JPS5817494B2 - Phenol - Google Patents
PhenolInfo
- Publication number
- JPS5817494B2 JPS5817494B2 JP49135859A JP13585974A JPS5817494B2 JP S5817494 B2 JPS5817494 B2 JP S5817494B2 JP 49135859 A JP49135859 A JP 49135859A JP 13585974 A JP13585974 A JP 13585974A JP S5817494 B2 JPS5817494 B2 JP S5817494B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- amine
- phenol
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title description 6
- 239000003822 epoxy resin Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 22
- 239000005011 phenolic resin Substances 0.000 claims description 21
- 150000001412 amines Chemical class 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 8
- -1 methylol group Chemical group 0.000 description 8
- 229920001568 phenolic resin Polymers 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229930003836 cresol Natural products 0.000 description 5
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000002648 laminated material Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical group CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003141 primary amines Chemical group 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】
フェノール樹脂積層板は比較的安価で且つ各性能がバラ
ンスされているので、近年電子部品及び電気部品に数多
く使用されているが、これに要求される特性は、電気性
能を始めとして打抜加工性耐燃性など益々シビャーに要
求されている。[Detailed Description of the Invention] Phenolic resin laminates are relatively inexpensive and have well-balanced performance, so they have been widely used in electronic and electrical parts in recent years. Increasingly, severe requirements are being placed on materials such as punching processability and flame resistance.
電気性能が良く且つ打抜加工性を向上させる方法の一つ
としてフェノール樹脂にエポキシ樹脂を配合する方法、
又耐燃性を附与する為にフェノール樹脂に対してハロゲ
ン化エポキシ樹脂を配合する方法が提案されているが、
フェノール樹脂とエポキシ樹脂を配合して熱硬化する場
合、フェノール樹脂のメチロール基又はフェノール性水
酸基とエポキシ基の反応は、メチロール基同志の縮合や
メチロール基とフェノール核の縮合に比べるとかなりゆ
るやかであるので、混合物を硬化させる場合、フェノー
ル樹脂単独の場合よりプレス時間を長くする必要があっ
て製造上、非能率的である。One method of improving electrical performance and punching workability is to mix epoxy resin with phenol resin.
In addition, a method of blending halogenated epoxy resin with phenol resin has been proposed in order to impart flame resistance.
When a phenolic resin and an epoxy resin are blended and thermally cured, the reaction between the methylol group or phenolic hydroxyl group of the phenolic resin and the epoxy group is considerably slower than the condensation of methylol groups with each other or the condensation of methylol groups with the phenol nucleus. Therefore, when curing the mixture, it is necessary to take longer pressing time than when using phenol resin alone, which is inefficient in terms of manufacturing.
しかもたとえ長くしても、メチロール基同志及びメチロ
ール基とフェノール核の反応が先に進行するので、エポ
キシ樹脂は完全に架橋構造に入ることがむずかしく、特
性的にも不充分である。Moreover, even if the length is longer, the reactions between the methylol groups and between the methylol groups and the phenol nucleus proceed first, making it difficult for the epoxy resin to completely enter into a crosslinked structure, resulting in insufficient properties.
又フェノール樹脂と同一プレス時間で製造すると、更に
エポキシ樹脂の反応が不完全になる為、電気性能が低下
し、エポキシ樹脂を配合した効果が失われてしまうとい
う欠点がある。Furthermore, if the epoxy resin is manufactured using the same pressing time as the phenol resin, the reaction of the epoxy resin will be incomplete, resulting in a decrease in electrical performance and a loss of the effect of incorporating the epoxy resin.
本発明者はフェノール樹脂とエポキシ樹脂の混合物の硬
化を促進し、フェノール樹脂と同一プレス時間で成形し
ても、電気性能その他の特性の良好な積層板を製造する
方法を種々検討した結果、添加するエポキシ樹脂を予め
過剰の2ヶ以上のアミン基を含有する脂肪族アミンと反
応した後にフェノール樹脂に配合する事により問題を解
決出来ることを見出した。The present inventor has investigated various methods of accelerating the curing of a mixture of phenolic resin and epoxy resin and producing a laminate with good electrical performance and other properties even when molded in the same pressing time as phenolic resin. It has been found that the problem can be solved by reacting the epoxy resin with an excess amount of aliphatic amine containing two or more amine groups and then blending it with the phenolic resin.
エポキシ樹脂と過剰の2ヶ以上のアミン基を含有する脂
肪族アミンとを反応せしめると末端のエポキシ基に対し
て1モルのアミンが附加し、所謂エポキシ樹脂のアミン
・アダクトが生成する。When an epoxy resin is reacted with an excess aliphatic amine containing two or more amine groups, 1 mole of amine is added to the terminal epoxy group, producing a so-called amine adduct of the epoxy resin.
このアミン・アダクトに残存する第一級のアミン基はエ
ポキシ基と比較するとフェノール樹脂のメチロール基と
非常に反応し易く、且つエポキシ樹脂中の全てのエポキ
シ基にアミンがアダクトしているので、反応が均一に進
行し、エポキシ樹脂が未反応のまま残される事がない。The primary amine group remaining in this amine adduct is much more reactive with the methylol group of the phenol resin than the epoxy group, and since the amine is adducted to all the epoxy groups in the epoxy resin, the reaction The process proceeds uniformly, and no epoxy resin is left unreacted.
即ちフェノール樹脂のみのプレス時間で充分に硬化が進
んで電気性能その他の特性の良好な積層板を得る事を見
出した。In other words, it has been found that the curing of the phenol resin alone progresses sufficiently in the pressing time, and a laminate with good electrical performance and other properties can be obtained.
本発明で用いるフェノール樹脂は、フェノールまたはク
レゾールとホルムアルデヒドとをアルカリ性で反応せし
めたフェノール樹月訳アルキルフェノールで変性したフ
ェノール樹脂、乾性油で変性したフェノール樹脂、又は
キシレン樹脂、トルエン樹脂で変性したフェノール樹脂
等であり、いずれも樹脂中にメチロール基を含有するも
のである。The phenolic resin used in the present invention is a phenol resin modified with an alkylphenol obtained by reacting phenol or cresol with formaldehyde in an alkaline state, a phenol resin modified with a drying oil, a phenol resin modified with a xylene resin, or a toluene resin. etc., all of which contain methylol groups in their resins.
エポキシ樹脂と過剰の脂肪族アミンとを反応せしめて得
られるアミン・アダクトは、エポキシ樹脂の1エポキシ
当量に対して1モル以上のアミンを配合し反応させたも
のである。An amine adduct obtained by reacting an epoxy resin with an excess of aliphatic amine is obtained by blending and reacting 1 mole or more of amine with respect to 1 epoxy equivalent of the epoxy resin.
アミンが1モル以下の場合には反応中にゲル化を起して
しまう。If the amount of amine is less than 1 mole, gelation will occur during the reaction.
こ\て用いる脂肪族アミンとは、通常エポキシ樹脂の硬
化剤として用いられるエチレンジアミン、ジエチレント
リアミン、トリエチレンテトラミン等であるが、この中
でエチレンジアミンの場合はエポキシ樹脂と反応してア
ミン・アダクトヲ製造する際、過剰のジアミンを減圧蒸
留によって容易に除去出来るので特に有用である。The aliphatic amines used here include ethylenediamine, diethylenetriamine, triethylenetetramine, etc., which are usually used as curing agents for epoxy resins. Among these, ethylenediamine is used when reacting with epoxy resins to produce amine adducts. is particularly useful because excess diamine can be easily removed by vacuum distillation.
フェノール樹脂100部(重量、以下同じ)に対するア
ミン・アダクトの配合割合は、10部乃至100部が適
当であり、10部以下では添加した効果が現われず、又
100部以上ではフェノール樹脂中のメチロール基に対
してアダクト中のアミン基が過剰になり、アダクトが未
反応のま5残って積層板の特性を却って低下してしまう
。The appropriate blending ratio of amine adduct to 100 parts (weight, same below) of phenolic resin is 10 to 100 parts; if it is less than 10 parts, the effect of adding it will not appear, and if it is more than 100 parts, the methylol in the phenol resin will be mixed. The amine groups in the adduct become excessive with respect to the groups, and the adduct remains unreacted, which actually deteriorates the properties of the laminate.
なお、本発明のフェノール樹脂とアミン・アダクトの配
合物に非反応性の可塑剤、難燃剤を適宜併用する事が出
来る。In addition, a non-reactive plasticizer and a flame retardant can be appropriately used in combination with the blend of the phenol resin and amine adduct of the present invention.
積層品用基材は、通常積層板用に用いられる紙、布、ガ
ラス布等である。The substrate for the laminate is paper, cloth, glass cloth, etc. which are commonly used for laminates.
以下実施例により詳細に説明する。This will be explained in detail below using examples.
実施例 1
フェノール94部、P−tertブチルフェノール45
部、37%ホルマリン130部、25%アンモニヤ水4
部を混合し、100°Cで2時間還流反応を行なった後
減圧脱水し、メチルアルコールニトリオール(1:1)
の混合溶媒で稀釈して固形分50%のフェノールワニス
を得た。Example 1 94 parts of phenol, 45 parts of P-tertbutylphenol
parts, 37% formalin 130 parts, 25% ammonia water 4 parts
After refluxing the mixture at 100°C for 2 hours, it was dehydrated under reduced pressure and mixed with methyl alcohol nitriol (1:1).
A phenol varnish with a solid content of 50% was obtained by diluting it with a mixed solvent.
エポキシ樹脂(ビスフェノールA型、エポキシ当量45
0乃至500)100部とエチレンジアミン30部を混
合し、室温で5時間反応させた後過剰のアミンを150
℃で減圧下で留去し、生成したアダクトをメチルエチル
ケトンで稀釈して固形分50%の溶液とした。Epoxy resin (bisphenol A type, epoxy equivalent: 45
0 to 500) and 30 parts of ethylenediamine were mixed, and after reacting at room temperature for 5 hours, excess amine was removed by 150 parts.
The mixture was distilled off under reduced pressure at °C, and the resulting adduct was diluted with methyl ethyl ketone to give a solution with a solid content of 50%.
該クレゾールワニス100部と該アミン・アダクト溶液
40部の混合物を厚さ10ミルスのコツトンリンター紙
に含浸乾燥して樹脂耐着量55%の積層材料を得た。A 10 mils thick cotton linter paper was impregnated with a mixture of 100 parts of the cresol varnish and 40 parts of the amine adduct solution and dried to obtain a laminated material having a resin adhesion resistance of 55%.
該積層材料8枚を重ね合せて、160°C150分、1
00に〆mlの条件でプレスして厚さ1,6%の積層板
を得た。8 sheets of the laminated material were stacked and heated at 160°C for 150 minutes.
A laminate with a thickness of 1.6% was obtained by pressing under the conditions of 0.00ml and 0.00ml.
この積層板の性能を表に示す。The performance of this laminate is shown in the table.
実施例 2
クレゾール108部に37%ホルマリン122部、25
%アンモニヤ水4部を混合し、100℃で2時間還流反
応を行なった後減圧脱水し、メチルアルコール:ドルオ
ール(1:1)の混合溶媒で稀釈し、固形分50%のワ
ニスを得た。Example 2 108 parts of cresol and 122 parts of 37% formalin, 25
% ammonia water were mixed, refluxed at 100°C for 2 hours, dehydrated under reduced pressure, and diluted with a mixed solvent of methyl alcohol:dolol (1:1) to obtain a varnish with a solid content of 50%. .
エポキシ樹脂(ブロム化ビスフェノールA型、エポキシ
当量380乃至420)100部とエチレンジアミン3
0部を混合し、室温で5時間反応させた後過剰のアミン
を150℃で減圧下で留去し、生成したアダクトをメチ
ルエチルケトンで稀釈して固形分50%の溶液とした。100 parts of epoxy resin (brominated bisphenol A type, epoxy equivalent 380 to 420) and 3 parts of ethylene diamine
After reacting at room temperature for 5 hours, excess amine was distilled off under reduced pressure at 150° C., and the resulting adduct was diluted with methyl ethyl ketone to give a solution with a solid content of 50%.
該クレゾールワニス100部と該アミン・アダクト溶液
50部の混合物を厚さ10ミルスのコツトンリンター紙
に含浸乾燥して樹脂付着量55%の積層材料を得た。A 10 mils thick cotton linter paper was impregnated with a mixture of 100 parts of the cresol varnish and 50 parts of the amine adduct solution and dried to obtain a laminated material with a resin coverage of 55%.
該積層材料8枚を重ね合せて、160℃、50分、10
0”7の条件でプレスして厚さ1.6への積層板を得た
。The 8 sheets of the laminated material were stacked and heated at 160°C for 50 minutes for 10 minutes.
A laminate with a thickness of 1.6 was obtained by pressing under conditions of 0"7.
この積層板の性能を表に示す。The performance of this laminate is shown in the table.
比較例 1
実施例1で得たクレゾールワニス100部に対してエポ
キシ樹脂(ビスフェノールA型、エポキシ当量450乃
至500)17部を混合したワニスを用いて実施例1と
同条件で積層板を得た。Comparative Example 1 A laminate was obtained under the same conditions as in Example 1 using a varnish prepared by mixing 17 parts of an epoxy resin (bisphenol A type, epoxy equivalent: 450 to 500) to 100 parts of the cresol varnish obtained in Example 1. .
その性能を表に示す。Its performance is shown in the table.
比較例 2
実施例2で得たフェノールワニス100部に対してエポ
キシ樹脂(ブロム化ビスフェノールA型、エポキシ当量
380乃至420)22部を混合したワニスを用いて実
施例2と同条件で積層板を得た。Comparative Example 2 A laminate was prepared under the same conditions as in Example 2 using a varnish prepared by mixing 22 parts of an epoxy resin (brominated bisphenol A type, epoxy equivalent: 380 to 420) to 100 parts of the phenol varnish obtained in Example 2. Obtained.
その性能を表に示す。表から明かなように、本発明の方
法は同一プレス時間の場合、比較例に比べて電気性能、
打抜加工性、耐燃性等の諸行性が優れている。Its performance is shown in the table. As is clear from the table, the method of the present invention has better electrical performance than the comparative example at the same pressing time.
Excellent handling properties such as punching workability and flame resistance.
このことは本発明の方法により硬化が著しく促進され、
短時間のプレスで特性の優れた積層板が得られ工業的に
非常に有用であることを示している。This means that curing is significantly accelerated by the method of the present invention,
This shows that a laminate with excellent properties can be obtained in a short pressing time and is very useful industrially.
Claims (1)
肪族アミンとエポキシ樹脂とを反応して得られるアミン
・アダクトを添加した混合物を含浸乾燥し、積層成形す
ることを特徴とするフェノール樹脂積層板を製造する方
法。1 A phenol resin characterized by impregnating and drying a mixture of phenol resin and adding an amine adduct obtained by reacting excess aliphatic amine and epoxy resin into a base material for laminate products, and then laminating the resin. Method of manufacturing laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49135859A JPS5817494B2 (en) | 1974-11-28 | 1974-11-28 | Phenol |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49135859A JPS5817494B2 (en) | 1974-11-28 | 1974-11-28 | Phenol |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5162873A JPS5162873A (en) | 1976-05-31 |
| JPS5817494B2 true JPS5817494B2 (en) | 1983-04-07 |
Family
ID=15161426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49135859A Expired JPS5817494B2 (en) | 1974-11-28 | 1974-11-28 | Phenol |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5817494B2 (en) |
-
1974
- 1974-11-28 JP JP49135859A patent/JPS5817494B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5162873A (en) | 1976-05-31 |
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