JPS5834770B2 - Thermocouple manufacturing method - Google Patents
Thermocouple manufacturing methodInfo
- Publication number
- JPS5834770B2 JPS5834770B2 JP56152363A JP15236381A JPS5834770B2 JP S5834770 B2 JPS5834770 B2 JP S5834770B2 JP 56152363 A JP56152363 A JP 56152363A JP 15236381 A JP15236381 A JP 15236381A JP S5834770 B2 JPS5834770 B2 JP S5834770B2
- Authority
- JP
- Japan
- Prior art keywords
- thermocouple
- platinum
- ceramic
- paste
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000919 ceramic Substances 0.000 claims description 31
- 229910000510 noble metal Inorganic materials 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910000629 Rh alloy Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- LIXXICXIKUPJBX-UHFFFAOYSA-N [Pt].[Rh].[Pt] Chemical compound [Pt].[Rh].[Pt] LIXXICXIKUPJBX-UHFFFAOYSA-N 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910052845 zircon Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【発明の詳細な説明】
本発明は熱電対の製造方法に関するものであり、特に高
温測定に用いられる安価な白金−白金ロジュウム系熱電
対の製造方法を提供することを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a thermocouple, and in particular, an object of the present invention is to provide a method for manufacturing an inexpensive platinum-platinum-rhodium thermocouple used for high temperature measurement.
熱電対は２種の金属線を接合して、２つの接合点の温度
差によって生ずる熱起電力を測定することによって温度
を測定するものである。A thermocouple is a device that measures temperature by joining two types of metal wires and measuring the thermoelectromotive force generated by the temperature difference between the two joining points.
熱電対で温度を測定する場合、一般に熱電対金属線が雰
囲気によって酸化又は還元されて熱起電力に差が生じた
り、劣化するのを防ぐため保護管と一緒に用いられる。When measuring temperature with a thermocouple, it is generally used together with a protective tube to prevent the thermocouple metal wire from being oxidized or reduced by the atmosphere, resulting in a difference in thermoelectromotive force or deterioration.
第１図に従来の白金−白金ロジュウムを用いた熱電対と
保護管を示す。FIG. 1 shows a conventional thermocouple and protection tube using platinum-platinum rhodium.
磁器製の絶縁管５によって互に隔離された白金線１およ
び白金とロジュウムとの合金線２は接合点３の部分で溶
接されて、先端が封じられた磁器製の保護管４の中に収
納され、各金属線の他の一端は端子板８に設けられたｅ
端子６および■端子７にそれぞれ固定されている。A platinum wire 1 and a platinum-rhodium alloy wire 2, which are separated from each other by a porcelain insulating tube 5, are welded at a joint 3 and housed in a porcelain protective tube 4 whose tip is sealed. and the other end of each metal wire is provided on the terminal plate 8.
They are fixed to terminal 6 and terminal 7, respectively.
この○端子６および■端子７に補償導線（図示せず）が
接続され冷接点を通してミＩＪボルトメータに接続され
ている。A compensating conductor (not shown) is connected to the O terminal 6 and the ■ terminal 7, and is connected to a MIJ voltmeter through a cold junction.
このような従来の熱電対における不都合な点は次の通り
である。The disadvantages of such conventional thermocouples are as follows.
１、高温側の接合点３が保護管の内部にあるため熱伝達
に遅れを生じたり、輻射熱が遮えぎられるため真の温度
を示さない。1. Since the junction point 3 on the high temperature side is inside the protection tube, there is a delay in heat transfer, and the radiant heat is blocked, so the true temperature is not indicated.
特に接合点３が保護管の底部に密着せず保護管の底部よ
り離れた位置にある場合、温度誤差を生じやすい。In particular, if the junction point 3 is not in close contact with the bottom of the protection tube and is located at a distance from the bottom of the protection tube, temperature errors are likely to occur.
また接合点３が保護管の底部に密着しているかどうかを
確かめる事ができない。Furthermore, it is not possible to confirm whether the junction point 3 is in close contact with the bottom of the protection tube.
２、熱電対金属線は貴金属であるため極めて高価である
。2. Thermocouple metal wires are extremely expensive because they are made of precious metals.
本発明は従来の熱電対、特に高温用の白金−白金ロジュ
ウム系の熱電対における上述の欠点を除去し、安価で測
温誤差の少ない熱電対の製造方法を提供するものである
。The present invention eliminates the above-mentioned drawbacks of conventional thermocouples, particularly platinum-platinum-rhodium thermocouples for high temperatures, and provides a method for manufacturing thermocouples that is inexpensive and has little temperature measurement error.
本発明は、セラミックグリーンシート上に耐酸化性高融
点貴金属のペーストを塗布し、この塗布面上にセラミッ
クグリーンシートを圧着或はセラミックペーストをコー
ティングしたのち焼成する熱電対の製造方法に関する。The present invention relates to a method for manufacturing a thermocouple, in which a paste of an oxidation-resistant, high-melting-point noble metal is applied onto a ceramic green sheet, and the ceramic green sheet is pressure-bonded or coated with the ceramic paste on the applied surface, and then fired.
なお焼成は中性又は酸化雰囲気中で行なうことが好まし
い。Note that the firing is preferably performed in a neutral or oxidizing atmosphere.
以下本発明の一実施例を面図により説明する。An embodiment of the present invention will be described below with reference to plan views.
第２図のａおよびｂは本発明の一実施例になる熱電対の
製造工程を示す斜視図であり、９はアルミナを主体とす
るセラミックグリーンシートである。2A and 2B are perspective views showing the manufacturing process of a thermocouple according to an embodiment of the present invention, and 9 is a ceramic green sheet mainly made of alumina.
セラミックグリーンシート９の製造方法は既に公知であ
り半導体のセラミックパーケージや多層配線板などの製
造に広く利用されている。The method for manufacturing the ceramic green sheet 9 is already well known and widely used for manufacturing semiconductor ceramic packages, multilayer wiring boards, and the like.
すなわちセラミック原料とブチラール樹脂（商品名工ス
レツク、積木化学製）の熱可塑性樹脂とを混合し押出成
形により成形する。That is, a ceramic raw material and a thermoplastic resin such as butyral resin (trade name: Meiko Suretsuku, manufactured by Block Chemical Co., Ltd.) are mixed and formed by extrusion molding.
成形法はこの他にドクターブレード法で成形、或は寸法
の短いものならプレス成形法も利用できる。Other molding methods that can be used include a doctor blade method, or a press molding method if the dimensions are short.
このセラミックグリーンシート９に白金ペースト１０（
聴力化学製）、および白金とロジュウム合金ペースト１
１（聴力化学製）、とを印刷法で第２図のａおよびｂに
示す如く先端で交叉させて接合点１２を形成し、他端を
リード線引出し用一端子１３および子端子１４になるよ
う塗布する。Platinum paste 10 (
(manufactured by Audiochemistry), and platinum and rhodium alloy paste 1
1 (manufactured by Auditory Chemical Co., Ltd.), and are crossed at the tips using a printing method as shown in a and b in FIG. Apply as shown.
塗布法は他に筆塗り法等があるが特に制限はしない。There are other application methods such as brush painting, but there are no particular limitations.
このとき使用する白金ペーストおよび白金−ロジュウム
合金ペーストはいずれもガラス質を全く含有しない純金
属ペーストであることが望ましい。It is desirable that both the platinum paste and the platinum-rhodium alloy paste used at this time be pure metal pastes containing no glass.
このようにして熱電対状に印刷したセラミックグリーン
シートの上に同材質のセラミックグリーンシート１５を
熱圧着する。A ceramic green sheet 15 made of the same material is thermocompression bonded onto the ceramic green sheet printed in the thermocouple shape in this way.
本方法はこの他にセラミックグリーンシートと同材質の
セラミックペーストとを端子部を残し熱電対部をカバー
するようにコーティングし、耐酸化性高融点貴金属をセ
ラミック中に埋込んでもよく特に制限はない。In addition to this method, the ceramic green sheet and the ceramic paste made of the same material may be coated to cover the thermocouple part, leaving the terminal part, and the oxidation-resistant high melting point noble metal may be embedded in the ceramic, and there are no particular limitations. .
オ本質的にはこれで成形は完了して次に焼成すること
になるが熱電対の用途によって形状は種々のものが可能
である。Essentially, this completes the molding and is then fired, but various shapes are possible depending on the use of the thermocouple.
例えばパイプ状にする場合は第３図のａのように印刷し
たセラミッククリーンシート９をパイプ状にまるめてか
らその上に圧着用のセラミックグリーンシートをまいて
かぶせる。For example, when making a pipe shape, the printed ceramic clean sheet 9 is rolled up into a pipe shape as shown in FIG.
なお第３図のａにおいて１６は保護用セラミックグリー
ンシートである。In addition, in FIG. 3a, 16 is a protective ceramic green sheet.
又は第３図のｂのように第２図のａにより成形した角棒
状成形体を他のセラミックグリーンシートでまいてパイ
プ状にすることも可能である。Alternatively, as shown in FIG. 3b, the rectangular bar-shaped molded product formed in FIG. 2a may be wrapped with other ceramic green sheets to form a pipe shape.
このようにして成形した成形品は熱電対用金属ペースト
の種類、セラミックの材質により１３００℃以上の温度
で焼成する。The molded product formed in this manner is fired at a temperature of 1300° C. or higher depending on the type of metal paste for the thermocouple and the quality of the ceramic material.
本発明の白金−白金ロジュウム系の場合は酸化雰囲気中
で例えば１７００℃の温度で焼成する。In the case of the platinum-platinum rhodium system of the present invention, it is fired at a temperature of, for example, 1700° C. in an oxidizing atmosphere.
との焼成によりセラミックは完全に焼結して完全気密質
となり印刷した白金及び白金ロジュウム合金のペースト
は焼結して金属線となりセラミック中に埋め込まれた熱
電対となる。The ceramic is completely sintered and becomes completely airtight, and the printed platinum and platinum-rhodium alloy paste is sintered to become a metal wire, which becomes a thermocouple embedded in the ceramic.
耐酸化性高融点貴金属ペーストとしては第１表に記載の
ものが用いられる。As the oxidation-resistant high melting point noble metal paste, those listed in Table 1 are used.
酸化雰囲気でセラミックと一緒に焼結できる金属として
はその他にバラジニウム系、イリジュウム系がある。Other metals that can be sintered with ceramics in an oxidizing atmosphere include varadinium and iridium.
熱電対用金属の組合せを第１表に示す。Table 1 shows the combinations of metals for thermocouples.
セラミック材質としては、アルミナ以外にもベリリア、
ジルコン、ムライト系等のセラミックも利用できる。In addition to alumina, other ceramic materials include beryllia,
Ceramics such as zircon and mullite can also be used.
しかしべＩＪ ＩＪア系は熱伝導性は良好であるが高価
であり、ジルコン系、ムライト系は熱伝導性が悪いので
価格的および耐熱性、熱伝導性の点からアルミナ系セラ
ミックが最も好ましい。However, ceramics based on ceramics have good thermal conductivity but are expensive, and ceramics based on zircon and mullite have poor thermal conductivity, so alumina ceramics are most preferred from the viewpoints of cost, heat resistance, and thermal conductivity.
従来の熱電対は熱電対線と保護管とから構成されていた
が本発明の熱電対は保護管の役割を果たスセラミックの
内部に完全に埋込まれセラミックと一体に構成されてい
るので熱の伝導が早く、温度の誤差が少なくまた熱電対
の劣化が少ない。Conventional thermocouples were composed of a thermocouple wire and a protection tube, but the thermocouple of the present invention is completely embedded inside the ceramic, which plays the role of a protection tube, and is integrated with the ceramic. Heat conduction is fast, there is little temperature error, and there is little deterioration of thermocouples.
従来は貴金属線を用いたために極めて高価であったが本
発明になる方法で製造すれば貴金属ペーストを印刷によ
り熱電対を構成するので貴金属の使用量が１０分の１以
下となり極めて安価に製造できる。Conventionally, it was extremely expensive because it used precious metal wire, but if it is manufactured by the method of the present invention, the thermocouple is constructed by printing precious metal paste, so the amount of precious metal used is less than one-tenth, and it can be manufactured at extremely low cost. .
第１図は従来の熱電対を保護管に取りつけた状態を示す
断面側面図、第２図のａおよびｂは本発明の一実施例に
なる熱電対の製造工程を示す斜視図、第３図のａ、ｂお
よびＣは本発明の一実施例になる熱電対の斜視図である
。
符号の説明、１・・・・・・白金線、２・・・・・・白
金とロジュウムとの合金線、３・・・・・・接合点、４
・・・・・・磁器製の保護管、５・・・・・・絶縁管、
６・・・・・・ｅ端子、７・・・・・・■端子、８・・
・・・・端子板、９・・・・・・セラミックグリーンシ
ート、１０・・・・・・白金ペースト、１１・・・・・
・白金とロジュウム合金ペースト、１２・・・・・・接
合点、１１３・・・・・・○端子、１４・・・・・・■
端子、１５・・・・・・セラミックグリーンシート、１
６・・・・・・保護用セラミックグリーンシート。Fig. 1 is a cross-sectional side view showing a conventional thermocouple attached to a protection tube, Fig. 2 a and b are perspective views showing the manufacturing process of a thermocouple according to an embodiment of the present invention, and Fig. 3 2A, 2B, and 2C are perspective views of a thermocouple according to an embodiment of the present invention. Explanation of symbols, 1... Platinum wire, 2... Alloy wire of platinum and rhodium, 3... Junction point, 4
... Porcelain protection tube, 5 ... Insulation tube,
6...e terminal, 7...■ terminal, 8...
...Terminal board, 9...Ceramic green sheet, 10...Platinum paste, 11...
・Platinum and rhodium alloy paste, 12...junction, 113...○terminal, 14...■
Terminal, 15... Ceramic green sheet, 1
6... Ceramic green sheet for protection.
Claims (1)
属のペーストを塗布し、この塗布面上にセラミックグリ
ーンシートを圧着或はセラミックペーストをコーティン
グして一体化したのち焼成することを特徴とする熱電対
の製造方法。1. A thermocouple characterized in that a paste of an oxidation-resistant high-melting-point noble metal is applied to a ceramic green sheet, and the ceramic green sheet is crimped or coated with ceramic paste on the applied surface, integrated, and then fired. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152363A JPS5834770B2 (en) | 1981-09-25 | 1981-09-25 | Thermocouple manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152363A JPS5834770B2 (en) | 1981-09-25 | 1981-09-25 | Thermocouple manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5794622A JPS5794622A (en) | 1982-06-12 |
| JPS5834770B2 true JPS5834770B2 (en) | 1983-07-28 |
Family
ID=15538891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56152363A Expired JPS5834770B2 (en) | 1981-09-25 | 1981-09-25 | Thermocouple manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834770B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151965U (en) * | 1988-03-30 | 1989-10-19 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4728369A (en) * | 1985-04-03 | 1988-03-01 | Hammerslag Julius G | Thermocouple probes |
| US5251981A (en) * | 1992-04-28 | 1993-10-12 | United States Of America, As Represented By The Secretary Of Commerce | Corrosion resistant thin film thermocouples and method |
| US5356218A (en) * | 1993-05-04 | 1994-10-18 | Motorola, Inc. | Probe for providing surface images |
| US7891870B2 (en) * | 2008-04-29 | 2011-02-22 | Ngk Spark Plug Co., Ltd. | Temperature sensor element and method of manufacturing the same |
-
1981
- 1981-09-25 JP JP56152363A patent/JPS5834770B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151965U (en) * | 1988-03-30 | 1989-10-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5794622A (en) | 1982-06-12 |
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