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JPS5815232B2 - Processing method using laser light - Google Patents
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JPS5815232B2 - Processing method using laser light - Google Patents

Processing method using laser light

Info

Publication number
JPS5815232B2
JPS5815232B2 JP51023938A JP2393876A JPS5815232B2 JP S5815232 B2 JPS5815232 B2 JP S5815232B2 JP 51023938 A JP51023938 A JP 51023938A JP 2393876 A JP2393876 A JP 2393876A JP S5815232 B2 JPS5815232 B2 JP S5815232B2
Authority
JP
Japan
Prior art keywords
light
workpiece
laser light
shielding plate
light shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51023938A
Other languages
Japanese (ja)
Other versions
JPS52107699A (en
Inventor
柿崎克行
長野幸隆
保科直美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP51023938A priority Critical patent/JPS5815232B2/en
Publication of JPS52107699A publication Critical patent/JPS52107699A/en
Publication of JPS5815232B2 publication Critical patent/JPS5815232B2/en
Expired legal-status Critical Current

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  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 この発明はたとえばCO2レーザ光により木材に彫刻を
施こす場合等に適用されるレーザ光による加工方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a processing method using a laser beam, which is applied, for example, to engraving wood with a CO2 laser beam.

一般に、木材等に彫刻を施こす場合、彫刻刃を用いて手
作業により行なう外、レーザ光による方法が知られてい
る。
Generally, when engraving wood or the like, methods using laser light are known as well as manual engraving using a carving blade.

しかしながら、手作業による方法は量産に適さず、また
、従来の、レーザ光による方法は、レーザ光あるいは被
加工物を、数値制御により互に交差するX軸及びY軸方
向に駆動して、被加工物に一定のパターンの加工(彫刻
)を施こすものであったから、複雑なパターンを加工す
る場合は数値制御のためのプログラミングが非常に煩雑
となり、かつ数値制御装置を使用するため加工装置自体
が高価となる欠点があった。
However, the manual method is not suitable for mass production, and the conventional method using laser light drives the laser light or the workpiece in the mutually intersecting X-axis and Y-axis directions by numerical control. Since processing (engraving) a certain pattern on the workpiece, programming for numerical control is extremely complicated when processing complex patterns, and since a numerical control device is used, the processing equipment itself is The disadvantage was that it was expensive.

この発明は、このような事情にかんがみてなされたもの
で、その目的とするところは、たとえば木材に彫刻を施
こす場合等において、安価な装置で容易に、かつ能率的
に量産することができるレーザ光による加工方法を提供
することにある。
This invention was made in view of these circumstances, and its purpose is to enable easy and efficient mass production using inexpensive equipment, for example when engraving wood. An object of the present invention is to provide a processing method using laser light.

以下、この発明を図に示す一実施例により説明する。The present invention will be explained below with reference to an embodiment shown in the drawings.

図中1は木材等の平板状の被加工物で、図示しない移動
テーブル上にセットされている。
In the figure, reference numeral 1 denotes a flat plate-shaped workpiece such as wood, which is set on a moving table (not shown).

上記被加工物1の上層(被加工面)1aには遮光板2が
載置されている。
A light shielding plate 2 is placed on the upper layer (worked surface) 1a of the workpiece 1. As shown in FIG.

この遮光板2はたとえば銅などの金属板よりなるもので
、この遮光板2には上記被加工物1に形成すべき一定パ
ターンの透光部3が設けられている。
This light-shielding plate 2 is made of a metal plate such as copper, and is provided with a certain pattern of light-transmitting portions 3 to be formed on the workpiece 1 .

この透光部3は、たとえば所定の形状にあげた孔である
This transparent portion 3 is, for example, a hole shaped into a predetermined shape.

そして、図示しないレーザ光発生装置より発生したCO
2レーザ光4を、レンズ5で収束して上記遮光板2の上
面で焦点外しのスポットとなるよう照射している。
CO generated from a laser beam generator (not shown)
2 laser beams 4 are converged by a lens 5 and irradiated to form an out-of-focus spot on the upper surface of the light shielding plate 2.

なお、被加工物1をセットしである前記移動テーブルは
互に交差する(たとえば直交する)X軸及びY軸方向に
移動可能となっていて、レーザ光4が遮光板2の全面に
わたって照射する範囲で走査するようになっている。
The moving table on which the workpiece 1 is set is movable in mutually intersecting (for example, perpendicular) X-axis and Y-axis directions, and the laser beam 4 irradiates the entire surface of the light shielding plate 2. It is designed to scan within a range.

このような構成であるから、移動テーブルをX軸及びY
軸方向に走査していくと、CO2レーザ光4が遮光板2
の上面を照射し、透光部3では、レーザ光4がその透光
部3を通して被加工面1aを照射して、被加工面1aに
図で示すような凹所6を形成する。
With this configuration, the moving table can be moved along the X and Y axes.
As it scans in the axial direction, the CO2 laser beam 4 hits the light shielding plate 2.
The upper surface of the laser beam 4 is irradiated onto the surface to be processed 1a through the light-transmitting portion 3, and a recess 6 as shown in the figure is formed in the surface to be processed 1a.

したがって、レーザ光4が遮光板2の全面を照射すると
、被加工面1aには遮光板に設けた透光部3と同一のパ
ターンが刻設される。
Therefore, when the entire surface of the light shielding plate 2 is irradiated with the laser beam 4, the same pattern as the transparent portion 3 provided on the light shielding plate is engraved on the processed surface 1a.

したがって、この方法によれば、従来の、レーザ光ある
いは被加工物を数値制御により駆動して被加工面に一定
のパターンの加工を施す場合に比して、数値制御のため
のプログラミングが不要であるとともに、レーザ光4を
遮光板2の全面に照射すればよいから作業性が優れ、か
つ、遮光板2は銅板に透光部3となる一定形状の孔をあ
げるだけでよいから、容易に、かつ安価に形成すること
ができる。
Therefore, this method does not require programming for numerical control compared to the conventional method in which a laser beam or workpiece is driven by numerical control to process a fixed pattern on the workpiece surface. In addition, the workability is excellent because the laser beam 4 only needs to be irradiated on the entire surface of the light shielding plate 2, and the light shielding plate 2 can be easily formed by simply making holes of a certain shape that will become the transparent parts 3 in the copper plate. , and can be formed at low cost.

また、数値制御装置のような高価な装置が不要であるか
ら、加工装置自体のコスト低下を図ることができる。
Furthermore, since expensive equipment such as a numerical control device is not required, the cost of the processing equipment itself can be reduced.

さらに、1枚の遮光板2をつくるだけで多数の被加工物
に一定のパターンを加工できるから、能率よく量産する
ことができる。
Furthermore, since it is possible to process a fixed pattern on a large number of workpieces by simply manufacturing one light shielding plate 2, mass production can be carried out efficiently.

また、遮光板2は被加工物1に密接しているので、レー
ザ加工中被加工物1から生じる飛散物が遮光板2の裏面
に付着せず透光部3を塞いでしまうような現象は生じな
いため、透光部3は常に清浄に保たれる。
In addition, since the light shielding plate 2 is in close contact with the workpiece 1, there is no possibility that scattered objects generated from the workpiece 1 during laser processing will not adhere to the back surface of the light shielding plate 2 and block the light-transmitting part 3. Since this does not occur, the transparent section 3 is always kept clean.

さらに遮光板2は熱伝導性、熱拡散率のよい銅になって
いるので、密接していることで熱の逃げがよく、遮光板
2の温度上昇が被加工物1の上記密接面に対して熱損傷
しない程度に低く押えられ熱変形が生じないことと併せ
て正確な加工を助ける効果を奏する。
Furthermore, since the light shielding plate 2 is made of copper with good thermal conductivity and thermal diffusivity, the close contact allows for good heat to escape, and the temperature rise of the light shielding plate 2 is caused by the above-mentioned close contact surface of the workpiece 1. It is held down low enough to avoid thermal damage, which prevents thermal deformation and helps in accurate machining.

なお、被加工物としては木材に限らず、合成樹脂その他
適宜選択することができる。
Note that the workpiece is not limited to wood, and may be appropriately selected from synthetic resin and others.

そして、この遮光板2は製作上の都合により複数枚を組
合わせて使用するようにしてもよい。
A plurality of light shielding plates 2 may be used in combination depending on manufacturing circumstances.

さらに、レーザ光としてはCO2レーザ光に限るもので
なく、また、レンズ5の位置を調節することにより、焦
点位置を被加工面1a上から外し被加工面1a上のスポ
ット径を大きくしてもよい。
Furthermore, the laser light is not limited to CO2 laser light, and by adjusting the position of the lens 5, the focal position can be removed from the surface to be processed 1a and the spot diameter on the surface to be processed 1a can be increased. good.

また、被加工物は固定し、レーザ光をX軸及びY軸方向
に走査するようにしてもよい。
Alternatively, the workpiece may be fixed and the laser beam may be scanned in the X-axis and Y-axis directions.

以上詳述したように、この発明は木材等に彫刻を施こす
場合、その他に適用できるもので、被加工面を一定パタ
ーンの透光部を有する遮光板にてマスキングし、その上
からレーザ光を互に交差するX軸及びY軸方向に走査し
て上記被加工面に一定のパターンの加工を施こすもので
あるから、これによって安価な装置で容易に、かつ能率
的に量産することができるレーザ光による加工方法を提
供できるものである。
As described in detail above, the present invention can be applied to engraving on wood, etc., in which the surface to be processed is masked with a light-shielding plate having a certain pattern of light-transmitting parts, and a laser beam is emitted from above. The machine scans the machine in the mutually intersecting X-axis and Y-axis directions to process a certain pattern on the surface to be machined, which makes it possible to mass-produce easily and efficiently using inexpensive equipment. It is possible to provide a processing method using a laser beam that can be used.

【図面の簡単な説明】[Brief explanation of the drawing]

図はこの発明の一実施例を示す要部断面図である。 1a・・・・・・被加工面、2・・・・・・遮光板、3
・−・・・・透光部、4・・・・・・C02レーザ光。
The figure is a sectional view of a main part showing an embodiment of the present invention. 1a... Processed surface, 2... Light shielding plate, 3
......Transparent part, 4...C02 laser light.

Claims (1)

【特許請求の範囲】[Claims] 1 被加工物上に、銅および銅程度の比較的熱伝導性の
よい金属からなり加工形状に対応するパターンを切欠し
てなる透光部を有する遮光板を密接する工程と、上記被
加工物とレーザ光とをX−Y方向に相対的に走査し上記
レーザ光を上記遮光板上に照射して上記透光部で形成さ
れるパターンを被加工物に対して加工する工程とを備え
ることを特徴とするレーザ光による加工方法。
1. A process in which a light-shielding plate made of copper or a metal with relatively good thermal conductivity such as copper and having a light-transmitting part formed by cutting out a pattern corresponding to the processing shape is brought into close contact with the workpiece, and the workpiece is and a step of processing the pattern formed by the light-transmitting portion on the workpiece by relatively scanning the laser light and the laser light in the X-Y direction and irradiating the light shielding plate with the laser light. A processing method using laser light characterized by:
JP51023938A 1976-03-05 1976-03-05 Processing method using laser light Expired JPS5815232B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51023938A JPS5815232B2 (en) 1976-03-05 1976-03-05 Processing method using laser light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51023938A JPS5815232B2 (en) 1976-03-05 1976-03-05 Processing method using laser light

Publications (2)

Publication Number Publication Date
JPS52107699A JPS52107699A (en) 1977-09-09
JPS5815232B2 true JPS5815232B2 (en) 1983-03-24

Family

ID=12124459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51023938A Expired JPS5815232B2 (en) 1976-03-05 1976-03-05 Processing method using laser light

Country Status (1)

Country Link
JP (1) JPS5815232B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050158B2 (en) * 1979-11-14 1985-11-07 大日本印刷株式会社 Bamboo decoration method
JPS56106899A (en) * 1980-01-08 1981-08-25 Toppan Printing Co Ltd Laser engraving method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52105025A (en) * 1976-02-28 1977-09-03 Kooken Yuugen Laser beam seal engraving method

Also Published As

Publication number Publication date
JPS52107699A (en) 1977-09-09

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