JPS5645491B2 - - Google Patents
Info
- Publication number
- JPS5645491B2 JPS5645491B2 JP12445477A JP12445477A JPS5645491B2 JP S5645491 B2 JPS5645491 B2 JP S5645491B2 JP 12445477 A JP12445477 A JP 12445477A JP 12445477 A JP12445477 A JP 12445477A JP S5645491 B2 JPS5645491 B2 JP S5645491B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12445477A JPS5458795A (en) | 1977-10-19 | 1977-10-19 | Preparation of curing agent for epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12445477A JPS5458795A (en) | 1977-10-19 | 1977-10-19 | Preparation of curing agent for epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5458795A JPS5458795A (en) | 1979-05-11 |
| JPS5645491B2 true JPS5645491B2 (en) | 1981-10-27 |
Family
ID=14885911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12445477A Granted JPS5458795A (en) | 1977-10-19 | 1977-10-19 | Preparation of curing agent for epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5458795A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235865B1 (en) | 1998-07-02 | 2001-05-22 | Shin-Etsu Chemical Co., Ltd. | Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition |
| US7268191B2 (en) | 2003-12-04 | 2007-09-11 | Nitto Denko Corporation | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5387329A (en) * | 1977-01-10 | 1978-08-01 | Sumitomo Chem Co Ltd | Preparation of hydroperoxide |
| JPS56112924A (en) * | 1980-02-13 | 1981-09-05 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
| JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
| MY123645A (en) * | 1999-07-22 | 2006-05-31 | Sumitomo Bakelite Co | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
| JP2001348488A (en) * | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | Thermal conductive resin composition, prepreg, heat dissipating circuit board and heat dissipating heat generating component |
-
1977
- 1977-10-19 JP JP12445477A patent/JPS5458795A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235865B1 (en) | 1998-07-02 | 2001-05-22 | Shin-Etsu Chemical Co., Ltd. | Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition |
| US7268191B2 (en) | 2003-12-04 | 2007-09-11 | Nitto Denko Corporation | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5458795A (en) | 1979-05-11 |