JPS5818723B2 - Hakuriseisetsuendensen - Google Patents
HakuriseisetsuendensenInfo
- Publication number
- JPS5818723B2 JPS5818723B2 JP47039423A JP3942372A JPS5818723B2 JP S5818723 B2 JPS5818723 B2 JP S5818723B2 JP 47039423 A JP47039423 A JP 47039423A JP 3942372 A JP3942372 A JP 3942372A JP S5818723 B2 JPS5818723 B2 JP S5818723B2
- Authority
- JP
- Japan
- Prior art keywords
- insulated wire
- insulating
- insulating paint
- wire
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 97
- 229920001296 polysiloxane Polymers 0.000 claims description 34
- 239000004962 Polyamide-imide Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 30
- 229920002312 polyamide-imide Polymers 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 27
- 239000007787 solid Substances 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 36
- 239000010408 film Substances 0.000 description 31
- 239000011347 resin Substances 0.000 description 28
- 229920005989 resin Polymers 0.000 description 28
- 239000000463 material Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 22
- 239000000126 substance Substances 0.000 description 13
- 238000007765 extrusion coating Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 229910000881 Cu alloy Inorganic materials 0.000 description 10
- 239000002904 solvent Substances 0.000 description 9
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 8
- 230000001846 repelling effect Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 229920001228 polyisocyanate Polymers 0.000 description 7
- 239000005056 polyisocyanate Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 6
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 4
- JFOCEBKIPCVSGU-UHFFFAOYSA-N 1h-pyrrolo[2,3-d]imidazol-2-one Chemical compound C1=CNC2=NC(=O)N=C21 JFOCEBKIPCVSGU-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 230000002940 repellent Effects 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- RQBIGPMJQUKYAH-UHFFFAOYSA-N 4-(3,4-diaminophenoxy)benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1OC1=CC=C(N)C(N)=C1 RQBIGPMJQUKYAH-UHFFFAOYSA-N 0.000 description 2
- MPKIJEUTPZPJFP-UHFFFAOYSA-N 4-(4-aminophenoxy)benzene-1,2-diamine Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C(N)=C1 MPKIJEUTPZPJFP-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 210000005036 nerve Anatomy 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical compound C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- PWAXUOGZOSVGBO-UHFFFAOYSA-N adipoyl chloride Chemical compound ClC(=O)CCCCC(Cl)=O PWAXUOGZOSVGBO-UHFFFAOYSA-N 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- OCWMFVJKFWXKNZ-UHFFFAOYSA-L lead(2+);oxygen(2-);sulfate Chemical compound [O-2].[O-2].[O-2].[Pb+2].[Pb+2].[Pb+2].[Pb+2].[O-]S([O-])(=O)=O OCWMFVJKFWXKNZ-UHFFFAOYSA-L 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Description
【発明の詳細な説明】
本発明は±布焼付けにより形成された絶縁層が容易に剥
離出来、かつ電気的、熱的、機械的、化学的特性に於て
優れた特性を有する絶縁電線に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulated wire having an insulating layer formed by fabric baking that can be easily peeled off and having excellent electrical, thermal, mechanical, and chemical properties. It is.
従来、巻線用以外の用途の機器配線等に用いられる絶縁
電線は端末接続の場合等に簡単な工具類で絶縁層が容易
に剥離されて導体が出て来る事が必須の条件となってい
る。Conventionally, insulated wires used for equipment wiring for purposes other than winding have been required to be able to easily peel off the insulating layer with simple tools to expose the conductor when connecting terminals. There is.
これらの用途には従来よりポリエチレン、塩化ビニール
、ポリアミド、フロリネーテツドエチレンプロピレン共
重合体等の溶融押出し可能な材料を用いて得られた押出
し被覆線が用いられて来た。For these applications, extruded coated wires made from melt-extrudable materials such as polyethylene, vinyl chloride, polyamide, and fluorinated ethylene propylene copolymers have conventionally been used.
しかし近年になってこれら押出し被覆線に対し、スペー
スファクターの減少の為の薄膜化、信頼性向上の為等の
熱的、電気的、機械的、化学的特性の向上が強く要請さ
れて来ている。However, in recent years, there has been a strong demand for these extruded coated wires to be thinner to reduce the space factor, and to improve thermal, electrical, mechanical, and chemical properties to improve reliability. There is.
この例として機器配線用絶縁電線の中機器内配線用絶縁
電線(例えばコンピューター用、電子交換機用等)につ
いてみると、電子回路がトランジスタ化、IC化、LS
I化されるに従い、絶縁電線に対しても、スペースファ
クターの減少がきびしく要求せられ導体径の減少と絶縁
層の薄膜化が要求されて来ている。As an example of this, when we look at insulated wires for internal wiring of equipment (for example, for computers, electronic exchanges, etc.), the electronic circuits are converted to transistors, ICs, and LS.
With the introduction of I-type wires, there has been a severe demand for a reduction in the space factor of insulated wires, as well as a reduction in the conductor diameter and a thinner insulating layer.
又回路と絶縁電線との間でインピーダンス整合が要求せ
られ、特にインピーダンスを低くする要求が強くなり、
この場合絶縁電線の特性インピーダンスを下げる為に絶
縁層の薄膜化が必要となり、しかも上記スペースファク
ターの関係より導体径が細くなると更に絶縁層の薄膜化
が必要となり全体的に導体径の減少と絶縁層の極端な薄
膜化が要求されつつある。In addition, impedance matching is required between the circuit and the insulated wire, and there is a particularly strong demand for lower impedance.
In this case, it is necessary to make the insulating layer thinner in order to lower the characteristic impedance of the insulated wire, and if the conductor diameter becomes thinner due to the above space factor, it is necessary to make the insulating layer even thinner, resulting in an overall reduction in the conductor diameter and insulation. There is a growing demand for extremely thin layers.
しかも薄膜化されながらも信頼性を一段と向上する為、
熱的、機械的、電気的特性の要求は、従来より一段とき
びしくなって来ている。Moreover, in order to further improve reliability even though the film is thinner,
Requirements for thermal, mechanical, and electrical properties are becoming more stringent than ever.
又、これらの用途の中、コンピューター、ハードウェア
に対する機器内配線用絶縁電線についてみると、ハード
ウェアに対する電線のコストは約0.7%程度であり将
来は更に0.5〜0.4上程度に低下すると推定されて
おり、その比率は極めて小さいものである。Also, among these uses, when looking at insulated wires for internal wiring for computers and hardware, the cost of wires for hardware is about 0.7%, and in the future it will increase by about 0.5 to 0.4 more. It is estimated that the ratio will decrease to 1,000,000, and the ratio is extremely small.
従ってコンピューターのメーカーは電線コストの低減よ
りむしろ配線コストの削減、誤配線の解消信頼性の向上
といった点に最重点を置いているのが現状である。Therefore, computer manufacturers are currently focusing on reducing wiring costs, eliminating wiring errors, and improving reliability rather than reducing wire costs.
特に配線コストの削減、誤配線の解消の為、自動配線機
が大巾に取り入れられており、現在すでに配線作業の約
80係はラッピング方式によって行われている。Particularly in order to reduce wiring costs and eliminate incorrect wiring, automatic wiring machines are being widely used, and about 80 wiring jobs are currently being done using the wrapping method.
しかしこの場合絶縁電線の受ける機械的損傷が非常に大
きくなり、絶縁層の機械的強度の向上を行わなければ信
頼性の向上はもとよりその保持すら困難となって来てい
る。However, in this case, the mechanical damage that the insulated wire receives becomes very large, and unless the mechanical strength of the insulating layer is improved, it is becoming difficult to improve the reliability or even maintain it.
このような自動配線機の使用はコンピュータ以外の機器
内配線用についても事情は同じである。The same situation applies to the use of such automatic wiring machines for wiring inside devices other than computers.
この他の例としてハーネス用絶縁電線がある。Another example is an insulated wire for a harness.
この中特に自動車用ハーネスを例にとってみる。Among these, let's take the automotive harness as an example in particular.
従来より自動車についてもその重量を減少し、かつ利用
空間を大きくする為、機器の小型化が強く行われてきて
いる。BACKGROUND ART Conventionally, there has been a strong effort to reduce the size of equipment in automobiles in order to reduce their weight and increase the usable space.
しかも最近は空気汚染の問題より、従来より更に機器を
増して排気ガスの浄化を行い、かつこの装置をつける為
使用する周辺の配線についても、例えば200℃以上の
耐熱性を要求される事がある。Moreover, due to the problem of air pollution, more equipment has been added than before to purify exhaust gas, and the surrounding wiring used to attach this equipment is also required to be heat resistant to temperatures of 200°C or higher, for example. be.
このような事情より自動車ノ配線についても、従来に比
してスペースファクターの減少と耐熱性の向上が強く望
まれている。Under these circumstances, there is a strong desire for automotive wiring to reduce the space factor and improve heat resistance compared to conventional wiring.
このような要求に応える為には現在使用しているハーネ
ス用絶縁電線の芯線径を細くし、かつ絶縁皮膜の薄膜化
が是非共必要となってきている。In order to meet these demands, it has become necessary to reduce the core wire diameter of the insulated wires for harnesses currently in use and to make the insulation coating thinner.
耐熱性については従来用いている絶縁電線の芯線径、絶
縁皮膜厚でもってしても、例えば200°C以上の耐熱
性に耐える事は難かしい問題を含んでいるのに、絶縁皮
膜の薄膜化を行いながらしかも絶縁電線の耐熱性を向上
させる事は非常に困難な問題である。Regarding heat resistance, even with the core wire diameter and insulation coating thickness of conventional insulated wires, it is difficult to withstand heat resistance of 200°C or higher, for example, but thinning the insulation coating is difficult. It is a very difficult problem to improve the heat resistance of insulated wires while doing so.
しかも、自動車は高度の安全性を要求されるものであり
、従って、自動車の神経ともいうべき絶縁電線には今後
益々高度の信頼性が要求せられ、為に熱的、電気的、機
械的、化学的特性の向上が必要となって来る。Moreover, automobiles require a high degree of safety, and therefore, insulated wires, which are the nerve of automobiles, will be required to have an even higher degree of reliability in the future. It becomes necessary to improve chemical properties.
これらの事情は多かれ少なかれ、自動車用以外のハーネ
ス用絶縁電線に於ても同じである。These circumstances are more or less the same for insulated wires for harnesses other than those for automobiles.
この他、防災関連機器用通信ケーブル等に於ても消防法
の改正等により耐熱性の向上が絶対必須の条件となって
来ている。In addition, improvements in heat resistance have become an absolute requirement for communication cables for disaster prevention-related equipment, etc. due to amendments to the Fire Service Act.
以上のような現在押出被覆線の用いられている分野に於
て今後必要とされる特性は、従来通り簡単な工具で絶縁
皮膜が容易に剥離出来て、かつスペースファクター減少
の為の絶縁層の薄膜化が絶対必要な条件となる。The properties that will be required in the future in the fields where extruded coated wire is currently used as described above are that the insulating film can be easily peeled off with a simple tool as before, and that the insulating layer can be removed to reduce the space factor. A thin film is an absolutely necessary condition.
現在剥離性を有する薄膜絶縁層を持った絶縁電線、或い
は剥離性を有する薄膜絶縁層が、熱的、機械的、電気的
、化学的特性のうち一種あるいはそれ以上の特性を併せ
持った絶縁電線の出現が強く望まれている。Currently, insulated wires have a peelable thin film insulation layer, or insulated wires whose peelable thin film insulation layer has one or more of thermal, mechanical, electrical, and chemical properties. Its appearance is strongly desired.
さて、これらの要求に対して、現在機器配線等に用いら
れている絶縁電線は押出し被覆線が使用されている。Now, in response to these demands, extruded coated wires are currently used as insulated wires used for equipment wiring and the like.
しかしながら押出しによる絶縁被覆法では、その絶縁皮
膜厚の減少には限界がある。However, in the insulation coating method using extrusion, there is a limit to the reduction in the thickness of the insulation coating.
現在押出し被覆による絶縁皮膜厚を減少させるべく種々
の方法が検討されている。Various methods are currently being studied to reduce the thickness of the insulation coating formed by extrusion coating.
しかし絶縁厚が100ミクロン以下になると、現状では
押出し被覆により工業的に安定かつ連続的に絶縁電線を
製造する事は膜切れ等の問題があり技術的に非常に困難
な事である。However, when the insulation thickness is less than 100 microns, it is currently technically very difficult to industrially and stably and continuously manufacture insulated wires by extrusion coating due to problems such as film breakage.
又芯線が細くなってゆく場合にも押出し被覆法では断線
等の問題があり種々問題が起って来る。In addition, even when the core wire becomes thinner, the extrusion coating method causes various problems such as wire breakage.
又、押出し法によりたとえ絶縁層の薄膜化が図られても
、或は現在工業的に可能な範囲で薄膜化が行われても従
来の材料による押し出し被覆による絶縁層は絶縁という
目的だけでなく熱的、機械的特性を絶縁皮膜の厚みで補
うという働きもしていたが、絶縁層の薄膜化に伴い熱的
、機械的特性の保持も非常に困難になって来る。In addition, even if the insulating layer is made thinner by extrusion, or even if it is thinned to the extent that is currently industrially possible, the insulating layer formed by extrusion coating with conventional materials is not only for the purpose of insulation. The thickness of the insulating film used to compensate for thermal and mechanical properties, but as the insulating layer becomes thinner, it becomes extremely difficult to maintain thermal and mechanical properties.
又、熱的、機械的特性の保持を図るべ〈従来と異なる材
料を用いようとしても、押出し被覆法を用いている限り
に於ては被覆材料が熱可塑性を有し、溶融し、かつその
溶融温度で長時間安定である事が必要であり、材料の選
択範囲が非常に制限される。In addition, thermal and mechanical properties should be maintained (even if a material different from conventional materials is used, as long as the extrusion coating method is used, the coating material has thermoplasticity, melts, and It must be stable for long periods of time at melting temperatures, which severely limits the range of materials that can be selected.
従ってこのように材料選択に制限条件のあるという事は
、その材料を用いて押出し被覆された絶縁電線の薄膜化
は勿論、熱的(例えば耐熱性、耐熱軟化性等)機械的特
性(例えば耐摩耗性等)電気的特性(例えば特性インピ
ーダンス等)化学的特性に於て限界のある事を示してい
る。Therefore, the fact that there are restrictions on material selection means that it is important not only to make the insulated wire coated by extrusion using the material thinner, but also to improve thermal (e.g. heat resistance, heat softening resistance, etc.) and mechanical properties (e.g. resistance). This indicates that there are limits to the electrical properties (e.g., abrasion resistance, etc.), electrical properties (e.g., characteristic impedance, etc.), and chemical properties.
しかも材料選択可能な範囲内で最高の熱的、機械的特性
を有するものを用いる場合、当然従来の材料での押出し
よりも条件は苛酷となり絶縁皮膜の薄膜化を図る事は一
段と困難な事となる。Moreover, when using a material with the best thermal and mechanical properties within the available material selection range, the conditions are naturally harsher than when extruding with conventional materials, making it even more difficult to achieve a thin insulating film. Become.
これらの理由より上記の如き絶縁電線に対する苛酷な要
求を満足するものは現在の押出し被覆法によっては製造
上に於ても、特性上に於ても実現不可能であるといって
も過言ではない。For these reasons, it is no exaggeration to say that it is impossible to meet the above-mentioned severe requirements for insulated wires, both in terms of manufacturing and properties, using the current extrusion coating method. .
さて、ここで観点をかえて絶縁電線のもう一つの製造法
である絶縁塗料を塗布焼付ける方法について考えてみる
。Now, let's change our perspective and consider another method of manufacturing insulated wires, which involves applying and baking an insulating paint.
絶縁塗料を塗布焼付けて得た絶縁電線はマグネットワイ
ヤ或は巻線と呼ばれる分野に於てのみ使用されるもので
ある。Insulated wires obtained by coating and baking insulating paint are used only in the field called magnet wires or windings.
この分野での使用には絶縁度膜厚を出来るだけ薄くして
、しかも熱的、機械的、電気的、化学的のあらゆる特性
に於て著しく高度な特性が要求せられ、かつその絶縁皮
膜に対する特性の均一性の要求は非常に苛酷である。For use in this field, it is necessary to make the insulation film as thin as possible and to have extremely high levels of thermal, mechanical, electrical, and chemical properties. The requirements for uniformity of properties are very strict.
しかも、機器配線用等の絶縁電線が容易な剥離性が必要
であるのに対し、マグネットワイヤーに於てはその必要
特性上導体と絶縁皮膜との密着性、接着力が大である事
が必須の条件となっていて容易に剥離するという事は全
く実用性のないものである。Moreover, while insulated wires for equipment wiring must be easily peelable, magnet wires require high adhesion and adhesion between the conductor and the insulating film due to their required characteristics. It is completely impractical for the film to peel off easily under these conditions.
この為試験項目としても捻回剥離性、急速切断後の導体
と絶縁皮膜の密着性等が大切な項目となっている。For this reason, important test items include twisting releasability and adhesion between the conductor and insulating film after rapid cutting.
しかも、マグネットワイヤーに於て、密着性が悪いとい
われるものでも、上記のような苛酷な試験即ち、試験後
には、絶縁電線として使えない程の機械的負荷を与えて
はじめて、絶縁皮膜がわずかに浮くといった程度のもの
で簡単な器具で容易に剥離するものではない。Moreover, even with magnet wires that are said to have poor adhesion, the insulating film only slightly deteriorates when subjected to the above-mentioned severe test, i.e., after being subjected to a mechanical load that is so great that it cannot be used as an insulated wire. It only floats and cannot be easily peeled off with a simple tool.
このように従来の押出し被覆した電線を用いた機器配線
用絶縁電線とマグネットワイヤーは、1)絶縁度膜厚、
2)使用材料、3)剥離性、4)製造方法に於て全く両
極端に位置するものであり、しかも、価格、特性、及び
使用分野に於ても全く異なるものであり、機器配線用と
してマグネットワイヤーを使用する事、或はその可能性
等の検討は全く念頭に置かれていなかった。In this way, insulated wires and magnet wires for device wiring using conventional extrusion-coated wires have the following characteristics: 1) insulation level, film thickness,
2) Materials used, 3) Peelability, and 4) Manufacturing methods are at two extremes, and they are also completely different in price, characteristics, and fields of use. No consideration was given to the use of wires or the possibility of such use.
従って例えば機器配線用絶縁電線の耐熱性を上昇する為
にはポリエチレン或はポリ塩化ビニール電線をパーオキ
サイド或は電子線照射により架橋反応を生じせしめる方
法が検討の中心となっている。Therefore, in order to improve the heat resistance of insulated wires for equipment wiring, for example, studies have focused on methods of causing a crosslinking reaction in polyethylene or polyvinyl chloride wires by irradiating them with peroxide or electron beams.
しかしこれらの耐熱性は、尚マグネットワイヤー用絶縁
、皮膜に比較できるものではない。However, the heat resistance of these materials is still not comparable to that of insulation and coatings for magnet wires.
しかしながら昨今の機器配線用等の押出し被覆絶縁電線
の分野に於る要求をみて、本発明者は鋭意検討の結果、
従来全く考えられていなかったマグネットワイヤー用の
絶縁物を用いかつマグネットワイヤーの製造方法を採用
する事により要求を満足せしめ得る事を解明した。However, in view of the recent demands in the field of extruded coated insulated wires for equipment wiring, etc., the inventors of the present invention have made the following as a result of intensive study.
It was discovered that the requirements could be met by using an insulator for magnet wires and adopting a manufacturing method for magnet wires, which had never been thought of before.
即ち本発明は塗布焼付けにより形成された絶縁層が容易
に剥離出来、表面平滑で均一な外観状態を呈し、電気的
、熱的、機械的、化学的特性に於て優れた特性を有する
絶縁電線を与えるものである。That is, the present invention provides an insulated wire in which the insulating layer formed by coating and baking can be easily peeled off, the surface exhibits a smooth and uniform appearance, and the wire has excellent electrical, thermal, mechanical, and chemical properties. It gives
本発明による絶縁電線は従来の押出し被覆した電線では
得られなかった薄い絶縁度膜厚と、薄い絶縁度膜厚に於
ての良好なる電気的、熱的、機械的、化学的特性を持ち
、更に従来塗布焼付けにより得られる絶縁電線では、考
えられもせず又、得る事も出来なかった剥離性を備え、
更に表面平滑で均一な外観状態を呈するものであり塗布
焼付けにより得られる絶縁電線の新しい用途即ち、機器
配線用等の分野を見出すものである。The insulated wire according to the present invention has a thin insulation film thickness that could not be obtained with conventional extrusion coated wires, and has good electrical, thermal, mechanical, and chemical properties at the thin insulation film thickness, Furthermore, it has peelability that was neither possible nor possible to obtain with insulated wires conventionally obtained by coating and baking.
Furthermore, the insulated wire has a smooth surface and a uniform appearance, and new uses for the insulated wire obtained by coating and baking, such as equipment wiring, can be found.
本発明により得られる絶縁電線の特徴を更に詳しく説明
する。The characteristics of the insulated wire obtained by the present invention will be explained in more detail.
まず絶縁度膜厚については、本発明では塗布焼付けの方
法によるので1回の塗布焼付けによる絶縁度膜厚は数ミ
クロン程度であり、かつその絶縁皮膜の特性は非常に均
一なものであり、数回から、数10回の塗布焼付けによ
り、非常にきびしい皮膜厚のコントロールが可能であり
、押出し被覆法では実現不能な薄膜化が可能であるのみ
ならず、特性インピーダンス等の電気的特性のきびしい
要求にも充分な精度の薄膜が実現可能である。First, regarding the insulation film thickness, since the present invention uses a coating and baking method, the insulation film thickness from one coating and baking process is approximately several microns, and the characteristics of the insulation film are very uniform, and the insulation film thickness is approximately several microns. By applying and baking several times to several dozen times, it is possible to control the film thickness very precisely, and it is not only possible to achieve thin films that cannot be achieved with extrusion coating methods, but also to meet strict requirements for electrical properties such as characteristic impedance. It is also possible to create thin films with sufficient precision.
又、熱的、機械的特性等に重大な影響を及ぼす材料の選
択範囲についても、本発明は絶縁塗料を塗布焼付ける方
法を用いるので絶縁材料が溶剤に可溶或いは均一に分散
するものであればいかなる材料でも使用でき、押出し被
覆法の如く被覆材料が熱可塑性を有し、溶融しかつその
溶融温度で長時間安定であるという制限条件はない。Furthermore, regarding the range of selection of materials that have a significant effect on thermal and mechanical properties, the present invention uses a method of applying and baking an insulating paint, so it does not matter whether the insulating material is soluble in a solvent or uniformly dispersed. Any material can be used, and there is no restriction that the coating material be thermoplastic, melt, and be stable at its melt temperature for long periods of time, as is the case with extrusion coating methods.
従って本発明により得られる絶縁電線では、絶縁皮膜と
して用いられる材料として、押出し被覆法により、材料
の選択範囲がはるかに広く、用途に応じ、種種の材料が
選択可能である。Therefore, in the insulated wire obtained according to the present invention, the selection range of materials used as the insulating film is much wider due to the extrusion coating method, and various materials can be selected depending on the application.
例えば機械的性質の優れたものが必要であればポリビニ
ルホルマール系或いはポリアミドイミド系の材料が望ま
しく、又、熱的性質の優れたものが必要であれば、イミ
ド基を含有するポリマーが望ましく、特に熱的機械的性
質の双方の特性を要求される場合はポリアミドイミド系
の材料が望ましい。For example, if a material with excellent mechanical properties is required, polyvinyl formal or polyamide-imide materials are desirable, and if a material with excellent thermal properties is required, a polymer containing an imide group is desirable, particularly If both thermal and mechanical properties are required, polyamide-imide materials are preferred.
ここに示した例はほんの一例であり、他の特性が望まれ
ても、それに対応する材料を選択する事は可能であり又
、特性と材料コストのバランスを考えた上での材料選択
も自由に行える。The example shown here is just one example, and even if other characteristics are desired, it is possible to select a material that corresponds to that, and you are also free to select materials after considering the balance between characteristics and material cost. can be done.
剥離性については従来の単なる塗布焼付は法による絶縁
電線ではその絶縁皮膜を取り除く方法として、機械的に
削り取るか、薬品により皮膜を分解させるか或いは、焔
で焼いて取り除く等の方法があるが、どの方法を用いて
も皮膜剥離が面倒で、押出し被覆による絶縁電線の如く
、簡単な器具すなわちワイヤーストIJツバー等で皮膜
剥離が容易に出きるものは望めない。Regarding removability, there are methods to remove the insulation film of insulated wires using the conventional simple coating and baking method, such as mechanically scraping it off, decomposing the film with chemicals, or burning it with a flame. No matter which method is used, it is troublesome to remove the coating, and it cannot be expected that the coating can be easily removed using a simple tool, such as a wire strike IJ tube, such as extruded insulated wires.
ただ単に剥離性を得るためには導体上に主としてシリコ
ーンから成る剥離層を設け、その上に従来エナメル線に
用いられている絶縁塗料を塗布焼付けた絶縁層を設けた
場合でも目的は達成出来る3しかしながら通常の絶縁塗
料を主としてシリコーンから成る剥離層に直接塗布焼付
けた場合、はじいたり発泡したりして外観状態が良好な
る剥離性の絶縁電線を工業的に安定かつ連続に得る事は
むずかしい。However, in order to simply obtain peelability, the purpose can be achieved even if a peeling layer mainly made of silicone is provided on the conductor, and an insulating layer coated and baked with the insulating paint conventionally used for enamelled wire is placed on top of that.3 However, when ordinary insulating paint is directly applied and baked on a release layer mainly made of silicone, it is difficult to industrially stably and continuously obtain a removable insulated wire with good appearance due to repellency or foaming.
絶縁電線の表面が平滑でなく又、均一でない場合、当然
のことながらその絶縁電線の特性には十分の信頼を置く
ことは出来ず従って需要家の要求には応じられない。If the surface of the insulated wire is not smooth or uniform, it goes without saying that sufficient confidence cannot be placed in the characteristics of the insulated wire, and therefore the demands of customers cannot be met.
このため、表面平滑で均一な絶縁電線即ち作業性の良い
絶縁電線を得る事は電線メーカーの大きな課題である。Therefore, obtaining an insulated wire with a smooth and uniform surface, that is, an insulated wire with good workability, is a major challenge for wire manufacturers.
しかも部分的に表面平滑で均一な絶縁電線が得られても
連続に十分長尺のものが得られなければ、工業的に意味
がなく事実上製造不能に陥いる。Moreover, even if an insulated wire with a partially smooth and uniform surface is obtained, unless a sufficiently long one is obtained continuously, it is industrially meaningless and virtually impossible to manufacture.
ところが本発明では、導体上に主としてシリコーンから
成る剥離層を設け、固体微粉末を添加混合してなる絶縁
塗料を該剥離層の直上に塗布焼付けた絶縁層を設けるこ
とにより表面平滑で均一な外観状態を呈しつつ、工業的
に安定かつ連続に製造出来る剥離性絶縁電線を得ること
が出来る。However, in the present invention, a peeling layer mainly made of silicone is provided on the conductor, and an insulating layer made by coating and baking an insulating paint made by adding and mixing solid fine powder directly on the peeling layer, thereby creating a smooth and uniform surface. It is possible to obtain a peelable insulated wire that can be produced industrially stably and continuously while exhibiting the following conditions.
ここで主としてシリコーンから成る剥離層上に本発明の
如く固体微粉末を添加した絶縁塗料を塗布焼付けるとは
じかない理由を考えてみる。Let us now consider the reason why an insulating paint containing fine solid powder as in the present invention is not repelled when applied and baked on a release layer mainly made of silicone.
本来シリコーンと絶縁塗料とはなじみが悪く、非常には
じきやすいものである。Originally, silicone and insulating paint do not mix well with each other and are extremely repellent.
主としてシリコーンから成る剥離層上に絶縁塗料が塗布
焼付けられる過程をふり返って見ると、まず塗布過程は
、絶縁塗料が強制的に連続的に塗布され、しかも通常常
温付近で塗布が行われるため、溶液粘度も高く、絶縁塗
料の流れが遅く、急激にはじくことはない。Looking back at the process of applying and baking insulating paint onto a release layer mainly made of silicone, we can see that first, in the application process, insulating paint is forcibly applied continuously, and usually at room temperature. The solution viscosity is high, the flow of the insulating paint is slow, and there is no sudden repelling.
ところが焼付は過程では温度が高いため塗布された絶縁
塗料の溶液粘度は低くなり流れやすくなるため非常には
じきゃすくなる。However, since the temperature during the baking process is high, the viscosity of the solution of the applied insulating paint becomes low and it flows easily, making it extremely difficult to break off.
一旦粘度が下った絶縁塗料は、高温雰囲気中で、溶剤の
蒸発と、塗料によっては硬化反応が起り、粘度が上がり
最終的には絶縁皮膜が形成され、もはやはじかなくなる
。Once the viscosity of the insulating paint has decreased, in a high-temperature atmosphere, the solvent evaporates and, depending on the paint, a curing reaction occurs, the viscosity increases, and eventually an insulating film is formed, making it no longer repellent.
従ってはじきや発泡が起るのは焼付は炉内で絶縁塗料の
粘度が下がった時と考えられる。Therefore, it is thought that repelling and foaming occur when the viscosity of the insulating paint decreases in the furnace.
このためはじきが起らないようにするためには塗布後粘
度が下がらず、すぐに絶縁皮膜が形成されることである
。Therefore, in order to prevent repelling, the viscosity should not decrease after application, and an insulating film should be formed immediately.
しかしながら絶縁塗料においては焼付は過程は避けられ
ない。However, baking is an unavoidable process in insulating paints.
即ち焼付は炉内において高温雰囲気となるため、絶縁塗
料は一旦粘度が下がることは避けられず、従ってはじき
が起る。That is, since baking creates a high-temperature atmosphere in the furnace, it is inevitable that the viscosity of the insulating paint will once decrease, resulting in repellency.
絶縁塗料に固体微粉末を添加すると高温雰囲気で絶縁塗
料の粘度が下がり、流動しようとしても、固体粒子のま
わりの流れが乱れて余分の仕事をするので、流動抵抗が
大きく、粘度の下がり方が少ない。When solid fine powder is added to insulating paint, the viscosity of the insulating paint decreases in a high-temperature atmosphere, and even when it tries to flow, the flow around the solid particles is disturbed and extra work is done, so the flow resistance is large and the viscosity decreases. few.
この間、溶剤の蒸発が進み、更に絶縁皮膜が形成されて
行へ
即ち急激なはじきが起るほど粘度が下がらず、はじきが
起る前に粘度が上がり更には皮膜が形成されもはやはじ
かなくなる。During this time, the evaporation of the solvent progresses, and an insulating film is formed, so that the viscosity does not decrease enough to cause rapid repelling, and before repelling occurs, the viscosity rises and a film is formed, making it no longer repellent.
従って塗布焼付は過程においてはじく事なく表面平滑か
つ均一な絶縁皮膜が形成されるのであろう。Therefore, during the coating and baking process, an insulating film with a smooth and uniform surface is likely to be formed without any repelling.
本発明において固体微粉末を添加した絶縁塗料は主とし
てシリコーンから成る剥離層によるはじきを防止するた
めであり、該剥離層の直上に、固体微粉末を塗加した絶
縁塗料を塗布焼付けた絶縁層が形成されたら、当然の事
ながらこの上層はいかなる絶縁塗料を塗布焼付けようと
も、もはやはじきは起らなくなる。In the present invention, the insulating paint to which solid fine powder is added is mainly used to prevent repelling by a peeling layer made of silicone, and immediately above the peeling layer is an insulating layer in which an insulating paint coated with solid fine powder is coated and baked. Once formed, this upper layer will no longer repel, no matter what type of insulating paint is applied and baked.
従って、用途に応じて、絶縁塗料の選択が可能となる。Therefore, it is possible to select an insulating paint depending on the application.
本発明により得られる絶縁電線の用途には電子機器内配
線用電線、ハーネス用電線等がある。Applications of the insulated wire obtained by the present invention include wires for wiring inside electronic devices, wires for harnesses, and the like.
電子機器内配線用として、コンピューターや電子交換器
等に用いられるラッピングワイヤーがある。Wrapping wires are used for wiring inside electronic devices, such as computers and electronic exchangers.
ラッピングワイヤーは従来より押出し被覆により製造さ
れている。Wrapping wire has traditionally been manufactured by extrusion coating.
近年電子回路がトランジスタ化IC化、LSI化される
に従いラッピングワイヤーに対してスペースファクター
の減少がきびしく要求せられ導体径の減少と絶縁層の薄
膜化が要求されて来ている。In recent years, as electronic circuits have become transistorized ICs and LSIs, there has been a growing demand for a reduction in the space factor for wrapping wires, a reduction in the conductor diameter, and a reduction in the thickness of the insulating layer.
又、回路と絶縁電線との間でインピーダンス整合が要求
せられ、特にインピーダンスを低くする要求が強くなり
、この場合ラッピングワイヤーの特性インピーダンスを
下げる為に絶縁層の薄膜化が必要となる。Also, impedance matching is required between the circuit and the insulated wire, and there is a particularly strong demand for lowering the impedance, and in this case, it is necessary to make the insulating layer thinner in order to lower the characteristic impedance of the wrapping wire.
しかも薄膜化されながらも信頼性を一段と向上する為熱
的、機械的、電気的、化学的特性の要求は従来より一段
ときびしくなって来ている。Moreover, in order to further improve reliability while thinning the film, the requirements for thermal, mechanical, electrical, and chemical properties are becoming more stringent than in the past.
このような絶縁層薄膜化の要求がありながら押出し被覆
線では薄い絶縁皮膜厚、特に100ミクロン以下のもの
を工業的に安定かつ連続に製造する事は、膜切れの問題
があり、非常に困難であ′る。Although there is a demand for thinning the insulation layer, it is very difficult to industrially and stably and continuously manufacture thin insulation coatings, especially those with a thickness of 100 microns or less, for extruded coated wires due to the problem of membrane breakage. It is.
又、製造出来たとしても、これまで膜厚の保持出来てい
た熱的機械的特性が薄膜化により、一段と見劣りするも
のしか得られない。Moreover, even if it can be manufactured, the thermal and mechanical properties that have been able to be maintained until now will only be inferior due to the thinning of the film.
しかしながら本発明により得られる絶縁電線はラッピン
グワイヤーに要求される皮膜の剥離性を持ち、要求に応
じた薄膜絶縁層を有するものが製造出来、すぐれた熱的
機械的特性をそなえている。However, the insulated wire obtained according to the present invention has the film removability required for wrapping wires, can be manufactured with a thin insulating layer that meets the requirements, and has excellent thermal and mechanical properties.
この他の例としてハーネス用絶縁電線がある5この中特
に自動車用ハーネスを例にとってみる。Another example is an insulated wire for a harness. Among these, let us take a harness for an automobile as an example.
従来より自動車についてもその重量を減少し、かつ利用
空間を大きくする為、機器の小型化が強く行われてきて
いる。BACKGROUND ART Conventionally, there has been a strong effort to reduce the size of equipment in automobiles in order to reduce their weight and increase the usable space.
しかも最近は空気汚染の問題より従来より更に機器を増
して排気ガスの浄化を行い、かつこの装置をつける為使
用する周辺の配線についても例えば200℃以上の耐熱
性を要求される事がある。Moreover, recently, due to the problem of air pollution, more equipment has been added than before to purify exhaust gas, and the surrounding wiring used to attach this device is sometimes required to have heat resistance of, for example, 200° C. or higher.
このような事情より、自動車の配線についても、従来に
比してスペースファクターの減少と耐熱性の向上が強く
望まれている。Under these circumstances, there is a strong desire for automotive wiring to reduce the space factor and improve heat resistance compared to conventional wiring.
このような要求に応える為には現在使用しているハーネ
ス用絶縁電線の芯線径を細くし、かつ絶縁皮膜の薄膜化
が是非共必要となってきている。In order to meet these demands, it has become necessary to reduce the core wire diameter of the insulated wires for harnesses currently in use and to make the insulation coating thinner.
耐熱性については従来用いている絶縁電線の芯線径、絶
縁皮膜厚でもってしても例えば200℃以上の耐熱性に
耐える事は難かしい問題を含んでいるのに、絶縁皮膜の
薄膜化を行いながらもしかも絶縁電線の耐熱性を向上さ
せる事は非常に困難な問題である。Regarding heat resistance, even with the core wire diameter and insulation coating thickness of conventional insulated wires, it is difficult to withstand heat resistance of 200℃ or higher, for example, but by making the insulation coating thinner. However, improving the heat resistance of insulated wires is a very difficult problem.
しかも、自動車は高度の安全性を要求されるものであり
、従って自動車の神経ともいうべき絶縁電線には今後益
々高度の信頼性が要求せられ、為に熱的、電気的、機械
的、化学的特性の向上が必要となって来る。Moreover, automobiles require a high degree of safety, and therefore insulated wires, which are the nerve of automobiles, will be required to have an even higher degree of reliability in the future. Therefore, it is necessary to improve the physical characteristics.
これらの事情は多かれ少なかれ、自動車用以外のハーネ
ス用絶縁電線に於ても同じである。These circumstances are more or less the same for insulated wires for harnesses other than those for automobiles.
この要求を満たすため近年ハーネス用にエナメル線が導
入されつつあるが端末剥離が困難で、作業上重大な問題
となっている。In order to meet this demand, enamelled wires have been introduced for harnesses in recent years, but it is difficult to peel off the ends, which poses a serious problem in work.
本発明の絶縁電線は、従来のエナメル線と同等の特性を
持ち、かつ、端末剥離が容易なため作業時間の大幅な短
縮が可能となる。The insulated wire of the present invention has characteristics equivalent to those of conventional enamelled wire, and the ends can be easily peeled off, so that the working time can be significantly shortened.
以上に述べた例は、ごく一部であり、薄膜絶縁層を有し
、絶縁層が容易に剥離出来、かつ、すぐれた電気的、熱
的、機械的、化学的特性を要求される絶縁電線にはすべ
て有効に使用されるものである。The examples mentioned above are just a few, and are insulated wires that have a thin insulating layer, can be easily peeled off, and require excellent electrical, thermal, mechanical, and chemical properties. All can be used effectively.
第1図、第2図に於て、2の層は主としてシリコーンよ
り成る剥離層である。In FIGS. 1 and 2, layer 2 is a release layer mainly made of silicone.
2の層を形成するために用いられるシリコーンは、一般
に離型剤として使用されるものである。The silicone used to form layer 2 is generally used as a mold release agent.
シリコーンの例として信越化学工業社製のKF96 、
KF965 、KS700 、KS701 。Examples of silicone include KF96 manufactured by Shin-Etsu Chemical Co., Ltd.
KF965, KS700, KS701.
KP301 、KP321 、KP330 、KP34
0゜KP354 、KR282、KC88、KS705
F。KP301, KP321, KP330, KP34
0゜KP354, KR282, KC88, KS705
F.
KS706 、KS709 、KS709S、KS71
1がある。KS706, KS709, KS709S, KS71
There is 1.
シリコーン中、KF96.KF965のようなオイルよ
りもシリコーンを溶解せしめている溶剤を乾燥させた時
、皮膜を形成するものが好ましく、溶剤を乾燥する過程
で、シリコーンが反応し、硬化皮膜を形成するものにつ
いては、微量の硬化剤を添加するのが好ましい。In silicone, KF96. It is preferable to use a solvent that forms a film when the solvent that dissolves the silicone is dried, rather than an oil such as KF965.If the silicone reacts with the solvent and forms a hardened film during the process of drying the solvent, use a trace amount. It is preferable to add a curing agent of.
硬化剤の例としては信越化学工業社製のcatalys
t PS 。An example of a curing agent is catalys manufactured by Shin-Etsu Chemical Co., Ltd.
tPS.
catalyst P D等があげられる。Examples include catalyst PD.
本発明において、第1図に示す3の層は、固体微粉末を
添加した絶縁塗料を塗布焼付けた絶縁層であり2の主と
してシリコーンから成る剥離層によるはじきを防止する
ためであり、3の層は2の層の直上にあればよい。In the present invention, the layer 3 shown in FIG. 1 is an insulating layer coated with an insulating paint containing fine solid powder and baked to prevent repelling by the release layer 2 mainly made of silicone. should be directly above layer 2.
一旦3の層が形成されるとその上層にいかなる絶縁塗料
を塗布焼付けようとも、もはやはじきは起らなくなるの
で、用途に応じて絶縁塗料を選択することができる。Once layer 3 is formed, no matter what kind of insulating paint is applied and baked on top of it, repellency will no longer occur, so the insulating paint can be selected depending on the application.
即ち4の層を形成するために用いる絶縁塗料はいかなる
ものでもよい。That is, any insulating paint may be used to form layer 4.
もし4の層が3の層とまったく同じであれば第2図とな
るわけである。If layer 4 is exactly the same as layer 3, then Figure 2 is obtained.
本願に於て用いる固体微粉末は、酸化アルミニウム(A
1203)、酸化ケイ素(SiO2)酸化チタン(T
102 )、酸化マグネシウム(MgO)、酸化亜鉛(
ZnO)、水酸化アルミニウム<hi(OH)3)から
選ばれる。The solid fine powder used in this application is aluminum oxide (A
1203), silicon oxide (SiO2), titanium oxide (T
102), magnesium oxide (MgO), zinc oxide (
ZnO), aluminum hydroxide<hi(OH)3).
本発明において固体微粉末を添カロした絶縁塗料は主と
してシリコーンより成る剥離層によるはじきを防止する
ためであるので剥離層とのなじみをよくするため、固体
微粉末を添加した絶縁塗料にシリコーンを更に添力目す
る事も好ましい。In the present invention, the insulating paint to which solid fine powder has been added is mainly used to prevent repellency by the release layer made of silicone, so in order to improve compatibility with the release layer, silicone is further added to the insulating paint to which solid fine powder has been added. It is also preferable to add a supplement.
3の層は固体微粉末を添加した絶縁塗料を塗布焼付ける
ことにより形成されるが、固体微粉末が添加される絶縁
塗料は、従来エナメル線に用いられている絶縁塗料が使
用される。The layer 3 is formed by applying and baking an insulating paint to which fine solid powder is added, and the insulating paint to which fine solid powder is added is the insulating paint conventionally used for enamelled wire.
゛この絶縁塗料としては、ポリビニルホルマールポリウ
レタン、アクリル、エポキシ、熱可塑性ポリエステル、
8種熱硬化性ポリエステル、H種熱硬化性ポリエステル
F種ポリエステルイミド、H種ポリエステルイミド、ポ
リアミド、ポリエステルアミドイミド、ポリヒダントイ
ン、ポリアミドイミド、ポリイミドを主成分とする絶縁
塗料から選ばれる。゛This insulating paint includes polyvinyl formal polyurethane, acrylic, epoxy, thermoplastic polyester,
Selected from Type 8 thermosetting polyester, Type H thermosetting polyester, Type F polyesterimide, Type H polyesterimide, polyamide, polyesteramideimide, polyhydantoin, polyamideimide, and an insulating coating containing polyimide as a main component.
4の層を形成するために用いられる絶縁塗料は従来エナ
メル線に用いられている絶縁塗料が使用される。The insulating paint used to form layer 4 is the insulating paint conventionally used for enamelled wire.
この絶縁塗料の例としてポリビニルホルマール、ポリウ
レタン、アクリル、エポキシ、熱可塑性ポリエステル、
B種熱硬化性ポリエステルH種熱硬化性ポリエステル、
F種ポリエステルイミド、H種ポリエステルイミド、ポ
リアミド、ポリエステルアミドイミド、ポリヒダントイ
ン、シリコーン、ポリアミドイミド、ポリイミド系等を
主成分とする絶縁塗料があげられる。Examples of this insulating paint include polyvinyl formal, polyurethane, acrylic, epoxy, thermoplastic polyester,
Class B thermosetting polyester, Class H thermosetting polyester,
Examples include insulating paints whose main components are F-type polyesterimide, H-type polyesterimide, polyamide, polyesteramideimide, polyhydantoin, silicone, polyamideimide, polyimide, and the like.
本発明でいうポリアミドイミド絶縁塗料とは、ポリアミ
ドイミド樹脂或いはポリアミドイミド前駆体樹脂を主成
分とする絶縁塗料であり、その一部をエポキシ樹脂、フ
ェノール樹脂、ポリイソシアネート、安定化ポリイソシ
アネート等の一般に絶縁塗料の添力ロ樹脂として用いら
れるものの各々或いはそれらの組合せたものを包含する
。The polyamide-imide insulating paint in the present invention is an insulating paint whose main component is polyamide-imide resin or polyamide-imide precursor resin, and a part of it is generally made of epoxy resin, phenol resin, polyisocyanate, stabilized polyisocyanate, etc. It includes each of the resins used as additives for insulating paints, or a combination thereof.
ポリアミドイミド絶縁塗料の主成分を成すポリアミドイ
ミド樹脂或いはその樹脂溶液或いはポリアミドイミド前
駆体樹脂或はその樹脂溶液の代表的な製法の例は、少な
くとも一種のトリカルボン酸無水物の酸クロライドと少
なくとも一種のジアミンとを反応させるものがある。A typical example of a method for producing polyamide-imide resin or its resin solution, or polyamide-imide precursor resin or its resin solution, which is the main component of polyamide-imide insulating paint, is to use at least one tricarboxylic acid anhydride acid chloride and at least one tricarboxylic acid anhydride acid chloride. Some react with diamines.
又、上記トリカルボン酸無水物の酸クロライドの一部を
少くとも一種のジカルボン酸ジクロライド或は少くとも
、一種のテトラカルボン酸二無水物、或は少くとも一種
のジカルボン酸ジクロライドと少くとも一種のテトラカ
ルボン酸二無水物でおきかえてもよい。Further, a part of the acid chloride of the tricarboxylic anhydride may be replaced with at least one dicarboxylic dichloride, at least one tetracarboxylic dianhydride, or at least one dicarboxylic dichloride and at least one tetracarboxylic dianhydride. It may be replaced with carboxylic dianhydride.
又、上記ジアミンの一部を少くとも一種のトリアミン、
或いは少なくとも一種のテトラミン、或いは少なくとも
一種のトリアミンと少なくとも一種のテトラミンでおき
かえてもよい。Further, a part of the above diamine may be replaced with at least one kind of triamine,
Alternatively, at least one type of tetramine may be replaced with at least one triamine and at least one type of tetramine.
トリカルボン酸無水物の酸クロライドの例としては、ト
リメリット酸無水物の4−酸クロライド等がある。Examples of the acid chloride of tricarboxylic anhydride include 4-acid chloride of trimellitic anhydride.
ジカルボン酸ジクロライドの例としては、テレフタル酸
ジクロライド、イソフタル酸ジクロライド、アジピン酸
ジクロライド等がある。Examples of dicarboxylic acid dichloride include terephthalic acid dichloride, isophthalic acid dichloride, adipic acid dichloride, and the like.
ジアミンの例としては、4,4′−ジアミノジフェニル
メタン、4,4′−ジアミノジフェニルエーテルm−フ
ェニレンジアミン等がある。Examples of diamines include 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether m-phenylenediamine, and the like.
トリアミンの例としては、3,4.4’−トリアミノジ
フェニルエーテル等がある。Examples of triamines include 3,4,4'-triamino diphenyl ether.
テトラミンの例としては、3,3’、4.4’−テトラ
アミノジフェニルエーテル等カアル。Examples of tetramine include 3,3', 4,4'-tetraaminodiphenyl ether and the like.
代表的な製法の他の例としては、少なくとも一種のトリ
カルボン酸無水物と少なくとも一種のジイソシアネート
とを反応させるものがある。Another typical manufacturing method involves reacting at least one tricarboxylic anhydride with at least one diisocyanate.
又、上記トリカルボン酸無水物の一部を少くとも一種の
ジカルボン酸、或は少くとも一種のテトラカルボン酸二
無水物、或は少くとも一種のジカルボン酸と少くとも一
種のテトラカルボン酸二無水物でおきかえてもよい。Further, a part of the above tricarboxylic anhydride may be at least one dicarboxylic acid, or at least one tetracarboxylic dianhydride, or at least one dicarboxylic acid and at least one tetracarboxylic dianhydride. You can replace it with
又、上記ジイソシアネートの一部を少くとも一種の3価
又はそれ以上のポリイソシアネートでおきかえてもよい
。Further, a part of the above diisocyanate may be replaced with at least one type of trivalent or higher polyisocyanate.
トリカルボン酸無水物の例としては、トリメリット酸無
水物等がある。Examples of tricarboxylic anhydrides include trimellitic anhydride.
ジカルボン酸の例としては、イソフタル酸、テレフタル
酸、アジピン酸等がある。Examples of dicarboxylic acids include isophthalic acid, terephthalic acid, adipic acid, and the like.
テトラカルボン酸二無水物の例としては、ピロメリット
酸二無水物、ベンゾフェノンテトラカルボン酸二無水物
等がある。Examples of tetracarboxylic dianhydride include pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, and the like.
ジイソシアネートの例としては、ジフェニルメタン−4
,4′−ジイソシアネート、ジフェニルエーテル−4,
4′−ジイソシアネート、トリレンジイソシアネート、
キシリレンジイソシアネート、ヘキサメチレンジイソシ
アネート等がある。Examples of diisocyanates include diphenylmethane-4
, 4'-diisocyanate, diphenyl ether-4,
4'-diisocyanate, tolylene diisocyanate,
Examples include xylylene diisocyanate and hexamethylene diisocyanate.
ポリイソシアネートの例としては、ポリメチレンポリフ
ェニレンポリイソシアネート等がある。Examples of polyisocyanates include polymethylene polyphenylene polyisocyanate.
本発明でいうポリイミド系絶縁塗料とは、イミダシピロ
ロン絶縁塗料も含み総称するものである。The polyimide-based insulating paint as used in the present invention is a general term that includes imidacypyrrolone insulating paint.
即ち本発明でいうポリイミ′ド系絶縁塗料とはポリイミ
ド(イミダゾピロロンを含む)樹脂或いは、ポリイミド
(イミダゾピロロンを含む)前駆体樹脂を主成分とする
絶縁塗料であり、その一部をエポキシ樹脂、フェノール
樹脂、ポリイソシアネート、安定化ポリイソシアネート
等の一般に絶縁塗料の添加樹脂として用いられるものの
各々或いはこれらを組合せたもので変性したものを包含
す句ポリイミド系絶縁塗料の主成分を成す、ポリイミド
(イミダゾピロロンを含む)樹脂或いはその樹脂溶液或
いはポリイミド(イミダゾピロロンヲ含む)前駆体樹脂
或いはその樹脂溶液の代表的な製法の例としては、少く
とも一種のテトラカルボン酸二無水物と少くとも一種の
ポリアミンとを反応させるものがある。That is, the polyimide-based insulating paint as used in the present invention is an insulating paint whose main component is polyimide (including imidazopyrrolone) resin or polyimide (including imidazopyrrolone) precursor resin, and a part of which is epoxy resin, Polyimide (imidazo), which is the main component of polyimide-based insulating paints, includes resins modified with phenol resins, polyisocyanates, stabilized polyisocyanates, and other resins commonly used as additives for insulating paints, or a combination of these. Typical manufacturing methods for resins (including pyrolone) or their resin solutions, or polyimide (including imidazopyrrolone) precursor resins or resin solutions include at least one type of tetracarboxylic dianhydride and at least one type of polyamine. There are things that cause a reaction.
ここで用いるテトラカルボン酸二無水物の例としては、
ピロメリット酸無水物、ペンシブエノンテトラカルボン
酸二無水物等がある。Examples of tetracarboxylic dianhydrides used here include:
Examples include pyromellitic anhydride and pensiveenonetetracarboxylic dianhydride.
又、ポリアミンは、ジアミン、トリアミン、テトラミン
が主として用いられ、トリアミンとしては三つのアミン
基の中二つのアミン基が互にオルト位にあるものが好適
であり、テトラミンとしては、各々二つのアミン基が互
にオルト位にあるものが好適である。In addition, diamines, triamines, and tetramines are mainly used as polyamines, and as triamines, it is preferable that two of the three amine groups are in ortho positions, and as tetraamines, it is preferable that two of the three amine groups are in the ortho position. It is preferable that these are in the ortho position to each other.
ジアミンの例としては、4,4′−ジアミノジフェニル
エーテル、4,4′−ジアミノジフェニルメタン等があ
る。Examples of diamines include 4,4'-diaminodiphenyl ether and 4,4'-diaminodiphenylmethane.
トリアミンの例としては、3,4.4’−トリアミノジ
フェニルエーテル、3−アミンベンジン等がある。Examples of triamines include 3,4,4'-triaminodiphenyl ether, 3-amine benzine, and the like.
テトラミンの例としては、3,3’、4,4’−テトラ
アミノジフェニルエーテル、3.3’−ジアミノベンジ
ジン等がある。Examples of tetramine include 3,3',4,4'-tetraamino diphenyl ether, 3,3'-diaminobenzidine, and the like.
4の層を形成するために使用する絶縁塗料は要求特性に
応じて選択すればよい。The insulating paint used to form layer 4 may be selected depending on the required characteristics.
例えば熱的性質が要求されれば、ポリエステルイミド、
ポリエステルアミドイミド、ポリアミドイミド、ポリヒ
ダントイン、ポリイミド等が望ましい。For example, if thermal properties are required, polyesterimide,
Preferred are polyesteramideimide, polyamideimide, polyhydantoin, polyimide, and the like.
熱的、機械的、電気的、化学的性質を兼ね備えたものと
してポリアミドイミドが最も好しい。Polyamideimide is most preferred as it has thermal, mechanical, electrical, and chemical properties.
又、勿論、二種以上の絶縁層を組み合せた多重構造も好
ましく、例えばコストと特性の兼合いからポリアミドイ
ミドを最外層に用いたものも好ましい。Of course, a multilayer structure in which two or more types of insulating layers are combined is also preferable, and for example, from the viewpoint of cost and characteristics, it is also preferable to use polyamideimide as the outermost layer.
絶縁層の摩擦係数を下げるため絶縁層の最外層に少なく
とも一層シリコーンを添加した絶縁塗料を塗布焼付ける
ことも好ましい。In order to lower the coefficient of friction of the insulating layer, it is also preferable to apply and bake an insulating paint containing at least one layer of silicone on the outermost layer of the insulating layer.
又、要求に応じて二種以上の絶縁塗料を混合して使用す
ることも好ましい。Furthermore, it is also preferable to use a mixture of two or more types of insulating paints depending on requirements.
又第2図に示すように絶縁層として3の層のみからなる
ものも好ましい。It is also preferable that the insulating layer consists of only three layers as shown in FIG.
本発明の絶縁電線の絶縁層の皮膜厚は100ミクロンを
越えるものでも押出し被覆により得られる絶縁電線より
すぐれた特性を示す。Even when the thickness of the insulating layer of the insulated wire of the present invention exceeds 100 microns, it exhibits properties superior to those of an insulated wire obtained by extrusion coating.
しかし本発明で得られる絶縁電線が最もその効果を発揮
するのは、絶縁層の皮膜厚が100ミクロン以下の時で
ある。However, the insulated wire obtained by the present invention is most effective when the thickness of the insulating layer is 100 microns or less.
なぜならば前述の如く押出し被覆による方法では100
ミクロン以下のものは事実上、製造が不可能であり、た
とえ出来たとしても要求される特性を十分に満たさない
からである。This is because, as mentioned above, in the extrusion coating method, the
This is because it is practically impossible to manufacture particles smaller than microns, and even if it were possible, the required characteristics would not be fully satisfied.
以下の実施例において本発明の詳細な説明するが本発明
はこれら実施例に限定されるものではない。The present invention will be explained in detail in the following examples, but the present invention is not limited to these examples.
以下の参考例で比較例及び実施例に用いた絶縁塗料を示
す。The following reference examples show insulating paints used in comparative examples and examples.
参考例 1
トリメリット酸無水物192.1g(1,0モル)とジ
フェニールメタン−4,4′−ジイソシアネート25o
、3g(1,oモル)とを、N−メチル−2−ピロリド
ン770gとソルベントナフサ(丸善石油化学製スワゾ
ール≠11000)330との混合溶剤中に加えて80
℃で3時間反応後、165℃迄6時間で昇温し、この温
度で2時間反応させポリアミドイミド絶縁塗料を得た。Reference example 1 192.1 g (1.0 mol) of trimellitic anhydride and 25 o of diphenylmethane-4,4'-diisocyanate
, 3 g (1,0 mol) were added to a mixed solvent of 770 g of N-methyl-2-pyrrolidone and solvent naphtha (Maruzen Petrochemical Swazol≠11000) 330.
After reacting at .degree. C. for 3 hours, the temperature was raised to 165.degree. C. over 6 hours, and the reaction was continued at this temperature for 2 hours to obtain a polyamide-imide insulation coating.
樹脂の還元比粘度は0.54であった。The reduced specific viscosity of the resin was 0.54.
参考例 2
4.4′−ジアミノジフェニールエーテル200.2g
(1,0モル)をN−メチル−2−ピロリドン1500
gに溶解し氷冷した。Reference example 2 4.4'-diaminodiphenyl ether 200.2g
(1,0 mol) to N-methyl-2-pyrrolidone 1500
g and cooled on ice.
次に、ここにピロメリット酸無水物218.1g(1,
0モル)を徐々に加え、この間反応容器は水冷を続は粘
稠な重合体溶液を得た。Next, 218.1 g of pyromellitic anhydride (1,
During this time, the reaction vessel was water-cooled, and a viscous polymer solution was obtained.
ここにN、N−ジメチルアセトアミド500gを更に加
えて希釈した。500 g of N,N-dimethylacetamide was further added to dilute the mixture.
樹脂の還元比粘度は1.58であった。The reduced specific viscosity of the resin was 1.58.
参考例 3 下記の如くして熱硬化性ポリエステル絶縁塗料を得た。Reference example 3 A thermosetting polyester insulation coating was obtained as follows.
1)ジメチルテレフタレート 388g2)エ
チレングリコール 81g3)グリセリ
ン 93g1)〜6)の成分を1
30〜140°Cにて5時間力ロ熱反応させて、低沸点
溜出物を溜出し、次に除徐に昇温しでゆき、低沸点物を
溜出しながら240°C迄昇温し、反応生成物が粘稠に
なった時点で、ブレゾールを加え40%の固型分を含む
溶液とした。1) Dimethyl terephthalate 388g2) Ethylene glycol 81g3) Glycerin 93g
A thermal reaction was carried out at 30 to 140°C for 5 hours to distill off the low boiling point distillate, and then the temperature was gradually raised to 240°C while distilling the low boiling point distillate. When the reaction product became viscous, Bresol was added to give a solution containing 40% solids.
この溶液にソルベントナフサ(丸善石油化学製、スワゾ
ール=#=1000)を加えて30%の固型分を含む溶
液とし、ここに全固型樹脂分の重量に対し、1.5%の
テトラブチルチタネートと4%のデスモジュールCTス
テーブル(独国バイエル社製)を加え、混合攪拌して均
一な溶液とした。Solvent naphtha (manufactured by Maruzen Petrochemical Co., Ltd., Swazol = # = 1000) is added to this solution to make a solution containing 30% solids, and 1.5% of tetrabutyl is added to this solution based on the weight of the total solid resin. Titanate and 4% Desmodur CT Stable (manufactured by Bayer, Germany) were added and mixed and stirred to form a uniform solution.
参考例 4
参考例1で得られたポリアミドイミド絶縁塗料に5iO
2(日本エロジル社製のエロジル200 )をポリアミ
ドイミド絶縁塗料の樹脂固型分に対し5重量係添カ目し
充分攪拌し分散させた絶縁塗料。Reference Example 4 5iO was added to the polyamide-imide insulation paint obtained in Reference Example 1.
2 (Erosil 200 manufactured by Nippon Erosil Co., Ltd.) was added to the solid resin content of a polyamide-imide insulating coating by 5 weights and thoroughly stirred and dispersed.
参考例 5
参考例1で得られたポリアミドイミド絶縁塗料に11’
203(西独I)egussa社製)をポリアミドイミ
ド絶縁塗料の樹脂固型分に対し6重量%添加し、充分攪
拌し分散させた絶縁塗料。Reference Example 5 11' was applied to the polyamide-imide insulation paint obtained in Reference Example 1.
203 (manufactured by Egussa GmbH, West Germany) was added in an amount of 6% by weight based on the solid resin content of a polyamide-imide insulating paint, and the mixture was thoroughly stirred and dispersed.
参考例 6
参考例1で得られたポリアミドイミド絶縁塗料にTi0
2(堺化学工業社製)をポリアミドイミド絶縁塗料の樹
脂固型分に対し7重量%添加し充分攪拌し分散させた絶
縁塗料。Reference Example 6 Ti0 was added to the polyamide-imide insulation paint obtained in Reference Example 1.
2 (manufactured by Sakai Chemical Industry Co., Ltd.) in an amount of 7% by weight based on the solid resin content of a polyamide-imide insulating paint and thoroughly stirred and dispersed.
参考例 7
参考例1で得られたポリアミドイミド絶縁塗料に5iO
2(日本エロジル社製のエロジル200)をポリアミド
イミド絶縁塗料の樹脂固型分に対し5重量%添加し、更
にKS701(信越化学工業社製のシリコーン溶液)を
ポリアミドイミド絶縁塗料の樹脂固型分に対し1重量%
添加し、充分攪拌し分散させた絶縁塗料。Reference Example 7 5iO was applied to the polyamide-imide insulation paint obtained in Reference Example 1.
2 (Erosil 200 manufactured by Nihon Erosil Co., Ltd.) was added in an amount of 5% by weight based on the resin solid content of the polyamide-imide insulation paint, and KS701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was added to the resin solid content of the polyamide-imide insulation paint. 1% by weight
Insulating paint that has been added and thoroughly stirred and dispersed.
参考例 8
参考例2で得られた絶縁塗料に5in2(日本エロジル
社製のエロジル200)を絶縁塗料の樹脂固型分に対し
7重量%添加し充分攪拌し分散させた絶縁塗料。Reference Example 8 An insulating paint obtained by adding 5in2 (Erosil 200 manufactured by Nippon Erosil Co., Ltd.) to the insulating paint obtained in Reference Example 2 in an amount of 7% by weight based on the solid resin content of the insulating paint, and thoroughly stirring and dispersing the mixture.
参考例 9
参考例2で得られた絶縁塗料にS i02 (日本エロ
ジル社製のエロジル200)を絶縁塗料の樹脂固型分に
対し7重量%添加し更にKS700(信越化学工業社製
のシリコーン溶液)を絶縁塗料の樹脂固型分に対し1重
量係添力口し、充分攪拌し分散させた絶縁塗料。Reference Example 9 To the insulating paint obtained in Reference Example 2, 7% by weight of S i02 (Erosil 200 manufactured by Nihon Erosil Co., Ltd.) was added to the resin solid content of the insulating paint, and KS700 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was added. ) is added by weight to the solid resin content of the insulating paint and thoroughly stirred to disperse it.
参考例 10
参考例1で得られたポリアミドイミド絶縁塗料?、:K
P321(信越化学工業社製のシリコーン溶液)をポリ
アミドイミド絶縁塗料の樹脂固型分に対し2.5重量%
添加し充分攪拌し分散させた絶縁塗料。Reference Example 10 Polyamide-imide insulation paint obtained in Reference Example 1? , :K
2.5% by weight of P321 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) based on the solid resin content of the polyamide-imide insulation paint.
Insulating paint that has been added and thoroughly stirred and dispersed.
尚、S i 02 (日本エロジル社製のエロジル20
0)の平均粒子径は16mμであり、A1203(西独
Degussa社製)の粒子径は5〜30mμである。In addition, S i 02 (Erosil 20 manufactured by Nippon Erosil Co., Ltd.
0) has an average particle diameter of 16 mμ, and A1203 (manufactured by Degussa, West Germany) has a particle diameter of 5 to 30 mμ.
比較例 1
0.26mmの直径を有する銀メツキ銅合金線上に参考
例1で得られたポリアミドイミド絶縁塗料を数回繰返し
塗布焼付はポリアミドイミド絶縁電線を得た。Comparative Example 1 The polyamide-imide insulating paint obtained in Reference Example 1 was repeatedly applied and baked on a silver-plated copper alloy wire having a diameter of 0.26 mm several times to obtain a polyamide-imide insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に記す。比較例 2
0.26mmの直径を有する銀メツキ銅合金線上にKS
701(信越化学工業社より発売されているシリコーン
溶液)を塗布焼付けた剥離層を設け、この上に参考例1
で得られたポリアミドイミド絶縁塗料を数回繰知し塗布
焼付はポリアミドイミド絶縁電線を得た。The characteristics of this insulated wire are shown in Table 1. Comparative Example 2 KS on a silver-plated copper alloy wire with a diameter of 0.26 mm
701 (a silicone solution sold by Shin-Etsu Chemical Co., Ltd.) was coated and baked, a release layer was provided, and Reference Example 1 was applied on top of this.
The polyamide-imide insulating paint obtained in step 1 was coated and baked several times to obtain a polyamide-imide insulated wire.
得られた絶縁電線は随所にはじきや発泡が見られた。The resulting insulated wire had cracks and foaming everywhere.
この絶縁電線の特性を表1に記す。The characteristics of this insulated wire are shown in Table 1.
比較例 3
Q、26771mの直径を有する銀メツキ銅合金線上に
塩化ビニール樹脂100重量部にジオクチルフタレート
50重量部、三塩基性硫酸鉛5重量部を配合した塩化ビ
ニール混和物を押出し被覆し、塩化ビニール被覆電線を
得た。Comparative Example 3 A vinyl chloride mixture containing 100 parts by weight of vinyl chloride resin, 50 parts by weight of dioctyl phthalate, and 5 parts by weight of tribasic lead sulfate was coated on a silver-plated copper alloy wire having a diameter of 26,771 m by extrusion, and then chlorinated. A vinyl-coated electric wire was obtained.
得られた絶縁電線の特性を表1に示す。Table 1 shows the characteristics of the obtained insulated wire.
実施例 I
Q、26mmの直径を有する銀メツキ銅合金線上にKS
701(信越化学工業社製のシリコーン溶液)を塗布焼
付けた剥離層を設けその上に参考例4の絶縁塗料を塗布
焼付け、更にその上に参考例1の絶縁塗料を塗布焼付け
て絶縁電線を得た。Example I Q, KS on a silver-plated copper alloy wire with a diameter of 26 mm
701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was applied and baked, a peeling layer was provided, the insulating paint of Reference Example 4 was applied and baked, and the insulating paint of Reference Example 1 was further applied and baked on top of that to obtain an insulated wire. Ta.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
ここ絶縁電線の特性を表1に示す。Table 1 shows the characteristics of the insulated wire.
実施例 2
0.26mmの直径を有する銀メツキ銅合金線上にKS
701(信越化学工業社製のシリコーン溶液)を塗布焼
付けた剥離層を設け、その上に参考例5の絶縁塗料を塗
布焼付は更にその上に参考例3の絶縁塗料を塗布焼付け
て絶縁電線を得た。Example 2 KS on a silver-plated copper alloy wire with a diameter of 0.26 mm
701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was applied and baked, a peeling layer was provided, and on top of that, the insulating paint of Reference Example 5 was applied and baked, and then the insulating paint of Reference Example 3 was further applied and baked to form an insulated wire. Obtained.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 3
Q、 26 mrrtの直径を有する銀メツキ銅合金線
上にKS701(信越化学工業社製のシリコーン溶液)
を塗布焼付けた剥離層を設け、その上に参考例6の絶縁
塗料を塗布焼付けて絶縁電線を得た。Example 3 Q, KS701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) on a silver-plated copper alloy wire having a diameter of 26 mrrt.
A peeling layer was provided by coating and baking, and the insulating paint of Reference Example 6 was coated and baked on top of the peeling layer to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 4
0.26mmの直径を有する銀メツキ銅合金線上にKS
701(信越化学工業社製のシリコーン溶液)を塗布焼
付けた剥離層を設け、その上に参考例7の絶縁塗料を塗
布焼付は更にその上に参考例2の絶縁塗料を塗布焼付け
て絶縁電線を得た。Example 4 KS on a silver-plated copper alloy wire with a diameter of 0.26 mm
701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was applied and baked, and then the insulating paint of Reference Example 7 was applied and baked. Further, the insulating paint of Reference Example 2 was further applied and baked to form an insulated wire. Obtained.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 5
0.26mmの直径を有する銀メツキ銅合金線上にKS
701(信越化学工業社製のシリコーン溶液)を塗布焼
付けた剥離層を設けその上に参考例8の絶縁塗料を塗布
焼付は更にその上に参考例1の絶縁塗料を塗布焼付けて
絶縁電線を得た。Example 5 KS on a silver-plated copper alloy wire with a diameter of 0.26 mm
701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was applied and baked, a peeling layer was formed, and then the insulating paint of Reference Example 8 was applied and baked. Further, the insulating paint of Reference Example 1 was further applied and baked to obtain an insulated wire. Ta.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 6
0.26mmの直径を有する銀メツキ銅合金線上にKS
701(信越化学工業社製のシリコーン溶液)を塗布焼
付けた剥離層を設け、その上に参考例9の絶縁塗料を塗
布焼付け、更にその上に参考例1の絶縁塗料を塗布焼付
けて、絶縁電線を得た。Example 6 KS on a silver-plated copper alloy wire with a diameter of 0.26 mm
701 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) is applied and baked, a release layer is provided, the insulating paint of Reference Example 9 is applied and baked, and the insulating paint of Reference Example 1 is further applied and baked on top of that to form an insulated wire. I got it.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この電線の特性を表1に示す。Table 1 shows the characteristics of this wire.
実施例 7
実施例1で得た絶縁電線に参考例10の絶縁塗料を塗布
焼付けて絶縁電線を得た。Example 7 The insulating paint of Reference Example 10 was applied and baked on the insulated wire obtained in Example 1 to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 8
0.26mmの直径を有する銀メツキ銅合金線上にKP
330(信越化学工業社製のシリコーン溶液)を塗布焼
付けた剥離層を設け、その上に参考例4の絶縁塗料を塗
布焼付け、更にその上に参考例1の絶縁塗料を塗布焼付
けて絶縁電線を得た。Example 8 KP on a silver-plated copper alloy wire with a diameter of 0.26 mm
330 (silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.) was applied and baked, a peeling layer was provided, the insulating paint of Reference Example 4 was applied and baked, and then the insulating paint of Reference Example 1 was further applied and baked to form an insulated wire. Obtained.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 9
Q、 3 mmの直径を有する銅線上にKS701(信
越化学工業社製のシリコーン溶液)を塗布焼付けた剥離
層を設け、その上に参考例5の絶縁塗料を塗布焼付は更
にその上に参考例1の絶縁塗料を塗布焼付けて絶縁電線
を得た。Example 9 Q: On a copper wire with a diameter of 3 mm, a release layer was provided by applying and baking KS701 (a silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.), and on top of that, the insulating paint of Reference Example 5 was applied and baked. The insulating paint of Reference Example 1 was applied and baked to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 10
Q、 3 mrnの直径を有する銅線上にKP330(
信越化学工業社製のシリコーン溶液)を塗布焼付けた剥
離層を設け、その上に参考例4の絶縁塗料を塗布焼付け
て絶縁電線を得た。Example 10 Q, KP330 (
A release layer was provided by applying and baking a silicone solution (manufactured by Shin-Etsu Chemical Co., Ltd.), and the insulating paint of Reference Example 4 was applied and baked thereon to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 11
Q、 3 mmの直径を有する銅線上にKP330(信
越化学工業社製のシリコーン溶液)を塗布焼付けた剥離
層を設けその上に参考例8の絶縁塗料を塗布焼付け、更
にその上に参考例2の絶縁塗料を塗布焼付けて絶縁電線
を得た。Example 11 Q: On a copper wire having a diameter of 3 mm, a release layer was formed by applying and baking KP330 (a silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.), and on top of that, the insulating paint of Reference Example 8 was applied and baked, and further on top of that, the insulating paint of Reference Example 8 was applied and baked. The insulating paint of Reference Example 2 was applied and baked to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 12
0、3 mmの直径を有する銅線上にKP330(信越
化学工業社製のシリコーン溶液)を塗布焼付けた剥離層
を設け、その上に参考例9の絶縁塗料を塗布焼付は更に
その上に参考例1の絶縁塗料を塗布焼付けて絶縁電線を
得た。Example 12 A release layer was provided on a copper wire having a diameter of 0.3 mm by applying and baking KP330 (a silicone solution manufactured by Shin-Etsu Chemical Co., Ltd.), and then the insulating paint of Reference Example 9 was applied and baked on top of it. The insulating paint of Reference Example 1 was applied and baked to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
実施例 13
実施例11で得た絶縁電線の上に参考例1の絶縁塗料を
塗布焼付けて絶縁電線を得た。Example 13 The insulating paint of Reference Example 1 was applied and baked on the insulated wire obtained in Example 11 to obtain an insulated wire.
得られた絶縁電線は表面平滑で均一なものであった。The obtained insulated wire had a smooth and uniform surface.
この絶縁電線の特性を表1に示す。Table 1 shows the characteristics of this insulated wire.
る剥離層であり、3は固体微粉末を添力日した絶縁塗料
を塗布焼付けた絶縁層であり、4は1種又はそれ以上の
絶縁塗料を塗布焼付けた絶縁層である。3 is an insulating layer coated and baked with an insulating paint supplemented with fine solid powder; 4 is an insulating layer coated with one or more types of insulating paint and baked.
Claims (1)
と酸化アルミニウム、酸化ケイ素、酸化チタン、酸化マ
グネシウム、酸化亜鉛、水酸化アルミニウムから選ばれ
る固体微粉末を、ポリビニルホルマール、ポリウレタン
、アクリル、エポキシ熱可塑性ポリエステル、8種熱硬
化性ポリエステル、H種熱硬化性ポリエステル、F種ポ
リエステルイミド、H種ポリエステルイミド、ポリアミ
ドポリエステルアミドイミド、ポリヒダントイン、ポリ
アミドイミド、ポリイミドから選ばれる樹脂を主成分と
する絶縁塗料中に、添加混合せしめた絶縁塗料を該剥離
層の直上に塗布焼付けて得られる絶縁層とを有する事を
特徴とする剥離性絶縁電線。1 A release layer mainly made of silicone provided on a conductor and solid fine powder selected from aluminum oxide, silicon oxide, titanium oxide, magnesium oxide, zinc oxide, and aluminum hydroxide are combined with polyvinyl formal, polyurethane, acrylic, and epoxy thermoplastic polyester. , Type 8 thermosetting polyester, Type H thermosetting polyester, Type F polyesterimide, Type H polyesterimide, polyamide polyesteramide imide, polyhydantoin, polyamideimide, and polyimide. 1. A peelable insulated wire, comprising: an insulating layer obtained by coating and baking an insulating paint containing an added mixture on the peelable layer.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47039423A JPS5818723B2 (en) | 1972-04-19 | 1972-04-19 | Hakuriseisetsuendensen |
| DE19732310826 DE2310826C3 (en) | 1972-03-06 | 1973-03-05 | Metal wire with an electrically insulating sheath |
| US05/338,479 US4000362A (en) | 1972-03-06 | 1973-03-06 | Insulated wire with a silicone releasing layer |
| GB1089973A GB1419881A (en) | 1972-03-06 | 1973-03-06 | Electrically insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47039423A JPS5818723B2 (en) | 1972-04-19 | 1972-04-19 | Hakuriseisetsuendensen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49781A JPS49781A (en) | 1974-01-07 |
| JPS5818723B2 true JPS5818723B2 (en) | 1983-04-14 |
Family
ID=12552559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47039423A Expired JPS5818723B2 (en) | 1972-03-06 | 1972-04-19 | Hakuriseisetsuendensen |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5818723B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6613163B2 (en) * | 2016-02-10 | 2019-11-27 | 住友電気工業株式会社 | Insulated wire |
-
1972
- 1972-04-19 JP JP47039423A patent/JPS5818723B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49781A (en) | 1974-01-07 |
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