JPS5599719A - Heat treatment jig of wafer - Google Patents
Heat treatment jig of waferInfo
- Publication number
- JPS5599719A JPS5599719A JP710179A JP710179A JPS5599719A JP S5599719 A JPS5599719 A JP S5599719A JP 710179 A JP710179 A JP 710179A JP 710179 A JP710179 A JP 710179A JP S5599719 A JPS5599719 A JP S5599719A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- heat treatment
- support
- supporting members
- shape grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE: To support wafers stably without damaging them in a wafer supporting jig for wafer heat treatment for the production of semiconductor devices by arranging supporting members so that V shape grooves may come to positions to support a wafer by four bisymmetrical points not higher than its center at the highest.
CONSTITUTION: Bar shape supporting members 2a, 2b, 2c and 2d on which V shape grooves 1a, 1b ... are formed at prescribed intervals are connected with connecting members 3a, 3b ... arranging and fixing the supporting members so that the V shape grooves may come to positions to support a wafer 4 by four points A, B, C and D which are lower than its center 0 at the highest and are symmetrical with respect to line Y-Y which passes point 0.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP710179A JPS5599719A (en) | 1979-01-26 | 1979-01-26 | Heat treatment jig of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP710179A JPS5599719A (en) | 1979-01-26 | 1979-01-26 | Heat treatment jig of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5599719A true JPS5599719A (en) | 1980-07-30 |
Family
ID=11656683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP710179A Pending JPS5599719A (en) | 1979-01-26 | 1979-01-26 | Heat treatment jig of wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5599719A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138142A (en) * | 1981-01-14 | 1982-08-26 | Northern Telecom Ltd | Method and device for coating semiconductor wafer |
| JPS61171242U (en) * | 1985-04-11 | 1986-10-24 | ||
| JPS61190128U (en) * | 1985-05-20 | 1986-11-27 | ||
| JPH02142633U (en) * | 1989-05-08 | 1990-12-04 | ||
| JP2003047811A (en) * | 2001-08-08 | 2003-02-18 | Toyobo Co Ltd | Electret filter medium and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037355A (en) * | 1973-08-06 | 1975-04-08 | ||
| JPS5164867A (en) * | 1974-12-03 | 1976-06-04 | Tokyo Shibaura Electric Co | Handotaisochino seizosochi |
-
1979
- 1979-01-26 JP JP710179A patent/JPS5599719A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037355A (en) * | 1973-08-06 | 1975-04-08 | ||
| JPS5164867A (en) * | 1974-12-03 | 1976-06-04 | Tokyo Shibaura Electric Co | Handotaisochino seizosochi |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138142A (en) * | 1981-01-14 | 1982-08-26 | Northern Telecom Ltd | Method and device for coating semiconductor wafer |
| JPS61171242U (en) * | 1985-04-11 | 1986-10-24 | ||
| JPS61190128U (en) * | 1985-05-20 | 1986-11-27 | ||
| JPH02142633U (en) * | 1989-05-08 | 1990-12-04 | ||
| JP2003047811A (en) * | 2001-08-08 | 2003-02-18 | Toyobo Co Ltd | Electret filter medium and method for manufacturing the same |
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