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JPS55133451A - Semicured silicone rubber molded article - Google Patents
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JPS55133451A - Semicured silicone rubber molded article - Google Patents

Semicured silicone rubber molded article

Info

Publication number
JPS55133451A
JPS55133451A JP4017279A JP4017279A JPS55133451A JP S55133451 A JPS55133451 A JP S55133451A JP 4017279 A JP4017279 A JP 4017279A JP 4017279 A JP4017279 A JP 4017279A JP S55133451 A JPS55133451 A JP S55133451A
Authority
JP
Japan
Prior art keywords
semicured
vinyl group
molded article
000cst
viscosity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4017279A
Other languages
Japanese (ja)
Other versions
JPS601892B2 (en
Inventor
Katsumi Horimuki
Norihiko Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP4017279A priority Critical patent/JPS601892B2/en
Publication of JPS55133451A publication Critical patent/JPS55133451A/en
Publication of JPS601892B2 publication Critical patent/JPS601892B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

PURPOSE: The title semicured molded article usable for insulating tapes, free from surface tack, comprising a specific diorganopolysiloxane, vinyl group-containing organopolysiloxane, organohydrogenpolysiloxane, etc.
CONSTITUTION: (A) 100pts.wt. of a diorganopolysiloxane having a viscosity ≥1,000,000cSt (at 25°C) of the average composition formula I, is mixed with (B) 5W80pts.wt. of a vinyl group-containing organopolysiloxane of formula II having two or more vinyl groups and a viscosity of 100W500,000cSt (at 25°C), (C) a liquid organohydrogenpolysiloxane of formula III having 3 or more Si-H bonds in one molecule in an amount to give 0.5W1.2 hydrogen atoms per vinyl group of (B), (D) 10W200pts.wt. of an inorganic filler, (E) a catalytic amount, calculated as Pt of 5W1,000ppm, of platinum or its compound, and (F) 0.01W15pts.wt. of an organic peroxide. The resulting mixture is then incorporated with 0.1W5pts.wt. of a blowing agent and semicured at room temperatureW80°C.
COPYRIGHT: (C)1980,JPO&Japio
JP4017279A 1979-04-03 1979-04-03 Semi-cured silicone rubber molded products Expired JPS601892B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4017279A JPS601892B2 (en) 1979-04-03 1979-04-03 Semi-cured silicone rubber molded products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4017279A JPS601892B2 (en) 1979-04-03 1979-04-03 Semi-cured silicone rubber molded products

Publications (2)

Publication Number Publication Date
JPS55133451A true JPS55133451A (en) 1980-10-17
JPS601892B2 JPS601892B2 (en) 1985-01-18

Family

ID=12573343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4017279A Expired JPS601892B2 (en) 1979-04-03 1979-04-03 Semi-cured silicone rubber molded products

Country Status (1)

Country Link
JP (1) JPS601892B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191902A (en) * 1981-05-21 1982-11-25 Hitachi Cable Thermal conductive insulating sheet
US4463127A (en) * 1982-01-16 1984-07-31 Bayer Aktiengesellschaft Crosslinkable graft polymer dispersion of organopolysiloxanes containing hydrogen-siloxane groups and Si-vinyl groups
JPH03119061A (en) * 1989-09-30 1991-05-21 Shiigeru:Kk Preparation of gel porous material and silicone gel porous material
JPH0436355A (en) * 1990-05-31 1992-02-06 Toray Dow Corning Silicone Co Ltd Silicone rubber composition
JPH04220463A (en) * 1990-03-15 1992-08-11 General Electric Co <Ge> Transparent silicone coating material which prevents splinter scattering
US5160670A (en) * 1990-06-25 1992-11-03 Dow Corning Toray Silicone Co., Ltd. Method of manufacturing silicone rubber moldings
JPH0565414A (en) * 1991-09-05 1993-03-19 Toshiba Silicone Co Ltd Thermosetting silicone rubber composition, rubber laminate using the same, and method for producing the same
JP2007024948A (en) * 2005-07-12 2007-02-01 Konica Minolta Business Technologies Inc Separating device, toner fixing device, and image forming apparatus
JP2011526648A (en) * 2008-06-26 2011-10-13 ダウ・コーニング・コーポレイション Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate
JP2018510240A (en) * 2015-03-31 2018-04-12 ロジャーズ コーポレーション Dual temperature curable silicone composition, method of manufacture, and article prepared therefrom

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191902A (en) * 1981-05-21 1982-11-25 Hitachi Cable Thermal conductive insulating sheet
US4463127A (en) * 1982-01-16 1984-07-31 Bayer Aktiengesellschaft Crosslinkable graft polymer dispersion of organopolysiloxanes containing hydrogen-siloxane groups and Si-vinyl groups
JPH03119061A (en) * 1989-09-30 1991-05-21 Shiigeru:Kk Preparation of gel porous material and silicone gel porous material
JPH04220463A (en) * 1990-03-15 1992-08-11 General Electric Co <Ge> Transparent silicone coating material which prevents splinter scattering
JPH0436355A (en) * 1990-05-31 1992-02-06 Toray Dow Corning Silicone Co Ltd Silicone rubber composition
US5160670A (en) * 1990-06-25 1992-11-03 Dow Corning Toray Silicone Co., Ltd. Method of manufacturing silicone rubber moldings
JPH0565414A (en) * 1991-09-05 1993-03-19 Toshiba Silicone Co Ltd Thermosetting silicone rubber composition, rubber laminate using the same, and method for producing the same
JP2007024948A (en) * 2005-07-12 2007-02-01 Konica Minolta Business Technologies Inc Separating device, toner fixing device, and image forming apparatus
JP2011526648A (en) * 2008-06-26 2011-10-13 ダウ・コーニング・コーポレイション Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate
JP2015110740A (en) * 2008-06-26 2015-06-18 ダウ・コーニング・コーポレイション Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate
JP2018510240A (en) * 2015-03-31 2018-04-12 ロジャーズ コーポレーション Dual temperature curable silicone composition, method of manufacture, and article prepared therefrom
JP2021152185A (en) * 2015-03-31 2021-09-30 ロジャーズ コーポレーション Dual temperature curable silicone compositions, methods of manufacture, and articles prepared therefrom
US11530305B2 (en) 2015-03-31 2022-12-20 Rogers Corporation Dual temperature curable silicone compositions, methods of manufacture, and articles prepared therefrom

Also Published As

Publication number Publication date
JPS601892B2 (en) 1985-01-18

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