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JPS5813512B2 - Fukugo Ceramitsukukogu - Google Patents
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JPS5813512B2 - Fukugo Ceramitsukukogu - Google Patents

Fukugo Ceramitsukukogu

Info

Publication number
JPS5813512B2
JPS5813512B2 JP50115231A JP11523175A JPS5813512B2 JP S5813512 B2 JPS5813512 B2 JP S5813512B2 JP 50115231 A JP50115231 A JP 50115231A JP 11523175 A JP11523175 A JP 11523175A JP S5813512 B2 JPS5813512 B2 JP S5813512B2
Authority
JP
Japan
Prior art keywords
ceramic
cemented carbide
al2o3
cutting
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50115231A
Other languages
Japanese (ja)
Other versions
JPS5239508A (en
Inventor
原昭夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP50115231A priority Critical patent/JPS5813512B2/en
Publication of JPS5239508A publication Critical patent/JPS5239508A/en
Publication of JPS5813512B2 publication Critical patent/JPS5813512B2/en
Expired legal-status Critical Current

Links

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  • Ceramic Products (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)
  • Powder Metallurgy (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)

Description

【発明の詳細な説明】 Al2O3を主成分とする、いわゆるセラミック工具は
WCを主成分とする超硬合金やTiCを主成分とする超
硬合金、いわゆるサーメットに比べて高温における機械
的性質がすぐれているため、高速切削用の工具材料とし
て使われている。
[Detailed Description of the Invention] So-called ceramic tools mainly composed of Al2O3 have superior mechanical properties at high temperatures compared to cemented carbide mainly composed of WC, cemented carbide mainly composed of TiC, and so-called cermets. Because of this, it is used as a tool material for high-speed cutting.

Al2O3セラミックスの欠点は逆に脆いことである。The disadvantage of Al2O3 ceramics is that they are brittle.

従って仕上げ加工の如くあまり大きな負荷のかからない
ところに使われて来た。
Therefore, it has been used in areas where heavy loads are not applied, such as finishing machining.

しかし最近の工作機械の進歩や、労働環境の変化に伴な
い、セラミック工具に期待される負荷は厳しくなって来
ている。
However, with recent advances in machine tools and changes in the working environment, the loads expected of ceramic tools are becoming more severe.

すなわち切削速度の増大切削断面積の増加、さらには水
溶性切削油の使用の増加に伴なう切削刃先温度の向上、
刃先にかかる応力の増加、熱衝撃の増加が著しい。
In other words, an increase in cutting speed, an increase in cutting cross-sectional area, and an increase in cutting edge temperature due to an increase in the use of water-soluble cutting oil.
There is a significant increase in stress and thermal shock on the cutting edge.

これらの期待負荷に対して現状のAl2O3基セラミッ
クは充分答え得ていない。
The current Al2O3-based ceramics have not been able to adequately meet these expected loads.

本発明はかかる観点から、より厳しい負荷に耐えられる
セラミック工具を提供せんとするものである。
From this point of view, the present invention aims to provide a ceramic tool that can withstand even more severe loads.

本発明の第1の特徴はセラミックと超硬合金を層状に複
合したことにある。
The first feature of the present invention is that ceramic and cemented carbide are composited in layers.

超硬合金は高い剛性耐熱性、熱伝導性を有し、このよう
な複合チップの下地としては最適である。
Cemented carbide has high rigidity, heat resistance, and thermal conductivity, and is ideal as a base for such composite chips.

下地とセラミックの接合は耐熱性が要求される為拡散接
合するかまたは銅鑞もしくはこれより融点の高い鑞材を
使用する。
Heat resistance is required for bonding the base and ceramic, so diffusion bonding is used, or copper solder or a solder material with a higher melting point is used.

この場合セラミックと超硬合金の熱膨脹係数の差が大き
いと変形や、過度の熱応力による破壊をもたらす。
In this case, if the difference in coefficient of thermal expansion between the ceramic and the cemented carbide is large, deformation or destruction due to excessive thermal stress may occur.

本発明の第2の特徴はセラミックとしてSialonを
用いることにある。
The second feature of the present invention is that Sialon is used as the ceramic.

Sialonは熱衝撃に強いこと、耐酸化性に富むこと
、鋼との溶着性に優れることなどの切削工具として好ま
しい特徴を多く備えている。
Sialon has many desirable characteristics as a cutting tool, such as being resistant to thermal shock, having high oxidation resistance, and having excellent weldability to steel.

しかしSialonを使うことのもっと重要な意味はそ
の熱膨脹係数が超硬合金より低いことにある。
However, the more important reason for using Sialon is that its coefficient of thermal expansion is lower than that of cemented carbide.

Al2O3の熱膨脹係数は7.8×10−6でWC−C
o合金の(4.5〜7)×10−6より大きい。
The thermal expansion coefficient of Al2O3 is 7.8 x 10-6 and WC-C
It is larger than (4.5-7)×10-6 of o alloy.

従って高温で接合すると冷却時Al2O3に引張応力を
生じAl2O3が破壊してしまう。
Therefore, if bonded at high temperature, tensile stress will be generated in Al2O3 upon cooling, resulting in destruction of Al2O3.

Sialonはそれに対しSi6−0.75xAl0.
67xOxN8−xのxの値により異なるが、2.4×
10−6の熱膨脹係数の値をもつSi3N4のそれにほ
ぼ等しいかそれ以下である。
Sialon, on the other hand, is Si6-0.75xAl0.
It varies depending on the value of x in 67xOxN8-x, but it is 2.4x
It is approximately equal to or less than that of Si3N4, which has a coefficient of thermal expansion value of 10-6.

従って冷却時セラミックに圧縮応力が発生し、これがク
ラックの進展を抑制するという点からも工具として好ま
しい。
Therefore, compressive stress is generated in the ceramic when it is cooled, and this is preferable as a tool because it suppresses the propagation of cracks.

本発明の第3の特徴は複合チップに形状と寸法的制限を
設けたことである。
A third feature of the present invention is that shape and dimensional limitations are placed on the composite chip.

セラミック部と超硬合金との組合せは基本的には層状が
よい。
Basically, the combination of the ceramic part and the cemented carbide is preferably layered.

片面づけにするかサンドウィッチにするかはその用途に
依りどちらに決めても良い。
You can decide whether to serve it on one side or as a sandwich depending on the purpose.

超硬の全面をセラミックで被覆する形状とすることは好
ましくない。
It is not preferable to cover the entire surface of the cemented carbide with ceramic.

層状構造においてその一部にセラミックと超硬合金との
接合をより強くするため凹凸を設けることなどは随意で
ある。
It is optional to provide a portion of the layered structure with unevenness in order to strengthen the bond between the ceramic and the cemented carbide.

セラミック部の厚みは1mm以下が好ましく、性能上、
製造技術上好ましいのは0.5mm前後である1mm以
上の厚さでは複合チップとしての効果がみられなくなる
The thickness of the ceramic part is preferably 1 mm or less, and in terms of performance,
From the viewpoint of manufacturing technology, the preferred thickness is around 0.5 mm; if the thickness is 1 mm or more, the effect as a composite chip will no longer be seen.

下地の超硬合金の厚みは余りに薄いと強度的に補強の役
割を果たさなくなることの他、セラミックとの接合后の
冷却時複合チップがわん曲してしまい、セラミック部に
圧縮残留応力を残そうという意図に反して、逆にセラミ
ック部上面に引張の残留応力を発生させることになり好
ましくない。
If the thickness of the underlying cemented carbide is too thin, not only will it not play a reinforcing role in terms of strength, but the composite chip will bend when cooled after bonding with the ceramic, leaving compressive residual stress in the ceramic part. Contrary to this intention, tensile residual stress is generated on the upper surface of the ceramic portion, which is undesirable.

この点から少なくとも下地の超硬合金の厚みは3mm以
上は必要である。
From this point of view, it is necessary that the thickness of the base cemented carbide is at least 3 mm or more.

実施例 1 Al2O3粉末20、Si3N4粉末79.5、Y2O
3粉末0.5の割合で十分に混合したのちこれを178
0℃×30分200kg/cm2の荷重でホットプレス
しSialonの焼結体を作成した。
Example 1 Al2O3 powder 20, Si3N4 powder 79.5, Y2O
After thoroughly mixing the three powders at a ratio of 0.5 to 178
A sintered body of Sialon was prepared by hot pressing at 0° C. for 30 minutes at a load of 200 kg/cm 2 .

この焼結体からダイヤモンド切断機を用い14×14×
0.5mmの薄片を切り出した。
From this sintered body, 14×14× was cut using a diamond cutting machine.
A 0.5 mm thin section was cut out.

この薄片とWC−10%Co組成の超硬合金片(大きさ
12.7×12.7×3.8mm)の間に上記のSia
lon原料粉末とWC−Coを50’:50の重量比率
で混合した粉末を充填し、この全体を重ねて1500℃
×10分、200kg/cm2の荷重下にホットプレス
した。
The above-mentioned Sia
Filled with a powder made by mixing lon raw powder and WC-Co at a weight ratio of 50':50, the whole was stacked and heated to 1500℃.
Hot pressing was carried out for 10 minutes under a load of 200 kg/cm2.

冷却后この複合体を12.7×12.7mm×4.8m
mの形状に研削した。
After cooling, this composite is 12.7 x 12.7 mm x 4.8 m.
It was ground into the shape of m.

このチップを用いてSCM3(11s=40)を切削速
度350m/分、切込み2mm、送り0.36mm/回
転で水溶性切削油をかけながら15分間切削した。
Using this chip, SCM3 (11s=40) was cut for 15 minutes at a cutting speed of 350 m/min, depth of cut of 2 mm, and feed rate of 0.36 mm/rotation while applying water-soluble cutting oil.

この時の逃げ面摩耗量は0.3mmであった。一方普通
のAl2O3焼成チップは3分で欠損し切削不能となっ
た。
The flank wear amount at this time was 0.3 mm. On the other hand, the ordinary Al2O3 fired chip broke in 3 minutes and became uncuttable.

この点本複合チップは熱衝撃性に大変優れていることが
分った。
In this respect, the present composite chip was found to have excellent thermal shock resistance.

実施例 2 Al2O3粉末45、Si3N4粉末54、MgO粉末
1の割合で実施例1と同様の方法でSialonの焼成
体を作成した。
Example 2 A fired body of Sialon was produced in the same manner as in Example 1 using a ratio of 45 Al2O3 powder, 54 Si3N4 powder, and 1 MgO powder.

この焼結体から14×14×O.2mmの薄片を切り出
した。
From this sintered body, 14×14×O. A 2 mm thin section was cut out.

この薄片を上記混合粉末を下地とし更にWC−10%C
o粉末に重ねて1500℃×20分、200kg/cm
2の加圧焼成をした。
This thin piece was coated with the above mixed powder as a base, and further WC-10%C
o Layered on powder at 1500℃ x 20 minutes, 200kg/cm
2 pressure firing was performed.

冷却后この複合体を観察するとSialon層の厚みは
約0.5mmであり、その下にWC−10%Coを主成
分とする層が連続した二重層状になっていた。
When this composite was observed after cooling, it was found that the thickness of the Sialon layer was about 0.5 mm, and there was a continuous double-layered layer below which was composed mainly of WC-10% Co.

この複合体を12.7×12.7×4.8mmの形状に
研削した。
This composite was ground into a shape of 12.7 x 12.7 x 4.8 mm.

このチップを用いてSK5(Hs=38)を切削速度3
70m/mm、切込み2mm、送り0.40mm/回転
で水溶性切削油をかけながら連続切削試験を行ったとこ
ろ、第1表に示す通りの結果が得られた。
Using this tip, cut SK5 (Hs=38) at a cutting speed of 3
A continuous cutting test was conducted at 70 m/mm, depth of cut of 2 mm, and feed rate of 0.40 mm/rotation while applying water-soluble cutting oil, and the results shown in Table 1 were obtained.

本発明品の耐熱衝撃抵抗の優位性が立証されたThe superiority of the thermal shock resistance of the invented product was proven.

Claims (1)

【特許請求の範囲】[Claims] 1 厚さ1mm以下のSi6−0.75xAl0.67
xOxN8−xでxの最大値が6であるセラミックと、
厚さ3mm以上の超硬合金とが層状に接合されてなるこ
とを特徴とする複合セラミック工具。
1 Si6-0.75xAl0.67 with a thickness of 1 mm or less
A ceramic whose maximum value of x is 6 in xOxN8-x,
A composite ceramic tool characterized by being formed by joining cemented carbide with a thickness of 3 mm or more in layers.
JP50115231A 1975-09-23 1975-09-23 Fukugo Ceramitsukukogu Expired JPS5813512B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50115231A JPS5813512B2 (en) 1975-09-23 1975-09-23 Fukugo Ceramitsukukogu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50115231A JPS5813512B2 (en) 1975-09-23 1975-09-23 Fukugo Ceramitsukukogu

Publications (2)

Publication Number Publication Date
JPS5239508A JPS5239508A (en) 1977-03-26
JPS5813512B2 true JPS5813512B2 (en) 1983-03-14

Family

ID=14657584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50115231A Expired JPS5813512B2 (en) 1975-09-23 1975-09-23 Fukugo Ceramitsukukogu

Country Status (1)

Country Link
JP (1) JPS5813512B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006182597A (en) * 2004-12-27 2006-07-13 Noritake Co Ltd Silicon-based ceramic bonding material, bonded body, and manufacturing method thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336707Y2 (en) * 1973-11-28 1978-09-06
JPS58213678A (en) * 1982-06-01 1983-12-12 三菱マテリアル株式会社 Sialon base sintering material for cutting tool and abrasion-resistant tool
JPS61168577A (en) * 1985-01-21 1986-07-30 住友電気工業株式会社 Ceramic composite member
JPH0697127B2 (en) * 1985-01-23 1994-11-30 株式会社日立製作所 Air-cooled absorption heat pump
JPH05246444A (en) * 1991-04-08 1993-09-24 Hachiro Kikuchi Airtight bag body and manufacture thereof
JP2011157233A (en) * 2010-02-01 2011-08-18 Sumitomo Electric Ind Ltd Sintered compact, cutting tool using sintered compact and manufacturing method for sintered compact

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006182597A (en) * 2004-12-27 2006-07-13 Noritake Co Ltd Silicon-based ceramic bonding material, bonded body, and manufacturing method thereof

Also Published As

Publication number Publication date
JPS5239508A (en) 1977-03-26

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