JPS527281B2 - - Google Patents
Info
- Publication number
- JPS527281B2 JPS527281B2 JP48019989A JP1998973A JPS527281B2 JP S527281 B2 JPS527281 B2 JP S527281B2 JP 48019989 A JP48019989 A JP 48019989A JP 1998973 A JP1998973 A JP 1998973A JP S527281 B2 JPS527281 B2 JP S527281B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Channel Selection Circuits, Automatic Tuning Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48019989A JPS527281B2 (en) | 1973-02-19 | 1973-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48019989A JPS527281B2 (en) | 1973-02-19 | 1973-02-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49108902A JPS49108902A (en) | 1974-10-16 |
| JPS527281B2 true JPS527281B2 (en) | 1977-03-01 |
Family
ID=12014573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48019989A Expired JPS527281B2 (en) | 1973-02-19 | 1973-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS527281B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11024598B2 (en) | 2016-08-22 | 2021-06-01 | Senju Metal Industry Co., Ltd. | Metallic sintered bonding body and die bonding method |
-
1973
- 1973-02-19 JP JP48019989A patent/JPS527281B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11024598B2 (en) | 2016-08-22 | 2021-06-01 | Senju Metal Industry Co., Ltd. | Metallic sintered bonding body and die bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49108902A (en) | 1974-10-16 |