JPS5612231B2 - - Google Patents
Info
- Publication number
- JPS5612231B2 JPS5612231B2 JP11385273A JP11385273A JPS5612231B2 JP S5612231 B2 JPS5612231 B2 JP S5612231B2 JP 11385273 A JP11385273 A JP 11385273A JP 11385273 A JP11385273 A JP 11385273A JP S5612231 B2 JPS5612231 B2 JP S5612231B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11385273A JPS5612231B2 (en) | 1973-10-12 | 1973-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11385273A JPS5612231B2 (en) | 1973-10-12 | 1973-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5064897A JPS5064897A (en) | 1975-06-02 |
| JPS5612231B2 true JPS5612231B2 (en) | 1981-03-19 |
Family
ID=14622669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11385273A Expired JPS5612231B2 (en) | 1973-10-12 | 1973-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5612231B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007141997A (en) * | 2005-11-16 | 2007-06-07 | Denso Corp | Semiconductor substrate cutting apparatus and semiconductor substrate cutting method |
| KR20210078417A (en) * | 2019-12-18 | 2021-06-28 | 구로사와 겐세츠 가부시키가이샤 | Method of introducing prestress to beam-column joint of pc structure in triaxial compression |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2831280B2 (en) * | 1994-09-16 | 1998-12-02 | 株式会社富士電機総合研究所 | Laser processing equipment |
| JP7704604B2 (en) * | 2021-07-21 | 2025-07-08 | 株式会社ディスコ | Laser processing equipment |
-
1973
- 1973-10-12 JP JP11385273A patent/JPS5612231B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007141997A (en) * | 2005-11-16 | 2007-06-07 | Denso Corp | Semiconductor substrate cutting apparatus and semiconductor substrate cutting method |
| KR20210078417A (en) * | 2019-12-18 | 2021-06-28 | 구로사와 겐세츠 가부시키가이샤 | Method of introducing prestress to beam-column joint of pc structure in triaxial compression |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5064897A (en) | 1975-06-02 |