JPS5836963B2 - How to round the tip of flexible wire materials such as brushes - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for rolling up flexible wire materials such as brushes whose tips have the same length.

In the present invention, the tip of a flexible wire material such as a brush is brought into pressure contact with the abrasive band running in an inclined manner, and while the wire material is rotated forward and backward, the abrasive band is This allows the tip to be ground and polished into a hemispherical shape.

To explain the apparatus for implementing the method of the present invention, as shown in FIGS. 1 and 4, a bevel gear 4 is rotated via a reduction gear 8 by driving a drive motor 2 installed at the bottom of a machine frame 1. , the bevel gear 6 of the shaft 5 engages with this, and the rotation of the gear 6 causes the gear 7 of the same shaft 5 and the gear γA of the rotating shaft 8 placed on the upper part of the machine frame 1 to be connected to the chain. 10 is connected to the gear 7 of the shaft 5, the sprocket wheel 9 of the rotating shaft 8 is connected to the chain 9B, and the vertical positions of the rotating shafts 8 and 8A can be freely set. A chain 9B is wound around and linked to the sprocket wheel 9 of No. 8 and the sprocket wheel 9A of the other rotating shaft 8A, and the transfer band 11 disposed on the chain 9B is moved in the direction of the arrow by the rotation of the sprocket wheel 90. Both sides of the band 11 are surrounded by frames 11A, and a holder 12 for fixing the wire material K to be ground and polished is pivotally mounted on the upper part of the transfer band 11 at a constant interval by a rotating shaft 13, as shown in FIG. A pinion 14 is fixed below the rotating shaft 13, and a guide member 15 is fixed below the pinion 14.

The guide member 15 moves in the guide groove 16 at both ends of the machine frame, and when the transfer band 11 moves downward and the pinion 14 of the holder 12 reaches the lower surface of the transfer band 11, the rack 17 moves in the left half of the lower surface. The pinions 14 mesh with each other, and the holder 12 rotates in the forward direction while moving in the direction of the arrow, and the abutments 18 on the left and right sides of the center engage with each other.
．． At 19, the guide member 15 passes in a transverse direction, the rotation of the pinion 140 is temporarily stopped, and then the rack 20 and the pinion 14 are engaged again in the right half of the lower surface, and this time the holder 12 is rotated in the opposite direction. Set the device to move in the direction of the arrow.

At the upper surface of the transfer band 11, the holder 12 moves in the direction of the arrow as shown in FIG. 2 while stopping its rotation along the guide 12B installed above the transfer band 11.

As the 1 drive motor 20 rotates, the pulley 22' coaxial with the rotary shaft 3' rotates via the reducer 3, and the pulley 22 of the rotary shaft 21 rotates via the V belt V1, and the speed change pulley 21 coaxially rotates. 23 is interlocked with the pulley 25 of the rotating shaft 24 by the V belt V2, and the pulley IJ-26 of the rotating shaft 24
is a V bell} V3 interlocks with the pulley 28 of the rotating shaft 27, and the roller R1 of the same shaft 27 rotates, and the tension roller R2, roller R3, roller R4, and roller R5
, an endless polishing band 29 is wound between rollers R6 and continuously rotated between each roller.

Further, the pulley 30 of the rotating shaft 27 of the roller R1 is crossed with the pulley 32 of the rotating shaft 31 of the roller R5 by a V bell (V4).

A tilting table 33A is fixed to a support plate 35 having an adjustment hole 34 on the lower surface of the polishing band 29 between the roller R1 and the roller R6,
The support plate 35 is screwed onto the side rail 1A of the machine frame 1, and the roller R
4 and the lower surface of the polishing zone 29 between the roller R3 and the inclined table 33B.
is fixed to a support plate 37 having an adjustment hole 36, and the support plate 3
7 to the side rail 1A of the machine frame 1.

Note that the tension on the polishing band 29 can be loosened by moving the tension roller R2 upward, and the tension in the polishing band 29 can be increased by moving the roller R2 downward.

Further, the device is arranged so that the rotational speed of each roller can be changed by operating the lever L of the variable speed pulley 23.

That is, by operating the lever L of the variable speed pulley 23, the abrasive band 29 is rotated quickly for wire materials with weak elasticity to make polishing easy and sufficient, and for wire materials with strong elasticity, the abrasive band 29 is rotated quickly. The device shall be capable of adjusting the speed of 29 to prevent excessive grinding and polishing.

Next, to explain the operation of the above-mentioned device, the driving of the drive motor 2 rotates the sprocket wheels 9, 9A of the rotating shafts 8, 8A placed on the upper part of the machine frame 1, and the sprocket wheels 9, 9A are fixed on the transfer chain 9B. The transfer band 11 moves in the direction of the arrow, and the fixing holders 12 on the band 11 move sequentially.

Therefore, the wire material K is inserted upward into the insertion holes 12A, 12A of the holder 12.

Hereinafter, in the present invention, the wire material refers to a plurality of wire materials to be implanted in the implanted body BH.

The transfer band 11 moves in the direction of the arrow, and the fixing holder 12 faces downward near the sprocket wheel 9A.

On the left half of the lower surface of the transfer band 11, as shown in FIG.
7, the holder 12 is transferred while rotating in the forward direction,
The guide member 15 comes into contact with the abutment 18 at the right end of the center and the abutment 19 at the left end of the center, and the holder 12 is transferred while the rotation stops. Conversely, the rack 20 and pinion 14 are engaged and the holder is transferred while rotating in the opposite direction.

On the inclined table 33A between the roller R1 and the roller R6, a plurality of wire materials K planted on the implanted body BH with uniform tips are installed at the tilt angle α of the polishing belt 29 and rotate forward on the polishing belt 29. As shown in FIG. 6, the degree of deflection of the wire material K is strong at the beginning, and becomes weaker as it moves to the right, and as the wire material K rotates, it comes into contact with the polishing band 29. As shown in Figure 7, the polishing angle at point A is A1, the polishing angle at point B is Bl, and the polishing angle at point C is C1, and as shown in Figure 7, the polishing angle is hemispherical. Ru.

However, since a plurality of wire materials K are bundled and implanted on the implanted body BH, if the wire materials K are brought into pressure contact with the polishing band 29 and rotated only in one direction. As shown in Fig. 7, the tips of the wire materials K are apparently ground and polished into a hemispherical shape, but all the bundled wire materials K are not completely ground and polished into a hemispherical shape, and some are irregular. remain.

That is, since the wire material K runs on the inclined polishing belt 29 while rotating, the contact angle of the wire material K with the polishing belt 29 always changes, and the degree of deflection of the wire material K with the polishing belt 29 changes. Since the grinding and polishing changes from time to time, some parts may be incompletely ground and polished.
On the inclined table 33B between 3 and 3, the inclination angle of the polishing belt 29 is set at the same angle as the previous time, and the polishing belt 29 is run in the direction of the arrow. By rotating in the same direction, the partially irregular end peripheral surface of the wire material K is ground and polished into a perfect hemispherical shape.

Therefore, when grinding and polishing the tip of the wire material with high accuracy is required, i.e., for high-grade products, the wire material is ground by pressing the wire material with a plurality of inclined polishing bands and rotating the wire material in forward and reverse directions. Grinding and Scratch Grinding If polishing precision is not required, the wire material may be pressed into contact with a tilted polishing band and rotated in only one direction for grinding and polishing.

The invention is grinding by rotating the wire material K in the forward and reverse directions while using the angle difference in which the wire material K gradually stands upright (or bends) on the polishing surface that runs at an inclined angle using the deflection caused by the pressing contact. Since the polishing is performed, the running speed and inclination angle of the abrasive band can be set separately, and therefore the best inclination angle and inclination angle suitable for rounding the tip of wire material with a thin diameter or wire material with a thick diameter can be set separately. The running speed can be selected arbitrarily.

It also has the excellent feature that the wire material K can be rotated forward and backward to polish the tip evenly and neatly.

Furthermore, since the moving direction of the polishing belt 29 and the moving direction of the wire material K are run parallel to each other, more polishing area and polishing time can be taken for one polishing belt, and the wire material K can be moved quickly. In addition, by rotating the wire material K forward and backward, it can be efficiently polished into a hemispherical shape in a short time.

As described above, according to the grinding and polishing method of the present invention, the tip of the wire material is aligned, the inclination angle of the polishing band is adjusted according to the material, length, thickness, and degree of deflection of the wire material, and the wire material is adjusted. By incorporating forward and reverse rotation, it has an excellent feature that allows easy and simple grinding and polishing to round the tip of each wire material.

[Brief explanation of the drawing]

The drawings show an apparatus for implementing the present invention, and FIG. 1 is a partially omitted front view, FIG. 2 is a partially omitted plan view, FIG. 3 is a partially omitted plan view showing the rotational relationship, and FIG. 4 is a partially omitted plan view. FIG. 5 is a partially omitted sectional view taken along the line A--A in FIG. 1, and FIGS. 6 to 8 are explanatory views showing the state of grinding and polishing. 29: Polishing band, K: Wire material, BH: Implanted body.

Claims (1)

[Claims] 1 The tip of the wire material K is brought into pressure contact with the polishing belt 29 running at an angle, rotated in the forward direction, and the polishing belt 29 is moved against the moving direction of the wire material K, and the next polishing is performed at an angle. A brush or the like characterized in that the tip of the wire material K is pressed into contact with the band 29 and rotated in the opposite direction, and the abrasive band 29 is moved against the moving direction of the wire material K for grinding and polishing. How to round the tip of flexible wire material.