JPS5836068B2 - Partial plating device for short frames - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for partially plating short frames for electronic components, such as IC frames.

In recent years, there has been a remarkable shift towards IC-LSI (Large Scale Integrated Circuits) electronic components, and their production has also increased in large quantities and in a wide variety of products.

With the progress of precision and the high quality of precious metals for plating such as gold and silver, conventionally the entire surface was plated, including unnecessary parts, but only the necessary parts were plated. It is changing to plating.

For example, when it comes to IC lead frames, they are becoming increasingly finer, ultra-miniaturized, and mass-produced.
In response to changes in performance, models, etc., the parts of the frame that require plating, the pitch (interval of plating), the base material of the frame, etc. change day by day, resulting in an extremely wide variety of products.

However, conventionally, partial plating means for this type of product is provided on a receiving member with holes as well as a sealing member with patterned holes depending on the location where plating is required, and the frame is placed on the sealing member and sealed from above. Generally, it is held by a holding member with an attached member, and a liquid is jetted from an anode pipe or the like provided inside the container of the receiving member.

However, this conventional partial plating means is dedicated to designing and manufacturing an apparatus with specifications corresponding to a plan for partial plating with a limit of one or three types.

Therefore, apart from mass production of a certain type of product, if the type of product changes, the equipment may become unusable, or it may be necessary to change the position and hole diameter of the nozzle, change the masking pattern, change the receiving member, etc. Become.

This is almost the same as replacing with a new device, which is quite expensive in terms of cost, and a great deal of time is wasted in adjustments.

Therefore, the conventional partial plating means is in an unbalanced situation as a partial plating means for IC lead frames, etc., which are constantly changing as described above.

In addition, in conventional partial plating methods, a gap is provided between the hole in the receiving member and the anode pipe to allow the liquid to escape after colliding with the plating area, but this may cause air to enter the liquid flow or cause the liquid flow to become splashes. In addition, there was a loss in flow velocity due to the collision between the jet stream and the discharge stream, which could worsen the plating condition.

The present invention relates to a partial plating apparatus for short frames such as IC lead frames, and is an object of the present invention to solve the above-mentioned problems.

In other words, in view of the recent increase in the number and variety of IC-LSIs, etc., the purpose of this is to not only mass-produce partial plating on lead frames of certain types, but also to mass-produce different types.・Even when it comes to small-volume production, it does not require the complicated steps associated with changing product types as in the past, and can be handled easily and quickly in a general-purpose manner, greatly improving productivity, and producing even higher quality than conventional products. The purpose of the present invention is to provide a partial plating device with a short frame, which can provide excellent plating.

The invention will be explained below by means of illustrated embodiments.

Reference numeral 1 denotes a receiving tank, which has an oblong shape with an opening at the top.A pair of horizontally long support plates 2 are erected in parallel from the center of the lower part of the tank. The inner surface is used as a guide surface 4.

The width of the support plate 2 is made long enough to shift the lower block 5 laterally.

Reference numeral 5 designates a lower block, which is shaped like a rectangular parallelepiped with its lower sides cut out, so that it can be placed on the support surface 3 with both cutout lower surfaces 6, and the central lower part 7 of the block 5 is connected to the support plate 2.
The two notched side surfaces 8 can be slid along the guide surfaces 4.

In the illustrated embodiment, 11 blocks 5 are provided in parallel, and each block 5 has an anode pipe 9 extending from the center of the lower part.
A pair of locking pins 10 are provided protruding from both sides of the upper surface, and a pair of vertical holes 11 for positioning are further formed on both sides of the locking pins 10.

Reference numeral 12 designates an upper block, which is a rectangular parallelepiped that is slightly shorter than the lower block 5, and can be placed closely on the upper surface of the lower block 5, and has locking holes near both sides of the lower part of the upper block 12 for each of the lower blocks 5. A vertical hole 13 for locking that can be engaged with the pin 10 is formed.

In the illustrated embodiment, 12,011 blocks are each placed on the lower block 5, but a hemispherical liquid introduction hole 14 is formed in each upper block 12 from the center of the lower part, and a plating area is formed in the center of the upper part of each upper block 12. Corresponding square pattern holes 15 are formed, and drain holes 16 are formed from both sides of the pattern holes 15 to the lower portions on both sides of the block 120.

The material of the upper block 12 and the lower block 5 is a hard synthetic resin that is resistant to plating liquid.
The upper and lower surfaces of 2 and the upper surface of the lower block 5 are coated with a soft synthetic resin material for sealing purposes.

1T is a flexible tube for supplying plating solution, and in the illustrated embodiment, there are 11 flexible tubes corresponding to the number of lower blocks 5, each of which is independent, and the upper part of the tube is connected to the lower part of the anode pipe 9 provided in each lower block 5. The lower part thereof is connected to a horizontally long constant pressure tank 1 provided between both support plates 2 of the receiving tank 1.
9 are connected to each of the connecting ports, which are provided at equal intervals in the illustrated embodiment.

The length of the tube 1T is made long enough to allow the lower block 5 on the support plate 2 to be shifted laterally.

Reference numeral 20 denotes a positioning scale, which is a pair of scales having the same length as the support plate 2 and has graduations, each having the same number of movable members 21 as the lower blocks 5.
are slidably held in their vertical parts, and fixing pins 23 that can be held in the vertical holes 11 for positioning of the lower block 5 are inserted into holes 22 in the horizontal parts.

Reference numeral 24 denotes a holding member which can be raised and lowered by an air cylinder (not shown), and has a soft sealing material pasted on its lower surface and a cathode wire (not shown).

25 is a plating liquid main tank, and the plating liquid is sent to the constant pressure tank 19 via a pump 26 and a liquid supply pipe 2T.

Reference numeral 28 denotes a return pipe for returning the plating solution stored in the receiving tank 1 to the main tank 25.

In the above configuration, the lengths of the support plate 1, scale 20, presser member 24, etc. are matched to the longest expected lead frame A.

In addition, the number of connection ports and flexible tubes 17 at the upper part of the constant pressure tank 19 is 11 in the illustrated embodiment, but the number of connections is set to 11 in accordance with lead frame A, which is expected to have the largest number of locations requiring plating. .

Furthermore, the width s of the lower block 5 and the upper block 12
, s' is the lead frame A' with the smallest pitch.
Even in this case, the dimensions are such that adjacent blocks do not interfere with each other and the pattern holes 15 can accurately match the plating area.

Note that the upper block 12 is prepared in advance with several different types of pattern holes 15 so as to correspond to expected differences in the size, shape, etc. of the plating area of the lead frame.

Depending on the number of parts of the frame that require plating, the remaining lower block 5 may be provided with a hollow upper block 12 such as pattern holes 15, or the flexible tube 17 may be squeezed in the middle.

Next, the state of use of the present invention will be explained based on the above embodiment.

First, if the number of parts of the IC lead frame A that require plating is 11, which is the maximum number planned for this device, the support plate 2
Above all the lower blocks 5, there is an upper block 12 with appropriate pattern holes 15 in the parts of the frame A that require plating.
is placed, and each vertical hole 13 at the lower part of the upper block 12 is engaged with each locking pin 10 at the upper part of the lower block 5.

Then, the position of each movable member 21 is determined using the scale scale so that the pins 23 of the positioning scales 20 on both sides are at the same pitch as the pitch of the parts of the lead frame A that require plating,
Each lower block 5 may be slid and arranged at a position where each pin 23 can be inserted into each vertical hole 11.

At that time, the plating solution supply pipe is the flexible pipe 17.
Therefore, the lower block 5 can be placed at a predetermined position.

In this state, correctly place the lead frame A on the upper surface of the upper block 12, lower the presser member 24, and lower the presser pump 2.
6 should be activated.

As a result, the plating solution in the main tank 25 once enters the constant pressure tank 19, becomes constant pressure there, and reaches the inside of each upper block 12 via each flexible tube 17 and anode pipe 9.

Then, the liquid flow passes from the liquid introduction hole 14 through the pattern hole 15 and collides with the part of the frame A that requires plating, and then immediately flows from the liquid drainage hole 16 on the side of the pattern hole 15 to the upper block 1.
2 It is discharged outside.

At this time, the plating liquid jetted from the anode pipe 9 passes through the hole 1, which is enclosed in a hermetically sealed manner, until it collides with the area requiring plating.
4, 15, so air is not mixed in, and
The liquid stream does not turn into droplets and collides with the areas requiring plating as a completely continuous liquid column.

In addition, since the liquid flow immediately escapes from the drain hole after colliding with the required plating location, there is no loss in flow velocity due to collision between the jet stream and the drain stream.

Thereafter, the drained liquid is received by the receiving tank 1 and returns to the main tank 25 via the pipe 28.

If the lead frames A are replaced one after another in this state, mass production of the same type can be achieved.

Next, we will discuss the case where there is a change in product type and the lead frame A has to be plated with a different number of plated parts, pitch, plating pattern, etc.

First, in order to change the number and pitch of the parts that require plating, remove each fixing pin 23 from the lower block 5 in the above-mentioned arrangement state, remove each scale 20, and remove as many lower blocks as the number of parts that require plating on lead frame A. , and slide the others to the side.

Then, slide each pin 23 on the positioning scale 20 so that the pitch is the same as the pitch on the lead frame A, and arrange the lower block 5 at an interval such that each vertical hole 11 of the lower block 5 is engaged with each of the bins 23. This means that it is set at a predetermined position according to the pitch change.

On the other hand, to change the plating pattern, remove the previous upper block 12 and replace the upper block 1 prepared in advance.
2, select the upper block 12 group with pattern holes 15 that can correspond to the plating required parts of the new lead frame 8, place it on each lower block 5, and insert the vertical hole 13 in the upper block 12 group.
It is only necessary to engage the locking pin 10 with the locking pin 10.

In this state, if the lead frame A is placed on the upper block 12 and the presser pump 26 is operated from above with the presser member 24 in the same manner as above, partial plating will be performed on a lead frame of a different type from the above. It is.

In addition, during any of the above plating, the lower block 5
Since the upper block 12 is separate and independent from the adjacent blocks, thermal expansion due to the temperature of the plating liquid does not accumulate as in the case of a long member, and there is no difference in the location or pitch where plating is required.

Therefore, the present invention has the following effects.

The present invention relates to partial plating on short IC lead frames, etc., and can easily and quickly be applied not only to mass production of the same product, but also to multi-product, small-volume production.

That is, in recent years, the areas where plating is required, the pitch, the frame base material, etc. of IC lead frames and the like change day by day in response to changes in their uses, performance, models, etc.

However, conventional means can only accommodate one to three types due to their structure, and if more types are changed, the entire device may become unusable, or the position and hole diameter of the nozzle etc. may be changed, the masking pattern replaced, etc. Requires changes to the receiving member, etc.
The cost was quite high and the time of many dogs had to be wasted for adjustment.

In contrast, in the present invention, each lower block is first made independent, and the plating solution is supplied to each lower block using a flexible tube. Even when it comes to problems, it is only necessary to slide it into a predetermined position, making it possible to respond easily and quickly.

On the other hand, the upper blocks are each independent and can be attached and detached from the lower block, so if you prepare several types with different pattern holes in advance, you can simply replace the upper block when the pattern changes due to a change in product type. This work is sufficient.

As described above, the present invention is a partial plating means that is highly responsive and suitable for IC lead frames, etc., which are constantly changing.

(6) The present invention can achieve further precision as a means for plating lead frames for electronic components that are to be miniaturized.

In other words, in the conventional means, the length of the receiving member with the hole and the sealing material on its upper surface is at least as long as one lead frame. If the temperature of the plating solution is raised, there is a risk that precision will be lost due to thermal expansion, which will cumulatively shift the plating required locations and pitches depending on the length.

However, in the present invention, since both the lower block and the upper block are separate and independent from their neighboring blocks, the influence of thermal expansion does not occur cumulatively, and more precise partial plating can be performed.

■ In addition to the above, the upper block can be placed closely on the upper surface of the lower block with the anode pipe facing upward and tightly fitted, and a liquid introduction hole is formed from the lower part to the upper pattern hole. If a drainage hole is formed outward from a position close to the pattern hole, good plating can be obtained with good plating coverage.

That is, in the conventional means, a nozzle or the like is provided in the hole of the receiving member in an open manner for liquid discharge.

Therefore, as air is mixed into the jet liquid, the liquid flow becomes droplets, and the plating coverage may be poor due to loss of flow velocity due to collision between the jet flow and the discharge flow.

In contrast, in the present invention, the plating liquid flow passes through the closed hole until it collides with the area that requires plating, so there is no air in the flow, and the liquid flow does not become droplets and forms a completely continuous column of liquid at the area that requires plating. collide with

Moreover, since the plating liquid flow can immediately escape from the drain hole after colliding with the area where plating is required, there is no flow velocity loss due to collision between the jet stream and the drain stream.

Therefore, in this case, the coverage of the plating is improved, and a higher quality plating suitable for electronic parts can be obtained.

It goes without saying that the present invention can be used not only for IC lead frames but also for partial plating of other short frames.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention; FIG. 1 is a partially cutaway perspective view, FIG. 2 is a vertical cross-sectional side view of the central portion, and FIG. 3 is an enlarged perspective view of the vicinity of the upper and lower blocks. Drawing code, A...Short frame, 5...Lower block, 9...Anode pipe, 12...Upper block, 14...Liquid introduction hole, 15...Pattern hole, 16...
...Drain hole, 1 7...Flexible tube,
19... constant pressure tank, 24... suppression member.

Claims (1)

[Scope of Claims] 1. A number of lower blocks 5 that can independently correspond to each plating required location of the short frame A, and a pattern hole that corresponds to each lower block 5, can be placed on the upper surface of each, and has an opening in the upper part. 15, and flexible tubes 17 each independently connected from a constant pressure tank 19 to the anode pipe 9 in each lower block 5. The lower block 5 is arranged in parallel in the same direction as the longitudinal direction of the frame A. This is a partial plating device for a short frame, which is slidably supported by a short frame and has a pressing member 24 for sealing above an upper block 12. 2. A number of lower blocks 5 that can independently correspond to each plating required part of the short frame A, and an upper block that corresponds to each lower block 5 and can be placed closely on each of them, and has an opening pattern hole 15 in the upper part. 12, and flexible tubes 17 that are independently connected to the anode pipes 9 in each lower block 5 from the constant pressure tank 19.
are supported so as to be slidable in parallel in the same direction as the longitudinal direction of the frame A, and a liquid introduction hole 14 from the lower part to the upper pattern hole 15 is formed in the upper block 12. 12 Drain hole 16 to the outside
This is a partial plating device for a short frame, in which a suppressing member 24 for sealing is provided above an upper block 12.