JP7854352B2 - Mounting apparatus and control method for mounting apparatus - Google Patents

Description

This specification discloses a mounting apparatus and a method for controlling the mounting apparatus.

Conventionally, mounting devices for mounting components onto a substrate have been proposed that, for example, capture image data of the component picked up by the mounting head and multiple types of first to third reference marks corresponding to multiple lighting conditions, and then determine the relative positional relationship between the component and the first to third reference marks based on this image data, and reflect this in the movement control of the mounting head to the mounting position (see, for example, Patent Document 1). In this mounting device, by using multiple types of reference marks, the mounting head can accurately recognize the position of the component even when the lighting type is changed, if it is holding a component under different lighting conditions. Furthermore, mounting devices have been proposed that determine the direction of movement of the mounting head during imaging according to the first X-axis distance and first Y-axis distance from the imaging position to the mounting position, and then image the component picked up by the mounting head while moving the mounting head (see, for example, Patent Document 2). This mounting device allows for a reduction in mounting time.

Japanese Patent Publication No. 2016-96174 International Publication No. 2015/145665

However, while the aforementioned mounting device claims to be able to accurately recognize component positions by providing multiple reference marks on the mounting head, there were cases where the reference marks could not be used depending on the type and size of the component. The mounting device required reliable acquisition of component positions.

This disclosure addresses these challenges and aims to provide a mounting apparatus and a control method for the mounting apparatus that can more reliably obtain the position of components.

The mounting apparatus and control method for the mounting apparatus disclosed herein employ the following means to achieve the main objectives described above.

In other words, the implementation device of this disclosure is
A mounting unit having a mounting head that picks up a component and mounts it onto a substrate, having a reference part which is a reference position and a predetermined member different from the reference part,
An imaging unit that images the mounting head from which the aforementioned parts have been collected and obtains an image of the image,
A control unit that uses either the reference part or the predetermined member as the reference position, depending on the type and/or size of the aforementioned part,
It is something that is provided.

In mounting equipment, depending on the type and size of the component, it may not be possible to image the reference area along with the component. However, even in such cases, a predetermined component can be used as the reference position, allowing for more reliable determination of the component's position.

A schematic diagram illustrating an example of the implementation system 10. Diagram illustrating the mounting head 22 and the imaging unit 16. An explanatory diagram showing an example of the state in which parts P1 and P2 have been collected. An explanatory diagram of an example of unique location information 34 stored in the memory unit 32. A flowchart showing an example of an implementation processing routine. A flowchart showing an example of an update processing routine. An explanatory diagram of an example of a process for obtaining a correction value to correct the position of the sampling member 23. A flowchart illustrating an example of a process for determining a reference position in place of the reference unit 24 using an captured image.

This embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram of an example of a mounting system 10 in this disclosure. Figure 2 is an explanatory diagram showing an example of a mounting head 22 and an imaging unit 16. Figure 3 is an explanatory diagram showing an example of a state in which parts P1 (Figure 3A) and parts P2 (Figure 3B) have been collected. Figure 4 is an explanatory diagram showing an example of unique position information 34 stored in the storage unit 32. The mounting system 10 is a system that performs the process of mounting parts P, which are objects to be imaged, onto a substrate S, which is a base material to be processed. This mounting system 10 includes a mounting device 11, a management device 40, and a printing device, a printing inspection device, a mounting inspection device, a transport device, a reflow device, etc. (not shown). The mounting system 10 is configured as a mounting line in which a plurality of mounting devices 11 that perform the mounting process of mounting parts P onto the substrate S are arranged from upstream to downstream. Here, the object to be processed is described as a substrate S, but it is not particularly limited as long as it is used to mount parts, and may also be a three-dimensional base material. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figures 1 and 2. Furthermore, parts P1 and P2 (see Figure 3) are collectively referred to as part P, and sampling members 23a and 23b (see Figure 7) are collectively referred to as sampling member 23.

As shown in Figure 1, the mounting apparatus 11 comprises a substrate processing unit 12, a component supply unit 13, an imaging unit 16, a standby unit 19, a mounting unit 20, and a control device 30. The substrate processing unit 12 is a unit that loads, transports, fixes, and unloads a substrate S as a base material. The component supply unit 13 is a unit that supplies components P to the mounting unit 20. Multiple feeders 15, each having a tape holding components P, are mounted on this component supply unit 13. These feeders 15 send the components P held on the tape to the picking position. This component supply unit 13 may also include a tray unit having a tray 16 for arranging and placing multiple components. The components P used in the mounting apparatus 11 include components P1, P2, etc., as shown in Figure 3. Component P1 is a standard component having a size less than or equal to a predetermined size that can be picked up by each picking member 23 mounted on the mounting head 22, and examples include fine chip components. Component P2 has a size that, when picked by the picking member 23, would hinder the picking of other components by the picking member 23. For example, it is a large component with a size larger than a predetermined size. Alternatively, as shown in Figure 3, component P2 may have a size that would interfere with (contact) other components P if they were picked. The mounting head 22 is configured to pick only one component P2 at a time to prevent interference with other components P. This component P2 may be supplied by a tray 15.

The imaging unit 16 is an image capture device and is a parts camera that captures images of one or more components P acquired and held by the mounting head 22. This imaging unit 16 is located between the component supply unit 13 and the substrate processing unit 12. The imaging range of the imaging unit 16 is above the imaging unit 16, and the imageable range is, for example, the imaging range 39 shown in Figure 3. The imaging unit 16 comprises an illumination unit 17, an image sensor 18, and an image processing unit. The illumination unit 17 is configured to irradiate light upwards and irradiate light onto the components P held by the mounting head 22. The image sensor 18 is an element that generates an electric charge upon receiving light and outputs the generated charge. The image sensor 18 may be, for example, a CMOS image sensor. The image processing unit performs processing to generate image data based on the input electric charge. When the mounting head 22 holding the components P passes above the imaging unit 16, the imaging unit 16 captures an image while the mounting head 22 is moving or while the mounting head 22 is stopped, and outputs the captured image data to the control device 30.

The mounting unit 20 is a unit that picks up components P from the component supply unit 13 and places them on a substrate S fixed to the substrate processing unit 12. The mounting unit 20 includes a head moving unit 21, a mounting head 22, a picking member 23, a reference unit 24, and a standby unit 19. The head moving unit 21 includes a slider that moves in the XY direction guided by a guide rail and a motor that drives the slider. The mounting head 22 picks up multiple components and moves in the XY direction by the head moving unit 21. This mounting head 22 is detachably mounted on the slider. One or more picking members 23 are detachably mounted on the lower surface of the mounting head 22. Multiple picking members 23 for picking components P are arranged circumferentially on the mounting head 22 (see Figures 2 and 3). The picking member 23 may be a nozzle that picks up components using negative pressure. In addition to a nozzle, the picking member 23 may be a mechanical chuck or the like that mechanically holds the component P. The reference section 24 is a reference mark that serves as the reference position in the image captured by the imaging section 16. The reference mark can be any component that serves as the reference position; for example, it may have a visually recognizable shape such as a circle or polygon. Two reference sections 24 are provided on the mounting head 22, near rotation positions D and F. The standby section 19 is a nozzle station that holds the sampling component 23, which is not yet mounted on the mounting head 22, in standby position.

The mounting head 22 is capable of mounting multiple sampling members 23 for sampling parts P, and as shown in Figure 2, it is configured as a rotary-type work head that is held in a rotatable state. Figure 2 illustrates a configuration that can mount eight sampling members 23, but it is not limited to this, and the number of sampling members 23 that can be mounted can be any number, such as two, four, six, or twelve, or it may be a non-rotatable type instead of a rotary type. As shown in Figure 2, the mounting head 22 comprises a mounting member 25, an R-axis drive unit 26, a Q-axis drive unit 27, a Z-axis drive unit 28, and a rotary unit 29. The mounting member 25 is a long-axis cylindrical holder that removably mounts the sampling members 23. The lower end of this mounting member 25 is fitted with a sampling member 23, and a pinion gear is disposed at the upper end. The mounting member 25 is also supported by the rotary unit 29 so that it can be raised and lowered by the Z-axis drive unit 28 at a predetermined rotational position. This pinion gear meshes with a ring gear (not shown) that is rotatably supported on the main body of the mounting head 22. The R-axis drive unit 26 is a motor that rotates the entire rotary unit 29 on which the sampling member 23 is mounted. By rotating the rotary unit 29, the R-axis drive unit 26 rotates (revolves) the sampling member 23 along its circumference. The Q-axis drive unit 27 is a motor that rotates the mounting member 25 at each rotational position. By rotating a ring gear (not shown), the Q-axis drive unit 27 rotates all the pinion gears in conjunction, causing all the mounting members 25 to rotate synchronously. The Z-axis drive unit 28 is a linear actuator that raises and lowers the mounting member 25 along the Z-axis. The Z-axis drive unit 28 may be configured as a ball screw and motor, or as a linear motor.

The control device 30 is configured as a microprocessor centered around a control unit 31 including a CPU, and includes a storage unit 32 for storing various data. This control device 30 outputs control signals to the board processing unit 12, component supply unit 13, imaging unit 16, and mounting unit 20, and inputs signals from the component supply unit 13, imaging unit 16, and mounting unit 20. The storage unit 32 stores mounting condition information 33, unique position information 34, reference member information 35, etc. The mounting condition information 33 includes information such as the sampling order and placement order when mounting components P, the identification information (ID) of components P, and the placement position (coordinates) on the board S. The unique position information 34 includes data for correcting the amount of deviation in the tip position of the sampling member 23 when it is positioned at rotation positions A to H of the mounting head 22. The unique position information 34 associates the identification information (ID) of the sampling member 23 with a correction value that corrects the amount of positional deviation of the tip when it is positioned at each rotation position A to H. Furthermore, each correction value is associated with the respective correction values when the rotation angle of the sampling member 23 at the vertically moving rotation position A is θ1 (°) and θ2 (°). This rotation angle is defined because the sampling member 23 can rotate at each rotation position, and for example, the sampling member 23 at rotation position A may be θ1 = 0° and θ1 = 90°. The correction value for the tip position of the sampling member 23 is associated with each rotation angle, as shown in Figure 4. Note that the unique position information 34 may also include correction values relating to the combination of the sampling member 23 and any of the multiple mounting members 25. The reference member information 35, as will be described in detail later, includes information on a predetermined member to be used as a reference position when the reference unit 24 is not included in the imaging range 39 and the reference unit 24 cannot be used. In the mounting device 11, the predetermined member used in place of the reference unit 24 is set at the tip position of the sampling member 23 mounted on the mounting member 25. The predetermined member used in place of the reference unit 24 is selected based on the part shape, such that it is not obscured by the part P collected by the mounting head 22, and/or is located within the imaging range 39 of the imaging unit 16. This reference member information 35 associates the identification information (ID) of the part P for which the reference unit 24 cannot be used, information regarding the position of the sampling member 23 used at the reference position when collecting that part P, and the identification information of the already mounted sampling member 23 attached to that reference position. The ID of the mounted sampling member is updated according to the attachment and removal of the sampling member 23 from the mounting member 25 at the reference position.

The management device 40 is a computer that manages information about each device in the implementation system 10. As shown in Figure 1, the management device 40 comprises a control unit 41, a storage unit 42, a display unit, and an input device. The control unit 41 is configured as a microprocessor centered on a CPU. The storage unit 42 is a device that stores various data, such as processing programs, such as an HDD. The storage unit 42 may also store a database containing implementation condition information 33 and unique location information 34 for each implementation device 11. The display unit is a liquid crystal screen that displays various information. The input device includes a keyboard and mouse, etc., for operators to input various commands.

Next, the operation of the mounting system 10 of this embodiment, as configured in this way, will be described, particularly the mounting process for placing components P onto the substrate S. Figure 5 is a flowchart showing an example of a mounting process routine executed by the control device 30 of the mounting apparatus 11. This routine is stored in the storage unit 32 and executed by the control unit 31 based on the operator's mounting start input. Here, the process when the mounting apparatus 11 mounts components P1 and P2 onto the substrate S will be described as an example. When this routine is started, the control unit 31 first reads and acquires mounting condition information 33 from the storage unit 32 (S100), and determines whether it is time to update the unique position information 34 (S110). This update timing may be empirically determined to be a timing that can more reliably correct the positional displacement of the tip of the sampling member 23, for example, when there is no correction information for the sampling member 23 yet, or when a predetermined usage time has elapsed for the sampling member 23. If it is time to update the unique position information 34 in S110, the control unit 31 executes the unique position information update process (S120).

Figure 6 is a flowchart showing an example of an update processing routine executed by the control device 30 of the mounting device 11. This routine is stored in the storage unit 32 and executed by the control unit 31 in S120 of the mounting processing routine. When this routine starts, the control unit 31 first mounts the sampling member 23 located in the standby unit 19 onto the mounting head 22 and moves the mounting head 22 to a predetermined imaging position on the imaging unit 16 (S300). The sampling member 23 may be mounted, for example, in the order in which it was housed in the standby unit 19. The predetermined imaging position is determined so that the rotary unit 29 is located in the center of the imaging range 39 on the imaging unit 16. Next, the control unit 31 causes the imaging unit 16 to take an image when the sampling member 23 is at a predetermined rotation position and the rotation angle of the sampling member 23 is at a predetermined angle (S310). At this time, the control unit 31 causes the imaging unit 16 to take an image while appropriately changing the rotation angle and rotation position to the next position.

Figure 7 is an explanatory diagram illustrating an example of the process for obtaining a correction value to correct the position of the sampling member 23. For the sake of explanation, the sampling member 23 of interest will be referred to as sampling member 23a, and the one of interest next will be referred to as sampling member 23b. First, the control unit 31 moves the mounting head 22 to a predetermined position on the imaging unit 16, rotates the sampling member 23a to rotation position A, sets the rotation angle of the sampling member 23 to θ1 (°), and captures an image (Figure 7A). The control unit 31 can also acquire the tip positions of the sampling members 23 mounted at rotation positions B to H at rotation angle θ1, which are included in this captured image. Next, the rotation angle of the sampling member 23a is changed to θ2 (°), and the imaging unit 16 captures an image (Figure 7B). The control unit 31 can also acquire the tip positions of the sampling members 23 mounted at rotation positions B to H at rotation angles θ2, which are included in this captured image. Next, the control unit 31 moves the sampling member 23a to rotation position B and causes the imaging unit 16 to capture an image at rotation angle θ1 (Figure 7C). Then, the control unit 31 causes the imaging unit 16 to capture an image of the sampling member 23a at rotation angle θ2 at rotation position B. This process is repeated to obtain images of the sampling members 23a, 23b, etc., at rotation positions A to H at rotation angles θ1 and θ2.

Next, the control unit 31 determines whether it has finished imaging all the sampling members 23 in the standby unit 19 (S320). If it has not finished imaging all the sampling members 23, it executes the processing from S300 onward. That is, the control unit 31 mounts the next sampling member 23 and executes the process of capturing an image at a predetermined rotation angle and rotation position. On the other hand, if it has finished imaging all the sampling members 23 in S320, the control unit 31 determines the amount of positional displacement of the sampling member 23 at the predetermined rotation angle and rotation position, calculates a correction value to compensate for this positional displacement, stores it in the unique position information 34 (S330), and terminates this routine. Through this process, the control device 30 can update the unique position information 34, including the new correction value.

Now, after the update processing routine is completed in S120 of the mounting processing routine, or when it is not time to update the unique position information 34 in S110, the control unit 31 executes the mounting processing from S130 onward. In the mounting processing, the control unit 31 causes the substrate processing unit 12 to perform the transport and fixing of the substrate S (S130). Next, the control unit 31 sets the parts P to be picked up by the picking member 23 based on the arrangement order of the mounting condition information 33 (S140). Next, the control unit 31 attaches or replaces the picking member 23 as necessary, and causes the mounting unit 20 to perform the suction and movement processing of one or more parts P (S150). At this time, the control unit 31 moves the mounting head 22 so that it passes above the imaging unit 16.

Next, the control unit 31 determines whether or not a specific component P is present among those collected by the mounting head 22 (S160). The control unit 31 determines that a specific component is present when a specific component P, such as component P2, which is larger than a predetermined size and limits the use of the total number of sampling members mounted on the mounting head 22, is collected by the mounting head 22. If there is no specific component P, that is, when the collected component P is smaller than or equal to the predetermined size, the control unit 31 performs a moving imaging process (also called fly vision) by moving the mounting head 22 without stopping it between the time the component P is collected and when it is mounted on the substrate S, so that the imaging unit 16 can image the component P collected by the mounting head 22 (S170). The control unit 31 controls the head movement unit 21 so that the center of the entire sampling member 23 that is collecting the component P passes through the center of the imaging range 39, and controls the imaging unit 16 to take a picture based on the value of the servo counter of the head movement unit 21. At this time, the control unit 31 can obtain an image that includes the entire component P1 in the imaging range 39 (see Figure 3A). Next, the control unit 31 uses the captured image and the reference unit 24 to acquire the position of the sampled part P (S180) and the amount of displacement of the part P (S220). The moving image capture process is an image capture process performed while moving, and due to the minute time difference in shutter release, the position of the mounting head 22 shifts slightly with each image capture. The control unit 31 uses the reference unit 24 as a reference position to determine the tip position of the sampling member 23 from the relative positional relationship between the reference unit 24 and the tip center position of the sampling member 23, thereby acquiring the position of the sampled part P. Furthermore, based on the obtained positional relationship, the control unit 31 can determine the distance (amount of displacement) between the acquired center position of part P and the tip center position of the sampling member 23.

On the other hand, in S160, if a specific component P is found among those collected by the mounting head 22, the control unit 31 sets a predetermined member to serve as the reference position (S190). Based on the information contained in the reference member information 35, the control unit 31 sets the sampling member 23 at a predetermined rotational position to the predetermined member. For example, as shown in Figure 4, for component P2, the reference position is the center of the tip of the sampling member 23 currently mounted at rotational position G. Next, similar to S170, the control unit 31 executes a moving imaging process to allow the imaging unit 16 to image the component P collected by the mounting head 22 without moving and stopping the mounting head 22 (S200). The control unit 31 controls the head movement unit 21 so that the center of the sampling member 23 collecting component P2 passes through the center of the imaging range 39, and controls the imaging unit 16 to take a picture based on the value of the servo counter of the head movement unit 21. At this time, the control unit 31 can obtain an image in which the entire component P2 is included in the center of the imaging range 39 (see Figure 3B). Next, the control unit 31 uses the reference position of the sampling member 23 with a correction value to acquire the position of the component P2 sampled by the mounting head 22 (S210) and acquires the amount of displacement of the component P (S220). As described above, when the mounting head 22 is moved so that the component P2 moves in the center of the imaging range 39 to obtain an image, the reference unit 24 may be outside the range of the imaging range 39 (see Figure 3B). Here, the control unit 31 uses the sampling member 23, which is a visible component included in the image, as the reference position. In addition, the sampling member 23 and the mounting member 25 may have a deviation from the theoretical position at the tip center due to their manufacturing precision and bending due to load during use. The control unit 31 corrects this amount of deviation at the tip position of the sampling member 23 using the correction value of the unique position information 34. As a result, the control unit 31 can acquire a more accurate position of the component P2. The control unit 31, for example, if the sampling member 23 with sampling member ID = #1 is mounted on the mounting member 25 at rotational position G and rotational angle θ1, reads and obtains the corresponding correction value from the unique position information 34. Furthermore, the control unit 31 corrects the tip center position of the sampling member 23 at the rotational position of the reference position using the correction value from the unique position information 34. From the relative positional relationship between the corrected tip center position of the sampling member 23 at the reference position and the tip center position of the sampling member 23 holding the part P2, the control unit 31 can determine the tip position of the sampling member 23 in the captured image. Additionally, the control unit 31 can determine the distance (positional displacement) between the center position of part P2 obtained from the captured image and the tip center position of the sampling member 23 that sampled part P2.

After S220, the control unit 31 places the component P at a position corrected for the acquired misalignment (S230). Then, the control unit 31 determines whether the mounting process for the current substrate is complete (S240). If it is not complete, it executes the processes from S140 onwards. That is, the control unit 31 sets the next component P to be sampled, replaces the sampling member 23 as needed, images the component P while moving it, corrects the misalignment, and places it on the substrate S. On the other hand, if the mounting process for the current substrate is complete in S240, the control unit 31 has the substrate processing unit 12 eject the completed substrate S (S250) and determines whether the production of the substrate S is complete (S260). If production is not complete, the control unit 31 executes the processes from S130 onwards; however, if production is complete, this routine terminates. In this way, the mounting apparatus 11 can perform mounting processing not only for standard components P1 but also for large components P2 by correcting the misalignment of their sampling position through the moving image processing.

Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The control device 30 of this embodiment is an example of the control device of the present disclosure; the control unit 31 is an example of the control unit; the imaging unit 16 is an example of the imaging unit; the mounting unit 20 is an example of the mounting unit; the mounting head 22 is an example of the mounting head; and the mounting device 11 is an example of the mounting device. Furthermore, the reference unit 24 is an example of the reference unit; the sampling member 23 is an example of the predetermined member and the sampling member; and the mounting member 25 is an example of the mounting member. In this embodiment, an example of the control method for the mounting device of the present disclosure is also clarified by explaining the operation of the control device 30 and the mounting device 11.

The control device 30 of the embodiment described above is used in a mounting apparatus that performs mounting processing. The apparatus includes a mounting unit 20 having a mounting head 22 that picks up a component P and mounts it onto a substrate S, and a mounting unit 16 that images the mounting head 22 after picking the component P and obtains an image. The control device 30 includes a control unit 31 that uses either the reference unit 24 or the predetermined member as the reference position, depending on the type and/or size of the component P. In the control device 30, depending on the type and size of the component P, it may not be possible to image the reference unit 24 together with the component P. However, even in such cases, the predetermined member can be used as the reference position, allowing for more reliable acquisition of the component P's position.

Furthermore, the control unit 31 moves the mounting head 22 without stopping it between the time the component P is picked up and when it is mounted on the substrate S, causing the imaging unit 16 to image the component P picked up by the mounting head 22. Since this control device 30 can perform the mounting process without stopping the mounting head 22, the processing time can be shortened. Also, the mounting head 22 can be equipped with multiple picking members 23 for picking up components P. The predetermined member is a picking member 23 that is mounted on the mounting head 22 and picks up components P, even though it has not picked up any components P. Therefore, this control device 30 uses a picking member that has not picked up any components P as a reference position without providing another reference unit 24, thus further suppressing complexity of the configuration. Moreover, before the mounting process, the control unit 31 acquires unique position information 34 related to the position correction of the picking member 23, and uses this unique position information 34 to acquire the position of the component P picked up by the mounting head 22. By using the unique position information 34, this control device 30 can take into account positional deviations that may occur due to the mounting accuracy of the picking member 23, and acquire a more accurate component position. Furthermore, the control device 30 selects a predetermined member that is not obscured by the component P captured by the mounting head 22, and/or a predetermined member that is located within the imaging range 39 of the imaging unit 16, based on the shape of the component P. Because this control device 30 selects a predetermined member that is not obscured by the component P and is located within the imaging range 39, it can more reliably use a reference position. The control unit 31 then uses the reference unit 24 as the reference position for components P1 of a predetermined size or smaller, and a predetermined member as the reference position for components P2 larger than the predetermined size. In this control device 30, the predetermined size is determined based on the imaging range of the imaging unit 16 and the position of the reference unit 24 provided on the mounting head 22. For example, for large components P2, where obtaining the component position can be difficult due to the reference unit 24 being obscured by the suctioned component P, or the reference unit 24 being outside the imaging range 39 of the imaging unit 16, the component position can be obtained more reliably.

Furthermore, the mounting apparatus 11 is used to mount components P onto a substrate S, which is the object to be processed. It comprises a mounting unit 20 having a mounting head 22 that picks up components P, which has a reference section 24 that is a reference position and a predetermined member different from the reference section 24; an imaging unit 16 that images the mounting head 22 after picking up components P and obtains an image; and the control device 30 described above. Because this mounting apparatus 11 includes the control device 30 and control unit 31 described above, the position of the components can be obtained more reliably. Also, since the mounting apparatus 11 acquires the position of components P by moving imaging, the processing time can be reduced compared to stopping the mounting head 22 at a predetermined position in the imaging range 39 and acquiring an image. In particular, the mounting apparatus 11 can perform moving imaging not only on components P1 of a predetermined size or smaller, but also on large components P2 whose number of pieces is limited, further reducing the time required for mounting.

Furthermore, this disclosure is not limited in any way to the embodiments described above, and it goes without saying that it can be implemented in various forms as long as it falls within the technical scope of this disclosure.

For example, in the embodiment described above, a moving imaging process (fly vision) is performed in which the component P collected by the mounting head 22 is imaged by the imaging unit 16 without moving or stopping the mounting head 22. However, the system is not limited to this, and a stopping imaging process (stop vision) may be performed in which the mounting head 22 is stopped at a predetermined stopping position and the component P collected by the mounting head 22 is imaged by the imaging unit 16. In this control device 30 as well, since a predetermined member is used as the reference position instead of the reference unit 24, the position of the component can be obtained more reliably. In particular, the mounting device 11 may perform the stopping imaging process when the reference position of the reference unit 24 or the predetermined member cannot be used.

In the embodiment described above, the predetermined member used as the reference position was explained as a sampling member 23 mounted on the mounting head 22 that does not have a component P sampled from it. However, it is not limited to this. For example, a mounting member 25 that does not have a sampling member 23 attached may be used as the predetermined member for the reference position, or other visible members or parts of the mounting head 22. Using these predetermined members as reference positions allows for more reliable determination of the component position.

In the embodiment described above, the position of part P is determined more accurately using unique position information 34, which corrects the position of the sampling member 23 as a predetermined member. However, the invention is not limited to this, and the use of unique position information 34 may be omitted. Even in this control device 30, the part position can be obtained more reliably by using a predetermined member.

In the embodiment described above, instead of the reference unit 24, a sampling member 23, which is a predetermined member located at a rotational position set in advance in the unique position information 34, is used as the reference position. However, the embodiment is not limited to this. For example, the control unit 31 may use the captured image to select a predetermined member that is captured together with the component P collected by the mounting head 22, instead of the reference unit 24. In particular, the control device 30 may automatically determine which predetermined member at which position should be used as the reference position instead of the reference unit 24. Figure 8 is a flowchart of an example of a process for determining a reference position in place of the reference unit 24 using the captured image. Note that this flowchart is a modified version of the mounting processing routine in Figure 5, and the same steps as in the mounting processing routine are numbered the same, and their detailed explanation is omitted. In the mounting process of Figure 8, the control unit 31 executes the processes S100 to S160. Then, in S160, if there is a specific component, the control unit 31 stops the mounting head 22 and determines whether or not a stopped imaging component, which captures an image of the component P, has been collected by the mounting head 22 (S400). The stationary imaging component is a component type that will be set later in S450, and is a component P that cannot be subjected to moving imaging processing. If no stationary imaging component has been set yet, the control unit 31 determines in this step that there is no stationary imaging component. If there is no stationary imaging component on the mounting head 22 in S400, the control unit 31 moves and stops the mounting head 22 at a predetermined position and performs stationary imaging processing to image the component P captured by the mounting head 22 (S410). In the stationary imaging processing, a reference position is set at the center of the imaging range 39. Next, the control unit 31 extracts a sample member 23 as a predetermined member from the captured image (S420) and determines whether there is a sample member 23 that can serve as a reference (S430). The control unit 31 determines that there is a sample member 23 that can serve as a reference if a sample member 23 that can be recognized without being hidden by the component P is located at any of the rotation positions B to H. When there is a sampling member 23 that can serve as a reference, the control unit 31 sets the rotational position of the corresponding sampling member 23 as the reference position, stores it in reference member information 35 (for example, S440), and executes the processing from S210 onwards. On the other hand, when there is no sampling member 23 that can serve as a reference in S430, the control unit 31 sets the component P sampled by the mounting head 22 as a component to be subjected to stop imaging processing (S450), uses a reference point at a predetermined position where the mounting head 22 is stopped (such as the center of the imaging range 39) as the reference position to obtain the position of the sampled component P (S460), and executes the processing from S220 onwards. Then, when there is a component to be subjected to stop imaging processing among the components sampled by the mounting head 22 in S400, the control unit 31 executes stop imaging processing in the same manner as in S410 (S470), and executes the processing from S460 onwards. In this way, the control device 30 obtains an image by stop imaging processing only at the beginning, and uses this image to set a predetermined member that will serve as the reference position. Furthermore, if a predetermined member to serve as the reference position does not exist during this stop imaging process, the control unit 31 performs the stop imaging process on the relevant part to correct the misalignment of the part P's sampling position. This control device 30 can automatically set the predetermined member to serve as the reference position.

Furthermore, in the embodiment described above, instead of the reference unit 24, a sampling member 23, which is a predetermined member located at a rotational position pre-set in the unique position information 34, is used as the reference position. However, the system is not limited to this. For example, the control unit 31 may acquire information on the type and size of the component P from mounting condition information 33, etc., and automatically set a predetermined member to be used as the reference position in place of the reference unit 24 based on this information. This control device 30 can automatically set the predetermined member. Alternatively, the control unit 31 may select a predetermined member specified by the operator. This control device 30 allows the operator to select the predetermined member, which offers greater flexibility and is therefore more preferable.

In the embodiment described above, a predetermined member is used as the reference position instead of the reference portion 24 for a component P2 that is larger than a component P1 of a predetermined size or smaller. However, regardless of the size of the component P2, a different predetermined member may be used when the reference portion 24 cannot be used.

In the embodiment described above, the sampling member 23, as a predetermined member, is used as a reference position to perform positional deviation correction during sampling of part P. However, the invention is not limited to this. For example, the sampling member 23, as a predetermined member, may be used as a reference position to perform super-resolution processing to generate a higher-resolution image from two or more captured images. In this control device 30 as well, since the predetermined member can be used as a reference position when the reference unit 24 is unavailable, the position of part P can be obtained more reliably.

Furthermore, although the above-described embodiments have explained this disclosure as a control device 30, a mounting device 11, and a mounting system 10, it may also be, for example, a control method for the mounting device 11, or a program in which a computer executes the above-described process.

Herein, the present disclosure may be configured as follows. For example, the control method for a mounting apparatus of the present disclosure is a control method for a mounting apparatus comprising: a mounting unit having a mounting head that picks up a component and mounts it on a substrate, having a reference unit which is a reference position and a predetermined member different from the reference unit; and an imaging unit which images the mounting head that has picked up the component and obtains an image.
Depending on the type and/or size of the aforementioned part, the step of using either the reference part or the predetermined member as the reference position,
It includes.

In this control method for the mounting device, similar to the control device described above, a predetermined component can be used as a reference position, thus allowing for more reliable determination of the component's position. Furthermore, various embodiments of the control device and mounting device described above may be adopted in this control method for the mounting device, and additional steps may be added to implement the functions of the control device and mounting device described above.

This specification also discloses technical concepts in which "the control device described in claim 1 or 2" in the original claim 4 was changed to "the control device described in any one of claims 1 to 3," technical concepts in which "the control device described in claim 1 or 2" in the original claim 5 was changed to "the control device described in any one of claims 1 to 4," and technical concepts in which "the control device described in claim 1 or 2" in the original claim 6 was changed to "the control device described in any one of claims 1 to 5."

This disclosure is applicable to apparatus used for mounting components onto a substrate.

10 Mounting system, 11 Mounting device, 12 Substrate processing unit, 13 Component supply unit, 14 Feeder, 15 Tray, 16 Imaging unit, 17 Illumination unit, 18 Image sensor, 19 Standby unit, 20 Mounting unit, 21 Head movement unit, 22 Mounting head, 23, 23a, 23b Sampling members, 24 Reference unit, 25 Mounting member, 26 R-axis drive unit, 27 Q-axis drive unit, 28 Z-axis drive unit, 29 Rotary unit, 30 Control device, 31 Control unit, 32 Storage unit, 33 Mounting condition information, 34 Unique position information, 35 Reference member information, 39 Imaging range, 40 Management device, 41 Control unit, 42 Storage unit, A-H Rotation position, P, P1, P2 Component, S Substrate.

Claims (7)

A mounting unit having a mounting head that has a reference part and a predetermined member different from the reference part, and that picks up a component and mounts it on a substrate,
The imaging unit captures images of the mounting head from below and obtains images of the reference unit, the predetermined member, and the component captured by the mounting head .
A storage unit stores the position of the predetermined member relative to the reference unit based on the imaging results of the reference unit and the predetermined member that have been previously imaged by the imaging unit,
A control unit that acquires the position of the component captured on the mounting head using either the reference unit or the predetermined member as a reference position, depending on the type and/or size of the component;
A mounting device equipped with this device. The mounting head can be equipped with multiple sampling members for sampling the components.
The mounting apparatus according to claim 1, wherein the predetermined member is one or more of the following: a sampling member that has not sampled the component and is attached to the mounting head for sampling the component; and a mounting member for attaching the sampling member. The storage unit acquires and stores the unique position information of the sampling member and/or the mounting member before the mounting process.
The mounting apparatus according to claim 1, wherein the control unit obtains the position of the component taken by the mounting head using the reference position obtained using the unique position information stored in the storage unit. The mounting apparatus according to claim 1 or 2, wherein the control unit moves the mounting head without stopping it between the time the component is picked up and the time it is mounted on the substrate, causing the imaging unit to image the component picked up by the mounting head. The mounting head has a plurality of predetermined members as reference positions,
The mounting apparatus according to claim 1 or 2, wherein the control unit selects one of the predetermined members as the reference position based on one or more of the conditions (1) to (3).
(1) Based on the shape of the component, a predetermined member is selected that is not hidden by the component captured on the mounting head, and/or that is located within the imaging range of the imaging unit.
(2) Select the predetermined member specified by the worker.
(3) Using the captured image, select the predetermined member that is captured together with the collected part. The mounting apparatus according to claim 1 or 2, wherein the control unit uses the reference section at the reference position for components of a predetermined size or smaller, and uses the predetermined member at the reference position for components larger than the predetermined size. A control method for controlling a mounting apparatus comprising: a mounting unit having a mounting head that has a reference unit and a predetermined member different from the reference unit and picks up a component and mounts it on a substrate; and an imaging unit that can image the mounting head from below and obtains an image of the reference unit, the predetermined member and the component picked up by the mounting head ,
(a) A step of obtaining the position of the predetermined member relative to the reference unit based on the imaging result of the reference unit imaging the reference unit and the predetermined member,
(b) A step in which either the reference part or the predetermined member is used as a reference position, depending on the type and/or size of the part,
(c) A step of obtaining the position of the component relative to the reference position based on the imaging result of the component taken by the mounting head,
A control method for an implementation device that includes [a specific component].