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JPS557751B2 - - Google Patents
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JPS557751B2 - - Google Patents

Info

Publication number
JPS557751B2
JPS557751B2 JP1351674A JP1351674A JPS557751B2 JP S557751 B2 JPS557751 B2 JP S557751B2 JP 1351674 A JP1351674 A JP 1351674A JP 1351674 A JP1351674 A JP 1351674A JP S557751 B2 JPS557751 B2 JP S557751B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1351674A
Other versions
JPS50117413A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1351674A priority Critical patent/JPS557751B2/ja
Publication of JPS50117413A publication Critical patent/JPS50117413A/ja
Publication of JPS557751B2 publication Critical patent/JPS557751B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Diaphragms For Electromechanical Transducers (AREA)
JP1351674A 1974-01-31 1974-01-31 Expired JPS557751B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1351674A JPS557751B2 (ja) 1974-01-31 1974-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1351674A JPS557751B2 (ja) 1974-01-31 1974-01-31

Publications (2)

Publication Number Publication Date
JPS50117413A JPS50117413A (ja) 1975-09-13
JPS557751B2 true JPS557751B2 (ja) 1980-02-28

Family

ID=11835302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1351674A Expired JPS557751B2 (ja) 1974-01-31 1974-01-31

Country Status (1)

Country Link
JP (1) JPS557751B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10913191B2 (en) 2014-12-15 2021-02-09 Besi Netherlands B.V. Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10913191B2 (en) 2014-12-15 2021-02-09 Besi Netherlands B.V. Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product

Also Published As

Publication number Publication date
JPS50117413A (ja) 1975-09-13

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