JPS5836808B2 - Image tube manufacturing method - Google Patents
Image tube manufacturing methodInfo
- Publication number
- JPS5836808B2 JPS5836808B2 JP53091598A JP9159878A JPS5836808B2 JP S5836808 B2 JPS5836808 B2 JP S5836808B2 JP 53091598 A JP53091598 A JP 53091598A JP 9159878 A JP9159878 A JP 9159878A JP S5836808 B2 JPS5836808 B2 JP S5836808B2
- Authority
- JP
- Japan
- Prior art keywords
- perforation
- face plate
- manufacturing
- hole
- metal solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
Description
【発明の詳細な説明】
本発明は撮像管の製造方法、特に撮像管ターゲットの信
号取り出し電極の製造方法に関し、詳細には3電極方式
、位相分離方式あるいは周波数分離方式など単一形撮像
管などに適用して好適に信号電流(以下信号と称する)
を取り出す信号取り出し電極の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an image pickup tube, and in particular to a method for manufacturing a signal extraction electrode for an image pickup tube target, and more particularly to a single type image pickup tube such as a three-electrode type, a phase separation type, or a frequency separation type. Signal current (hereinafter referred to as signal)
The present invention relates to a method for manufacturing a signal extraction electrode for extracting .
第1図a,bは従来より用いられている位相分離方式単
一形撮像管の面板構体の一例を示す要部断面図、要部平
面図である。FIGS. 1A and 1B are a sectional view and a plan view of a main part showing an example of a face plate structure of a conventionally used single-type phase separation type image pickup tube.
これらの図において、1は例えば透明ガラス板などによ
って形成された透光性面板であり、この面板1の所定位
置には面板1に近い膨張係数を有する金属線2a,2b
が貫通配置され、信号取り出し端子の一部が形成されて
いる。In these figures, reference numeral 1 denotes a translucent face plate made of, for example, a transparent glass plate, and metal wires 2a and 2b having an expansion coefficient close to that of the face plate 1 are placed at predetermined positions on the face plate 1.
is arranged through the terminal, forming a part of the signal extraction terminal.
この場合、この金属線2a ,2bは面板1の表裏面に
その端面が露出して配置されている。In this case, the metal wires 2a and 2b are arranged on the front and back surfaces of the face plate 1 with their end surfaces exposed.
またこの面板1の表面にはR(赤)、G(緑)、B(青
)に区分された光学フィルタ3が被着形成され、さらに
その上面には透明接着剤4を介して薄板ガラス5が配置
されている。In addition, optical filters 3 divided into R (red), G (green), and B (blue) are adhered to the surface of the face plate 1, and a thin glass plate 5 is attached to the upper surface of the optical filter 3 with a transparent adhesive 4 interposed therebetween. is located.
そして、この薄板ガラス5の表面には、ストライプ状に
形成された透明導電膜(以下ネサ膜と称する)6が上記
光学フィルタ3内のR,G,Bのそれぞれのストライプ
に対向して被着形成され、さらにその表面には光導電膜
7が被着形成されている。A transparent conductive film (hereinafter referred to as NESA film) 6 formed in a stripe shape is deposited on the surface of the thin glass 5 so as to face each of the R, G, and B stripes in the optical filter 3. A photoconductive film 7 is formed on the surface thereof.
また上記金属線2a,2bはネサ膜6に金属塊からなる
結合端子8a ,sbを介して電気的に接続されており
、この場合、上記結合端子8a ,abは薄板ガラス5
、透明接着剤4の所定位置、つまり金属線2a,2bと
一致する位置に穿孔部を設け、この穿孔部にIn金属塊
を圧着して埋め込むことによってネサ膜6と金属線2a
,2bとを電気的に接続させて信号取り出し電極が構成
されている。Further, the metal wires 2a, 2b are electrically connected to the Nesa membrane 6 via bonding terminals 8a, sb made of metal lumps, and in this case, the bonding terminals 8a, ab are
, a perforation is provided at a predetermined position of the transparent adhesive 4, that is, a position corresponding to the metal wires 2a and 2b, and an In metal lump is pressed into the perforation and embedded, thereby forming the Nesa film 6 and the metal wire 2a.
, 2b are electrically connected to form a signal extraction electrode.
ここで、上記結合端子8a ,sbと金属線2a,2b
とを電気的に接続させる加工方法としては、薄板ガラス
5上に光学電膜7を形成する以前にネサ膜6を形成させ
た薄板ガラス5表面に光硬化性樹脂を塗布乾燥させて所
定のマスクを介して露光し、金属線2a,2bと対応部
分を光不透過させ、溶媒で処理することによって光硬化
樹脂の未露光部分を溶化させ、薄板ガラス5の所定位置
つまり結合端子8a ,8bを形成する部分に所定の径
を有する孔を形成し、選択的にその位置を露出させる。Here, the coupling terminals 8a, sb and the metal wires 2a, 2b
As a processing method for electrically connecting the two, before forming the optical electrical film 7 on the thin glass 5, a photocurable resin is applied and dried on the surface of the thin glass 5 on which the Nesa film 6 has been formed, and a predetermined mask is applied. The metal wires 2a, 2b and the corresponding portions are made opaque by exposure, and the unexposed portions of the photocuring resin are dissolved by treatment with a solvent, and the predetermined positions of the thin glass 5, that is, the coupling terminals 8a, 8b, are exposed. A hole having a predetermined diameter is formed in the portion to be formed, and the position thereof is selectively exposed.
さらに化学的処理によって露出した薄板ガラス5および
透明接着剤4を選択的に除去させることによって金属線
2a ,2bに到する深さの穿孔を形成する。Furthermore, the exposed thin glass 5 and transparent adhesive 4 are selectively removed by chemical treatment, thereby forming perforations deep enough to reach the metal wires 2a and 2b.
次にこの薄板ガラス5の表面上に残っている光硬化性樹
脂を除去した後、上記穿孔部にIn金属を強大な力で圧
着、埋め込むことによってネサ膜6と金属線2a ,2
bとを電気的に接続させていた。Next, after removing the photocurable resin remaining on the surface of the thin glass plate 5, In metal is pressed into the perforated portion with great force and embedded, thereby forming the Nesa film 6 and the metal wires 2a, 2.
b were electrically connected.
しかしながら、上記構成による面板構体において、面板
1に信号取り出し電極を形成するのに、透光性面板1に
ガラス加工法により金属線2a,2bを埋設して貫通配
置されるため、その作業工程を大幅に複雑化させ、生産
性を著しく低下させていた。However, in the face plate structure having the above configuration, in order to form the signal extraction electrodes on the face plate 1, the metal wires 2a and 2b are buried and penetrated through the transparent face plate 1 using a glass processing method. This greatly increased complexity and significantly reduced productivity.
また薄板ガラス5を穿孔するのに化学エッチング法を用
いているため、その作業性を大幅に低下させていた。Furthermore, since a chemical etching method is used to perforate the thin glass plate 5, the workability is significantly reduced.
さらには薄板ガラス5の穿孔部にIn金属塊を強大な力
で圧着、埋め込ませているため、この圧着時に薄板ガラ
ス5が破損する恐れが多く、また密着性が乏しく、穿孔
部における気密保持性において信頼性を著しく低下させ
ていた。Furthermore, since the In metal lump is pressed and embedded in the perforated portion of the thin sheet glass 5 with great force, there is a high risk that the thin sheet glass 5 will be damaged during this press-bonding, and the adhesion is poor, making it difficult to maintain airtightness at the perforated portion. reliability was significantly reduced.
したがって本発明の目的は上記の欠点を除去し、気密保
持性を向上させるとともに、生産工程を簡易化させ、か
つ生産コストを安価にさせた撮像管の製造方法を提供す
ることにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing an image pickup tube that eliminates the above-mentioned drawbacks, improves airtightness, simplifies the production process, and reduces production costs.
以下図面を用いて本発明による撮像管の製造方法につい
て詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing an image pickup tube according to the present invention will be described in detail below with reference to the drawings.
第2図は本発明による撮像管、特にその信号取り出し電
極を備えた面板構体の一例を示す要部断面図であり、第
1図a,bと同記号は同一要素となるのでその説明は省
略する。FIG. 2 is a cross-sectional view of essential parts showing an example of the image pickup tube according to the present invention, particularly its face plate structure equipped with a signal extraction electrode. The same symbols as in FIGS. do.
同図において、面板1の所定位置には穿孔部1aが貫通
して形成され、さらにこの面板1上面に配設された透明
接着剤4、薄板ガラス5およびネサ膜6には上記穿孔部
1aに連続する貫通穿孔部9が形成されている。In the figure, a perforation 1a is formed penetrating through a predetermined position of the face plate 1, and a transparent adhesive 4, a thin glass plate 5, and a Nesa membrane 6 disposed on the upper surface of the face plate 1 are formed in the perforation 1a. A continuous through-hole portion 9 is formed.
そして、この穿孔部1a,9内にはPb−Snを主成分
とし、Zn ,Sb,Al,Ti ,Si ,Cuなど
が添加された多元系の特殊組成を有する金属ハンダ10
例えばセラソルザ(商品名)が充填固化され、ネサ膜6
にその端部を電気的に接続して信号取り出し電極11が
構成されている。Inside the perforations 1a and 9 is a metal solder 10 having a special multi-component composition containing Pb-Sn as a main component and adding Zn, Sb, Al, Ti, Si, Cu, etc.
For example, when Cerasolza (trade name) is filled and solidified, Nesa Membrane 6
A signal extraction electrode 11 is constructed by electrically connecting the end portions of the two ends to each other.
このように構戒された信号取り出し電極において、この
信号取り出し電極11を構成する金属半田10はネサ膜
6に完全に密着されるとともに、面板1、薄板ガラス5
および貫通穿孔部1a,9の側壁等に密着充填されるた
め、真空気密性を確実に保持することができ、外気がリ
ークする事故が皆無となった。In the signal extraction electrode arranged in this way, the metal solder 10 constituting the signal extraction electrode 11 is completely adhered to the Nesa film 6, and the face plate 1 and the thin glass 5
Since the side walls and the like of the through-holes 1a and 9 are closely filled, vacuum tightness can be maintained reliably, and there has been no accident of outside air leaking.
第3図a = fは本発明による撮像管の製造方法、特
に信号取り出し電極の製造方法の一実施例を示す要部工
程断面図であり、第1図a,bおよび第2図と同記号は
同一要素となるのでその説明は省略する。FIG. 3 a = f is a cross-sectional view showing an embodiment of a method for manufacturing an image pickup tube according to the present invention, particularly a method for manufacturing a signal extraction electrode, and the same symbols as in FIGS. 1 a, b and 2 are used. Since they are the same element, their explanation will be omitted.
これらの図において、まず同図aに示したように透光性
面板1の所定位置に超音波加工機を用いた機械法または
弗化水素液(HF)を用いた化学法等により貫通する穿
孔部1aを形成する。In these figures, first, as shown in figure a, perforations are made at predetermined positions on the translucent face plate 1 by a mechanical method using an ultrasonic processing machine or a chemical method using hydrogen fluoride (HF). A portion 1a is formed.
次にこの貫通穿孔部1aを有する面板1を2〜10%の
酸素を含む窒素または不活性ガス雰囲気中に配置し、同
図bに示したようにこの貫通穿孔部1a内に超音波振動
を印加しつつ溶融した金属半田10を注入して充填固化
させる。Next, the face plate 1 having the through-holes 1a is placed in a nitrogen or inert gas atmosphere containing 2 to 10% oxygen, and ultrasonic vibrations are applied to the insides of the through-holes 1a as shown in FIG. The molten metal solder 10 is injected while applying the voltage, and is filled and solidified.
この場合、面板1を常温の状態で貫通穿孔部1aに金属
半田10を注入、充填することも可能であるが、金属半
田10が貫通孔部1a内壁に完全に密着し易くするため
に金属半田10の融点近傍の温度まで面板1を加熱する
ことが望ましい。In this case, it is also possible to inject and fill the through-hole portion 1a with the metal solder 10 while the face plate 1 is at room temperature. It is desirable to heat the face plate 1 to a temperature near the melting point of 10.
次に貫通孔部1aに金属半田10を充填固化させて信号
取り出し端子を設けた面板1の所定位置に同図Cに示し
たようにフォトリングラフイ法を用いて所定形状の光学
フィルタ3を形或する。Next, as shown in Figure C, an optical filter 3 having a predetermined shape is attached to a predetermined position of the face plate 1, in which metal solder 10 is filled and solidified in the through-hole portion 1a and a signal extraction terminal is provided, using the photophosphorography method. take shape
次に同図dに示したように薄板ガラス5の片面にネサ膜
6を被着形成し、その他面側を上記光学フィルタ3に対
向させて透明接着剤4を用いて接着固化させる。Next, as shown in FIG. 4D, a NESA film 6 is formed on one side of the thin glass plate 5, and the other side is made to face the optical filter 3 and is bonded and solidified using a transparent adhesive 4.
しかるのち、同図dに示したように金属半田10が充填
固化された上記貫通孔部1a部分に対応するネサ膜6の
上面から矢印で示した方向にダイヤモンドドリルまたは
超鋼ドリルを用いて研削し、ネサ膜6、薄板ガラス5、
透明接着剤4を貫通させ、同図eに示したように金属半
田10の端面が露出する深さの貫通穿孔部9を形戒する
。Thereafter, as shown in FIG. d, the upper surface of the Nesa membrane 6 corresponding to the through-hole portion 1a filled with the metal solder 10 and solidified is ground using a diamond drill or a super steel drill in the direction indicated by the arrow. , Nesa membrane 6, thin glass 5,
The transparent adhesive 4 is penetrated to form a through hole 9 deep enough to expose the end surface of the metal solder 10, as shown in FIG.
次に上記eの工程を経た面板構体1を脱脂剤および中性
洗剤を用いて十分に洗浄するとともに、貫通孔部9周辺
のネサ膜6に付着した研削屑を特に十分に洗浄した後、
この貫通穿孔部9に溶融金属半田10を注入して充填す
る。Next, the face plate structure 1 that has gone through the step e above is thoroughly cleaned using a degreaser and a neutral detergent, and the grinding debris that has adhered to the Nesa membrane 6 around the through hole portion 9 is particularly thoroughly cleaned.
Molten metal solder 10 is injected into the through-hole 9 to fill it.
この場合、この溶融金属半田10を貫通穿孔部9の底部
で前記工程で貫通穿孔部1aに充填固化された金属半田
10の端面露出面に到達するまで充填し、電気的導通が
得られるまで注入充填させるとともに、第4図に平面図
で示したようにネサ膜6の表面において貫通穿孔部9の
直径より若干大きくなる様に盛り上げ、ネサ膜6との接
着面積を拡大させて固化させ、第2図に示したように面
板構体の信号取り出し電極11を完成する。In this case, the molten metal solder 10 is filled at the bottom of the through-hole part 9 until it reaches the exposed end surface of the metal solder 10 that was filled and solidified in the through-hole part 1a in the previous step, and injected until electrical continuity is obtained. At the same time, as shown in the plan view in FIG. 4, the surface of the Nesa membrane 6 is raised so as to be slightly larger than the diameter of the through-hole part 9, and the adhesion area with the Nesa membrane 6 is expanded and solidified. As shown in FIG. 2, the signal extraction electrode 11 of the face plate structure is completed.
このような製造方法によれば、面板1の所定位置に機械
的に貫通穿孔部1aを設け、この貫通穿孔部に溶融金属
半田10を充填固化させるため、その作業工程が極めて
簡単となる。According to this manufacturing method, the through-hole portion 1a is mechanically provided at a predetermined position of the face plate 1, and the molten metal solder 10 is filled and solidified into the through-hole portion, so that the working process is extremely simple.
また、薄板ガラス5への穿孔部形成も機械法によって行
なうため、その作業工程が極めて簡単となる。Furthermore, since the perforations in the thin glass 5 are formed by a mechanical method, the working process is extremely simple.
さらには、面板1の貫通穿孔部1aおよび接着剤4、薄
板ガラス5、ネサ膜6の貫通穿孔部9に超音波振動を印
加しつつ溶融金属半田10を注入し、充填固化させるた
め、真空気密性が確実となるとともに薄板ガラス5の破
損の恐れも全くなくなる。Furthermore, the molten metal solder 10 is injected while applying ultrasonic vibrations to the through-holes 1a of the face plate 1 and the through-holes 9 of the adhesive 4, the thin glass 5, and the Nesa film 6, and is filled and solidified in a vacuum-tight manner. In addition to ensuring reliability, there is no fear of breakage of the thin glass 5.
第5図a,b,cは本発明による撮像管の製造方法、特
に信号取り出し電極の製造方法の他の実施例を示す要部
工程断面図であり、前図と同記号は同一要素となるので
その説明は省略する。FIGS. 5a, b, and c are cross-sectional views showing main steps of another embodiment of the method of manufacturing an image pickup tube according to the present invention, particularly the method of manufacturing a signal extraction electrode, and the same symbols as in the previous figure represent the same elements. Therefore, its explanation will be omitted.
これらの図において、まず同図aに示したように透光性
面板1の片面の所定位置に超音波加工機を用いた機械法
または弗化水素液( HF )を用いた化学法等により
厚さが20〜200μm程度の底部1bを有する非貫通
穿孔部1cを形成する。In these figures, first, as shown in figure a, a predetermined position on one side of the translucent face plate 1 is thickened by a mechanical method using an ultrasonic processing machine or a chemical method using a hydrogen fluoride solution (HF). A non-penetrating perforation portion 1c having a bottom portion 1b having a length of about 20 to 200 μm is formed.
次にこの非貫通穿孔部1cを有する面板1を2〜10%
の酸素を含む窒素または不活性ガス雰囲気中に配置し、
同図bに示したようにこの非貫通穿孔部1c内に超音波
振動を印加しつつ溶融した金属半田10を注入して充填
固化させる。Next, 2 to 10% of the face plate 1 having this non-penetrating perforated portion 1c is
placed in a nitrogen or inert gas atmosphere containing oxygen,
As shown in FIG. 5B, molten metal solder 10 is injected into the non-penetrating hole 1c while applying ultrasonic vibrations and is filled and solidified.
次に同図Cに示したように上記非貫通穿孔部1cを形威
しない面板1の他面側の所定位置にフオl− IJソグ
ラフイ法によりストライプ状の光学フィルタ3を被着形
成した後、第3図dに示したネサ膜6を形成した薄板ガ
ラス5の接着工程に移行し、以下前述と同様の方法にし
たがって第2図に示したように面板構体の信号取り出し
電極11を完成する。Next, as shown in FIG. C, a striped optical filter 3 is formed at a predetermined position on the other surface side of the face plate 1 that does not have the non-penetrating perforated portion 1c by FOL-IJ lithography. Proceeding to the step of bonding the thin glass 5 on which the Nesa film 6 is formed as shown in FIG. 3d, the signal extraction electrode 11 of the face plate structure is completed as shown in FIG. 2 in the same manner as described above.
このような製造方法においても前述と全く同様の効果が
得られる。Even in this manufacturing method, the same effects as described above can be obtained.
なお、上記第3図eの研削作業工程において、貫通穿孔
部9周辺の切削屑の飛散を防止させかつ除去するために
第6図に要部断面構戒図で示したように小型ドリル12
に真空パッキング13を介して集塵容器14を装置し、
その排気口14aを高速回転排気系15に連結させ、小
型ドリル12および高速回転排気系15をスイッチ16
により作動させることによって、集塵容器14内は急速
に減圧され、ダイヤモンドドリル1γの先端部分の集塵
口(空気吸込口)14b周辺の空気18を急速にしかも
犬量に吹い込ませるとともに、薄板ガラス5および透明
接着剤4等を穿孔する切削屑を同時に集塵容器14内に
収容させ、面板1構体は全く汚れることなく穿孔目的を
果すことができる。In the grinding process shown in FIG. 3e, a small drill 12 is used to prevent and remove cutting debris around the through-hole portion 9, as shown in the cross-sectional view of the main part in FIG.
A dust collection container 14 is installed through a vacuum packing 13,
The exhaust port 14a is connected to the high speed rotation exhaust system 15, and the small drill 12 and the high speed rotation exhaust system 15 are connected to the switch 16.
As a result, the pressure inside the dust collection container 14 is rapidly reduced, and the air 18 around the dust collection port (air suction port) 14b at the tip of the diamond drill 1γ is rapidly blown into the thin plate. The cutting waste for drilling the glass 5, the transparent adhesive 4, etc. is stored in the dust collection container 14 at the same time, so that the face plate 1 structure can accomplish the purpose of drilling without being contaminated at all.
また上記実施例による位相分離方式の単一形撮像管では
、その面板にインデックス信号および映像信号取り出し
電極として2個所に、3電極方式の単一撮像管としては
各色映像信号を取り出す必要から3個所に信号取り出し
電極を設けなければならないが、いずれも前述の手段に
よって容易にその目的を果すことができる。In addition, in the phase separation type single type image pickup tube according to the above embodiment, there are two electrodes on the faceplate as index signal and video signal extraction electrodes, and in a three-electrode type single type image pickup tube, there are three electrodes because it is necessary to extract each color video signal. It is necessary to provide a signal extraction electrode in both, but the purpose can be easily achieved by the above-mentioned means.
以上説明したように本発明による撮像管の製造方法によ
れば、撮像管の真空気密性が確実となり、品質および信
頼性を向上させるとともに、生産性を大幅に向上させて
生産コストを低下させるなどの極めて優れた効果が得ら
れる。As explained above, according to the method for manufacturing an image pickup tube according to the present invention, the vacuum tightness of the image pickup tube is ensured, quality and reliability are improved, and productivity is significantly improved and production costs are reduced. Extremely excellent effects can be obtained.
第1図a,bは従来の位相分離方式単一形撮像管の面板
構体の一例を示す要部断面図、要部平面図、第2図は本
発明製造方法による撮像管特にその信号取り出し電極を
備れた面板構体の一例を示す要部断面図、第3図a =
fは本発明による撮像管特に信号取り出し電極の製造
方法の一実施例を示す要部工程断面図、第4図はその要
部平面図、第5図a ”−’ cは本発明による撮像管
特に信号取り出し電極の製造方法の他の実施例を示す要
部工程断面図、第6図は本発明に係わる製造方法に用い
る集塵装置の一例を示す要部断面構成図である。
1・・・・・・面板、1a・・・・・・貫通穿孔部、1
b・・・・・・底部、1c・・・・・・非貫通穿孔部、
2a , 2b・・・・・・金属線、3・・・・・・光
学フィルタ、4・・・・・・接着剤、5・・・・・・薄
板ガラス、6・・・・・・透明導電膜(ネサ膜)、γ・
・・・・・光導電膜、8a , ab・・・・・・結合
端子、9・・・・・・貫通穿孔部、10・・・・・・金
属半田、11・・・・・・信号取り出し電極、12・・
・・・・小型ドリル、13・・・・・・真空パッキング
、14・・・・・・集塵容器、14a・・・・・・排気
口、14b・・・・・・集塵口、15・・・・・・高速
回転排気系、16・・・・・・スイッチ、1γ・・・・
・・ダイヤモンドドリル、18・・・・・・空気。FIGS. 1a and 1b are a sectional view and a plan view of essential parts showing an example of the face plate structure of a conventional single-type phase separation type image pickup tube, and FIG. 2 is an image pickup tube manufactured by the manufacturing method of the present invention, particularly its signal extraction electrode A cross-sectional view of main parts showing an example of a face plate structure equipped with
f is a cross-sectional view of the essential parts showing an embodiment of the method for manufacturing an image pickup tube, particularly a signal extraction electrode, according to the present invention, FIG. 4 is a plan view of the essential parts, and FIGS. Particularly, FIG. 6 is a cross-sectional view of the main part process showing another embodiment of the method for manufacturing the signal extraction electrode, and FIG. ... Face plate, 1a ... Through-hole part, 1
b...Bottom part, 1c...Non-penetrating perforation part,
2a, 2b...metal wire, 3...optical filter, 4...adhesive, 5...thin glass, 6...transparent Conductive film (NESA film), γ・
...Photoconductive film, 8a, ab...Coupling terminal, 9...Through hole, 10...Metal solder, 11...Signal Take-out electrode, 12...
...Small drill, 13...Vacuum packing, 14...Dust collection container, 14a...Exhaust port, 14b...Dust collection port, 15 ...High-speed rotation exhaust system, 16...Switch, 1γ...
...Diamond drill, 18...Air.
Claims (1)
膜とを少なくとも有する撮像管において前記面板の所定
位置に第1の穿孔を形成する工程と前記第1の穿孔に超
音波振動を印加しつつ溶融金属半田を充填して固化させ
る工程と、前記面板の所定位置に光学フィルタを被着形
成する工程と、前記面板上の光学フィルタ面にガラス層
を介して透明導電膜を密着配置する工程と、前記第1の
穿孔に対応する前記透明導電膜上から前記第1の穿孔方
向へ研削して前記第1の穿孔に連続する第2の穿孔を形
成する工程と、前記第2のに超音波振動を印加しつつ金
属半田を注入充填し前記第1の穿孔に充填固化された金
属半田と電気的に接続させる工程とを備えたことを特徴
とする撮像管の製造方法。 2 前記第1の穿孔は貫通穿孔または非貫通穿孔とした
ことを特徴とする特許請求の範囲第1項記載の製造方法
。 3 前記第1の穿孔に溶融金属半田を注入するとき、そ
の穿孔を有する面板全体を2〜10%の酸素を含む窒素
、不活性ガスまたはその混合物雰囲気中に配置するかま
たはその穿孔周辺部に窒素、不活性ガスまたはその混合
物を吹き付けたことを特徴とする特徴請求の範囲第1項
記載の撮像管の製造方法。[Scope of Claims] 1. A step of forming a first perforation at a predetermined position of the face plate in an image pickup tube having at least a face plate and a transparent conductive film adhered to the inner surface of the face plate; a step of filling and solidifying molten metal solder while applying ultrasonic vibration to the perforation; a step of adhering and forming an optical filter at a predetermined position on the face plate; and a step of applying a glass layer to the optical filter surface on the face plate. a step of closely arranging a transparent conductive film; and a step of grinding the transparent conductive film corresponding to the first perforation in the direction of the first perforation to form a second perforation continuous with the first perforation. and a step of injecting and filling the second hole with metal solder while applying ultrasonic vibration, and electrically connecting it to the solidified metal solder filled into the first hole. manufacturing method. 2. The manufacturing method according to claim 1, wherein the first perforation is a through-hole or a non-through-hole. 3. When injecting molten metal solder into the first perforation, the entire face plate having the perforation is placed in an atmosphere of nitrogen, inert gas, or a mixture thereof containing 2 to 10% oxygen, or the area around the perforation is 2. The method for manufacturing an image pickup tube according to claim 1, wherein nitrogen, an inert gas, or a mixture thereof is sprayed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53091598A JPS5836808B2 (en) | 1978-07-28 | 1978-07-28 | Image tube manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53091598A JPS5836808B2 (en) | 1978-07-28 | 1978-07-28 | Image tube manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5519714A JPS5519714A (en) | 1980-02-12 |
| JPS5836808B2 true JPS5836808B2 (en) | 1983-08-11 |
Family
ID=14030986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53091598A Expired JPS5836808B2 (en) | 1978-07-28 | 1978-07-28 | Image tube manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5836808B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51210A (en) * | 1974-06-18 | 1976-01-05 | Matsushita Electric Industrial Co Ltd | Denshikantaagetsuto oyobi sonoseizohoho |
| JPS5530654B2 (en) * | 1974-11-30 | 1980-08-12 |
-
1978
- 1978-07-28 JP JP53091598A patent/JPS5836808B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5519714A (en) | 1980-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2722798B2 (en) | Method for manufacturing thin liquid crystal display element | |
| JP3131379B2 (en) | Electronic module with multiple solder dams in the solder mask window | |
| JP4028017B2 (en) | Method for moving a thin film from an initial substrate onto a target substrate | |
| JP4843012B2 (en) | Piezoelectric device and manufacturing method thereof | |
| JP5892378B2 (en) | Manufacturing method of package material | |
| JP4071615B2 (en) | Method for forming through electrode and substrate with through electrode | |
| US6774327B1 (en) | Hermetic seals for electronic components | |
| JP2005251407A (en) | Display panel manufacturing method and display panel | |
| JP2005213125A (en) | Method for manufacturing electron tube and airtight container for electron tube | |
| JPS5836808B2 (en) | Image tube manufacturing method | |
| EP0620473A1 (en) | Method of making a display cell with realisation of the contact for the counter-electrode | |
| JPH05121989A (en) | Package for piezoelectric element | |
| DE10350460B4 (en) | Method for producing semiconductor devices having micromechanical and / or microelectronic structures, which result from the fixed connection of at least two semiconductor wafers, and corresponding arrangement | |
| JP2010081127A (en) | Crystal oscillator and method of manufacturing same | |
| US5850688A (en) | Method of manufacturing electronic component | |
| EP0042003A1 (en) | Method for forming a fusible spacer for plasma display panel. | |
| US3666911A (en) | Method for manufacturing planar raised cathode gas tubes | |
| JP2000277023A (en) | Method of forming electrode wiring of gas discharge panel, and gas discharge panel | |
| JP4399240B2 (en) | Plasma display panel and manufacturing method thereof | |
| JP3405102B2 (en) | Manufacturing method of solder bump connection element | |
| JP3675783B2 (en) | Method for manufacturing plasma display panel | |
| JPH0561054A (en) | Liquid crystal display device and manufacturing method thereof | |
| JPH04342940A (en) | Vacuum envelope | |
| JPH02262120A (en) | Method for injecting liquid crystal to liquid crystal display element | |
| JPH09306345A (en) | Manufacturing method of plasma display |