JPS5832796B2 - composite board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite board characterized in that it is constructed by integrating first and second printed wiring boards that are manufactured separately.

Printed wiring boards, which have been generally manufactured in the past, are made by cutting raw materials such as copper-clad laminates into appropriate sizes to form a single base material, which is then used to form wiring patterns, apply solder resist, etc. Printing of symbols, characters, etc., and perforation are manufactured by processing and finishing.

In the case of double-sided boards, multilayer boards, etc., electrical connections are made through through holes, and chips such as high-density integrated circuits (IC, LSI) can be bonded as external components to increase the density of the board circuit. It has been implemented.

Since heating is required when bonding the chips in the above process, the material of the substrate is also limited, and complicated operations and management such as temperature conditions and bonding equipment are required.

Furthermore, when creating the through-hole portion, it is difficult to perform extremely high-density drilling operations, and there is a limit to mechanical precision.

Therefore, it is difficult to increase the density of the board circuit using only a single base material as described above, and many additional conditions are required.

In view of the above-mentioned reality, the present invention has been developed by manufacturing printed wiring boards in separate processes for manufacturing a board with a normal wiring pattern and a board containing high-density circuit elements, and then combining the two. This was done with the aim of solving the various drawbacks of the conventional printed wiring boards mentioned above by combining them, and in order to achieve the above purpose, a first printed wiring board in which a notch was formed and , a composite board comprising a second printed wiring board fitted into the notch, and a conductive material connecting the first and second printed wiring boards via an adhesive. This is what we intend to provide.

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG.
1 is a first printed wiring board on which a normal wiring pattern is applied, and a separately manufactured second printed wiring board 3 is inserted into a notch 2 provided in an arbitrary part of the board through an adhesive. It shows the inserted and fixed state.

B of the same figure is a sectional view of a portion indicated by a dotted line x-x in A, and this example shows a case where through holes are formed in a circuit board for double-sided conduction.

That is, by providing a wiring pattern 4 and a through-hole portion 5 connected to the wiring pattern 4 on the second printed wiring board 3 formed separately, conduction on both sides is made possible.

FIG. 2 is a cross-sectional perspective view when a multilayer board is used as the second board to be inserted, and the boards A, A, and C, each having a wiring pattern and a through-hole portion, are laminated to form the second printed wiring. The case where it is used as a substrate is shown.

In the above embodiment, only the wiring pattern for configuring the circuit is formed on the first printed wiring board 1, and the second printed wiring board 3 is
Although a case is shown in which a through-hole portion is provided on the top, other embodiments are also possible.

For example, it is also possible to implement an implementation method in which extremely high-density circuit elements are configured on the second substrate and connected to a wiring pattern formed on the first substrate.

Furthermore, the notch 2 is not limited to the illustrated rectangular shape, but may be circular or any other shape.

The first printed wiring board and the second printed wiring board are electrically connected to each other by a conductive material via an adhesive, and their cross-sectional structure will be explained based on FIG. 3.

In the figure, reference numeral 1 designates a first printed wiring board similar to that described above, and a second printed wiring board 3 having a through-hole portion 5 is fitted into the cutout portion of the first printed wiring board 1 and fixed thereto with an adhesive 6.

Note that the end surface 3' of the second substrate is partially chamfered, but this is to facilitate insertion of the adhesive and the substrate.

A conductive paste 7 as a conductive material is applied to connect the wiring pattern 4 formed on the surface of the second substrate and the wiring pattern 4' formed on the first substrate.
The conductive paste 7 enables conduction between wiring patterns for which electrical connection is desired.

FIG. 42 shows another embodiment of the composite board of the present invention, in which, instead of the chamfered portion shown in FIG. By cutting, the upper surface edge of the first substrate 1 is attached to the 3a.
It is possible to place the parts on it, and has a feature of good operability.

The adhesive 6 and conductive paste 7 are the same as those shown in FIG.

The second printed wiring board may be a ceramic board other than the double-sided through-hole board or multilayer board shown in the drawings.

The feature of the present invention is that a first board having a relatively low density and a second board including a high density circuit are separately manufactured, and the second board and the first board are fitted and combined. ,
As a result, a high-density substrate can be obtained.

Therefore, we manufacture products using base materials that are suitable for the characteristics required for each board, and by combining these materials, it is possible to integrate different materials. This makes it possible to design circuits using suitable materials.

Furthermore, from a manufacturing technology perspective, it is desirable to manufacture a low-density substrate and a high-density substrate separately, to avoid the time loss that would occur when manufacturing both on the same substrate. However, it also contributes to improving efficiency and yield.

FIG. 5 is a block diagram showing an example of the method for manufacturing a composite board according to the present invention, in which the human process shows an example of manufacturing the first printed wiring board, and the B process shows an example of manufacturing the second printed wiring board.

In operation 11, the raw material is cut into a predetermined size, and after forming a notch in an arbitrary part in press processing 12, a first printed wiring board is manufactured through pattern printing 13 and etching 14, which are known operations.

Parallel to the above-mentioned human process, in process B, the raw material is first cut into a predetermined size in operation 15, and through holes having a desired density are formed in operation 16.

Next, after plating operation 17 of the through-hole portion, baking 18, solder plating 19 of the pattern, and etching 20,
It is cut to a size corresponding to the notch provided in the first printed circuit board by outer diameter processing 21.

The second substrate obtained in step B above is subjected to substrate synthesis in step 22, in which chamfering and cutting as described above are performed, and adhesive application 23, curing 24, and conductive paste application 25 are performed. , curing 26, applying solder resist 27
, curing 28, printing of symbols, characters, etc. 29 (Le-gend
The finished product is obtained through the following operations: marking (marking) and curing 30.

Since known means can be applied to the operation contents of each improvement, detailed explanation thereof will be omitted.

Although the above manufacturing example shows a case where a through hole portion is formed in the second substrate, the present invention is of course not limited to the above example. For example, a wiring pattern and a through hole portion are formed in the first substrate. It is also possible to form a hole portion, construct a high-density circuit in the second substrate, and combine the two.

The composite substrate and the manufacturing method thereof according to the present invention have been described in detail above, and by applying the present invention, many advantages described below can be exhibited.

That is, in a double-sided board, if only the through-hole portions for establishing conduction are concentrated on the second board, the first board only needs to have a wiring pattern, and the process can be simplified.

Moreover, the same effect is produced when similarly high-density circuit thinking is concentrated on the second board.

The second board is made by manufacturing a highly densely designed circuit board on a separate manufacturing line, and if a relatively simple board and a high-density board are manufactured separately as described above, , mass productivity and yield are improved, and high-quality products can be obtained.

The first and second substrates may be made of different materials, and it is possible to arbitrarily select materials suitable for the characteristics of the electrical components mounted on each substrate.

Furthermore, as mentioned at the beginning, even if it is safe to mount chips such as ICs and LSIs, the work can be carried out without difficulty.

That is, a material for the substrate that satisfies the heating conditions required for bonding the chips and the like may be selected and used as the second substrate.

In addition, the end surface of the second printed wiring board, which is fitted into the notch of the first printed wiring board and fixed with adhesive, is cut out in a chevron-shaped or L-shape to increase the surface area, thereby increasing the adhesive area. In addition, since the printed wiring on each printed wiring board is connected to each other using conductive paste, it is possible to increase the mechanical strength so that it will not be separated even by careless external force. Conventional means such as screen printing for applying a solder resist can be used as is, and high-density and precise wiring patterns can be electrically connected simultaneously and easily by extremely simple means.

As described above, the composite board according to the present invention can be implemented in various ways and can be used in a wide range of applications, and can be applied to the production of various printed circuit boards to achieve great effects.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2 is a partially sectional perspective view thereof, Fig. 3 is a sectional view showing adhesion and conductive state, and Fig. 4 is a sectional view showing another embodiment. It is a diagram. FIG. 5 is a schematic process diagram showing the manufacturing method according to the present invention. DESCRIPTION OF SYMBOLS 1...First printed wiring board, 2...Notch, 3...Second printed wiring board, 4...
...Wiring pattern, 5...Through hole part, 6
...Adhesive, 7...Conductivity paste.

Claims (1)

[Claims] 1 Consisting of a first printed wiring board in which a notch is formed and a second printed wiring board that is fitted into the notch, the end face of the second printed wiring board is deformed so that its surface area increases. A second printed wiring board fitted into the notch of the first printed wiring board is fixed with an adhesive so that it cannot fall off, and the printed wiring between both boards is connected to each other by applying conductive paste. A composite board characterized by: