JPS555873B2 - - Google Patents
Info
- Publication number
- JPS555873B2 JPS555873B2 JP2351574A JP2351574A JPS555873B2 JP S555873 B2 JPS555873 B2 JP S555873B2 JP 2351574 A JP2351574 A JP 2351574A JP 2351574 A JP2351574 A JP 2351574A JP S555873 B2 JPS555873 B2 JP S555873B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2351574A JPS555873B2 (en) | 1974-02-28 | 1974-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2351574A JPS555873B2 (en) | 1974-02-28 | 1974-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50116955A JPS50116955A (en) | 1975-09-12 |
| JPS555873B2 true JPS555873B2 (en) | 1980-02-12 |
Family
ID=12112573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2351574A Expired JPS555873B2 (en) | 1974-02-28 | 1974-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS555873B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010068005A (en) * | 2009-12-22 | 2010-03-25 | Hitachi Chem Co Ltd | Method of manufacturing multilayer printed wiring board |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2561692B2 (en) * | 1988-03-24 | 1996-12-11 | 日立化成工業株式会社 | Method for manufacturing single-sided printed wiring board |
| JPH01287989A (en) * | 1988-05-14 | 1989-11-20 | Matsushita Electric Works Ltd | Manufacture of printed wiring board |
| US4918812A (en) * | 1988-06-29 | 1990-04-24 | International Business Machines Corporation | Processing of cores for circuit boards or cards |
| JPH0756909B2 (en) * | 1988-11-30 | 1995-06-14 | 新神戸電機株式会社 | Method and apparatus for manufacturing single-sided printed circuit board and metal foil-clad laminate used for the manufacturing |
| JP2009253219A (en) * | 2008-04-10 | 2009-10-29 | Denka Agsp Kk | Method of manufacturing wiring board |
| JP2010056165A (en) * | 2008-08-26 | 2010-03-11 | Denso Corp | Method of manufacturing conductor pattern film |
-
1974
- 1974-02-28 JP JP2351574A patent/JPS555873B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010068005A (en) * | 2009-12-22 | 2010-03-25 | Hitachi Chem Co Ltd | Method of manufacturing multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50116955A (en) | 1975-09-12 |