JPS5545316B2 - - Google Patents
Info
- Publication number
- JPS5545316B2 JPS5545316B2 JP12682877A JP12682877A JPS5545316B2 JP S5545316 B2 JPS5545316 B2 JP S5545316B2 JP 12682877 A JP12682877 A JP 12682877A JP 12682877 A JP12682877 A JP 12682877A JP S5545316 B2 JPS5545316 B2 JP S5545316B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12682877A JPS5461050A (en) | 1977-10-24 | 1977-10-24 | Metal brazing alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12682877A JPS5461050A (en) | 1977-10-24 | 1977-10-24 | Metal brazing alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5461050A JPS5461050A (en) | 1979-05-17 |
| JPS5545316B2 true JPS5545316B2 (en) | 1980-11-17 |
Family
ID=14944915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12682877A Granted JPS5461050A (en) | 1977-10-24 | 1977-10-24 | Metal brazing alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5461050A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125855A1 (en) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | Lead-free solder alloy, solder material, and joined structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008221330A (en) * | 2007-03-16 | 2008-09-25 | Fuji Electric Holdings Co Ltd | Solder alloy |
-
1977
- 1977-10-24 JP JP12682877A patent/JPS5461050A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125855A1 (en) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | Lead-free solder alloy, solder material, and joined structure |
| JPWO2015125855A1 (en) * | 2014-02-24 | 2017-03-30 | 株式会社弘輝 | Lead-free solder alloy, solder material and joint structure |
| US9764430B2 (en) | 2014-02-24 | 2017-09-19 | Koki Company Limited | Lead-free solder alloy, solder material and joined structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5461050A (en) | 1979-05-17 |