JPS5550503B2 - - Google Patents
Info
- Publication number
- JPS5550503B2 JPS5550503B2 JP8895673A JP8895673A JPS5550503B2 JP S5550503 B2 JPS5550503 B2 JP S5550503B2 JP 8895673 A JP8895673 A JP 8895673A JP 8895673 A JP8895673 A JP 8895673A JP S5550503 B2 JPS5550503 B2 JP S5550503B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8895673A JPS5550503B2 (en) | 1973-08-08 | 1973-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8895673A JPS5550503B2 (en) | 1973-08-08 | 1973-08-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5037898A JPS5037898A (en) | 1975-04-08 |
| JPS5550503B2 true JPS5550503B2 (en) | 1980-12-18 |
Family
ID=13957293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8895673A Expired JPS5550503B2 (en) | 1973-08-08 | 1973-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5550503B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1111141B (en) * | 1979-02-16 | 1986-01-13 | Faulin Antonio | ATTACHMENT STRUCTURE FOR SKI |
| JPS58128757A (en) * | 1982-01-27 | 1983-08-01 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
| JPS5922001A (en) * | 1982-07-28 | 1984-02-04 | Sumitomo Bakelite Co Ltd | Lens or prism made of epoxy resin |
| JPS61101526A (en) * | 1984-10-23 | 1986-05-20 | Toyobo Co Ltd | Curable resin composition |
| JP3344228B2 (en) * | 1996-07-29 | 2002-11-11 | 松下電工株式会社 | Epoxy resin composition for laminated board |
| JP4779221B2 (en) * | 2001-03-29 | 2011-09-28 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| JP4607544B2 (en) * | 2004-10-29 | 2011-01-05 | サンスター技研株式会社 | Two-part sealer composition |
| JP6166568B2 (en) * | 2013-03-28 | 2017-07-19 | 四日市合成株式会社 | Epoxy resin composition, method for producing the same, and cured epoxy resin |
-
1973
- 1973-08-08 JP JP8895673A patent/JPS5550503B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5037898A (en) | 1975-04-08 |