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JPS5827214B2 - Clay-free enamel glaze - Google Patents
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JPS5827214B2 - Clay-free enamel glaze - Google Patents

Clay-free enamel glaze

Info

Publication number
JPS5827214B2
JPS5827214B2 JP53129919A JP12991978A JPS5827214B2 JP S5827214 B2 JPS5827214 B2 JP S5827214B2 JP 53129919 A JP53129919 A JP 53129919A JP 12991978 A JP12991978 A JP 12991978A JP S5827214 B2 JPS5827214 B2 JP S5827214B2
Authority
JP
Japan
Prior art keywords
clay
enamel
slurry
particle size
bubbles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53129919A
Other languages
Japanese (ja)
Other versions
JPS5556034A (en
Inventor
浩司 片岡
尚 伊藤
弘 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON FUEROO KK
Original Assignee
NIPPON FUEROO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON FUEROO KK filed Critical NIPPON FUEROO KK
Priority to JP53129919A priority Critical patent/JPS5827214B2/en
Publication of JPS5556034A publication Critical patent/JPS5556034A/en
Publication of JPS5827214B2 publication Critical patent/JPS5827214B2/en
Expired legal-status Critical Current

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  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Glass Compositions (AREA)

Description

【発明の詳細な説明】 本発明はほうろう下ぐずり、特に平滑なほうろう表面と
、高い耐電圧特性を併有するほうろうを得るのに適した
下ぐすりに関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an enamel sinter, and particularly to an enamel sinter suitable for obtaining an enamel having both a smooth enamel surface and high withstand voltage characteristics.

はうろう工業においては、天然鉱物質粘土は非常に重要
な役割を果している。
Natural mineral clay plays a very important role in the crawling industry.

この天然鉱物質粘土は一般にはカオリン、ハロサイト、
蛇紋石、アロフェン石、雲母鉱物、バーミュキュライト
、モンモリロナイト鉱物、緑泥石、混合層粘土鉱物等か
ら得られるもので、特にほうろう工業では蛙目粘土と呼
ばれる粘土が浮遊剤としてよく使用される。
This natural mineral clay is generally kaolin, hallosite,
It is obtained from serpentine, allophene stone, mica minerals, vermiculite, montmorillonite minerals, chlorite, mixed-layer clay minerals, etc. In particular, a clay called frog's eye clay is often used as a flotation agent in the enamel industry.

以下、本願中で使用される粘土は天然鉱物質粘土(上述
の分類に属する)を指すものである。
Hereinafter, clay as used in this application refers to natural mineral clays (belonging to the above-mentioned categories).

はうろう下ぐすりの配合で、従来は粘土の配合が不可欠
であった。
In the past, it was essential to include clay in the formulation of ``Hauro-shitagusuri''.

これは下ぐすり泥漿の沈降防止のみならず泥漿のレオロ
ジー特性の調節剤の役目を持つからである。
This is because it not only prevents sedimentation of the slurry slurry, but also acts as a regulator of the rheological properties of the slurry.

又、粘土の配合が下ぐすりの泡構造を発達させ、はうろ
うの機械的特性を向上させる一方でほうろう面の平滑度
を阻害し、耐電圧性を劣化させることが本発明者によっ
て見い出された。
In addition, the present inventor found that the addition of clay develops a foam structure in the enamel, improving the mechanical properties of the enamel, but inhibiting the smoothness of the enamel surface and deteriorating the voltage resistance. It was.

しかしながら、単に下ぐずり配合から粘土を減するだけ
では、上記のように下ぐすりの作業性が悪化するのみな
らず、下ぐすりの中の泡自体は小さくなってもかえって
その数が増大することは本発明者の認めるところで文献
にも記載されている。
However, simply reducing the amount of clay from the base mixer not only deteriorates the workability of the base mix as described above, but also increases the number of bubbles in the base mix even though they are smaller. This fact is acknowledged by the inventor and is also described in the literature.

(例えばB、Walker &J 、Campbell
、 1.V、E。
(e.g. B., Walker & J., Campbell
, 1. V.E.

Bulletin、18(12)1967)一方、本発
明の関連先行技術として、特公昭51−16451号が
挙げられる。
Bulletin, 18(12) 1967) On the other hand, Japanese Patent Publication No. 51-16451 can be mentioned as prior art related to the present invention.

しかしながら上記発明においては粘土を用いない代わり
にポリトラントFSなる高分子ポリサツカリド、スクレ
ログルカンを含む水溶性バイオポリマー組成物を用いて
いるが、これは浮遊剤として粘土と同効の作用を有して
いるので、たとえ粘土が使用されていなくともポリトラ
ントFSを用いるときには上記本発明の目的を達成する
ことはできない。
However, in the above invention, instead of using clay, a water-soluble biopolymer composition called Polytranto FS containing polymer polysaccharide and scleroglucan is used, but this has the same effect as clay as a flotation agent. Therefore, even if clay is not used, the above object of the present invention cannot be achieved when using Polytranto FS.

このことは、後記実施例と比較例の対比によって明らか
であろう。
This will be made clear by comparing the Examples and Comparative Examples described later.

従って、下ぐすり配合から粘土を除き、下ぐすり中の泡
を微小にし、かつ少数とすることによって、仕上げぐす
りの品質、外観の改良が長年に亘る研究者の願いであっ
たが、実際には極めて困難で通常7%程度含まれる粘土
の配合量を、最少の場合でも4%程度に減らすだけで1
〜2%の存在は止むを得ないこととされてきた。
Therefore, it has been the long-held desire of researchers to improve the quality and appearance of finished grains by removing clay from the base grain mixture and reducing the number of bubbles in the grain. In reality, it is extremely difficult to reduce the amount of clay, which is usually around 7%, to around 4% at the minimum.
The existence of ~2% has been considered unavoidable.

ところが本発明者の研究によればフリットに粘土を添加
せず少量のシリカゲル、アルミナゾル、コロイダルシリ
カの1種以上を配合し、通常の粒度(約10〜15μm
)より細く、平均粒度を6.5μm以下に湿式ミル引き
して得られる泥漿をくすり掛は乾燥後、焼成して得られ
る下ぐずりは泡が極めて小さく、又その数も少なく、そ
の上に仕上げぐすりを施して得られるほうろう面の平滑
度は飛躍的に向上し、同時に高い電気絶縁性を有するこ
とが判明した。
However, according to the research of the present inventor, a small amount of one or more of silica gel, alumina sol, and colloidal silica was blended into the frit without adding clay, and the particle size was reduced to a normal particle size (approximately 10 to 15 μm).
) The slurry obtained by wet milling to finer particles with an average particle size of 6.5 μm or less is dried and then fired. It was found that the smoothness of the enamel surface obtained by applying the glazing was dramatically improved, and at the same time, it had high electrical insulation properties.

本発明は浮遊剤としての粘土を含有せず、シリカゲル、
アルミナゾル、コロイダルシリカの1種以上を含有し固
体粒子の平均粒度が6.5μm以下になるように湿式粉
砕して得られる泥漿を使用するほうろう下ぐずりである
The present invention does not contain clay as a floating agent, and contains silica gel,
This is an enameled slurry containing one or more of alumina sol and colloidal silica, which is obtained by wet grinding so that the average particle size of solid particles is 6.5 μm or less.

上述のシリカゲル等(以下コロイド状耐火物質という)
は、親水性コロイドを形成し、フリットの粒子の沈降を
防止する働きを有する、はうろうの焼成温度では熔融し
ないコロイド状耐火物質である。
Silica gel, etc. mentioned above (hereinafter referred to as colloidal refractory material)
is a colloidal refractory material that does not melt at the firing temperature of wax, which forms a hydrophilic colloid and has the function of preventing settling of frit particles.

その含有量は1〜7%程度が適当である。粉砕粒度は泥
漿乾燥物をフィッシャ一式平均粒度計で測定して得られ
る値で6.5μm以下とすることが必要であって、工業
技術的に可及的に小さくすることが望ましく、これ以上
では泥漿の沈降が著しく、<すりかけ作業が困難となる
The appropriate content is about 1 to 7%. The pulverized particle size needs to be 6.5 μm or less, which is the value obtained by measuring the dry slurry with a Fisher set average particle size meter, and it is desirable to make it as small as possible from an industrial technical point of view. Sedimentation of the slurry is significant, making the scouring process difficult.

本発明においてコロイド状耐火物質を配合する意義は末
だ明らかではないが、これらの物質の配合により下ぐす
り焼成の初期に於て下ぐすりの熔融がおくれ、焼成前の
膜の収縮で生成するマイクロ・クラックの存在が下ぐす
りの脱気を促進し、気泡の減少につながるものと推察さ
れる。
Although the significance of incorporating colloidal refractory materials in the present invention is not yet clear, the combination of these substances delays the melting of the underlayment at the initial stage of firing, and the formation of the refractory material due to shrinkage of the film before firing. It is presumed that the presence of micro-cracks promotes deaeration of the underfill, leading to a reduction in air bubbles.

上述した様に本発明では従来得ることができなかった平
滑なほうろう表面を得ることができる上、従来の下ぐず
りでは約1500Vでピンホールを生ずるのに対し、本
発明においては少くとも3000Vの高電圧に耐えられ
る。
As mentioned above, in the present invention, it is possible to obtain a smooth enamel surface that could not be obtained conventionally, and in contrast to the conventional undercutting which causes pinholes at about 1500V, in the present invention, a high level of at least 3000V can be obtained. Can withstand voltage.

又はうろう表面の平滑度が増すことによって、その耐蝕
性も向上するという副次的成果も期待でき、はうろう工
業に於ては実用上非常に有意義である。
Furthermore, by increasing the smoothness of the wafer surface, a secondary effect of improving its corrosion resistance can also be expected, which is of great practical significance in the warou industry.

なお、本発明の下ぐすりは施釉の対象となる基材に限定
されることなく、又その施釉方法についても従来用いら
れているすべての方法に適用されるものである。
The underglaze of the present invention is not limited to the base material to be glazed, and can be applied to all conventional glazing methods.

又、はうろうのうわぐすりは一般に下ぐずりとその上に
施す仕上げぐすりから構成され、本発明は下ぐすりに関
するものであるが広義に解釈すれば公知の下ぐすりのよ
うに必ずしも密着酸化物を含有する必要はなく、直接1
回掛は前処理を施した素地金属では密着剤を欠く明色の
下掛けぐずりであってもよい。
In addition, the glaze of the fly is generally composed of a bottom glaze and a finishing glaze applied thereon, and although the present invention relates to the bottom glaze, if interpreted in a broad sense, it does not necessarily have to be the same as the known glaze. It is not necessary to contain adhesion oxide, and directly 1
The hook may be a light-colored undercoat that lacks an adhesive on pretreated base metals.

以下、本発明の実施を具体的に示すと に従来のほうろ
う技術による下ぐすりとを比較することによって本発明
の効果を実証する。
Hereinafter, the implementation of the present invention will be specifically shown, and the effects of the present invention will be demonstrated by comparing it with a glaze made by conventional enamel technology.

実施例 1 下記に示すミル配合で泥漿の平均粒径が6.0〜6.5
μmになる様ミル引きし下ぐすり用泥漿を得る。
Example 1 The average particle size of slurry was 6.0 to 6.5 with the mill formulation shown below.
A slurry for milling is obtained to obtain a slurry with a thickness of μm.

ミル配合 #2232(市販フリット) 30重量部#223
6(// ) 30 //=l=l=22
40(// ) 40 //シリカゲル
4 〃アルミン酸ソーダ
Q、3 tt水
45 〃この泥漿を既知の方法で前処理した直径
18c′rIL鋼板厚み1.0間の鍋に浸しかけにより
施釉し、乾燥後850℃で約3分間焼成した。
Mill blend #2232 (commercially available frit) 30 parts by weight #223
6(// ) 30 //=l=l=22
40 (// ) 40 // Silica gel
4 Sodium aluminate
Q, 3 tt water
45 This slurry was glazed by dipping into a pot having a diameter of 18 cm and a thickness of 1.0 mm, which had been pretreated by a known method, and after drying, it was fired at 850° C. for about 3 minutes.

得られた下ぐすりほうろうを斜光照明で顕微鏡観察した
ところ、泡は非常に小さく又その数も少ない。
When the obtained underglazing enamel was observed under a microscope under oblique light, the bubbles were very small and the number of them was small.

又サンコラ電子研究所製THE−20A型ピンホール探
知器で3000V(直流)でピンホール試験を行ったが
ピンホールは全く認められなかった。
In addition, a pinhole test was conducted at 3000V (DC) using a THE-20A pinhole detector manufactured by Sancora Electronic Research Institute, but no pinholes were observed.

得られた下ぐすりほうろう層の顕微鏡写真による泡構造
を第1図に示す。
The foam structure of the obtained underglazing enamel layer is shown in FIG. 1 in a micrograph.

(拡大倍率75倍。以下同様) 比較例 1 下記に示す従来の下ぐすり用ミル配合で泥漿の平均粒径
が10〜11μmになるようミル引きし、得られた泥漿
を実施例1と同様の鍋に施釉し、乾燥後850’Cで3
分間焼成した。
(Enlargement magnification: 75 times. The same applies hereinafter) Comparative Example 1 Milling was performed using the following conventional mill formulation for milling so that the average particle size of the slurry was 10 to 11 μm, and the resulting slurry was milled in the same manner as in Example 1. Glaze the pot and dry it at 850'C for 3
Bake for a minute.

ミル配合 #2232(市販フリット) 30重量部1223
6(// ) 30 //#2240(/
/ ) 4Q //蛙目粘土
7重量部硅 石
5 〃含水硼砂 0,5〃亜
硝酸ソーダ 0.25 〃得られた下
ぐずりほうろう(粘土を含み粒径大)を斜光照明で顕微
鏡観察したところ、微小な泡C間に大きな泡が多く存在
し、その数も非常に多0゛又実施例1と同様ピンホール
テストを行ったところ(実施例1と同じ電圧)無数のピ
ンホールが描記された。
Mill blend #2232 (commercially available frit) 30 parts by weight 1223
6(// ) 30 //#2240(/
/ ) 4Q // Frog-eye clay
7 parts by weight silica stone
5 Hydrous borax 0.5 Sodium nitrite 0.25 When the obtained sagging enamel (contains clay and has large particle size) was observed under a microscope under oblique light, it was found that there were many large bubbles between the small bubbles C. The number of pinholes was also very large, and when a pinhole test was conducted in the same manner as in Example 1 (at the same voltage as in Example 1), countless pinholes were drawn.

得られた下ぐずりほうろう層の顕微鏡写真による泡構造
を第2図に示す。
The foam structure of the obtained enamel layer is shown in FIG. 2 as a micrograph.

比較例 2 下記のミル配合で泥漿の平均粒径が6〜7μWになるよ
うミル引きし、得られた泥漿を実施例1と同様の鍋に施
釉し、乾燥後850℃で3分間鵠成した。
Comparative Example 2 The slurry was milled using the following mill formulation so that the average particle size was 6 to 7 μW, the resulting slurry was glazed in the same pot as in Example 1, and after drying it was glazed at 850°C for 3 minutes. .

ミル配合 #2232 (市販フリット) 30重量部#223
6(// ) 30 //#2240(/
/ ) 4Q ttシリカゲル
3 〃蛙目粘土
1 〃含水硼砂 0.5〃アル
ミン酸ソーダ 0.2〃亜硝酸ソーダ
0.1〃水
45 〃得られた下ぐすりほうろう(粘土を含
む)を斜光照明で顕微鏡観察したところ、比較例1の泡
に比較して泡は小さいがその数はかえって多くな;でい
ることが判明した。
Mill blend #2232 (commercially available frit) 30 parts by weight #223
6(// ) 30 //#2240(/
/ ) 4Q tt silica gel
3 Frog-eye clay
1 〃Hydrous borax 0.5〃Sodium aluminate 0.2〃Sodium nitrite
0.1 water
45 When the obtained underglaze enamel (containing clay) was observed under a microscope under oblique light, it was found that although the bubbles were smaller than those of Comparative Example 1, the number of bubbles was actually larger.

得られた下ぐすりほうろう層の顕微鏡写真による泡構造
を第3図に示す。
The foam structure of the obtained underglazing enamel layer is shown in FIG. 3 as a micrograph.

実施例 2 下記に示すミル配合で泥漿の平均粒径が5.8〜6.0
μmになるようミル引きし、得られたスリップを公知の
方法で前処理した巾300 mm、長さ600mmのパ
ネルにスプレーで施釉し、乾燥後830℃で3.5分間
焼成した。
Example 2 The average particle size of the slurry was 5.8 to 6.0 with the mill formulation shown below.
The resulting slip was spray glazed onto a panel with a width of 300 mm and a length of 600 mm, which had been pretreated by a known method, and after drying was fired at 830° C. for 3.5 minutes.

ミル配合 #2232 (市販フリット) 30重量部1223
6(// ) 40 //−#2240(/
/ ) 40 〃硅 石
5 〃アルミナゾル 1重
量部シリカゲル 3 〃亜硝酸
ソーダ 0.1〃水
40 〃得られた下ぐすりのほうろう
層の泡構造を斜光照明で観察したところ、泡は極めて小
さく、且つその数も少ないことが確認された。
Mill blend #2232 (commercially available frit) 30 parts by weight 1223
6(// ) 40 //-#2240(/
/ ) 40 〃Silicon stone
5 Alumina sol 1 part by weight Silica gel 3 Sodium nitrite 0.1 Water
40 When the bubble structure of the enamel layer of the obtained underglaze was observed under oblique lighting, it was confirmed that the bubbles were extremely small and the number thereof was small.

この顕微鏡写真を第4図に示す。This micrograph is shown in FIG.

更に得られた下ぐずりほうろうを実施例1と同じピンホ
ール探知器でピンホールをテストしたところ、3000
■(直流)で全くピンホールは検出されなかった。
Furthermore, when the pinholes obtained were tested using the same pinhole detector as in Example 1, 3000
■ (DC) No pinholes were detected at all.

一方、得られた下ぐすりほうろうの上に従来公知のチタ
ン乳白上ぐすりをスプレーで施釉し、乾燥後800°C
で約3分間焼成したところ、得られたほうろう面は非常
に平滑でいわゆる鏡面に近い仕上であった。
On the other hand, a conventionally known titanium milky white top glaze was spray glazed on top of the obtained bottom glaze enamel, and after drying it was heated to 800°C.
When fired for about 3 minutes, the enamel surface obtained was extremely smooth and had a so-called mirror-like finish.

比較例 3 下記に示すミル配合で泥漿の平均粒径が4〜4.5μm
になるようミル引きし得られたスリップを実施例2と同
じパネルに施釉し、乾燥後830℃で約3.5分間焼成
した。
Comparative Example 3 The average particle size of slurry was 4 to 4.5 μm with the mill formulation shown below.
The resulting slip was glazed on the same panel as in Example 2, dried and fired at 830° C. for about 3.5 minutes.

ミル配合 #2232(市販フリット) 30重量部#223
6(// ) 30##2240(//
) 40 //蛙目粘土
4 〃アルミナゾル 1
〃硅 石 5 〃含水硼砂
0.5〃亜硝酸ソーダ
0.2〃水
40 〃得られた下ぐずりほうろう層の泡構造を斜光
照明で顕微鏡で観察したところ、比較的泡の大きさはそ
ろっているが泡の数が著しく多かった。
Mill blend #2232 (commercially available frit) 30 parts by weight #223
6(//) 30##2240(//
) 40 // Frog-eye clay
4 Alumina sol 1
〃Silicon stone 5〃Hydrous borax
0.5 Sodium nitrite
0.2 water
40 When the foam structure of the obtained sub-guzuri enamel layer was observed under a microscope under oblique illumination, it was found that although the size of the bubbles was relatively uniform, the number of bubbles was significantly large.

この顕微鏡写真を第5図に示す。This micrograph is shown in FIG.

更にこの下ぐすりほうろうの上に実施例2と同様チタン
乳白上ぐすりをかけ、乾燥後800℃で約3分間焼成し
たところ、得られた上ぐずり表面には小さい波が多く存
在し、従来の上ぐずりほうろう表面とほとんど差はなか
った。
Furthermore, when a titanium opalescent glaze was applied on top of this glazed enamel in the same manner as in Example 2, and after drying, it was fired at 800°C for about 3 minutes. There was almost no difference from the upper enamel surface.

実施例 3 下記のミル配合で泥漿の平均粒径が5〜6μmになるよ
うミル引きし、得られたスリップを既知の方法で前処理
した浴槽本体に焼成後のほうろう厚みが120〜140
μになるよう施釉し、乾燥後850℃で約6分間焼成し
た。
Example 3 The slurry was milled using the following mill formulation to have an average particle size of 5 to 6 μm, and the resulting slip was applied to a bathtub body pretreated by a known method to give an enamel thickness of 120 to 140 μm after firing.
It was glazed to give a thickness of μ, and after drying, it was fired at 850°C for about 6 minutes.

ミル配合 #2232 (市販フリット) 30重量部#22
36(// ) 30 //#2240(
// ) 40 //硅 石
15 〃シリカゲル
5 〃アルミン酸ソーダ 0.1〃
亜硝酸ソーダ 0.1〃得られた下ぐ
すり仕上げの浴槽の底面の一部を切りとり、斜光照明で
顕微鏡観察で泡構造を調べたところ、泡は非常に小さく
、且つその数が著しく少なかった。
Mill blend #2232 (commercially available frit) 30 parts by weight #22
36(// ) 30 //#2240(
// ) 40 // Silica stone
15 Silica gel
5 Sodium aluminate 0.1
Sodium nitrite 0.1 When we cut out a part of the bottom of the obtained bathtub and examined the bubble structure using a microscope under oblique light, we found that the bubbles were very small and the number of bubbles was extremely small. .

この顕微鏡写真を第6図に示す。又この浴槽本体を実施
例1で用いたピンホール探知器により4000V(直流
)でピンホールテストを実施したがピンホールは全く検
出されなかった。
This micrograph is shown in FIG. Further, a pinhole test was conducted on this bathtub body using the pinhole detector used in Example 1 at 4000V (DC), but no pinholes were detected.

更にこの浴槽に公知のチタン乳白上ぐすりを2回施釉、
焼成を繰り返し、最終製品に仕上げた上でサンコラ電子
研究所製THE−10A型ピンホール探知器で9000
V(直流)でピンホールテストを実施したがピンホール
は全く検出されなかった。
Furthermore, this bathtub is glazed twice with a well-known titanium milky finish.
After repeated firing and finishing the final product, it was inspected with a THE-10A pinhole detector made by Sancola Electronics Laboratory.
A pinhole test was conducted at V (direct current), but no pinholes were detected.

比較例 4 実施例3と同じミル配合で泥漿の平均ね径が8μmにな
るようミル引きしたスリップは沈降が激しい上、浴槽本
体に施釉したところ乾燥する迄に下ぐすりが流れて使用
することはできなかった。
Comparative Example 4 A slip milled using the same mill composition as in Example 3 so that the average diameter of the slurry was 8 μm caused severe sedimentation, and when the bathtub body was glazed, the glaze flowed by the time it dried, making it difficult to use. I couldn't.

比較例 5 特公昭51−16451号第4頁7欄35行目に明示さ
れているミル配合を用い泥漿の平均粒径が6μmになる
ようミル引きし得られた泥漿を公知の方法で前処理した
3 00imX 300mm(鋼板厚み0.8 ytw
)の平坦な鋼板に焼成後のほうろう厚みが90〜10
0μmになるようスプレーで施釉し乾燥後840°Cで
3分間焼成した。
Comparative Example 5 The slurry obtained by milling the slurry to an average particle size of 6 μm using the mill formulation specified in page 4, column 7, line 35 of Japanese Patent Publication No. 51-16451 was pretreated by a known method. 300imX 300mm (steel plate thickness 0.8ytw
) has a flat steel plate with an enamel thickness of 90 to 10 after firing.
It was spray glazed to a thickness of 0 μm, dried and then fired at 840°C for 3 minutes.

ミル配合 #2232(市販フリット) 30重量部#2236
(// ) 30 1/#2240(//
) 40 //ポリトラントF、S、
0.5 //亜硝酸ソーダ
0.5〃水
45 〃得られた下ぐすりほうろうを斜光照明でその泡
構造を顕微鏡で観察したところ、粗大泡が多数確認され
たとほうろう面の凹凸が激しいものであった。
Mill blend #2232 (commercially available frit) 30 parts by weight #2236
(// ) 30 1/#2240(//
) 40 //Politrant F, S,
0.5 // Sodium nitrite
0.5 water
45 When the foam structure of the obtained underglazed enamel was observed under a microscope under oblique illumination, many large bubbles were observed and the surface of the enamel was extremely uneven.

この顕微鏡写真を第7図に示す。This micrograph is shown in FIG.

実施例 4 表−1に示す調合組成のフリットを13000Gで熔解
、急冷して得た。
Example 4 A frit having the formulation shown in Table 1 was melted at 13000G and rapidly cooled.

得られたフリットの酸化物組成は表−2に示すとおりで
ある。
The oxide composition of the obtained frit is as shown in Table-2.

得られた3種のフリットを以下の配合で平均粒径が3〜
4μmになるようミル引きし、得られたスリップを既知
の方法で前処理した20X20iのほうろう用鋼板に厚
みが120〜130μになるよう施釉し、乾燥後820
℃で3.5分間焼成した。
The three types of frits obtained were mixed with the following composition to achieve an average particle size of 3 to 3.
Milled to a thickness of 4 μm, the obtained slip was glazed to a thickness of 120 to 130 μm on a 20×20i enameling steel plate pretreated by a known method, and after drying,
C. for 3.5 minutes.

得られた製品をピンホール探知器により5000V(直
流)でピンホールテストを実施したがピンホールは検出
されなかった。
A pinhole test was performed on the obtained product using a pinhole detector at 5000 V (DC), but no pinholes were detected.

ミル配合 フリット43 30重量物// /
I64 3Q //〃
/I6.5 40 〃シ
リカゲル 2 〃亜硝酸ソーダ
0.25 //水
45 〃尚上記においてシリカゲルの
代りにコロイダルシリカを用いても略々同様の結果かえ
られた。
Mill compound frit 43 30 weight // /
I64 3Q //〃
/I6.5 40 〃Silica gel 2 〃Sodium nitrite
0.25 // water
45 In the above, substantially the same results were obtained even when colloidal silica was used instead of silica gel.

上述の実施例及び比較例からも明白なように本発明の下
ぐすりによるほうろうは従来のほうろう技術ではとうて
い得られないほうろう表面の平滑性と高い電気絶縁性を
もつものである。
As is clear from the above-mentioned Examples and Comparative Examples, the enamel prepared by the underglazing of the present invention has a smooth enamel surface and high electrical insulation properties that cannot be obtained by conventional enamel technology.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、本発明の実施例1によって得られたほうろう下
ぐすりの泡構造を示す顕微鏡写真(拡大倍率75倍。 以下同様)。第2図、比較例1によって得られたほうろ
う下ぐすりの泡構造を示す顕微鏡写真。 第3図、比較例2によって得られたほうろう下ぐすりの
泡構造を示す顕微鏡写真。 第4図、本発明の実施例2によって得られたほうろう下
ぐすりの泡構造を示す顕微鏡写真。 第5図、比較例3によって得られたほうろう下ぐすりの
泡構造を示す顕微鏡写真。 第6図、本発明の実施例3によって得られたほうろう下
ぐすりの泡構造を示す顕微鏡写真。 第7図、比較例5によって得られたほうろう下ぐすりの
泡構造を示す顕微鏡写真。
FIG. 1 is a micrograph showing the foam structure of the enameled underglaze obtained in Example 1 of the present invention (magnification: 75 times; the same applies hereinafter). FIG. 2 is a microscopic photograph showing the foam structure of the enameled underglaze obtained in Comparative Example 1. FIG. 3 is a microscopic photograph showing the foam structure of the enameled underglaze obtained in Comparative Example 2. FIG. 4 is a micrograph showing the foam structure of the enameled underglaze obtained in Example 2 of the present invention. FIG. 5 is a microscopic photograph showing the foam structure of the enameled underglaze obtained in Comparative Example 3. FIG. 6 is a micrograph showing the foam structure of the enameled underglaze obtained in Example 3 of the present invention. FIG. 7 is a microscopic photograph showing the foam structure of the enameled underglaze obtained in Comparative Example 5.

Claims (1)

【特許請求の範囲】[Claims] 1 浮遊剤としての天然鉱物質粘土を含有せず、シリカ
ゲル、アルミナゾル、コロイダルシリカの1種以上を含
有し、かつ平均粒度が6.5μm以下になるように湿式
粉砕して得られたフリットを含む泥漿よりなるほうろう
下ぐずり。
1 Contains frit that does not contain natural mineral clay as a flotation agent, contains one or more of silica gel, alumina sol, and colloidal silica, and is obtained by wet grinding so that the average particle size is 6.5 μm or less Enamel stain made of mud.
JP53129919A 1978-10-21 1978-10-21 Clay-free enamel glaze Expired JPS5827214B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53129919A JPS5827214B2 (en) 1978-10-21 1978-10-21 Clay-free enamel glaze

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53129919A JPS5827214B2 (en) 1978-10-21 1978-10-21 Clay-free enamel glaze

Publications (2)

Publication Number Publication Date
JPS5556034A JPS5556034A (en) 1980-04-24
JPS5827214B2 true JPS5827214B2 (en) 1983-06-08

Family

ID=15021636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53129919A Expired JPS5827214B2 (en) 1978-10-21 1978-10-21 Clay-free enamel glaze

Country Status (1)

Country Link
JP (1) JPS5827214B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3224349A1 (en) * 1982-06-30 1984-01-05 Degussa Ag, 6000 Frankfurt SCREEN PRINT OIL FOR THE PRODUCTION OF FINE COLOR GRIDS AND RELIEF PRINTS ON CERAMIC MATERIALS
JP2774860B2 (en) * 1990-07-09 1998-07-09 日本碍子株式会社 Manufacturing method of stone enameled products

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127913A (en) * 1976-04-20 1977-10-27 Matsushita Electric Industrial Co Ltd Product coated with an layer of selffcleaning type

Also Published As

Publication number Publication date
JPS5556034A (en) 1980-04-24

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