JPS5810827B2 - Manufacturing method for airtight terminals - Google Patents
Manufacturing method for airtight terminalsInfo
- Publication number
- JPS5810827B2 JPS5810827B2 JP13122478A JP13122478A JPS5810827B2 JP S5810827 B2 JPS5810827 B2 JP S5810827B2 JP 13122478 A JP13122478 A JP 13122478A JP 13122478 A JP13122478 A JP 13122478A JP S5810827 B2 JPS5810827 B2 JP S5810827B2
- Authority
- JP
- Japan
- Prior art keywords
- pipe lead
- nickel plating
- plating layer
- glass
- outer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000005394 sealing glass Substances 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【発明の詳細な説明】
本発明は先端部が圧潰扁平化されたパイプリードと金属
外環とをガラスを介して気密かつ絶縁して封着してなる
気密端子の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an airtight terminal in which a pipe lead whose tip is crushed and flattened and a metal outer ring are hermetically and insulatedly sealed via glass.
中電力用の整流器の容器の一部として用いられる気密端
子として、第１図に示す構造のものは公知である。As an airtight terminal used as a part of a container of a rectifier for medium power, a structure shown in FIG. 1 is known.
図において、１は鉄・ニッケル合金等よりなるパイプリ
ードで、上端部に圧潰扁平部２を有し、その中央に透孔
３を有する。In the figure, 1 is a pipe lead made of iron-nickel alloy, etc., which has a crushed flat part 2 at its upper end and a through hole 3 at its center.
４は鉄等よりなる金属外環で、前記パイプリード１と金
属外環４とはソーダバリウムガラス等の封着ガラス５を
介して気密かつ絶縁して封着されている。Reference numeral 4 denotes a metal outer ring made of iron or the like, and the pipe lead 1 and the metal outer ring 4 are sealed in an airtight and insulated manner via a sealing glass 5 such as soda barium glass.
従来、この種の気密端子は第２図Ａないし第２図Ｆのよ
うにして製造されていた。Conventionally, this type of hermetic terminal has been manufactured as shown in FIGS. 2A to 2F.
すなわち、長尺のパイプを適宜の長さに切断したパイプ
リード部材１′を用意しく第２図Ａ）、その一端部を圧
潰して扁平部２を形成しく第２図Ｂ）、扁平部２の中央
部に透孔３を形成してパイプリード１を製作する（第２
図Ｃ）。That is, prepare a pipe lead member 1' made by cutting a long pipe into an appropriate length (Fig. 2A), and crush one end thereof to form a flat part 2 (Fig. 2B). A through hole 3 is formed in the center of the pipe lead 1 (second step).
Figure C).
次に、このパイプリード１を、グラファイト製の封着治
具６を用いて、金属外環４およびガラスタブレット５′
とともに所定の関係位置に組み立て、ガラスタブレット
５′の溶融温度以上に加熱する（第２図Ｄ）。Next, the pipe lead 1 is attached to the metal outer ring 4 and the glass tablet 5' using a sealing jig 6 made of graphite.
The glass tablet 5' is then assembled in a predetermined position with the glass tablet 5' and heated to a temperature above the melting temperature of the glass tablet 5' (FIG. 2D).
すると、パイプリード１と金属外環４とが封着ガラス５
を介して封着される（第２図Ｅ）。Then, the pipe lead 1 and the metal outer ring 4 are bonded to the sealing glass 5.
(Fig. 2E).
次に、パイプリード１を前処理液で処理して清浄化した
のち、パイプリード１内に銀ロウ粒７を入れて再び加熱
して、パイプリード１の圧潰扁平部２を銀ロウにより気
密に封止する（第２図Ｆ）。Next, after the pipe lead 1 is treated with a pre-treatment liquid to clean it, silver solder grains 7 are put into the pipe lead 1 and heated again, and the crushed flat part 2 of the pipe lead 1 is made airtight with silver solder. Seal (Figure 2F).
しかしながら、上述の方法では、ガラスタブレット５′
の溶融のための加熱工程と、銀ロウ付けのための加熱工
程との２回の加熱工程が必要となり煩雑である。However, in the above method, the glass tablet 5'
The heating process is complicated because it requires two heating processes: one for melting the silver and the other for silver brazing.
のみならず、銀ロウ付けの前処理液がパイプリード１の
隅部にまで到達していないと、銀ロウ付けが不完全とな
って気密性が悪くなったり、あるいは前記前処理液がパ
イプリード１の隅部から扱は切っていないと、発錆の原
因となる。In addition, if the pretreatment liquid for silver brazing does not reach the corners of the pipe lead 1, the silver brazing may be incomplete and the airtightness may deteriorate, or the pretreatment liquid may not reach the corners of the pipe lead 1. If you do not handle the parts starting from the corners, it may cause rust.
さらには錬ロウ粒７の入れ忘れによる気密不良発生や、
銀ロウ粒７の入れ過ぎおよびパイプリード１の途中への
引掛りによるパイブレード１の奥行き寸法不足の不良等
が発生しやすいといった問題点があった。In addition, airtightness may occur due to forgetting to add Renwa grains 7,
There are problems in that defects such as insufficient depth of the pie blade 1 are likely to occur due to overfilling of the silver solder grains 7 and the pipe lead 1 getting caught in the middle.
それゆえ、本発明の主たる目的は、銀ロウ粒を不要にし
、しかもパイプリードおよび金属外環のガラス封着と、
パイプリードのロウ付けとを一回の加熱工程のみで行な
い得る気密端子の製造方法を提供することにある。Therefore, the main object of the present invention is to eliminate the need for silver solder grains, and to improve glass sealing of pipe leads and metal outer rings.
It is an object of the present invention to provide a method for manufacturing an airtight terminal in which brazing of a pipe lead can be performed in only one heating step.
本発明は要約すると、直円筒状のパイプリード部材の全
面に無電解ニッケルメッキを施し、その一端を圧潰して
扁平部を形成したパイプリードから露出している無電解
ニッケルメッキ層を除去したのち、封着治具を用いて金
属外環およびガラスタブレットと組み合せて加熱するこ
とを特徴とする。To summarize, the present invention applies electroless nickel plating to the entire surface of a right cylindrical pipe lead member, and then removes the electroless nickel plating layer exposed from the pipe lead by crushing one end to form a flat part. , which is characterized by heating the metal outer ring and the glass tablet in combination using a sealing jig.
本発明の上述の目的およびその他の目的と特徴は、図面
を参照して行なう以下の詳細な説明から一層明らかとな
ろう。The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.
第３図Ａないし第３図Ｇは本発明の一実施例の製造方法
を説明するための各工程の縦断面図を示す。FIGS. 3A to 3G are longitudinal cross-sectional views of each process for explaining a manufacturing method according to an embodiment of the present invention.
まず、長尺の鉄・ニッケル合金等よりなるパイプを適宜
の長さに切断したパイプリード部材１０′を用意しく第
３図Ａ）、表面を清浄化したのちその全面に３〜１０μ
程度の無電解ニッケルメッキ層１１を形成しく第３図Ｂ
）、その一端を圧潰して扁平部１２を形成しく第３図Ｃ
）、さらにこの扁平部１２の略中央部に透孔１３を形成
してパイプリード１０を製作する（第３図Ｄ）。First, prepare a pipe lead member 10' made by cutting a long pipe made of iron/nickel alloy, etc. to an appropriate length (Fig. 3A), clean the surface, and then apply a 3-10μ
To form an electroless nickel plating layer 11 of approximately
), one end of which is crushed to form a flat part 12.
), and further, a through hole 13 is formed approximately in the center of this flat portion 12 to manufacture the pipe lead 10 (FIG. 3D).
次にこのパイプリード１０から露出している無電解ニッ
ケルメッキ層１１を除去しく第３図Ｅ）、しかるのち、
このパイプリード１０を、グラファイト製の封着治具１
６を用いて、鉄等よりなる金属外環１４と、ソーダバリ
ウムガラス等の封着ガラスの微粉末を有機バインダと混
練し造粒後所定形状にプレス成型しさらに仮焼して有機
バインダを焼き飛ばしたガラスタブレット１５′と共に
所定の関係位置に組み立て、中性または弱還元性雰囲気
中で１０００℃程度に加熱する（第３図Ｆ）。Next, the electroless nickel plating layer 11 exposed from the pipe lead 10 is removed (Fig. 3E), and then,
This pipe lead 10 is connected to a graphite sealing jig 1.
6, a metal outer ring 14 made of iron or the like and fine powder of sealing glass such as soda barium glass are kneaded with an organic binder, granulated, press-molded into a predetermined shape, and further calcined to bake the organic binder. It is assembled together with the blown glass tablet 15' in a predetermined position and heated to about 1000° C. in a neutral or weakly reducing atmosphere (FIG. 3F).
すると、ガラスタブレット１５′が溶融してパイプリー
ド１０と金属外環１４とが封着ガラス１５によって気密
かつ絶縁して封着されるとともに、パイプリード１０の
圧潰扁平部１２に挾持内在されている無電解ニッケルメ
ッキ層１１が溶融して圧潰扁平部１２の内面全面がロウ
付けされて気密端子が得られる（第３図Ｇ）。Then, the glass tablet 15' is melted, and the pipe lead 10 and the metal outer ring 14 are sealed airtightly and insulated by the sealing glass 15, and the tablet 15' is sandwiched and contained in the flattened flat part 12 of the pipe lead 10. The electroless nickel plating layer 11 is melted and the entire inner surface of the crushed flat portion 12 is brazed to obtain an airtight terminal (FIG. 3G).
上述の本発明の製造方法に従えば、一回の加熱工程で、
パイプリード１０と金属外環１４とを封着ガラス１５に
より気密かつ絶縁して封着できるとともに、パイプリー
ド１０の圧潰扁平部１２のロウ付けができ、しかも銀ロ
ウ粒の挿入が不要なので、著しく製造が容易となる。According to the manufacturing method of the present invention described above, in one heating step,
The pipe lead 10 and the metal outer ring 14 can be sealed airtightly and insulated by the sealing glass 15, and the crushed flat part 12 of the pipe lead 10 can be brazed, and there is no need to insert silver solder grains, which is extremely convenient. Manufacturing becomes easier.
のみならず、銀ロウ粒を用いるものに比し、銀ロウ粒の
入れ忘れや入れ過ぎあるいはパイプリードの中途への引
掛り等による不都合が皆無となり、しかも圧潰扁平部１
２の内面全面力釦つ付けされるので、気密性および信頼
性の高い気密端子が得られるという効果を奏する。Not only that, compared to those that use silver solder grains, there are no inconveniences such as forgetting to add silver solder grains, putting in too much silver solder grains, or getting caught in the middle of the pipe lead.
Since the inner surface of No. 2 is fully pressed, an airtight terminal with high airtightness and reliability can be obtained.
なお、パイプリードの露出している無電解ニッケルメッ
キ層１１を除去するのは、無電解ニッケルメッキ層１１
の溶融物がグラファイトとくっ付き易い性質を有するの
で、パイプリードをグラファイト製の封着治具を用いて
金属外環１４およびガラスタブレット１５′と組み合せ
て加熱する際、パイプリードの表面の無電解ニッケルメ
ッキ層１１が溶融してグラファイト製の封着治具１６と
固着するのを防止するためである。Note that the electroless nickel plating layer 11 that is exposed on the pipe lead is removed by removing the electroless nickel plating layer 11 that is exposed on the pipe lead.
Since the molten material tends to stick to graphite, when heating the pipe lead in combination with the metal outer ring 14 and the glass tablet 15' using a graphite sealing jig, the surface of the pipe lead is electroless. This is to prevent the nickel plating layer 11 from melting and sticking to the graphite sealing jig 16.
上記実施例は、単一のパイプリード１０が金属外環１４
の中央部に封着された整流器用の気密端子に本発明の製
造方法を適用した場合について説明したが、本発明はゲ
ート端子用の小径のパイプリードをも備えるＳＣＲ，Ｔ
ＲＩＡＣ等の３端子サイリスク用の気密端子の製造にも
適用できるものである。In the above embodiment, the single pipe lead 10 has a metal outer ring 14.
The case where the manufacturing method of the present invention is applied to an airtight terminal for a rectifier sealed in the central part of the SCR, T
It can also be applied to the manufacture of airtight terminals for 3-terminal cyrisks such as RIAC.
第１図は整流器用の気密端子の縦断面図、第２図Ａない
し第２図Ｆは第１図の気密端子の従来の製造方法を説明
するための各段階の縦断面図、第３図Ａないし第３図Ｇ
は第１図の気密端子の本発明による製造方法を説明する
ための各段階の縦断面図である。
１０……パイプリード、１０′……パイプリ一ド部材、
１１……無電解ニッケルメッキ層、１２……圧潰扁平部
、１３……透孔、１４……金属外環、１５……封着ガラ
ス、１５′……ガラスタブレツト、１６……封着治具。Fig. 1 is a longitudinal sectional view of an airtight terminal for a rectifier, Figs. 2A to 2F are longitudinal sectional views of each stage of the conventional manufacturing method of the airtight terminal of Fig. 1, and Fig. 3 A to Figure 3G
1A and 1B are longitudinal cross-sectional views of each step of the method for manufacturing the airtight terminal of FIG. 1 according to the present invention. 10...Pipe lead, 10'...Pipe lead member,
11...Electroless nickel plating layer, 12...Crushed flat part, 13...Through hole, 14...Metal outer ring, 15...Sealing glass, 15'...Glass tablet, 16...Sealing treatment Ingredients.
Claims (1)
メッキ層を形成する工程と、その一部を圧潰して扁平部
を有するパイプリードを製作する工程と、このパイプリ
ードから露出している無電解ニッケルメッキ層を除去す
る工程と、このパイプリードを封着治具を用いて金属外
環およびガラスタブレットと共に組み立てる工程と、全
体をガラスタブレットおよび無電解ニッケルメッキ層の
融点以上の温度で加熱してパイプリードと金属外環とを
封着ガラスを介して封着するとともにパイプリードの圧
潰扁平部をロウ付けする工程とを含む気密端子の製造方
法。1. A process of forming an electroless nickel plating layer on the entire surface of a cylindrical pipe lead member, a process of crushing a part of it to produce a pipe lead with a flat part, and a process of forming an electroless nickel plating layer on the entire surface of a cylindrical pipe lead member. A process of removing the nickel plating layer, a process of assembling this pipe lead together with the metal outer ring and the glass tablet using a sealing jig, and heating the whole at a temperature higher than the melting point of the glass tablet and the electroless nickel plating layer. A method for manufacturing an airtight terminal, which includes the steps of sealing a pipe lead and a metal outer ring via a sealing glass, and brazing the flattened portion of the pipe lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13122478A JPS5810827B2 (en) | 1978-10-25 | 1978-10-25 | Manufacturing method for airtight terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13122478A JPS5810827B2 (en) | 1978-10-25 | 1978-10-25 | Manufacturing method for airtight terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5557284A JPS5557284A (en) | 1980-04-26 |
| JPS5810827B2 true JPS5810827B2 (en) | 1983-02-28 |
Family
ID=15052925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13122478A Expired JPS5810827B2 (en) | 1978-10-25 | 1978-10-25 | Manufacturing method for airtight terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810827B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109192A (en) * | 1983-11-17 | 1985-06-14 | 関西日本電気株式会社 | Method of producing airtight terminal |
-
1978
- 1978-10-25 JP JP13122478A patent/JPS5810827B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5557284A (en) | 1980-04-26 |
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