JPS5814136B2 - Cross-linked polyethylene power cable connections - Google Patents
Cross-linked polyethylene power cable connectionsInfo
- Publication number
- JPS5814136B2 JPS5814136B2 JP13396879A JP13396879A JPS5814136B2 JP S5814136 B2 JPS5814136 B2 JP S5814136B2 JP 13396879 A JP13396879 A JP 13396879A JP 13396879 A JP13396879 A JP 13396879A JP S5814136 B2 JPS5814136 B2 JP S5814136B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- crosslinking agent
- power cable
- semiconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003020 cross-linked polyethylene Polymers 0.000 title claims description 10
- 239000004703 cross-linked polyethylene Substances 0.000 title claims description 10
- 239000003431 cross linking reagent Substances 0.000 claims description 18
- 238000010894 electron beam technology Methods 0.000 claims description 16
- 239000004698 Polyethylene Substances 0.000 claims description 13
- -1 polyethylene Polymers 0.000 claims description 13
- 229920000573 polyethylene Polymers 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Cable Accessories (AREA)
Description
【発明の詳細な説明】
本発明は、架橋ポリエチレン電力ケーブル接続部の改良
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in crosslinked polyethylene power cable connections.
架橋ポリエチレン電力ケーブル（以下ＣＶケーブルと称
す）用モールド式絶縁接続部は、接続部の外部半導電層
部を縁切りすることが循環電流を防止するために必要で
ある。Molded insulated connections for cross-linked polyethylene power cables (hereinafter referred to as CV cables) require edging of the outer semiconducting layer of the connection to prevent circulating currents.
この外部半導電層の縁切りを行う場合には、加熱モール
ド工程を別個に行うか、または一括して加熱するなどの
方法がある。When cutting the edges of this external semiconductive layer, there are methods such as performing a heat molding process separately or heating them all at once.
前者の場合は作業時間が大幅に長くなり、実線路の作業
には適さない面がある。In the former case, the working time is significantly longer and it is not suitable for working on actual railway lines.
また、後者の場合は、縁切りする外部半導電層の加熱モ
ールド時の変形が著しく電気的性能上改善を必要とする
。Moreover, in the latter case, the deformation of the outer semiconductive layer to be edged during heat molding is significant and requires improvement in terms of electrical performance.
本発明の目的は、絶縁層と縁切り部半導電層の変形を防
止できるとともに、絶縁層と外部半導電層との接着が良
好な架橋ポリエチレン電力ケーブル接続部を提供するこ
とにある。An object of the present invention is to provide a crosslinked polyethylene power cable connection part that can prevent deformation of the insulating layer and the edge-cut semiconductive layer and has good adhesion between the insulating layer and the external semiconductive layer.
本発明の架橋ポリエチレン電力ケーブル接続部は、ＣＶ
ケーブルの導体相互を接続する圧縮スリーブ外周に内部
半導電層を設け、この内部半導電層外側に絶縁層が形成
され、この絶縁層外周側に縁切り部を有する外部半導電
層が形成されてなり、上記絶縁層の内周側は架橋剤入り
ポリエチレンテープが巻回形成さ札外部半導電層の縁切
り部付近の絶縁層は電子線照射処理された架橋剤入り電
子線照射ポリエチレンテープが巻回形成され、内外半導
電層及び絶縁層が加熱モールドされ一体化されたもので
ある。The cross-linked polyethylene power cable connection of the present invention
An inner semiconducting layer is provided on the outer periphery of the compression sleeve that connects the conductors of the cable, an insulating layer is formed on the outer side of this inner semiconducting layer, and an outer semiconducting layer having an edge cut portion is formed on the outer periphery of this insulating layer. The inner circumferential side of the insulating layer is formed by winding polyethylene tape containing a crosslinking agent, and the insulating layer near the edge of the outer semiconductive layer of the tag is formed by winding an electron beam irradiated polyethylene tape containing a crosslinking agent that has been subjected to electron beam irradiation treatment. The inner and outer semiconducting layers and insulating layers are heat molded and integrated.
以下本発明の架橋ポリエチレン電力ケーブル接続部の一
実施例を図面により説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the crosslinked polyethylene power cable connection part of the present invention will be described below with reference to the drawings.
Ｃ■ケーブル１の導体相互間は圧縮スリーブ２を圧縮し
て接続され、圧縮スリーブ２の外周には内部半導電層３
が形成されている。C■ The conductors of the cable 1 are connected by compressing a compression sleeve 2, and an inner semiconductive layer 3 is provided on the outer periphery of the compression sleeve 2.
is formed.
内部半導電層３は、架橋剤入り半導電性テープを巻いて
所定の形状に仕上げるか、あるいは半導電性プレモール
ドユニットを被せるか、もしくは半導電性収縮チューブ
を被せるなどの手段により形成される。The internal semiconductive layer 3 is formed by winding a crosslinking agent-containing semiconductive tape to give it a predetermined shape, or by covering it with a semiconductive pre-molded unit, or by covering it with a semiconductive shrink tube. .
内部半導電層３の外側には絶縁テープを巻回した絶縁層
が形成されるが、この絶縁層の内周側の絶縁層４は架橋
剤入りポリエチレンテープが縁切り部８部分の外部半導
電層５付近まで巻回されている。An insulating layer with an insulating tape wound around it is formed on the outside of the inner semiconductive layer 3, and the insulating layer 4 on the inner circumferential side of this insulating layer is made of polyethylene tape containing a crosslinking agent as the outer semiconductive layer at the edge cut portion 8. It is wound around 5.
そして、縁切り部８の他方の外部半導電層６との間の外
周側の絶縁層７には架橋剤入りポリエチレンテープを電
子線照射処理した架橋剤入り電子線照射ポリエチレンテ
ープを巻回形成している。Then, an electron beam irradiated polyethylene tape containing a crosslinking agent is wound around the insulating layer 7 on the outer peripheral side between the edge cutting portion 8 and the other external semiconductive layer 6. There is.
また、外部半導電層５，６は、架橋剤入り半導電性ポリ
オレフインテープを電子線照射した架橋剤入り半導電性
電子線照射テープを巻いて成形されている。The outer semiconductive layers 5 and 6 are formed by wrapping a crosslinking agent-containing semiconductive electron beam irradiated tape obtained by irradiating a crosslinking agent-containing semiconductive polyolefin tape with an electron beam.
尚、絶縁層及び半導電層のテープの巻回順序は、絶縁層
４の架橋剤入りポリエチレンテープを全部巻回後、絶縁
層７の電子線照射処理された架橋剤入り電子線照射ポリ
エチレンテープを極く一部巻回し、次に架橋剤入り半導
電性ポリオレフインテープを電子線照射した架橋剤入り
半導電性電子線照射テープを巻いて外部半導電層５を形
成する。Note that the order of winding the tapes for the insulating layer and the semiconductive layer is that after all the polyethylene tape containing a crosslinking agent for the insulating layer 4 is wound, the electron beam irradiated polyethylene tape containing a crosslinking agent that has been subjected to electron beam irradiation treatment for the insulating layer 7 is wound. The outer semiconducting layer 5 is formed by winding only a portion of the tape, and then wrapping a crosslinking agent-containing semiconductive electron beam irradiated tape obtained by irradiating a crosslinking agent-containing semiconductive polyolefin tape with an electron beam.
そして、再び絶縁層７の電子線照射処理された架橋剤入
り電子線照射ポリエチレンテープの大部分を巻いた後、
外部半導電層５と同材料の架橋剤入り半導電性電子線照
射テープを巻回し、外部半導電層６を形成し、最後に絶
縁層７の電子線照射処理された架橋剤入り電子線照射ポ
リエチレンテープを縁切り部８の外部半導電層６の外周
に巻回してテープを巻終る。Then, after wrapping most of the electron beam irradiated polyethylene tape containing a crosslinking agent that has been subjected to electron beam irradiation treatment for the insulating layer 7 again,
A semiconductive electron beam irradiation tape containing a crosslinking agent made of the same material as the outer semiconducting layer 5 is wound to form an outer semiconducting layer 6, and finally an insulating layer 7 is irradiated with an electron beam containing a crosslinking agent and subjected to electron beam irradiation treatment. The polyethylene tape is wound around the outer periphery of the outer semiconductive layer 6 of the edge cut portion 8 to finish winding the tape.
このようにテープを巻回し、形成した接続部を加熱モー
ルドし一体化する。The tape is wound in this manner, and the formed connection portion is heat molded and integrated.
この加熱モールドの場合に、縁切り部８付近の絶縁層７
は、電子線照射処理された架橋剤入りポリエチレンテー
プが巻回されているので、加熱モールド時に軟くなるこ
とがなく、従って、従来のように変形を生じることがな
いため変形を防止でき、そして架橋剤入りポリエチレン
テープを用いているので絶縁層と外部半導電層との接着
がよくなる。In the case of this heating mold, the insulating layer 7 near the edge cut portion 8
Since the tape is wrapped with a polyethylene tape containing a crosslinking agent that has been treated with electron beam irradiation, it does not become soft during hot molding, and therefore does not deform as in the past, so it can prevent deformation. Since polyethylene tape containing a crosslinking agent is used, adhesion between the insulating layer and the external semiconductive layer is improved.
また、縁切り部外部半導電層の変形を防止でき、しかも
、作業も簡単容易である。Further, deformation of the outer semiconductive layer at the edge cutting portion can be prevented, and the work is simple and easy.
以上記述した如く本発明の架橋ポリエチレン電力ケーブ
ル接続部は、絶縁層及び縁切り部半導電層の変形を防止
できるとともに、絶縁層と外部半導電層との接着性を向
上することができる効果を有するものである。As described above, the cross-linked polyethylene power cable connection part of the present invention has the effect of preventing deformation of the insulating layer and the semiconductive layer at the edge cutting part, and improving the adhesiveness between the insulating layer and the external semiconductive layer. It is something.
図は本発明の架橋ポリエチレン電力ケーブル接続部の一
実施例の一部の断面図である。
１・・・ＣＶケーブル、２・・・圧縮スリーブ、３・・
・内部半導電層、４，７・・・絶縁層、５，６・・・外
部半導電層、８・・・縁切り部。The figure is a cross-sectional view of a portion of one embodiment of a cross-linked polyethylene power cable connection of the present invention. 1...CV cable, 2...compression sleeve, 3...
-Inner semiconducting layer, 4, 7... Insulating layer, 5, 6... Outer semiconducting layer, 8... Edge cutting portion.
Claims (1)
る圧縮スリーブ外周に内部半導電層を設け該内部半導電
層外側に絶縁層が形成され、該絶縁層外周側に縁切り部
を有する外部半導電層が形成されてなるケーブル接続部
において、上記絶縁層の内周側は架橋剤入りポリエチレ
ンテープが巻回形成され、外部半導電層の上記縁切り部
付近の絶縁層は電子線照射処理された架橋剤入り電子線
照射ポリエチレンテープが巻回形成され、内外半導電層
及び絶縁層が加熱モールドされ、一体化されたことを特
徴とする架橋ポリエチレン電力ケーブル接続部。1. An internal semiconductive layer is provided on the outer periphery of a compressed sleeve that connects the conductors of a cross-linked polyethylene power cable, an insulating layer is formed on the outside of the internal semiconductive layer, and an external semiconductive layer having an edge cut portion is formed on the outer periphery of the insulating layer. In the cable connection section, the inner circumferential side of the insulating layer is wound with a polyethylene tape containing a crosslinking agent, and the insulating layer near the edge cut portion of the outer semiconducting layer is a polyethylene tape containing a crosslinking agent that has been irradiated with an electron beam. A cross-linked polyethylene power cable connection part characterized in that a line-irradiated polyethylene tape is wound and formed, and an inner and outer semiconductive layer and an insulating layer are heat-molded and integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13396879A JPS5814136B2 (en) | 1979-10-17 | 1979-10-17 | Cross-linked polyethylene power cable connections |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13396879A JPS5814136B2 (en) | 1979-10-17 | 1979-10-17 | Cross-linked polyethylene power cable connections |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5658717A JPS5658717A (en) | 1981-05-21 |
| JPS5814136B2 true JPS5814136B2 (en) | 1983-03-17 |
Family
ID=15117284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13396879A Expired JPS5814136B2 (en) | 1979-10-17 | 1979-10-17 | Cross-linked polyethylene power cable connections |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814136B2 (en) |
-
1979
- 1979-10-17 JP JP13396879A patent/JPS5814136B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5658717A (en) | 1981-05-21 |
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