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JPS5639076B2 - - Google Patents
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JPS5639076B2 - - Google Patents

Info

Publication number
JPS5639076B2
JPS5639076B2 JP10078178A JP10078178A JPS5639076B2 JP S5639076 B2 JPS5639076 B2 JP S5639076B2 JP 10078178 A JP10078178 A JP 10078178A JP 10078178 A JP10078178 A JP 10078178A JP S5639076 B2 JPS5639076 B2 JP S5639076B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10078178A
Other versions
JPS5527647A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10078178A priority Critical patent/JPS5527647A/ja
Priority to US06/066,822 priority patent/US4238385A/en
Priority to DE2933251A priority patent/DE2933251B2/de
Publication of JPS5527647A publication Critical patent/JPS5527647A/ja
Publication of JPS5639076B2 publication Critical patent/JPS5639076B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP10078178A 1978-08-17 1978-08-17 Paint for forming insulating film of conductive printed circuit board and method of forming insulating film Granted JPS5527647A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10078178A JPS5527647A (en) 1978-08-17 1978-08-17 Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
US06/066,822 US4238385A (en) 1978-08-17 1979-08-14 Coating composition for forming insulating film on electroconductive substrate for printed circuits and method therefor
DE2933251A DE2933251B2 (de) 1978-08-17 1979-08-16 Beschichtungsmasse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10078178A JPS5527647A (en) 1978-08-17 1978-08-17 Paint for forming insulating film of conductive printed circuit board and method of forming insulating film

Publications (2)

Publication Number Publication Date
JPS5527647A JPS5527647A (en) 1980-02-27
JPS5639076B2 true JPS5639076B2 (ja) 1981-09-10

Family

ID=14282997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10078178A Granted JPS5527647A (en) 1978-08-17 1978-08-17 Paint for forming insulating film of conductive printed circuit board and method of forming insulating film

Country Status (3)

Country Link
US (1) US4238385A (ja)
JP (1) JPS5527647A (ja)
DE (1) DE2933251B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043264U (ja) * 1983-08-25 1985-03-27 ダイコク電機株式会社 パチンコ球計数器
JPS6363481A (ja) * 1986-09-04 1988-03-19 株式会社　ソフイア 遊戯球交換装置
JP2008519468A (ja) * 2004-11-11 2008-06-05 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 改良されたバイアデザインを有する単層または多層プリント回路基板

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55123192A (en) * 1979-03-15 1980-09-22 Akai Electric Electronic circuit board
DE3044447C2 (de) * 1980-11-26 1982-12-09 Basf Farben + Fasern Ag, 2000 Hamburg Verfahren zum Beschichten eines als Kathode geschalteten elektrisch leitfähigen Substrates und wässrige Dispersion dafür
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
US4592816A (en) 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process
JPS62226695A (ja) * 1986-03-24 1987-10-05 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 回路ボ−ドの製造方法
US5004672A (en) * 1989-07-10 1991-04-02 Shipley Company Inc. Electrophoretic method for applying photoresist to three dimensional circuit board substrate
US5202222A (en) * 1991-03-01 1993-04-13 Shipley Company Inc. Selective and precise etching and plating of conductive substrates
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
US6824959B2 (en) 2002-06-27 2004-11-30 Ppg Industries Ohio, Inc. Process for creating holes in polymeric substrates
AU2003248743A1 (en) * 2002-06-27 2004-01-19 Ppg Industries Ohio, Inc. Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
US20100300884A1 (en) * 2009-05-26 2010-12-02 Wd Media, Inc. Electro-deposited passivation coatings for patterned media
JP5606211B2 (ja) * 2010-08-09 2014-10-15 株式会社シミズ 電着塗料用樹脂組成物、水性電着塗料、塗装方法および塗装物
JP5606212B2 (ja) * 2010-08-09 2014-10-15 株式会社シミズ 着色した電着塗料用樹脂組成物、水性電着塗料、塗装方法および塗装物
CN103282830B (zh) 2010-12-14 2016-06-22 株式会社钟化 新颖的感光性树脂组合物及其利用
WO2013111481A1 (ja) * 2012-01-25 2013-08-01 株式会社カネカ 新規な顔料含有絶縁膜用樹脂組成物及びその利用
CN104293094A (zh) * 2014-09-17 2015-01-21 明光市锐创电气有限公司 一种用于空调内部变压器的绝缘漆
CA3199506A1 (en) * 2020-12-18 2022-06-23 Corey James DEDOMENIC Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450655A (en) * 1965-04-09 1969-06-17 Ransburg Electro Coating Corp Non-aqueous suspension for electrophoretically coating articles comprising a pigment and an organic-solventsoluble thermosetting resin
US3377699A (en) * 1965-05-03 1968-04-16 Western Electric Co Fluidized bed coating a core containing metal board, including circuit forming, core wiring and connecting steps
JPS5140585B2 (ja) * 1971-10-06 1976-11-04
US3934334A (en) * 1974-04-15 1976-01-27 Texas Instruments Incorporated Method of fabricating metal printed wiring boards
US4007154A (en) * 1975-08-01 1977-02-08 Ppg Industries, Inc. Novel pigment paste for cationic electrodeposition
JPS5335163A (en) * 1976-09-14 1978-04-01 Hitachi Chemical Co Ltd Method of producing printed circuit board substrate having through hole from metallic material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043264U (ja) * 1983-08-25 1985-03-27 ダイコク電機株式会社 パチンコ球計数器
JPS6363481A (ja) * 1986-09-04 1988-03-19 株式会社　ソフイア 遊戯球交換装置
JP2008519468A (ja) * 2004-11-11 2008-06-05 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 改良されたバイアデザインを有する単層または多層プリント回路基板

Also Published As

Publication number Publication date
DE2933251A1 (de) 1980-07-03
JPS5527647A (en) 1980-02-27
US4238385A (en) 1980-12-09
DE2933251B2 (de) 1981-06-19

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