JPS5816575B2 - Manufacturing method of sealed relay - Google Patents
Manufacturing method of sealed relayInfo
- Publication number
- JPS5816575B2 JPS5816575B2 JP52045040A JP4504077A JPS5816575B2 JP S5816575 B2 JPS5816575 B2 JP S5816575B2 JP 52045040 A JP52045040 A JP 52045040A JP 4504077 A JP4504077 A JP 4504077A JP S5816575 B2 JPS5816575 B2 JP S5816575B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal block
- tape
- semi
- manufacturing
- relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【発明の詳細な説明】 この発明は密封リレーの製造方法に関する。[Detailed description of the invention] The present invention relates to a method of manufacturing a sealed relay.
。密封リレーはシールを施したリレーであって、接点等
が外部雰囲気の影響を受けないため、悪環境下で負荷の
開閉等を行うのに適したものであ′る。. Sealed relays are sealed relays whose contacts are not affected by the external atmosphere, making them suitable for opening and closing loads in adverse environments.
従来、このシールを行うには液状（溶融させた樹脂材料
、例えばエポキシ樹脂材料を、シールする間隙に流入さ
せるようにしていた。Conventionally, this sealing has been achieved by flowing a liquid (molten) resin material, such as an epoxy resin material, into the gap to be sealed.
しかしながら、この方法では樹脂材料を液状に保つこと
、および、所定箇所にこの液状の樹脂材料を流入させる
ことが煩雑で、作業性が悪く、また不必要な箇所に樹脂
を付着させてしまうこともあった。However, with this method, it is complicated to keep the resin material in a liquid state and to flow the liquid resin material into predetermined locations, resulting in poor workability and the possibility that the resin may adhere to unnecessary locations. there were.
最近では、このような点から、予めプリフオーノ・され
た固形の樹脂材料をシール箇所に取り付け、そののち熱
風炉等で熱処理することによってシールを行う方法が多
くとられるようになってきている。Recently, from this point of view, a method of sealing by attaching a solid resin material that has been preformed in advance to the sealing area and then heat-treating it in a hot air oven or the like has become popular.
この固形の樹脂材料は、例えばエポキシ樹脂のコンパウ
ンドを所定の型に入れ加圧等して半硬化させたものであ
る（以下半硬化型エポキシ樹脂ペレットとする）。This solid resin material is, for example, an epoxy resin compound placed in a predetermined mold and semi-cured by applying pressure or the like (hereinafter referred to as semi-cured epoxy resin pellets).
シールを行うには、このペレットを所定箇所に挿着等し
てそののち熱風炉等で熱硬化させればよいので、前述し
た液状のものでシールする場合に比して作業性が向上し
ている。To seal, the pellets can be inserted into a predetermined location and then heat-cured in a hot air oven, etc., so workability is improved compared to the case of sealing with a liquid material as described above. There is.
しかしながら、このペレットは衝撃に弱いため、挿着作
業時や保管時に割れてしまう場合があり、衝撃に対する
十分な配慮が要求される。However, these pellets are sensitive to impact and may break during insertion or storage, so sufficient consideration must be given to impact resistance.
この発明は、上記に鑑み、シールの方法を改善し、もっ
て作業性の向上およびコストダウンを図った密封、リレ
ーの製造方陣を提供することを目的とする。In view of the above, it is an object of the present invention to provide a sealing and relay manufacturing system that improves the sealing method and thereby improves workability and reduces costs.
以下、この発明の５，１実施例について説明する。Hereinafter, 5.1 embodiments of this invention will be described.
まず第１図に示すように、金顧４内に接着面を上にじて
絶縁テープ２２を配置し、この接着面上にエポキシ樹脂
のコンパウンド２１ａを堆積させる。First, as shown in FIG. 1, an insulating tape 22 is placed in the metal plate 4 with the adhesive surface facing upward, and an epoxy resin compound 21a is deposited on the adhesive surface.
つぎに、・第２図に示すようにこのコンパウンド２１ａ
を゛テープ２２と一体に加圧し、半硬化型エホキヒ樹ｍ
’７”レット２１ｂを成形する。Next, as shown in FIG.
Pressure is applied together with the tape 22 to form a semi-cured Ehokihi tree m.
A '7'' let 21b is formed.
このペレット２１］ｂおよびテープ２２は、第３図に示
すように金型、４から取り外してもテープ２２の粘着カ
ーによって一体に成っている。As shown in FIG. 3, the pellet 21]b and the tape 22 are kept together by the adhesive layer of the tape 22 even when removed from the mold 4.
なお、金型４にピン部材４１．４２を設けであるため（
第１図、第２図参照）ペレツ）２１ ｂおよびテープ２
２にはスリット状の穴２１１，２１２が形成される。Note that since the mold 4 is provided with pin members 41 and 42 (
See Figures 1 and 2) Peretz) 21 b and tape 2
Slit-like holes 211 and 212 are formed in 2.
つぎに、このようにして得たベレツｌ−２１ｂを第４図
に示すように、リレー１の端子台１２に挿着する。Next, the thus obtained bevel l-21b is inserted into the terminal block 12 of the relay 1, as shown in FIG.
すなわち、テープ２２を端子台１２と対向させながら、
穴２１１を端子片３１．３３１こ接合させ、また穴２１
２を端子片３２，３４に嵌合させていき、やがてテープ
２２が端子台１２に当接するまで、ペレット２１ｂを押
し込むのであるなお、第５図に示すように、ヨーク１３
、コイル１４、可動鉄片１５等の各部品を端子台１２に
取り付けたのち、この各部品を覆うようにこの端子台１
２にカバー１１を嵌着して、リレー１が構成されている
。That is, while the tape 22 is facing the terminal block 12,
The hole 211 is connected to the terminal piece 31.331, and the hole 21
2 into the terminal pieces 32 and 34, and then push the pellet 21b until the tape 22 comes into contact with the terminal block 12.As shown in FIG.
, the coil 14, the movable iron piece 15, etc., are attached to the terminal block 12, and then the terminal block 1 is attached so as to cover each of the components.
A relay 1 is constructed by fitting a cover 11 onto the relay 2.
最後に、熱風炉でペレツ１−２ｂを溶融させて、端子台
１２々カバー１１との間、および端子台１２と端子片３
１〜３４との間の空隙に流入させさらに熱して熱硬化さ
せる。Finally, melt the pellets 1-2b in a hot air oven, and melt the pellets 1-2b between the terminal block 12 and the cover 11, and between the terminal block 12 and the terminal piece 3.
1 to 34, and is further heated and thermosetted.
こうして、密封リレーが完成する。In this way, a sealed relay is completed.
なお、テープはこの熱硬化によって埋め込まれてしまう
が、絶縁テープであるから何ら支障がない。Note that although the tape is embedded due to this heat curing, there is no problem because it is an insulating tape.
以上、１実施例について説明したように、この発明によ
れば、テープの粘着面上にコンパウンドを堆積させたの
ち加圧成形するため成形が容易であり、また複雑な形状
の成形を行うことができる。As described above with respect to the first embodiment, according to the present invention, the compound is deposited on the adhesive surface of the tape and then pressure molded, so molding is easy and complex shapes can be molded. can.
また、このようにして得た半硬化型樹脂ペレットはテー
プによって補強されているため衝撃に強く、またクラッ
クが生じても全体としてはバラバラにならない。Furthermore, since the semi-cured resin pellets thus obtained are reinforced with tape, they are resistant to impact and do not fall apart as a whole even if cracks occur.
したがって、端子台に挿着するとき、または保管時の取
り扱いが容易で、作業性が向上し、コストダウンを図る
ことができる。Therefore, it is easy to handle when inserting into the terminal block or storing, improving workability and reducing costs.
なお、この発明は上記実施にのみ限定されるものではな
く、例えばコンパウンドをテープと一体に加圧してペレ
ットを成形せずに、コンパウンドのみを加圧してペレッ
トを成形し、このペレットに後からテープを接着するよ
うにしてもよい。Note that the present invention is not limited to the above-mentioned implementation. For example, instead of pressing the compound together with the tape to form a pellet, only the compound is pressed to form a pellet, and the tape is later applied to the pellet. may be glued.
第１図〜第５図はこの発明の１実施例に係る各工程をそ
れぞれ示す断面図である。
１・・・・・・リレー、１１・・・・・・カバー、１２
・・・・・・端子台、１３−・−−−−ヨーク、１４・
・・・・・コイル、１５・・・・・・可動鉄片、２１ａ
・・・・・・コンパウンド、２１ｂ・・・・・・半硬化
型エポキシ樹脂ペレット、２２・・・・・・テープ、３
１〜３４・・・・・・端子片、４・・・・・・金型。1 to 5 are cross-sectional views showing each process according to an embodiment of the present invention. 1...Relay, 11...Cover, 12
...Terminal block, 13----Yoke, 14-
... Coil, 15 ... Movable iron piece, 21a
... Compound, 21b ... Semi-cured epoxy resin pellet, 22 ... Tape, 3
1-34...Terminal piece, 4...Mold.
Claims (1)
うようにこの端子台にカバーを嵌合する工程と、熱硬化
性樹脂のコンパウンドを補強用テープの上に堆積させる
工程と−こあコンパウンドと補強用テープとを一体に加
圧して成形し半硬化型樹脂ペレットを得る工程と、この
半硬化型樹脂ペレットを前記端子台に配置した後この半
硬化型樹脂ペレットを熱硬化させてシールを行なう゛工
程とから成る密封リレーの製造方法。1 The process of attaching each component to the terminal block, the process of fitting a cover to the terminal block so as to cover each component, and the process of depositing thermosetting resin compound on the reinforcing tape. A process of pressurizing and molding the compound and reinforcing tape together to obtain a semi-cured resin pellet, and placing the semi-cured resin pellet on the terminal block and then heat-curing the semi-cured resin pellet to seal it. A method for manufacturing a sealed relay comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52045040A JPS5816575B2 (en) | 1977-04-19 | 1977-04-19 | Manufacturing method of sealed relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52045040A JPS5816575B2 (en) | 1977-04-19 | 1977-04-19 | Manufacturing method of sealed relay |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53129849A JPS53129849A (en) | 1978-11-13 |
| JPS5816575B2 true JPS5816575B2 (en) | 1983-03-31 |
Family
ID=12708237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52045040A Expired JPS5816575B2 (en) | 1977-04-19 | 1977-04-19 | Manufacturing method of sealed relay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5816575B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59114723A (en) * | 1982-12-22 | 1984-07-02 | 日本電気株式会社 | Enclosed electromagnetic relay |
-
1977
- 1977-04-19 JP JP52045040A patent/JPS5816575B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53129849A (en) | 1978-11-13 |
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