JPS5832783B2 - Thin plate gripper - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin plate used when thin plate bodies such as semiconductor wafers (hereinafter referred to as wafers), which are arranged in advance in a holding jig to face each other, are stacked and transferred to another holding jig. This invention relates to a body gripping tool.

In general, as a method for diffusing specific impurities such as gallium and aluminum into wafers, overlapping diffusion (also known as coin stack diffusion), in which wafers are stacked on top of each other and diffusion is performed, is well known.

This method is often adopted because it allows a large number of wafers to be processed for the above-mentioned specific impurities.

In this overlapping diffusion process, each wafer is cleaned with chemicals by being held in a cleaning carrier jig facing each other as a surface treatment before diffusion, and then transferred to another holding jig. It will be necessary to transfer and overlap them.

As shown in FIG. 1, this carrier jig for cleaning uses tweezers 9 between a large number of grooves 3a and 3b formed at equal intervals in parallel on the inner surface between l pairs of opposing side plates 2a and 2b, respectively. By inserting the wafers 1 one by one using the wafers 1, the wafers 1 are arranged to face each other.

Further, as shown in FIG. 2, the diffusion boat used as the holding jig has a structure in which quartz rods 7 having a circular cross section are combined into a frame shape.

In addition, in FIG. 1, 4a and 4b are the respective side plates 2a and 2b.
Collars to maintain constant spacing, 5a, 5b and 6a
, 6b are l pairs of engagement protrusions and engagement holes provided on the upper surface of each side plate 2a, 2b, respectively.

In FIG. 2, 8 is a quartz rod that supports the wafers 1 placed one above the other on the boat so that they do not fall over, and the rod 8 is configured to be slidable along its longitudinal direction. .

However, conventionally, when transferring the wafers 1 arranged facing each other on a carrier jig for cleaning to another holding jig, it is necessary to manually transfer the wafers 1 one by one using tweezers 9, which is a time-consuming process. ) and troublesome;
Moreover, there was a drawback that the wafer was easily damaged.

The present invention has been made in order to eliminate such conventional drawbacks, and involves stacking thin plate bodies, such as wafers, which have been arranged in advance to face each other, and then gripping both ends of the stacked thin plate bodies. To provide a gripping tool for a thin plate body, which allows the work to be carried out easily and reliably by gripping the object in the same manner and then transferring it at once in that state.

The present invention will be described in detail based on examples using the following five drawings.

FIG. 3 shows an embodiment in which the gripping tool of the present invention is applied to a wafer, and FIG. 3A is an external perspective view, and FIGS. A vertical cross-sectional view of H is shown.

In FIG. 3, side plates 11 and 12 are vertically planted on both ends of the upper surface of a base 10 having a rectangular shape, facing each other along the longitudinal direction.

Both ends of each of these side plates 11 and 12 are bent portions 11a bent at right angles.

11b, 12a, and 12b, and collars 13a and 13b are interposed between the bent portions 11a and 12a, and between 11b and 12b so as to keep the side plates 11 and 12 at a constant distance.

In this case, the side plate LL12 installed on the base 10 is configured to have approximately the same dimensions and the same spacing as the cleaning carrier jig shown in FIG. 1, so that the cleaning carrier jig shown in FIG. 1 can be vertically stacked on the upper surface thereof.

In addition, a base 1 is provided near the openings on both sides of each side plate lL12.
The shaft hole 14a, 1 is provided relatively centrally near 0.
4b and 15a, an arcuate slit 16 centered on 15b.
a, 16b and 17a, 17b are respectively formed,
Each of these slits 16a and 17a and 16b, 17b
In between, shafts 18a, 18b, and 19a are formed to protrude outward at the lower positions of plate-shaped rotating plates 18, 19, respectively.

19b is each of the shaft holes 14a, 14b and 15a.

15b and each of these shafts 18a, 18b and 1
Each of the rotating plates 1B,
Operating pieces 18c, 18d and 19c, 19d, which are formed to protrude outward, are respectively fitted into the upper positions of 19.

Further, rectangular slits 20.21 are provided in parallel with the base 10 near the center opening of each side plate 1L12, and each of these slits 20.21 has a cross section Q).
The holding bodies 22 and 23 are L-shaped and fixed at one end or at the bottom of the base 10, and the other ends thereof are adapted to go in and out.

In this case, each of the holders 22, 23 is a pin, an elastic body with spring properties, a synthetic resin plate with flexibility, etc.f)3, and the elastic force of each of these holders 22, 23 is the same as the side plate 11. 12 is configured to act in the direction of opening outward.

In addition, in FIG. 3, 24a. 24b and 25a
, 25b are l pairs of engagement protrusions and engagement holes provided at the upper end of each side plate 11, 12, and these are the engagement protrusions and engagement holes 5a of the cleaning carrier jig shown in FIG. , 5b and 6a.

6b.

Next, an embodiment of the gripping tool configured in this way will be described based on FIGS. 4 to 6.

First, after cleaning the wafers 1 arranged opposite to each other on the cleaning carrier jig shown in FIG. 1, when placing the gripping tool shown in FIG. Each engaging protrusion 24a with the part facing down.

24b and 5a, 5b and engagement holes 5a, 5b and 25
After aligning and engaging the 5 gripping tools 31 and 25b, turn them upside down and attach the 5 gripping tools 31 as shown in FIG. 4a.
A cleaning carrier jig 30 is stacked on top.

At this time, if the holding bodies 22, 23 and rotating plates 18, 19 of the gripping tool 31 are kept open, each groove 3a of the carrier jig 30 will open.

A large number of wafers 1 arranged between 3b are simultaneously transferred into the gripping tool 31, and as shown in FIG.
0, the side plates 11, 12, and the rotating plates 18, 19.

Note that the rotating plates 18 and 19 are provided so that the weight of the stacked wafers 1 can be maintained, taking into consideration the thickness corresponding to the number of wafers held in the cleaning carrier jig 30 at a mutual interval b3. .

Next, when the operation pieces 18c, 18d and 19c, 19d of each rotating plate 18, 19 are slid along the arcuate slits 16a, 17a and 16b, 17b, the rotating plate 18
, 19 are closed and the wafers 1 are stacked on top of each other in a coin stack as shown in FIG. 4C.

When the bent other ends of each holding body 22.23 are inserted into the rectangular slints T-20 and 21 and projected in this state, each holding body 22.23 is attached to the rotating plate 18.19. A part of the outer circle of each wafer 1 superimposed on each other is held so as to be held therein.

Next, the cleaning carrier jig 30 is removed from the gripping tool 31, and the gripping tool 31 is turned over so that its opening is facing down, and is placed above the diffusion board 32 as shown in FIG. When the holders 22 and 23 of the gripper 31 are opened, the wafers 1 which have been stacked in advance are transferred to the diffusion boat 32 at once.

Thereafter, the gripping tool 31 is removed and the quartz rod 8 is brought together to complete the transfer.

In this way, by sequentially repeating the transfer using the gripper 31, the number of wafers 1 transferred can be increased as shown in FIG.

The material of the above-mentioned gripping tool is preferably Teflon in terms of slipperiness of the wafer and ease of cleaning, but it is not limited to this.
Any material may be used as long as it does not damage or contaminate the wafer.

In the above embodiments, a wafer is used as the thin plate, but it is not limited to this, and may be a ceramic plate, a glass plate,
It can also be used to stack and transfer thin plates such as sapphire plates and liquid crystal plates.

Furthermore, the base, side plates, collar, holder, etc. can be integrally molded from a flexible synthetic resin material without having to be constructed as separate bodies.

As explained above, according to the gripping tool of the present invention, thin plate bodies arranged in advance on a holding jig so as to face each other can be superimposed and transferred to another holding jig at the same time.
The transfer operation can be carried out easily and reliably, and since the surface of the thin plate is not damaged, there are excellent effects such as there is no risk of damage or contamination of the thin plate.

[Brief explanation of the drawing]

1 and 2 are external perspective views of a cleaning carrier and a diffusion boat used in the overlapping diffusion process, and FIG. 3 shows an embodiment of the gripping tool according to the present invention. Figure a is an external perspective view. Figure 4 and C are longitudinal sectional views taken along line I-I and n-11 shown in figure a, Figures 4 to 6 are illustrations of the embodiment of the gripper shown in Figure 3, and Figure 4 a is FIG. 3 is a perspective view of the cleaning carrier jig shown in FIG. 1 stacked on the holding tool; FIG. 4 is a front view showing how the wafer is transferred from the carrier jig to the holding tool; FIG. 4C is a perspective view showing a state in which a large number of wafers are stacked in the above-mentioned gripping tool, FIG. 5 is a perspective view showing a state in which wafers are transferred from the above-mentioned holding tool to a diffusion boat, and FIG. FIG. 3 is a perspective view showing a mode in which a large number of wafers are stacked and held on the boat. 10...-Base, 11,12...Side plate,
13a. 13 b------Color, 14a, 14b, 15a
. 15 b---shaft hole, 16a, 16b, 17a, 17
b - Arc-shaped slit, 18, 19... Rotating plate, 20° 21... Rectangular slit, 22.23
...Holding body, 24a, 24b...-Engagement protrusion, 25a, 25b...Engagement hole.

Claims (1)

[Claims] 1 In a device in which thin plate bodies arranged in advance in a holding jig to face each other are stacked and transferred to another holding jig,
A pair of side plates arranged opposite to the base along the longitudinal direction of the base, and an opening between the side plates that is orthogonal to each other and pivoted horizontally at a lower position of each of the side plates. A pair of rotating plates rotatably supported at a predetermined interval between the side plates so as to open and close the upper surface, and a pair of rotating plates arranged parallel to the base on each side plate near the central opening between the side plates. L pairs of slits are respectively provided, one end is fixed to the base, the other end is supported so as to be freely put in and taken out from the slit, and the other end holds the outer periphery of each thin plate when the thin plate is accommodated. 1. A thin plate body gripping tool comprising: l pairs of holding bodies provided so as to hold the thin plate body.