JPS5826199B2 - Manufacturing method of printed wiring board with metal core - Google Patents
Manufacturing method of printed wiring board with metal coreInfo
- Publication number
- JPS5826199B2 JPS5826199B2 JP13479580A JP13479580A JPS5826199B2 JP S5826199 B2 JPS5826199 B2 JP S5826199B2 JP 13479580 A JP13479580 A JP 13479580A JP 13479580 A JP13479580 A JP 13479580A JP S5826199 B2 JPS5826199 B2 JP S5826199B2
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- printed wiring
- manufacturing
- wiring board
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 title claims description 14
- 229910052751 metal Inorganic materials 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000005520 cutting process Methods 0.000 claims description 13
- 239000012467 final product Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、金属芯入り印刷配線板の製造法に関し詳しく
は表面を絶縁化処理した金属芯基板の外形加工又は外形
につながる作業用取手を切断し、金属芯基板の最終製品
形状への切断方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board with a metal core. Specifically, the present invention relates to a method for manufacturing a printed wiring board with a metal core. The present invention relates to a method for cutting into final product shapes.
電子機器の高密度化に伴い、印刷配線板への物理的要求
、例えば熱の拡散放熱能あるいは多数の重量部品の搭載
に耐える剛性を持つこと等の要求が強まり、従来の有機
材料を基体とする印刷配線板では十分に満足出来ないた
め金属材料を基体とする印刷配線板への指向がなされて
いる。As the density of electronic devices increases, the physical requirements for printed wiring boards, such as heat dissipation ability and rigidity that can withstand the mounting of a large number of heavy components, are increasing. Printed wiring boards made of metal materials are not fully satisfactory, so there is a trend towards printed wiring boards based on metal materials.
金属芯印刷配線板においては、表面を絶縁化処理した金
属芯基板を用いるが、一般にこの金属芯基板は、最終製
品外形加工に作業用取手を付加したものに、絶縁処理し
たものか又は最終製品形状よりひと1わり大きな形状の
ものを絶縁処理したものである。Metal-core printed wiring boards use a metal-core substrate whose surface is insulated, but generally, this metal-core substrate is either an insulated one with a work handle added to the final product external shape, or a final product. It is a piece that is slightly larger than the original shape and has been insulated.
この金属芯基板は、印刷配線加工により導電回路を形成
後外形加工又は作業用取手を切断し金属芯基板を最終製
品形状にしこの切断部を絶縁化処理して金属芯印刷配線
板が出来上る。After forming a conductive circuit on this metal core board by printing wiring processing, the metal core board is shaped into a final product by cutting the handle for external processing or working, and insulating the cut portion to complete a metal core printed wiring board.
この外形加工又は作業用取手を切断し、金属芯基板を最
終製品形状にする場合通常の金型パンチング切断又はシ
ャーリング切断では第1図に示すように切断部にパリが
発生しパリ取りヤスリ仕上げ作業を必要とするほか、更
にパリ取り作業による塵挨、異物が印刷配線板に付着す
るなど工業的にも品質的にも問題を生じている。When cutting this external shape or working handle to make the metal core board into the final product shape, when cutting with normal mold punching or shearing, burrs are generated at the cut part as shown in Figure 1, and the finishing process is to remove burrs with a file. In addition, dust and foreign matter from the deburring work adhere to the printed wiring board, causing problems both industrially and in terms of quality.
第1図に於て1は最終製品形状の基板、2は作業用取手
、3はパリである。In FIG. 1, 1 is a board in the shape of a final product, 2 is a handle for working, and 3 is a handle.
本発明は、このような点に鑑みてなされたもので表面を
絶縁化処理した金属芯基板に印刷配線加工又は作業用取
手を切断し、金属芯基板を最終製品形状にし、切断箇所
の絶縁化を行う印刷配線板の製造方法に於いて外形加工
又は作業取手を切断するに際し切断部に■溝の切り込み
を入れ、この■溝の部分で溝の反対側より打抜切断する
事によりパリは製品板取みより飛び出さないので、パリ
取り作業は不要となり従って塵挨の付着も防止するもの
である。The present invention has been made in view of these points, and involves printing wiring or cutting work handles on a metal core substrate whose surface has been insulated, shaping the metal core substrate into a final product shape, and insulating the cut portion. In the manufacturing method of printed wiring boards, when processing the external shape or cutting the work handle, a groove is cut in the cut part, and the die is cut by punching from the opposite side of the groove at the groove part. Since it does not protrude from the board, there is no need to perform deburring work, thereby preventing dust from adhering.
第2図は本発明の方法により切断した場合を示すもので
4は■溝を示す。FIG. 2 shows the case of cutting by the method of the present invention, and 4 indicates the groove.
本発明を実施例により具体的に示す。The present invention will be specifically illustrated by examples.
実施例
厚み1.2間の鉄板の所定の箇所に直径16mmのスル
ホールをNCターレットパンチプレスであけ、最終製品
サイズに作業用取手を残し加工した。Example: A through hole with a diameter of 16 mm was punched at a predetermined location on an iron plate with a thickness of 1.2 mm using an NC turret punch press, and a working handle was left in the final product size.
エポキシ樹脂を電着塗装により150μ厚みで形成し、
更に増感剤入り接着剤HA−0,4(日立化成工業株商
品名)40μ厚みで塗布した。Epoxy resin is formed with a thickness of 150μ by electrodeposition coating,
Furthermore, a sensitizer-containing adhesive HA-0,4 (trade name, Hitachi Chemical Co., Ltd.) was applied to a thickness of 40 μm.
全面に5μの化学銅メッキを、更に20μの銅を電気メ
ッキによりパネル銅メッキを形成した。Panel copper plating was formed by chemical copper plating of 5 μm on the entire surface and further electroplating of 20 μm of copper.
パターンメッキ用レジストを形成し、パターン電気銅メ
ッキ、半田メッキを行い、回路、接栓を形成した。A resist for pattern plating was formed, and pattern electrolytic copper plating and solder plating were performed to form circuits and plugs.
パターンメッキを行った後塩化メチレン系剥離剤でパタ
ーンメッキ用レジスタを剥離し、過硫酸アンモン等で不
要パネル銅をエツチングした。After pattern plating, the pattern plating resistor was removed using a methylene chloride remover, and unnecessary panel copper was etched using ammonium persulfate or the like.
次に、作業用取手切断部に■溝を金型を用いパンチング
し、更に■溝の部分より切断出来る様■溝の反対面から
金型を行いパンチング切断を行い、切断断面にエポキシ
樹脂を筆塗りしたその結果切断部のパリは製品板厚より
飛び出す事もなく、又エポキシ樹脂の筆塗り後も充分絶
縁化され美麗な事が確認された。Next, use a die to punch a groove in the cutting part of the work handle, and then use a die to cut from the groove part using a die from the opposite side of the groove, then apply epoxy resin to the cut section with a brush. As a result of coating, it was confirmed that the cut part did not protrude beyond the thickness of the product board, and even after the epoxy resin was applied with a brush, it was sufficiently insulated and beautiful.
以上説明したように従来の外形加工又は作業用取手切断
ではパリが板厚より飛びだし、パリ取り作業を必要とし
更にこの塵挨が製品に付着し欠陥を発生すると共に、作
業工数的にも問題があったが、本発明によると、切断パ
リは板厚よりも飛び取す事もなく、更にパリ取りを必要
としないため塵挨の付着もなく、工数的にも品質的にも
同上させる事が出来た。As explained above, in conventional external processing or cutting of handles for work, the burr protrudes from the plate thickness, requiring burr removal work, and furthermore, this dust adheres to the product, causing defects and also problems in terms of work man-hours. However, according to the present invention, the cutting edge does not fly off beyond the board thickness, and furthermore, since there is no need to remove the edge, there is no adhesion of dust, and the same can be achieved in terms of man-hours and quality. done.
第1図は、従来法の作業用取手切断部分の断面図、第2
図は本発明による作業用取手切断部分の断面図である。
符号の説明、1・・・・・・最終製品形状の基板、2・
・・・・・作業用取手、3・・・・・・パリ、4・・・
・・・■溝。Figure 1 is a sectional view of the cutting part of the working handle in the conventional method,
The figure is a sectional view of a cut portion of the working handle according to the present invention. Explanation of symbols, 1... Board in final product shape, 2.
...Work handle, 3... Paris, 4...
...■ Groove.
Claims (1)
後、外形加工又は外形につながる作業用取手の切断によ
り、金属芯基板を最終製品形状にし、切断箇所の絶縁化
を行う金属芯入り印刷配線板の製造法に於いて絶縁化処
理した、金属芯基板にノツチ■溝を入れ、更に■溝の部
分を反対面より打抜、パンチ切断することにより金属芯
基板の最終製品形状とすることを特徴とする金属芯入り
印刷配線板の製造法。1 After forming a conductive circuit on a metal core substrate whose surface has been insulated, the metal core substrate is shaped into a final product by external processing or cutting of a working handle that connects to the external shape, and the cutting area is insulated. In the manufacturing method of wiring boards, a notch is formed in a metal core substrate that has been insulated, and the groove portion is punched and cut from the opposite side to form the final product shape of the metal core substrate. A method for manufacturing a printed wiring board with a metal core, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13479580A JPS5826199B2 (en) | 1980-09-26 | 1980-09-26 | Manufacturing method of printed wiring board with metal core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13479580A JPS5826199B2 (en) | 1980-09-26 | 1980-09-26 | Manufacturing method of printed wiring board with metal core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5759400A JPS5759400A (en) | 1982-04-09 |
| JPS5826199B2 true JPS5826199B2 (en) | 1983-06-01 |
Family
ID=15136710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13479580A Expired JPS5826199B2 (en) | 1980-09-26 | 1980-09-26 | Manufacturing method of printed wiring board with metal core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826199B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4803002B2 (en) * | 2006-11-27 | 2011-10-26 | パナソニック電工株式会社 | Metal printed circuit board |
| JP5614096B2 (en) * | 2010-05-19 | 2014-10-29 | 日産自動車株式会社 | Permanent magnet embedded in rotor core of rotating electrical machine and method for manufacturing the same |
| JP6704234B2 (en) * | 2015-10-06 | 2020-06-03 | 長堀工業株式会社 | Fluid fitting |
-
1980
- 1980-09-26 JP JP13479580A patent/JPS5826199B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5759400A (en) | 1982-04-09 |
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