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JPS5583244A - Wire bonding apparatus - Google Patents
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JPS5583244A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS5583244A
JPS5583244A JP15726178A JP15726178A JPS5583244A JP S5583244 A JPS5583244 A JP S5583244A JP 15726178 A JP15726178 A JP 15726178A JP 15726178 A JP15726178 A JP 15726178A JP S5583244 A JPS5583244 A JP S5583244A
Authority
JP
Japan
Prior art keywords
gold wire
capillary
height
clamp
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15726178A
Other languages
Japanese (ja)
Other versions
JPS5917974B2 (en
Inventor
Tatsuo Imaizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP53157261A priority Critical patent/JPS5917974B2/en
Publication of JPS5583244A publication Critical patent/JPS5583244A/en
Publication of JPS5917974B2 publication Critical patent/JPS5917974B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To stably obtain a loop of a gold wire by a wire bonding apparatus by holding the gold wire at a clamp and lowering the wire while lowering a capillary from its uppermost limit to predetermined height in a step of transferring from a ball bonding to its stitch bonding step, and retaining it as it is until the stitch bonding step is completed.
CONSTITUTION: After a ball is bonded to a gold wire 6, a capillary 2 is raised in height a, and then horizontally moved at a distance c. Then, a clamp 5 is closed, and the gold wire is lowered at a distance d in synchronization with the capillary 2. Then, only the capillary is further lowered to stitch bond it and returned to its original position. At this time the clamp 5 is opened, the gold wire is raised in synchronization with the capillary. Then, the clamp 5 is closed to then melt to cut the gold wire 6 by a torch. When the length L of the gold wire is so selected as to become L=a-d+c according to this configuration, a loop of height b of the gold wire is obtained, while when the height a is increased, it can prevent the gold wire from buckling and lowering the height of the loop to thereby stably form a loop of the gold wire.
COPYRIGHT: (C)1980,JPO&Japio
JP53157261A 1978-12-19 1978-12-19 wire bonding equipment Expired JPS5917974B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53157261A JPS5917974B2 (en) 1978-12-19 1978-12-19 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53157261A JPS5917974B2 (en) 1978-12-19 1978-12-19 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS5583244A true JPS5583244A (en) 1980-06-23
JPS5917974B2 JPS5917974B2 (en) 1984-04-24

Family

ID=15645777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53157261A Expired JPS5917974B2 (en) 1978-12-19 1978-12-19 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS5917974B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418858A (en) * 1981-01-23 1983-12-06 Miller C Fredrick Deep bonding methods and apparatus
JPH01151182A (en) * 1987-12-08 1989-06-13 Matsushita Electric Ind Co Ltd Formation of electrical connection contact
US5090119A (en) * 1987-12-08 1992-02-25 Matsushita Electric Industrial Co., Ltd. Method of forming an electrical contact bump

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418858A (en) * 1981-01-23 1983-12-06 Miller C Fredrick Deep bonding methods and apparatus
JPH01151182A (en) * 1987-12-08 1989-06-13 Matsushita Electric Ind Co Ltd Formation of electrical connection contact
US5090119A (en) * 1987-12-08 1992-02-25 Matsushita Electric Industrial Co., Ltd. Method of forming an electrical contact bump

Also Published As

Publication number Publication date
JPS5917974B2 (en) 1984-04-24

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