JPS5822542B2 - Method for forming multiple deposited films - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming multiple deposited films, and particularly to a method for forming deposited films of different sizes on the surface of an object to be deposited, such as an electrode substrate for a gas discharge display panel. It is about a novel method for

Conventionally, for example, in the manufacturing process of an indirect discharge type gas discharge display panel, when forming a dielectric layer such as At203 by covering a predetermined pattern of electrodes formed on a glass substrate, the electrodes are made of Cr-Cu- In the case of oxidizing materials such as Cr, from the viewpoint of preventing oxidation of the electrode surface, a thin At203 film is first formed on the entire surface, and then an At203 film of a desired thickness is deposited over the display area. It is taken.

In this way, the thin vapor deposited film initially formed also covers the end portions of the electrodes, and after all heating steps associated with panel assembly are completed, the vapor deposited films at the end portions are removed by etching to connect the electrodes.

By the way, when forming a first vapor deposited film with a pattern including the electrode terminal portion as described above and a second vapor deposited film with a pattern that covers only the display area, conventionally, the electrode area including the terminal portion is first oxidized. A first evaporation mask is attached to form a thin At203 evaporation film to prevent this, and a desired evaporation film is formed through predetermined steps in a rotary evaporation apparatus.

When the formation of the first vapor deposition film is completed, the first vapor deposition mask is removed and replaced with a second vapor deposition mask having an opening corresponding to the display area, and a relatively thick vapor deposition film of 5 to 10 μm is formed. had to be formed.

The process of replacing this deposition mask requires the following operations: cooling the substrate, introducing air, taking out the drum, replacing the mask, inserting the drum, suctioning air, and reheating the substrate. There was the problem of time and labor costs.

The present invention has been made in order to solve the above-mentioned problems, and includes a method in which a plurality of vapor deposition masks having different openings are removably stacked on top of a substrate on which electrodes of a predetermined pattern are formed, and the vapor deposition apparatus is stopped. The focus is on forming multiple layers of vapor-deposited films.

Specifically, the present invention includes a first vapor deposition mask having a predetermined pattern of openings on the surface of an object on which a vapor deposition film is to be formed;
At least two masks, including a second vapor deposition mask having an opening pattern different from that of the first vapor deposition mask, are removably stacked and installed in a vapor deposition apparatus, and the second vapor deposition mask is passed through these double vapor deposition masks. After forming a vapor deposition film corresponding to the opening pattern of the second vapor deposition film, the second vapor deposition film is removed from the object to be formed out of the vapor deposition path, and then the vapor deposition film corresponding to the opening pattern of the nuclear mask is formed through the first vapor deposition mask. It is characterized in that it is formed continuously.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the method for forming multiple deposited films according to the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a cross-sectional view of essential parts showing one embodiment of a vapor deposition apparatus used in the vapor deposited film forming method of the present invention, in which 1 is a cylindrical vacuum vessel serving as a vapor deposition tank, and 2 is a cylindrical vacuum vessel installed in the vacuum vessel 1. 3 is a vapor deposition sample container housed in the vapor deposition sample container; 4 is a rotary frame on which a hanging tool 9 on which a substrate 5 on which a vapor deposition film is to be formed is fixed is rotatably attached via a shaft 10; 7; The vapor deposition sample 3 mentioned above is heated.

+Jrl heat heat, 8 is a rotation transmission roller that rotates the rotating frame 4, 11 is a push rod for dropping the second vapor deposition mask 61, 61 is a second vapor deposition mask equipped with a mounting fitting 611, and 62 is a second vapor deposition mask. 1 vapor deposition mask.

In such a configuration, the first vapor deposition mask 62 is first attached to the vapor deposition film forming surface of the substrate 5, and in this state, a second vapor deposition mask 62 equipped with a mounting fitting 611 is attached to the lower outside of the first vapor deposition mask 62. The vapor deposition masks 61 are mounted one on top of the other and fixed to the hanging tool 9.

In this manner, the substrate with the plurality of vapor deposition masks 61 and 62 mounted thereon is rotatably supported at a predetermined position on the rotating frame 4, and a predetermined vapor deposition sample 3 such as At203 is accommodated in the vapor deposition sample container 2.

The inside of the vacuum container 1 is evacuated by a vacuum pump (not shown), and the rotating frame 4 is rotated in the direction of the arrow A by the rotary transmission roller 8 while maintaining a high vacuum, thereby depositing the substrate 5 on which the vapor deposition masks 61 and 62 are stacked. Since the film forming surface is always facing downward, it is successively positioned above the vapor deposition sample 3.

When the vapor deposition sample 3 is evaporated by the heater 7 in this way, the opening pattern of the second vapor deposition mask 61 first corresponds to the plurality of substrates 5 attached to the hanging tool 9 pivotally supported by the rotating frame 4. A vapor deposition film of a regulated shape is sequentially formed in the region corresponding to the display part, and when the vapor deposition is finished, the push rod 11 provided on the side of the vacuum container 1 is used without stopping the rotary vapor deposition apparatus. is pushed into a mounting fitting 611 provided below the second vapor deposition mask 61, and the second vapor deposition mask 61 is sequentially removed from the vapor deposition path and dropped into the lower space of the empty container 1.

Subsequently, a vapor deposited film is formed in a region including the terminal portion corresponding to the window of the first vapor deposition mask 62, that is, a vapor deposited film including the vapor deposited film in the discharge portion.

The structure of the substrate on which the deposited film was formed in this manner will be described in detail later with reference to FIG.

FIG. 2 is a side sectional view showing an example of a structure in which a deposition mask is attached to a substrate 5 in the formation force method of multiple deposition films according to the present invention, and parts equivalent to the forebrain are given the same reference numerals. It is.

Reference numeral 621 denotes a mounting fitting provided on the first vapor deposition mask 62, which is used to attach the first vapor deposition mask 62 to the substrate 5, and then overlay and fix the second vapor deposition mask 61 on top of the substrate 5. A plurality of permanent magnets 622 are held on the lower surface of both ends of the vapor deposition mask 62 .

Therefore, an iron piece 612 is provided on the second vapor deposition mask 61 at a position corresponding to the permanent magnet 622 attached to the first vapor deposition mask 62.

FIG. 3 is a side cross-sectional view showing another embodiment of the structure in which two vapor deposition masks are attached to the substrate 5, in which parts equivalent to the forebrain are given the same reference numerals.

Reference numeral 623 denotes elastic stoppers made of, for example, phosphor bronze, which are attached to both ends of the first vapor deposition mask 62 in the longitudinal direction, and are configured so that the second vapor deposition mask 61 is fitted therein.

Therefore, the second vapor deposition mask 61 is provided with a hole at a position corresponding to the stopper 623.

Note that the method for excluding the second vapor deposition mask 61 is as described in FIG. 2.

FIG. 4 is a side sectional view showing another embodiment of the structure in which two vapor deposition masks are attached to the substrate 5, in which parts equivalent to the forebrain are given the same reference numerals.

624 is a metal fitting for receiving the first vapor deposition mask 62, and 613 is a hook for bending the end of the second vapor deposition mask 61.
3 is an O-ring for security maintenance, and 14 is a hook for removing the second vapor deposition mask 61.

This configuration differs from the above-mentioned embodiments in that metal fittings 624 are provided at both ends of the first vapor deposition mask 62 in the longitudinal direction of the second vapor deposition mask 61, and the second vapor deposition mask 61 is mounted on the metal fittings 624. This figure shows the state in which the vacuum vessel 1 is inserted to form a predetermined vapor deposition film. The vapor deposition mask 61 is detached from the vapor deposition path by pulling the hook 613 thereof.

FIG. 5 shows a substrate 5 on which a vapor-deposited film is formed by the formation force method of multiple vapor-deposited films according to the present invention, in which a is a plan view and b is a side cross-sectional view, where parts equivalent to the forebrain are designated by the same reference numerals. attach

51 is an electrode formed on the substrate 5, 52 is an electrode terminal, 53 is a first dielectric vapor deposited film on the discharge portion, and 54 is a second dielectric vapor deposited film that covers the discharge portion and the terminal portion.

The size of the window of the vapor deposition mask is not shown in Figure 5a, and the double diagonal line is the second one used when depositing only the discharge area, and the sum of the single and 71 double diagonal lines is the one used to evaporate the discharge area and the terminal area. The first one has a large window for simultaneous vapor deposition.

Therefore, the deposition film is formed by passing through a second mask with a small window and the first mask below it to form a deposition film on the discharge area, and then through the first mask to form a thin deposition film including the discharge area and terminal area. Do it like this.

In addition, in this example, 2
Although the formation of a vapor-deposited film has been described in detail, the present invention is applicable not only to gas discharge panels but also to EL and other flat panel display elements, and the vapor-deposited film is not limited to two layers but can be formed in a plurality of layers.

It is also possible, of course, to form multiple deposited films by changing the deposition materials.

As explained above, according to the method for forming multiple deposited films according to the present invention, it is possible to form multiple layers of deposited films in one step, which significantly shortens the manufacturing process and contributes to improved efficiency. However, since they are dogs and are not exposed to the outside air, we can expect their quality to improve.

[Brief explanation of the drawing]

FIG. 1 is a side cross-sectional view of essential parts showing an embodiment of the method for forming multiple deposited films according to the present invention, FIGS. 2 to 4 are side cross-sectional views showing the mounting structure of a vapor deposition mask according to the present invention, The figures are a side sectional view and a plan view of a substrate formed by the method for forming multiple deposited films according to the present invention. 1: Vacuum container, 2: Vapor deposition sample container, 3: Vapor deposition sample, 4:
Rotating frame, 5: Substrate, 7: Heater, 8: Rotating conduction roller, 9: Hanging tool, 10: Shaft, 11: Push rod, 13:
O-ring, 14: hook rod, 51: electrode, 52: electrode terminal, 53: dielectric vapor deposited film on discharge portion, 54: dielectric vapor deposited film on discharge portion and terminal portion, 61: second vapor deposition mask, 62: First vapor deposition mask, 611: 621: Mounting fitting, 612: Iron piece, 613: Hook, 622: Permanent magnet, 623: Stopper, 624: Holder is metal fitting.

Claims (1)

[Claims] 1. At least two masks, a first vapor deposition mask having a predetermined pattern of openings and a second vapor deposition mask having an opening pattern different from that of the first vapor deposition mask, on the surface of the object on which a vapor deposition film is to be formed. are removably stacked and installed in a vapor deposition apparatus, and after forming a vapor deposition film corresponding to the opening pattern of the second vapor deposition mask through these double vapor deposition masks, remove the second vapor deposition mask from the object on which the vapor deposition film is to be formed. 1. A method for forming a multiple evaporation film, characterized in that the evaporation film is moved out of the evaporation path, and then the evaporation film corresponding to the opening pattern of the first evaporation mask is successively formed through the first evaporation mask.