JPS582472B2 - Heisenkai Sakusei Souchi - Google Patents

Description

[Detailed Description of the Invention] The present invention provides a method for applying a thick film conductor paste (hereinafter referred to as paste) to a circuit board to be wired (hereinafter referred to as board) with a required wiring circuit.
The present invention relates to a wiring circuit creation device that forms a pattern using the following.

Recently, when mounting electronic devices, there has been a demand for higher density, higher speed, smaller size, and lighter weight.As a result, the wiring circuits on the board need to be denser and have the shortest distance between interconnections, making it more difficult than just an IC. There are limits to how it can be combined with a printed circuit board, and there are expectations for modularization in which ICs are mounted at the chip level.

Conventionally, in order to form wiring circuits on this type of board, paste was screen printed to form the required wiring circuits.
The paste is fired in a firing furnace.

In this conventional method, the paste is applied to the entire surface of the screen by the reciprocating motion of a squeegee, which wastes paste that is more expensive than the actual wiring circuit required, resulting in higher product costs. There is a drawback.

Furthermore, in the case of multilayer wiring, each layer needs to match with respect to a certain reference point.

For this reason, in the screen printing process, when printing wiring circuits for each layer, reference marks are printed to align the substrate and screen.

This positioning work required time and skill, and product yield was a problem.

On the other hand, changes in paste viscosity during screen printing,
Due to the adjustment of the supply amount and the pressure setting of the squeegee, the thickness of the wiring circuit becomes uneven, and short circuits and defects occur in the pattern of a very small part of the wiring circuit, and due to the need to reduce costs, it is not allowed to be discarded immediately. However, the task of completely repairing and remanufacturing these defective products is also technically and efficiently problematic, and there has been a demand for the development of a reliable wiring circuit creation device.

An object of the present invention is to eliminate such drawbacks, minimize paste consumption, and provide a highly reliable wiring circuit creation device.

According to the present invention, the table has the function of mounting a wiring board, has a driving table, and has patterns P1, P2, ... Pi, ... Pn corresponding to a plurality of wiring circuits, and covers the entire surface. A mask coated with a release agent and a pattern P1 of the mask
, P2...Pi,...Pn, and a plurality of dispensers D1 having a paste supply forming function at their tips.
, D2, . . . Di, .
Needle valves V1, V2... connected to i,...Dn
Vi, . . . Vn, and a paste supply section having a pressure control section and connected to the dispenser head via the twenty dollar valves V1, V2, . . . Vi, . and the valves V1, V2,...Vi
,... Creation of a wiring circuit consisting of a dispenser control unit that is connected to Vn and controls the timing of supplying paste to the dispenser head, and a central control unit that is connected to the table and the dispenser control unit and controls each operation. A device is obtained.

Next, one embodiment of the present invention will be described with reference to the drawings.

Figure 1 is a diagram of a product in which a wiring circuit is created using paste on a board, Figure 2 is a configuration diagram showing how the wiring circuit is created by conventional screen printing, and Figure 3 is a wiring diagram of an embodiment of the present invention. 4 is a perspective view showing a state in which a board and a mask are superimposed, FIG. 5 is a sectional view of the main part of FIG. 3, and FIG. 1 is an explanatory diagram showing a state in which a wiring circuit has been created; 1 is a substrate; 2 is a wiring circuit formed on the substrate 1 with paste; FIG.

3 is a printing screen having a wiring circuit pattern; 4
is the screen frame holding the printing screen 3, 5
is a squeegee for applying the paste 6; 7 is a chuck having a vacuum hole 103 provided on the table 8; 09 is a mask for mounting and fixing the substrate 1; 09 is a mask loaded on the substrate 1 and positioned by the positioning plate 10; Patterns P1, P2, ...Pi, ...P corresponding to multiple wiring circuits
n, and the entire surface is coated with a mold release agent, such as tetrafluoroethylene.

Also, the patterns P1, P2, ... Pi, ... of this mask 9
...The width Wn and length Ln of Pn are the width Wn and length L of the wiring circuit.
It is finished to have the same dimensions as n, and the thickness H is made thicker than the thickness H of the wiring circuit 2 after firing, taking into account the minimum shrinkage of the paste 6 forming the wiring circuit 2. .

11 is a dispenser head, pattern Pi of mask 9
, P2, ... Pi, ... Pn, and a supply port 104 for the paste 106 and a paste molded piece 10 at the tip.
A plurality of dispensers D1, D2, ...Di having 5
, . . . Dn are arranged independently in a straight line facing the table 8.

This dispenser head 11 includes a dispenser D1,
Twenty-one dollar valves V1, V2, . . . Vi, . . . Vn are connected corresponding to D2, . . . Di, . . . Dn.

Reference numeral 12 denotes a paste supply section which has a compressed air source 20 and a pressure control section 13, stores paste and supplies a fixed amount of paste, and is connected to the dispenser head 11 through the needle valves V1, V2...Vi,...Vn. is connected to.

14 are needle valves V1, V2, ...Vi, ...Vn
This is a dispenser control unit that is connected to the dispenser head 11 and controls the timing of supplying paste to the dispenser head 11.

15 is a central control unit, and a motor 16 that drives the table 8.
It is connected to the generator 17 and the dispenser control unit 14 to control their respective operations.

18 is a vacuum source connected to the chuck.

19 dispenses the paste 6 with dispensers Di, D2, ... Di
, . . . Dn, 0101 is an arrow indicating the direction in which the squeegee 5 moves, and 102 is an arrow indicating the direction in which the table 8 moves.

Next, the operation of the illustrated embodiment will be explained.

First, in FIG. 3, the substrate 1 is placed on the chuck 7 of the table 8.
and set it on the positioning plate 10, and then turn on the vacuum source 18.
is operated to fix the board 1.

Next, the mask 9 is placed on the fixed substrate 1 in alignment with the positioning plate 10.

This superimposed state is shown in FIG. 4.

Next, the pressure control unit 13 is set to an appropriate pressure, and the dispensers D1, D2, ...Di of the dispenser head 11 are
. . . Deliver the paste 106 to the tip of Dn and close the twenty-one dollar valves V1, V2, . . . Vi, . . . Vn.

Furthermore, the origin of the table 8 and dispenser head 11 is aligned.

Next, a pattern of the wiring circuit 19 that is synchronized with the amount of movement of the table 8 is set in the dispenser head control section 14.

When the table 8 is next started to move in the direction of the arrow 102 in FIG. 5 while maintaining this state, the amount of movement is
When a set amount preset in the dispenser control unit 14 is reached via the valves V1, V2, . . .
...Vi, ...Vn is selected and activated, and the paste 6 is dispensed onto the substrate 1 by the dispensers D1, D2, ...
Di, .

In general, depending on the viscosity of the paste 106, it may flow out after application, increasing the variation in circuit width and causing short circuits. Therefore, this mask 9 plays a major role in determining the circuit width and length, and the paste 106 consumption is also kept to a minimum.

The state in which this circuit is created is as shown in FIG.
, . . . Dn and the paste molded piece 105 is set to an appropriate value, a stable and constant film thickness can always be obtained.

FIG. 6 shows a state in which the creation of the wiring circuit 19 is completed,
In this state as shown in the figure, it is placed in a firing furnace, heated to a predetermined temperature, and cured.

When the mask 9 is peeled off from the substrate 1 after this baking process is completed,
A target wiring circuit 19 is formed on the substrate 1, resulting in a product.

In this case, since the surface of the mask 9 is coated with a mold release agent, it can be easily peeled off without any adhesion.

As explained above, according to the present invention, it is possible to solve the conventional drawbacks of short circuits, defects, and uneven film thickness in wiring patterns, and to achieve high reliability with high efficiency and minimal paste consumption. , it exhibits many effects such as obtaining high-quality products.

[Brief explanation of the drawing]

Figure 1 is a product diagram of a wiring circuit created using paste on a board, Figure 2 is a configuration diagram showing how the wiring circuit is created using conventional screen printing, and Figure 3 is a wiring circuit according to an embodiment of the present invention. Figure 4 is a perspective view showing the state in which the substrate and mask are superimposed, Figure 5 is a sectional view of the main part of Figure 3, and Figure 6 is a diagram showing the wiring on the substrate using the mask. This is an explanatory diagram showing the state in which the circuit has been created. 1 is a board, 2 is a wiring circuit, 3 is a printing screen, 4 is a screen frame, 5 is a squeegee, 6 is a paste, 7 is a chuck, 8 is a table,
9 is a mask, 10 is a positioning plate, 11 is a dispenser head, 12 is a paste supply section, 13 is a pressure control section, 14 is a dispenser head control section, 15 is a central control section, 16 is a motor, 17 is a generator, 18 is the vacuum source,
19 is a wiring circuit, and 20 is a compressed air source.

Claims (1)

[Claims] 1. Has the function of mounting a wiring board, has a driving table, and a pattern corresponding to multiple wiring circuits,
A mask whose entire surface is coated with a mold release agent, and a plurality of dispenser groups corresponding to the pattern of the mask and having a paste supply forming function at their tips are arranged in a straight line and are placed opposite to the table. The dispenser head has a needle valve group connected to the dispenser group of the dispenser head, and a pressure control section, and is connected to the dispenser head via the needle valve group, and stores and supplies a fixed amount of paste. a paste supply section, a dispenser control section that is connected to the needle valve group and controls the timing of supplying paste to the dispenser head, and a central control section that is connected to the table and the dispenser control section and controls the operation of each. A wiring circuit creation device comprising: