a schematic cross-sectional view along the line B-B in the schematic plan view, and (B) in Figure 5 is a schematic enlarged view of the area enclosed by the circle in Figure 5 (A-b). Figure 5 (A-a) corresponds to Figure 4 (D), and Figure 5 (A-b) corresponds to Figure 4 (D-b).
In Figures 4 and 5, the inkjet film corrosion pre-existing fine uneven protrusions 466 are formed in a form that protrudes from the inkjet film corrosion second recess formation portion 121, which has an etched and recessed shape. On the surface of the inkjet film corrosion pre-existing fine uneven protrusions 466, a plurality of pre-existing fine uneven protrusions 461 and a plurality of pre-existing fine uneven recesses 462 are formed.
However, in Figures 4 and 5, the shapes of the multiple pre-existing multiple micro-recesses 461 and multiple pre-existing multiple micro-recesses 462 of the inkjet film corrosion-affected multiple micro-recesses 466 do not represent the exact shape or dimensions, but rather show a schematic general shape to explain the shape configuration.

The height dimension "d1" of each of the multiple pre-existing multiple fine uneven protrusions 461 is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.05 mm to 1 mm, even more preferably 0.05 mm to 0.5 mm, and even more preferably 0.08 mm to 0.3 mm.
The width dimension "w1" of each of the multiple pre-existing multiple fine uneven protrusions 461 is not particularly limited, but is preferably 0.0005 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.05 mm to 0.1 mm.

The depth dimension "d1" of each of the multiple pre-existing multiple fine uneven recesses 462 is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.05 mm to 1 mm, even more preferably 0.05 mm to 0.5 mm, and even more preferably 0.08 mm to 0.3 mm.
Furthermore, the depth of the recessed portion of the pre-existing multiple micro-ridges is the same as the height of the convex portion of the pre-existing multiple micro-ridges, and the height dimension "d1" of the convex portion of the pre-existing multiple micro-ridges is the same as the depth dimension "d1" of the recessed portion of the pre-existing multiple micro-ridges.
The width dimension "w2" of each of the multiple pre-existing multiple fine uneven recesses 462 is not particularly limited, but is preferably 0.0005 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.05 mm to 0.1 mm.
If the depth dimension "d1" of the recessed portion of the pre-existing multiple micro-recesses (the height dimension "d1" of the convex portion of the pre-existing multiple micro-recesses) is less than 0.05 mm, when a workpiece is pressed using a pressing plate with the pre-existing multiple micro-recesses formed on it, it tends not to be possible to obtain a workpiece with a recessed shape having the desired depth of the pre-existing multiple micro-recesses and the desired height of the pre-existing multiple micro-recesses and convex portion.
As the depth dimension "d1" of the recessed portion of the pre-existing multiple micro-recesses (the height dimension "d1" of the protruding portion of the pre-existing multiple micro-recesses) increases, it becomes possible to obtain a workpiece with the desired excellent dimensional accuracy of the micro-recessed shape when pressing a workpiece using a pressing plate with multiple pre-existing multiple micro-recesses formed thereon. As "d1" exceeds 1 mm, for example, when foil stamping is performed using a sheet-like foil material, the proportion of problems such as the sheet-like foil material tearing during pressing tends to increase.

Multiple of these pre-existing multiple micro-recesses, protrusions 461 and recesses 462, come together to form an inkjet film corrosion pre-existing multiple micro-recess protrusion 466. The number of multiple pre-existing multiple micro-recesses, protrusions 461 and recesses 462 is not particularly limited, but for example, it can range from 10 to 10,000.

The depth dimension "d12" of the inkjet resist film corrosion second recess formation portion 121 is not particularly limited, but is greater than the depth dimension "d1" of the pre-existing multiple fine uneven recesses, and is preferably 1.0 mm or more, more preferably 1.5 mm to 5 mm, and even more preferably 1.8 mm to 2 mm.
When the depth dimension "d12" of the inkjet resist film corrosion second recess formation portion 121 is smaller than the depth dimension "d1" of the pre-existing multiple fine uneven recess portion 462, when a workpiece is pressed using a pressing plate on which the pre-existing multiple fine uneven portions 46 are formed, the area of the pre-existing multiple fine uneven portions 46 on the pressing plate tends not to be able to press the surface of the workpiece to the desired depth, and a workpiece processed with an uneven shape having pre-existing multiple fine uneven recess portion 462 of the desired depth and pre-existing multiple fine uneven protrusion portion 461 of the desired height tends not to be obtained.

Figure 8 is a schematic diagram illustrating the shape of a graphic character or pictogram pattern formed by relief on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention.
For example, a pressing plate equipped with multiple inkjet-etched pre-formed fine uneven protrusions 466, as shown in Figures 8(B) and 8(D), can be manufactured. In Figures 8(B) and 8(D), "ABCDE pattern,""heartpattern," and "star pattern" are formed on the inkjet-etched pre-formed fine uneven protrusions 466, and the surface of each pattern is formed with multiple pre-formed fine uneven protrusions and multiple pre-formed fine uneven recesses.

[Dependency Structure 7]
In the manufacturing method of the pressing plate described in [Dependent Configuration 6] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented.
A method for manufacturing a plate for pressing, wherein in step (A) above, the pre-existing multiple fine uneven parts 46 having a plurality of pre-existing multiple fine uneven parts convex parts 461 and a plurality of pre-existing multiple fine uneven parts recess parts 462 is formed with a fine picture pattern, which is formed by at least one of the multiple fine uneven shapes selected from the group consisting of (f) fine dot patterns, fine pattern patterns, fine picture patterns and/or fine grid patterns, (g) fine line patterns, (h) fine stripe patterns, and (i) latent image patterns that represent different picture patterns when viewed from different directions.

This configuration provides the aforementioned "(Manufacturing method effect a: effect that enables the formation of a desired dimensional uneven surface shape using inkjet resist)" and "(Manufacturing method effect a-b: effect that enables the formation of multiple pre-existing fine uneven parts of desired dimensions having a protruding shape using inkjet resist)", and in particular, "(Manufacturing method effect a-bb: effect that enables the manufacture of a pressing plate equipped with a surface formed of fine uneven parts having a desired fine graphic character pattern shape) having a desired dimensional shape, (f) fine dot pattern, fine graphic pattern, fine picture pattern, and/or fine grid pattern, (g) It is possible to manufacture a pressing plate having a surface formed with fine graphic and pictographic patterns such as fine line patterns, fine stripe patterns, and latent image patterns that represent different graphic and pictographic patterns when viewed from different directions. Furthermore, corrosion etching of areas that should not be etched is suppressed, and it is possible to manufacture a pressing plate having desired shapes and desired size dimensions such as height, depth, and width of each of the multiple pre-existing multiple fine uneven parts 46) which have multiple pre-existing multiple fine uneven parts convex parts 461 and multiple pre-existing multiple fine uneven parts concave parts 462.
In particular, the "side etching phenomenon," in which the "side surfaces 461b of each pre-existing multiple uneven parts and the side surfaces 462b of each pre-existing multiple uneven parts" are corroded and etched, is suppressed.

Furthermore, "fine line patterns" include fine line patterns formed by straight lines, dashed lines, dotted lines, dashed lines, etc. "Fine striped patterns" include fine striped patterns formed by curves of a desired shape, and fine striped patterns formed by wavy curves of a desired shape.
"(Ri) Latent image patterns that represent different pictographic patterns when viewed from different directions" means, in other words, pictographic patterns that are recognized as different pictographic patterns when viewed from different directions.

[Subordinate Structure 8]
In the manufacturing method of the pressing plate according to the above-described [dependent configuration 6] or [dependent configuration 7], a manufacturing method of the pressing plate comprising the following configuration is preferably possible.
Figure 9 is a schematic diagram, or schematic plan view, illustrating the shape of a graphic character or pictogram pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention.
Figures 9(A-a) and (A-b) are plan views illustrating the shapes of multiple pattern cells that are divided into predetermined shapes and arranged in a regular manner, with (A-a) showing multiple pattern cells divided into approximately squares. Figures 9(B-a), (B-b), (B-c), (B-d), (B-e), and (B-f) are schematic enlarged views showing one embodiment of the shape of the uneven pattern formed by the uneven shapes formed in the multiple pattern cells shown in Figures 9(A-a) and (A-b), with (B-a) showing fine left diagonal lines, (B-b) showing fine right diagonal lines, (B-c) showing fine horizontal lines, (B-d) showing fine vertical parallel lines, (B-e) showing fine stripe patterns, and (B-f) showing fine dot patterns. Figure 9(C) shows the form of one embodiment of the uneven pattern formed by the uneven shape in each of the multiple pattern cells. Figures 9(D-a), (D-b), and (D-c) show multiple types of uneven pattern cells formed in Figure 9(C).

As shown in Figures 9 (A-a) and (A-b), in step (A) of the aforementioned [dependent configuration 6] or [dependent configuration 7], the pre-existing multiple fine uneven portion 46 having a plurality of pre-existing multiple fine uneven portion protrusions 461 and a plurality of pre-existing multiple fine uneven portion recesses 462 is formed by a combination of a plurality of types of uneven pattern cells that are engraved with a fine uneven shape, divided into predetermined shapes, and arranged in a regular manner.
As shown in Figures 9 (B-a) to (B-f), each of the multiple types of uneven pattern cells forms a fine graphic character pattern, which is made up of at least two types of fine uneven shapes selected from the group consisting of fine dot patterns, fine patterned patterns, fine picture patterns, fine line patterns, and fine striped patterns.
Furthermore, fine line patterns include fine line patterns formed by straight lines, dashed lines, dotted lines, dashed lines, etc. Fine striped patterns include fine striped patterns formed by curves of a desired shape, and fine striped patterns formed by wavy curves of a desired shape.
As shown in Figure 9(C) and Figure 9(D-a) to (D-c), a first image is formed by combining multiple micro-character patterns of one of two or more types of micro-character patterns, and another image is formed by combining multiple micro-character patterns of a second type, which is different from the first type, from the two or more types of micro-character patterns.
In this way, a plate for pressing is manufactured.

Preferably, in the above configuration, it is possible to implement a configuration in which the first image is recognized when viewed from one direction, and the other image is recognized when viewed from a different direction than the one direction.
In other words, it is preferable to implement a configuration in which multiple micro-picture patterns of one type from two or more types of micro-picture patterns come together to form one image, and multiple micro-picture patterns of other types come together to form another image, so that different images appear and are recognized when viewed from different directions.

For example, in Figure 9, which shows an embodiment, the fine left-diagonal line pattern in Figure 9(C) comes together to form the letter "H" image 46a in Figure 9(D-a), the fine right-diagonal line pattern in Figure 9(C) comes together to form the letter "T" image 46b in Figure 9(D-b), and the fine horizontal line pattern in Figure 9(C) comes together to form the letter "Z" image 46c in Figure 9(D-c). These characters are formed so that different image characters are recognized when viewed from different directions.
In this way, a plate for pressing is manufactured.

Figure 9 shows a schematic shape of the surface of a pressing plate. The workpiece formed by pressing a workpiece using this pressing plate is processed to have a shape with irregularities that match the irregularities formed on the pressing plate used, and is formed so that different image characters are recognized when viewed from different directions.

In Figure 9, the "multiple types of raised and recessed pattern cells divided into predetermined shapes and arranged in a regular manner" have boundary lines formed between each of the pattern cells that are divided into predetermined shapes. However, the configuration is not limited to this, and it is possible to implement a configuration in which no boundary lines are formed between each of the pattern cells, and each pattern cell has a fine graphic character pattern formed by its raised and recessed shape.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, the effect of "(Manufacturing method effect A-b: Effect that enables the formation of a desired number of pre-existing fine uneven parts having a protruding shape using an inkjet resist) a chemical corrosion etching process that produces a pressing plate having a desired shape in which a recess, a projection protruding from the recess, and a plurality of pre-existing fine uneven parts having a plurality of pre-existing multiple fine uneven recesses and a plurality of pre-existing multiple fine uneven protrusions on the surface of the projection, and corrosion etching of the "area of the plate-making substrate that must not be etched" is suppressed, and when a workpiece is pressed using this pressing plate, a pressing plate is obtained that is processed and formed to have an uneven shape that matches the uneven shape formed on the pressing plate used, and is formed so that different image characters can be recognized when viewed from different directions."
In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the multiple pre-existing multiple fine uneven portion protrusions side surfaces 461b (the same side surfaces as the multiple pre-existing multiple fine uneven portion recess surfaces 462b)" which are areas of the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape."
In particular, the "side etching phenomenon," in which the "side surfaces 461b of each pre-existing multiple micro-uneven areas and the side surfaces 462b of each pre-existing multiple micro-uneven areas" are corroded and etched, is suppressed.

[Dependency Structure 10]
In the manufacturing method of the pressing plate described in [Dependent Configuration 1] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented.
Figure 7 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to another embodiment of the present invention.

As shown in Figure 7(A), in step (A) of the aforementioned [dependent configuration 1], the second region surface 12 of the plate-making substrate has a plurality of smooth, non-irregular areas, and the first region surface 11 of the plate-making substrate has a plurality of pre-existing irregular areas 4. The second region surface 12 of the plate-making substrate is located in the peripheral region of the first region surface 11 of the plate-making substrate.
One of the multiple pre-existing uneven surfaces 4 has (a) a multiple pre-existing multiple uneven surface 45 which has multiple convex portions 451 formed by multiple convex shapes and multiple concave portions 452 formed by multiple concave shapes.
One of the multiple pre-existing uneven surfaces 4 has (b) a multiple pre-existing multiple fine uneven surface 46 which has multiple pre-existing multiple fine uneven surface protrusions 461 formed of multiple fine convex shapes and multiple pre-existing multiple fine uneven surface recesses 462 formed of multiple fine concave shapes.
Each of the multiple pre-existing multiple recesses and protrusions, each convex portion 451, has a multiple pre-existing multiple recessed portion convex upper surface 451a and a multiple pre-existing multiple recessed portion convex side surface 451b, and each of the multiple pre-existing multiple recesses and protrusions, each has a multiple pre-existing multiple recessed portion concave surface 452c and a multiple pre-existing multiple recessed portion concave side surface 452b.
Here, the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b correspond to the same surface region.
Each of the multiple pre-existing multiple micro-recesses has a convex portion 461a and a side surface 461b, and each of the multiple pre-existing multiple micro-recesses has a concave portion 462 and a bottom surface 462c and a side surface 462b.
Here, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 456b correspond to the same side region.

In step (B) of the aforementioned [dependent configuration 1], the process includes an inkjet resist film formation step in which the inkjet resist material 2 is applied by inkjet by covering the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, and the upper surfaces 461a of the multiple pre-existing multiple fine uneven parts, the side surfaces 461b of the multiple pre-existing multiple fine uneven parts, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven parts, thereby forming an inkjet resist film attached to the upper surface of the protrusions, an inkjet resist film attached to the side surfaces of the protrusions, an inkjet resist film attached to the bottom surface of the recesses, and an inkjet resist film attached to the upper surface of the fine protrusions, an inkjet resist film attached to the side surfaces of the fine protrusions, and an inkjet resist film attached to the bottom surface of the fine recesses. Here, the inkjet resist material 2 is not applied to the surface 12 of the second region of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45.
In step (B) above, the process further includes a desired region inkjet resist curing film formation step, in which the inkjet resist curing film attached to the upper surface of the protrusions, the inkjet resist curing film attached to the side of the protrusions, the inkjet resist curing film attached to the bottom of the recesses, and the inkjet resist curing film attached to the upper surface of the fine protrusions, the inkjet resist curing film attached to the side of the fine protrusions, and the inkjet resist curing film attached to the bottom of the fine recesses are cured to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film 3a on the upper surface of the protrusions, a desired region inkjet resist curing film 3b on the side of the protrusions, a desired region inkjet resist curing film 3c on the bottom of the recesses, and a desired region inkjet resist curing film 3e on the upper surface of the fine protrusions, a desired region inkjet resist curing film 3f on the side of the fine protrusions, and a desired region inkjet resist curing film 3g on the bottom of the fine recesses.

In step (C) of the aforementioned [dependent configuration 1], the process includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the desired region inkjet resist protrusion upper surface hardened film 3a, desired region inkjet resist protrusion side surface hardened film 3b, desired region inkjet resist recess bottom surface hardened film c), and desired region inkjet resist fine protrusion upper surface hardened film 3e, desired region inkjet resist fine protrusion side surface hardened film 3f, and desired region inkjet resist fine recess bottom surface hardened film 3g are formed, thereby etching the second region surface 12 of the plate-making substrate on which the desired region inkjet resist hardened film is not attached.
As a result, the surface 12 of the second region of the plate-type substrate is etched without etching the existing multiple uneven portions 45 and the existing multiple fine uneven portions 46, thereby forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recessed shape. The existing multiple uneven portions 45 are formed into inkjet film corrosion existing multiple uneven portion protrusions 455 having a protruding shape that extends from the inkjet resist film corrosion second recess-forming portion 121, and the existing multiple fine uneven portions 46 are formed into inkjet film corrosion existing multiple fine uneven portion protrusions 466 having a protruding shape that extends from the inkjet resist film corrosion second recess-forming portion 121.

In step (D) of the aforementioned [dependent configuration 1], a resist curing film removal step is provided to remove the inkjet resist curing film 3 in a desired area. This process etches the surface 12 of the second region of the plate-making substrate without etching the existing uneven portion 4, thereby forming the inkjet resist corrosion second recess formation portion 121, and also forms the existing uneven portion into an inkjet film corrosion existing uneven portion protrusion having a protruding shape that extends from the inkjet resist corrosion second recess formation portion 121.
In other words, the process includes a resist hardening film removal step that removes the hardened film 3a on the upper surface of the desired region inkjet resist protrusions, the hardened film 3b on the side of the desired region inkjet resist protrusions, the hardened film 3c on the bottom surface of the desired region inkjet resist, and the hardened film 3e on the upper surface of the desired region inkjet resist fine protrusions, the hardened film 3f on the side of the desired region inkjet resist fine protrusions, and the hardened film 3g on the bottom surface of the desired region inkjet resist fine recesses.
As a result, the inkjet resist film corrosion second recess-forming portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the existing multiple recessed portions 45 and the existing multiple fine recessed portions 46. The first region surface 11 of the plate-making substrate, which has an existing multiple recessed portion 45 having a plurality of existing multiple protrusions 451 and a plurality of existing multiple recessed portions 452, and an existing multiple fine recessed portion 46 having a plurality of existing multiple fine recessed portions 461 and a plurality of existing multiple recessed portions 462, is formed in the form of inkjet film corrosion existing multiple recessed portion protrusions 455 and inkjet film corrosion existing multiple fine recessed portion protrusions 466, which have a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess-forming portion 121.
In this way, a plate for pressing is manufactured.

This configuration provides the above-mentioned (manufacturing method effect I-a: effect of being able to form pre-existing uneven parts of desired dimensions having a protruding shape using inkjet resist), as well as (manufacturing method effect I-b: effect of being able to form multiple pre-existing fine uneven parts of desired dimensions having a protruding shape using inkjet resist).
In other words, the second recessed portion 121 of the inkjet resist film is formed by corrosion etching, and the effect is obtained that "corrosion etching of multiple pre-existing multiple uneven portion protrusions (the same side surface as the multiple pre-existing multiple uneven portion recesses)" and "multiple pre-existing multiple fine uneven portion protrusions (the same side surface as the multiple pre-existing multiple fine uneven portion recesses)" which are areas of the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape."

Figure 8 is a schematic diagram illustrating the shape of a graphic character or pictogram pattern formed by relief on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention.
As one embodiment of the pressing plate manufactured by this manufacturing method, a pressing plate equipped with both inkjet-etched pre-existing multiple uneven protrusions 455 and inkjet-etched pre-existing multiple fine uneven protrusions 466 can be manufactured, as shown in Figures 8(C), (E), and (F).

[Dependency Structure 11]
In the manufacturing method of the pressing plate described in [Basic Configuration 1] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented.
Figure 10 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to another embodiment of the present invention.
Figures 10(A), (B), (C), and (D) are schematic cross-sectional views illustrating a method for manufacturing a pressing plate. Figures 10(A-a), (B-a), (C-a), and (D-a) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate having a desired graphic, letter, or pictorial pattern formed by reliefs. Figures 10(A-b), (B-b), (C-b), and (D-b) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate having a desired fine graphic, letter, or pictorial pattern formed by reliefs.

As shown in Figure 10(A), the first region surface 11 of the plate-making substrate has a pre-formed protrusion 47, and the second region surface 12 of the plate-making substrate has a pre-formed recess 48. The first region surface 11 of the plate-making substrate is located in the peripheral region of the second region surface 12 of the plate-making substrate. The pre-formed protrusion 47 has a pre-formed protrusion upper surface 47a and a pre-formed protrusion side surface 47b, and the pre-formed recess 48 has a pre-formed recess bottom surface 48c and a pre-formed recess side surface 48b. Here, the pre-formed protrusion side surface 47b and the pre-formed recess side surface 48b correspond to the same side surface.

As shown in Figure 10(B), the (B) step of the [Basic Configuration 1] described above includes a desired region inkjet resist film formation step in which an inkjet resist material 2 is attached to the upper surface 47a of the pre-existing protrusions, covering the side surface 47b of the pre-existing protrusions, the side surface 48b of the pre-existing recesses, and the bottom surface 48c of the pre-existing protrusions by an inkjet method to form a desired region inkjet resist film having (a) a desired graphic character pattern, or (b) a desired fine graphic character pattern, and a desired region inkjet resist cured film formation step in which the desired region inkjet resist film is cured to form a desired region inkjet resist cured film 3.
For example, as shown in Figures 10(B), (B-a), and (B-b), an "ABCDE pattern" formed by a desired region inkjet resist cured film, or a "heart pattern formed by a fine figure, character, and pictogram pattern," is formed on the upper surface 47a of the pre-existing protrusion, and no desired region inkjet resist film is formed in the areas other than the "ABCDE pattern" or the "heart pattern formed by a fine figure, character, and pictogram pattern."

As shown in Figure 10(C), the (C) step of the [Basic Configuration 1] described above includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the desired region inkjet resist cured film 3 is formed, and the areas on the upper surface 47a of the pre-formed protrusions to which the desired region inkjet resist cured film is not attached are etched.
This allows for the formation of a pre-existing protruding upper surface uneven portion 477 having multiple recesses and multiple protrusions by etching the areas on the pre-existing protruding upper surface 47a where the desired region inkjet resist cured film is not attached, without etching the pre-existing protruding side surface 47b, the pre-existing recessed side surface 48b, and the pre-existing recessed bottom surface 48c.
Here, if the inkjet resist cured film 3 in the desired region has a desired graphic, character, or pattern, then, as shown in Figure 10 (C-a), the pre-existing protrusion upper surface uneven portion 477 is a pre-existing protrusion upper surface multiple uneven portion 477a having a plurality of concave shapes corresponding to the desired graphic, character, or pattern and a plurality of protrusions 471a formed by a plurality of convex shapes.
Alternatively, if the inkjet resist cured film 3 in the desired region has a desired fine figure, character, or pattern, then, as shown in Figure 10 (C-b), the pre-existing protrusion upper surface uneven portion 477 is a pre-existing protrusion upper surface multiple fine uneven portion recess 472b formed by a plurality of fine concave shapes corresponding to the desired fine figure, character, or pattern, and a pre-existing protrusion upper surface multiple fine uneven portion protrusion 471b formed by a plurality of fine convex shapes.

As shown in Figure 10(D), the (D) step of the [Basic Configuration 1] described above includes a desired region inkjet resist curing film removal step for removing the desired region inkjet resist curing film 3.
As a result, if the inkjet resist cured film 3 in the desired region has a desired graphic, character, or picture pattern, then, as shown in Figure 10 (D-a), multiple pre-existing protrusions 477a are formed on the upper surface 47a of the pre-existing protrusion, which are pre-existing protrusion upper surface irregularities 477.
Alternatively, if the inkjet resist cured film 3 in the desired region has a desired fine figure, character, or pattern, a plurality of fine uneven surfaces 477b are formed on the upper surface 47a of the pre-existing protrusion, as a pre-existing protrusion upper surface uneven surface 477.
In this way, a pressing plate is manufactured having a pre-formed recess 48 and a pre-formed protrusion 47, wherein a plurality of pre-formed upper surface irregularities 477a, or a plurality of pre-formed upper surface irregularities 477b, are formed on the upper surface of the pre-formed protrusion 477.

In this configuration, the height dimension of each of the multiple pre-existing protrusions 471a (which is the same as the depth dimension of each of the multiple pre-existing recesses 472a) is not particularly limited, but for example, it is preferably 0.1 mm or more, and is smaller (shorter, shallower) than the depth dimension of the pre-existing recess 48.
Furthermore, the height dimension of each of the multiple micro-recesses on the upper surface of the pre-existing protrusions 471b (which is the same as the depth dimension of the recesses 472b on the upper surface of the pre-existing protrusions) is not particularly limited, but for example, it is preferably 0.05 mm or more, and is smaller (shorter, shallower) than the depth dimension of the pre-existing recess 48.
Furthermore, the width dimensions of each of the multiple micro-recesses on the upper surface of the pre-existing protrusions, 471b and 472b, are not particularly limited, but for example, 0.0005 mm to 1 mm is preferably achievable.

This method for manufacturing a pressing plate provides the following effect: [(Effect of manufacturing method A: Effect of forming a surface shape with irregularities of desired dimensions using inkjet resist) By using a process that includes chemical corrosion etching, which has a simpler process than conventional general-purpose chemical corrosion etching, it becomes possible to manufacture a pressing plate that has desired shapes such as desired convex parts, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing corrosion etching in the "areas of the plate-making substrate that must not be etched"].
In other words, without etching areas that should not be etched (the side surface 47b of the pre-existing protrusion, the side surface 48b of the pre-existing recess, and the bottom surface 48c of the pre-existing recess), it is possible to form desired unevenness, desired fine unevenness, etc., on the upper surface 47a of the pre-existing protrusion, such as the upper surface unevenness 477 of the pre-existing protrusion.

[Dependency Structure 12]
In the manufacturing method of the pressing plate described in [Basic Configuration 1] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented.
Figure 11 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to another embodiment of the present invention.
Figures 11(A), (B), (C), and (D) are schematic cross-sectional views illustrating a method for manufacturing a pressing plate. Figures 11(A-a), (B-a), (C-a), and (D-a) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate that has a desired graphic, character, or pictorial pattern formed by relief. Figures 11(A-b), (B-b), (C-b), and (D-b) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate that has a desired fine graphic, character, or pictorial pattern formed by relief.

As shown in Figure 11(A), the first region surface 11 of the printing plate substrate has a pre-formed protrusion 47, and the second region surface 12 of the printing plate substrate has a pre-formed recess 48. The first region surface 11 of the printing plate substrate is located in the peripheral region of the second region surface 12 of the printing plate substrate.
The pre-formed protrusion 47 has a pre-formed protrusion upper surface 47a and a pre-formed protrusion side surface 47b, and the pre-formed recess 48 has a pre-formed recess bottom surface 48c and a pre-formed recess side surface 48b.
Here, the pre-existing protruding side surface 47b and the pre-existing recessed side surface 48b correspond to the same side surface.

As shown in Figure 11(B), the (B) step of the [Basic Configuration 1] described above includes a desired region inkjet resist film formation step in which an inkjet resist material 2 is attached by an inkjet method to cover the pre-existing protruding side surface 47b, the pre-existing recessed side surface 48b, and the pre-existing protruding upper surface 47a, and to the pre-existing recessed bottom surface 48c, thereby forming a desired region inkjet resist film having (a) a desired graphic character pattern, or (b) a desired fine graphic character pattern, and a desired region inkjet resist cured film formation step in which the desired region inkjet resist film is cured to form a desired region inkjet resist cured film 3.
For example, as shown in Figures 11(B), (B-a), and (B-b), the desired region inkjet resist film is not formed in the area of the pre-existing recess bottom surface 48c that has the "ABCDE pattern" or the "heart pattern formed with fine figures and characters," and the desired region inkjet resist cured film is formed in the area excluding the "ABCDE pattern" or the "heart pattern formed with fine figures and characters."

As shown in Figure 11(C), the (C) step of the [Basic Configuration 1] described above includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the desired region inkjet resist cured film 3 is formed, and the areas on the bottom surface 48c of the pre-formed recesses to which the desired region inkjet resist cured film is not attached are etched. As a result, the areas on the bottom surface 48c of the pre-formed recesses to which the desired region inkjet resist cured film is not attached are etched without etching the side surface 47b of the pre-formed protrusions, the side surface 48b of the pre-formed recesses, and the top surface 47a of the pre-formed protrusions, thereby forming a pre-formed recess bottom surface uneven portion 488 having a plurality of recesses and a plurality of protrusions.
Here, if the desired region inkjet resist cured film (3) has a desired graphic, character, or pattern, then, as shown in Figure 11 (C-a), the pre-existing recessed bottom surface uneven portion 488 is a pre-existing recessed bottom surface multiple uneven portion 488a having a plurality of concave shapes corresponding to the desired graphic, character, or pattern and a plurality of convex shapes.
Alternatively, if the desired region inkjet resist cured film 3 has a desired fine figure, character, or pattern, then, as shown in Figure 11(C-b), the pre-existing recess bottom surface uneven portion 488 is a pre-existing recess bottom surface multiple fine uneven portion 488b having a plurality of fine recess shapes corresponding to the desired fine figure, character, or pattern and a plurality of fine convex shapes and a plurality of fine uneven portion 481b.

As shown in Figure 11(D), the (D) step of the [Basic Configuration 1] described above includes a desired region inkjet resist curing film removal step for removing the desired region inkjet resist curing film 3.
As a result, if the inkjet resist cured film 3 in the desired region has a desired graphic, character, or picture pattern, then, as shown in Figure 11 (D-a), a plurality of pre-existing recessed areas 488a are formed on the bottom surface 48c of the pre-existing recess, which are pre-existing recessed area recesses 488.
Alternatively, if the inkjet resist cured film 3 in the desired region has a desired fine figure, character, or pattern, a plurality of fine irregularities 488b are formed on the bottom surface 48c of the pre-existing recess, as a pre-existing recess bottom surface irregularity 488.
In this way, a pressing plate is manufactured having a pre-formed recess 48 and a pre-formed protrusion 47, wherein a plurality of pre-formed recess bottom surface protrusions 488a, or a plurality of pre-formed recess bottom surface protrusions 488b, is formed on the bottom surface of the pre-formed recess 48.

In this configuration, the height dimension of each of the multiple recessed surface protrusions 481a of the multiple recessed surface protrusions 488 (which is the same as the depth dimension of the recess 482a of the multiple recessed surface protrusions 482a) is not particularly limited, but for example, it is preferably 0.1 mm or more, and the depth dimension is smaller (shorter, shallower) than the depth dimension of the original recess 48.
Furthermore, the height dimension of each of the multiple micro-recesses 488b on the bottom surface of the pre-existing recess, which is formed with multiple micro-recesses, is not particularly limited, but it is preferably 0.05 mm or more, and is smaller (shorter, shallower) than the depth dimension of the pre-existing recess 48.
Furthermore, the width dimension of each of the multiple fine uneven portions 488b on the bottom surface of the pre-existing recess (which is the same as the width dimension of the recess 482a) is not particularly limited, but for example, 0.0005 mm to 1 mm is preferably achievable.

This method for manufacturing a pressing plate provides the following effect: [(Effect of manufacturing method A: Effect of forming a surface shape with irregularities of desired dimensions using inkjet resist) By using a process that includes chemical corrosion etching, which has a simpler process than conventional general-purpose chemical corrosion etching, it becomes possible to manufacture a pressing plate that has desired shapes such as desired protrusions, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing corrosion etching in areas of the plate-making substrate that should not be etched].
In other words, without etching areas that should not be etched (the side surface 47b of the pre-existing protrusion, the side surface 48b of the pre-existing recess, and the bottom surface 48c of the pre-existing recess), it is possible to form desired irregularities, desired fine irregularities, and other irregularities on the bottom surface 488 of the pre-existing recess 48c.

[Dependency Structure 13]
In the manufacturing method of the pressing plate described above in [Dependent Configuration 2] to [Dependent Configuration 12], a manufacturing method of the pressing plate having the following configuration is preferably possible.
A method for manufacturing a pressing plate, wherein in step (A), the surface 11 of the first region of the plate-making substrate is formed by (a) chemical etching using an inkjet resist-cured film formed using an inkjet resist material as an etching mask, and/or (b) chemical etching using a resist-cured film formed using a conventional liquid resist material as an etching mask, and/or (c) chemical etching using a resist-cured film formed using a conventional sheet-type dry film resist material as an etching mask, and/or (d) mechanical processing using a conventional machine tool, thereby forming the pre-existing uneven portion 4.
For example, a plate-type substrate having a pre-existing uneven surface 4 having multiple pre-existing uneven surfaces 45 and/or multiple pre-existing fine uneven surfaces 46 as shown in Figures 1, 2, 3, 6, and 7, can be manufactured by chemical corrosion etching using a resist-cured film made from (a) an inkjet resist material, (b) a conventional liquid resist material, (c) a conventional sheet-type dry film resist material, etc., as a mask for corrosion etching, and/or (d) conventional machining.

(a) Chemical etching using an inkjet resist-cured film formed using an inkjet resist material as a mask for etching is a process in which an inkjet resist material used in the manufacturing method of the pressing plate of the present invention is attached to the surface of a plate-making substrate by an inkjet method to form an inkjet resist attachment film, the inkjet resist attachment film is cured to form an inkjet resist-cured film, and the plate-making substrate is chemically etched using an etching solution with the inkjet resist-cured film as a mask for etching to form a pre-existing uneven surface 4. In this chemical etching process using an inkjet resist material, the processing method can be similar to or the same as the method described in "Basic Configuration 1" above.

The inkjet resist material is not particularly limited, and as described in "Basic Configuration 1" above, any inkjet resist material 2 manufactured by a company that supplies general-purpose resist materials, such as Taiyo Ink Manufacturing Co., Ltd., Mitsui Chemicals, Go-O Chemical Industry Co., Ltd., JNC Corporation, Nikko Material Co., Ltd., Asahi Kasei Corporation, Agfarewald Japan Ltd., or Tokyo Ohka Kogyo Co., Ltd., can be used. For example, any inkjet resist material 2 having a viscosity of 5 mPa·s to 100 mPa·s (25°C), preferably 10 mPa·s to 50 mPa·s (25°C), which is desirable as described above, can be used as it chemically reacts with ultraviolet irradiation to become insoluble and form resist hardening.

As the viscosity of the inkjet resist material 2 decreases, the thickness of the inkjet resist film tends to decrease, and as the viscosity of the inkjet resist material 2 increases, the thickness of the inkjet resist film tends to increase. An inkjet resist material having a viscosity that allows for the formation of an inkjet resist film of the desired thickness required for its function as a corrosion etching mask is selected and used. By using an inkjet resist material 2 with optimal viscosity, it becomes possible to form a desired region inkjet resist film with high precision and the desired graphic, character, and pattern shape in a desired area on the surface of the printing plate substrate.

(b) Chemical etching using a resist-cured film formed with conventional liquid resist material as an etching mask is a process in which a conventional liquid resist material is attached to the surface of a plate-making substrate by conventional screen printing, spray coating, curtain coating, spin coating, or other conventional attachment methods, the liquid resist material is dried to form a resist-attached film, the resist-attached film is exposed by ultraviolet irradiation or the like through an exposure mask member having desired through holes, and a resist-cured film is formed through processes such as development and baking, and the resist-cured film is used as an etching mask to chemically etch the surface of the plate-making substrate using an etching solution to form a pre-existing uneven surface 4 with an uneven shape.

The conventional liquid resist material is not particularly limited, and for example, any conventional general-purpose liquid resist material used in the field of photolithography, having the desired viscosity, photoreactivity, temperature reactivity, etc., can be used. For example, a general-purpose conventional liquid resist material 2, which is a type of negative photoresist that is a fluid material mainly composed of an organic polymer material with a two-dimensional chemical structure and has the property of chemically crosslinking and curing into a crosslinked organic polymer state with a three-dimensional chemical structure by ultraviolet irradiation, electron beam irradiation, laser irradiation, or heating, can be used.
Furthermore, while there are no particular limitations on the viscosity of conventional liquid resist materials, it is preferable to use a conventional liquid resist material having a viscosity of 1 mPa·s (25°C) or higher to form a conventional resist-cured film of less than 50 μm (approximately 0.05 mm).
As the viscosity of the resist material 2 decreases, the thickness of the resist film becomes thinner. By using a liquid resist material 2 with optimal viscosity, a resist-cured film of the desired thickness can be formed.

The specific material of the liquid resist material is not particularly limited. For example, general-purpose liquid resist materials used for corrosive etching of metal substrates for printing plates can be used. Preferably, a liquid resist material with a desired viscosity that chemically reacts with ultraviolet irradiation to become insoluble and form a resist harden can be used.

Furthermore, in this processing method using conventional liquid resist material, it is also possible to perform a method in which, without using an exposure mask member, the conventional resist adhesion film or resist curing film is chemically altered by laser irradiation, electron beam irradiation, etc., the resist material is developed to form an etching mask having the desired shape, and this etching mask is used to chemically etch the plate-making substrate using an etching solution to form a pre-existing uneven surface 4.

(c) Chemical etching using a conventional sheet-shaped dry film resist material as a mask for etching involves attaching a conventional sheet-shaped dry film resist material to the surface of a plate-making substrate, exposing the sheet-shaped dry film resist material to ultraviolet light irradiation, etc., through an exposure mask member having desired through holes, and forming a resist-cured film through processes such as development and baking. Using this resist-cured film as a mask for etching, the surface of the plate-making substrate is chemically etched using an etching solution to form a pre-existing uneven surface 4.
Furthermore, in this processing method, it is also possible to perform a method in which, without using an exposure mask member, a conventional sheet-shaped dry film resist material is chemically altered by laser irradiation, electron beam irradiation, etc., and developed to form an etching mask having the desired shape, and then the etching solution is used to chemically etch the plate-making substrate using this etching mask to form the pre-existing uneven surface 4. The laser exposure apparatus is not particularly limited, and for example, a laser exposure apparatus manufactured by Daishin Sangyo Co., Ltd. can be used.

Furthermore, in this processing method, instead of "attaching a conventional sheet-shaped dry film resist material to the surface of a plate-making substrate," it is also possible to use "a plate-making substrate with a resist-attached sheet-shaped dry film resist material attached to the surface of a commonly available plate-making substrate."
The specific material for the sheet-shaped dry film resist material is not particularly limited, and general-purpose sheet-shaped dry film resist materials supplied by companies such as Tokyo Ohka Kogyo Co., Ltd., Mitsui Chemicals, Taiyo Ink Manufacturing Co., Ltd., JNC Corporation, Nikko Material Co., Ltd., Asahi Kasei Corporation, and Agfarewald Japan Ltd. can be used.

(d) Mechanical processing using conventional machining equipment is a process in which conventional NC machining, cutting, grinding, and other general-purpose machining processes are used to form pre-existing uneven or recessed parts 4.

In this process, the thickness of the cured film of the conventional liquid resist material, the sheet-like dry film resist material, etc., is not particularly limited, but for example, a thickness of less than approximately 50 μm (approximately 0.05 mm) is preferably used.
When the thickness of the applied conventional resist film is approximately 50 μm or more, the variation in the thickness of the planar region of the conventional resist film increases as the thickness increases, making it difficult to form a uniform conventional resist film. As a result, variations in exposure occur when using an exposure mask with ultraviolet light, making it impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when the conventional resist-cured film is used as an etching mask to etch the plate mold container, it becomes impossible to form uneven areas with the desired shape and dimensional accuracy, resulting in poor etching accuracy.

[Dependency Structure 14]
In the manufacturing method of the pressing plate described above in [Basic Configuration 1] to [Dependent Configuration 13], a plate mold substrate 1 made of metal, plastic, or resin, which is generally used as a pressing plate, can be used, although this is not particularly limited.
In particular, a method for manufacturing a pressing plate having the following configuration can be implemented.
A method for manufacturing a pressing plate, wherein the plate mold substrate 1 is made of iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
For iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel, those described in detail in the above-mentioned [Basic Configuration 1] are preferably implementable.

[Dependency Structure 15]
In the manufacturing method of the pressing plate described above in [Basic Configuration 1] to [Dependent Configuration 14], preferably, a manufacturing method of the pressing plate having at least one of the following forms (a) to (g) can be implemented.
(i) A flat plate die configured in a flat-pressure type processing device having flat plates facing each other.
(b) A roll plate configured in a roll-type processing device having roll shapes that face each other.
(h) A flexible plate configured by winding and fixing it around a cylindrical or cylindrical roll, or a flexible plate configured by contacting and fixing it to the surface of a plate-shaped substrate for printing plates.
(ii) A die for shaping a workpiece into a predetermined uneven or convex shape.
(e) A foil stamping plate for applying foil stamping to a workpiece.
(f) A cutting and cutting plate for cutting and/or cutting a workpiece into a predetermined shape.
(t) A die-stamping/cutting/cutting plate for stamping or foil-stamping a workpiece into a predetermined uneven shape, and for cutting and/or cutting.
The above classifications (a), (b), and (c) are based on the shape of the pressing plate, while (d), (e), (f), and (g) are based on the purpose and use.

Figure 17 shows a schematic diagram illustrating the configuration of the pressing plate in the method for manufacturing a pressing plate of the present invention.
Figure 17 is a schematic diagram of a conventional flat plate or roll type pressing device, showing the pressing plate of the present invention mounted on this conventional pressing device.

As shown in Figure 17(A), the sheet-like workpiece substrate 108a and the sheet-like foil material 108b are positioned between the pressing plate 10 and the receiving plate 94, which have formed a fine graphic character pattern with a predetermined uneven shape. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, a graphic character pattern with an uneven shape matching the pressing plate 10 is formed on the sheet-like workpiece substrate 108a, and a foil transfer uneven graphic character pattern formed by the transfer of the sheet-like foil material 108b is also transferred and formed.
This pressing plate 10 corresponds to (e) a foil stamping plate for applying foil to a workpiece.

As shown in Figure 17(B), the sheet-like workpiece 108 is positioned between a pressing plate 10 and a receiving plate 94, which have a predetermined uneven shape formed on them. When at least one of the pressing plate 100 and the receiving plate 94 presses against the other, a sheet-like workpiece 108 is formed on the sheet-like workpiece 108 with an uneven shape that matches the pressing plate 10.
This pressing plate 10 corresponds to (ii) a die plate for processing a workpiece into a predetermined uneven shape.
Incidentally, the printing plate used for embossing is also called an embossing plate.

As shown in Figure 17(C), the sheet-like workpiece 108 is positioned between a pressing plate 10 on which a plurality of fine graphic character and pictographic patterns formed with a predetermined uneven shape are formed, and a receiving plate 94. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, a graphic character and pictographic pattern formed with an uneven shape that matches the pressing plate 10 and the receiving plate 94 is formed on the sheet-like workpiece 108.
Furthermore, although not shown in the figures, it is also possible to implement a pressing plate 100 that does not form a fine graphic character or pictographic pattern, but only has a pressing plate 10 that forms a graphic character or pictographic pattern with one or more predetermined uneven shapes. This pressing plate 10 corresponds to (e) a foil stamping plate for foil stamping on a workpiece.
This pressing plate 10 is applied, for example, to the pressing plates of the aforementioned "dependent components 3 to 5" and "dependent components 6 to 9".

As shown in Figure 17(D), the sheet-like workpiece 108 is positioned between a graphic character pattern formed with a predetermined uneven shape and a receiving plate 94 on which the graphic character pattern formed with a predetermined uneven shape is formed. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, a graphic character pattern formed with an uneven shape that matches the pressing plate 10 and the receiving plate 94 is formed on the sheet-like workpiece 108.
This pressing plate 10 corresponds to (ii) a die plate for processing a workpiece into a predetermined uneven shape.

As shown in Figure 17(E), the sheet-like workpiece 108 is positioned between the die pattern, which is formed in a predetermined shape, and the receiving plate 94. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, the sheet-like workpiece 108 is cut or cut out in a shape that matches the pressing plate 10 and the receiving plate 94.
This pressing plate 10 corresponds to (f) a cutting and cutting plate for cutting and/or cutting a workpiece into a predetermined shape.

Although not shown in the diagram, the device is configured such that a sheet-like workpiece is positioned between a pressing plate and a receiving plate, with a graphic, character, and pictorial pattern formed in a predetermined uneven shape. When at least one of the pressing plate and the receiving plate presses against each other, a graphic, character, and pictorial pattern formed in an uneven shape matching the pressing plate is formed on the sheet-like workpiece, and it is also cut or cut into a predetermined shape.

Although not shown in the diagram, the device is configured such that a sheet-like workpiece substrate and a sheet-like foil material are positioned between a pressing plate that has formed a graphic character pattern with a predetermined uneven shape and a receiving plate 94 that has formed a graphic character pattern with a predetermined uneven shape, and at least one of the pressing plate and the receiving plate presses against the other, thereby forming a graphic character pattern on the sheet-like workpiece substrate with an uneven shape that matches the pressing plate and the receiving plate, and also transferring a foil transfer uneven graphic character pattern formed by the transfer of the sheet-like foil material.
This pressing plate corresponds to (e) a foil stamping plate for applying foil to a workpiece.

In the pressing plate of the present invention, the flat plate type plate configured in the flat pressing processing apparatus having a flat plate shape with opposing flat plates as described above (a) is used as a flat plate type plate configured in a flat pressing processing apparatus having a first base 92 and a second base 93, and each base having a pressing plate 10 and a receiving plate 94 installed facing each other.

In the pressing plate of the present invention, the roll plate configured in the roll-type processing apparatus having opposing roll shapes as described above (b) is a roll apparatus equipped with a main roll 96 and a pair of rolls 97 having opposing cylindrical or cylindrical roll shapes, as shown in Figure 16(B), and is used as a roll plate configured on the surface of each roll.
The following role versions are applicable.
(Low-a) A roll plate formed by directly engraving and creating an uneven shape at a desired position on the surface of the roll.
(Low-b) A roll plate comprising a flat plate-shaped plate-type substrate having a flat surface with uneven surfaces, which is installed and fixed at a desired position on the surface of the roll.
(Low-c) A roll plate is constructed by installing and fixing a curved plate-making substrate, which has a curved surface and uneven surfaces, at a desired position on the surface of the roll.

As described above, (c) the flexible plate, which is constructed by wrapping and fixing around a cylindrical or cylindrical roll, has a degree of flexibility that allows it to bend, and is installed and used by wrapping it around the surface of the roll.
For example, the circumferential surface of the roll is magnetic, and the flexible plate is made of a magnetic metal such as iron or iron-containing steel, and is in a roughly sheet-like shape with a bendable thickness. This flexible plate is then installed and fixed to the circumferential surface of the roll by magnetic attraction.
As a flexible plate constructed by installing and fixing it to the surface of a plate-shaped substrate for printing plates, it is installed and fixed to the surface of a flat plate-shaped substrate of a desired thickness in a flatbed processing device and used for application.

In a pressing apparatus using a pressing plate, it is also possible to implement a configuration in which a heating mechanism, such as a heater, is provided for heating at least one of the first substrate 92, the second substrate 93, the pressing plate 100, and the receiving plate 94. In such an apparatus equipped with a heating mechanism, (e) in a pressing apparatus configured with a foil stamping plate for foil stamping on a workpiece, when a sheet workpiece 108 consisting of a sheet workpiece base material 108a and a sheet foil material 108b is used, foil stamping is formed on the sheet foil material 108b while it is heated.

<Regarding pressing plates manufactured by the pressing plate manufacturing method of the present invention>
[Dependency Structure 16]
The pressing plate of the present invention is a pressing plate manufactured by a method for manufacturing a pressing plate, comprising at least one of the above-described "basic configuration 1" and "dependent configurations 2" to "dependent configurations 15".
For example, the pressing plate of the present invention is a pressing plate manufactured by the manufacturing method of "dependent configuration 1". That is, the pressing plate of the present invention is a method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, and comprises the following configuration.
(A) A plate-type substrate supply process that supplies a plate-type substrate 1 having a first plate-type substrate surface area 11 and a second plate-type substrate surface area 12.
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material 2 is attached to a desired region of the first region surface 11 of the printing substrate 1 by an inkjet method to form a desired region inkjet resist film, and a desired region inkjet resist cured film formation step, wherein the inkjet resist film is cured to form an inkjet resist cured film 3.
(C) A plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the inkjet resist cured film 3 in the desired area is formed, thereby etching the surface of the plate-making substrate on which the inkjet resist cured film 3 in the desired area is not attached, thereby forming an etched recess formed in a concave shape on the surface of the plate-making substrate.
(D) A resist curing film removal step to remove the inkjet resist curing film in the desired area.

Furthermore, the pressing plate of the present invention is not limited to the above, and a pressing plate manufactured by at least one of the "dependent configuration 2" to "dependent configuration 13" described above is also possible.

The pressing plate of the present invention provides the effect of obtaining a pressing plate that has desired shapes such as desired convex portions, desired recesses, desired uneven portions, and desired fine uneven portions, and that has desired shape accuracy and dimensional accuracy, while suppressing corrosive etching in the "areas of the plate-making substrate that must not be etched".

<Regarding the processing method of the workpiece according to the present invention>
[Dependency Structure 17]
The present invention relates to a method for processing a workpiece, characterized by processing a workpiece using a pressing plate manufactured by a method for manufacturing a pressing plate, which is one of the "basic configuration 1" and "dependent configurations 2" to "dependent configurations 15" described above, to produce a workpiece that has been processed into a predetermined shape.

The workpieces that can be processed using the above-described processing method are not particularly limited, but preferably include paper, corrugated cardboard, plastic film, plastic board, plastic molded products, leather, wood, cloth, soft metal, and laminates thereof.
Furthermore, a method for processing a workpiece into a predetermined shape by at least one process selected from the group consisting of embossing, foil stamping, cutting, and die-cutting can be preferably implemented.

[Dependency Structure 18]
The present invention relates to a method for processing a workpiece, characterized in that the pressing plate manufactured by the method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15" is a flat plate type plate having a flat plate shape, and the workpiece is processed using the pressing plate having a flat plate shape to produce a workpiece processed into a predetermined shape, and comprises the following configuration.
(S-a) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the above-mentioned "basic configuration 1" or "dependent configuration 2" to "dependent configuration 15".
(S-b) A step of preparing a pressing device equipped with a first base 92 and a second base 93 facing each other.
(S-d) A step of installing a predetermined receiving plate 94 on the second base 93 of the pressing device.
(S-e) A step in which, with the workpiece 108 positioned between the pressing plate 10 and the receiving plate 94, at least one of the first base 92 and the second base 93 is driven so that the pressing plate 10 and the receiving plate 94 press the workpiece.
This creates a workpiece surface with a surface that matches the surface shape of the pre-existing surface area 4.
(S-f) A step of driving at least one of the bases of the pressing plate 10 and the receiving plate 94 to separate the pressing plate 10 and the receiving plate 94 from each other and release the pressure on the workpiece.
This process prepares a workpiece in which a workpiece surface 108 has a workpiece surface ridge-forming portion that is transferred and formed on the surface of the workpiece 108 in a form that matches the surface shape of the pre-existing ridge portion 4.

In the step of installing the (S-d) predetermined receiving plate 94 on the second base 93 of the pressing device, a workpiece processing method can be implemented using a receiving plate 94 as shown in Figure 17(A), which has a smooth surface and no uneven shape.
Furthermore, the receiving plate 94 is not limited to the above, and a processing method for a workpiece can also be implemented using a receiving plate 94 having an uneven surface shape, manufactured using the inkjet resist material of the present invention or a conventional resist material, as shown in Figure 17(D).

In this method of processing a workpiece, the following is used: (a) a flat plate die as a pressing plate configured in a flat-press type processing device having flat plates facing each other, and (d) an embossing plate for processing a workpiece into a predetermined uneven shape.

The workpiece processing method of the present invention provides the following effect: [Effect of workpiece processing method A: The workpiece processing method of the present invention has the effect of being able to prepare workpieces that have desired shapes such as desired convex portions, desired recesses, desired uneven portions, and desired fine uneven portions, and that are processed and formed with desired shape accuracy and dimensional accuracy].

[Dependency Structure 19]
Another method for processing a workpiece according to the present invention is a flat plate type plate having a flat plate shape, which is manufactured by a method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15", and is characterized in that a workpiece is foil-stamped using the pressing plate having a flat plate shape to produce a workpiece that has been foil-stamped into a predetermined shape, and comprises the following configuration.
(S-a) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the following: "Basic configuration 1", "Dependent configuration 2" to "Dependent configuration 13".
(S-b) A step of preparing a pressing device equipped with a first base 92 and a second base 93 facing each other.
(S-d) A step of installing a predetermined receiving plate 94 on the second base 93 of the pressing device.
(S-e) A step in which, with the workpiece base material 108a and the sheet-like foil material 108b positioned between the pressing plate 10 and the receiving plate 94, at least one of the first base 92 and the second base 93 is driven so that the pressing plate 10 and the receiving plate 94 press the workpiece.
This transfers the sheet-like foil material 108b onto the surface of the workpiece substrate 108a, forming a workpiece foil stamping transfer portion having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4.
(S-f) A step of driving at least one of the bases of the pressing plate 10 and the receiving plate 94 to separate the pressing plate 10 and the receiving plate 94 from each other and release the pressure on the workpiece.
This process prepares a workpiece in which a workpiece foil stamping transfer forming portion is formed on the surface of the workpiece substrate 108a by transferring a sheet-like foil material 108b in a form that matches the shape of the existing uneven portion 4.

In this method of processing a workpiece, the flat plate die set configured in a flat-pressure processing device having flat plates facing each other, and the flat plate die set used as a foil stamping plate for foil stamping a workpiece is applied.
In addition, in this foil stamping method, it is also preferable to carry out a configuration in which foil stamping is performed while at least one of the first substrate 92, the second substrate 93, the pressing plate 10, and the receiving plate 94 is heated. By heating, a desired area of the sheet-like foil material 108b is transferred to and joined to the surface of the workpiece, thereby forming a foil stamping transfer area on the workpiece.

The present invention provides the following effect of processing a workpiece: "The effect of processing a workpiece is that it is possible to prepare a workpiece in which a workpiece such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, or laminate thereof is formed by foil stamping with excellent shape and dimensional accuracy, into a shape formed by recesses, protrusions and/or uneven surfaces having desired graphic, character, picture, or pattern forms such as desired characters, desired symbols, desired figures, desired patterns, desired grid patterns, and desired fine multiple uneven patterns."
In particular, the effect of being able to prepare a workpiece formed by foil stamping with excellent shape and dimensional accuracy can be obtained. Furthermore, especially when using a pressing plate manufactured by the "dependent configuration 8" in which multiple types of fine figures, characters, and patterns are gathered to form different images from each other, it becomes possible to prepare a foil-stamped workpiece with remarkably superior quality because the workpiece is formed in such a way that different images are visible when viewed from different directions.

[Dependent Structure 20]
Another workpiece processing method of the present invention is a method for processing a workpiece characterized by installing a pressing plate, manufactured by a method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15", into a roll device, processing a workpiece, and producing a workpiece processed into a predetermined shape, and comprising the following configuration.
(S-a) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the following: "Basic configuration 1", "Dependent configuration 2" to "Dependent configuration 13".
(S-b) A step of preparing a pressing device equipped with a main roll 96 and a counter roll 97 facing each other.
(S-c) A step of setting the pressing plate 10 on the main roll 96.
(S-d) A step of installing a predetermined receiving plate 94 on the opposing roll 97 of the pressing device.
(S-e) A step in which the main roll 96 and the opposing roll 97 are driven, and a workpiece is supplied between the main roll 96 and the opposing roll 97, so that the pressing plate 10 and the receiving plate 94 press the workpiece.
This creates a workpiece surface 108 with a workpiece surface having a surface shape that matches the surface shape of the pre-existing surface 4.
(S-f) A step in which the workpiece separates from the main roll 96 and the opposing roll 97, thereby releasing the pressure on the workpiece.
This process prepares a workpiece in which a workpiece transfer forming portion is formed on the surface of the workpiece 108, having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4.

In this method of processing a workpiece, the following are applicable: (b) a roll plate configured in a roll-type processing device having opposing roll shapes, which is installed and fixed at a predetermined position on the rolls; or (c) a flexible plate configured by being wrapped around and installed and fixed around the cylindrical or columnar rolls of the roll device.

The workpiece processing method of the present invention provides the effect described in "Effect A of Workpiece Processing Method" above.
In particular, it provides the effect of "preparing workpieces with excellent shape and dimensional accuracy."

[Dependency Structure 21]
Another method for processing a workpiece according to the present invention is a method for processing a workpiece characterized by installing a pressing plate, manufactured by a method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15", into a roll device, processing the workpiece, and manufacturing a workpiece that has been foil-stamped into a predetermined shape, and comprising the following configuration.
(S-a) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the following: "Basic configuration 1", "Dependent configuration 2" to "Dependent configuration 13".
(S-b) A step of preparing a pressing device equipped with a main roll 96 and a counter roll 97 facing each other.
(S-c) A step of setting the pressing plate 10 on the main roll 96.
(S-d) A step of setting a predetermined receiving plate 94 on the roll 97 of the pressing device.
(S-e) A step in which the main roll 96 and the opposing roll 97 are driven, and the workpiece base material 108a and the sheet-like foil material 108b are supplied between the main roll 96 and the opposing roll 97, so that the pressing plate 10 and the receiving plate 94 press the workpiece.
This transfers the sheet-like foil material 108b onto the surface of the workpiece substrate 108a, forming a workpiece foil stamping transfer portion having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4.
(S-f) A step in which the workpiece separates from the main roll 96 and the opposing roll 97, thereby releasing the pressure on the workpiece.
This process prepares a workpiece in which a workpiece transfer forming portion is formed on the surface of the workpiece 108 by transferring a sheet-like foil material 108b into a form that has an uneven shape that matches the uneven shape of the pre-existing uneven portion 4.

In this method of processing a workpiece, the following is applied: (b) a roll plate configured in a roll-type processing device having opposing roll shapes, and (c) a flexible plate configured by being wrapped around and fixed to the tubular or cylindrical rolls of a circular roll device.
In addition, in this foil stamping method, it is also preferable to carry out the foil stamping process while at least one of the main roll 96, the opposing roll 97, and the pressing plate 10 is heated. By heating, a desired area of the sheet-like foil material 108b is transferred to and joined to the surface of the workpiece, thereby forming a foil stamping transfer area on the workpiece.

The workpiece processing method of the present invention provides the effect described above as "Effect B of Workpiece Processing Method".
In particular, the effect of being able to prepare a workpiece formed by foil stamping with excellent shape and dimensional accuracy can be obtained. Furthermore, especially when using a "pressing plate made of multiple types of multiple micro-figures and characters arranged to form different images" manufactured by "dependent configuration 8", it becomes possible to prepare a foil-stamped workpiece with remarkably superior quality because the workpiece is formed so that different images are visible when viewed from different directions.

[Dependency Structure 22]
In the workpiece processing method described in any of the "dependent configuration 17" to "dependent configuration 21" above, a workpiece processing method having the following configuration is preferably implementable.
The workpiece is at least one workpiece selected from the group consisting of paper, corrugated cardboard, plastic film, plastic board, plastic molded product, leather, wood, cloth, soft metal, and laminates thereof, and is a method for processing a workpiece.
This configuration provides the effects described above as "Effect A of workpiece processing method" and "Effect B of workpiece processing method," and in particular, the "effect of being able to prepare workpieces that are processed and formed with excellent shape and dimensional accuracy."

Typical embodiments of the manufacturing method of the pressing plate of the present invention, the pressing plate manufactured by the manufacturing method of the pressing plate, and the method of processing a workpiece into a predetermined shape using the pressing plate manufactured by the manufacturing method of the pressing plate will be described below. In the drawings, the shape, size, dimensions, etc. of the components are not shown precisely, but are schematic representations to explain the shape, structure, operation, and other characteristics.

<Example 1A (Manufacturing of flat die plates and embossing plates for pressing)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 3" described above, and is a pressing plate shown in Figure 1, in which the graphic letter pattern "ABCDE" is formed in a raised shape on the surface of the protrusions that protrude from the recesses. This pressing plate is used as a flat plate die or an embossing plate.
In this embodiment, a conventional resist material is used to form a plurality of pre-existing uneven portions 45, and an inkjet resist material is used to form a second inkjet resist film corrosion recess formation portion 121 on the surface of the plate-type substrate on which the plurality of pre-existing uneven portions 45 are formed, and the substrate is prepared in such a form that the plurality of pre-existing uneven portions 45 are formed into an inkjet film corrosion pre-existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the second inkjet resist film corrosion recess formation portion 121.
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a pre-existing number of uneven surfaces 45.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of stainless steel and has a substantially flat shape with a thickness "h" of 7.0 mm, a width of 125 mm, and a height of 90 mm.
Next, a desired area of the first region surface 11 of the printing substrate 1 was selected and used as a conventional resist material. This conventional liquid resist material (a conventional liquid resist material commonly used for plate making and etching printed circuit boards, selected from commercially available general-purpose liquid resist materials) had the property of chemically reacting with ultraviolet irradiation to crosslink into a three-dimensional chemical structure. It was then applied to a desired area of the first region surface 11 of the printing substrate 1 to a thickness of approximately 0.02 mm to approximately 0.04 mm using a conventional spray coating method, and dried by a predetermined method to form a resist film.
Then, ultraviolet light was irradiated onto the resist film through an exposure mask member having through-holes for light transmission and forming a desired graphic and letter pattern (ABCDE pattern). After that, unwanted resist film in areas not irradiated with ultraviolet light was removed using a commercially available general-purpose conventional developer (sodium carbonate aqueous solution). Subsequently, the film was matured by heating and baking in a predetermined conventional method. In this way, a cured resist film having the desired graphic and letter pattern (ABCDE pattern) was formed.

Next, a commercially available general-purpose conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which the resist-cured film had been formed, and the surface of the plate-making substrate that did not have the resist-cured film attached was etched until the depth "D1" reached 0.9 mm, thereby forming a plurality of pre-existing concave and convex portions 452 and a plurality of pre-existing convex portions 451 on the plate-making substrate.
Next, the hardened resist film was removed using a commercially available, general-purpose, conventional resist remover (aqueous soda solution).
In this way, multiple pre-existing multiple recessed/concave parts, convex portions 451 and multiple pre-existing multiple recessed/concave parts, concave portions 452 were formed.
Figure 1 does not show a diagram illustrating the process of forming a pre-existing multiple uneven portion 45 which has multiple pre-existing multiple uneven portions 451 formed in the convex shape and multiple pre-existing multiple uneven portions 452 formed in the concave shape.

In other words, the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing uneven portion 4, and the pre-existing uneven portion 4 has a plurality of pre-existing uneven portions 45.
The pre-existing multiple recessed portion 45 has a plurality of pre-existing multiple recessed portion protrusions 451 formed with a plurality of convex shapes and a plurality of pre-existing multiple recessed portion recesses 452 formed with a plurality of concave shapes, the plurality of pre-existing multiple recessed portion protrusions 451 has a plurality of pre-existing multiple recessed portion protrusion upper surfaces 451a and a plurality of pre-existing multiple recessed portion protrusion side surfaces 451b, and the plurality of pre-existing multiple recessed portion recesses 452 has a plurality of pre-existing multiple recessed portion bottom surfaces 452c and a plurality of pre-existing multiple recessed portion side surfaces 452b.
In this way, a plate-type substrate having multiple pre-existing uneven surfaces 45 as pre-existing uneven surfaces 4 was prepared.
Furthermore, the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b correspond to the same surface region.
Furthermore, the height dimension "D1" of the etched pre-existing multiple recessed portion protrusions 451 corresponds to the depth dimension "D1" of the pre-existing multiple recessed portion recesses, which is 0.9 mm. The width dimension "W1" of the pre-existing multiple recessed portion protrusions 451 and the width dimension "W2" of the pre-existing multiple recessed portion recesses 452 had the desired dimensions as shown in (A-b) of Figure 1.
In this way, a plate-type substrate 1 having a graphic character pattern (ABCDE pattern) formed by multiple pre-existing protrusions 451 shown in black in Figure 1 (A-b), and multiple pre-existing recesses 452 shown in white, was prepared and supplied.

(B) Process for forming an inkjet resist cured film in the desired area.
Using the mold substrate 1 prepared in step (A) above, as shown in Figure 1(B), the inkjet resist material 2 was applied by inkjet by covering the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, and the side surfaces 452b of the multiple pre-existing multiple uneven parts, thereby forming an inkjet resist film attached to the upper surface of the protrusions, an inkjet resist film attached to the side surfaces of the recesses, and an inkjet resist film attached to the bottom surface of the recesses. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the mold substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45.
Subsequently, the inkjet resist film attached to the upper surface of the protrusions, the inkjet resist film attached to the side surface of the recesses, and the inkjet resist film attached to the bottom surface of the recesses were cured to form the desired region inkjet resist cured film 3a on the upper surface of the protrusions, the desired region inkjet resist cured film 3b on the side surface of the protrusions, and the desired region inkjet resist cured film 3c on the bottom surface of the recesses, thereby forming the desired region inkjet resist cured film 3.
Furthermore, the side-cured film on the raised portion of the inkjet resist in the desired region and the side-cured film on the recessed portion of the inkjet resist in the desired region correspond to the same side-cured film.

In the process of forming the inkjet resist cured film in the desired area, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material commonly used in the manufacture of metal wiring boards as electronic components was selected and used, which has the property of crosslinking into a three-dimensional chemical structure through a chemical reaction upon irradiation with ultraviolet light, and has a viscosity of "10 mPa·s to 20 mPa·s (25°C)". The droplets ejected from the ejection nozzle were attached to the printing plate substrate at a rate of 2 pl to 15 pl. Then, ultraviolet light was irradiated onto the inkjet resist film attached to the printing plate substrate to cause a chemical reaction of the inkjet resist material, and then heating burning was performed at 120°C for 10 minutes to form the hardened upper surface hardened film 3a of the protrusions of the desired area inkjet resist, the side surface hardened film 3b of the protrusions of the desired area inkjet resist, and the bottom surface hardened film 3c of the recesses of the desired area inkjet resist. In this way, the desired area inkjet resist cured film 3 was formed.
The thickness of the inkjet resist cured film in the desired area was in the range of approximately 0.03 mm to approximately 0.05 mm.

In this process, the inkjet resist material adheres well to the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b) without flowing off the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b), and also adheres well to the existing multiple uneven surfaces 451a and the multiple existing multiple uneven surfaces bottom surfaces 452c. Furthermore, it was confirmed that a desired region inkjet resist upper surface cured film 3a, a desired region inkjet resist side surface cured film 3b, and a desired region inkjet resist bottom surface cured film 3c were formed in the desired region.

(C) Etching process.
As shown in Figure 1(C), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the printing plate substrate 1, which had a hardened film 3a on the upper surface of the desired region inkjet resist protrusions, a hardened film 3b on the side of the desired region inkjet resist protrusions, and a hardened film 3c on the bottom surface of the desired region inkjet resist recesses, using a paddle blowing method. The second region surface 12 of the printing plate substrate, to which the hardened film of the desired region inkjet resist was not attached, was etched until the depth dimension (D12) was approximately 1.9 mm.
As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the existing multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the existing multiple uneven portions 45 are formed into inkjet film corrosion existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figure 1 (D-b), the hardened film 3a on the upper surface of the protrusions of the desired inkjet resist, the hardened film 3b on the side of the protrusions of the desired inkjet resist, and the hardened film 3c on the bottom surface of the recesses of the desired inkjet resist were removed using a commercially available general-purpose conventional resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In this way, without etching the pre-existing multiple uneven portions 45 formed in an uneven shape, the surface of the second region 12 of the plate-making substrate is etched to form an inkjet resist film corrosion second recess-forming portion 121. At the same time, the surface of the first region 11 of the plate-making substrate, which has a pre-existing multiple uneven portion 45 having a plurality of pre-existing multiple uneven portion protrusions 451 and a plurality of pre-existing multiple uneven portion recesses 452, is prepared in the form of an inkjet film corrosion pre-existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess-forming portion 121.

As shown in Figure 1(D), the depth dimension "D12" of the inkjet resist film corrosion second recess formation portion 121 was 1.9 mm, and the height dimension "D1" of the multiple pre-existing multiple recesses 451 and the depth dimension "D1" of the multiple pre-existing multiple recesses 452 represented the same area, maintaining their initial dimensions, which was 0.9 mm. In this way, a plate for pressing was manufactured.

As described above, in this embodiment, a plate-making substrate 1 is prepared by using a conventional resist material to form a plurality of pre-existing protrusions 451 having a height dimension "D1" and a plurality of pre-existing recesses 452 having a depth dimension "D1" on the surface 11 of the first region of the plate-making substrate. Using the plate-making substrate 1 with the plurality of pre-existing protrusions 45 formed thereon, etching is performed using an inkjet resist material to form an inkjet resist film etching second recess formation portion 121. As a result, the plurality of pre-existing protrusions 45 having an "ABCDE pattern" formed in an uneven shape are formed into inkjet film etching pre-existing protrusions 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film etching second recess formation portion 121.

In this embodiment, it was confirmed that the object has a combination of pre-existing uneven surfaces 45 having desired shape and dimensional accuracy, and that it also has a protruding shape that extends from the bottom surface of the inkjet resist film etching second recess forming portion 121, and that this protruding portion 455 is formed on the object.
Furthermore, it was confirmed that the desired shape accuracy and dimensional accuracy were not observed on the desired pre-existing multiple uneven surfaces, specifically on the convex side surface 451b (and the pre-existing multiple uneven surface recessed side surface 452b), and that the surface was not etched in a recessed state.

<Example 1B (Manufacturing of flat die plates and stamping plates for pressing)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 3" described above, and is a pressing plate shown in Figure 2, in which a graphic letter pattern of "ABCDE pattern" is formed in a raised shape on the surface of the protruding part that protrudes from the recess. This pressing plate is used as a flat plate die plate and an embossing plate.
In this embodiment, an inkjet resist material is used to form a plurality of pre-existing uneven portions 45, and an inkjet resist film corrosion second recess formation portion 121 is formed on the surface of the plate-type substrate on which the plurality of pre-existing uneven portions 45 are formed, using the inkjet resist material. The substrate is prepared in such a form that the plurality of pre-existing uneven portions 45 are formed into an inkjet film corrosion pre-existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a pre-existing number of uneven surfaces 45.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of brass and has a substantially flat shape with a thickness "h" of 7 mm, a width of 125 mm, and a height of 90 mm.

Next, an inkjet resist film having an "ABCD pattern of letters and images" was formed on the surface of the printing plate substrate 1 using an inkjet method with an inkjet resist material.
In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, the same inkjet resist material used in step (B) of Example 1A described above was selected from commercially available inkjet resist materials, which have the property of crosslinking into a three-dimensional chemical structure through a chemical reaction by ultraviolet irradiation, and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the inkjet resist film attached to the plate-making substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120°C for 10 minutes to form a cured inkjet resist film having the desired ABCDE pattern and design.
In this way, an inkjet resist-cured film having an ABCD pattern was formed. The thickness of the inkjet resist-cured film was in the range of approximately 0.03 to 0.05 mm.

A commercially available conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of a plate-making substrate 1 on which an inkjet resist-cured film had been formed. The surface of the plate-making substrate that did not have the resist-cured film attached was etched until the depth "D1" reached approximately 0.9 mm, thereby forming a plurality of pre-existing multiple uneven surfaces 45 having a plurality of pre-existing multiple uneven surfaces, convex portions 451 and a plurality of pre-existing multiple uneven surfaces, concave portions 452 on the plate-making substrate.

Next, the inkjet resist curing film was removed using a commercially available, conventional resist remover.
Note that the diagram illustrating the process of forming the pre-existing multiple uneven surfaces 45 described above is not shown in Figure 2.

In this way, a pre-existing multiple uneven portion 45 having a plurality of pre-existing multiple uneven portions, convex portions 451 and a plurality of pre-existing multiple uneven portion recesses 452 is formed on the first region surface 11 of the plate-making substrate 1 as shown in Figure 2(A).
The depth "D1" of each pre-existing multiple recessed portion 452 was approximately 0.9 mm, and the height of the pre-existing multiple protrusions 451 was approximately 0.9 mm, corresponding to the depth of the pre-existing multiple recessed portion 452.
In this way, a plate-type substrate 1 having a graphic character pattern (ABCDE pattern) shown in black in (A-b) of Figure 2, and a plurality of pre-existing multiple recesses 452 shown in white, was prepared and supplied.

(B) Process for forming an inkjet resist cured film in the desired area.
As shown in Figure 2(B), the inkjet resist material 2 was applied by inkjet by covering the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, and the side surfaces 452b of the multiple pre-existing multiple uneven parts, thereby forming an inkjet resist film attached to the upper surface of the raised parts, an inkjet resist film attached to the side surfaces of the raised parts, and an inkjet resist film attached to the bottom surface of the raised parts. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45.
Subsequently, the inkjet resist cured film attached to the upper surface of the protrusions, the inkjet resist cured film attached to the side of the protrusions, and the inkjet resist cured film attached to the bottom surface of the recesses were cured to form a desired region inkjet resist cured film 3 having a desired region inkjet resist cured upper surface film 3a, a desired region inkjet resist cured side surface film 3b, and a desired region inkjet resist cured bottom surface film 3c.
Furthermore, the side-cured film 3b on the raised portion of the inkjet resist in the desired region and the side-cured film on the recessed portion of the inkjet resist in the desired region correspond to the same side-cured film.

A Microcraft on-demand inkjet printing system was used. As the inkjet resist material, a commercially available inkjet resist material was selected and used that is the same as the inkjet resist material used in step (B) of Example 1A described above, which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation, and has a viscosity of 10 mPa to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above and step (A) of Example 2B described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. The above inkjet resist film attached to the printing plate substrate was then irradiated with ultraviolet light, and subsequently burned at 120°C for 10 minutes to form a hardened upper surface hardened film 3a of the desired area inkjet resist protrusions, a hardened side surface hardened film 3b of the desired area inkjet resist protrusions, and a hardened bottom surface hardened film 3c of the desired area inkjet resist recesses.
The thickness of the inkjet resist cured film 3 in the desired area was in the range of approximately 0.03 to 0.05 mm.

In this process, the inkjet resist material adheres well to the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b) without flowing off the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b), and also adheres well to the existing multiple uneven surfaces 451a and the multiple existing multiple uneven surfaces bottom surfaces 452c. Furthermore, it was confirmed that a desired region inkjet resist upper surface cured film 3a, a desired region inkjet resist side surface cured film 3b, and a desired region inkjet resist bottom surface cured film 3c were formed in the desired region.

(C) Etching process.
As shown in Figure 2(C), a commercially available conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the printing plate substrate 1, which had a hardened film 3a on the upper surface of the desired region inkjet resist protrusions, a hardened film 3b on the side of the desired region inkjet resist protrusions, and a hardened film 3c on the bottom surface of the desired region inkjet resist recesses, using a paddle blowing method, and the second region surface 12 of the printing plate substrate, to which the hardened film of the desired region inkjet resist was not attached, until the depth dimension "D12" was approximately 1.9 mm.
As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the existing multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the existing multiple uneven portions 45 are formed into inkjet film corrosion existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figure 2 (D-b), the hardened film 3a on the upper surface of the protrusions of the inkjet resist in the desired region, the hardened film 3b on the side of the protrusions of the inkjet resist in the desired region, and the hardened film 3c on the bottom surface of the recesses of the inkjet resist in the desired region were removed using a commercially available conventional resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In this way, without etching the pre-existing multiple uneven portions 45 having an "ABCDE pattern" formed in an uneven shape, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate, and the first region surface 11 of the plate-making substrate, which has a pre-existing multiple uneven portion 45 having a plurality of pre-existing multiple uneven portion protrusions 451 and a plurality of pre-existing multiple uneven portion recesses 452, is prepared in a form in which an inkjet film corrosion pre-existing multiple uneven portion projection 455 is formed having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.

As shown in Figure 2(D), the depth dimension "D12" of the inkjet resist film corrosion second recess formation portion 121 was 1.9 mm, and the height dimension "D1" of the multiple pre-existing multiple recesses 451 and the depth dimension of the multiple pre-existing multiple recesses 452 indicated the same area, maintaining their respective initial dimensions, which was 0.9 mm.
In this way, a plate for pressing was manufactured.

As described above, in this embodiment, a plate-making substrate 1 is prepared by forming a plurality of pre-existing uneven parts 45 having a height dimension D1 and a plurality of pre-existing uneven parts recesses 452 having a depth dimension D on the surface 11 of the first region of the plate-making substrate using an inkjet resist material. Using the plate-making substrate 1 with the plurality of pre-existing uneven parts 45 formed thereon, etching is performed using an inkjet resist material to form an inkjet resist film etching second recess formation portion 121. As a result, the plurality of pre-existing uneven parts 45 are formed into inkjet film etching pre-existing uneven parts protrusions 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film etching second recess formation portion 121.

In this embodiment, it was confirmed that the desired multiple pre-existing uneven portions 45 having desired shape accuracy and dimensional accuracy are present, and that the desired inkjet film corrosion pre-existing multiple uneven portion protrusions 455 are formed having a protruding shape that extends from the bottom surface of the inkjet resist film corrosion second recess forming portion 121.
Furthermore, it was confirmed that the desired shape accuracy and dimensional accuracy were achieved, as the side surfaces 451b of the convex portions (and the side surfaces 452b of the concave portions) did not exhibit the side etching phenomenon where the concave portions were etched in a recessed state.

<Example 1B-a (Processing of a workpiece using the pressing plate of Example 1B)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 1B is used as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108, which is the workpiece 108.
The workpiece was embossed using the following process.
(S-a) A die-cutting plate 10 was prepared to be used as a pressing plate 10, which had the pre-existing uneven surface 4 manufactured in Example 1B formed on it.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94, which had been prepared separately and had a smooth, flat surface without any irregularities, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108.
As a result, a workpiece surface irregularity forming portion is created on the surface of the workpiece 108, having an irregularity shape that matches the irregularity shape of the pre-existing irregularity portion 4.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
As a result, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed shape having a relief of approximately 0.9 mm in depth, having a relief of

In this embodiment of the processing method for the workpiece, a paper sheet 108, which served as the workpiece 108, was produced with an "ABCDE pattern" graphic design formed on it with the desired shape and dimensional accuracy. The "ABCDE pattern" graphic design formed on the workpiece was confirmed to be formed with the desired unevenness of approximately 0.9 mm, without any abnormalities.

<Comparative Example 1A (Manufacturing of a pressing plate using a conventional liquid resist material)>
This comparative example describes a method for manufacturing a plate for pressing, in which, in the "(B) Desired Area Inkjet Resist Curing Film Formation Process" of Example 1A described above, a conventional liquid resist material is used instead of the inkjet resist material.
Schematic diagrams illustrating the manufacturing process of this comparative example are shown in Figures 12 and 13.
Figures 12 and 13 are schematic diagrams illustrating the manufacturing process of a conventional method for manufacturing pressing plates.

(A) A step of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 45.
As shown in Figure 12(A), the material and shape of the printing plate substrate were the same as in Example 1A. A printing plate substrate made of stainless steel was prepared, having a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm, and a substantially flat shape.
As shown in Figure 12(B), using the same method as in step (A) of Example 1A described above, a conventional general-purpose liquid resist material (the same liquid resist material used in step (A) of Example 1A described above, and a conventional liquid resist material commonly used for plate making and etching of printed circuit boards) was applied by spray coating to a thickness of approximately 0.02 mm to approximately 0.04 mm, dried to form a resist adhesion film, and the resist adhesion film was irradiated with ultraviolet light through a desired exposure mask member having through-holes for light transmission, and a resist cured film having a desired graphic character pattern (ABCDE pattern) was formed by after-baking, development, etc.
Subsequently, the mold substrate on which the resist-cured film was formed was etched using an etching solution to create a pre-existing multiple uneven surface 45 having multiple existing protrusions 451 and multiple existing uneven surface recesses 452.
In this way, a printing plate substrate was prepared in which a plurality of pre-existing uneven surfaces 45 were formed on the surface 11 of the first region of the printing plate substrate as shown in Figure 12(B).
The material and shape of the prepared mold substrate were the same as in Example 1A, and the height dimension D1 (depth dimension D1 of the pre-existing multiple recessed parts 452) was 0.9 mm, the same as in Example 1.
The second region surface 12 of the substrate for printing plates has a smooth surface without irregularities, the first region surface 11 of the substrate for printing plates has a pre-existing irregularity 4, the pre-existing irregularity 4 has a plurality of pre-existing irregularities 45, the plurality of pre-existing irregularities 45 has a plurality of pre-existing irregularity convex portions 451 formed with a plurality of convex shapes, and a plurality of pre-existing irregularity convex portions 451 has a plurality of pre-existing irregularity convex upper surfaces 451a and a plurality of pre-existing irregularity convex side surfaces 451b, and the plurality of pre-existing irregularity recesses 452 have a plurality of pre-existing irregularity recess bottom surfaces 452c and a plurality of pre-existing irregularity recess side surfaces 452b.
Note that the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b refer to the same surface.

(B) Conventional liquid resist curing film formation process.
A liquid resist film was formed on the surface of a plate-making substrate 1, which had multiple pre-existing multiple uneven surface top surfaces 451a, multiple pre-existing multiple uneven surface side surfaces 451b (multiple pre-existing multiple uneven surface recess side surfaces 452b), and multiple pre-existing multiple uneven surface recess bottom surfaces 452c. A conventional liquid resist material 20 (the same liquid resist material used in step (A) of Comparative Example 1A, which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation, and is a conventional liquid resist material commonly used for plate making and etching of printed circuit boards) was applied by a conventional spray-coating method to cover the surface.
Subsequently, the material was exposed to ultraviolet light through an exposure mask member of the desired shape (an exposure mask member having through holes in the portion corresponding to the "ABCDE pattern" region formed on the first region surface 11 of the plate-making substrate when the exposure mask member is placed on the surface of the plate-making substrate, and having a light-blocking portion in the surrounding region). After that, the resist film attached to the areas not irradiated with ultraviolet light was removed using a developer (aqueous solution of sodium carbonate) and developed. Then, the attached conventional resist film was cured by conventional methods such as after-baking to form a conventional resist cured film 30 having a conventional resist convex upper surface cured film 30a and a conventional resist recess bottom surface cured film 30c, as shown in Figure 12(C). However, the conventional resist material attached to the convex side surface 451b (concrete side surface 452b) of the pre-existing multiple uneven parts flowed down to the bottom surface of the recess of the pre-existing multiple uneven parts, and a conventional resist recess side surface cured film was not formed.
The thickness of the conventionally cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.

In this case, a resist-cured film was formed in a form in which no resist-cured film was formed in the peripheral region of the mold substrate, but a conventional resist-cured film was formed in the internal region.
Furthermore, the conventional liquid resist material adhered well to the upper surface 451a of the convex portion and the lower surface 452c of the concave portion, forming a conventional resist upper surface cured film 30a and conventional resist lower surface cured film 30c in the desired area. However, the conventional liquid resist material flowed down from the side surface 451b (side surface 452b) of the convex portion, and no cured film was formed on the side surface 451b (side surface 452b) of the convex portion.

(C) Etching process.
As shown in Figure 13(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1, which had a conventional resist upper surface hardened film 30a and a conventional resist lower surface hardened film 30c formed thereon, using a paddle blowing method, and the surface 12 of the second region of the plate-making substrate, to which the conventional resist hardened film was not attached, until the depth dimension (D3) was approximately 1.0 mm. In this case, slight side etching occurred on the convex side surface 451b (concave side surface 452b) of the pre-existing multiple uneven surfaces.

As shown in Figure 13(E), the etching was further continued until the surface 12 of the second region of the plate-making substrate was etched to a depth dimension (D12a) of approximately 1.9 mm.
As a result, the surface 12 of the second region of the plate-making substrate is etched to form a conventional second recess-forming portion 121a having an etched recessed shape, and the existing multiple recessed portions 45 are formed to protrude from the conventional second recess-forming portion 121a.

(D) Conventional process for removing the cured resist film.
As shown in Figure 13(F), the conventional resist cured film 30a on the upper surface of the protrusions and the conventional resist cured film 30c on the lower surface of the recesses were removed using a general-purpose resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In the aforementioned "(C) Corrosion Etching Process," the pre-existing multiple uneven surfaces (convex surfaces 451b, concave surfaces 452b) where the hardened film had not been formed were also corroded and etched, resulting in side-etched pre-existing multiple uneven surfaces (convex surfaces 451s, concave surfaces 452s, concave surfaces 452s) as shown in Figure 13(D). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched pre-existing multiple uneven surfaces have undesirable shapes, and when a workpiece is processed using a press-forming die with such side-etched uneven surfaces, it is undesirable because a workpiece with the desired uneven shape cannot be obtained.
Side etching refers to a shape in which the side surface 451b of the convex portion or the side surface 452b of the concave portion of the existing multiple uneven portions is etched in a way that causes it to be recessed toward the inner surface of the side surface, which is an undesirable shape for a plate used for pressing.

<Comparative Example 1Ab (Manufacturing of a pressing plate using a conventional dry film resist material)>
Other comparative examples of Example 1A described above are explained below.
Comparative Example 1Ab is a method for manufacturing a pressing plate in which a conventional dry film resist material is used instead of an inkjet resist material in step (B) of Example 1A described above.
Although diagrams illustrating the series of steps in this comparative example are not shown, some of the components are similar to those in comparative example 1A above, and some of the components will be described with their respective reference numerals.
(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a pre-existing number of uneven surfaces 45.
Using the same method as in step (A) of the above-described Example 1A, a conventional liquid resist material was used to prepare a plate-making substrate in which the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a pre-existing multiple irregularity 45, (i) the pre-existing multiple irregularity 45 has a plurality of pre-existing multiple irregularity convex portions 451 formed with a plurality of convex shapes and a plurality of pre-existing multiple irregularity recesses 452 formed with a plurality of concave shapes, the plurality of pre-existing multiple irregularity convex portions 451 have a plurality of pre-existing multiple irregularity convex upper surfaces 451a and a plurality of pre-existing multiple irregularity convex side surfaces 451b, and the plurality of pre-existing multiple irregularity recesses 452 have a plurality of pre-existing multiple irregularity recess bottom surfaces 452c and a plurality of pre-existing multiple irregularity recess side surfaces 452b.
The material and shape of the plate-making substrate are the same as in Example 1A, being made of stainless steel and having a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a height of 90 mm. Also, the height dimension D1 of the protrusions 451 of the pre-existing multiple protrusions (the depth dimension D1 of the recesses 452 of the pre-existing multiple protrusions) is 0.9 mm, the same as in Example 1A.

(B) Conventional resist curing film formation process.
A conventional dry film resist material (with a thickness of approximately 0.02 mm to approximately 0.04 mm) was attached to the surface of the printing plate substrate on which the pre-formed multiple uneven areas 45 were formed. In this case, gaps were created between the multiple protruding surfaces 451b (recessed surfaces 452b) and the bottom surfaces 452c of the recessed areas of the pre-formed multiple uneven areas 45 formed on the printing plate substrate, as the dry film resist material did not come into contact with them. As the dry film resist material, a sheet-type dry film resist material with a desired "thickness of approximately 0.02 mm to approximately 0.04 mm" was selected and used from among commercially available conventional sheet-type dry film resist materials.
A resist-cured film was formed on a plate-making substrate to which a conventional dry film resist material had been attached, by irradiating it with conventional ultraviolet light, developing it, and other conventional processes, via an exposure mask member (an exposure mask member that, when placed on the surface of the plate-making substrate, has through holes in the area corresponding to the ^" ABCDE pattern" area formed on the first surface region 11 of the plate-making substrate, and has a light-blocking portion in the surrounding area).
In this case, no resist-cured film was formed in the peripheral region of the plate-making substrate, and a conventional resist-cured film was formed covering the "ABCDE pattern" region formed by the uneven shape of the internal region of the plate-making substrate. Furthermore, in the resist-cured film formed in the internal region, the conventional resist-cured film did not come into contact with the convex side surface 451b (concave side surface 452b) and the concave bottom surface 452c of the pre-existing multiple uneven parts, and no conventional resist-cured film was attached to or formed on these surfaces.

(C) Etching process.
Next, an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a conventional resist-cured film had been formed, and the surface 12 of the second region of the plate-making substrate, to which the conventional resist-cured film was not attached, was etched to a depth of approximately 1.0 mm, and then further etched until the depth of approximately 1.9 mm was reached.
As a result, the surface 12 of the second region of the plate-making substrate is etched to form a conventional second recess-forming portion 121a having an etched recessed shape, and a plurality of pre-existing recessed portions 45 forming an "ABCDE pattern" are formed to protrude from the conventional second recess-forming portion 121a.

(C) Conventional resist curing film removal process.
Next, the conventionally cured resist film was removed using a resist remover (aqueous sodium hydroxide solution or sodium hydroxide solution).

In this "corrosion etching process," the existing multiple uneven surfaces (convex surfaces 451b, concave surfaces 452b) where the hardened film had not been formed were also corroded and etched, resulting in side-etched existing multiple uneven surfaces (convex surfaces 451s, concave surfaces 452s). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched pre-existing multiple uneven surfaces have undesirable shapes, and when a workpiece is processed using a press-forming die with such side-etched uneven surfaces, it is undesirable because a workpiece with the desired uneven shape cannot be obtained.
This side etching phenomenon occurred when a conventional resist material (with a thickness of approximately 0.02 mm to approximately 0.04 mm) was applied to the surface of a plate-making substrate with multiple pre-formed uneven areas 45. As a result, gaps were created between the sides 451b (sides 452b) of the convex portions and the bottom surfaces 452c of the concave portions without contact by the dry film resist material. This was due to the absence of a conventionally cured resist film on the sides 451b (sides 452b) and bottom surfaces 452c of the concave portions, leading to etching of these sides and bottom surfaces.

<Comparative Example 1A-a (Processing of a workpiece using the pressing plate of Comparative Example 1A)>
This comparative example uses the pressing plate 10 manufactured in "Comparative Example 1A" above as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108 as a workpiece 108.
This comparative example uses the pressing plate 10 configured in "Comparative Example 1A" instead of the pressing plate 10 configured in "Example 1A-a" described above, and the other configurations are the same as those of "Example 1B-a" described above.
In other words, the workpiece was embossed using the following process.
(S-a) A die-cutting plate 10 was prepared to be used as a pressing plate 10, which had the pre-existing uneven surface 4 manufactured in Comparative Example 1A.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94 with a smooth surface, which was prepared separately, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108.
As a result, a workpiece surface irregularity forming portion is created on the surface of the workpiece 108, having an irregularity shape that matches the irregularity shape of the pre-existing irregularity portion 4.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
In this way, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed shape having a graphic character pattern that matched the graphic character pattern formed in a raised and recessed shape on the pre-existing raised and recessed portion 4.

In this case, irregularities were observed in the graphic and pictorial patterns formed by the uneven shape, and the desired shape and dimensional accuracy of the workpiece could not be obtained. Furthermore, during repeated pressing, a phenomenon was observed in some cases where the workpiece 108 was driven to detach from the pressing plate while remaining stuck to or caught on the pressing plate, rather than detaching from it.
In other words, due to the shape of the side-etched surface 451s (multiple side-etched recessed surface 452s) of the pressing plate, it was not possible to obtain a workpiece with the desired shape accuracy and dimensional accuracy of graphic characters and patterns.

<Example 2A (Manufacturing of flexible plates and foil stamping plates for pressing processes)>
This embodiment is a method for manufacturing a stamping plate similar to the "dependent configuration 6" described above, and is a method for manufacturing a stamping plate shown in Figure 4, in which a "heart pattern formed with fine irregularities" is formed on the surface of the protrusions that protrude from the recesses. This stamping plate is used as a flexible plate and foil stamping plate, which is installed by being wrapped around the surface of a roll.
In this embodiment, a conventional resist material is used to form a plurality of pre-existing fine uneven portions 46. An inkjet resist material is then applied to the surface of the printing plate substrate on which the plurality of pre-existing fine uneven portions 46 are formed, and an inkjet resist material is applied, cured, and etched to form a second inkjet resist film corrosion recess 121. The result is an inkjet film corrosion pre-existing plurality of fine uneven portions protruding 46 from the bottom surface of the second inkjet resist film corrosion recess 121, forming a protruding shape.
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a plurality of pre-existing fine irregularities 46.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel and has a substantially flat shape with a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm, and is flexible.
Next, a conventional liquid resist material (i) having the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon irradiation with ultraviolet light as a conventional resist material (a conventional liquid resist material commonly used for plate making and etching of printed circuit boards, a desired conventional liquid resist material selected from commercially available general-purpose liquid resist materials, the same conventional liquid resist material used in step (A) of Example 1A described above) was selected and used on a desired area of the first region surface 11 of the plate-making substrate 1, and was applied to a thickness of approximately 0.02 mm to approximately 0.04 mm by a conventional spray-coating method, and dried by a predetermined method to form a resist adhesion film.
Then, ultraviolet light was irradiated onto the resist-attached film through an exposure mask member having through holes and forming a desired fine graphic/character pattern (heart pattern) for light transmission. Unwanted areas of the resist-attached film were removed using a developer in a manner similar to that of Example 1A, and after baking was performed to form a cured resist film having the desired fine graphic/character pattern (heart pattern).

A commercially available general-purpose etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched until the depth "d1" was 0.1 mm, thereby forming a plurality of pre-existing multiple fine uneven recesses 462 formed in a concave shape, and a plurality of pre-existing multiple fine uneven protrusions 461 formed in a convex shape.
Next, the hardened resist film was removed using a commercially available general-purpose resist remover (caustic soda aqueous solution).
In this way, multiple pre-existing multiple micro-recesses 461 formed in a convex shape and multiple pre-existing multiple micro-recesses 462 formed in a concave shape are formed, and thus multiple pre-existing multiple micro-recesses 46 are formed.
Note that the diagram illustrating the formation of the multiple pre-existing multiple micro-recesses 46, which has multiple pre-existing multiple micro-recesses convex portions 461 and multiple pre-existing multiple micro-recesses concave portions 462 formed in a concave shape, is not shown in Figure 4.

In other words, a plate-making substrate was prepared such that the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a plurality of pre-existing fine irregularities 46, the plurality of pre-existing fine irregularities 46 has a plurality of pre-existing multiple fine irregularity convex portions 461 formed with a plurality of convex shapes and a plurality of pre-existing multiple fine irregularity recesses 462 formed with a plurality of concave shapes, the plurality of pre-existing multiple fine irregularity convex portions 461 has a plurality of pre-existing multiple fine irregularity convex upper surfaces 461a and a plurality of pre-existing multiple fine irregularity convex side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b.
Furthermore, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b correspond to the same side region.

In this way, a pre-existing multiple fine uneven portion 46 having multiple pre-existing multiple fine uneven portion protrusions (461) and multiple pre-existing multiple fine uneven portion recesses 462 is formed on the printing plate substrate as shown in Figure 4(A).
The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed portion protrusion (461) was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (50 μm).
In this way, a plate-making substrate 1 having multiple pre-existing fine uneven areas 46, represented by a "heart pattern" fine pattern formed with the uneven shape shown in (A-b) of Figure 4, was prepared and supplied.

(B) Process for forming an inkjet resist cured film in the desired area.
Next, as shown in Figure 4(B), the inkjet resist material 2 was applied using an inkjet method to cover the multiple pre-existing multiple fine uneven surfaces 46 of the printing plate substrate 1, specifically the multiple pre-existing multiple fine uneven surfaces convex portions 461 and multiple pre-existing multiple fine uneven surfaces recessed portions 462, thereby forming a pre-existing multiple fine uneven surface inkjet resist adhesion film. In this case, it was confirmed that the inkjet resist material was attached to the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 461b of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces recessed portions, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven surfaces recessed portions.
Note that the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces and the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces refer to the same side surface.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material commonly used in the manufacture of metal wiring boards as electronic components was selected and used, which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. The above inkjet resist film attached to the printing plate substrate was then irradiated with ultraviolet light, and subsequently burned at 120°C for 10 minutes to form a hardened upper surface hardened film 3e of the fine protrusions of the desired region inkjet resist, a hardened side surface hardened film 3f of the fine protrusions of the desired region inkjet resist, and a hardened bottom surface hardened film 3g of the fine recesses of the desired region inkjet resist. The thickness of each desired region inkjet resist hardened film was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, inkjet resist cured films 3 were formed in each desired region.

(C) Etching process.
Next, as shown in Figure 4(C), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the desired region inkjet resist fine protrusion upper surface hardened film 3e, the desired region inkjet resist fine protrusion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g have been formed. The surface 12 of the second region of the printing plate substrate 1, on which the desired region inkjet resist hardened film 3 is not attached, is etched to a depth of approximately 0.3 mm. This forms an inkjet resist film corrosion second recess forming portion 121 having a recessed shape, and also forms an inkjet film corrosion pre-existing multiple fine protrusions 466 having a protruding shape where the pre-existing multiple fine protrusions 46 protrude from the inkjet resist film corrosion second recess forming portion 121.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figure 4(D), the inkjet resist cured film 3 was removed from the desired area.
This creates an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-existing multiple fine uneven protrusion portion 466 having a plurality of pre-existing multiple fine uneven protrusion portions 461 and a plurality of pre-existing multiple fine uneven recess portions 462 (heart pattern).

The depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), and the height "d1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), which corresponds to the depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area. The width "w2" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.05 mm (approximately 50 μm), and the width "w1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.05 mm (approximately 50 μm).
Furthermore, the depth "d12" of the second recess formation portion 121 due to inkjet resist film corrosion was approximately 0.3 mm.

Furthermore, it was confirmed that no side etching occurred on the side surface of the second recess formation portion 121 of the inkjet resist film corrosion, and that the side surface of the second recess formation portion 121 of the inkjet resist film corrosion has a smooth, desired inclined side surface that extends from the bottom surface of the second recess formation portion 121 of the inkjet resist film corrosion toward the multiple fine uneven protrusions 466 formed by the inkjet film corrosion.
Furthermore, it was confirmed that the sides of the multiple pre-existing multiple micro-recesses 462 (corresponding to the sides of the multiple pre-existing multiple micro-recesses 461) in Figure 4(D) were not etched and maintained the normal, desired shape shown in Figure 4(A).
In this way, a flexible embossing plate having a degree of flexibility that allows it to be deformed to match the spherical surface of a roll was manufactured, which had multiple pre-existing fine uneven protrusions 466 formed by inkjet film etching of a "heart pattern" with a fine uneven shape.

In this embodiment, it was confirmed that a desired inkjet film corrosion pre-existing multiple fine uneven surface protrusion 466 is formed, which has a normal, desired multiple fine uneven surface 46 and a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that no side etching phenomenon occurred on the desired multiple pre-existing micro-recessed portion convex side surface 461b (pre-existing multiple micro-recessed portion concave side surface 462b), and that the desired shape accuracy and dimensional accuracy were achieved.

<Example 2B (Manufacturing of flexible plates and foil stamping plates for pressing)>
This embodiment is a method for manufacturing a stamping plate similar to the "dependent configuration 6" described above, and is a method for manufacturing a stamping plate shown in Figure 4, in which a "heart pattern formed with fine irregularities" is formed on the surface of the protrusions that protrude from the recesses. This stamping plate is used as a flexible plate and foil stamping plate, which is installed by being wrapped around the surface of a roll.
In the aforementioned Example 2A, the multiple pre-existing fine uneven surfaces 46 are formed by a process that includes a step of attaching them using a conventional liquid resist material by a spray coating method. However, in this example, instead, the present invention is an example of preparing a plate-type substrate in which the multiple pre-existing fine uneven surfaces 46 are formed by a process that includes a step of attaching the multiple pre-existing fine uneven surfaces 46 using an inkjet resist material by an inkjet method.
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a pre-existing number of fine irregularities 46.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel, has a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm, is flexible, and has a substantially flat shape.

Next, a fine-grained heart pattern was applied to the surface of the printing plate substrate 1 using an inkjet resist material. The inkjet resist material was then applied and cured to form an inkjet resist-cured film.
In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120°C for 10 minutes to form a cured inkjet resist film 3 having the desired heart pattern and fine pattern design. The thickness of the inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm.

Next, an etching solution was brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film had been formed, and the surface of the printing plate substrate that did not have the resist cured film attached was etched until the depth "d1" was approximately 0.1 mm (100 μm), thereby forming a plurality of pre-existing multiple fine uneven surfaces 46 having a plurality of pre-existing multiple fine uneven surfaces convex portions 461 and a plurality of pre-existing multiple fine uneven surfaces concave portions 462 on the printing plate substrate.

Next, the inkjet resist curing film was removed using a resist remover.
In this way, a "heart pattern" of multiple pre-existing multiple fine uneven surfaces 46, having multiple pre-existing multiple fine uneven surfaces protrusions 461 and multiple pre-existing multiple fine uneven surfaces recesses 462, was formed on a printing plate substrate as shown in Figure 4(A).
The depth "d1" of each pre-existing multiple micro-recessed recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed protrusion 461 was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed recess 462. The width "w1" of each pre-existing multiple micro-recessed recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of each pre-existing multiple micro-recessed protrusion 461 was approximately 0.05 mm (approximately 50 μm).

(B) Process for forming an inkjet resist cured film in the desired area.
Next, as shown in Figure 4(B), the inkjet resist material 2 was applied using an inkjet method to cover the multiple pre-existing multiple fine uneven surfaces 46 of the printing plate substrate 1, specifically the multiple pre-existing multiple fine uneven surfaces convex portions 461 and multiple pre-existing multiple fine uneven surfaces recessed portions 462, thereby forming a pre-existing multiple fine uneven surface inkjet resist coating film. In this case, it was confirmed that the inkjet resist material was attached to the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 461b of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces recessed portions, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven surfaces recessed portions.
Note that the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b refer to the same region.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in the (B) step of Example 1A and the (A) step of this example), and the droplets ejected from the ejection nozzle were attached under conditions of 2 pl to 15 pl. Then, using a method similar to the (B) step of Example 1A, the above inkjet resist film attached to the plate-making substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a hardened upper surface hardened film 3e of the desired region's fine protrusions, a hardened side surface hardened film 3f of the desired region's fine protrusions, and a hardened bottom surface hardened film 3g of the desired region's fine recesses. The thickness of the inkjet resist cured film in each desired region was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, the inkjet resist cured film 3 was formed in each desired region.

(C) Etching process.
Next, as shown in Figure 4(C), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the desired region inkjet resist fine protrusion upper surface hardened film 3e, the desired region inkjet resist fine protrusion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g have been formed. The surface 12 of the second region of the printing plate substrate 1, on which the desired region inkjet resist hardened film 3 is not attached, is etched to a depth of approximately 0.3 mm. This forms an inkjet resist film corrosion second recess forming portion 121 having a recessed shape, and also forms an inkjet film corrosion pre-existing multiple fine protrusions 466 having a protruding shape where the pre-existing multiple fine protrusions 46 protrude from the inkjet resist film corrosion second recess forming portion 121.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figure 4(D), the inkjet resist cured film 3 was removed from the desired area.
This creates an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-existing multiple fine uneven protrusion portion 466 having a plurality of pre-existing multiple fine uneven protrusion portions 461 and a plurality of pre-existing multiple fine uneven recess portions 462.

The depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), and the height "d1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.1 mm (approximately 100 μm), which corresponds to the depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area. The width "w2" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.05 mm (approximately 50 μm), and the width "w1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 50 μm.
Furthermore, the depth "d12" of the second recess formation portion 121 due to inkjet resist film corrosion was approximately 0.3 mm.

Furthermore, it was confirmed that no side etching occurred on the side surface of the second recess formation portion 121 of the inkjet resist film corrosion, and that the side surface of the second recess formation portion 121 of the inkjet resist film corrosion has a smooth, desired inclined side surface that extends from the bottom surface of the second recess formation portion 121 of the inkjet resist film corrosion toward the multiple fine uneven protrusions 466 formed by the inkjet film corrosion.
Furthermore, it was confirmed that the sides of the multiple pre-existing multiple micro-recesses 462 (corresponding to the sides of the multiple pre-existing multiple micro-recesses 461) in Figure 4(D) were not etched and maintained the normal, desired shape shown in Figure 4(A).
In this way, a flexible embossing plate having a degree of flexibility that allows it to be deformed to match the spherical surface of a roll was manufactured, forming a "heart pattern" with multiple pre-existing fine uneven protrusions 466 formed by inkjet film etching with a fine uneven shape.

In this embodiment, it was confirmed that a desired inkjet film corrosion pre-existing multiple fine uneven surface protrusion 466 is formed, which has a normal, desired multiple fine uneven surface 46 and a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that no side etching phenomenon occurred on the desired multiple pre-existing micro-recessed portion convex side surface 461b (pre-existing multiple micro-recessed portion concave side surface 462b), resulting in a recessed state, and that the desired shape accuracy and dimensional accuracy were achieved.

<Example 2B-a (Processing of a workpiece using the pressing plate from Example 2B installed in a roll device)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 2B is installed in a roll-type processing device and used as a foil stamping plate 10 to perform foil stamping.
The workpiece was foil-stamped using the following process.
(S-a) A foil stamping plate 10, which is a pressing plate 10, was prepared and supplied, on which a plurality of pre-existing fine uneven surfaces 46, which are pre-existing uneven surfaces 4, were formed as pre-existing uneven surfaces 4, as manufactured in Example 2B.
(S-b) A pressing device was prepared, equipped with a main roll 96 and a counter roll 97 facing each other.
(S-c) The foil stamping plate, which serves as the pressing plate 10, is wrapped around the main roll 96 and installed. In this case, a magnetic force member that generates magnetic force is configured inside the main roll 96, and the foil stamping plate 10, which serves as the pressing plate 10 and has flexibility, is wrapped around the main roll 96 by magnetic force and installed.
(S-d) A predetermined receiving plate 94 was installed on the opposing roll 97 of the pressing device.
In this embodiment, a stainless steel anvil roll 97 with a smooth spherical surface, prepared separately, was prepared and installed as the counter-roll 97.
(S-e) The main roll 96 and the opposing roll 97 were driven, and the workpieces, consisting of a 1 mm thick paper sheet as the workpiece base material 108a and a thin gold-colored sheet-like foil material 108b with a thickness of approximately 30 μm, were continuously supplied between the main roll 96 and the opposing roll 97 in a parallel manner, so that the pressing plate 10 and the receiving plate 94 could rotate and continuously press the workpieces.
As a result, a sheet-like foil material having a fine uneven shape that matches the uneven shape of the multiple fine uneven parts 46, which are pre-existing uneven parts 4, is transferred to the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation part.
(S-f) As the roll rotated, the workpiece was separated from the main roll 96 and the opposing roll 97, releasing the pressure on the workpiece.
As a result, a workpiece was prepared in which a workpiece transfer forming portion was formed on the surface of the workpiece 108, having a fine uneven shape that matches the uneven shape of the multiple pre-existing fine uneven portions 46 as pre-existing uneven portions 4.
In this way, a processed product was prepared in which a metal foil having a heart pattern and a plurality of fine relief patterns was transferred and formed on the surface of a paper sheet 108a, which was to be processed 108.

In this case, no abnormalities occurred in the paper sheet 108a and the metal foil sheet 108b, which served as the workpiece 108. Under normal conditions, a workpiece was obtained in which a plurality of fine uneven patterns, with the desired shape accuracy and dimensional accuracy, were formed on the paper sheet 108a, which served as the workpiece 108, by transferring the metal foil.

<Comparative Example 2A (Manufacturing of a pressing plate using conventional liquid resist material)>
This comparative example describes a method for manufacturing a pressing plate in which, in step (B) of Example 2A above, a conventional liquid resist material is used instead of the inkjet resist material to form the second recessed portion 121 of the inkjet resist film corrosion.
Schematic diagrams illustrating the manufacturing process of this comparative example are shown in Figures 14 and 15. Figures 14 and 15 are schematic diagrams illustrating the manufacturing process of a conventional method for manufacturing a pressing plate.

(A) A step of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 46.
As shown in Figures 14(A) and (B), a plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel and has a substantially flat shape with a thickness "h" of 0.5 mm, a width of 125 mm, and a height of 90 mm.
Next, in the same manner as in step (A) of Example 2A, a conventional liquid resist material (a conventional liquid resist material that has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and is commonly used for plate making and etching of printed circuit boards, and is a desired conventional liquid resist material from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material used in step (A) of Example 1A described above) was applied to the surface of the plate-making substrate 1, including the surface of the first region 11 of the plate-making substrate 1, using a conventional resist material, to a thickness in the range of approximately 0.02 mm to approximately 0.04 mm, and dried by a predetermined method to form a resist film.
Then, ultraviolet light was irradiated onto the resist-attached film through an exposure mask member on which a desired fine graphic pattern (heart pattern) for light blocking was formed. A cured resist film having the desired fine graphic pattern (heart pattern) was then formed by development, after-baking, development, etc.

An etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched until the depth "d1" was approximately 0.1 mm (100 μm), thereby forming a plurality of pre-existing multiple fine uneven recesses 462 formed in a concave shape, and a plurality of pre-existing multiple fine uneven protrusions 461 formed in a convex shape.
Next, the cured resist film was removed using a resist remover (caustic soda aqueous solution).
In this way, as shown in Figure 14(B), a plurality of pre-existing multiple micro-recesses 461 formed in a convex shape and a plurality of pre-existing multiple micro-recesses 462 formed in a concave shape were created.

In this way, a plate-making substrate was prepared, wherein the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a plurality of pre-existing fine irregularities 46, the plurality of pre-existing fine irregularities 46 has a plurality of pre-existing multiple fine irregularity protrusions 461 formed by a plurality of fine convex shapes, and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of fine concave shapes, the plurality of pre-existing multiple fine irregularity protrusions 461 has a plurality of pre-existing multiple fine irregularity protrusion upper surfaces 461a and a plurality of pre-existing multiple fine irregularity protrusion side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b.
Furthermore, the multiple pre-existing multiple micro-protrusions and protrusions (convex side surfaces 461b) and the multiple pre-existing multiple micro-protrusions and recesses (concave surfaces 462) are all the same side region and represent the same side surface.
The material and shape of the substrate for the printing plate are the same as in Example 2A, being made of steel, with a thickness "h" of 0.5 mm, a width of 125 mm, a height of 90 mm, flexibility, and a substantially flat shape.
Furthermore, the depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm (approximately 100 μm), and the height "d1" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm (approximately 100 μm), corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (approximately 50 μm).

(B) Conventional conventional resist curing film formation process.
As shown in Figure 14(C), a conventional liquid resist material (a conventional liquid resist material that has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and is commonly used for plate making and etching of printed circuit boards, and is a desired conventional liquid resist material from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material used in step (A) of this embodiment 2A) was applied to the surface of the plate-making substrate 1 by a conventional spray-coating method, covering the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces, the side surfaces 461b of the multiple pre-existing multiple fine uneven surfaces, the bottom surfaces 462c of the multiple pre-existing multiple fine uneven surfaces, and the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces) and adhering to the surface of the plate-making substrate 1 by a conventional spray-coating method.

Subsequently, the attached liquid resist film was cured by conventional methods such as ultraviolet irradiation exposure, development, and after-baking, using an exposure mask member of the desired shape (an exposure mask member having through holes in the portion corresponding to the "heart pattern" region formed on the first region surface 11 of the plate-making substrate when the exposure mask member is placed on the surface of the plate-making substrate, and having a light-blocking portion in the surrounding region), thereby forming a conventional resist cured film 30 that forms a conventional resist fine protrusion upper surface cured film 30e and a conventional resist fine recess bottom surface cured film 30g, as shown in Figure 14(C). However, the conventional resist material attached to the existing multiple fine uneven surface protrusion side surface 461b (existing multiple fine uneven surface recess side surface 462b) flowed down to the bottom surface of the existing multiple fine uneven surface recess, and a conventional resist fine recess side surface cured film (conventional resist fine protrusion side surface cured film) was not formed.
The thickness of the conventionally cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.

In this process, a resist-cured film was formed in which no resist-cured film was formed in the peripheral region of the mold substrate, but a conventional resist-cured film was formed in the internal region.
Furthermore, within that internal region, the conventional liquid resist material adhered well to the upper surface 461a of the multiple existing fine uneven surfaces and the bottom surface 462c of the multiple existing fine uneven surfaces, and formed a conventional resist hardened film 30e on the upper surface of the fine uneven surfaces and a conventional resist hardened film 30g on the bottom surface of the fine uneven surfaces in the desired region. However, the conventional liquid resist material flowed down from the side surfaces 461b (side surfaces 462b) of the multiple existing fine uneven surfaces, and no conventional resist hardened film was formed on the side surfaces 461b (side surfaces 462b) of the multiple existing fine uneven surfaces.

(C) Etching process.
As shown in Figure 15(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of a plate-making substrate 1, which had a conventional resist fine protrusion upper surface hardened film 30e and a conventional resist fine recess bottom surface hardened film 30g formed on it, using a paddle blowing method. The surface 12 of the second region of the plate-making substrate, to which the conventional resist hardened film was not attached, was etched until the depth dimension "d3" was approximately 0.1 mm, thereby forming a second recessed area 121b during the etching process. In this case, slight side etching occurred on the convex side surface 461b (concrete side surface 462b) of the pre-existing multiple fine uneven areas.

As shown in Figure 15(E), the etching was further continued until the surface 12 of the second region of the plate-making substrate was etched to a depth of approximately 0.3 mm (d12a).
As a result, the surface 12 of the second region of the substrate for printing plates is etched to form a conventionally used second erosion recess-forming portion 121s having an etched recessed shape, and the multiple existing fine irregularities 46 are formed to protrude from the conventionally used second erosion recess-forming portion 121s.

(D) Conventional resist curing film removal process.
As shown in Figure 15(F), the conventional resist fine protrusion upper surface hardened film 30e and the conventional resist fine recess bottom surface hardened film 30g were removed using a resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In the aforementioned "(C) Corrosion Etching Process," the existing multiple micro-recessed protrusions 461b (existing multiple micro-recessed recesses 462b) on which the hardened film had not been attached were also corroded and etched, resulting in side-etched existing multiple micro-recessed protrusions 461s (multiple side-etched existing multiple micro-recessed recesses 462s) as shown in Figure 15(D). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched pre-existing multiple micro-recesses have undesirable shapes, resulting in undesirable shapes. When a workpiece is processed using a press-forming die with such side-etched micro-recesses, it is undesirable because a workpiece with the desired recessed shape cannot be obtained.
Side etching refers to a shape in which the side surfaces 461b of the convex portions or the side surfaces 462b of the concave portions of the existing multiple fine uneven surfaces are etched in a way that causes them to be recessed toward the inner surface of the side surface. This shape is undesirable for a plate used for pressing.

<Comparative Example 2Ab (Manufacturing of a pressing plate using a conventional dry film resist material)>
Other comparative examples of Example 2A described above are explained below.
This comparative example uses a plate-making substrate 1 equipped with a plate-making substrate second region surface 12 having a smooth, even surface and a plate-making substrate first region surface 11 having a plurality of pre-existing fine uneven surfaces 46 as pre-existing uneven surfaces 4, using a conventional conventional liquid resist material in the same process as in step (A) of Example 2A above. Subsequently, in step (B), a conventional conventional dry film resist material is used instead of the inkjet resist material to manufacture a plate for pressing.
Figures illustrating this comparative example are shown in Figures 21(B) to (F).

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a plurality of pre-existing fine irregularities 46.
A plate-making substrate was prepared using the same method as in step (A) of the above-described embodiment 2A, wherein the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a plurality of pre-existing fine irregularities 46, (b) the plurality of pre-existing fine irregularities 46 has a plurality of pre-existing multiple fine irregularity protrusions 461 formed by a plurality of fine protrusion shapes, and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of fine recess shapes, the plurality of pre-existing multiple fine irregularity protrusions 461 has a plurality of pre-existing multiple fine irregularity protrusion upper surfaces 461a and a plurality of pre-existing multiple fine irregularity protrusion side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b.
The material and shape of the substrate for the printing plate are the same as in Example 2A, and it is made of steel and has a substantially flat shape with a thickness of 0.5 mm, a width of 125 mm, and a length of 90 mm, and is flexible.
Furthermore, the depth "d1" of the pre-existing multiple fine uneven recesses 462 was approximately 0.1 mm (approximately 100 μm), and the height "d1" of the pre-existing multiple fine uneven protrusions 461 was approximately 0.1 mm (approximately 100 μm), corresponding to the depth of the pre-existing multiple fine uneven recesses 462. The width "w1" of each pre-existing multiple fine uneven recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of the pre-existing multiple fine uneven protrusions 461 was approximately 0.05 mm (approximately 50 μm). In this way, a plate-making substrate as shown in Figure 21(A) was prepared.
In Figure 21(A), reference numerals 461a, 461b, 462c, and 462b are not shown, but are similar to the reference numerals shown in Figure 14(B). A plurality of pre-existing multiple micro-recesses have multiple upper surfaces 461a and multiple side surfaces 461b, and a plurality of pre-existing multiple micro-recesses have multiple bottom surfaces 462c and multiple side surfaces 462b.

(B) Conventional resist curing film formation process.
Next, as shown in Figure 21(B), a conventional dry film resist material 20 (with a thickness of approximately 0.02 mm to approximately 0.04 mm) was attached to the surface of the mold substrate on which the multiple pre-formed fine irregularities 46 were created, using a conventional method. As the conventional dry film resist material 20, a sheet-type dry film resist material (with a thickness of approximately 0.02 mm to approximately 0.04 mm) was selected from commercially available conventional sheet-type dry film resist materials.
In this case, gaps were created between the conventional dry film resist material and the surfaces 461b (surfaces 462b) of the multiple pre-existing multiple fine uneven surfaces 46 formed on the mold substrate, and the bottom surface 462c of the pre-existing multiple fine uneven surfaces.
Next, as shown in Figure 21(C), a resist-cured film was formed on the mold substrate to which the conventional dry film resist material was attached, by irradiating it with ultraviolet light through an exposure mask member (an exposure mask member having through holes in the portion corresponding to the "heart pattern" region formed on the first surface region 11 of the mold substrate when the exposure mask member is placed on the surface of the mold substrate, and having a light-blocking portion in the surrounding region), followed by conventional processes such as development.
In this case, a resist-cured film was formed in a form in which no resist-cured film was formed in the peripheral region of the mold substrate, but a conventional resist-cured film was formed in the internal region. Furthermore, no conventional resist-cured film was formed on the convex side surface 461b (concave side surface 462b) of the pre-existing multiple fine unevenness portion and the bottom surface 462c of the pre-existing multiple fine unevenness portion recess.

(C) Etching process.
Next, as shown in Figure 21(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a conventional resist-cured film had been formed, and the surface of the second region 12 of the plate-making substrate, to which the conventional resist-cured film had not been attached, was etched until the depth dimension "d3" was approximately 0.1 mm, thereby forming a second eroded recess 121b during the etching process.
In this case, slight side etching occurred on the convex side surface 461b (concave side surface 462b) of the existing multiple fine uneven surfaces, and furthermore, the bottom surface 462c of the concave surface of the existing multiple fine uneven surfaces was also corroded and etched.

Furthermore, as shown in Figure 21(E), the etching was continued until the surface of the second region 12 of the plate-making substrate was etched to a depth of approximately 0.3 mm.
As a result, the surface 12 of the second region of the plate-making substrate is etched to form a conventionally used second erosion recess-forming portion 121s having an etched recessed shape, and the multiple pre-existing fine irregularities 46 are formed to protrude from the conventionally used second erosion recess-forming portion 121s.

(D) Conventional resist curing film removal process.
Next, as shown in Figure 21(F), the conventionally cured resist film was removed using a resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In the aforementioned "corrosion etching process," the existing multiple micro-recessed protrusions 461b (existing multiple micro-recessed recesses 462b) on which the hardened film had not been attached were also corroded and etched, resulting in side-etched existing multiple micro-recessed protrusions 461s (multiple side-etched existing multiple micro-recessed recesses 462s). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched pre-existing multiple micro-recesses have convex side surfaces 461s (multiple side-etched pre-existing multiple micro-recesses have concave side surfaces 462s), which are not of the desired shape and are undesirable. When a workpiece is processed using a press-forming die with such side-etched micro-recesses, it is undesirable because a workpiece with the desired recessed shape cannot be obtained.
This side etching phenomenon occurred when a conventional dry film resist material was applied to the surface of a plate-making substrate with multiple pre-existing fine uneven areas 46. As a result, gaps were created between the sides 461b (sides 462b) of the convex portions of the multiple pre-existing fine uneven areas and the bottom surface 462c of the concave portions of the multiple pre-existing fine uneven areas, without contact by the conventional dry film resist material. Consequently, the conventional resist curing film was not formed on the sides 461b (sides 462b) of the convex portions of the multiple pre-existing fine uneven areas and the bottom surface 462c of the concave portions of the multiple pre-existing fine uneven areas, leading to etching of these sides and bottom surfaces.

<Comparative Example 2A-a (Processing of a workpiece using the pressing plate from Comparative Example 2A installed in a roll device)>
In this comparative example, the pressing plate 10 manufactured in Comparative Example 2A above is installed in a roll-type processing device and used as a foil stamping plate 10 to perform foil stamping.
The workpiece was foil-stamped using the following process.
(S-a) A foil stamping plate 10, which is a pressing plate 10, was prepared and supplied, on which a plurality of pre-existing fine uneven surfaces 46, which are pre-existing uneven surfaces 4, were formed as pre-existing uneven surfaces 4, as manufactured in Comparative Example 2A.
(S-b) A pressing device was prepared, equipped with a main roll 96 and a counter roll 97 facing each other.
(S-c) A foil stamping plate, which serves as the pressing plate 10, is wrapped around the main roll 96, which has magnetic properties on its surface, and installed.
(S-d) A predetermined receiving plate 94 was installed on the opposing roll 97 of the pressing device.
In this embodiment, a stainless steel anvil roll 97 with a smooth spherical surface, prepared separately, was prepared and installed as the counter-roll 97.
(S-e) The main roll 96 and the opposing roll 97 were driven, and the workpiece 108, consisting of a paper sheet with a thickness of 1 mm as the workpiece base material 108a and a thin, gold-colored sheet-like foil material 108b with a thickness of approximately 30 μm, was continuously supplied between the main roll 96 and the opposing roll 97 in a parallel manner, so that the pressing plate 10 and the receiving plate 94 could rotate and continuously press the workpiece.
As a result, a sheet-like foil material having a fine uneven shape that matches the uneven shape of the multiple fine uneven parts 46, which are pre-existing uneven parts 4, is transferred to the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation part.
(S-f) As the roll rotated, the workpiece was separated from the main roll 96 and the opposing roll 97, releasing the pressure on the workpiece.
As a result, a workpiece was prepared in which a workpiece transfer forming portion was formed on the surface of the workpiece 108, having a fine uneven shape that matches the uneven shape of the multiple pre-existing fine uneven portions 46, which are pre-existing uneven portions 4.
In this way, a processed product was prepared in which a metal foil having a heart pattern and a plurality of fine relief patterns was transferred and formed on the surface of a paper sheet 108a, which was to be processed 108.

Specifically, using the foil stamping plate manufactured as a pressing plate according to Comparative Example 2A, foil stamping was performed using a processing method similar to that of Example 2A.

In this case, irregularities were observed in the fine patterns and characters formed by the fine uneven surface, and the desired shape and dimensional accuracy of the workpiece could not be obtained. Furthermore, during repeated pressing, a phenomenon was observed in some cases where the workpiece 108, consisting of a paper sheet and a sheet-like foil material 108b, was driven to detach from the pressing plate while remaining stuck to or caught on the pressing plate, rather than separating from it.
In other words, due to the shape of the side-etched surface 461s (and the side-etched recessed surface 462s) of the pressing plate, it was not possible to obtain a workpiece with a fine graphic character pattern with the desired shape accuracy and dimensional accuracy.

<Example 3A (Manufacturing of a foil stamping plate for pressing)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 8" described above, and is a pressing plate shown in Figure 9 (A-a), Figure 9 (B-a), (B-b), (B-c), and Figure 9 (C), wherein a "fine graphic character pattern" is formed on the surface of the protrusions that protrude from the recesses by a combination of multiple types of uneven pattern cells that are engraved with a fine uneven shape, divided into predetermined shapes, and arranged in a regular manner. This pressing plate is used as a foil stamping die or an embossing plate.
In this embodiment, a plurality of pre-existing fine uneven portions 46 are formed by a process including a process using an inkjet resist material, and then a second inkjet resist film corrosion recess formation portion 121 is formed by a process including a process using an inkjet resist material, and the form is adjusted so that the plurality of pre-existing fine uneven portions 46 are formed into an inkjet film corrosion pre-existing multiple fine uneven portion protrusion portion 466 having a protruding shape that protrudes from the bottom surface of the second inkjet resist film corrosion recess formation portion 121.
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a plurality of pre-existing fine irregularities 46.
A plate-type substrate 1 having a planar surface shape was prepared and supplied, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of copper and has a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, an inkjet resist material was applied to the surface of the printing plate substrate 1 using an inkjet method to form an inkjet resist adhesion film, which was then cured to form an inkjet resist cured film. In this way, an inkjet resist cured film with a fine uneven shape as shown in Figure 9(C) was formed.
In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, the same inkjet resist material used in step (B) of Example 1A described above was selected from commercially available inkjet resist materials, specifically those commonly used in the manufacture of metal wiring boards as electronic components, that have the property of crosslinking into a three-dimensional chemical structure through a chemical reaction upon ultraviolet irradiation, and have a viscosity of "10 mPa·s to 20 mPa·s (25°C)". The droplets ejected from the ejection nozzle were 2 pl to 15 pl. The inkjet resist film attached to the printing plate substrate was then irradiated with ultraviolet light, and subsequently, burning was performed at 120°C for 10 minutes to form a cured inkjet resist film 3 having a fine pattern. The thickness of the inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm.
A commercially available conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of a printing plate substrate 1 on which an inkjet resist cured film had been formed. The surface of the printing plate substrate that did not have the resist cured film attached was etched until the depth "d1" reached 0.1 mm, thereby forming a plurality of pre-existing multiple fine uneven recesses 462 in a concave shape, and a plurality of pre-existing multiple fine uneven protrusions 461 in a convex shape.

Next, the cured resist film was removed using a commercially available conventional resist remover (caustic soda aqueous solution).
In this way, multiple pre-existing multiple micro-recesses 461 formed in a convex shape and multiple pre-existing multiple micro-recesses 462 formed in a concave shape were created.

In other words, the second region surface 12 of the substrate for printing plates has a smooth surface without irregularities, and the first region surface 11 of the substrate for printing plates has a pre-existing irregularity 4, and the pre-existing irregularity 4 has a pre-existing multiple fine irregularity 46 formed in a fine irregularity shape as shown in Figure 9(C). The pre-existing multiple fine irregularity 46 has a plurality of pre-existing multiple fine irregularity convex portions 461 formed in a plurality of convex shapes, and a plurality of pre-existing multiple fine irregularity recesses 462 formed in a plurality of concave shapes, and the plurality of pre-existing multiple fine irregularity convex portions 461 has a plurality of pre-existing multiple fine irregularity convex upper surfaces 461a and a plurality of pre-existing multiple fine irregularity convex side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b.
A plate-making substrate having multiple pre-existing micro-relief sections 46 formed with a micro-relief shape as shown in Figure 9(C) was prepared.
Furthermore, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b correspond to the same side region.
In Figure 9, the reference numerals for the multiple pre-existing multiple micro-recesses, protrusions 461, recesses 462, upper surfaces 461a, side surfaces 461b, bottom surfaces 462c, and side surfaces 462b of the multiple pre-existing multiple micro-recesses are not shown, but their respective reference numerals are similar to those shown in Figure 4.

In this way, a plurality of pre-existing multiple fine uneven surfaces 46, having multiple pre-existing multiple fine uneven surfaces protrusions 461 and multiple pre-existing multiple fine uneven surfaces recesses 462, was formed on the printing plate substrate as shown in Figure 9(C).
The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (approximately 50 μm).
In this way, a plate-type substrate 1 having multiple pre-existing fine uneven surfaces 46 was prepared and supplied.

(B) Inkjet resist curing film formation step to form an inkjet resist curing film 3 in a desired area.
Using a plate-making substrate 1 having multiple pre-existing fine uneven surfaces 46 prepared as described above, an inkjet resist material 2 was applied by an inkjet method to cover the multiple pre-existing fine uneven surfaces 46 of the plate-making substrate 1, specifically the multiple pre-existing fine uneven surfaces 461 and multiple pre-existing fine uneven surfaces recesses 462, thereby forming a pre-existing multiple fine uneven surface inkjet resist adhesive film. In this case, it was confirmed that the inkjet resist material was attached to the upper surfaces 461a of the multiple pre-existing fine uneven surfaces, the side surfaces 461b of the multiple pre-existing fine uneven surfaces, the side surfaces 462b of the multiple pre-existing fine uneven surfaces recesses, and the bottom surfaces 462c of the multiple pre-existing fine uneven surfaces recesses.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material that is commonly used in the manufacture of metal wiring boards as electronic components was selected and used, which is the same as the inkjet resist material used in the (B) step of Example 1A (the same inkjet resist material used in (A) of Example 3) above, has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation, and has a viscosity of 10 mPa·s to 20 mPa·s (25°C), and was attached under conditions that the amount of liquid droplets ejected from the ejection nozzle was 2 pl to 15 pl. Then, ultraviolet light was irradiated onto the inkjet resist film attached to the plate-making substrate, and then burning was performed at 120°C for 10 minutes to form a hardened upper surface hardened film 3e of the fine protrusions of the desired region inkjet resist, a hardened side surface hardened film 3f of the fine protrusions of the desired region inkjet resist, and a hardened bottom surface hardened film 3g of the fine recesses of the desired region inkjet resist. The thickness of the inkjet resist cured film in each desired region was in the range of 0.03 mm to 0.05 mm. In this way, the inkjet resist cured film 3 was formed in each desired region.

(C) A plate-making substrate etching step, which involves etching the surface 12 of the second region of the plate-making substrate to which the inkjet resist cured film 3 is not attached in the desired region.
Next, an etching solution is brought into contact with the surface of the printing plate substrate 1 on which a hardened film 3e is formed on the upper surface of the desired region inkjet resist fine protrusions, a hardened film 3f is formed on the side of the desired region inkjet resist fine protrusions, and a hardened film 3g is formed on the bottom surface of the desired region inkjet resist fine recesses. The surface 12 of the second region of the printing plate substrate 1, on which the hardened film 3 is not attached, is etched to a depth of approximately 1.9 mm. This forms an inkjet resist film corrosion second recess formation portion 121 having a recessed shape, and also forms inkjet film corrosion multiple pre-existing fine protrusion portion protrusions 466, on which the pre-existing multiple fine protrusions 46 protrude from the inkjet resist film corrosion second recess formation portion 121.

(D) Process to remove the inkjet resist curing film from the desired area.
The inkjet resist cured film 3 was removed from the desired area.
This creates an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-existing multiple fine uneven protrusion portion 466 having a plurality of pre-existing multiple fine uneven protrusion portions 461 and a plurality of pre-existing multiple fine uneven recess portions 462.

The depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), and the height "d1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), which corresponds to the depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area. The width "w2" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.05 mm (50 μm), and the width "w1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.05 mm (approximately 50 μm).
Furthermore, the depth "d12" of the second recess formation portion 121 due to inkjet resist film corrosion was approximately 1.9 mm.

Furthermore, it was confirmed that no side etching occurred on the side surface of the second recess formation portion 121 of the inkjet resist film corrosion, and that the side surface of the second recess formation portion 121 of the inkjet resist film corrosion has a smooth, desired inclined side surface that extends from the bottom surface of the second recess formation portion 121 of the inkjet resist film corrosion toward the multiple fine uneven protrusions 466 formed by the inkjet film corrosion.
Furthermore, it was confirmed that the sides of the multiple pre-existing multiple micro-recesses 462 (corresponding to the sides of the multiple pre-existing multiple micro-recesses 461) maintained their normal, desired shape without being etched.
In this way, a foil stamping plate was manufactured having a plurality of pre-existing fine uneven surfaces 46a, 46b, and 46c as shown in Figure 9(C), with each of the pre-existing multiple fine uneven surfaces 46a, 46b, and 46c forming a plurality of pre-existing fine uneven surfaces as shown in Figure 9(D-a), (D-b), and (D-c).

In this embodiment, it was confirmed that the object has multiple pre-existing fine uneven surfaces 46 having normal and desired shape accuracy and dimensional accuracy, and that it also has desired inkjet film corrosion pre-existing multiple fine uneven surface protrusions 466 that protrude from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that no side etching phenomenon occurred on the desired multiple pre-existing micro-recessed portion convex side surface 461b (pre-existing multiple micro-recessed portion concave side surface 462b), and that the desired shape accuracy and dimensional accuracy were achieved.

<Example 3B (Manufacturing of a foil stamping plate for use as a pressing plate)>
This embodiment replaces the process of forming the "multiple pre-existing fine uneven areas 46" in the "manufacturing of a foil stamping plate as a pressing plate" of the aforementioned Embodiment 3A with a process using an inkjet resist material, by forming the "multiple pre-existing fine uneven areas 46" using a conventional sheet-type dry film resist material. The other processes are similar to those of Embodiment 3A.
In other words, this embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 8" described above, and is a pressing plate shown in Figure 9 (A-a), Figure 9 (B-a), (B-b), (B-c), and Figure 9 (C), wherein a "fine graphic character pattern" is formed on the surface of the protrusions that protrude from the recesses by a combination of multiple types of uneven pattern cells that are engraved with a fine uneven shape, divided into predetermined shapes, and arranged in a regular manner. This pressing plate is used as a foil stamping die or an embossing plate.
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a plurality of pre-existing fine irregularities 46.
A plate-type substrate 1 having a planar surface shape was prepared and supplied, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of copper and has a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, a conventional sheet-type dry film resist material was attached to the surface of the printing plate substrate 1. The conventional sheet-type dry film resist material used was selected from commercially available sheet-type dry film resist materials with a thickness of approximately 0.02 mm to approximately 0.04 mm.
A sheet-like dry film resist material was attached to a mold substrate, and ultraviolet light was irradiated onto the dry film resist material through an exposure mask member having through holes and a desired fine graphic/character pattern for light transmission. Unwanted resist film was removed using a commercially available conventional developer, and after-baking was performed to form a resist-cured film having a fine graphic/character pattern as shown in Figure 9(C).
A commercially available conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched until the depth "d1" was 0.1 mm, thereby forming a plurality of pre-existing multiple fine uneven recesses 462 formed in a concave shape, and a plurality of pre-existing multiple fine uneven protrusions 461 formed in a convex shape.
Next, the cured resist film was removed using a resist remover (caustic soda aqueous solution).
In this way, a chemical etching process was performed using a resist-cured film formed with a conventional sheet-like dry film resist material as a mask for etching, thereby forming multiple pre-existing multiple fine uneven surfaces, protrusions 461, and multiple pre-existing multiple fine uneven surfaces, recesses 462, which are formed in a concave shape.

In other words, the second region surface 12 of the substrate for printing plates has a smooth surface without irregularities, and the first region surface 11 of the substrate for printing plates has a pre-existing irregularity 4, and the pre-existing irregularity 4 has a pre-existing multiple fine irregularity 46 formed in a fine irregularity shape as shown in Figure 9(C). The pre-existing multiple fine irregularity 46 has a plurality of pre-existing multiple fine irregularity convex portions 461 formed in a plurality of convex shapes, and a plurality of pre-existing multiple fine irregularity recesses 462 formed in a plurality of concave shapes, and the plurality of pre-existing multiple fine irregularity convex portions 461 has a plurality of pre-existing multiple fine irregularity convex upper surfaces 461a and a plurality of pre-existing multiple fine irregularity convex side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b.
A plate-making substrate having multiple pre-existing micro-relief sections 46 formed with a micro-relief shape as shown in Figure 9(C) was prepared.
Furthermore, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b correspond to the same side region.
In Figure 9, the reference numerals for the multiple pre-existing multiple micro-recesses, the multiple pre-existing multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the upper surfaces, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the upper surfaces, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, the multiple micro-recesses, and

In this way, a plurality of pre-existing multiple fine uneven surfaces 46, having multiple pre-existing multiple fine uneven surfaces protrusions 461 and multiple pre-existing multiple fine uneven surfaces recesses 462, was formed on the printing plate substrate as shown in Figure 9(C).
The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (approximately 50 μm).
In this way, a plate-type substrate 1 having multiple pre-existing fine uneven surfaces 46 was prepared and supplied.

(B) Inkjet resist curing film formation step to form an inkjet resist curing film 3 in a desired area.
Using a plate-making substrate 1 having multiple pre-existing fine uneven surfaces 46 prepared as described above, an inkjet resist material 2 was applied by an inkjet method to cover the multiple pre-existing fine uneven surfaces 46 of the plate-making substrate 1, specifically the multiple pre-existing fine uneven surfaces 461 and multiple pre-existing fine uneven surfaces recesses 462, thereby forming a pre-existing multiple fine uneven surface inkjet resist adhesive film. In this case, it was confirmed that the inkjet resist material was attached to the upper surfaces 461a of the multiple pre-existing fine uneven surfaces 461a, the side surfaces 461b of the multiple pre-existing fine uneven surfaces 462b, and the bottom surfaces 462c of the multiple pre-existing fine uneven surfaces recesses.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material commonly used in the manufacture of metal wiring boards as electronic components was selected and used, which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the above inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120°C for 10 minutes to form a hardened upper surface hardened film 3e of the fine protrusions of the desired region inkjet resist, a hardened side surface hardened film 3f of the fine protrusions of the desired region inkjet resist, and a hardened bottom surface hardened film 3g of the fine recesses of the desired region inkjet resist. The thickness of each desired region inkjet resist hardened film was in the range of 0.03 mm to 0.05 mm.
In this way, inkjet resist cured films 3 were formed in each desired region.

(C) A plate-making substrate etching step, which involves etching the surface 12 of the second region of the plate-making substrate to which the inkjet resist cured film 3 is not attached in the desired region.
Next, an etching solution is brought into contact with the surface of the printing plate substrate 1 on which a hardened film 3e is formed on the upper surface of the desired region inkjet resist fine protrusions, a hardened film 3f is formed on the side of the desired region inkjet resist fine protrusions, and a hardened film 3g is formed on the bottom surface of the desired region inkjet resist fine recesses. The surface 12 of the second region of the printing plate substrate 1, on which the hardened film 3 is not attached, is etched to a depth of approximately 1.9 mm. This forms an inkjet resist film corrosion second recess formation portion 121 having a recessed shape, and also forms inkjet film corrosion multiple pre-existing fine protrusion portion protrusions 466, on which the pre-existing multiple fine protrusions 46 protrude from the inkjet resist film corrosion second recess formation portion 121.

(D) Process to remove the inkjet resist curing film in the desired area.
The inkjet resist cured film 3 was removed from the desired area.
This creates an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-existing multiple fine uneven protrusion portion 466 having a plurality of pre-existing multiple fine uneven protrusion portions 461 and a plurality of pre-existing multiple fine uneven recess portions 462.

The depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), and the height "d1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.1 mm (100 μm), which corresponds to the depth "d1" of the recessed portion 462 of the existing multiple micro-recessed area. The width "w2" of the recessed portion 462 of the existing multiple micro-recessed area was approximately 0.05 mm (50 μm), and the width "w1" of the protruding portion 461 of the existing multiple micro-recessed area was approximately 0.05 mm (approximately 50 μm).
Furthermore, the depth "d12" of the second recess formation portion 121 due to inkjet resist film corrosion was approximately 1.9 mm.

Furthermore, it was confirmed that no side etching occurred on the side surface of the second recess formation portion 121 of the inkjet resist film corrosion, and that the side surface of the second recess formation portion 121 of the inkjet resist film corrosion has a smooth, desired inclined side surface that extends from the bottom surface of the second recess formation portion 121 of the inkjet resist film corrosion toward the multiple fine uneven protrusions 466 formed by the inkjet film corrosion.
Furthermore, it was confirmed that the sides of the multiple pre-existing multiple micro-recesses 462 (corresponding to the sides of the multiple pre-existing multiple micro-recesses 461) maintained their normal, desired shape without being etched.
In this way, a foil stamping plate was manufactured having a plurality of pre-existing fine uneven surfaces 46a, 46b, and 46c as shown in Figure 9(C), with each of the pre-existing multiple fine uneven surfaces 46a, 46b, and 46c forming a plurality of pre-existing fine uneven surfaces as shown in Figure 9(D-a), (D-b), and (D-c).

In this embodiment, it was confirmed that the desired multiple pre-existing fine uneven surfaces 46 have normal shape accuracy and dimensional accuracy, and that the desired inkjet film corrosion pre-existing multiple fine uneven surface protrusions 466 are formed, which have a protruding shape that extends from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that no side etching phenomenon occurred on the desired multiple pre-existing micro-recessed portion convex side surface 461b (pre-existing multiple micro-recessed portion concave side surface 462b), and that the desired shape accuracy and dimensional accuracy were achieved.

<Example 3A-a (Processing of a workpiece using the pressing plate of Example 3A)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 3A is used as the pressing plate 10 of a flat-pressure type processing apparatus, and foil stamping is performed using a workpiece 108 consisting of a paper sheet with a thickness of 1 mm as the workpiece base material 108a and a thin gold sheet-like foil material 108b with a thickness of approximately 30 μm.
The workpiece was foil-stamped using the following process.
(S-a) A foil stamping plate 10 was prepared as a pressing plate 10 with the pre-existing uneven portion 4 manufactured in Example 3A.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94 with a smooth surface, which was prepared separately, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108a with a thickness of approximately 1 mm and a golden-colored sheet-like foil material with a thickness of approximately 30 μm are positioned between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108. In this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method, causing the pressing plate 10 and the receiving plate 94 to press the workpiece 108.
As a result, a workpiece textured portion was formed on the surface of the paper sheet 108a, in which a gold-colored sheet-like foil material 108b was transferred to create a textured surface that matched the textured surface of the pre-existing textured portion 4.
(S-f) The base of at least one of the pressing plate 10 (foil stamping plate) and the receiving plate 94 was driven to separate the pressing plate 10 (foil stamping plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which a graphic character pattern, formed with an uneven shape of approximately 0.1 mm in depth, was formed by foil-stamping transfer onto a paper sheet 108a using a sheet-like foil material 108b.

In this case, a processed product was obtained in which a graphic character pattern formed with a relief shape having the desired shape accuracy and dimensional accuracy was formed by foil stamping transfer, without any abnormalities occurring on the workpiece 108, such as the paper sheet 108a and the sheet-like foil material 108b.

In the workpiece prepared as described above, it was confirmed that when the workpiece was viewed from different directions, the letters "H," "T," and "Z" were clearly visible in each of these different directions compared to other letters.

<Comparative Example 3B (Manufacturing of a pressing plate using conventional liquid resist material)>
This comparative example is a method for manufacturing a pressing plate in which, in step (B) of Example 3B described above, a conventional liquid resist material is used instead of the inkjet resist material to form the second recessed portion 121 of the inkjet resist film corrosion.

(A) A step of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 46.
A plate-type substrate 1 having a planar surface shape was prepared and supplied by the same process as in step (A) of the above-described example 3B, and comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of copper and has a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, a conventional sheet-type dry film resist material, the same as that used in step (A) of Example 3B described above, was attached to the surface of the plate-making substrate 1. The conventional sheet-type dry film resist material used was selected from commercially available sheet-type dry film resist materials with a thickness of approximately 0.02 mm to approximately 0.04 mm.
A sheet-like dry film resist material was attached to a mold substrate, and an exposure mask member, which had through holes and formed a desired fine graphic/character pattern for light transmission, was used to irradiate the dry film resist material with ultraviolet light using a conventional method. A developer solution was then used to remove the resist film in unwanted areas, thereby forming a cured resist film with a fine graphic/character pattern.
Then, using a conventional method, the resist-cured film was used as a corrosion etching mask to corrosion-etch the substrate for the printing plate, thereby forming a plurality of pre-existing fine uneven surfaces 46 having a plurality of pre-existing fine uneven surfaces, convex portions 461 and a plurality of pre-existing fine uneven surfaces, concave portions 462.
The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed portion protrusion (461) was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (50 μm).
In this manner, a plate-making substrate 1 having multiple pre-existing fine uneven surfaces 46 was prepared and supplied.

(B) Conventional conventional resist curing film formation process.
Using a plate-making substrate 1 having multiple pre-existing multiple fine uneven surfaces 46, a conventional liquid resist material 2 (a conventional liquid resist material commonly used for plate making and etching printed circuit boards, and a desired conventional liquid resist material (the same conventional liquid resist material used in step (A) of Example 1A described above) from among commercially available general-purpose conventional liquid resist materials) was applied by a conventional spray-coating method to form a liquid resist adhesion film, and the resist adhesion film was formed by drying in a conventional method.
Furthermore, the liquid resist material 2 is not applied to the surface 12 of the second region of the plate-making substrate located in the area surrounding the multiple existing fine uneven portions 46.
Subsequently, a conventional resist hardened film 30 was formed by conventional methods such as ultraviolet irradiation exposure, development, and after-baking, using a member of the desired shape (an exposure mask member having through holes in the portion corresponding to the "multiple pre-existing multiple fine uneven portions 46" formed on the first region surface 11 of the plate-making substrate when the member is placed on the surface of the plate-making substrate, and having a light-blocking portion in the surrounding region) to harden the attached resist film, thereby forming a conventional resist hardened film 30e on the upper surface of the conventional resist fine protrusions and a conventional resist hardened film 30g on the bottom surface of the conventional resist fine recesses. However, the conventional resist material attached to the side surface 461b of the pre-existing multiple fine uneven portions (side surface 462b of the recesses) flowed down to the bottom surface of the pre-existing multiple fine uneven portions, and a conventional resist hardened film on the side of the fine recesses (conventional resist hardened film on the side of the fine protrusions) was not formed.
The thickness of the conventionally cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.

In this process, the conventional liquid resist material adhered well to the upper surface 461a of the multiple pre-existing fine uneven surfaces and the bottom surface 462c of the multiple pre-existing fine uneven surfaces, and formed a conventional resist fine upper surface hardened film 30e and a conventional resist fine lower surface hardened film 30g in the desired area. However, the conventional liquid resist material flowed down from the side surfaces 461b (and the side surfaces 462b) of the multiple pre-existing fine uneven surfaces, and no hardened film was formed on the side surfaces 461b (and the side surfaces 462b) of the multiple pre-existing fine uneven surfaces.

(C) Etching process.
An etching solution (ferric chloride aqueous solution) was brought into contact with the surface of a plate-making substrate 1, which had a conventional resist fine protrusion upper surface hardened film 30e and a conventional resist fine recess bottom surface hardened film 30g formed on it, using a paddle blowing method. The surface 12 of the second region of the plate-making substrate, where the conventional resist hardened film was not attached, was etched to a depth of approximately 0.1 mm, forming a second recessed area 121b formed during the etching process. In this case, slight side etching occurred on the side surfaces 461b of the existing multiple fine protrusions (side surfaces 462b of the existing multiple fine protrusions). The bottom surface 462c of the existing multiple fine protrusions was also corroded and etched.

The etching process was further continued until the surface 12 of the second region of the substrate for the printing plate was etched to a depth of approximately 1.9 mm.
As a result, the surface 12 of the second region of the substrate for printing plates is etched to form a conventionally used second erosion recess-forming portion 121s having an etched recessed shape, and the multiple existing fine irregularities 46 are formed to protrude from the conventionally used second erosion recess-forming portion 121s.

(D) Conventional resist curing film removal process.
The conventional hardened film 30e on the upper surface of the fine protrusions of the resist and the conventional hardened film 30g on the lower surface of the fine recesses of the resist were removed using a resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In the aforementioned "(C) Corrosion Etching Process," the existing multiple micro-recessed protrusions 461b (existing multiple micro-recessed recesses 462b) on which the hardened film had not been attached were also corroded and etched, resulting in side-etched existing multiple micro-recessed protrusions 461s (multiple side-etched existing multiple micro-recessed recesses 462s). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched pre-existing multiple micro-recesses have convex side surfaces 461s (multiple side-etched pre-existing multiple micro-recesses have concave side surfaces 462s), which are not of the desired shape and are undesirable. When a workpiece is processed using a press-forming die with such side-etched micro-recesses, it is undesirable because a workpiece with the desired recessed shape cannot be obtained.

<Comparative Example 3B-a (Processing of a workpiece using the pressing plate of Comparative Example 3B)>
In this comparative example, the pressing plate 10 manufactured in Comparative Example 3B above is used as the pressing plate 10 of a flat-pressure type processing apparatus, and foil stamping is performed using a workpiece 108 consisting of a paper sheet with a thickness of 1 mm as the workpiece base material 108a and a thin gold sheet-like foil material 108b with a thickness of approximately 30 μm.
The workpiece was foil-stamped using the following process.
(S-a) A foil stamping plate 10 was prepared as a pressing plate 10 with the pre-existing uneven portion 4 manufactured in Comparative Example 3A.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94 with a smooth surface, which was prepared separately, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108a with a thickness of approximately 1 mm and a gold-colored sheet-like foil material with a thickness of approximately 30 μm are positioned between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108. In this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method, causing the pressing plate 10 and the receiving plate 94 to press the workpiece 108.
As a result, a workpiece textured portion was formed on the surface of the paper sheet 108a, in which a gold-colored sheet-like foil material 108b was transferred to create a textured surface that matched the textured surface of the pre-existing textured portion 4.
(S-f) The base of at least one of the pressing plate 10 (foil stamping plate) and the receiving plate 94 was driven to separate the pressing plate 10 (foil stamping plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which a graphic character pattern, formed with an uneven shape of approximately 0.1 mm in depth, was formed by foil-stamping transfer onto a paper sheet 108a using a sheet-like foil material 108b.

In this case, irregularities were observed in the fine patterns and characters formed by the fine uneven surface, and the desired shape and dimensional accuracy of the workpiece could not be obtained. Furthermore, during repeated pressing, a phenomenon was observed in some cases where the workpiece 108, consisting of the workpiece base material 108a and the sheet-like foil material 108b, was driven to detach from the pressing plate while remaining stuck to or caught on the pressing plate.
In other words, due to the shape of the side-etched surface 461s (and the side-etched recessed surface 462s) of the pressing plate, it was not possible to obtain a workpiece with a fine graphic character pattern with the desired shape accuracy and dimensional accuracy.

<Example 4A (Manufacturing of a foil stamping plate for use as a pressing plate)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 10" described above, and is a pressing plate shown in Figures 7 and 8(F), which has a plurality of recesses and a plurality of protrusions protruding from the recesses, with a "fine graphic character pattern formed in a fine uneven shape" on the surface of one of the protrusions, and a "graphic character pattern formed in an uneven shape" on each of the other two protrusions. This pressing plate is used as a foil stamping die or an embossing plate.
In this embodiment, a process including the use of an inkjet resist material is used to form a plurality of pre-existing uneven portions 45 and a plurality of pre-existing fine uneven portions 46. The substrate for printing plates on which the plurality of pre-existing uneven portions 45 and a plurality of pre-existing fine uneven portions 46 have been formed is then processed including the use of an inkjet resist material to form a second inkjet resist film corrosion recess formation portion 121. The substrate is then prepared in such a form that the plurality of pre-existing uneven portions 45 and a plurality of pre-existing fine uneven portions 46 are formed as protruding portions 455 and 466, respectively, which have a protruding shape that extends from the bottom surface of the second inkjet resist film corrosion recess formation portion 121.
Figure 7 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to one embodiment of the present invention. Figure 8 is a schematic plan view of a schematic diagram illustrating the shape of the graphic, character, and pictographic pattern formed by relief on the pressing plate in a method of manufacturing a pressing plate according to one embodiment of the present invention, and this embodiment is the foil stamping plate shown in Figure 8(F).
This embodiment will be described in detail below.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a pre-existing multiple uneven surface 45 and a pre-existing multiple fine uneven surface 46.
(A-a) A plate-type substrate 1 having a planar surface shape was prepared and supplied, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of brass and has a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a height of 90 mm. (Not shown)

Next, on the surface of the printing plate substrate 1, only the "heart-shaped fine-patterned character design" from the patterns shown in Figure 8(F) was covered with an inkjet resist film using an inkjet resist material.
In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material, commonly used in the manufacture of metal wiring boards as electronic components, was selected and used. This material was the same as the inkjet resist material used in step (B) of Example 1A described above, and possesses the property of crosslinking into a three-dimensional chemical structure through a chemical reaction upon ultraviolet irradiation, and has a viscosity of "10 mPa·s to 20 mPa·s (25°C)". The droplets ejected from the ejection nozzle were 2 pl to 15 pl when the material was attached. The above inkjet resist film attached to the printing plate substrate was then irradiated with ultraviolet light, and burning was performed to form a cured inkjet resist film with a desired heart pattern and fine pattern design. The thickness of the inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm.

An etching solution was brought into contact with the surface of a plate-making substrate 1 on which an inkjet resist cured film had been formed, and the surface of the plate-making substrate that did not have the resist cured film attached was etched until the depth "d1" was approximately 0.1 mm, thereby forming a plurality of pre-existing multiple fine uneven surfaces 46 having a plurality of pre-existing multiple fine uneven surfaces, convex portions 461 and a plurality of pre-existing multiple fine uneven surfaces, concave portions 462 on the plate-making substrate.
Next, the inkjet resist curing film was removed using a resist remover.
In this way, multiple pre-existing micro-ridges 46 forming a heart pattern were created.
The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm (100 μm), and the height "d1" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm (100 μm), corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (50 μm).
Although the symbols "d1,""w1," and "w2" are not shown in Figure 7, these symbols represent the same depth, height, or width as the symbols explained in the descriptions of Figures 4 and 5(B) above.

(A-b) Next, a resist-cured film was formed on the above-mentioned mold substrate 1, which has a pre-existing multiple fine uneven portion 46 having a plurality of pre-existing multiple fine uneven portion protrusions 461 and a plurality of pre-existing multiple fine uneven portion recesses 462. The top and side surfaces of the pre-existing multiple fine uneven portion protrusions 461, and the side surfaces (the same area as the side surfaces of the pre-existing multiple fine uneven portion protrusions 461) and bottom surface of the pre-existing multiple fine uneven portion recesses 462 were covered with an inkjet resist material similar to that used in (A-a) above, and the "Otsu pattern" and "san pattern" among the patterns shown in Figure 8(F) were formed using an inkjet resist material similar to that used in (A-a) above.
Subsequently, an etching solution was brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film had been formed, and the surface of the printing plate substrate that did not have the resist cured film attached was etched until the depth "D1" was approximately 0.9 mm, thereby forming a pre-existing multiple uneven surface 45 having a plurality of pre-existing multiple uneven surface protrusions 451 and a plurality of pre-existing multiple uneven surface recesses 452 on the printing plate substrate.
Next, the inkjet resist curing film was removed using a resist remover.
In this way, a printing plate substrate was prepared with the following patterns formed on it, as shown in Figure 7(A): a "miniature heart-shaped character pattern formed with a fine uneven surface," a "recessed pattern," and a "recessed pattern."
Although the symbol "D1" is not shown in Figure 7, the symbol "D1" is the same as the symbol explained in the descriptions of Figures 1, 2, and 3 above, and represents the depth "D1".

(B) Process for forming an inkjet resist cured film in the desired area.
As shown in Figure 7(B), the inkjet resist material 2 was applied by inkjet by covering the upper surface 461a, the upper side 461b, the lower surface 462c, and the lower side 462b of the pre-existing multiple fine uneven parts of the "heart-shaped fine-shaped character pattern", the upper surface 451a, the upper side 451b, the lower surface 452c, and the lower side 452b of the pre-existing multiple uneven parts of the "Otsu pattern formed in an uneven shape", and the upper surface 451a, the upper side 451b, the lower surface 452c, and the lower side 452b of the pre-existing multiple uneven parts of the "Rib pattern formed in an uneven shape", and applying the inkjet resist material 2 by inkjet by inkjet by inkjet. In this case, the inkjet resist material 2 is not applied to the surface 12 of the second region of the printing plate substrate located in the area surrounding each of the pre-existing multiple fine uneven areas 46 and the area surrounding each of the pre-existing multiple uneven areas 45.
Subsequently, the inkjet resist coating was cured to form an inkjet resist cured film 3 that consists of a desired region inkjet resist fine protrusion upper surface cured film 3e, a desired region inkjet resist fine protrusion side surface cured film 3f, a desired region inkjet resist fine recess bottom surface cured film 3g, and a desired region inkjet resist protrusion upper surface cured film 3a, a desired region inkjet resist protrusion side surface cured film 3b, and a desired region inkjet resist recess bottom surface cured film 3c.

A Microcraft on-demand inkjet printing system was used. The inkjet resist material selected and used was "a commercially available inkjet resist material commonly used in the manufacture of metal wiring boards as electronic components, the same as the one used in step (A) of this embodiment 4A (the same inkjet resist material used in step (A) of this embodiment 4A), which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation, and has a viscosity of 10 mPa·s to 20 mPa·s (25°C)." The droplets ejected from the ejection nozzle were 2 pl to 15 pl. The inkjet resist film attached to the printing plate substrate was then irradiated with ultraviolet light, and subsequently burned at 120°C for 10 minutes to form an inkjet resist cured film in each desired area.
The thickness of the inkjet resist cured film in the desired area was in the range of approximately 0.03 mm to approximately 0.05 mm.

In this process, the inkjet resist material adhered well to the existing multiple fine uneven surfaces without flowing off the convex side surface 461b (existing multiple fine uneven surfaces recess side surface 462b) and the existing multiple uneven surfaces convex side surface 451b (existing multiple uneven surfaces recess side surface 452b), and also adhered well to the existing multiple fine uneven surfaces convex upper surface 461a, the multiple existing multiple fine uneven surfaces recess bottom surface 462c, the existing multiple uneven surfaces convex upper surface 451a, and the multiple existing multiple uneven surfaces recess bottom surface 452c.
Furthermore, it was confirmed that the following hardened films were formed in the desired region: a hardened upper surface film 3e of the fine protrusions of the inkjet resist in the desired region, a hardened side surface film 3f of the fine protrusions of the inkjet resist in the desired region, a hardened bottom surface film 3g of the fine recesses of the inkjet resist in the desired region, a hardened upper surface film 3a of the protrusions of the inkjet resist in the desired region, a hardened side surface film 3b of the protrusions of the inkjet resist in the desired region, and a hardened bottom surface film 3c of the recesses of the inkjet resist in the desired region.

(C) Etching process.
As shown in Figure 7(C), a commercially available general-purpose conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the printing plate substrate 1, on which inkjet resist cured films 3 were formed in each desired area, using a paddle blowing method, and the second area surface 12 of the printing plate substrate, on which the inkjet resist cured film was not attached, was etched until the depth dimension "D12" was approximately 1.9 mm.
As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the existing multiple fine uneven portions 46 and multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the existing multiple fine uneven portions 46 and multiple uneven portions 45 are formed into inkjet film corrosion existing multiple fine uneven portion protrusions 466 and inkjet film corrosion existing multiple uneven portion protrusions 455, which have a shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figure 7 (D-b), the inkjet resist cured film 3 in each desired region was removed using a commercially available conventional resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

In this way, without etching the existing multiple fine uneven portions 46 and multiple uneven portions 45, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate, and the first region surface 11 of the plate-making substrate, which has an existing multiple fine uneven portion 46 having a plurality of existing multiple fine uneven portion protrusions 461 and a plurality of existing multiple fine uneven portion recesses 462, is formed as an inkjet film corrosion existing multiple fine uneven portion projection 466 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121, and the other first region surface 11 of the plate-making substrate, which has an existing multiple uneven portion 45 having a plurality of existing multiple uneven portion protrusions 451 and a plurality of existing multiple uneven portion recesses 452, is formed as an inkjet film corrosion existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.

In this embodiment, it was confirmed that the object has a combination of pre-existing multiple uneven surfaces 45 and multiple fine uneven surfaces 46 having normal and desired shape accuracy and dimensional accuracy, and that it also has a protruding shape that extends from the bottom surface of the inkjet resist film corrosion pre-existing multiple uneven surface protrusions 455 and multiple fine uneven surface protrusions 466.
Furthermore, it was confirmed that the desired pre-existing multiple uneven surface convex side surface 451b (pre-existing multiple uneven surface concave side surface 452b) and the desired pre-existing multiple fine uneven surface convex side surface 461b (pre-existing multiple fine uneven surface concave side surface 462b) did not exhibit side etching in a recessed state, and that the desired shape accuracy and dimensional accuracy were achieved.

<Example 4A-a (Processing of a workpiece using the pressing plate of Example 4A)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 4A is used as the embossing plate 10 of a flat-pressure type processing device to emboss a gold-colored glossy paper sheet 108, which is a workpiece 108 with a gold-colored surface.
The workpiece was embossed using the following process.
(S-a) A die-cutting plate 10 was prepared to be used as a pressing plate 10, which had the pre-existing uneven portion 4 manufactured in Example 4A.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94 with a smooth surface, which was prepared separately, was installed on the second base 93 of the pressing device.
(S-e) In this state, a "gold-colored glossy paper sheet 108" with a thickness of approximately 1.5 mm and a surface colored gold was placed between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108. In this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
As a result, a workpiece surface irregularity forming portion is created on the surface of the workpiece 108, having an irregularity shape that matches the irregularity shape of the pre-existing irregularity portion 4.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
As a result, a workpiece was prepared on a paper sheet 108, which served as the workpiece 108, with an embossed shape having a heart-shaped micro-pattern that matches multiple existing micro-recesses 46 and a Z-pattern and rib pattern that matches multiple existing micro-recesses 45.

In this case, no abnormalities occurred in the workpiece 108, which was a "gold-colored glossy paper sheet 108," and a workpiece was obtained in which "fine graphic and character patterns" and "graphic and character patterns" were formed with the desired shape accuracy and dimensional accuracy.

<Comparative Example 4A (Manufacturing of a pressing plate using conventional liquid resist material)>
This comparative example is a method for manufacturing a pressing plate, wherein in the step of forming a plurality of pre-existing fine uneven surfaces 46 in step (A) of Example 4A described above, a conventional liquid resist material is used instead of an inkjet resist material to form the plurality of pre-existing fine uneven surfaces 46, and further, in the step of forming a plurality of pre-existing uneven surfaces 45 on the plate-making substrate on which the plurality of pre-existing fine uneven surfaces 46 have been formed, a conventional liquid resist material is used instead of an inkjet resist material to form the plurality of pre-existing uneven surfaces 45 on the plate-making substrate.

(A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having a pre-existing multiple uneven surface 45 and a pre-existing multiple fine uneven surface 46.
(A-a) A step of forming multiple pre-existing fine irregularities 46.
(A-a-a) A plate-type substrate 1 having a half-surface shape was prepared and supplied, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of brass and has a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a height of 90 mm.
(No illustration)
(A-a-b) Next, (i) a conventional liquid resist material (a conventional liquid resist material that has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and is commonly used for plate making and etching of printed circuit boards, and is a conventional liquid resist material selected from commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material used in step (A) of Example 1A described above) was applied to a desired area of the first region surface 11 of the plate-making substrate 1, using a conventional spray coating method to a thickness in the range of approximately 0.02 mm to approximately 0.04 mm, and dried by a predetermined method to form a resist adhesion film.
Then, ultraviolet light was irradiated onto the resist-attached film through an exposure mask member having a desired graphic pattern (heart pattern) formed on it for light blocking, and a resist-cured film having the desired graphic pattern (heart pattern) was formed by conventional processes such as development and after-baking.
(A-a-c) An etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched until the depth "d1" was approximately 0.1 mm (100 μm), thereby forming a plurality of pre-existing multiple fine uneven recesses 462 formed in a concave shape, and a plurality of pre-existing multiple fine uneven protrusions 461 formed in a convex shape.
(A-a-d) Next, the resist hardened film was removed using a resist remover (caustic soda aqueous solution).

In this way, a plurality of pre-existing multiple micro-recesses 46 (a micro-picture pattern of a heart) is formed, comprising a plurality of pre-existing multiple micro-recesses 461 having a plurality of convex upper surfaces 461a and a plurality of pre-existing multiple micro-recesses 461b, and a plurality of pre-existing multiple micro-recesses 462 having a plurality of concave bottom surfaces 462c and a plurality of pre-existing multiple micro-recesses 462b.
The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm (100 μm), and the height "d1" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm (100 μm), corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (50 μm).

(A-b) A step of forming multiple pre-existing uneven surfaces 45.
(A-b-b) A conventional liquid resist material (the same conventional liquid resist material used in the "A-a-b" step above) was applied to the surface of the mold substrate on which the above-mentioned multiple fine uneven portions 46 were formed, using a conventional spray coating method to a thickness of approximately 0.02 mm to approximately 0.04 mm, and the resist film was formed by drying in a predetermined method.
Then, ultraviolet light was irradiated onto the resist-attached film through an exposure mask member on which the desired graphic and character patterns ("Z pattern" and "bar pattern") for light blocking were formed, and a resist-cured film having the desired graphic and character patterns ("Z pattern" and "bar pattern") was formed by conventional processes such as development and after-baking.
In this case, when the liquid resist material was applied, the liquid resist material adhering to the convex side surface 461b (same as the concave side surface 462b) of the existing multiple fine uneven surfaces flowed down to the concave bottom surface 462c of the existing multiple fine uneven surfaces, and no resist film was formed on the convex side surface 461b (same as the concave side surface 462b) of the existing multiple fine uneven surfaces 46.
(A-b-c) An etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched to a depth of approximately 0.9 mm, thereby forming a plurality of pre-existing concave and convex portions 452 on the plate-making substrate, as well as a plurality of pre-existing convex portions 451.
(A-b-d) Next, the resist hardened film was removed using a resist remover (caustic soda aqueous solution).

In this way, desired graphic letter patterns ("Z pattern" and "bar pattern") were formed by a pre-existing multiple-recessed portion 45 which has a pre-existing multiple-recessed portion convex portion 451 having a pre-existing multiple-recessed portion convex upper surface 451a and a pre-existing multiple-recessed portion convex portion side surface 451b formed in a convex shape, and a pre-existing multiple-recessed portion recess 452 having a pre-existing multiple-recessed portion recess bottom surface 452c and a pre-existing multiple-recessed portion recess side surface 452b formed in a concave shape.
However, slight side etching occurred on the convex side surface 461b (concave side surface 462b) of the existing multiple fine uneven surfaces 46 (miniature heart-shaped graphic letter pattern).
The pre-existing multiple micro-recessed areas' protruding side surfaces 461b (pre-existing multiple micro-recessed areas' recessed side surfaces 462b), where the resist-cured film had not been attached, were also corroded and etched, resulting in pre-existing multiple micro-recessed areas' protruding side surfaces 461s (multiple pre-existing multiple micro-recessed areas' recessed side surfaces 462s) that were side-etched, similar to those shown in Figure 15(D). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched pre-existing multiple micro-recesses have convex side surfaces 461s (multiple side-etched pre-existing multiple micro-recesses have concave side surfaces 462s) that are not of the desired shape and are undesirable. When a workpiece is processed using a press-forming die with such side-etched micro-recesses, it is not possible to obtain a workpiece with the desired shape accuracy, dimensional accuracy, etc.

(B) Using a plate-making substrate on which a pre-existing multiple fine uneven areas 46 (a fine graphic character pattern in the shape of a heart) and a pre-existing multiple uneven areas 45 (a graphic character pattern "Z pattern" and "stile pattern") prepared as described above were formed, it was planned to form recesses and pre-existing multiple fine uneven area protrusions and pre-existing multiple uneven area protrusions having a shape that protrudes from the recesses by processes such as resist coating, resist curing, corrosion etching, and etching solution removal. However, in the process described in (A) above, it was not possible to form the pre-existing multiple fine uneven areas 46 having the desired uneven shape, so the subsequent processes were discontinued.

<Example 5A (Manufacturing of a foil stamping plate for pressing)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 11" described above, and is a method for manufacturing a pressing plate shown in Figures 10 (A) to (D) and (A-b) to (D-b), wherein a "fine graphic character pattern formed in a fine uneven shape" is formed on the upper surface of the pre-existing protrusions 47 of a plate mold substrate having pre-existing protrusions 47 and pre-existing recesses 48. This pressing plate is used as a foil stamping plate or an embossing plate.
In this embodiment, a plate for pressing was prepared by forming pre-existing protrusions 47 and pre-existing recesses 48 in a process including the use of an inkjet resist material, and then forming "multiple fine protrusions 477, 477b on the upper surface of the pre-existing protrusions 477, which are formed by multiple fine recesses corresponding to fine figures, characters, and patterns formed by fine protrusions" on the upper surface of the pre-existing protrusions 47 in a process including the use of an inkjet resist material on the plate-type substrate having the pre-existing protrusions 47 and pre-existing recesses 48 in a fine protrusion shape, and preparing a plate for pressing.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate-making substrate 1 having a first plate-making substrate surface area 11 having a pre-formed protrusion 47 and a second plate-making substrate surface area 12 having a pre-formed recess 48.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel, has a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm, is flexible, and has a substantially flat shape.

Next, an inkjet resist material was applied to the surface 11 of the first region of the printing plate substrate 1 using an inkjet method to create a roughly rectangular pattern, and then cured to form an inkjet resist cured film.
In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120°C for 10 minutes to form a cured inkjet resist film 3 having the desired heart pattern and fine pattern design. The thickness of the inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm.

Next, an etching solution was brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film had been formed, and the surface of the printing plate substrate that did not have the resist cured film attached was etched to a depth of approximately 0.3 mm (300 μm) to form a pre-formed protrusion 47 and a pre-formed recess 48 on the printing plate substrate. The pre-formed protrusion 47 has a pre-formed protrusion upper surface 47a and a pre-formed protrusion side surface 47b, and the pre-formed recess 48 has a pre-formed recess bottom surface 48c and a pre-formed recess side surface 48b. Note that the pre-formed protrusion side surface 47b and the pre-formed recess side surface 48b refer to the same side region.

Next, the inkjet resist curing film was removed using a resist remover.
In this way, a pre-formed uneven surface having a pre-formed protrusion 47 and a pre-formed recess 48 was formed on the printing plate substrate as shown in Figures 10(A) and (A-b).
The depth of the pre-existing recess 48 was approximately 0.3 mm, and the height of the pre-existing protrusion 47 was approximately 0.3 mm, which corresponds to the depth of the pre-existing recess 48.

(B) Process for forming an inkjet resist cured film in the desired area.
Next, as shown in Figures 10(B) and (B-b), the inkjet resist material 2 was applied using an inkjet method to cover the entire surface of the pre-formed protruding side surface 47b, pre-formed recessed side surface 48b, and pre-formed recessed bottom surface 48c of the printing plate substrate 1. At the same time, the inkjet resist material (2) was applied to the upper surface of the pre-formed protruding upper surface 47a using an inkjet method to form an inkjet resist film in the desired area having a desired fine heart pattern or character design as shown in Figure 10(B-b). In this case, it was confirmed that the inkjet resist material was attached to the pre-formed protruding side surface 47b and the pre-formed recessed side surface 48b.
Note that the pre-existing convex side surface 47b and the pre-existing concave side surface 48b refer to the same region.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A and step (A) of this example). An inkjet resist film was formed by adhesion under conditions where the amount of droplets ejected from the ejection nozzle was 2 pl to 15 pl. Then, using a method similar to step (B) of Example 1A described above, ultraviolet light was irradiated onto the inkjet resist film attached to the printing plate substrate, and then burning was performed at 120°C for 10 minutes to form a cured desired area inkjet resist film 3 on the entire surface of the pre-formed protrusion side surface 47b, the entire surface of the pre-formed recess side surface 48b, and the entire surface of the pre-formed recess bottom surface 48c, and a cured desired area inkjet resist film 3 with a fine figure character pattern (fine heart pattern) was formed on the upper surface 47a of the pre-formed protrusion. The thickness of each desired area inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, each desired area inkjet resist film 3 was formed.

(C) Etching process.
Next, as shown in Figures 10(C) and (C-b), an etching solution (ferric chloride aqueous solution) is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area is formed, and the surface 12 of the second region of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area is not attached is etched to a depth of approximately 0.1 mm (100 μm). This forms a plurality of fine recessed portions 472b on the upper surface of a pre-existing protrusion, which are formed by a plurality of fine concave shapes corresponding to the desired fine pattern or character design, and a plurality of fine protrusions 471b on the upper surface of a pre-existing protrusion, which are formed by a plurality of fine convex shapes. The plurality of fine recessed portions 477b on the upper surface of a pre-existing protrusion corresponds to the pre-existing recessed portion 477b on the upper surface of a pre-existing protrusion.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figures 10(D) and (D-b), the inkjet resist cured film 3 in the desired area was removed using a commercially available, general-purpose, conventional resist remover (caustic soda aqueous solution).
In this way, a plurality of micro-recessed portions 477b is formed on the upper surface of the pre-existing protrusion 47a, having a plurality of micro-recessed portions (472b) formed by a plurality of micro-recessed shapes and a plurality of micro-recessed portions 471b formed by a plurality of micro-recessed shapes.

The depth dimension of the multiple micro-recesses 472b on the upper surface of the pre-existing protrusion (the height dimension of the protrusion 471b on the upper surface of the pre-existing protrusion) was approximately 0.1 mm (100 μm). The width dimension of the multiple micro-recesses 472b on the upper surface of the pre-existing protrusion was approximately 0.05 mm (approximately 50 μm), and the width dimension of the multiple micro-recesses 472b on the upper surface of the pre-existing protrusion was approximately 50 μm.
Furthermore, the depth dimension of the pre-formed recess 48 (the height dimension of the pre-formed protrusion 47) was 0.3 mm.

Furthermore, it was confirmed that the side surfaces of the pre-formed protrusions 47 (corresponding to the side surfaces of the pre-formed recesses 48) in Figures 10(D) and (D-b) were not etched and maintained the normal, desired shape shown in Figure 10(D).
In this way, a flexible embossing plate (pressing plate 10) having a degree of flexibility that allows it to be deformed to match the spherical surface of a roll was manufactured, which has a pre-existing protrusion 47 and a pre-existing recess 48, and a plurality of pre-existing micro-recesses 477b forming a "heart pattern" on the upper surface of the pre-existing protrusion 47.

In this embodiment, it was confirmed that the pre-formed protrusions 47 and recesses 48 have normal desired shape accuracy and dimensional accuracy, and that the pre-formed protrusions 47 have multiple fine irregularities 477b formed on the upper surface of the pre-formed protrusions 47, which also have normal desired shape accuracy and dimensional accuracy.
Furthermore, it was confirmed that no side etching occurred on the side surface of the pre-formed protrusion 47 (corresponding to the pre-formed recess 48), resulting in a recessed etching state, and that the desired shape accuracy was achieved.

<Example 5A-a (Processing of a workpiece using the pressing plate from Example 5A installed in a roll device)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 5A is installed in a roll-type processing device and used as a foil stamping plate 10 to perform foil stamping.
The workpiece was foil-stamped using the following process.
(S-a) A foil stamping plate 10, which was manufactured in Example 5A as a pressing plate 10, was prepared and supplied.
(S-b) A pressing device was prepared, equipped with a main roll 96 and a counter roll 97 facing each other.
(S-c) The foil stamping plate, which serves as the pressing plate 10, is wrapped around the main roll 96 and installed. In this case, a magnetic force member that generates magnetic force is configured inside the main roll 96, and the foil stamping plate 10, which serves as the pressing plate 10 and has flexibility, is wrapped around the main roll 96 by magnetic force and installed.
(S-d) A predetermined receiving plate 94 was installed on the opposing roll 97 of the pressing device.
In this embodiment, a stainless steel anvil roll 97 with a smooth spherical surface, prepared separately, was prepared and installed as the counter-roll 97.
(S-e) The main roll 96 and the opposing roll 97 were driven, and the workpieces, consisting of a 1 mm thick paper sheet as the workpiece base material 108a and a thin silver sheet-like foil material 108b with a thickness of approximately 30 μm, were continuously supplied between the main roll 96 and the opposing roll 97 in a parallel manner, so that the pressing plate 10 and the receiving plate 94 could rotate and continuously press the workpieces.
As a result, a sheet-like foil material having a fine uneven shape that matches the uneven shape of the multiple fine uneven portions 477b on the upper surface of the pre-formed protrusions 47 was transferred to the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation portion.
(S-f) As the roll rotated, the workpiece was separated from the main roll 96 and the opposing roll 97, releasing the pressure on the workpiece.
As a result, a workpiece was prepared in which a workpiece transfer formation portion was formed on the surface of the workpiece 108, having a fine uneven shape that matches the uneven shape of the multiple fine uneven portions 477b on the upper surface of the pre-existing protrusions 47.
In this way, a processed product was prepared in which a foil material having a "heart pattern" and a plurality of fine relief patterns was transferred and formed on the surface of a paper sheet 108a, which was to be processed 108.

In this case, no abnormalities occurred in the paper sheet 108a and the metal foil sheet 108b, which served as the workpiece 108. Under normal circumstances, a workpiece was obtained in which multiple fine relief patterns of a "heart pattern" were formed on the paper sheet 108a, which served as the workpiece 108, with fine relief shapes having the desired shape accuracy and dimensional accuracy, and the metal foil was transferred onto the paper sheet 108a.

<Example 5B (Manufacturing of a die for pressing)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 11" described above, and is a method for manufacturing a pressing plate shown in Figures 10 (A) to (D) and (A-a) to (D-a), in which a "picture, letter, and design pattern formed in an uneven shape" is formed on the upper surface of the pre-existing protrusions 47 of a plate mold substrate having pre-existing protrusions 47 and pre-existing recesses 48. This pressing plate is used as an embossing plate.
In this embodiment, a plate for pressing was prepared by forming pre-existing protrusions 47 and pre-existing recesses 48 in a process that includes using a conventional general-purpose liquid resist material, and then forming "multiple protrusions 477, 477a" on the upper surface of the pre-existing protrusions 47, which are formed with multiple protrusions corresponding to graphic characters and patterns formed with protrusions and recesses, on the upper surface of the pre-existing protrusions 47, which includes using an inkjet resist material.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate-making substrate 1 having a first plate-making substrate surface area 11 having a pre-formed protrusion 47 and a second plate-making substrate surface area 12 having a pre-formed recess 48.
A plate-making substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-making substrate 1 is made of copper and has a substantially flat shape with a thickness "h" of 7 mm, a width of 125 mm, and a height of 90 mm.

Next, a conventional liquid resist material (a conventional liquid resist material commonly used for plate making and etching printed circuit boards, selected from commercially available conventional liquid resist materials, or the conventional liquid resist material used in step (A) of Example 1A described above) was applied to the entire surface of the plate-making substrate 1 using a conventional spray-coating method to a thickness of approximately 0.02 mm to approximately 0.04 mm, and then dried by a predetermined method to form a resist film.
Then, ultraviolet light was irradiated onto the resist film through an exposure mask member having light-transmitting through-holes formed on the surface 11 of the first region of the substrate for printing. After that, unwanted resist film in areas not irradiated with ultraviolet light was removed using a commercially available general-purpose conventional developer (aqueous solution of sodium carbonate). Subsequently, the film was matured by heating and baking in a predetermined conventional method. In this way, a resist-cured film having the desired substantially rectangular shape was formed.

Next, a commercially available general-purpose conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which the resist-cured film had been formed, and the surface of the plate-making substrate that did not have the resist-cured film attached was etched to a depth of 1.9 mm, thereby forming pre-formed recesses 48 in a concave shape and pre-formed protrusions 47 in a convex shape on the plate-making substrate.
Next, the hardened resist film was removed using a commercially available, general-purpose, conventional resist remover (aqueous soda solution).
In this way, a pre-formed convex portion 47 and a pre-formed concave portion 48 were created on the printing plate substrate as shown in Figures 10(A) and (A-a).
The depth of the pre-existing recess 48 was approximately 1.9 mm, and the height of the pre-existing protrusion 47 was approximately 1.9 mm, which corresponds to the depth of the pre-existing recess 48.

(B) Process for forming an inkjet resist cured film in the desired area.
Next, as shown in Figures 10(B) and (B-a), the inkjet resist material 2 was applied using an inkjet method to cover the entire surface of the pre-formed protrusion side surface 47b, pre-formed recess side surface 48b, and pre-formed recess bottom surface 48c of the printing plate substrate 1. At the same time, the inkjet resist material (2) was applied to the upper surface of the pre-formed protrusion upper surface 47a using an inkjet method to form an inkjet resist film in a desired area having a desired graphic character pattern of "ABCDE pattern" as shown in Figure 10(B-a). In this case, it was confirmed that the inkjet resist material was attached to the pre-formed protrusion side surface 47b and the pre-formed recess side surface 48b.
Note that the pre-existing convex side surface 47b and the pre-existing concave side surface 48b refer to the same region.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in the (B) step of Example 1A, the (A) step of Example 5, and the (B) step of Example 5 described above). An inkjet resist film was formed by adhesion under conditions where the amount of liquid ejected from the ejection nozzle was 2 pl to 15 pl. Then, using a method similar to step (B) of Example 1A described above, ultraviolet light was irradiated onto the inkjet resist film attached to the printing plate substrate, and then burning was performed at 120°C for 10 minutes to form a cured desired area inkjet resist film 3 on the entire surface of the pre-formed protrusion side surface 47b, the entire surface of the pre-formed recess side surface 48b, and the entire surface of the pre-formed recess bottom surface 48c, and a cured desired area inkjet resist film 3 with a graphic character pattern (ABCDE pattern) was formed on the upper surface 47a of the pre-formed protrusion. The thickness of each desired area inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, each desired area inkjet resist film 3 was formed.

(C) Etching process.
Next, as shown in Figures 10(C) and (C-a), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed, and etching is performed on the upper surface of the pre-formed protrusion upper surface 47a of the printing plate substrate 1 where the inkjet resist cured film 3 in the desired area has not been attached, until the depth is approximately 0.9 mm. This forms a pre-formed protrusion upper surface multiple recess 477a having a plurality of concave shapes corresponding to the desired graphic character pattern and a plurality of convex shapes forming the pre-formed protrusion upper surface multiple recess 472a and a plurality of convex shapes forming the pre-formed protrusion upper surface multiple recess 471a. Note that the pre-formed protrusion upper surface multiple recess 477a corresponds to the pre-formed protrusion upper surface recess 477.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figures 10(D) and (D-a), the inkjet resist cured film 3 was removed from the desired area.
In this way, a multiple recessed portion 477a is formed on the upper surface of the pre-existing protrusion 47a, which has multiple concave shapes formed as recesses 472a and multiple convex shapes formed as protrusions 471a.

The depth dimension of the recess 472a of the multiple uneven surfaces on the upper surface of the pre-existing protrusion (the height dimension of the protrusion 471a of the multiple uneven surfaces on the upper surface of the pre-existing protrusion) was approximately 0.9 mm.
Furthermore, the depth dimension of the pre-formed recess 48 (height dimension of the pre-formed protrusion 47) was 1.9 mm.

Furthermore, it was confirmed that the side surface of the pre-formed protrusion 47 (corresponding to the side surface of the pre-formed recess 48) in Figures 10(D) and (D-a) was not etched and maintained the normal, desired shape shown in Figure 10(D).
In this way, a pressing plate 10 was manufactured having a pre-existing protrusion 47 and a pre-existing recess 48, and having multiple pre-existing protrusions 477a forming an "ABCDE pattern" in an uneven shape on the upper surface of the pre-existing protrusion 47.

In this embodiment, it was confirmed that the pre-formed protrusions 47 and recesses 48 have normal desired shape accuracy and dimensional accuracy, and that the pre-formed protrusions 47 have multiple normal desired upper surface protrusions 477a formed on them.
Furthermore, it was confirmed that no side etching occurred on the side surface of the pre-formed protrusion 47 (corresponding to the pre-formed recess 48), resulting in a recessed etching state, and that the desired shape accuracy was achieved.

<Example 5B-a (Processing of a workpiece using the pressing plate of Example 5B)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 5B is used as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108, which is the workpiece 108.
The workpiece was embossed using the following process.
(S-a) An embossing plate 10 was prepared as an embossing plate 10 for pressing, with the pre-formed convex and concave portions manufactured in Example 5B.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94, which had been prepared separately and had a smooth, flat surface without any irregularities, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108.
As a result, a workpiece surface is formed on the workpiece 108, having a surface shape that matches the surface shape of the multiple uneven surfaces 477a formed on the upper surface of the pre-existing protrusions 47 of the die-cut substrate.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
As a result, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed shape of approximately 0.9 mm in depth, having a graphic character pattern that matched the graphic character pattern formed in a relief shape on the multiple reliefs 477a on the upper surface of the pre-existing protrusions 47 of the printing plate substrate.

In this embodiment of the processing method for the workpiece, a paper sheet 108, which served as the workpiece 108, was produced with an "ABCDE pattern" graphic design formed on it with the desired shape and dimensional accuracy. The "ABCDE pattern" graphic design formed on the workpiece was confirmed to be formed with the desired unevenness of approximately 0.9 mm, without any abnormalities.

<Comparative Example 5B (Manufacturing of a pressing plate using conventional liquid resist material)>
This comparative example is a method for manufacturing a pressing plate in which, in the step of forming multiple uneven surfaces 477a on the upper surface of a pre-existing protrusion 47 in steps (B), (C), and (D) of Example 5B described above, a conventional liquid resist material is used instead of an inkjet resist material to form multiple uneven surfaces 477a on the upper surface of a pre-existing protrusion 47.

The comparative example is described in detail below.
Figure 22 shows a schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes.
(A) A step of preparing and supplying a printing plate substrate 1 having a first region surface 11 for printing plate substrates having a pre-formed protrusion 47 and a second region surface 12 for printing plate substrates having a pre-formed recess 48.
Using the same method as in Example 5B described above, a copper plate-shaped substrate with a thickness of 7 mm, a width of 125 mm, and a length of 90 mm was used to form a plate-shaped mold, and a pre-formed convex portion 47 was formed in a convex shape on the first region surface 11 of the plate-shaped substrate, as shown in Figures 22(A) and (A-a), and a pre-formed concave portion 48 was formed in a concave shape on the second region surface 12 of the plate-shaped substrate.
The depth of the pre-existing recess 48 was approximately 1.9 mm, and the height of the pre-existing protrusion 47 was approximately 1.9 mm, which corresponds to the depth of the pre-existing recess 48.

(B) Conventional liquid resist curing film formation process.
As shown in Figures 22(B) and (B-a), a liquid resist film was formed by covering the entire surface of the plate-making substrate, which had pre-formed protrusions 47 and pre-formed recesses 48, with a conventional liquid resist material 20 (the same liquid resist material used in step (A) of Comparative Example 5B, step (A) of Example 5B, and step (A) of Example 1A, which has the property of undergoing a chemical reaction upon ultraviolet irradiation to crosslink into a three-dimensional chemical structure, and is a conventional liquid resist material commonly used for plate making and etching of printed circuit boards) using a conventional spray-coating method.
In this case, a liquid resist film was formed on the upper surface of the pre-existing protrusions and the bottom surface of the pre-existing recesses of the conventional liquid resist material. However, no liquid resist film was formed on the sides of the pre-existing protrusions (or the sides of the pre-existing recesses).
Subsequently, the material was exposed to ultraviolet light through an exposure mask member of the desired shape (an exposure mask member that, when placed on the surface of the printing plate substrate, has through holes in the shape of the "ABCDE pattern" in the area corresponding to the area of the pre-formed protrusions 47 formed on the first region surface 11 of the printing plate substrate, and has a light-blocking portion in the surrounding area). After that, the resist film attached to the areas not irradiated with ultraviolet light was removed using a developer (aqueous solution of sodium carbonate) and developed. Then, the attached conventional resist film was cured by conventional methods such as after-baking, forming a cured film on the bottom surface of the pre-formed recesses as shown in Figures 22(C) and (C-a), and a conventional cured resist film 30 having the desired "ABCDE pattern" on the upper surface of the pre-formed protrusions. The thickness of the conventional cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.

(C) Etching process.
As shown in Figure 22(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a conventional resist-cured film 30 was formed, using a paddle blowing method, and the areas where the conventional resist-cured film was not attached were etched to a depth of approximately 0.9 mm.
As a result, the upper surface of the pre-existing protrusion 47 was etched to form a pre-existing protrusion upper surface with multiple recesses 472a formed by multiple concave shapes and multiple protrusions 471a formed by multiple convex shapes, forming a pre-existing protrusion upper surface with multiple recesses 477a.
In this case, side etching in a recessed state occurred on the side surface of the existing protrusion (the side surface of the existing recess).

(D) Conventional process for removing the cured resist film.
As shown in Figure 22(E), the conventionally cured resist film 30 was removed using a general-purpose resist remover (aqueous sodium hydroxide aqueous solution or sodium hydroxide aqueous solution).

In the above-described "(C) Corrosion Etching Process," the sides of the pre-formed protrusions 47 (sides of the pre-formed recesses 48) where the hardened film had not been attached were also corrosively etched, resulting in side etching as shown in Figures 22(D) and (E). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.
Such side-etched shapes are not desirable and are therefore undesirable. When a workpiece is processed using a press-forming die with such side-etched uneven surfaces, it is not possible to obtain a workpiece with the desired uneven shape, which is undesirable.

<Comparative Example 5B-a (Processing of a workpiece using the pressing plate of Comparative Example 5B)>
In this comparative example, the pressing plate 10 manufactured in "Comparative Example 5B" above is used as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108 as a workpiece 108.
The workpiece was embossed using the following process.
(S-a) A die-setting plate 10 was prepared to be used as a pressing plate 10, which was manufactured in Comparative Example 5B.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94 with a smooth surface, which was prepared separately, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 with a thickness of 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press the workpiece 108.
As a result, a workpiece surface is formed on the workpiece 108, having a surface shape that matches the surface shape of the multiple uneven surfaces 477a formed on the upper surface of the pre-existing protrusions 47 of the die-cut substrate.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
In this way, a workpiece was prepared on the paper sheet 108, which was to be processed, with an embossed shape having a graphic character pattern that matches the graphic character pattern formed in a relief shape on the multiple reliefs 477a on the upper surface of the pre-existing protrusions 47 of the printing plate substrate.

In this case, when the pressing process was repeated, a phenomenon was observed in which the workpiece 108 did not detach from the pressing plate but instead stuck to or got caught on it while being driven to detach. Specifically, due to the shape of the side surfaces of the side-etched pre-formed protrusions (side surfaces of multiple side-etched pre-formed recesses) on the pressing plate, the workpiece 108 stuck to or got caught on the pressing plate in some cases. As a result, a workpiece with the desired uneven shape could not be obtained.

<Example 6A (Manufacturing of a die-cutting plate for press-forming)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 12" described above, and is a method for manufacturing a pressing plate shown in Figures 11(A) to (D) and (A-b) to (D-b), in which a "pictogram, letter, and image pattern formed in an uneven shape" is formed on the bottom surface of the pre-existing recess 48 of a plate mold substrate having a pre-existing protrusion 47 and a pre-existing recess 48. This pressing plate is used as an embossing plate.
In this embodiment, a plate for pressing was prepared by forming pre-existing uneven portions 47 and pre-existing recesses 48 in a process that includes a step of using a conventional dry film resist material, and then forming "multiple uneven portions 488, 488b on the bottom surface of the pre-existing recesses 48" on the bottom surface of the pre-existing recesses 48 in a process that includes a step of using an inkjet resist material.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate-making substrate 1 having a first plate-making substrate surface area 11 having a pre-formed protrusion 47 and a second plate-making substrate surface area 12 having a pre-formed recess 48.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of brass and has a substantially flat shape with a height of 7 mm, a width of 125 mm, and a height of 90 mm.

Next, a conventional dry film resist material (selected from commercially available general-purpose dry film resist materials (the same dry film resist material used in step (A) of Example 3B, with a thickness of approximately 0.02 mm to approximately 0.04 mm)) was used to adhere to the surface of the printing plate substrate 1 and form a resist adhesion film.
Then, ultraviolet light was irradiated onto the resist film through an exposure mask member having light-transmitting through-holes formed on the surface 11 of the first region of the substrate for printing. After that, unwanted resist film in areas not irradiated with ultraviolet light was removed using a commercially available general-purpose conventional developer (aqueous solution of sodium carbonate). Subsequently, the film was matured by heating and baking in a predetermined conventional method. In this way, a resist-cured film having the desired substantially rectangular shape was formed.

Next, a commercially available general-purpose conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which the resist-cured film had been formed, and the surface of the plate-making substrate that did not have the resist-cured film attached was etched to a depth of approximately 1.0 mm, thereby forming pre-formed recesses 48 in a concave shape and pre-formed protrusions 47 in a convex shape on the plate-making substrate.
Next, the hardened resist film was removed using a commercially available, general-purpose, conventional resist remover (aqueous soda solution).
In this way, a pre-formed convex portion 47 and a pre-formed concave portion 48 were created on the printing plate substrate as shown in Figures 11(A) and (A-b).
The depth of the pre-existing recess 48 was approximately 1.0 mm, and the height of the pre-existing protrusion 47 was approximately 1.0 mm, which corresponds to the depth of the pre-existing recess 48.

(B) Process for forming an inkjet resist cured film in the desired area.
Next, as shown in Figures 11(B) and (B-b), the inkjet resist material 2 was applied using an inkjet method to cover the pre-formed protruding side surface 47b, pre-formed recessed side surface 48b, and pre-formed protruding upper surface 47a of the printing plate substrate 1, and the inkjet resist material 2 was also applied using an inkjet method to the bottom surface of the pre-formed recessed bottom surface 48c, thereby forming an inkjet resist film in a desired area having a desired graphic character pattern of a "heart pattern" as shown in Figure 11(B-b). In this case, it was confirmed that the inkjet resist material was attached to the pre-formed protruding side surface 47b and the pre-formed recessed side surface 48b.
Note that the pre-existing convex side surface 47b and the pre-existing concave side surface 48b refer to the same region.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). An inkjet resist adhesion film was formed by adhering to the substrate with a droplet amount of 2 pl to 15 pl ejected from the ejection nozzle. Then, using a method similar to step (B) of Example 1A described above, the above inkjet resist adhesion film attached to the plate-making substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a cured inkjet resist film 3 in the desired area on the pre-formed convex side surface 47b, the pre-formed recess side surface 48b, and the pre-formed convex top surface 47a, and a cured inkjet resist film 3 in the desired area with a graphic character pattern (heart pattern) was formed on the bottom surface 48c of the pre-formed recess bottom surface. The thickness of the inkjet resist cured film in each desired region was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, the inkjet resist cured film 3 was formed in each desired region.

(C) Etching process.
Next, as shown in Figures 11(C) and (C-b), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed, and etching is performed on the bottom surface of the pre-existing recess 48c of the printing plate substrate 1 where the inkjet resist cured film 3 in the desired area has not been attached, until the depth is approximately 0.1 mm. This forms a pre-existing recess bottom surface with multiple fine irregularities 488b, which has multiple recesses 482b formed with multiple concave shapes corresponding to the desired graphic character pattern and multiple convex shapes 481b. The pre-existing recess bottom surface with multiple fine irregularities 488b corresponds to the pre-existing recess bottom surface with irregularities 488.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figures 11(D) and (D-a), the inkjet resist cured film 3 was removed from the desired area.
In this way, a plurality of fine uneven surfaces 488b is formed on the bottom surface of the pre-existing recess bottom surface 48c, having a plurality of concave recesses 482b and a plurality of convex protrusions 481b.

The depth dimension of the multiple micro-irregularities on the bottom surface of the pre-existing recess 482b (the height dimension of the multiple micro-irregularities on the bottom surface of the pre-existing recess 481b) was approximately 0.1 mm.
Furthermore, the depth dimension of the pre-existing recess 48 (the height dimension of the pre-existing protrusion 47) was approximately 1.9 mm.

Furthermore, it was confirmed that the side surfaces of the pre-formed recesses 48 (corresponding to the side surfaces of the pre-formed protrusions 47) in Figures 11(D) and (D-b) were not etched and maintained the normal, desired shape shown in Figure 11(D).
In this way, a pressing plate 10 was manufactured that had a pre-existing protrusion 47 and a pre-existing recess 48, and also had a plurality of fine protrusions 488b forming a "heart pattern" on the bottom surface of the pre-existing recess 48.

In this embodiment, it was confirmed that the pre-formed protrusions 47 and recesses 48 have normal desired shape accuracy and dimensional accuracy, and that the pre-formed recesses 47 have multiple normal desired fine irregularities 488b on the bottom surface of the recess.
Furthermore, it was confirmed that no side etching occurred on the side surface of the pre-formed recess 48 (corresponding to the pre-formed protrusion 47), and that the desired shape accuracy was achieved.

<Example 6A-a (Processing of a workpiece using the pressing plate of Example 6A)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 6A is used as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108 having a silvery glossy surface as the workpiece 108.
The workpiece was embossed using the following process.
(S-a) An embossing plate 10 was prepared as an embossing plate 10 for pressing, with the pre-formed convex and concave portions manufactured in Example 6A.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94, which had been prepared separately and had a smooth, flat surface without any irregularities, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm and a silvery surface gloss is placed between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108. In this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108.
As a result, a workpiece surface is formed on the workpiece 108, having a surface shape that matches the surface shape of the multiple uneven areas 488b formed on the bottom surface of the pre-existing recess 47 of the die-cut substrate.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
As a result, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed shape having a heart-shaped graphic pattern that matched the graphic pattern of the multiple uneven portions 488b on the bottom surface of the pre-existing recess 47 of the printing plate substrate, and having an uneven shape with an unevenness of about 0.1 mm in depth.

In an embodiment of the processing method for this workpiece, a workpiece was obtained in which a "heart pattern" graphic letter and pictogram was formed on a paper sheet 108, which served as the workpiece 108, with desired shape and dimensional accuracy. The "heart pattern" graphic letter and pictogram formed on the workpiece was confirmed to be formed with fine irregularities having the desired step height of approximately 0.1 mm, without any abnormalities.

<Comparative Example 6A (Manufacturing of a pressing plate using conventional liquid resist material)>
This comparative example is a method for manufacturing a pressing plate in which, in the step of forming multiple uneven surfaces 488a on the bottom surface of a pre-existing recess 48 in steps (B), (C), and (D) of Example 6A described above, a conventional liquid resist material is used instead of an inkjet resist material to form multiple uneven surfaces 488a on the bottom surface of a pre-existing recess 48.

The comparative example is described in detail below.
Figure 23 shows a schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes.
(A) A step of preparing and supplying a plate-making substrate 1 having a first plate-making substrate surface area 11 having a pre-formed protrusion 47 and a second plate-making substrate surface area 12 having a pre-formed recess 48.
Using the same method as in Example 6A described above, a brass plate-shaped substrate for printing, having a thickness of 7 mm, a width of 125 mm, and a height of 90 mm, and a conventional dry film resist material were used to form a pre-existing convex portion 47 on the surface 11 of the first region of the plate-making substrate and a pre-existing concave portion 48 on the surface 12 of the second region of the plate-making substrate, as shown in Figures 23(A) and (A-b).
The depth of the pre-existing recess 48 was approximately 1.0 mm, and the height of the pre-existing protrusion 47 was approximately 1.0 mm, which corresponds to the depth of the pre-existing recess 48.

(B) Conventional liquid resist curing film formation process.
As shown in Figures 23(B) and (B-b), a liquid resist film was formed by covering the entire surface of the plate-making substrate, which had pre-formed protrusions 47 and pre-formed recesses 48, with a conventional liquid resist material 20 (the same liquid resist material used in step (A) of Example 1A described above, which has the property of chemically reacting with ultraviolet irradiation to crosslink into a three-dimensional chemical structure, and is a conventional liquid resist material commonly used for plate making and etching of printed circuit boards) and applying it using a conventional spray-coating method.
In this case, a liquid resist film was formed on the upper surface of the pre-formed protrusions and the bottom surface of the pre-formed recesses using the conventional liquid resist material. However, no liquid resist film was formed on the side surface 47b of the pre-formed protrusions (side surface 48b of the pre-formed recesses).
Subsequently, an exposure mask member of the desired shape (when the exposure mask member is placed on the surface of the printing plate substrate, it has through holes in the shape of a "heart E pattern" in the area corresponding to the area of the pre-existing recess 48 formed on the first region surface 11 of the printing plate substrate, and has a light-blocking portion in the surrounding area) is exposed to ultraviolet light. After that, the resist film attached to the areas not irradiated with ultraviolet light is removed using a developer (aqueous solution of sodium carbonate) and developed. After that, the attached conventional resist film is cured by conventional methods such as after baking, forming a cured film on the upper surface of the pre-existing protrusion 47 as shown in Figures 23(C) and (C-b), and forming a conventional cured resist film 30 having the desired "heart pattern" on the bottom surface of the pre-existing recess. The thickness of the conventional cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.
However, no hardened film was formed on the sides of the pre-existing recesses (sides of the pre-existing protrusions).

(C) Etching process.
As shown in Figure 23(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a conventional resist-cured film 30 was formed, using a paddle blowing method, and the areas where the conventional resist-cured film was not attached were etched to a depth of approximately 0.1 mm.
As a result, the bottom surface of the pre-existing recess 48 was etched to form a pre-existing recess bottom surface with multiple recesses 482b formed by multiple concave shapes and a pre-existing recess bottom surface with multiple protrusions 481b formed by multiple convex shapes.
In this case, side etching in a recessed state occurred on the side of the pre-existing recess (the side of the pre-existing protrusion).

(D) Conventional process for removing the cured resist film.
As shown in Figure 23(E), the conventionally cured resist film 30 was removed using a general-purpose resist remover (aqueous sodium hydroxide aqueous solution or sodium hydroxide aqueous solution).

In the above-described "(C) Corrosion etching process," the sides of the pre-existing recesses 48 (sides of the pre-existing protrusions 47) where the hardened film had not been attached were also corrosively etched, resulting in side etching as shown in Figures 23(D) and (E).
Furthermore, the graphic and character pattern (heart pattern) of the multiple uneven portions 488b formed in an uneven shape on the bottom surface of the pre-existing recess 48 was unclear, and it was not possible to form a graphic and character pattern (heart pattern) with the desired shape and dimensions. It is presumed that this was caused by the exposure mask member not being in close contact with the resist film during the process of exposing the resist film via the exposure mask member, resulting in the inability to form a conventionally cured resist film with the desired shape and dimensions. In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained.

<Example 6B (Manufacturing of a die for pressing)>
This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 12" described above, and is a method for manufacturing a pressing plate shown in Figures 11(A) to (D) and (A-a) to (D-a), in which a "picture, letter, and design pattern formed in an uneven shape" is formed on the bottom surface of the pre-formed recess 48 of a plate mold substrate having a pre-formed protrusion 47 and a pre-formed recess 48. This pressing plate is used as an embossing plate.
In this embodiment, a pre-existing uneven portion 47 and a pre-existing recess 48 are formed by a process including the use of an inkjet resist material. Then, a plate for pressing is prepared by forming "multiple uneven portions 488, 488a on the bottom surface of the pre-existing recess 48" on the bottom surface of the pre-existing recess 48, which are formed with multiple uneven shapes corresponding to graphic characters and patterns formed with an uneven shape, in a process including the use of an inkjet resist material.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate-making substrate 1 having a first plate-making substrate surface area 11 having a pre-formed protrusion 47 and a second plate-making substrate surface area 12 having a pre-formed recess 48.
A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of brass and has a substantially flat shape with a thickness "h" of 7 mm, a width of 125 mm, and a height of 90 mm.

Next, in order to form a rectangular area in the central region of the printing plate substrate where no inkjet resist material is attached, an inkjet resist material was applied to the peripheral region of the surface of the printing plate substrate 1 using an inkjet method, thereby forming an inkjet resist film on the peripheral region of the printing plate substrate.
In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material was selected that has the property of crosslinking into a three-dimensional chemical structure through a chemical reaction upon ultraviolet irradiation, and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120°C for 10 minutes to form a resist-cured film having the desired approximately rectangular shape.
The thickness of the inkjet resist cured film was in the range of approximately 0.03 to 0.05 mm.

Next, a commercially available general-purpose conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which the resist-cured film had been formed, and the surface of the plate-making substrate that did not have the resist-cured film attached was etched to a depth of approximately 0.4 mm, thereby forming pre-existing recessed portions 48 in a concave shape and pre-existing convex portions 47 in a convex shape on the plate-making substrate.
Next, the hardened resist film was removed using a commercially available, general-purpose, conventional resist remover (aqueous soda solution).
In this way, a pre-formed convex portion 47 and a pre-formed concave portion 48 were created on the plate-making substrate as shown in Figures 11(A) and (A-a).
The depth of the pre-existing recess 48 was approximately 0.4 mm, and the height of the pre-existing protrusion 47 was approximately 0.4 mm, which corresponds to the depth of the pre-existing recess 48.

(B) Process for forming an inkjet resist cured film in the desired area.
Next, as shown in Figures 11(B) and (B-a), the inkjet resist material 2 was applied using an inkjet method to cover the pre-formed protruding side surface 47b, pre-formed recessed side surface 48b, and pre-formed protruding upper surface 47a of the plate-making substrate 1, and the inkjet resist material 2 was also applied using an inkjet method to the bottom surface of the pre-formed recessed bottom surface 48c, thereby forming an inkjet resist film in a desired area having a desired graphic character pattern of "ABCDE pattern" as shown in Figure 11(B-b). In this case, it was confirmed that the inkjet resist material was attached to the pre-formed protruding side surface 47b and the pre-formed recessed side surface 48b.
Note that the pre-existing convex side surface 47b and the pre-existing concave side surface 48b refer to the same region.

In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in step (B) of Example 1A and step (A) of this example). An inkjet resist film was formed by adhesion under conditions where the amount of droplets ejected from the ejection nozzle was 2 pl to 15 pl. Then, using a method similar to step (B) of Example 1A described above, ultraviolet light was irradiated onto the inkjet resist film attached to the printing plate substrate, and then burning was performed at 120°C for 10 minutes to form a cured desired area inkjet resist film 3 on the entire surface of the pre-formed protrusion side surface 47b, the pre-formed recess side surface 48b, and the pre-formed protrusion top surface 47a, and a cured desired area inkjet resist film 3 with a graphic character pattern (ABCDE pattern) was formed on the bottom surface of the pre-formed recess bottom surface 48c. The thickness of each desired area inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, each desired area inkjet resist film 3 was formed.

(C) Etching process.
Next, as shown in Figures 11(C) and (C-a), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed, and etching is performed on the bottom surface of the pre-existing recess 48c of the printing plate substrate 1 where the inkjet resist cured film 3 in the desired area has not been attached, until the depth is approximately 0.6 mm. This forms a pre-existing recess 488a having a plurality of recesses 482a formed by a plurality of concave shapes corresponding to the desired graphic character pattern of the "ABCDE pattern" and a plurality of convex shapes 481a formed by a plurality of convex shapes. The pre-existing recess 488a corresponds to the pre-existing recess 488.

(D) Process to remove the inkjet resist curing film in the desired area.
As shown in Figures 11(D) and (D-b), the inkjet resist cured film 3 was removed from the desired area.
In this way, a pre-existing recessed bottom surface 488a is formed on the bottom surface of the pre-existing recessed bottom surface 48c, having a plurality of recessed shapes formed as pre-existing recessed bottom surface plurality of uneven surfaces recesses 482a and a plurality of convex shapes formed as pre-existing recessed bottom surface plurality of uneven surfaces protrusions 481a.

The depth dimension of the pre-formed recess 48 (height dimension of the pre-formed protrusion 47) was approximately 0.4 mm, and the depth dimension of the multiple recessed and uneven portion recess 482a formed on the bottom surface of the pre-formed recess 48 (height dimension of the multiple protrusions 481a on the bottom surface of the pre-formed recess) was approximately 0.6 mm. In other words, the distance from the surface of the printing plate substrate to the bottom surface of the multiple recessed and uneven portion recess 482a was approximately 1.0 mm.

It was confirmed that the side surface of the pre-formed recess 48 (corresponding to the side surface of the pre-formed protrusion 47) in Figure 11(D) and (D-a) was not etched and maintained the normal, desired shape shown in Figure 11(D).
In this way, a pressing plate 10 was manufactured having a pre-existing protrusion 47 and a pre-existing recess 48, and having multiple pre-existing recessed areas 488a with an "ABCDE pattern" formed in an uneven shape on the bottom surface of the pre-existing recess 48.

In this embodiment, it was confirmed that the pre-formed protrusions 47 and recesses 48 have normal desired shape accuracy and dimensional accuracy, and that the pre-formed recesses 47 have multiple protrusions 488a formed on the bottom surface of the pre-formed recess, which have normal desired shape accuracy and dimensional accuracy.
Furthermore, it was confirmed that no side etching occurred on the side surface of the pre-formed recess 48 (corresponding to the pre-formed protrusion 47), and that the desired shape accuracy was achieved.

<Example 6B-a (Processing of a workpiece using the pressing plate of Example 6B)>
In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 6B is used as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108 as a workpiece 108.
The workpiece was embossed using the following process.
(S-a) An embossing plate 10 was prepared as an embossing plate 10 for pressing, with the pre-formed convex and concave portions manufactured in Example 6B.
(S-b) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other.
(S-d) A stainless steel receiving plate 94, which had been prepared separately and had a smooth, flat surface without any irregularities, was installed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108.
As a result, a workpiece surface is formed on the workpiece 108, having a surface shape that matches the surface shape of the multiple uneven areas 488a formed on the bottom surface of the pre-existing recess 48 of the die-cut substrate.
(S-f) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece.
As a result, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed "ABCDE pattern" in an uneven shape that matched the multiple uneven portions 488a (figure-character-picture patterns formed in an uneven shape) on the bottom surface of the pre-existing recess 48 of the printing plate substrate.

In this embodiment of the processing method for the workpiece, a paper sheet 108, which served as the workpiece 108, was produced with an "ABCDE pattern" graphic design formed on it, having the desired shape and dimensional accuracy. It was confirmed that the "ABCDE pattern" graphic design formed on the workpiece was formed with the desired uneven shape and steps, without any abnormalities.

The present invention provides a method for manufacturing a pressing plate, which enables chemical etching,
It becomes possible to manufacture a pressing plate having a desired shape, such as a desired character, desired symbol, desired pattern, desired design, desired picture, or desired fine character, character, and picture pattern, which has desired shape accuracy and dimensional accuracy formed by convex parts, concave parts, uneven parts, and/or fine uneven parts, while suppressing corrosive etching in the "areas of the plate-making substrate that must not be etched".

With the pressing plate of the present invention,
A pressing plate is obtained that has a desired shape, such as a desired character, desired symbol, desired pattern, desired design, desired picture, or desired fine character, character, and picture pattern, which has desired shape accuracy and dimensional accuracy formed by convex parts, concave parts, uneven parts, and/or fine uneven parts, and in which corrosion etching of the "area of the plate-making substrate that must not be etched" is suppressed.

The present invention provides a method for processing workpieces such as paper, corrugated cardboard, plastic film, plastic board, plastic molded products, and laminates thereof, which can be processed and formed into a shape having desired shape and dimensional accuracy, and which includes recesses, protrusions, and/or uneven surfaces having desired graphic or character patterns or desired fine graphic or character patterns.

1. Printing substrate 10. Pressing plate 11. First area surface of printing substrate 12. Second area surface of printing substrate 121. Inkjet resist film corrosion second recess formation area 121a. Conventional second recess formation area 121b. Corrosion second recess formation area 121s during etching. Side-etched corrosion second recess formation area 2. Inkjet resist material 20. Conventional resist material, conventional liquid resist material, conventional dry film resist material 23. Exposure mask member 3. Desired area inkjet resist cured film 3a. Desired area inkjet resist convex upper surface cured film 3b. Desired area inkjet resist convex side surface cured film 3c. Desired area inkjet resist recess bottom surface cured film 3e. Desired area inkjet resist fine convex upper surface cured film 3f. Desired area inkjet resist fine convex side surface cured film 3g. Desired area inkjet resist fine recess bottom surface cured film 30. Conventional resist cured film 30a. Conventional resist convex upper surface cured film.
30c Conventional hardened film on the bottom surface of the resist recess,
30e Conventional resist fine protrusion upper surface hardened film 30g Conventional resist fine recess bottom surface hardened film 4 Pre-existing uneven portion 41 Pre-existing protrusion 411 Inkjet film etching pre-existing protrusion projection 42 Pre-existing recess 45 Pre-existing multiple uneven portion 450 Conventional machined uneven portion protrusion 451 formed by conventional machining Pre-existing multiple uneven portion protrusion 451a Multiple pre-existing multiple uneven portion protrusion upper surface 451b Multiple pre-existing multiple uneven portion protrusion side surface 451s Multiple side-etched pre-existing multiple uneven portion protrusion side surface 452 Multiple pre-existing multiple uneven portion recess 452b Multiple pre-existing multiple uneven portion recess side surface 452c Multiple pre-existing multiple uneven portion recess bottom surface 452s Multiple side-etched pre-existing multiple uneven portion recess side surface 455 Inkjet film etching pre-existing multiple uneven portion protrusion 455s Multiple side-etched pre-existing uneven portion protrusion 46 Pre-existing multiple micro-protrusions 46b Side surface of pre-existing multiple micro-protrusions,
461 Multiple pre-existing multiple fine uneven surfaces, protrusions 461a Multiple pre-existing multiple fine uneven surfaces, upper surfaces 461b Multiple pre-existing multiple fine uneven surfaces, protrusions side surfaces 461s Multiple side-etched pre-existing multiple fine uneven surfaces, protrusions side surfaces 462 Multiple pre-existing multiple fine uneven surfaces, recesses 462b Multiple pre-existing multiple fine uneven surfaces, recess side surfaces 462c Multiple pre-existing multiple fine uneven surfaces, recess bottom surfaces 462s Multiple side-etched pre-existing multiple fine uneven surfaces, recess side surfaces 466 Inkjet film corrosion pre-existing multiple fine uneven surfaces, protrusions 466s Multiple side-etched pre-existing multiple fine uneven surfaces, protrusions 47 Pre-existing protrusions 47a Pre-existing protrusions, upper surfaces 47b Pre-existing protrusions side surfaces 471a Pre-existing protrusions, upper surfaces, multiple uneven surfaces, protrusions 471b Pre-existing protrusions, upper surfaces, multiple fine uneven surfaces, protrusions 472a Pre-existing protrusions, upper surfaces, multiple uneven surfaces, recesses 472b Multiple fine irregularities on the upper surface of the existing protrusion 477 Recessed portion 477a on the upper surface of the existing protrusion 477b Multiple fine irregularities on the upper surface of the existing protrusion 48 Existing recess 48b Existing recess side surface 48c Existing recess bottom surface 481a Multiple irregularities on the bottom surface of the existing recess 481b Multiple fine irregularities on the bottom surface of the existing recess 482a Multiple irregularities on the bottom surface of the existing recess 482b Multiple fine irregularities on the bottom surface of the existing recess 488 Recessed portion 488a on the bottom surface of the existing recess 488b Multiple fine irregularities on the bottom surface of the existing recess 92 First base 93 Second base 94 Receiving plate 96 Main roll 97 Opposing roll 100 Conventional pressing plate 108 Workpiece 108a Workpiece base material 108b Sheet-like foil material D1 Height dimension of the protrusions of the existing multiple uneven parts, depth dimension of the recesses of the existing multiple uneven parts D3 Etching depth during etching D12 Depth dimension of the second recess formation area of the inkjet resist film corrosion D12a Depth dimension of the conventional second recess formation area d1 Height dimension of the protrusions of the existing multiple fine uneven parts, depth dimension of the recesses of the existing multiple fine uneven parts d3 Etching depth during etching d12 Depth dimension of the second recess formation area of the inkjet resist film corrosion d12a Depth dimension of the conventional second recess formation area W1 Width dimension of the protrusions of the existing multiple uneven parts W2 Width dimension of the recesses of the existing multiple uneven parts w1 Width dimension of the protrusions of the existing multiple fine uneven parts w2 Width dimension of the recesses of the existing multiple fine uneven parts h Thickness dimension of the substrate for printing plates

Claims (14)

A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing,
(A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12),
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and
A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3),
(C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched.
This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1),
And,
(D) A step to remove the inkjet resist cured film (3) in the desired region.
It is equipped with,
The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
In step (A) above,
The second region surface (12) of the plate-type substrate has one or more smooth, non-irregular areas.
The first region surface (11) of the plate-type substrate has one or more pre-existing uneven surfaces (4),
(i) The surface (12) of the second region of the substrate for the plate mold has a single smooth surface without any irregularities,
When the first region surface (11) of the substrate for the plate mold has one pre-existing uneven portion (4),
The smooth portion is located in the area surrounding the pre-existing uneven portion (4).
The aforementioned pre-existing uneven portion (4) is
(a) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes,
Or,
(b) A pre-existing multiple micro-recessed portion (46) having multiple pre-existing multiple micro-recessed portions (461) formed by multiple micro-convex shapes and multiple pre-existing multiple micro-recessed portions (462) formed by multiple micro-concave shapes,
It has,
(ii) The second region surface (12) of the plate-type substrate has a plurality of smooth, even portions,
When the first region surface (11) of the substrate for the plate mold has a plurality of pre-existing uneven portions (4),
Each of the aforementioned smooth areas is located in the surrounding region of each of the aforementioned predetermined areas (4)
Each of the aforementioned multiple pre-existing uneven surfaces (4) is,
(a) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes,
and/or,
(b) A pre-existing multiple micro-recessed portion (46) having multiple pre-existing multiple micro-recessed portions (461) formed by multiple micro-convex shapes and multiple pre-existing multiple micro-recessed portions (462) formed by multiple micro-concave shapes,
It has,
In step (B) above,
A desired region inkjet resist film formation step, in which an inkjet resist material (2) is attached by an inkjet method to cover the pre-existing uneven portion (4) on the first region surface (11) of the plate-type substrate (1) to form a desired region inkjet resist film,
And,
The process includes a desired region inkjet resist curing step, which involves curing the aforementioned desired region inkjet resist deposition film to form a desired region inkjet resist cured film (3),
In step (C) above,
The process includes etching a plate-making substrate by contacting an etching solution with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, thereby etching the second region surface (12) of the plate-making substrate where the desired region inkjet resist cured film is not attached.
As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing uneven portion (4), forming a second inkjet resist film corrosion recess-forming portion (121) with a recessed shape, where the second inkjet resist film corrosion recess-forming portion (121) corresponds to the inkjet resist film corrosion recess-forming portion.
In step (D) above,
The system includes a step for removing the inkjet resist cured film (3) in the desired region,
This allows etching of the second region surface (12) of the plate-type substrate without etching the pre-existing uneven portion (4) to form the inkjet resist film corrosion second recess-forming portion (121) which is formed in a recessed shape, and also forms the pre-existing uneven portion (4) into a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion (121) .
A method for manufacturing a plate for pressing, characterized by the above. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing,
(A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12),
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and
A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3),
(C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched.
This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1),
And,
(D) A step to remove the inkjet resist cured film (3) in the desired region.
It is equipped with,
The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
In step (A) above,
The second region surface (12) of the substrate for the plate mold has a smooth surface without irregularities.
The first region surface (11) of the substrate for the plate mold has a pre-existing uneven portion (4),
The second region surface (12) of the substrate for printing plates is located in the surrounding region of the first region surface (11) of the substrate for printing plates.
The aforementioned pre-existing uneven portion (4) has a plurality of pre-existing uneven portions (45),
(i) The pre-existing multiple uneven portion (45) has a plurality of pre-existing multiple uneven portion convex portions (451) formed by a plurality of convex shapes and a plurality of pre-existing multiple uneven portion recesses (452) formed by a plurality of concave shapes,
The plurality of pre-existing multiple uneven parts protrusions (451) have a plurality of pre-existing multiple uneven parts protrusions upper surfaces (451a) and a plurality of pre-existing multiple uneven parts protrusions side surfaces (451b),
The plurality of pre-existing multiple recesses (452) have a plurality of pre-existing multiple recesses bottom surfaces (452c) and a plurality of pre-existing multiple recesses side surfaces (452b),
Here, the multiple pre-existing protruding surfaces (451b) and the multiple pre-existing recessed surfaces (452b) correspond to the same lateral region.
In step (B) above,
In the inkjet resist film formation step, an inkjet resist material (2) is applied by an inkjet method to cover the upper surfaces (451a) of the multiple pre-existing multiple uneven portions, the side surfaces (451b) of the multiple pre-existing multiple uneven portions, and the bottom surfaces (452c) of the multiple pre-existing multiple uneven portions, thereby forming an inkjet resist film attached to the upper surface of the uneven portions, an inkjet resist film attached to the side surfaces of the uneven portions, and an inkjet resist film attached to the bottom surface of the uneven portions, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven portions (45), and
The process includes a desired region inkjet resist curing film step, which involves curing the inkjet resist upper surface adhering film of the protrusions, the inkjet resist side surface adhering film of the protrusions, and the inkjet resist bottom surface adhering film to form a desired region inkjet resist curing film (3) having a desired region inkjet resist upper surface curing film (3a), a desired region inkjet resist side surface curing film (3b), and a desired region inkjet resist bottom surface curing film (3c) ,
In step (C) above,
The process includes an etching step for a plate-making substrate, in which an etching solution is brought into contact with the surface of the plate-making substrate (1), which has the desired region inkjet resist upper surface cured film (3a) of the desired region inkjet resist protrusions, the desired region inkjet resist side surface cured film (3b) of the desired region inkjet resist recess bottom surface cured film (3c), to etch the second region surface (12) of the plate-making substrate to which the desired region inkjet resist cured film (3) is not attached.
As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple uneven portions (45), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape,
The aforementioned multiple pre-existing uneven portions (45) are formed into inkjet film corrosion pre-existing multiple uneven portion protrusions (455) having a protruding shape that extends from the inkjet resist film corrosion second recess forming portion (121),
In step (D) above,
The process includes a step to remove the hardened film on the upper surface of the protrusions of the desired region inkjet resist (3a), the hardened film on the side of the protrusions of the desired region inkjet resist (3b), and the hardened film on the bottom surface of the desired region inkjet resist (3c).
As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple recesses (45),
The first region surface (11) of the plate-type substrate, which has the multiple pre-existing multiple protrusions (451) and the multiple pre-existing multiple recesses (452) of the multiple pre-existing multiple protrusions (455), is formed in the form of an inkjet film corrosion pre-existing multiple protrusions (455) that protrudes from the bottom surface of the inkjet resist film corrosion second recess-forming portion (121).
A method for manufacturing a plate for pressing, characterized by the above. In step (A) above,
The pre-existing multiple uneven portion (45) having the pre-existing multiple uneven portion protrusions (451) and the pre-existing multiple uneven portion recesses (452) is,
(i) Letters,
(b) Symbol,
(c) Figures,
(ii) The design, and
(e) Pattern,
The method for manufacturing a pressing plate according to claim 2 , characterized in that it forms a graphic character pattern consisting of at least one uneven shape selected from the group consisting of the above. In step (A) above,
The height dimension of each of the aforementioned multiple pre-existing multiple recessed parts (451) is 0.1 mm or more.
The depth dimension of each of the aforementioned multiple pre-existing multiple recesses (452) is 0.1 mm or more.
The depth dimension of the inkjet resist film corrosion second recess formation portion (121) is the same as the depth dimension of the pre-existing multiple recesses, or a greater depth dimension than the pre-existing multiple recesses.
The method for manufacturing a pressing plate according to feature 2 . A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing,
(A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12),
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and
A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3),
(C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched.
This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1),
And,
(D) A step to remove the inkjet resist cured film (3) in the desired region.
It is equipped with,
The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
In step (A) above,
The aforementioned mold substrate (1) has a first mold substrate surface area (11) and a second mold substrate surface area (12),
The second region surface (12) of the substrate for the plate mold has a smooth surface without irregularities.
The first region surface (11) of the substrate for the plate mold has a pre-existing uneven portion (4),
The second region surface (12) of the substrate for printing plates is located in the surrounding region of the first region surface (11) of the substrate for printing plates.
(b) The pre-existing uneven portion (4) has a plurality of pre-existing fine uneven portions (46),
The aforementioned pre-existing multiple fine uneven portion (46) has a plurality of pre-existing multiple fine uneven portion protrusions (461) and a plurality of pre-existing multiple fine uneven portion recesses (462),
The plurality of pre-existing multiple fine uneven protrusions (461) have a plurality of upper surfaces (461a) and a plurality of side surfaces (461b) of the pre-existing multiple fine uneven protrusions.
The plurality of pre-existing multiple fine uneven recesses (462) have a plurality of pre-existing multiple fine uneven recess bottom surfaces (462c) and a plurality of pre-existing multiple fine uneven recess side surfaces (462b),
Here, the multiple pre-existing multiple fine uneven surface convex side surfaces (461b) and the multiple pre-existing multiple fine uneven surface concave side surfaces (462b) correspond to the same side surface region.
In step (B) above,
In an inkjet resist film formation step, the inkjet resist material (2) is applied by an inkjet method to cover the upper surfaces (461a) of the multiple pre-existing multiple fine uneven portions, the side surfaces (461b) of the multiple pre-existing multiple fine uneven portions, and the bottom surfaces (462c) of the multiple pre-existing multiple fine uneven portions, thereby forming an inkjet resist film attached to the upper surface of the fine uneven portions, an inkjet resist film attached to the side surfaces of the fine uneven portions, and an inkjet resist film attached to the bottom surface of the fine recesses, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-making substrate located in the area surrounding the multiple pre-existing fine uneven portions (46), and
The process includes an inkjet resist curing film formation step, in which the inkjet resist curing film attached to the upper surface of the inkjet resist fine protrusions, the inkjet resist curing film attached to the side surface of the inkjet resist fine protrusions, and the inkjet resist curing film attached to the bottom surface of the inkjet resist fine recesses are cured to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film on the upper surface of the inkjet resist fine protrusions (3e), a desired region inkjet resist curing film on the side surface of the inkjet resist fine protrusions (3f), and a desired region inkjet resist curing film on the bottom surface of the inkjet resist fine recesses (3g).
In step (C) above,
The process includes an etching step for a printing plate substrate, in which an etching solution is brought into contact with the surface of the printing plate substrate (1) on which the desired region inkjet resist fine protrusion upper surface cured film (3e), the desired region inkjet resist fine protrusion side surface cured film (3f), and the desired region inkjet resist fine recess bottom surface cured film (3g) are formed, thereby etching the second region surface (12) of the printing plate substrate to which the desired region inkjet resist cured film 3 is not attached.
As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple fine uneven portions (46), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape,
The aforementioned multiple pre-existing fine uneven portions (46) are formed into the form of inkjet film corrosion pre-existing multiple fine uneven portion protrusions (466) having a protruding shape that protrudes from the inkjet resist film corrosion second recess forming portion (121),
In step (D) above,
The process includes a resist curing film removal step that removes the hardened film on the upper surface of the fine protrusions of the desired region inkjet resist (3e), the hardened film on the side of the fine protrusions of the desired region inkjet resist (3f), and the hardened film on the bottom surface of the fine recesses of the desired region inkjet resist (3g).
As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple fine uneven portions (46),
The first region surface (11) of the plate-type substrate, which has a plurality of pre-existing multiple fine uneven portions (46) having multiple pre-existing multiple fine uneven portions (461 ) and a plurality of pre-existing multiple fine uneven portions (462), is formed in the form of an inkjet film corrosion pre-existing multiple fine uneven portion projection (466) that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion (121).
A method for manufacturing a plate for pressing, characterized by the above. In step (A) above,
The aforementioned multiple pre-existing multiple fine uneven parts (46) having multiple pre-existing multiple fine uneven parts protrusions (461) and multiple pre-existing multiple fine uneven parts recesses (462) is
(f) Fine dot patterns, fine patterned designs, fine picture patterns, and/or fine grid patterns,
(T) Fine line pattern,
(Chi) Fine striped pattern, and,
(Ri) Latent patterns that represent different pictographic patterns when viewed from different directions.
A fine graphic character pattern is formed by at least one plurality of fine uneven shapes selected from the group consisting of the following,
The method for manufacturing a pressing plate according to feature 5. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing,
(A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12),
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and
A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3),
(C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched.
This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1),
And,
(D) A step to remove the inkjet resist cured film (3) in the desired region.
It is equipped with,
The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
In step (A) above,
The aforementioned mold substrate (1) has a first mold substrate surface area (11) and a second mold substrate surface area (12),
The second region surface (12) of the substrate for the plate mold has a smooth surface without irregularities.
The first region surface (11) of the substrate for the plate mold has a pre-existing uneven portion (4),
The second region surface (12) of the substrate for printing plates is located in the surrounding region of the first region surface (11) of the substrate for printing plates.
(b) The pre-existing uneven portion (4) has a plurality of pre-existing fine uneven portions (46),
The aforementioned pre-existing multiple fine uneven portion (46) has a plurality of pre-existing multiple fine uneven portion protrusions (461) and a plurality of pre-existing multiple fine uneven portion recesses (462),
The plurality of pre-existing multiple fine uneven protrusions (461) have a plurality of upper surfaces (461a) and a plurality of side surfaces (461b) of the pre-existing multiple fine uneven protrusions.
The plurality of pre-existing multiple fine uneven recesses (462) have a plurality of pre-existing multiple fine uneven recess bottom surfaces (462c) and a plurality of pre-existing multiple fine uneven recess side surfaces (462b),
Here, the multiple pre-existing multiple fine uneven surface convex side surfaces (461b) and the multiple pre-existing multiple fine uneven surface concave side surfaces (462b) correspond to the same side surface region.
In step (A) above,
The pre-existing multiple fine uneven portion (46), which has multiple pre-existing multiple fine uneven portion protrusions (461) and multiple pre-existing multiple fine uneven portion recesses (462), is formed by a combination of multiple types of uneven pattern cells that are engraved with a fine uneven shape, divided into predetermined shapes, and arranged in a regular manner.
Each of the aforementioned multiple types of uneven pattern cells is formed with a fine graphic character pattern, which consists of at least two types of fine uneven shapes selected from the group consisting of fine dot patterns, fine patterned patterns, fine picture patterns, fine line patterns, and fine striped patterns.
Multiple micro-picture patterns of one of two or more types of micro-picture patterns come together to form the first image.
Multiple fine graphic character patterns of a second type, different from one of the two or more types of fine graphic character patterns mentioned above, are gathered together to form another image.
In step (B) above,
In an inkjet resist film formation step, the inkjet resist material (2) is applied by an inkjet method to cover the upper surfaces (461a) of the multiple pre-existing multiple fine uneven portions, the side surfaces (461b) of the multiple pre-existing multiple fine uneven portions, and the bottom surfaces (462c) of the multiple pre-existing multiple fine uneven portions, thereby forming an inkjet resist film attached to the upper surface of the fine uneven portions, an inkjet resist film attached to the side surfaces of the fine uneven portions, and an inkjet resist film attached to the bottom surface of the fine recesses, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-making substrate located in the area surrounding the multiple pre-existing fine uneven portions (46), and
The process includes an inkjet resist curing film formation step, in which the inkjet resist curing film attached to the upper surface of the inkjet resist fine protrusions, the inkjet resist curing film attached to the side surface of the inkjet resist fine protrusions, and the inkjet resist curing film attached to the bottom surface of the inkjet resist fine recesses are cured to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film on the upper surface of the inkjet resist fine protrusions (3e), a desired region inkjet resist curing film on the side surface of the inkjet resist fine protrusions (3f), and a desired region inkjet resist curing film on the bottom surface of the inkjet resist fine recesses (3g).
In step (C) above,
The process includes an etching step for a printing plate substrate, in which an etching solution is brought into contact with the surface of the printing plate substrate (1) on which the desired region inkjet resist fine protrusion upper surface cured film (3e), the desired region inkjet resist fine protrusion side surface cured film (3f), and the desired region inkjet resist fine recess bottom surface cured film (3g) are formed, thereby etching the second region surface (12) of the printing plate substrate to which the desired region inkjet resist cured film 3 is not attached.
As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple fine uneven portions (46), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape,
The aforementioned multiple pre-existing fine uneven portions (46) are formed into the form of inkjet film corrosion pre-existing multiple fine uneven portion protrusions (466) having a protruding shape that protrudes from the inkjet resist film corrosion second recess forming portion (121),
In step (D) above,
The process includes a resist curing film removal step that removes the hardened film on the upper surface of the fine protrusions of the desired region inkjet resist (3e), the hardened film on the side of the fine protrusions of the desired region inkjet resist (3f), and the hardened film on the bottom surface of the fine recesses of the desired region inkjet resist (3g).
As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple fine uneven portions (46),
The first region surface (11) of the plate-type substrate, which has a plurality of pre-existing multiple fine uneven portions (46) having a plurality of pre-existing multiple fine uneven portions (461) and a plurality of pre-existing multiple fine uneven portions (462), is formed in the form of an inkjet film corrosion pre-existing multiple fine uneven portion projection (466) that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion (121).
A method for manufacturing a plate for pressing, characterized by the above. In step (A) above,
The height dimension of each of the aforementioned multiple pre-existing multiple fine uneven protrusions (461) is 0.05 mm or more.
The width dimension of each of the aforementioned multiple pre-existing multiple fine uneven protrusions (461) is 0.0005 mm to 1 mm.
The depth of each of the aforementioned multiple pre-existing multiple fine uneven recesses (462) is 0.05 mm or more.
The width dimension of each of the aforementioned multiple pre-existing multiple fine uneven recesses (462) is 0.0005 mm to 1 mm.
The depth dimension of the inkjet resist film corrosion second recess formation portion (121) is greater than the depth dimension of the pre-existing multiple fine uneven recesses.
A method for manufacturing a pressing plate according to claim 5 or 7 . A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing,
(A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12),
(B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and
A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3),
(C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched.
This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1),
And,
(D) A step to remove the inkjet resist cured film (3) in the desired region.
It is equipped with,
The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
In step (A) above,
The surface (12) of the second region of the substrate for the plate mold has a plurality of smooth, even areas without irregularities.
The first region surface (11) of the plate-type substrate has a plurality of pre-existing uneven portions (4),
Each of the multiple second region surfaces (12) of the plate-type substrate is located in the surrounding region of each of the multiple first region surfaces (11) of the plate-type substrate,
One of the multiple pre-existing uneven surfaces (4) is,
(a) Having a plurality of pre-existing multiple recessed parts (45) which have a plurality of convex shapes and a plurality of pre-existing multiple recessed parts (452) which have a plurality of concave shapes,
Of the plurality of pre-existing uneven surfaces (4), one other pre-existing uneven surface (4) is
(b) Having a plurality of pre-existing multiple micro-recessed portions (46) which have a plurality of pre-existing multiple micro-recessed portions (461) formed by a plurality of micro-convex shapes and a plurality of pre-existing multiple micro-recessed portions (462) formed by a plurality of micro-concave shapes,
The plurality of pre-existing multiple uneven parts protrusions (451) have a plurality of pre-existing multiple uneven parts protrusions upper surfaces (451a) and a plurality of pre-existing multiple uneven parts protrusions side surfaces (451b),
The plurality of pre-existing multiple recesses (452) have a plurality of pre-existing multiple recesses bottom surfaces (452c) and a plurality of pre-existing multiple recesses side surfaces (452b),
Here, the multiple pre-existing protruding surfaces (451b) and the multiple pre-existing recessed surfaces (452b) correspond to the same lateral region.
The plurality of pre-existing multiple fine uneven protrusions (461) have a plurality of upper surfaces (461a) and a plurality of side surfaces (461b) of the pre-existing multiple fine uneven protrusions.
The plurality of pre-existing multiple fine uneven recesses (462) have a plurality of pre-existing multiple fine uneven recess bottom surfaces (462c) and a plurality of pre-existing multiple fine uneven recess side surfaces (462b),
Here, the multiple pre-existing multiple fine uneven surface convex side surfaces (461b) and the multiple pre-existing multiple fine uneven surface concave side surfaces (456b) correspond to the same side surface region.
In step (B) above,
In an inkjet resist film formation step, inkjet resist material (2) is applied by inkjet method to cover the multiple pre-existing multiple uneven portion convex upper surfaces (451a), the multiple pre-existing multiple uneven portion convex side surfaces (451b), the multiple pre-existing multiple uneven portion recess bottom surfaces (452c), and the multiple pre-existing multiple multiple fine uneven portion convex upper surfaces (461a), the multiple pre-existing multiple multiple fine uneven portion convex side surfaces (461b), and the multiple pre-existing multiple multiple fine uneven portion recess bottom surfaces (462c), thereby forming an inkjet resist film attached to the upper surface of the convex portion, an inkjet resist film attached to the side surfaces of the convex portion, an inkjet resist film attached to the bottom surface of the recess, and an inkjet resist film attached to the upper surface of the fine uneven portion, an inkjet resist film attached to the side surfaces of the fine uneven portion, and an inkjet resist film attached to the bottom surface of the fine recess, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-type substrate located in the area surrounding the multiple pre-existing multiple uneven portions (45), and
The process includes an inkjet resist curing film formation step, in which the inkjet resist material (2) is applied by an inkjet method to form an inkjet resist cured film 3 having an inkjet resist cured film on the upper surface of the inkjet resist protrusions, an inkjet resist cured film on the side of the inkjet resist protrusions, an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist protrusions, and an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist protrusions, an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist fine protrusions, and an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the bottom of the inkjet resist fine recesses, and the inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist fine protrusions, and an inkjet resist cured film on the bottom of the inkjet resist fine recesses, respectively.
In step (C) above,
The process includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the above-mentioned desired-area inkjet resist upper surface cured film (3a) of the raised portion
As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple uneven portions (45) and the pre-existing multiple fine uneven portions (46), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape,
The aforementioned multiple pre-existing uneven portions (45) are formed into the form of inkjet film corrosion pre-existing multiple uneven portion protrusions (455) having a protruding shape that protrudes from the inkjet resist film corrosion second recess forming portion (121),
The aforementioned multiple pre-existing fine uneven portions (46) are formed into inkjet film corrosion pre-existing multiple fine uneven portion protrusions (466) having a shape that protrudes from the inkjet resist film corrosion second recess forming portion (121),
In step (D) above,
The system includes a resist curing film removal step for removing the inkjet resist curing film (3) in the desired region,
As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing uneven portion (4) to form the inkjet resist film corrosion second recess-forming portion (121), and the pre-existing uneven portion is formed into the form of an inkjet film corrosion pre-existing uneven portion projection having a protruding shape that extends from the inkjet resist film corrosion second recess-forming portion (121) .
The process includes a resist curing film removal step for removing the hardened film on the upper surface of the desired region inkjet resist protrusions (3a), the hardened film on the side of the desired region inkjet resist protrusions (3b), the hardened film on the bottom surface of the desired region inkjet resist recesses (3c), and the hardened film on the upper surface of the desired region inkjet resist fine protrusions (3e), the hardened film on the side of the desired region inkjet resist fine protrusions (3f), and the hardened film on the bottom surface of the desired region inkjet resist fine recesses (3g).
As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple recesses (45),
The first region surface (11) of the printing plate substrate, which has a plurality of pre-existing multiple uneven parts (45) having a plurality of pre-existing multiple uneven parts (451) and a plurality of pre-existing multiple uneven parts (452), and a plurality of pre-existing multiple fine uneven parts (46) having a plurality of pre-existing multiple fine uneven parts (461) and a plurality of pre-existing multiple fine uneven parts (462), is formed in the form of an inkjet film corrosion pre-existing multiple uneven parts protrusion (455) and an inkjet film corrosion pre-existing multiple fine uneven parts protrusion (466) that protrude from the bottom surface of the inkjet resist film corrosion second recess forming portion (121).
A method for manufacturing a plate for pressing, characterized by the above. The aforementioned pressing plate is
(i) Flat plates configured in a flat-pressure type processing device having flat plates facing each other,
(b) Roll plates configured in a roll-type processing device having roll shapes facing each other,
(h) A flexible plate configured by winding and fixing it around a cylindrical or cylindrical roll, or a flexible plate configured by fixing it to the surface of a plate-shaped substrate for printing plates.
(ii) A die for processing a workpiece into a predetermined uneven shape,
(e) A foil stamping plate for applying foil stamping to a workpiece.
(f) Cutting and cutting plates for cutting and/or cutting a workpiece into a predetermined shape.
And,
(t) A die-stamping/cutting/cutting plate for stamping or foil-stamping a workpiece into a predetermined uneven shape, and for cutting and/or cutting it.
A pressing plate having at least one form selected from the group consisting of the following:
A method for manufacturing a pressing plate according to claim 1, 2, 5, or 9 . (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9 ,
(S-b) A step of preparing a pressing device equipped with a first base (92) and a second base (93) facing each other,
(S-d) A step of installing a predetermined receiving plate (94) on the second base (93) of the pressing device,
(S-e) With the workpiece (108) positioned between the pressing plate (10) and the receiving plate (94), the process of driving at least one of the first base (92) and the second base (93) so that the pressing plate (10) and the receiving plate (94) press the workpiece,
This creates a workpiece surface (108) with a surface shape that matches the surface shape of the pre-existing surface (4),
And,
(S-f) A step of driving at least one base of the pressing plate (10) and the receiving plate (94) to separate the pressing plate (10) and the receiving plate (94) from each other and to release the pressure on the workpiece,
This prepares a workpiece in which the workpiece transfer forming portion is formed on the surface of the workpiece (108) in a form that has an uneven shape that matches the uneven shape of the pre-existing uneven portion (4).
A method for processing a workpiece, characterized by comprising the following: (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9 ,
(S-b) A step of preparing a pressing device equipped with a first base (92) and a second base (93) facing each other,
(S-d) A step of installing a predetermined receiving plate (94) on the second base (93) of the pressing device,
(S-e) With the workpiece substrate (108a) and the sheet-like foil material (108b) positioned between the pressing plate (10) and the receiving plate (94), the process of driving at least one of the first base (92) and the second base (93) so that the pressing plate (10) and the receiving plate (94) press the workpiece,
As a result, the sheet-like foil material (108b) is used to form a workpiece foil stamping transfer forming portion on the surface of the workpiece substrate (108a) having an uneven shape that matches the uneven shape of the pre-formed uneven portion (4),
And,
(S-f) A step of driving at least one base of the pressing plate (10) and the receiving plate (94) to separate the pressing plate (10) and the receiving plate (94) from each other and to release the pressure on the workpiece,
This prepares a workpiece in which the workpiece foil stamping transfer forming portion is formed on the surface of the workpiece substrate (108a) by the sheet-like foil material (108b) in a form that matches the shape of the pre-existing uneven portion (4).
A method for processing a workpiece, characterized by comprising the following: (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9 ,
(S-b) A step of preparing a pressing device equipped with a main roll (96) and a counter roll (97) facing each other,
(S-c) Step of installing the pressing plate (10) on the main roll (96),
(S-d) A step of installing a predetermined receiving plate (94) on the pair of rolls (97) of the pressing device,
(S-e) A step of driving the main roll (96) and the opposing roll (97), and supplying a workpiece between the main roll (96) and the opposing roll (97), so that the pressing plate (10) and the receiving plate (94) press the workpiece.
This creates a workpiece surface (108) with a workpiece surface having a surface shape that matches the surface shape of the pre-existing surface (4).
And,
(S-f) A step in which the workpiece separates from the main roll (96) and the opposing roll (97) to release the pressure on the workpiece.
This prepares a workpiece in which a workpiece surface (108) has a workpiece surface formed with a workpiece surface area having a surface shape that matches the surface shape of the pre-existing surface area (4).
A method for processing a workpiece, characterized by comprising the following: (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9 ,
(S-b) A step of preparing a pressing device equipped with a main roll (96) and a counter roll (97) facing each other,
(S-c) Step of installing the pressing plate (10) on the main roll (96),
(S-d) A step of installing a predetermined receiving plate (94) on the pair of rolls (97) of the pressing device,
(S-e) A step of driving the main roll (96) and the opposing roll (97), and supplying the workpiece substrate (108a) and the sheet-like foil material (108b) between the main roll (96) and the opposing roll (97), so that the pressing plate (10) and the receiving plate (94) press the workpiece,
This transfers the sheet-like foil material (108b) onto the surface of the workpiece substrate (108a) to form a workpiece foil stamping transfer forming portion having an uneven shape that matches the uneven shape of the pre-existing uneven portion (4).
And,
(S-f) A step in which the workpiece separates from the main roll (96) and the opposing roll (97) to release the pressure on the workpiece.
This prepares a workpiece in which a workpiece transfer forming portion is formed on the surface of the workpiece (108) by transferring the sheet-like foil material (108b) in a form that has an uneven shape that matches the uneven shape of the pre-existing uneven portion (4).
A method for processing a workpiece, characterized by comprising the following: