JPS5821019B2 - Copper alloy for lead material - Google Patents
Copper alloy for lead materialInfo
- Publication number
- JPS5821019B2 JPS5821019B2 JP4617376A JP4617376A JPS5821019B2 JP S5821019 B2 JPS5821019 B2 JP S5821019B2 JP 4617376 A JP4617376 A JP 4617376A JP 4617376 A JP4617376 A JP 4617376A JP S5821019 B2 JPS5821019 B2 JP S5821019B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- copper alloy
- alloy
- copper
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 title claims description 15
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 15
- 229910045601 alloy Inorganic materials 0.000 description 12
- 238000005452 bending Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
本発明は、リード材用銅合金に関するもので、さらに詳
しくは、優秀な耐熱性、高機械的特性に。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper alloy for lead materials, and more specifically, it has excellent heat resistance and high mechanical properties.
加えて優れた耐候性、ハンダ付は性を有する半導体装置
等の電子部品や電子機器、電気機器のり−ド材として好
適な銅合金に関するものである。In addition, the present invention relates to a copper alloy suitable for use as a glue material for electronic components such as semiconductor devices, electronic equipment, and electrical equipment, which has excellent weather resistance and soldering properties.
近年半導体装置等の電子部品の発達とともに、そのリー
ド材にも益々優れた特性が要求されるようになって来た
。In recent years, with the development of electronic components such as semiconductor devices, the lead materials thereof are also required to have increasingly superior properties.
従来からトランジスター、ダイオード等の電子部品のリ
ード材には良好な耐食性とハンダ付は性が要求され、鉄
系やニッケル系の合金に比して耐候性、ハンダ付は性に
優れた銅基台金が求められて来たが、耐熱性、高強度に
加えて繰返し屈曲と言った電子部品等の製造工程、組立
過程において要求される諸特性を十分に満足させること
が困難であり、これらの諸特性を兼備した銅合金の開発
が切望されていた。Lead materials for electronic components such as transistors and diodes have traditionally required good corrosion resistance and soldering properties, and copper bases have excellent weather resistance and soldering properties compared to iron-based and nickel-based alloys. Gold has been in demand, but it has been difficult to fully satisfy the various properties required in the manufacturing and assembly processes of electronic components, such as heat resistance, high strength, and repeated bending. There has been a strong desire to develop a copper alloy that has a variety of properties.
本発明は、かかる点に鑑み、上述の従来合金の欠点を改
善し、電子部品や機器用リード材として好適な諸特性を
有する銅合金を提供せんとするものである。In view of the above, the present invention aims to improve the drawbacks of the conventional alloys described above and provide a copper alloy having various properties suitable as lead materials for electronic parts and devices.
本発明の第１の発明は、クロム０．２０〜０．９０重量
％（以下、単に係と記す）、錫０．３０〜０゜０．９５
係、ニッケル０．２０〜９．０％を含有し、残部が本質
的に銅よりなることを特徴とするリード材用鋼合金であ
る。The first invention of the present invention is that chromium is 0.20 to 0.90% by weight (hereinafter simply referred to as "part") and tin is 0.30 to 0.95% by weight.
This is a steel alloy for lead material, characterized in that it contains 0.20 to 9.0% nickel, with the remainder essentially consisting of copper.
本発明の第２の発明は、クロム０．２０〜０．９０係、
錫０．３０〜０．９５係、ニッケル０．２０〜９．０係
、アルミニウム０．１０〜４０飲で、かつニッケルとア
ルミニウムの合計量で１０係以内を含有し、残部が本質
的に銅よりなることを特徴とする銅合金である。The second invention of the present invention is chromium 0.20-0.90 ratio,
Contains 0.30 to 0.95 parts of tin, 0.20 to 9.0 parts of nickel, and 0.10 to 40 parts of aluminum, and the total amount of nickel and aluminum is within 10 parts, and the balance is essentially copper. It is a copper alloy characterized by the following.
本発明において、合計で０．１５％以下のＰ 、 Ｂ。In the present invention, the total amount of P and B is 0.15% or less.
Ｃａ、Ｓｉ等の脱酸剤が残留含有されることは何ら差支
えない。There is no problem with the residual content of deoxidizing agents such as Ca and Si.
また合計量で０．６ ｃｌ、以下のＡｇ ＋ Ｚｒ 、
Ｂｅ ＋ Ｃｏ ＩＭｇ 、 Ｃｄ 、ミツシュメタル
、Ｍｎ 、 Ｔｉ 、 Ｉｎ等の元素が含有されること
は何ら差支えなく、耐熱性等の一層の向上の効果をもた
らすことがある。In addition, the total amount is 0.6 cl, the following Ag + Zr,
There is no problem with the inclusion of elements such as Be + Co IMg, Cd, Mitsushimetal, Mn, Ti, In, etc., and may bring about the effect of further improving heat resistance and the like.
本発明において、クロム量を０．２０〜０．９０％と規
定したのは、０．２０ ％未満では耐熱性や強度の向上
に効果が少なく、また０、９０％を超えると耐熱性や強
度の向上の効果が増加せず、かえって偏析を生じたり、
加工性に時題を生じやすいためである。In the present invention, the amount of chromium is specified as 0.20 to 0.90% because if it is less than 0.20%, it will have little effect on improving heat resistance and strength, and if it exceeds 0.90%, it will not improve heat resistance or strength. The effect of improving the
This is because problems tend to arise in processability.
また錫量を０．３０〜０．９５％と規定したのは、０．
３０％未満では強度や繰返し屈曲強さの向上の効果が少
なく、また０、９５％を超えると熱間加工性を害し、熱
間加工中割れを発生しやすく、製品歩留りが低下したり
しやすいためである。Moreover, the tin amount was specified as 0.30 to 0.95%.
If it is less than 30%, the effect of improving strength and cyclic bending strength will be small, and if it exceeds 0.95%, hot workability will be impaired, cracks will easily occur during hot working, and product yield will tend to decrease. It's for a reason.
またニッケル量を０．２０〜９．０％と規定したのは、
０．２０％未満では強度、耐候性の向上に効果が少なく
、また９、 ０ ％を超えるとハンダ付は性を害するた
めである。In addition, the nickel content was specified as 0.20 to 9.0% because
If it is less than 0.20%, it will have little effect on improving strength and weather resistance, and if it exceeds 9.0%, soldering properties will be impaired.
また第２の発明において、アルミニウム量を０．１０〜
４．０％と規定したのは、ｏ、１％未満では強度、耐候
性の向上の効果が少なく、また４、０係を超えると鋳造
性、熱間加工性を害しやすいためである。Further, in the second invention, the amount of aluminum is 0.10 to
The reason why it is specified as 4.0% is because if it is less than 1%, the effect of improving strength and weather resistance will be small, and if it exceeds 4.0, it will tend to impair castability and hot workability.
また第２の発明において、ニッケルとアルミニウムの合
計量を１０係以内としたのは、１０係を超えるとニッケ
ルとアルミニウムの間で化学的な：作用が働き、特性の
向上が望めないという理由によるものである。In addition, in the second invention, the reason why the total amount of nickel and aluminum is set to within 10 parts is because if it exceeds 10 parts, a chemical reaction will occur between nickel and aluminum, and no improvement in properties can be expected. It is something.
また本発明において必須元素以外に含有される元素の量
を０．６ ％以下とするのは、必須元素以外の元素は０
．６ ％を超えて含有させても何ら特性面シにおいて改
善が見られないのみならず、いたずらに合金の鋳造性や
加工性を害するためである。In addition, in the present invention, the content of elements other than essential elements is set to 0.6% or less, which means that elements other than essential elements are 0.6% or less.
．． This is because even if the content exceeds 6%, not only will no improvement be seen in terms of properties, but it will also unnecessarily impair the castability and workability of the alloy.
以下、本発明を実施例によりさらに詳述する。Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例：
通常の銅地金を約１３５０℃にて溶解し、リンＪ脱酸後
所定量の合金添加元素を、クロムは銅−１０係クロム母
合金、錫、ニッケルは単体、アルミニウムは銅−５０％
アルミニウム母合金の形で投入し、′十分攪拌溶解した
後、５０７１ｇ１１角の鋳型に鋳造した。Example: Ordinary copper ingot is melted at about 1350℃, and after deoxidizing phosphorus J, a predetermined amount of alloy additive elements are added, chromium is a copper-10 chromium master alloy, tin and nickel are simple substances, aluminum is copper- 50%
It was charged in the form of an aluminum master alloy, thoroughly stirred and melted, and then cast into a 5071 g 11 square mold.
得られた鋳塊を約８７０℃で熱間圧延Ｊして８Ｍφのワ
イアーロッドとし、酸洗の後、非酸化性雰囲気中で９８
０℃で２時間加熱して溶体化処理後水焼入れを行なった
。The obtained ingot was hot rolled at about 870°C to form a wire rod of 8Mφ, and after pickling, it was rolled at 98°C in a non-oxidizing atmosphere.
Water quenching was performed after solution treatment by heating at 0° C. for 2 hours.
さらに０．４５Ｍφまで冷間伸線を行なった後、各種条
件で真空焼鈍を行ない、試料とした。After further cold drawing to 0.45 Mφ, vacuum annealing was performed under various conditions to prepare samples.
ワイアーロッドの分析値を第１表に示す。The analytical values for the wire rod are shown in Table 1.
なお試料扁８は鋳造性が悪く、鋳塊中に多数の空隙部が
観察されたので以後の加工は取り止めた（ Ａ、 ８の
分析値は鋳塊のものである。Sample flat 8 had poor castability and many voids were observed in the ingot, so further processing was canceled (A, 8 analysis values are for the ingot).
）。焼鈍処理後の試料の機械的特性として、ステイフネ
ス値と屈曲値を測定した結果は第２表に示す通りである
。). Table 2 shows the results of measuring the stiffness value and bending value as the mechanical properties of the sample after the annealing treatment.
ここでステイフネス値は、試料を水平にしてその一端を
固定し、他端に錘りをのせて試料を３５゜曲げるに要す
るトルクの値で示したものである。Here, the stiffness value is expressed as the value of the torque required to bend the sample by 35 degrees with the sample held horizontally, one end fixed, and a weight placed on the other end.
また屈曲値は、第１図に示す如く、試料１に０．１ＭＨ
のエツジをもつダイス２を添えて締つけ治具３で把持し
、かつ一端に５００ｇの荷重Ｗを負荷した状態で、締付
は金具３を第２図に示す如＜９０°回転して試料を０．
１ｗ１．Ｈのエツジの周りで９０°曲げて復元に戻す操
作を繰返し、破断に至るまでの回数を、９０°曲げを１
回として示したものである。In addition, the bending value is 0.1MH for sample 1, as shown in Figure 1.
The sample is tightened by rotating the metal fitting 3 by <90° as shown in Fig. 2, with the die 2 having an edge of 0.
1w1. Repeat the operation of bending 90 degrees around the edge of H and restoring it to its original shape, and calculate the number of times it takes to bend 90 degrees by 1.
This is shown as times.
電子部品等のリード材において、特に優れた機械的特性
が要求される様な場合は、例えばステイフネス値７０ｇ
・σ以上でかつ屈曲値１５回以上が望ましい。In cases where particularly excellent mechanical properties are required for lead materials such as electronic parts, for example, a stiffness value of 70g is required.
・It is desirable that the bending value is σ or more and the bending value is 15 times or more.
第２表より、本発明の銅合金材はステイフネス値、繰返
し屈曲強さともに要望通りの特性が得られることが分る
。From Table 2, it can be seen that the copper alloy material of the present invention has the desired properties in terms of stiffness value and repeated bending strength.
一方比較合金材は両特性を満足するものがない。On the other hand, there is no comparative alloy material that satisfies both characteristics.
また耐熱性を見るため、これらの焼鈍前の試料を夫々１
時間宛加熱してステイフネス値が７０ｇ−α以下になる
最低の温度（耐熱温度）を求めた結果は第３表に示す通
りである。In addition, in order to check the heat resistance, each of these samples before annealing was
Table 3 shows the results of determining the lowest temperature (heat-resistant temperature) at which the stiffness value becomes 70 g-α or less after heating for a certain period of time.
第３表より、本発明合金は耐熱性においても比較合金よ
り優れ、製造工程で受ける４００℃程度の加熱処理を経
ても所望のステイフネス値を満足することがわかる。From Table 3, it can be seen that the alloys of the present invention are superior to the comparative alloys in terms of heat resistance, and satisfy the desired stiffness value even after being subjected to heat treatment at about 400°C during the manufacturing process.
次に耐候性について調査するため、湿度９０％、温度５
０℃の恒温、恒湿槽中で各種材料の０．４５原φの線を
３個月間放置した後の表面の変化状態を第４表に示した
。Next, in order to investigate weather resistance, the humidity was 90% and the temperature was 5.
Table 4 shows the changes in the surface of wires of 0.45 original diameter made of various materials after being left in a constant temperature and humidity chamber at 0° C. for three months.
第４表より、本発明合金は耐候性にも優れており、信頼
性の要求される電子部品等のリード材として優れた特性
を有していることがわかる。Table 4 shows that the alloy of the present invention has excellent weather resistance and has excellent properties as a lead material for electronic parts and the like that require reliability.
更にハンダ付は性をテストするため、０．４５原φの本
発明合金Ａ１〜３の合金（４４０℃×１時間焼鈍）線、
ニッケル線、鉄−５０％ニッケル合金線について各１０
０本ずつを２本１組にして、同−材料線同志つき合わせ
てハンダ付け（共晶ハンダ、ロジンフラックス使用）シ
た後、２００ｇの荷重を負荷した所、本発明による合金
線は１組もはがれを生じなかったが、ニッケル線、鉄−
５０係ニッケル合金線には、はがれを生じるものが存在
した。Furthermore, in order to test the soldering properties, alloy wires (annealed at 440°C x 1 hour) of the present invention alloys A1 to 3 with an original diameter of 0.45,
10 each for nickel wire and iron-50% nickel alloy wire
After making a set of two wires of the same material and soldering them together (using eutectic solder and rosin flux), when a load of 200 g was applied, one set of alloy wires according to the present invention No peeling occurred, but nickel wire, iron
Some of the 50% nickel alloy wires peeled off.
このように本発明による合金材はハンダ付は性において
も良好である。As described above, the alloy material according to the present invention has good solderability.
以上述べた如く、本発明のリード材用銅合金はクロム０
．２０〜０．９０％、錫０．３０〜０．９５係を含有し
、ニッケルおよび／またはアルミニウムを含有した銅合
金であるから、ステイフネス値、繰返し屈曲強さ等の機
械的特性に優れ、かつ耐熱性、耐候性、ハンダ付は性を
兼ねそなえた特長を有するので、電子部品や電子機器、
電気機器等用のリード材として好適である。As mentioned above, the copper alloy for lead material of the present invention has no chromium.
．． Since it is a copper alloy containing 20% to 0.90% tin, 0.30% to 0.95% tin, and nickel and/or aluminum, it has excellent mechanical properties such as stiffness value and cyclic bending strength. It has the characteristics of heat resistance, weather resistance, and solderability, so it is suitable for electronic parts, electronic equipment,
It is suitable as a lead material for electrical equipment, etc.
また、本発明の銅合金は、特に真空溶解法等の特殊な溶
解設備を必要とせず、熱間、冷間の加工性も問題なく、
また巾広い焼鈍処理条件にて要求される機械的特性が得
られるので、製造が容易である利点を有する。In addition, the copper alloy of the present invention does not require special melting equipment such as vacuum melting, and has no problem in hot or cold workability.
Further, since the required mechanical properties can be obtained under a wide range of annealing treatment conditions, it has the advantage of being easy to manufacture.
第１図および第２図は繰返し屈曲試験の方法を説明する
図である。
１・・・試料、２・・・ダイス、３・・・締め付は治具
、Ｗ・・・荷重。FIGS. 1 and 2 are diagrams for explaining the method of repeated bending tests. 1...Sample, 2...Dice, 3...Jig for tightening, W...Load.
Claims (1)
．９５５重量％ニッケル０．２０〜９．０％を含有し、
残部が本質的に銅よりなることを特徴とするリー。 ド材用銅合金。 ２ クロム０．２０〜０．９００重量％錫０．３０〜０
．９５５重量％ニッケル０．２０〜９．０重量％、アル
ミニウム０．１０〜４．．０重ｉ％で、かつニッケルと
アルミニウムの合計量で１０重量％以内を含有。 し、残部が本質的に銅よりなることを特徴とするリード
材用銅合金。[Claims] 1 Chromium 0.20-0.900% by weight Tin 0.30-0
．． Contains 955% by weight nickel 0.20-9.0%,
Lee characterized in that the remainder consists essentially of copper. Copper alloy for steel materials. 2 Chromium 0.20-0.900% by weight Tin 0.30-0
．． 955% by weight nickel 0.20-9.0% by weight, aluminum 0.10-4. ．． 0 weight i%, and the total amount of nickel and aluminum is within 10 weight%. A copper alloy for lead material, characterized in that the remainder essentially consists of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4617376A JPS5821019B2 (en) | 1976-04-22 | 1976-04-22 | Copper alloy for lead material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4617376A JPS5821019B2 (en) | 1976-04-22 | 1976-04-22 | Copper alloy for lead material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52128825A JPS52128825A (en) | 1977-10-28 |
| JPS5821019B2 true JPS5821019B2 (en) | 1983-04-26 |
Family
ID=12739623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4617376A Expired JPS5821019B2 (en) | 1976-04-22 | 1976-04-22 | Copper alloy for lead material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821019B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS54104596A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| CN107723502A (en) * | 2017-11-28 | 2018-02-23 | 徐高杰 | A kind of electromagnetism propels device with high-precision V-type copper section bar |
| CN107937751A (en) * | 2017-11-28 | 2018-04-20 | 徐高杰 | A kind of electromagnetism propels device copper alloy bar |
| CN110004322B (en) * | 2018-01-05 | 2021-05-14 | 比亚迪股份有限公司 | A copper-based microcrystalline alloy and its preparation method and an electronic product |
-
1976
- 1976-04-22 JP JP4617376A patent/JPS5821019B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52128825A (en) | 1977-10-28 |
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