JPS5312785B2 - - Google Patents

Info

Publication number: JPS5312785B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP586974A

Other languages

Japanese (ja)

Other versions

JPS50103276A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-01-11

Filing date

1974-01-11

Publication date

1978-05-04

1974-01-11 Application filed filed Critical

1974-01-11 Priority to JP586974A priority Critical patent/JPS5312785B2/ja

1975-08-15 Publication of JPS50103276A publication Critical patent/JPS50103276A/ja

1978-05-04 Publication of JPS5312785B2 publication Critical patent/JPS5312785B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP586974A 1974-01-11 1974-01-11 Expired JPS5312785B2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP586974A JPS5312785B2 (en)	1974-01-11	1974-01-11

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP586974A JPS5312785B2 (en)	1974-01-11	1974-01-11

Publications (2)

Publication Number	Publication Date
JPS50103276A JPS50103276A (en)	1975-08-15
JPS5312785B2 true JPS5312785B2 (en)	1978-05-04

Family

ID=11622935

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP586974A Expired JPS5312785B2 (en)	1974-01-11	1974-01-11

Country Status (1)

Country	Link
JP (1)	JPS5312785B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2020184338A1 (en) *	2019-03-08	2020-09-17	株式会社新川	Wire bonding device

1974
- 1974-01-11 JP JP586974A patent/JPS5312785B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS50103276A (en)	1975-08-15

Publication	Publication Date	Title
DK139498C (en)	1979-08-06
FI751236A7 (en)	1975-10-27
FI366474A7 (en)	1975-09-06
JPS5312785B2 (en)	1978-05-04
AU7459074A (en)	1976-04-29
AU7462274A (en)	1976-04-29
FI221674A7 (en)	1976-01-20
DK141377A (en)	1977-03-31
DE2415134A1 (en)	1975-09-25
AU6599874A (en)	1975-08-28
BG19828A1 (en)	1975-10-30
BG19694A1 (en)	1975-10-10
DD112138A1 (en)	1975-03-20
DD112016A1 (en)	1975-03-12
CH977675A4 (en)	1977-07-15
CH589458A5 (en)	1977-07-15
CH587767A5 (en)	1977-05-13
CH581510A5 (en)	1976-11-15
BG19999A1 (en)	1975-10-30
BG19959A1 (en)	1975-10-30
BG19927A1 (en)	1975-10-30
BG19878A1 (en)	1975-10-30
BG19872A1 (en)	1975-10-30
DD113403A1 (en)	1975-06-05
BG19825A1 (en)	1975-10-30