JPS5731667B2 - - Google Patents

Info

Publication number: JPS5731667B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP12554676A

Other languages

Japanese (ja)

Other versions

JPS5271681A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-10-22

Filing date

1976-10-21

Publication date

1982-07-06

1976-10-21 Application filed filed Critical

1977-06-15 Publication of JPS5271681A publication Critical patent/JPS5271681A/en

1982-07-06 Publication of JPS5731667B2 publication Critical patent/JPS5731667B2/ja

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

JP51125546A 1975-10-22 1976-10-21 Method of forming printed circuit unit Granted JPS5271681A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB43289/75A GB1497312A (en)	1975-10-22	1975-10-22	Production of printed circuit arrangements

Publications (2)

Publication Number	Publication Date
JPS5271681A JPS5271681A (en)	1977-06-15
JPS5731667B2 true JPS5731667B2 (en)	1982-07-06

Family

ID=10428105

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP51125546A Granted JPS5271681A (en)	1975-10-22	1976-10-21	Method of forming printed circuit unit

Country Status (5)

Country	Link
JP (1)	JPS5271681A (en)
AU (1)	AU498261B2 (en)
DE (1)	DE2645947C2 (en)
GB (1)	GB1497312A (en)
ZA (1)	ZA765930B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4472238A (en) *	1983-12-05	1984-09-18	E. I. Du Pont De Nemours And Company	Process using plasma for forming conductive through-holes through a dielectric layer
US4501638A (en) *	1983-12-05	1985-02-26	E. I. Du Pont De Nemours And Company	Liquid chemical process for forming conductive through-holes through a dielectric layer
US4517050A (en) *	1983-12-05	1985-05-14	E. I. Du Pont De Nemours And Company	Process for forming conductive through-holes through a dielectric layer
RU2138140C1 (en) *	1998-11-30	1999-09-20	Самарцев Николай Борисович	Method for manufacturing hybrid integrated circuits and printed-circuit boards on polymeric substrate
DE202014006674U1 (en) *	2014-08-20	2015-11-23	Automotive Lighting Reutlingen Gmbh	Printed circuit board for vehicle lighting devices
CN112235951B (en) *	2020-10-20	2021-09-21	盐城维信电子有限公司	Method for manufacturing circuit boards with different copper thicknesses

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3319317A (en) *	1963-12-23	1967-05-16	Ibm	Method of making a multilayered laminated circuit board
US3268653A (en) *	1964-04-29	1966-08-23	Ibm	Printed circuit board with solder resistant coating in the through-hole connectors
US3471631A (en) *	1968-04-03	1969-10-07	Us Air Force	Fabrication of microminiature multilayer circuit boards
US3871930A (en) *	1973-12-19	1975-03-18	Texas Instruments Inc	Method of etching films made of polyimide based polymers

1975
- 1975-10-22 GB GB43289/75A patent/GB1497312A/en not_active Expired
1976
- 1976-10-04 ZA ZA765930A patent/ZA765930B/en unknown
- 1976-10-12 DE DE2645947A patent/DE2645947C2/en not_active Expired
- 1976-10-13 AU AU18624/76A patent/AU498261B2/en not_active Expired
- 1976-10-21 JP JP51125546A patent/JPS5271681A/en active Granted

Also Published As

Publication number	Publication date
DE2645947A1 (en)	1977-04-28
AU498261B2 (en)	1979-02-22
GB1497312A (en)	1978-01-05
JPS5271681A (en)	1977-06-15
DE2645947C2 (en)	1983-01-27
AU1862476A (en)	1978-04-20
ZA765930B (en)	1977-09-28

Publication	Publication Date	Title
USB545777I5 (en)	1976-01-27
FR2332289B1 (en)	1980-04-25
JPS564516B2 (en)	1981-01-30
FI52674B (en)	1977-08-01
JPS5731667B2 (en)	1982-07-06
CS170564B1 (en)	1976-09-15
FR2314052B1 (en)	1980-05-16
FR2299108B1 (en)	1981-03-20
JPS5546078Y2 (en)	1980-10-28
JPS5216944U (en)	1977-02-05
JPS5511582Y2 (en)	1980-03-13
JPS5138122Y1 (en)	1976-09-18
JPS5152372Y1 (en)	1976-12-15
JPS5630200B2 (en)	1981-07-13
JPS51156988U (en)	1976-12-14
JPS51141546U (en)	1976-11-15
CS171614B1 (en)	1976-10-29
JPS5255938U (en)	1977-04-22
JPS5253789U (en)	1977-04-18
CS171616B1 (en)	1976-10-29
JPS5216872U (en)	1977-02-05
JPS5197757A (en)	1976-08-27
JPS5272202U (en)	1977-05-30
JPS51105790A (en)	1976-09-18
JPS51121041U (en)	1976-10-01