JPS5313950B2 - - Google Patents
Info
- Publication number
- JPS5313950B2 JPS5313950B2 JP2187772A JP2187772A JPS5313950B2 JP S5313950 B2 JPS5313950 B2 JP S5313950B2 JP 2187772 A JP2187772 A JP 2187772A JP 2187772 A JP2187772 A JP 2187772A JP S5313950 B2 JPS5313950 B2 JP S5313950B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Dicing (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2187772A JPS5313950B2 (en) | 1972-03-02 | 1972-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2187772A JPS5313950B2 (en) | 1972-03-02 | 1972-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4890478A JPS4890478A (en) | 1973-11-26 |
| JPS5313950B2 true JPS5313950B2 (en) | 1978-05-13 |
Family
ID=12067341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2187772A Expired JPS5313950B2 (en) | 1972-03-02 | 1972-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5313950B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0642496B2 (en) * | 1984-02-20 | 1994-06-01 | 東芝精機株式会社 | Die bonding machine |
| JPS6282008A (en) * | 1985-10-04 | 1987-04-15 | 三菱電機株式会社 | Breaking device for semiconductor wafer |
-
1972
- 1972-03-02 JP JP2187772A patent/JPS5313950B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4890478A (en) | 1973-11-26 |