JPS5826155B2 - Contact free/lock device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a contact free lock device suitable for contacting and releasing contact between female and male contacts in IC sockets and IC packages.

Contact free locking devices are often used as, for example, no-load attachment/detachment devices for ICs, but the conventional free locking devices of this type include a device in which an implantable contact is inserted through a cam hole in a slide plate. A typical example is a method in which the slide plate is moved horizontally or vertically by the operation of a camshaft having a bending part, and the contactor is opened and closed within the cam hole. The thickness increases due to the interposition, manufacturing precision is required to guide the contact to the correct opening/closing regulation position within the cam hole of the slide plate, dead space is created on the left and right sides necessary for the slide plate to slide, and the contact Since the contact pieces are forced to open and close, there is a risk of elastic deterioration or deformation, and there are drawbacks such as heavy sliding operation.

Therefore, the present invention modifies these slide plate methods, and as will be described in detail in the embodiments described below, the implanted leg of the contact is given flexibility using the implanted leg on the insulating substrate as a support point. The upper part is held by a rotating piece, and the above-mentioned contact piece is displaced between a contact release position and a contact position by the rotating operation of a legitimate child provided on the rotating piece, so that the contact piece is free from contact with a terminal such as an IC lead.・It is characterized by a lock operation.

The drawing shows an optimal embodiment of the moderation holding mechanism for each of the above positions using a rotating sesame, and in the drawing, 1 is a contactor which is provided with flexibility using the leg part 3 implanted in the substrate 2 as a support point. , 4 corresponds to the above-mentioned fixed fulcrum rotating top for holding the upper part of the implanted leg of the contactor 1, and 5 corresponds to the above-mentioned turning operation knob protruding from the side pillar surface of the rotating top.

The illustrated embodiment shows a case where a large number of the contacts 1 are implanted in the connecting holes 7 arranged in a row in the insulating substrate 2, and the rotating sesame 4 is provided for each unit, with several contacts as a unit. There is.

Figures 1 and 2 illustrate one unit.

The contact holes 7 of the insulating substrate 2 are arranged in two rows on the left and right, and the contact 1 is inserted vertically into each contact hole 7 and press-fitted into the bottom wall of the connection hole 7 with its press-fitting leg portion 3 .

The contactor 1 includes a connecting leg 9 for connecting to a printed circuit board or the like that protrudes below the implantable leg 3, and also includes a flexible leg 10 that stands up on the implantable leg 3. A contact portion 11 having a sandwiching structure is provided through the portion 10, and this is positioned below the opening of the connection hole 7, and the ICIJ-
It is configured to make contact with a connection terminal such as a cable.

The drawing shows the connection mechanism between the IC socket and the IC package, and 8 in the drawing shows two types of ICs inserted into the connection hole 7.
Package leads are shown superimposed.

1 and 3 show the contact released state (free state) between the I CIJ-domain 8 and the contactor 1, and FIGS. 2 and 4 show the same contact state (locked state), that is, the ICIJ-domain 8 is inserted between the contact portions 11 to establish an electrical connection.

The contactor 1 is given flexibility by the flexible leg portions 10, and is allowed to be displaced to each of the above positions.

As described above, the rotary piece 4 controls the action of forcibly displacing the contact 1 to each of the above positions.

As shown in the figure, the rotating block 4 is assembled into the substrate 2 so as to traverse between several connecting holes 7 as a unit.

Contact 1 embedded in connection hole 7 crossed by each rotating sesame 4
The upper part of the implanted leg part 3 is penetrated and held by the rotating sesame 4.

In order to hold the contactor 1 in the rotating sesame, the contact portion 11
In other words, the insertion plate part 13 is directly below the flexible leg part 10.
is extended and press-fitted into the contact hole 14 vertically penetrated through the center of the rotating sesame 4, and the insertion plate portion 1
A claw piece 15 cut and raised from the plate surface of No. 3 is engaged with a step formed on the inner wall of the hole to restrict vertical displacement.

A vertical cut 17 is made in the insertion plate part 13 to provide elasticity due to the press-fitting, and the flexible leg part 10 is extended within the cut 17 to allow free flexibility.

The flexible leg portion 10 preferably extends integrally with the engagement plate portion 13 from the rotation fulcrum P of the rotation sesame or the vicinity of the rotation fulcrum, and is flexible as the rotation sesame 4 rotates. The vertical tension and contraction of 10, that is, the amount of deflection, is kept to a minimum.

The heirs 5 of each rotary sesame 4 are protruded perpendicularly to the rows of connection holes 7, and protrude to the outside through knob guide holes 12 bored in the outer surface of the board along the rows of connection holes 7.

The knob guide hole 12 allows the heir 5 to rotate with a fixed stroke up and down, and the sesame 4 moves up and down as the heir 5 moves up and down.
Rotate clockwise and counterclockwise about fulcrum P.

The rotation of the rotating sesame 4 displaces the contact 1 held therein between a contact position and a contact release position according to the direction of the rotation force.

That is, in the illustrated embodiment, when the eldest child 5 is rotated to its upper limit under the control of the knob guide hole 12, the rotating sesame 4
is rotated in the same direction, and along with this constant rotation, the contact 1 is displaced in the same direction, and the ICIJ- is inserted into the connection hole 7.
The pad 8 is sandwiched in the contact portion 11 under elastic contact, and a contact state (locked state) is established (FIGS. 2 and 4).

Also, rotate the legitimate child 5 to the lower limit of the guide hole 12 and rotate the rotating sesame 4.
By rotating the contactor 1 at a constant rate in the opposite direction to the above, the contact 1 held by the contact 1 is displaced in the opposite direction to the above and detached from the IC lead 8.

That is, the contact is released and the IC lead 8 is placed in a free state.

As a result, the IC package can be removed or reinserted without any load.

Preferably, the connection terminal of the above-mentioned ICIJ-do 8 is inserted inside a perpendicular line passing through the rotation fulcrum P which is the center of the rotating sesame 4 (with the legitimate child side being the outside), and the rotating sesame 4 is inserted into the above-mentioned When the contact portion 11 is rotated to the contact position, it is pulled downward (toward the bottom of the connection hole 7) by the sliding force of the contact portion 11 that is rotated together with the contact portion 11.

Each rotating sesame 4 preferably has a cylindrical shape as shown in the figure, and is slidably fitted to a shaft hole 16 passing through a row of connecting holes 7 formed by hollowing out the connecting holes 7, so that the rotating sesame 4 is fitted on the sliding surface. Stable support and ensure smooth rotation.

As explained above, in the present invention, only by rotating the rotating sesame 4 by rotating the eldest child 5 projected from the side surface of the substrate 2, the contact position of the contact 1 held by the rotating sesame 4 can be brought into contact with the contact position. Displacement to the release position can be easily and reliably obtained, and the free locking device for the contact 1 can be constructed simply and rationally.

Unlike the conventional slide plate method, since it is a rotating force type that uses the eldest child 5 as a lever, the operation is nimble and accurate, and bad contact and incomplete release can be reliably prevented.

Furthermore, compared to the case where a slide plate is interposed, the structure is not bulky, and the rotating top itself only rotates within the substrate 2 and does not protrude toward the end of the row of connection holes of the substrate.

Therefore, for example, it is often the case that the insulating substrate 2 is connected in multiples in the direction of the connection hole 7 and several IC packages are mounted thereon, but according to the present invention, it is possible to bond the end surfaces of the substrates. Multiple connections can be made without any problems.

Further, according to the present invention, as described above, the rotary sesame 4 can be provided for each unit, with several contacts 1 as a unit,
The rotating sesame 4 for each unit allows for contact or contact release operations, attachment and detachment of IC packages for each unit, etc.

Providing a rotary knob for each unit in this way makes the operation easier and significantly reduces the fatigue of workers who have to attach and detach large amounts of mm in IC package performance tests and the like.

In the embodiment shown in the same figure, a connecting groove 18 is provided at one end of the board 2, and a mortise hole 19 is provided at the other end, thereby making it possible to connect multiple boards.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, and FIGS. 1 and 2 are perspective views showing a free locking mechanism of a contactor using a rotating sesame. Figure 1 shows the state in which the ICIJ-de and the contact are released from contact, and the second
The figure shows the same contact state, and Figures 3 and 4 are enlarged views showing the free locking structure of the contact by the rotating sesame, taken in cross section of the insulating board for contact implantation. Figure 4 shows the state of contact release between the ICIJ-de and the contact.
FIG. 5 is an overall plan view of the insulating substrate for contact implantation equipped with the free lock mechanism, FIG. 6 is a front view of the same, FIG. 7 is a side view of the same, and FIG. 8 is a front view of the contact. . DESCRIPTION OF SYMBOLS 1...Contact, 2...Insulating board for contact implantation, 3...Contact implantation leg, 4...
...Rotating sesame for contact displacement, 5... Same operating knob, 7... Connection L for inserting a connecting terminal with a contact inserted therein.

Claims (1)

[Claims] 1 Using the implanted leg as a support point, hold the upper part of the implanted leg of the contact, which has been given flexibility, with a rotating piece, and move the contact to the contact position by rotating the eldest child provided on the rotating piece. A free lock device for a contact, characterized in that it is configured to be displaced to a contact release position.